Lenovo ThinkEdge SE455 V3 User manual

ThinkEdge SE455 V3
User Guide
Machine Type: 7DBY

Note
Before using this information and the product it supports be sure to read and understand the safety
information and the safety instructions which are available at:
https://pubs.lenovo.com/safety_documentation/
In addition be sure that you are familiar with the terms and conditions of the Lenovo warranty for your server
which can be found at:
http://datacentersupport.lenovo.com/warrantylookup
First Edition (November 2023)
© Copyright enovo 2023.
LIMITED AND RESTRICTED RIGHTS NOTICE: If data or software is delivered pursuant to a General Services
Administration (GSA) contract use reproduction or disclosure is subject to restrictions set forth in Contract No. GS-35F-
05925.

Contents
Contents . . . . . . . . . . . . . . . . . i
Safety . . . . . . . . . . . . . . . . . . iii
Safety inspection checklist . . . . . . . . . . . iv
Chapter 1. Introduction . . . . . . . . . 1
Features. . . . . . . . . . . . . . . . . . . 1
Tech Tips . . . . . . . . . . . . . . . . . . 2
Security advisories . . . . . . . . . . . . . . 3
Specifications . . . . . . . . . . . . . . . . 3
Technical specifications. . . . . . . . . . . 3
Mechanical specifications . . . . . . . . . . 7
Environmental specifications . . . . . . . . . 7
Management options. . . . . . . . . . . . . 14
Chapter 2. Server components . . . . 19
Front view . . . . . . . . . . . . . . . . . 19
Top view . . . . . . . . . . . . . . . . . 22
System-board layout. . . . . . . . . . . . . 24
System-board connectors . . . . . . . . . 24
System-board switches . . . . . . . . . . 26
System LEDs and diagnostics display . . . . . . 28
Chapter 3. Parts list . . . . . . . . . . 29
Power cords . . . . . . . . . . . . . . . . 32
Chapter 4. Unboxing and setup . . . . 35
Server package contents . . . . . . . . . . . 35
Identify the server and access the Lenovo XClarity
Controller . . . . . . . . . . . . . . . . . 35
Server setup checklist . . . . . . . . . . . . 37
Chapter 5. Hardware replacement
procedures . . . . . . . . . . . . . . . 39
Installation Guidelines . . . . . . . . . . . . 39
Safety inspection checklist. . . . . . . . . 40
System reliability guidelines . . . . . . . . 41
Working inside the server with the power on . . 42
Handling static-sensitive devices . . . . . . 42
Memory module installation rules and order . . . . 43
Independent memory mode installation
order . . . . . . . . . . . . . . . . . 45
PCIe adapter installation rules and order . . . . . 45
Power on and power off the server . . . . . . . 48
Power on the server . . . . . . . . . . . 48
Power off the server . . . . . . . . . . . 48
Configuration guide . . . . . . . . . . . . . 49
Rack mount configuration . . . . . . . . . 49
Node component replacement . . . . . . . . . 62
Air baffle replacement . . . . . . . . . . 62
Air flow sensor board replacement . . . . . 75
Bezel detect switch with cable replacement . . 77
Cable wall with heat sink detect switch
replacement . . . . . . . . . . . . . . 80
CMOS battery (CR2032) replacement . . . . 83
Fan module replacement . . . . . . . . . 89
Fan cage and fan control board (FCB)
replacement . . . . . . . . . . . . . . 91
Front hot-swap drive and front drive
backplane replacement . . . . . . . . . . 97
Internal drive drive cage and drive backplane
replacement . . . . . . . . . . . . . . 105
Intrusion switch with cable replacement . . . 118
M.2 backplane assembly and M.2 drive
replacement . . . . . . . . . . . . . . 121
Memory module replacement . . . . . . . 132
OCP module replacement . . . . . . . . . 138
PCIe riser assembly and adapter
replacement . . . . . . . . . . . . . . 141
PCIe riser card replacement . . . . . . . . 163
Power distribution board and PDB cage
replacement . . . . . . . . . . . . . . 169
Power supply unit replacement . . . . . . . 174
Processor and heat sink replacement (trained
technician only) . . . . . . . . . . . . . 181
RAID flash power module (supercap)
replacement . . . . . . . . . . . . . . 188
RAID flash power module holder
replacement . . . . . . . . . . . . . . 191
Security bezel and dust filter replacement . . . 195
Security bezel keylock bracket
replacement . . . . . . . . . . . . . . 200
Serial port module replacement . . . . . . . 203
System board replacement (trained technician
only) . . . . . . . . . . . . . . . . . 207
Top cover replacement . . . . . . . . . . 223
Complete the parts replacement . . . . . . . . 225
Chapter 6. Internal cable routing . . . 227
Identifying connectors . . . . . . . . . . . . 227
Drive backplane connectors . . . . . . . . 227
Fan control board (FCB) connectors . . . . . 228
Power distribution board connectors. . . . . 228
PCIe riser card connectors. . . . . . . . . 228
System-board connectors for cable
routing . . . . . . . . . . . . . . . . 230
© Copyright Lenovo 2023 i

Power distribution board (PDB) and fan control board
(FCB) cable routing . . . . . . . . . . . . . 232
M.2 backplane cable routing . . . . . . . . . . 234
To system board . . . . . . . . . . . . 235
To RAID adapter. . . . . . . . . . . . . 236
PCIe riser card cable routing . . . . . . . . . . 237
PCIe riser 1 riser card cable routing . . . . . 237
PCIe riser 2 riser card cable routing . . . . . 238
GPU power cable routing . . . . . . . . . . . 239
RAID flash power module (supercap) cable
routing . . . . . . . . . . . . . . . . . . 240
Drive backplane cable routing . . . . . . . . . 242
BP signal cable routing . . . . . . . . . . 242
Complete the BP cable routing . . . . . . . 251
Chapter 7. System configuration . . . 253
Set the network connection for the Lenovo XClarity
Controller . . . . . . . . . . . . . . . . . 253
Activate/unlock the system and configure
ThinkEdge security features . . . . . . . . . . 254
Activate or unlock the system . . . . . . . 255
System Lockdown Mode . . . . . . . . . 257
Manage the Self Encryption Drive
Authentication Key (SED AK) . . . . . . . . 257
Set dust filter measurement . . . . . . . . . . 258
Update the firmware . . . . . . . . . . . . . 260
Configure the firmware . . . . . . . . . . . . 264
Memory module configuration . . . . . . . . . 265
RAID configuration . . . . . . . . . . . . . 265
Deploy the operating system. . . . . . . . . . 266
Back up the server configuration . . . . . . . . 266
Chapter 8. Problem
determination . . . . . . . . . . . . . 269
Event logs . . . . . . . . . . . . . . . . . 269
Troubleshooting by system LEDs and diagnostics
display . . . . . . . . . . . . . . . . . . 271
Drive LEDs . . . . . . . . . . . . . . . 271
Front LEDs . . . . . . . . . . . . . . . 271
Power supply LEDs . . . . . . . . . . . 274
System-board LEDs . . . . . . . . . . . 275
Firmware and RoT security module LEDs . . . 278
XCC system management port LEDs. . . . . 279
External Diagnostics Handset . . . . . . . 280
General problem determination procedures . . . . 285
Resolving suspected power problems . . . . 286
Resolving suspected Ethernet controller
problems . . . . . . . . . . . . . . . 286
Troubleshooting by symptom . . . . . . . . . 287
Fan problems . . . . . . . . . . . . . . 287
Intermittent problems. . . . . . . . . . . 288
Keyboard mouse KVM switch or USB-device
problems . . . . . . . . . . . . . . . 289
Memory problems . . . . . . . . . . . . 290
Monitor and video problems . . . . . . . . 291
Network problems . . . . . . . . . . . . 293
Observable problems. . . . . . . . . . . 293
Optional-device problems . . . . . . . . . 296
Performance problems . . . . . . . . . . 298
Power on and power off problems . . . . . . 298
Power problems . . . . . . . . . . . . . 299
Serial-device problems . . . . . . . . . . 300
Software problems. . . . . . . . . . . . 300
Storage drive problems . . . . . . . . . . 300
Appendix A. Hardware
disassembling for recycle . . . . . . . 303
Disassemble the system board for recycle . . . . 303
Appendix B. Getting help and
technical assistance . . . . . . . . . . 305
Before you call . . . . . . . . . . . . . . . 305
Collecting service data . . . . . . . . . . . . 306
Contacting Support . . . . . . . . . . . . . 307
Appendix C. Documents and
supports . . . . . . . . . . . . . . . . 309
Documents download . . . . . . . . . . . . 309
Support websites . . . . . . . . . . . . . . 309
Appendix D. Notices. . . . . . . . . . 311
Trademarks . . . . . . . . . . . . . . . . 312
Important notes . . . . . . . . . . . . . . . 312
Electronic emission notices . . . . . . . . . . 312
Taiwan Region BSMI RoHS declaration . . . . . 313
Taiwan Region import and export contact
information . . . . . . . . . . . . . . . . 313
ii ThinkEdge SE455 V3 User Guide

Safety
Before installing this product read the Safety Information.
Antes de instalar este produto leia as Informações de Segurança.
在安装本产品之前，请仔细阅读 Safety Information （安全信息）。
Læs sikkerhedsforskrifterne før du installerer dette produkt.
Lees voordat u dit product installeert eerst de veiligheidsvoorschriften.
Ennen kuin asennat tämän tuotteen lue turvaohjeet kohdasta Safety Information.
Avant d'installer ce produit lisez les consignes de sécurité.
Vor der Installation dieses Produkts die Sicherheitshinweise lesen.
Prima di installare questo prodotto leggere le Informazioni sulla Sicurezza.
Les sikkerhetsinformasjonen (Safety Information) før du installerer dette produktet.
Antes de instalar este produto leia as Informações sobre Segurança.
© Copyright Lenovo 2023 iii

Antes de instalar este producto lea la información de seguridad.
Läs säkerhetsinformationen innan du installerar den här produkten.
Safety inspection checklist
Use the information in this section to identify potentially unsafe conditions with your server. As each machine
was designed and built required safety items were installed to protect users and service technicians from
injury.
Note: This device is not intended for use in the direct field of view at visual display workplaces. To avoid
incommoding reflections at visual display workplaces this device must not be placed in the direct field of
view.
Attention: This is a Class A product. In a domestic environment this product may cause radio interference
in which case the user may be required to take adequate measures.
CAUTION:
This equipment must be installed or serviced by trained personnel, as defined by the NEC, IEC 62368-
1 & IEC 60950-1, the standard for Safety of Electronic Equipment within the Field of Audio/Video,
Information Technology and Communication Technology. enovo assumes you are qualified in the
servicing of equipment and trained in recognizing hazards energy levels in products. Access to the
equipment is by the use of a tool, lock and key, or other means of security.
Important: Electrical grounding of the server is required for operator safety and correct system function.
Proper grounding of the electrical outlet can be verified by a certified electrician.
Use the following checklist to verify that there are no potentially unsafe conditions:
1. Make sure that the power is off and the power cord is disconnected.
2. Check the power cord.
• Make sure that the third-wire ground connector is in good condition. Use a meter to measure third-
wire ground continuity for 0.1 ohm or less between the external ground pin and the frame ground.
• Make sure that the power cord is the correct type.
To view the power cords that are available for the server:
a. Go to:
iv ThinkEdge SE455 V3 User Guide

http://dcsc.lenovo.com/#/
b. Click Preconfigured Model or Configure to order.
c. Enter the machine type and model for your server to display the configurator page.
d. Click Power ➙ Power Cables to see all line cords.
• Make sure that the insulation is not frayed or worn.
3. Check for any obvious non-Lenovo alterations. Use good judgment as to the safety of any non-Lenovo
alterations.
4. Check inside the server for any obvious unsafe conditions such as metal filings contamination water or
other liquid or signs of fire or smoke damage.
5. Check for worn frayed or pinched cables.
6. Make sure that the power-supply cover fasteners (screws or rivets) have not been removed or tampered
with.
© Copyright Lenovo 2023 v

vi ThinkEdge SE455 V3 User Guide

Chapter 1. Introduction
The ThinkEdge SE455 V3 server (Type 7DBY) is a new edge server offering. It is specifically designed to meet
the needs of edge computing edge AI hybrid cloud and workloads at the edge locations. ThinkEdge SE455
V3 is a rugged compact sized edge solution with a focus on smart connectivity business security and
manageability for the harsh environment. Built for long life and dependable performance to support your
demanding IoT workloads at the Edge. Compact and rugged it is designed for the non-datacenter
environment ideal for remote locations such as retail manufacturing and factory locations.
Features
Performance ease of use reliability and expansion capabilities were key considerations in the design of
your server. These design features make it possible for you to customize the system hardware to meet your
needs today and provide flexible expansion capabilities for the future.
Your server implements the following features and technologies:
• Features on Demand
If a Features on Demand feature is integrated in the server or in an optional device that is installed in the
server you can purchase an activation key to activate the feature. For information about Features on
Demand see:
https://fod.lenovo.com/lkms
• enovo XClarity Controller (XCC)
The Lenovo XClarity Controller is the common management controller for Lenovo ThinkEdge server
hardware. The Lenovo XClarity Controller consolidates multiple management functions in a single chip on
the server system board (system board assembly). Some of the features that are unique to the Lenovo
XClarity Controller are enhanced performance higher-resolution remote video and expanded security
options.
The server supports Lenovo XClarity Controller 2 (XCC2). For additional information about Lenovo XClarity
Controller 2 (XCC2) refer to https://pubs.lenovo.com/lxcc-overview/.
• UEFI-compliant server firmware
Lenovo ThinkEdge firmware is Unified Extensible Firmware Interface (UEFI) compliant. UEFI replaces
BIOS and defines a standard interface between the operating system platform firmware and external
devices.
Lenovo ThinkEdge servers are capable of booting UEFI-compliant operating systems BIOS-based
operating systems and BIOS-based adapters as well as UEFI-compliant adapters.
Note: The server does not support Disk Operating System (DOS).
• arge data-storage capacity and hot-swap capability
With the hot-swap feature you can add remove or replace hard disk drives without turning off the server.
The server supports up to four 2.5-inch SAS/SATA/NVMe hot-swap drives in the front drive cage and up
to four optional 2.5-inch SAS/SATA/NVMe non-hot-swap drives in the internal drive cage.
Notes:
– When SED encryption is enabled it is necessary to power cycle the system after installing an SED;
without power cycling the SED will not be recognized by the host OS.
– RAID adapter/HBA is required for 2.5-inch SAS drives.
© Copyright Lenovo 2023 1

• ightpath Diagnostics
Lightpath Diagnostics provides LEDs to help you diagnose problems. For more information about the
Lightpath Diagnostics see “Troubleshooting by system LEDs and diagnostics display” on page 271.
• Mobile access to enovo Service Information website
The server provides a QR code on the system service label which is on the cover of the server that you
can scan using a QR code reader and scanner with a mobile device to get quick access to the Lenovo
Service Information website. The Lenovo Service Information website provides additional information for
parts installation replacement videos and error codes for server support.
• Active Energy Manager
Lenovo XClarity Energy Manager is a power and temperature management solution for data centers. You
can monitor and manage the power consumption and temperature of Converged NeXtScale System x
ThinkServer ThinkSystem and ThinkEdge servers and improve energy efficiency using Lenovo XClarity
Energy Manager.
• Redundant networking connection
The Lenovo XClarity Controller provides failover capability to a redundant Ethernet connection with the
applicable application installed. If a problem occurs with the primary Ethernet connection all Ethernet
traffic that is associated with the primary connection is automatically switched to the optional redundant
Ethernet connection. If the applicable device drivers are installed this switching occurs without data loss
and without user intervention.
• Redundant cooling
The redundant cooling by the fans in the server enables continued operation if one rotor of the fans fails.
• Optional power capabilities
The server supports up to two 1100-watt or 1800-watt power supply units.
• RAID support
The RAID adapter provides hardware redundant array of independent disks (RAID) support to create
configurations. RAID adapter with RAID 0 1 10 5 50 6 60 is available for purchase.
• Integrated Trusted Platform Module (TPM)
This integrated security chip performs cryptographic functions and stores private and public secure keys.
It provides the hardware support for the Trusted Computing Group (TCG) specification.
• enovo XClarity Controllers System ockdown Mode
System lockdown will be enforced under specific circumstances to protect the server from information
breach particularly when the server is transported by non-certified carriers to remote environments. See
“System Lockdown Mode” on page 257 for details.
Tech Tips
Lenovo continually updates the support website with the latest tips and techniques that you can use to solve
issues that your server might encounter. These Tech Tips (also called retain tips or service bulletins) provide
procedures to work around issues or solve problems related to the operation of your server.
To find the Tech Tips available for your server:
1. Go to http://datacentersupport.lenovo.com and navigate to the support page for your server.
2. Click on How To’s from the navigation pane.
3. Click Article Type ➙ Solution from the drop-down menu.
Follow the on-screen instructions to choose the category for the problem that you are having.
2ThinkEdge SE455 V3 User Guide

Security advisories
Lenovo is committed to developing products and services that adhere to the highest security standards in
order to protect our customers and their data. When potential vulnerabilities are reported it is the
responsibility of the Lenovo Product Security Incident Response Team (PSIRT) to investigate and provide
information to our customers so they may put mitigation plans in place as we work toward providing
solutions.
The list of current advisories is available at the following site:
https://datacentersupport.lenovo.com/product_security/home
Specifications
Summary of the features and specifications of the server. Depending on the model some features might not
be available or some specifications might not apply.
Refer to the below table for specifications categories and the content of each category.
Specification
category
Technical specifications Mechanical specifications Environmental specifications
Content • Processor
• Memory
• M.2 Drive
• Storage expansion
• Expansion slots
• Graphics processing units
(GPU) and accelerator
• Integrated functions and I/O
connectors
• Network
• RAID adapter
• Host bus adapter
• System fan
• Electrical input
• Minimal configuration for
debugging
• Operating systems
• Dimension
• Weight
• Acoustical noise emissions
• Ambient temperature
management
• Environmental
Technical specifications
Summary of the technical specifications of server. Depending on the model some features might not be
available or some specifications might not apply.
Chapter 1.Introduction 3

Processor
Supports AMD® EPYCTM 8004 series processors.
• Scalable up to 64 cores
• Designed for LGA 4844 (SP6) socket
• Supports 96 lanes of high speed I/O
• Thermal Design Power (TDP): up to 200 watts
• Configurable Thermal Design Power (cTDP): up to 225 watts
For a list of supported processors see: https://serverproven.lenovo.com.
Memory
See “Memory module installation rules and order” on page 43 for detailed information about memory configuration and
setup.
• Capacity
– Minimum: 16 GB
– Maximum: 576 GB
• Memory module types: Double-data-rate 5 (TruDDR5) error correcting code (ECC) 4800 MT/s registered DIMM
(RDIMM)
• Slots: 6 dual inline memory module (DIMM) connectors
For a list of supported memory modules see: https://serverproven.lenovo.com.
M.2 Drive
Supports up to two SATA/NVMe M.2 drives.
• Capacity
– 128 GB
– 240 GB
– 480 GB
– 960 GB
Notes:
• The non-RAID configuration of M.2 drives supports NVMe only.
• The RAID configuration of M.2 drives is supported with one of the following RAID adapters:
– ThinkSystem RAID 5350-8i PCIe 12Gb Adapter: SATA
– ThinkSystem RAID 540-8i PCIe Gen4 12Gb Adapter: NVMe
For a list of supported M.2 drives see: https://serverproven.lenovo.com.
Storage expansion
Front drives
• Up to four 2.5-inch SAS/SATA/NVMe hot-swap drives
Note: When SED encryption is enabled it is necessary to power cycle the system after installing an SED; without
power cycling the SED will not be recognized by the host OS.
Internal drives (optional)
• Up to four 2.5-inch SAS/SATA/NVMe non-hot-swap drives
Note: RAID adapter/HBA is required for SAS drives.
4ThinkEdge SE455 V3 User Guide

Expansion slots
Supported expansion slots vary by configuration.
• M.2 drive bay (optional): support up to two M.2 SATA/NVMe drives
– Slot 1 / M.2 bay 0
– Slot 2 / M.2 bay 1
Note: RAID adapter/HBA is required for M.2 SATA drives.
• PCIe slots: all PCIe slots support 75W
Note: Performance may degrade when a x16 PCIe adapter is installed in a x8 lane PCIe slot.
– PCIe riser 1
– Slot 3: x16 (Gen5 x16 lanes)
– Slot 4: x16 (Gen4 x8 lanes)
– Slot 5: x16 (Gen4 x8 lanes)
Notes:
– When the serial port module is installed Slot 5 is not supported.
– When a double-wide GPU is installed in Slot 3 Slot 4 is not supported.
– PCIe riser 2 (optional)
– Slot 6: x16 (Gen4 x8 lanes)
– Slot 7: x16 (Gen5 x16 lanes)
– Slot 8: x16 (Gen4 x8 lanes)
Notes:
– Slot 6 and Slot 8 are not supported in the following configurations:
• Front SATA drive backplane and internal NVMe drive backplane connect to the system board
• Front NVMe drive backplane and internal NVMe drive backplane connect to the system board
– When a double-wide GPU is installed in Slot 7 Slot 6 is not supported.
• OCP module slot
– Slot 9: Gen5 x16 lanes (with NC-SI support)
Graphics processing unit (GPU) and accelerator
Supports one of the following:
• Up to two double-wide 330W GPUs (Slot 3 and Slot 7)
• Up to six single-wide 75W GPUs/accelerators
Chapter 1.Introduction 5

Integrated functions and I/O connectors
• Lenovo XClarity Controller (XCC) which provides service processor control and monitoring functions video
controller and remote keyboard video mouse and remote drive capabilities.
– The server supports Lenovo XClarity Controller 2 (XCC2). For additional information about Lenovo XClarity
Controller 2 (XCC2) refer to https://pubs.lenovo.com/lxcc-overview/.
• Front I/O connectors
– One XCC system management port on the front to connect to a systems-management network. This RJ-45
connector is dedicated to the Lenovo XClarity Controller functions and runs at 1 GB speed.
– A group of two or four Ethernet connectors on OCP module
– One USB 2.0 Type-A connector with Lenovo XClarity Controller management
– Two USB 3.2 Gen 1 (5 Gbps) Type-A connectors
– One USB 3.2 Gen 1 (5 Gbps) Type-C connector with display support
– One external diagnostics connector
Network
• OCP 3.0 module: Supports one OCP 3.0 Ethernet network adapter in Slot 9 (with NC-SI support)
• Supports up to six PCIe Ethernet adapters
RAID adapter
• ThinkSystem RAID 5350-8i PCIe 12Gb Adapter: RAID 0 1 10 5
• ThinkSystem RAID 540-8i PCIe Gen4 12Gb Adapter: RAID 0 1 10
• ThinkSystem RAID 940-8i 4GB Flash PCIe Gen4 12Gb Adapter: RAID 0 1 10 5 50 6 60
Important: Do not enable the SED management of RAID adapter and do not connect encryption-enabled SEDs to
RAID adapters. The SED management of RAID adapter might conflict with system AK management.
Notes:
• The non-RAID configuration of M.2 drives supports NVMe only.
• The RAID configuration of M.2 drives is supported with one of the following RAID adapters:
– ThinkSystem RAID 5350-8i PCIe 12Gb Adapter: SATA
– ThinkSystem RAID 540-8i PCIe Gen4 12Gb Adapter: NVMe
Host bus adapter
• ThinkSystem 440-8i SAS/SATA PCIe Gen4 12Gb HBA
• ThinkSystem 4350-8i SAS/SATA 12Gb HBA
System fan
• Five 60 mm x 60 mm x 56 mm dual-rotor fans
Electrical input
Supports up to two units of power supplies with N+N redundancy. Following is the list of supported types:
• 1800-watt Platinum input power 230 VAC
• 1100-watt Titanium input power 230 VAC
• 1100-watt Platinum input power 115-230 VAC
• 1100-watt -48V DC power supply unit
Important: Power supplies installed in the server must be with the same power rating wattage or level.
6ThinkEdge SE455 V3 User Guide

Minimal configuration for debugging
• One processor
• One DDR5 DRAM memory modules in slot 3 (DIMM3)
• One power supply unit in PSU bay 1 (PSU1)
• One M.2 boot drive (if OS is needed for debugging)
• Five system fans
Operating systems
Supported and certified operating systems:
• Microsoft Windows Server
• VMware ESXi
• Red Hat Enterprise Linux
• SUSE Linux Enterprise Server
References:
• Complete list of available operating systems: https://lenovopress.lenovo.com/osig.
• OS deployment instructions see “Deploy the operating system” on page 266.
Mechanical specifications
Summary of the mechanical specifications of server. Depending on the model some features might not be
available or some specifications might not apply.
Dimension
• Depth:
– Without security bezel (from the EIA brackets to the rear end of the chassis): 440.0 mm (17.32 inches)
– With security bezel: 546.5 mm (21.51 inches)
• Height: 86.5 mm (3.41 inches)
• Width:
– Without EIA brackets: 444.6 mm (17.50 inches)
– With EIA brackets: 480.5 mm (18.92 inches)
Weight
Maximum: 19.36 kg (42.68 lbs)
Environmental specifications
Summary of the environmental specifications of server. Depending on the model some features might not be
available or some specifications might not apply.
Chapter 1.Introduction 7

Acoustical noise emissions
The server has the following acoustic noise emissions declaration:
• Sound power level (LWAd)
– Idling:
– Minimum: 5.5 Bel
– GPU Rich: 5.5 Bel
– Operating profile 1:
– Minimum: 5.5 Bel
– GPU Rich: 5.5 Bel
– Operating profile 2:
– Minimum: 5.5 Bel
– GPU Rich: 7.4 Bel
• Sound pressure level (LpAm):
– Idling:
– Minimum: 39.0 dBA
– GPU Rich: 39.0 dBA
– Operating profile 1:
– Minimum: 39.0 dBA
– GPU Rich: 39.0 dBA
– Operating profile 2:
– Minimum: 39.0 dBA
– GPU Rich: 58.2 dBA
Notes:
• These sound levels were measured in controlled acoustical environments according to procedures specified by
ISO7779 and are reported in accordance with ISO 9296. Operating profile 1 is represented by 50% CPU TDP.
Operating profile 2 is represented by 100% CPU TDP or 70%/30% storage write/read or 100% GPU.
• The declared acoustic sound levels are based on the specified configurations which may change depending on
configuration/conditions.
– Minimum: 1x AMD EPYC 8024P (8 core 90W) CPU 4x ThinkSystem 32GB TruDDR5 4800MHz (2Rx8) RDIMMs
1x ThinkSystem Intel X710-T2L 10GBASE-T 2-port OCP Ethernet Adapter 2x 5400 Pro 2280 M.2 SATA SSD
960GB boot drive 4x ThinkSystem 2.5" 5400 MAX 3.84TB Mixed Use SATA 6Gb HS SSD data drives 2x
ThinkSystem RAID 5350-8i PCIe 12Gb Adapter 2x AC PSU 1100W
– GPU Rich: 1x AMD EPYC 8224P (24 core 160W) CPU 4x ThinkSystem 32GB TruDDR5 4800MHz (2Rx8)
RDIMMs 1x ThinkSystem Intel X710-T2L 10GBASE-T 2-port OCP Ethernet Adapter 2x 5400 Pro 2280 M.2
SATA SSD 960GB boot drive 4x ThinkSystem 2.5" 5400 MAX 3.84TB Mixed Use SATA 6Gb HS SSD data
drives 2x ThinkSystem RAID 5350-8i PCIe 12Gb Adapter 4x ThinkSystem NVIDIA L4 24GB PCIe Gen4 Passive
GPU 2x AC PSU 1100W
• Government regulations (such as those prescribed by OSHA or European Community Directives) may govern noise
level exposure in the workplace and may apply to you and your server installation. The actual sound pressure levels
in your installation depend upon a variety of factors including the number of racks in the installation; the size
materials and configuration of the room; the noise levels from other equipment; the room ambient temperature and
employee's location in relation to the equipment. Further compliance with such government regulations depends
on a variety of additional factors including the duration of employees' exposure and whether employees wear
hearing protection. Lenovo recommends that you consult with qualified experts in this field to determine whether
you are in compliance with the applicable regulations.
8ThinkEdge SE455 V3 User Guide

Recommended ambient temperature
Specific components require proper ambient temperature to prevent performance degradation. See the following table
for details.
Notes:
• ThinkEdge SE455 V3 supports different acoustic modes which optimize the operation of system fans for better
acoustic performance.
• The server might operate in one of the following acoustic modes. See the corresponding table for information of
recommended ambient temperature:
– Table 1 “Disabled” on page 9
– Table 2 “Mode 1” on page 11
– Table 3 “Mode 2” on page 11
Disabled Mode 1 Mode 2
The server operates at default fan
speeds.
The server operates with sound
pressure level of 45 dBA at 25°C with
proper configuration.
The server operates with sound
pressure level of 40 dBA at 25°C with
proper configuration.
• 2U heat sink is necessary.
• The optimized acoustic performance requires ambient temperature to be
lower than 25°C.
• Throttling might momentarily occur in this mode.
Note: The components listed as "not recommended" in the following tables
usually generate too much heat for the fans to run at a low enough speed to
keep the noise of the system low. If a not-recommended component is
installed and is only lightly loaded it may still be possible to run the server in
the acoustic mode and lower the system noise.
Table 1. Recommended ambient temperature: acoustic mode disabled
Components installed Recommended ambient temperature lower
than
Note: The components not listed in this table are recommended to operate with ambient temperature lower than 55°
C.
Processor
AMD EPYC 8124P processor 50°C
AMD EPYC 8224P 8324P 8434P 8534P
processor
45°C
AMD EPYC 8024PN 8124PN 8224PN 8324PN
8434PN 8534PN processor
45°C
PCIe adapters
• ThinkSystem RAID 940-8i 4GB Flash PCIe
Gen4 12Gb Adapter
• ThinkSystem Broadcom 57508 100GbE
QSFP56 2-port PCIe 4 Ethernet Adapter
• ThinkSystem Mellanox ConnectX-6 Dx
100GbE QSFP56 2-port PCIe Ethernet
Adapter
• ThinkSystem Nvidia ConnectX-7 NDR200/
HDR QSFP112 2-port PCIe Gen5 x16
InfiniBand Adapter
50°C
Chapter 1.Introduction 9

Table 1. Recommended ambient temperature: acoustic mode disabled (continued)
Components installed Recommended ambient temperature lower
than
Single-wide GPU adapter or accelerator 45°C
Double-wide GPU adapter 40°C
OCP module
ThinkSystem Broadcom 57508 100GbE QSFP56
2-Port OCP Ethernet Adapter
50°C
Front NVMe drives
• U.3 7450 PRO SSD (1.92TB or smaller)
• U.2 P5520 SSD (3.84TB or smaller)
• U.2 P5620 SSD (3.2TB or smaller)
• U.3 7450 MAX SSD (800GB)
50°C
• U.2 P5520 SSD (7.68TB or larger)
• U.2 P5620 SSD (6.4TB or larger)
45°C
• U.3 7450 PRO SSD (3.84TB or larger)
• U.3 7450 MAX SSD (1.6TB or larger)
35°C
Internal SATA drives 45°C
Internal NVMe drives 35°C
Notes:
• The following internal NVMe drives might be
throttled when ambient temperature is higher
than 30°C:
– U.2 P5520 SSD (7.68TB)
– U.2 P5620 SSD (6.4TB)
• The following NVMe drives are not supported
as internal drives:
– U.3 7450 PRO SSD (3.84TB or larger)
– U.2 P5520 SSD (15.36TB)
– U.2 P5620 SSD (12.8TB)
– U.3 7450 MAX SSD (1.6TB or larger)
M.2 SATA drives 50°C
M.2 NVMe drives 45°C
Memory modules
64GB 50°C
96GB 45°C
10 ThinkEdge SE455 V3 User Guide

Table 2. Recommended ambient temperature: Mode 1
Components with
recommended
number
• Up to two single-wide GPU adapters
Components not
recommended
When one of the following components is installed the acoustic performance might be
impacted:
• AMD EPYC 8224P 8324P 8434P 8534P processor
• AMD EPYC 8024PN 8124PN 8224PN 8324PN 8434PN 8534PN processor
• Memory modules (64GB or larger)
• Double-wide GPU adapters
• Accelerators
• Front NVMe drives:
– U.3 7450 PRO SSD (3.84TB or larger)
– U.2 P5520 SSD (7.68TB or larger)
– U.2 P5620 SSD (6.4TB or larger)
– U.3 7450 MAX SSD (1.6TB or larger)
• Internal NVMe drives
• M.2 NVMe drives
Table 3. Recommended ambient temperature: Mode 2
Components not
recommended
When one of the following components is installed the acoustic performance might be
impacted:
• AMD EPYC 8124P 8224P 8324P 8434P 8534P processor
• AMD EPYC 8024PN 8124PN 8224PN 8324PN 8434PN 8534PN processor
• Memory modules (64GB or larger)
• GPU adapters
• Accelerators
• ThinkSystem Nvidia ConnectX-7 NDR200/HDR QSFP112 2-port PCIe Gen5 x16 InfiniBand
Adapter
• Front NVMe drives:
– U.3 7450 PRO SSD (3.84TB or larger)
– U.2 P5520 SSD (7.68TB or larger)
– U.2 P5620 SSD (6.4TB or larger)
– U.3 7450 MAX SSD (1.6TB or larger)
• Internal drives
• M.2 NVMe drives
Chapter 1.Introduction 11

Environment
ThinkEdge SE455 V3 complies with ASHRAE Class A2 specifications with most configurations and depending on the
hardware configuration also complies with ASHRAE Class A3 and Class A4 specifications. System performance may
be impacted when operating temperature is outside AHSARE A2 specification.
• Air temperature:
– Operating
– ASHARE Class A2: 10°C to 35°C (50°F to 95°F); the maximum ambient temperature decreases by 1°C for
every 300 m (984 ft) increase in altitude above 900 m (2 953 ft).
– ASHARE Class A3: 5°C to 40°C (41°F to 104°F); the maximum ambient temperature decreases by 1°C for
every 175m (574 ft) increase in altitude above 900 m (2 953 ft).
– ASHARE Class A4: 5°C to 45°C (41°F to 113°F); the maximum ambient temperature decreases by 1°C for
every 125m (410 ft) increase in altitude above 900 m (2 953 ft).
– Server off: 5°C to 45°C (41°F to 113°F)
– Shipment/storage: -40°C to 60°C (-40°F to 140°F)
– Extended operation temperature (with limited configuration):
– Server on: 5°C to 55°C (41°F to 131°F)
– Server off: 5°C to 55°C (41°F to 131°F)
Note: See Table 1 “Ambient temperature management” on page 9 for the supported components at different
ambient temperature.
• Maximum altitude: 3 050 m (10 000 ft)
• Relative Humidity (non-condensing):
– Operating
– ASHRAE Class A2: 8% to 80%; maximum dew point: 21°C (70°F)
– ASHRAE Class A3: 8% to 85%; maximum dew point: 24°C (75°F)
– ASHRAE Class A4: 8% to 90%; maximum dew point: 24°C (75°F)
– Shipment/storage: 8% to 90%
• Particulate contamination
– SE455 V3 supports use of a dust filler that is installed inside the security bezel. The dust filler has a Minimum
Efficiency Rating Value (MERV) of 2 per ASHRAE Standard 52.2-2017.
Attention: Airborne particulates and reactive gases acting alone or in combination with other environmental factors
such as humidity or temperature might pose a risk to the server. For information about the limits for particulates and
gases see “Particulate contamination” on page 13.
12 ThinkEdge SE455 V3 User Guide