Lenovo thinksystem SR630 User manual

ThinkSystem SR630 V2
Maintenance Manual
Machine Types: 7Z70 and 7Z71

Note
Before usin this information and the product it supports, be sure to read and understand the safety
information and the safety instructions, which are available at:
http://thinksystem.lenovofiles.com/help/topic/safety_documentation/pdf_files.html
In addition, ensure that you are familiar with the terms and conditions of the Lenovo warranty for your server,
which can be found at:
http://datacentersupport.lenovo.com/warrantylookup
Second Edition (July 2021)
© Copyright enovo 2021.
LIMITED AND RESTRICTED RIGHTS NOTICE: If data or software is delivered pursuant to a General Services
Administration (GSA) contract, use, reproduction, or disclosure is subject to restrictions set forth in Contract No. GS-35F-
05925.

Contents
Safety . . . . . . . . . . . . . . . . . . v
Safety inspection checklist . . . . . . . . . . . vi
Chapter 1. Introduction . . . . . . . . . 1
Specifications . . . . . . . . . . . . . . . . 2
Particulate contamination . . . . . . . . . 10
Firmware updates . . . . . . . . . . . . . . 11
Tech Tips . . . . . . . . . . . . . . . . . 15
Security advisories . . . . . . . . . . . . . 16
Power on the server . . . . . . . . . . . . . 16
Power off the server . . . . . . . . . . . . . 16
Chapter 2. Server components . . . . 19
Front view . . . . . . . . . . . . . . . . . 19
Dia nostics panel . . . . . . . . . . . . 26
LCD dia nostics panel . . . . . . . . . . 28
External LCD dia nostics handset . . . . . . 33
Rear view . . . . . . . . . . . . . . . . . 39
Rear view LEDs . . . . . . . . . . . . . 43
System board components . . . . . . . . . . 44
System board LEDs . . . . . . . . . . . 46
Switch block . . . . . . . . . . . . . . 48
Parts list. . . . . . . . . . . . . . . . . . 49
Power cords . . . . . . . . . . . . . . 52
Chapter 3. Internal cable routing . . . 55
CFF HBA/RAID adapter. . . . . . . . . . . . 57
Front I/O . . . . . . . . . . . . . . . . . 58
Intrusion switch . . . . . . . . . . . . . . . 59
RAID super capacitor modules . . . . . . . . . 60
M.2 drive backplane . . . . . . . . . . . . . 62
16-EDSFF drive backplane . . . . . . . . . . 63
7mm drive backplane . . . . . . . . . . . . 64
2.5-inch/3.5-inch drive backplane (power) . . . . 65
2.5-inch/3.5-inch drive backplane (si nal). . . . . 66
4 x 3.5-inch front drive bays . . . . . . . . 66
4 x 2.5-inch front drive bays . . . . . . . . 70
8 x 2.5-inch front drive bays . . . . . . . . 73
10 x 2.5-inch front drive bays. . . . . . . . 78
Chapter 4. Hardware replacement
procedures . . . . . . . . . . . . . . . 83
Installation uidelines . . . . . . . . . . . . 83
Safety inspection checklist. . . . . . . . . 84
System reliability uidelines . . . . . . . . 85
Workin inside the server with the power on . . 85
Handlin static-sensitive devices . . . . . . 85
Technical rules . . . . . . . . . . . . . . . 86
Technical rules for processors and heat
sinks . . . . . . . . . . . . . . . . . 86
Technical rules for drives . . . . . . . . . 87
Technical rules for RAID confi uration . . . . 87
Technical rules for PCIe adapters . . . . . . 88
Technical rules for GPU adapters . . . . . . 89
Technical rules for system fans . . . . . . . 90
Air baffle replacement . . . . . . . . . . . . 91
Remove the air baffle . . . . . . . . . . . 91
Install the air baffle . . . . . . . . . . . . 92
Backplane replacement. . . . . . . . . . . . 94
Remove the front 2.5-inch drive backplane . . 94
Install the front 2.5-inch drive backplane . . . 95
Remove the front 3.5-inch drive backplane . . 96
Install the front 3.5-inch drive backplane . . . 97
Remove the front 16-EDSFF drive
backplane . . . . . . . . . . . . . . . 99
Install the front 16-EDSFF drive backplane . . 100
Remove the 2.5-inch rear drive backplane. . . 101
Install the 2.5-inch rear drive backplane . . . 103
Remove the 7mm drive backplanes . . . . . 105
Install the 7mm drive backplanes . . . . . . 107
CMOS battery replacement . . . . . . . . . . 108
Remove the CMOS battery . . . . . . . . 108
Install the CMOS battery . . . . . . . . . 110
EDSFF ca e replacement . . . . . . . . . . . 112
Remove an EDSFF ca e . . . . . . . . . 112
Install an EDSFF ca e . . . . . . . . . . 113
Front I/O assembly replacement . . . . . . . . 115
Remove the front I/O assembly . . . . . . . 116
Install the front I/O assembly . . . . . . . . 117
Remove the LCD dia nostics panel
assembly . . . . . . . . . . . . . . . 118
Install the LCD dia nostics panel
assembly . . . . . . . . . . . . . . . 119
Heat sink Torx T30 nut replacement . . . . . . . 121
Remove a heat sink Torx T30 nut . . . . . . 121
Install a heat sink Torx T30 nut . . . . . . . 122
Hot-swap drive replacement . . . . . . . . . . 123
Remove a 2.5/3.5-inch hot-swap drive . . . . 124
Install a 2.5/3.5-inch hot-swap drive . . . . . 125
Remove an EDSFF drive . . . . . . . . . 126
Install an EDSFF drive . . . . . . . . . . 128
Hot-swap power supply unit replacement . . . . 130
Remove a hot-swap power supply unit . . . . 130
Install a hot-swap power supply . . . . . . 135
© Copyri ht Lenovo 2021 i

Hot-swap rear drive assembly replacement . . . . 140
Remove the hot-swap rear drive assembly . . 140
Install the hot-swap rear drive assembly . . . 141
Internal CFF HBA/RAID adapter replacement . . . 144
Remove the internal CFF HBA/RAID
adapter . . . . . . . . . . . . . . . . 144
Install the internal CFF HBA/RAID adapter. . . 145
Intrusion switch replacement . . . . . . . . . 146
Remove an intrusion switch . . . . . . . . 146
Install an intrusion switch . . . . . . . . . 147
Memory module replacement . . . . . . . . . 148
Remove a memory module . . . . . . . . 148
Memory module installation rules and
order . . . . . . . . . . . . . . . . . 150
Install a memory module . . . . . . . . . 164
M.2 adapter and M.2 drive replacement . . . . . 166
Remove the M.2 adapter and M.2 drive. . . . 166
Adjust the retainer on the M.2 adapter . . . . 168
Install the M.2 adapter and M.2 drive. . . . . 169
OCP 3.0 Ethernet adapter replacement . . . . . 171
Remove the OCP 3.0 Ethernet adapter . . . . 171
Install the OCP 3.0 Ethernet adapter . . . . . 172
PCIe adapter replacement. . . . . . . . . . . 173
Remove a PCIe adapter . . . . . . . . . . 174
Install a PCIe adapter . . . . . . . . . . . 175
Processor and heat sink replacement . . . . . . 176
Remove a processor and heat sink . . . . . 176
Separate the processor from carrier and heat
sink. . . . . . . . . . . . . . . . . . 179
Install a processor and heat sink . . . . . . 181
Rack latches replacement . . . . . . . . . . . 185
Remove the rack latches . . . . . . . . . 185
Install the rack latches . . . . . . . . . . 187
RAID super capacitor module replacement . . . . 189
Remove the RAID super capacitor module on
the chassis . . . . . . . . . . . . . . . 190
Install the RAID super capacitor module on
the chassis . . . . . . . . . . . . . . . 192
Remove the RAID super capacitor module on
the air baffle . . . . . . . . . . . . . . 194
Install the RAID super capacitor module on
the air baffle . . . . . . . . . . . . . . 195
Remove the RAID super capacitor module on
the riser . . . . . . . . . . . . . . . . 196
Install the RAID super capacitor module on
the riser . . . . . . . . . . . . . . . . 197
Riser card replacement . . . . . . . . . . . . 198
Remove a riser card . . . . . . . . . . . 198
Install a riser card . . . . . . . . . . . . 201
Security bezel replacement . . . . . . . . . . 203
Remove the security bezel . . . . . . . . . 203
Install the security bezel . . . . . . . . . . 204
Serial port module replacement . . . . . . . . 206
Remove a serial port module . . . . . . . . 206
Install a serial port module . . . . . . . . . 207
System fan replacement . . . . . . . . . . . 209
Remove a system fan. . . . . . . . . . . 209
Install a system fan. . . . . . . . . . . . 210
System board replacement . . . . . . . . . . 212
Remove the system board . . . . . . . . . 213
Install the system board . . . . . . . . . . 214
Update the machine type and serial
number . . . . . . . . . . . . . . . . 216
Enable TPM . . . . . . . . . . . . . . 218
Enable UEFI Secure Boot . . . . . . . . . 219
Top cover replacement . . . . . . . . . . . . 220
Remove the top cover . . . . . . . . . . 220
Install the top cover . . . . . . . . . . . 222
Complete the parts replacement . . . . . . . . 224
Chapter 5. Problem
determination . . . . . . . . . . . . . 227
Event lo s . . . . . . . . . . . . . . . . . 227
Li ht path dia nostics . . . . . . . . . . . . 229
General problem determination procedures . . . . 229
Resolvin suspected power problems . . . . 229
Resolvin suspected Ethernet controller
problems . . . . . . . . . . . . . . . 230
Troubleshootin by symptom . . . . . . . . . 230
Power on and power off problems . . . . . . 232
Memory problems . . . . . . . . . . . . 233
Hard disk drive problems . . . . . . . . . 237
Monitor and video problems . . . . . . . . 241
Keyboard, mouse, KVM switch or USB-device
problems . . . . . . . . . . . . . . . 242
Optional-device problems . . . . . . . . . 243
Serial-device problems . . . . . . . . . . 245
Intermittent problems. . . . . . . . . . . 245
Power problems . . . . . . . . . . . . . 247
Network problems . . . . . . . . . . . . 247
Observable problems. . . . . . . . . . . 247
Software problems. . . . . . . . . . . . 250
Appendix A. Hardware
disassembling for recycle . . . . . . . 251
Disassemblin the system board for recycle. . . . 251
Appendix B. Getting help and
technical assistance . . . . . . . . . . 253
Before you call . . . . . . . . . . . . . . . 253
Collectin service data . . . . . . . . . . . . 254
Contactin Support . . . . . . . . . . . . . 255
ii ThinkSystem SR630 V2 Maintenance Manual

Appendix C. Notices. . . . . . . . . . 257
Trademarks . . . . . . . . . . . . . . . . 258
Important notes . . . . . . . . . . . . . . . 258
Telecommunication re ulatory statement. . . . . 258
Electronic emission notices . . . . . . . . . . 258
Taiwan BSMI RoHS declaration . . . . . . . 259
Taiwan import and export contact information . . . 259
Index . . . . . . . . . . . . . . . . . . 261
© Copyri ht Lenovo 2021 iii

iv ThinkSystem SR630 V2 Maintenance Manual

Safety
Before installin this product, read the Safety Information.
Antes de instalar este produto, leia as Informações de Se urança.
在安装本产品之前，请仔细阅读 Safety Information （安全信息）。
Læs sikkerhedsforskrifterne, før du installerer dette produkt.
Lees voordat u dit product installeert eerst de veili heidsvoorschriften.
Ennen kuin asennat tämän tuotteen, lue turvaohjeet kohdasta Safety Information.
Avant d'installer ce produit, lisez les consi nes de sécurité.
Vor der Installation dieses Produkts die Sicherheitshinweise lesen.
Prima di installare questo prodotto, le ere le Informazioni sulla Sicurezza.
Les sikkerhetsinformasjonen (Safety Information) før du installerer dette produktet.
Antes de instalar este produto, leia as Informações sobre Se urança.
© Copyri ht Lenovo 2021 v

Antes de instalar este producto, lea la información de se uridad.
Läs säkerhetsinformationen innan du installerar den här produkten.
Safety inspection checklist
Use the information in this section to identify potentially unsafe conditions with your server. As each machine
was desi ned and built, required safety items were installed to protect users and service technicians from
injury.
Notes:
• The product is not suitable for use at visual display workplaces accordin to §2 of the Workplace
Re ulations.
• The set-up of the server is made in the server room only.
CAUTION:
This equipment must be installed or serviced by trained personnel, as defined by the NEC, IEC 62368-
1 & IEC 60950-1, the standard for Safety of Electronic Equipment within the Field of Audio/Video,
Information Technology and Communication Technology. enovo assumes you are qualified in the
servicing of equipment and trained in recognizing hazards energy levels in products. Access to the
equipment is by the use of a tool, lock and key, or other means of security, and is controlled by the
authority responsible for the location.
Important: Electrical roundin of the server is required for operator safety and correct system function.
Proper roundin of the electrical outlet can be verified by a certified electrician.
Use the followin checklist to verify that there are no potentially unsafe conditions:
1. Make sure that the power is off and the power cord is disconnected.
2. Check the power cord.
• Make sure that the third-wire round connector is in ood condition. Use a meter to measure third-
wire round continuity for 0.1 ohm or less between the external round pin and the frame round.
• Make sure that the power cord is the correct type.
To view the power cords that are available for the server:
a. Go to:
vi ThinkSystem SR630 V2 Maintenance Manual

http://dcsc.lenovo.com/#/
b. In the Customize a Model pane:
1) Click Select Options/Parts for a Model.
2) Enter the machine type and model for your server.
c. Click the Power tab to see all line cords.
• Make sure that the insulation is not frayed or worn.
3. Check for any obvious non-Lenovo alterations. Use ood jud ment as to the safety of any non-Lenovo
alterations.
4. Check inside the server for any obvious unsafe conditions, such as metal filin s, contamination, water or
other liquid, or si ns of fire or smoke dama e.
5. Check for worn, frayed, or pinched cables.
6. Make sure that the power-supply cover fasteners (screws or rivets) have not been removed or tampered
with.
© Copyri ht Lenovo 2021 vii

viii ThinkSystem SR630 V2 Maintenance Manual

Chapter 1. Introduction
The ThinkSystem™ SR630 V2 server is a 1U rack server desi ned to be hi hly flexible to support many kinds
of Information Technolo y (IT) workloads. This hi h-performance, multi-core server is ideally suited for IT
environments that require superior processor performance, input/output (I/O) flexibility, and flexible
mana eability.
Performance, ease of use, reliability, and expansion capabilities were key considerations in the desi n of the
server. These desi n features make it possible for you to customize the system hardware to meet your needs
today and provide flexible expansion capabilities for the future.
The server comes with a limited warranty. For details about the warranty, see:
https://support.lenovo.com/us/en/solutions/ht503310
For details about your specific warranty, see:
http://datacentersupport.lenovo.com/warrantylookup
Identifying your server
When you contact Lenovo for help, the machine type and serial number information helps support
technicians to identify your server and provide faster service.
The machine type and serial number are on the ID label on the ri ht rack latch in the front of the server.
Figure 1. Location of the ID label
XClarity Controller network access label
The XClarity® Controller network access label is attached on the top side of the pull-out information tab as
shown. After you et the server, peel the XClarity Controller network access label away and store it in a safe
place for future use.
Note: The pull-out information tab is located on the ri ht bottom of the front side of your server. For detailed
information, see “Front view” on pa e 19.
© Copyri ht Lenovo 2021 1

Figure 2. Location of the XClarity Controller network access label
Quick response code
The system service label, which is on the top cover, provides a quick response (QR) code for mobile access
to service information. Scan the QR code with a mobile device and a QR code reader application to et quick
access to the Lenovo Service Web site for this server. The Lenovo Service Information Web site provides
additional information for parts installation and replacement videos, and error codes for server support.
The followin illustration shows the QR code: https://datacentersupport.lenovo.com/products/servers/
thinksystem/sr630v2/7z70
Figure 3. QR co e
Specifications
The followin information is a summary of the features and specifications of the server. Dependin on the
model, some features mi ht not be available, or some specifications mi ht not apply.
2ThinkSystem SR630 V2 Maintenance Manual

Table 1. Server specifications
Specification Description
Dimension
• 1U
• Hei ht: 43.0 mm (1.69 inches)
• Width: 439.2 mm (17.29 inches)
• Depth: 772.6 mm (30.42 inches)
Note: The depth is measured without PSU handles or security bezel installed.
Packa e wei ht Up to 26.3 k (57.98 lb)
Processor
Supports multi-core Intel Xeon processors, with inte rated memory controller and
Intel Mesh Ultra Path Interconnect (UPI) topolo y.
• Up to two Intel® Xeon® processors
• Desi ned for Land Grid Array (LGA) 4189 socket
• Scalable up to 40 cores per socket, 80 cores in total
• Thermal Desi n Power (TDP): up to 270 watts
• Supports 3 UPI links up to 11.2 GT/s
For a list of supported processors, see https://static.lenovo.com/us/en/serverproven/
index.shtml.
Only one processor is supported if you use the 8351N processor or processor with
the suffix of “U”.
For technical rules for processors and heat sinks, see “Technical rules for processors
and heat sinks” on pa e 86.
Heat sink
• Standard heat sink
• Hi h-performance heat sink (T-shape)
For technical rules for processors and heat sinks, see “Technical rules for processors
and heat sinks” on pa e 86.
Chapter 1.Introduction 3

Table 1. Server specifications (continue )
Specification Description
Memory
• Slots: 32 memory module slots
• Supported memory module type:
– TruDDR4 3200, dual-rank, 16 GB/32 GB/64 GB RDIMM
– TruDDR4 3200, quad-rank, 128 GB 3DS RDIMM
– TruDDR4 3200, 128 GB/256 GB Intel® OptaneTM Persistent Memory (PMEM)
• Minimum memory: 16 GB
• Maximum memory:
– 2 TB usin RDIMMs
– 4 TB usin 3DS RDIMMs
Notes:
• The operatin speed and total memory capacity depend on the processor model
and UEFI settin s.
• All Icelake Platinum and Gold CPUs support PMEM. For Icelake Silver CPUs, only
processor 4314 supports PMEM.
For a list of supported memory options, see https://static.lenovo.com/us/en/
serverproven/index.shtml.
For technical rules for memory modules, see “Memory module installation rules and
order” on pa e 150.
Operatin systems
Supported and certified operatin systems:
• Microsoft Windows Server
• VMware ESXi
• Red Hat Enterprise Linux
• SUSE Linux Enterprise Server
• Canonical Ubuntu
References:
• Complete list of available operatin systems: https://lenovopress.com/osi .
• OS deployment instructions: Follow the adopted combination to install all the
PMEMs and DRAM DIMMs (see “Install the operatin system” in Setup Gui e).
4ThinkSystem SR630 V2 Maintenance Manual

Table 1. Server specifications (continue )
Specification Description
Internal drives
Front:
• Up to four 3.5-inch hot-swap SAS/SATA drives
• Up to four 3.5-inch hot-swap AnyBay (SAS/SATA/NVMe) drives
• Up to four 2.5-inch hot-swap SAS/SATA drives
• Up to ei ht 2.5-inch hot-swap SAS/SATA/U.3 NVMe drives
• Up to six 2.5-inch hot-swap SAS/SATA and four 2.5-inch hot-swap AnyBay (SAS/
SATA/NVMe) drives
• Up to six 2.5-inch hot-swap SAS/SATA and four 2.5-inch hot-swap NVMe drives
• Up to six 2.5-inch hot-swap SAS/SATA and two 2.5-inch hot-swap AnyBay (SAS/
SATA/NVMe) drives and two 2.5-inch hot-swap NVMe drives
• Up to ten 2.5-inch hot-swap NVMe drives
• Up to ten 2.5-inch hot-swap AnyBay (SAS/SATA/NVMe) drives
• Up to 16 hot-swap EDSFF drives
Inside:
• Up to two internal SATA or NVMe M.2 drives
Rear:
• Up to two 2.5-inch hot-swap SAS/SATA or NVMe drives
• Up to two 7mm hot-swap SATA or NVMe drives
Notes:
• M.2 and 7mm drives are not supported at the same time.
• If PMEM or 256 GB DIMM is used, rear 2.5-inch drives are not supported.
• For the server model with 16 front EDSFF drives, M.2 drives are not supported.
• For technical rules for drives, see “Technical rules for drives” on pa e 87.
Expansion slots
Dependin on the model, your server supports up to three PCIe slots in the rear.
• PCIe x16, low-profile
• PCIe x16/x16, low-profile + low profile
• PCIe x16/x16, low profile + full-hei ht
For locations and technical rules for PCIe slots, see “Rear view” on pa e 39 and
“Technical rules for PCIe adapters” on pa e 88.
Graphics processin unit
(GPU)
Your server supports the followin GPUs:
• Low-profile, half-len th, sin le-wide: NVIDIA® Tesla T4 16GB Base Card (for China
only), NVIDIA® Quadro® P620, NVIDIA® Tesla® T4
• Full-hei ht, 3/4 len th, sin le-wide: NVIDIA® Quadro® P2200
For technical rules for GPU, see “Technical rules for GPU adapters” on pa e 89.
Chapter 1.Introduction 5

Table 1. Server specifications (continue )
Specification Description
Input/Output (I/O) features
• Front:
– One VGA connector (optional)
– One USB 2.0 connector
– One USB 3.2 Gen 1 (5Gbps) connector
– One external dia nostics connector
– One dia nostics panel (optional)
– One LCD dia nostics panel (optional)
• Rear:
– One VGA connector
– Three USB 3.2 Gen 1 (5Gbps) connectors
– Ethernet connectors on OCP 3.0 Ethernet adapter (optional)
– One RJ45 BMC mana ement network connector
– One serial port (optional)
For detailed information about each component, see “Front view” on pa e 19 and
“Rear view” on pa e 39.
HBA/RAID adapters
(dependin on the model)
Support for JBOD mode and RAID level 0, 1, 10:
• 530-16i PCIe 12Gb RAID Adapter
Support for JBOD mode and RAID level 0, 1, 5, 10, 50:
• 530-8i PCIe 12Gb RAID Adapter
Support for JBOD mode and RAID level 0, 1, 5, 6, 10, 50, 60:
• 930-8i 2GB Flash PCIe 12Gb RAID Adapter
• 930-8e 4GB Flash PCIe 12Gb RAID Adapter
• 930-16i 4GB Flash PCIe 12Gb RAID Adapter
• 940-8i 4GB Flash PCIe Gen4 12Gb RAID Adapter
• 940-8i 8GB Flash PCIe Gen4 12Gb RAID Adapter
• 940-16i 8GB Flash PCIe Gen4 12Gb RAID Adapter
• 940-16i 8GB Flash PCIe Gen4 12Gb Internal RAID Adapter
Support the following HBAs:
• 430-8i SAS/SATA 12Gb HBA
• 430-8e SAS/SATA 12Gb HBA
• 430-16i SAS/SATA 12Gb HBA
• 430-16e SAS/SATA 12Gb HBA
• 440-16i SAS/SATA PCIe Gen4 12Gb Internal HBA
For technical rules for stora e controller adapters, see “Technical rules for PCIe
adapters” on pa e 88.
For technical rules for RAID confi uration, see “Technical rules for RAID
confi uration” on pa e 87.
6ThinkSystem SR630 V2 Maintenance Manual

Table 1. Server specifications (continue )
Specification Description
System fans
Up to ei ht dual-rotor hot-swap fans (includin two redundant fans)
• Standard fan 4056 (21000 RPM)
• Performance fan 4056 (28000 RPM)
For technical rules for system fans, see “Technical rules for system fans” on pa e 90.
Minimal confi uration for
debu in
• One processor in processor socket 1
• One memory module in slot 3
• One power supply
• One HDD/SSD drive, one M.2 drive, or one 7mm drive (if OS is needed for
debu in )
• Six system fans (with one processor)
Chapter 1.Introduction 7

Table 1. Server specifications (continue )
Specification Description
Acoustical noise emissions
The server has the followin acoustic noise emissions declaration:
Table 2. Acoustic noise emissions eclaration
Scenario Sound power
level ( WAd)
Sound
pressure level
( pAm): Used configuration
Idlin-
g
Oper-
ating
Idlin-
g
Oper-
ating
Typical 6.0
Bel
7.1
Bel
45
dBA
56 dBA • Two 165 W processors
• Ei ht 64 GB DIMMs
• Ei ht SAS hard disk drives
• RAID 440-16i adapter
• Intel X710-T2L 10GBASE-T 2-
port OCP adapter
• Two 750-watt power supply
units
Stora e
rich
7.5
Bel
7.7
Bel
61
dBA
62 dBA • Two 165 W processors
• Sixteen 64 GB DIMMs
• Twelve SAS hard disk drives
• RAID 940-16i adapter
• Intel X710-T2L 10GBASE-T 2-
port OCP adapter
• Two 750-watt power supply
units
GPU rich 7.6
Bel
8.3
Bel
62
dBA
69 dBA • Two 205 W processors
• Sixteen 64 GB DIMMs
• Ten SAS hard disk drives
• RAID 940-16i adapter
• Intel X710-T2L 10GBASE-T 2-
port OCP adapter
• Two NVIDIA Tesla T4 GPUs
• Two 1100-watt power supply
units
Notes:
• These sound power levels are measured in controlled acoustical environments
accordin to procedures specified by ISO 7779 and are reported in accordance
with ISO 9296.
• The declared sound levels may chan e dependin on confi uration/conditions, for
example hi h-power NICs, hi h-power processors and GPUs, such as
ThinkSystem Mellanox ConnectX-6 HDR/200GbE QSFP56 1-port/2-port PCIe
Adapter, ThinkSystem Broadcom 57454 10GBASE-T 4-port OCP Ethernet
Adapter.
• Government re ulations (such as those prescribed by OSHA or European
Community Directives) may overn noise level exposure in the workplace and may
8ThinkSystem SR630 V2 Maintenance Manual

Table 1. Server specifications (continue )
Specification Description
apply to you and your server installation. The actual sound pressure levels in your
installation depend upon a variety of factors, includin the number of racks in the
installation; the size, materials, and confi uration of the room; the noise levels
from other equipment; the room ambient temperature, and employee's location in
relation to the equipment. Further, compliance with such overnment re ulations
depends on a variety of additional factors, includin the duration of employees'
exposure and whether employees wear hearin protection. Lenovo recommends
that you consult with qualified experts in this field to determine whether you are in
compliance with the applicable re ulations.
Electrical input
One or two hot-swap power supplies for redundancy support:
Table 3. Electrical input for power supplies
Power supply 100–127 V
ac
200–240 V ac 240 V dc -48 V dc
500-watt 80 PLUS
Platinum
√ √ √
750-watt 80 PLUS
Platinum
√ √ √
1100-watt 80
PLUS Platinum √ √ √
1800-watt 80
PLUS Platinum √ √
750-watt 80 PLUS
Titanium
√ √
1100-watt √
CAUTION:
• 240 V dc input (input range: 180-300 V dc) is supported in Chinese Mainland
ON Y.
• Power supply with 240 V dc input cannot support hot plugging power cord
function. Before removing the power supply with dc input, please turn off
server or disconnect dc power sources at the breaker panel or by turning off
the power source. Then, remove the power cord.
Environment
The server is supported in the followin environment:
• Air temperature:
– Operatin :
– ASHRAE class A2: 10–35°C (50–95°F); when the altitude exceeds 900 m
(2953 ft), the maximum ambient temperature value decreases by 1°C (1.8°F)
with every 300 m (984 ft) of altitude increase.
– ASHRAE class A3: 5–40°C (41–104°F); when the altitude exceeds 900 m
(2953 ft), the maximum ambient temperature value decreases by 1°C (1.8°F)
with every 175 m (574 ft) of altitude increase.
– ASHRAE class A4: 5–45°C (41–113°F); when the altitude exceeds 900 m
(2953 ft), the maximum ambient temperature value decreases by 1°C (1.8°F)
with every 125 m (410 ft) of altitude increase.
– Server off: 5–45°C (41–113°F)
– Shippin or stora e: -40–60°C (-40–140°F)
Chapter 1.Introduction 9

Table 1. Server specifications (continue )
Specification Description
• Maximum altitude: 3050 m (10 000 ft)
• Relative humidity (non-condensin ):
– Operatin :
– ASHRAE Class A2: 8%–80%, maximum dew point: 21°C (70°F)
– ASHRAE Class A3: 8%–85%, maximum dew point: 24°C (75°F)
– ASHRAE Class A4: 8%–90%, maximum dew point: 24°C (75°F)
– Shipment or stora e: 8%–90%
• Particulate contamination
Attention: Airborne particulates and reactive ases actin alone or in
combination with other environmental factors such as humidity or temperature
mi ht pose a risk to the server. For information about the limits for particulates and
ases, see “Particulate contamination” on pa e 10.
The server is desi ned for standard data center environment and is recommended to
be placed in industrial data center. Dependin on hardware confi urations, the server
complies with ASHRAE Class A2, A3, or A4 specifications with certain thermal
restrictions. System performance may be impacted when operatin temperature is
outside permitted conditions.
The restrictions to ASHRAE support are as follows:
• The ambient temperature must be no more than 30°C if your server meets any of
the followin conditions:
– 205 W < TDP ≤ 270 W
– Installed with any rear 2.5-inch NVMe drive
– Installed with any 256 GB DIMM or PMEM
– Installed with any passive GPU
• The ambient temperature must be no more than 35°C if your server meets any of
the followin conditions:
– 165 W < TDP ≤ 205 W
– Installed with any front NVMe drive or rear NVMe AIC SSD
– Installed with any 7mm boot drive
– Installed with any M.2 NVMe drive
– Installed with any rear 2.5-inch SAS/SATA drive
• The ambient temperature must be no more than 45°C if the CPU TDP is equal to
or smaller than 165 W.
Particulate contamination
Attention: Airborne particulates (includin metal flakes or particles) and reactive ases actin alone or in
combination with other environmental factors such as humidity or temperature mi ht pose a risk to the
device that is described in this document.
Risks that are posed by the presence of excessive particulate levels or concentrations of harmful ases
include dama e that mi ht cause the device to malfunction or cease functionin alto ether. This
specification sets forth limits for particulates and ases that are intended to avoid such dama e. The limits
must not be viewed or used as definitive limits, because numerous other factors, such as temperature or
moisture content of the air, can influence the impact of particulates or environmental corrosives and aseous
10 ThinkSystem SR630 V2 Maintenance Manual