LG LG500G User manual

Service Manual Model : LG500G
Internal Use Only
Service Manual
LG500G
Date: January, 2011 / Issue 1.0

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Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
Table Of Contents
1. INTRODUCTION..................................................................5
1.1 Purpose............................................................................................... 5
1.2 Regulatory Information ............................................................... 5
1.3 Abbreviations................................................................................... 7
2. PERFORMANCE...................................................................9
2.1 H/W Features.................................................................................... 9
2.2 Technical Specification...............................................................11
3. TECHNICAL BRIEF.............................................................16
3.1 Digital Main Processor................................................................16
3.2 Power Management....................................................................21
3.3 FEM with integrated Power Amplifier Module
(SKY77547, U400) .........................................................................33
3.4 Crystal(26 MHz, X100).................................................................35
3.5 RF Subsystem of PMB8810 (U100).........................................36
3.6 MEMORY(PF38F5060M0Y0BE, U101)...................................41
3.7 BT module .......................................................................................43
3.8 SIM Card Interface........................................................................45
3.9 LCD Interface..................................................................................46
3.10 Battery Charger Interface .......................................................49
3.11 Keypad Interface........................................................................50
3.12 Audio Front-End.........................................................................52
3.13 Camera Interface(2M Fixed Focus Camera).....................58
3.14 KEY BACLKLIGHT LED Interface............................................60
3.15 Vibrator Interface .......................................................................61
4. TROUBLE SHOOTING .......................................................62
4.1 RF Component...............................................................................62
4.2 RX Trouble .......................................................................................63
4.3 TX Trouble........................................................................................67
4.4 Power On Trouble.........................................................................71
4.5 Charging Trouble..........................................................................74
4.6 Vibrator Trouble.............................................................................76
4.7 LCD Trouble.....................................................................................79
4.8 Camera Trouble.............................................................................83
4.9 Speaker Trouble ............................................................................87
4.10 Earphone Trouble ......................................................................89
4.11 Receiver Trouble.........................................................................92
4.12 Microphone Trouble.................................................................94
4.13 SIM Card Interface Trouble.....................................................96
4.14 KEY backlight Trouble ..............................................................98
4.15 Micro SD (uSD) Trouble......................................................... 100
4.16 Bluetooth Trouble................................................................... 102
5. DOWNLOAD................................................................... 104
6. BLOCK DIAGRAM........................................................... 117
7. CIRCUIT DIAGRAM ........................................................ 119
8. BGA PIN MAP................................................................. 125
9. PCB LAYOUT................................................................... 131
10. ENGINEERING MODE .................................................. 135
11. STAND ALONE TEST .................................................... 136
11.1 Introduction.............................................................................. 136
11.2 Setting Method........................................................................ 136
11.3 Tx Test........................................................................................... 139
11.4 Rx Test.......................................................................................... 140
12. AUTO CALIBRATION.................................................... 141
12.1 Overview .................................................................................... 141
12.2 Configuration of HotKimchi ............................................... 141
12.3 Description of Basic File ....................................................... 142
12.4 Procedure................................................................................... 142
12.5 AGC............................................................................................... 146
12.6 APC ............................................................................................... 146
12.7 ADC............................................................................................... 146
12.8 Target Power ............................................................................. 146
13 EXPLODED VIEW & REPLACEMENT PART LIST .......... 147
13.1 EXPLODED VIEW...................................................................... 147
13.2 Replacement Parts.................................................................. 151
13.3 Accessory ................................................................................... 165

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LGE Internal Use Only Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes

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Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
1. INTRODUCTION
1. INTRODUCTION
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1.1 Purpose
This manual provides the information necessary to repair, calibration, description and download the
features of this model.
1.2 Regulatory Information
A. Security
Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example,
persons other than your company’s employees, agents, subcontractors, or person working on your
company’s behalf) can result in substantial additional charges for your telecommunications services.
System users are responsible for the security of own system. There are may be risks of toll fraud
associated with your telecommunications system. System users are responsible for programming and
configuring the equipment to prevent unauthorized use. The manufacturer does not warrant that this
product is immune from the above case but will prevent unauthorized use of common-carrier
telecommunication service of facilities accessed through or connected to it.
The manufacturer will not be responsible for any charges that result from such unauthorized use.
B. Incidence of Harm
If a telephone company determines that the equipment provided to customer is faulty and possibly
causing harm or interruption in service to the telephone network, it should disconnect telephone service
until repair can be done. A telephone company may temporarily disconnect service as long as repair is
not done.
C. Changes in Service
A local telephone company may make changes in its communications facilities or procedure. If these
changes could reasonably be expected to affect the use of the this phone or compatibility with the
network, the telephone company is required to give advanced written notice to the user, allowing the
user to take appropriate steps to maintain telephone service.
D. Maintenance Limitations
Maintenance limitations on this model must be performed only by the manufacturer or its authorized
agent. The user may not make any changes and/or repairs expect as specifically noted in this manual.
Therefore, note that unauthorized alternations or repair may affect the regulatory status of the system
and may void any remaining warranty.
1. INTRODUCTION
1. INTRODUCTION

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LGE Internal Use Only Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
1. INTRODUCTION
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E. Notice of Radiated Emissions
This model complies with rules regarding radiation and radio frequency emission as defined by local
regulatory agencies. In accordance with these agencies, you may be required to provide information such
as the following to the end user.
F. Pictures
The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly
different.
G. Interference and Attenuation
Phone may interfere with sensitive laboratory equipment, medical equipment, etc.Interference from
unsuppressed engines or electric motors may cause problems.
H. Electrostatic Sensitive Devices
ATTENTION
Boards, which contain Electrostatic Sensitive Device (ESD), are indicated
by the sign. Following information is ESD handling:
• Service personnel should ground themselves by using a wrist strap when exchange system boards.
• When repairs are made to a system board, they should spread the floor with anti-static mat
which is also grounded.
• Use a suitable, grounded soldering iron.
• Keep sensitive parts in these protective packages until these are used.
• When returning system boards or parts like EEPROM to the factory, use the protective
package as described.
2. INTRODUCTION

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Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
1. INTRODUCTION
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1.3 Abbreviations
For the purposes of this manual, following abbreviations apply:
Offset Phase Locked LoopOPLL
Light Emitting DiodeLED
Low Drop OutputLDO
Liquid Crystal DisplayLCD
Intermediate FrequencyIF
International Portable User IdentityIPUI
Global System for Mobile CommunicationsGSM
General Purpose Interface BusGPIB
Gaussian Minimum Shift KeyingGMSK
Flexible Printed Circuit BoardFPCB
Electrostatic DischargeESD
Electrical Erasable Programmable Read-Only MemoryEEPROM
Digital Signal ProcessingDSP
dB relative to 1 milli wattdBm
Digital Communication SystemDCS
Digital to Analog ConverterDAC
Constant Current – Constant VoltageCC-CV
Bit Error RatioBER
BasebandBB
Automatic Power ControlAPC
1. INTRODUCTION

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LGE Internal Use Only Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
1. INTRODUCTION
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Wireless Application Protocol
WAP
Voltage Control Temperature Compensated Crystal OscillatorVCTCXO
Voltage Controlled OscillatorVCO
Universal Asynchronous Receiver/TransmitterUART
Time Division Multiple AccessTDMA
Time Division DuplexTDD
Travel AdapterTA
Side Tone Masking RatingSTMR
Pseudo SRAMPSRAM
Static Random Access MemorySRAM
Sending Loudness RatingSLR
Subscriber Identity ModuleSIM
Surface Acoustic WaveSAW
Real Time ClockRTC
Root Mean SquareRMS
Receiving Loudness RatingRLR
Radio FrequencyRF
Public Switched Telephone NetworkPSTN
Phase Locked LoopPLL
Programmable Gain AmplifierPGA
Printed Circuit BoardPCB
Power Amplifier ModulePAM
1. INTRODUCTION

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Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
2. PERFORMANCE
2. PERFORMANCE
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2.1 H/W Features
2. SYSTEM SPECIFICATION
Item Feature Comment
Standard Battery Lithium-Polymer, 3.7V 950mAh
Stand by TIME Up to 475 hrs : Paging Period 5, RSSI -85dBm
Talk time Up to 253min : GSM Tx Level 5
Charging time Approx. 3 hours
RX Sensitivity GSM, EGSM: -109dBm, DCS: -109dBm
TX output power GSM, EGSM: 32.3dBm(Level 5),
DCS , PCS: 29.5dBm(Level 0)
SIM card type 3V / 1.8V
Display MAIN : 2.2” TFT 176 Ý220 pixel 262K Color
Status Indicator
Hard icons. Key Pad
0 ~ 9, #, *, Up/Down Left/Right OK Key
Send Key, PWR Key ,Soft Key(Left/Right),
ANT Internal
EAR Phone Jack Yes
PC Synchronization Yes
Speech coding EFR/FR/HR
Data and Fax Yes
GPRS compatibility Class 12
Vibrator Yes
Loud Speaker Yes
Voice Recoding Yes
Microphone Yes
2. SYSTEM SPECIFICATION

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LGE Internal Use Only Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
2. PERFORMANCE
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2. SYSTEM SPECIFICATION
Travel Adapter Yes
Speaker/Receiver 18x12ȰSpeaker/ Receiver
MIDI 64 Poly (Mono SPK)
Item Feature Comment
Camera 1.3M FF
Bluetooth / FM Radio Bluetooth version 1.5
18x12ȰSpeaker/ Receiver

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Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
2. PERFORMANCE
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2.2 Technical Specification
Item Description Specification
1 Frequency Band
GSM850
TX: 824 ~ 849 MHz
RX: 869 ~ 894 MHz
PCS
TX: 1850 ~ 1910 MHz
RX: 1930 ~ 1990 MHz
2 Phase Error RMS < 5 degrees
Peak < 20 degrees
3 Frequency Error < 0.1 ppm
4 Power Level
Level Power Toler. Level Power Toler.
6 30.5dBm ·3dB 14 14.5dBm ·3dB
7 28.5dBm ·3dB 15 12.5dBm ·3dB
8 26.5dBm ·3dB 16 10.5dBm ·5dB
9 24.5dBm ·3dB 17 8.5dBm ·5dB
10 22.5dBm ·3dB 18 6.5dBm ·5dB
11 20.5dBm ·3dB 19 4.5dBm ·5dB
12 18.5dBm ·3dB
GSM850
5 32.5dBm ·2dB 13 6.5dBm ·3dB
Level Power Toler. Level Power Toler.
1 27.5dBm ·3dB 9 11.5dBm ·4dB
2 25.5dBm ·3dB 10 9.5dBm ·4dB
3 23.5dBm ·3dB 11 7.5dBm ·4dB
4 21.5dBm ·3dB 12 5.5dBm ·4dB
5 19.5dBm ·3dB 13 3.5dBm ·4dB
6 17.5dBm ·3dB 14 1.5dBm ·5dB
7 15.5dBm ·3dB 15 0dBm ·5dB
PCS
0 29.5dBm ·2dB 8 13.5dBm ·3dB
2. SYSTEM SPECIFICATION

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LGE Internal Use Only Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
2. PERFORMANCE
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5Output RF Spectrum
(due to modulation)
Offset from Carrier (kHz). Max. dBc
100 +0.5
200 -30
250 -33
400 -60
600~ <1,200 -60
1,200~ <1,800 -60
1,800~ <3,000 -63
3,000~ <6,000 -65
6,000 -71
GSM850
Offset from Carrier (kHz). Max. dBc
100 +0.5
200 -30
250 -33
400 -60
600~ <1,200 -60
1,200~ <1,800 -60
1,800~ <3,000 -65
3,000~ <6,000 -65
6,000 -73
PCS
6
Output RF Spectrum
(due to switching
transient)
GSM850
Offset from Carrier (kHz). Max. dBm
400 -19
600 -21
1,200 -21
1,800 -24
Item Description Specification
2. SYSTEM SPECIFICATION

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Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
2. PERFORMANCE
ͽ͸ͶͺΟΥΖΣΟΒΝΆΤΖ΀ΟΝΪ XZVX[W
Item Description Specification
6
Output RF Spectrum
(due to switching
transient)
Offset from Carrier (kHz). Max. dBm
400 -22
600 -24
1,200 -24
1,800 -27
7 Spurious Emissions Conduction, Emission Status
8 Bit Error Ratio
GSM850
BER (Class II) < 2.439% @-102 dBm
PCS
BER (Class II) < 2.439% @-100 dBm
9 RX Level Report Accuracy ·3 dB
10 SLR 8·3 dB
11 Sending Response
300 -12
1,000 -6
2,000 -6
3,000 -6
Frequency (Hz) Max.(dB) Min.(dB)
100 -
200 -
4,000 -
3,400 -9
0
0
4
4
-12
0
0
4
12 RLR 2·3 dB
PCS
2. SYSTEM SPECIFICATION

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2. PERFORMANCE
ͽ͸ͶͺΟΥΖΣΟΒΝΆΤΖ΀ΟΝΪ X[VX[W
Item Description Specification
13 Receiving Response
300 -7
500 -5
1,000 -5
3,000 -5
Frequency (Hz) Max.(dB) Min.(dB)
100 -
200 -
4,000
3,400 -10
2
*
0
2
-12
0
2
2
14 STMR > 17 dB
* Mean that Adopt a straight line in between 300 Hz
and 1,000 Hz to be Max. level in the range.
15 Stability Margin > 6 dB
-20
-10
0
7
dB to ARL (dB) Level Ratio (dB)
-35
-30
10
30.7
33.3
33.7
31.7
17.5
22.5
25.5
16 Distortion
17 Side Tone Distortion Three stage distortion < 10%
18 System frequency
(26 MHz) tolerance ˺10 ppm
19 32.768KHz tolerance ˺20 ppm
20 Ringer Volume
At least 55 dBspl under below conditions:
1. Ringer set as ringer.
2. Test distance set as 1 m
2. SYSTEM SPECIFICATION

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Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
2. PERFORMANCE
ͽ͸ͶͺΟΥΖΣΟΒΝΆΤΖ΀ΟΝΪ X\VX[W
2. SYSTEM SPECIFICATION
Item Description Specification
21 Charge Current Fast Charge : Typ. 400 mA
Total Charging Time : average 3 hours
2 -> 1
0 -> OFF
Bar Number Power
4 -> 2
-104 ·2
Under -108
-89 ·2
-98 ·2
22 Antenna Display
2 -> 1
1 -> 0
Battery Bar Number Voltage
3
3 -> 2 3.72 ·0.05 V
23 Battery Indicator
24 Low Voltage Warning
( Blinking Bar)
˺3.42 ·0.05V (Call), 1 time per 1 minute (Receiver)
˺3.42 ·0.05V (Standby), 1 time per 3 minutes(Speaker)
25 Forced shut down
Voltage 3.35 ·0.05V
27 Battery Type
Lithium-Polymer Battery
Standard Voltage = 3.7 V
Battery full charge voltage = 4.2 V
Capacity: 950mAh
28 Travel Charger
Switching-mode charger
Input: 100 ~ 240V, 50/60 Hz
Output: 4.8V, 400mA
˻3.73·0.05 V
26 Sustain RTC
without battery 220 min
3.58 ·0.05 V
3.42 ·0.05 V
5
5 -> 4
-80 ·2
1 -> 0 -108 ·2
1< -104 ± 2
No Service No Service

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3. TECHNICAL BRIEF
3. TECHNICAL BRIEF
3.1 Digital Main Processor
Figure. 3.1.1 X-Gold tm 213 Hardware Block Diagram
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3. TECHNICAL BRIEF
3.1 Digital Main Processor
Figure. 3.1.1 X-Gold tm 213 Hardware Block Diagram
3. TECHNICAL BRIEF

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LGE Internal Use Only
3. TECHNICAL BRIEF
ͽ͸ͶͺΟΥΖΣΟΒΝΆΤΖ΀ΟΝΪ X^VX[W
3. TECHNICAL BRIEF
3.1.1 General
• Technology:
– SoC, Monolithic, 65 nm CMOS
• Package:
– eWLB, 8x8x0.8 mm
– 0.5 mm pitch
– 217 balls / 8-layer PCB
3.1.2 RF Transceiver
• Dual-band direct conversion receiver
• Tri/Quad-band possible with external circuitry
• Fully integrated digital controlled X0
• Additional buffer for 2 external system clocks
• Fully digital RF-Synthesizer incl. ȭȟ-Transmitter
3.1.3 Baseband
• DSP:
– 156 MHz TeakLite™
• MCU:
– ARM1176® @ 208 MHz
• MCU RAM:
– 3.00Mbit
• Memory I/F:
– 512 Mbit
• Modem:
– GPRS class 12, (RX/TX CS1-CS4)
– EGPRS class 12, (RX MCS1-MCS9, TX MCS1-MCS4)
• Cipher Units:
– A51/2/3
– GEA-1/2/3
• Security:
– OMTP TR0
– Secure Boot
– RSA(ROM)/SHA-1(HW accel.)
– OCDS disabling
– Certificate Management

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3. TECHNICAL BRIEF
ͽ͸ͶͺΟΥΖΣΟΒΝΆΤΖ΀ΟΝΪ X_VX[W
3. TECHNICAL BRIEF
• Speech Codec:
– FR / HR / EFR / NB-AMR
• Audio Codec (running on ARM1176):
– SP-MIDI
– SB-ADPCM
– MP3
– WB-AMR
– AAC/AAC+/eAAC+
• Others:
– DARP (SAIC)
– TTY
• Customization:
– E-Fuses
3.1.4 External Memory
• External Bus Unit
– 25-bit address bus (512 Mbit)
– 16-bit data bus
– 1.8V & 2.8V support
• Flash / RAM
– NOR Type
– Serial Flash SPI and SPI-4
– Parallel Flash (Page & Burst Mode)
- 16-bit Demultiplexed
- 16-bit AD-multiplexed
- 16-bit AAD-multiplexed
– iNAND Type e.g. oneNAND
• Memory card
– SD/MMC card interface with 1 or 4 data lines
3.1.5 Connectivity
• 3xUSIF (configurable either as SPI or UART), I2C, I2S; Interfaces @ 1.8V
• Direct (U)SIM 1.8/3V
• USB2.0 up to 480 Mbit/s (High Speed) w/ external USB Phy over ULPI interface
• Stereo Headset (Amplifier integrated)
• 3 external analog measurement PIN’s
• Bluetooth

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Copyright © 2011 LG Electronics. Inc. All right reserved.
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LGE Internal Use Only
3. TECHNICAL BRIEF
ͽ͸ͶͺΟΥΖΣΟΒΝΆΤΖ΀ΟΝΪ X`VX[W
3. TECHNICAL BRIEF
3.1.6 Mixed Signal
• Improved audio performance
• Loudspeaker Audio Class D Amplifier, 900 mW@8 ȳmono for hands-free and ringing
• Stereo Headset 2x30 mW@16 ȳw/o coupling C
• Mono Earpiece 100 mW@16 ȳ
• Digital microphone supported
• Differential microphone inputs
3.1.7 FM Radio
• Direct-to-Battery Connection
– LDOs (incl. capless)
– DC/DC step-down converter
• Battery Type
– Li-ion
• Charging control
– Battery temperature
– Over Voltage / Over Current protection
• External Charger
– 4.8v / 400mA input
• USB battery charging
– USB charging spec 1.0 compliant
3.1.8 Main LCD Display
• Type
– 176*220, QCIF, 262k color (parallel)
• Interface
– Parallel 8bit
– Interf. voltage at 1.8V or 2.8V
• gRacr - Display Controller (Hardware)
– 30 fps Display update without DMA (up to 60 fps) (full or partial)
– Video post processing Scaling, Rotation (90¶steps), Mirroring
– Overlay with alpha blending
– Color conversion YUV -> RGB
– 2D vector graphics (Lines, filled rectangles, Bit block transfer (e.g. sprites, scrolling,
antialiased bitmap fonts)

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3. TECHNICAL BRIEF
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3. TECHNICAL BRIEF
3.1.9 Camera
• 1.3 M pixel, FF
• Frame Rate : 15fps@VGA
• 13 MHz Pixel Rate
• ADC resolution : 10 bit
3.1.10 Video Capabilities
• Video Decoding MPEG-4/H.263
– QCIF@30 fps
– QVGA@15fps
• Video Encoding MPEG-4/H.263
– QCIF@15 fps
3.1.11 Audio Capabilities
• Polyphonic ring tones
– 64 voices MIDI, SP-MIDI
– FM synthesizer
• AMR-WB
• True ring tones (MP3)
• MP3, eAAC+
• G.722 SB-ADPCM encoding/decoding

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3. TECHNICAL BRIEF
ͽ͸ͶͺΟΥΖΣΟΒΝΆΤΖ΀ΟΝΪ YXVX[W
3.2 Power Management
A mobile platform requires power supplies for different functions. These power supplies are
generated in the integrated power management Unit (PMU). The PMU is designed to deliver the
power for a typical standard phone.
Figure. 3-2-1 Block Figure of the PMU Modules X-Gold tm 213
3. TECHNICAL BRIEF
DC/DC Step Down Converter for 1.8V (SD1)
The DC/DC converter generates a 1.8V supply rail. This voltage rail is used to supply main parts of the
system, like the digital core of the chip (via LDO LCORE), some parts of the mixed signal macro, parts of
the RF macro and the external memory if a 1.8V memory is used. The efficiency of the DC/DC converter
is optimized for an average load current of 100mA. That is the load current estimated for the GSM talk
mode.