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Copyright © 2011 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
Table Of Contents
1. INTRODUCTION..................................................................5
1.1 Purpose............................................................................................... 5
1.2 Regulatory Information ............................................................... 5
1.3 Abbreviations................................................................................... 7
2. PERFORMANCE...................................................................9
2.1 H/W Features.................................................................................... 9
2.2 Technical Specification...............................................................11
3. TECHNICAL BRIEF.............................................................16
3.1 Digital Main Processor................................................................16
3.2 Power Management....................................................................21
3.3 FEM with integrated Power Amplifier Module
(SKY77547, U400) .........................................................................33
3.4 Crystal(26 MHz, X100).................................................................35
3.5 RF Subsystem of PMB8810 (U100).........................................36
3.6 MEMORY(PF38F5060M0Y0BE, U101)...................................41
3.7 BT module .......................................................................................43
3.8 SIM Card Interface........................................................................45
3.9 LCD Interface..................................................................................46
3.10 Battery Charger Interface .......................................................49
3.11 Keypad Interface........................................................................50
3.12 Audio Front-End.........................................................................52
3.13 Camera Interface(2M Fixed Focus Camera).....................58
3.14 KEY BACLKLIGHT LED Interface............................................60
3.15 Vibrator Interface .......................................................................61
4. TROUBLE SHOOTING .......................................................62
4.1 RF Component...............................................................................62
4.2 RX Trouble .......................................................................................63
4.3 TX Trouble........................................................................................67
4.4 Power On Trouble.........................................................................71
4.5 Charging Trouble..........................................................................74
4.6 Vibrator Trouble.............................................................................76
4.7 LCD Trouble.....................................................................................79
4.8 Camera Trouble.............................................................................83
4.9 Speaker Trouble ............................................................................87
4.10 Earphone Trouble ......................................................................89
4.11 Receiver Trouble.........................................................................92
4.12 Microphone Trouble.................................................................94
4.13 SIM Card Interface Trouble.....................................................96
4.14 KEY backlight Trouble ..............................................................98
4.15 Micro SD (uSD) Trouble......................................................... 100
4.16 Bluetooth Trouble................................................................... 102
5. DOWNLOAD................................................................... 104
6. BLOCK DIAGRAM........................................................... 117
7. CIRCUIT DIAGRAM ........................................................ 119
8. BGA PIN MAP................................................................. 125
9. PCB LAYOUT................................................................... 131
10. ENGINEERING MODE .................................................. 135
11. STAND ALONE TEST .................................................... 136
11.1 Introduction.............................................................................. 136
11.2 Setting Method........................................................................ 136
11.3 Tx Test........................................................................................... 139
11.4 Rx Test.......................................................................................... 140
12. AUTO CALIBRATION.................................................... 141
12.1 Overview .................................................................................... 141
12.2 Configuration of HotKimchi ............................................... 141
12.3 Description of Basic File ....................................................... 142
12.4 Procedure................................................................................... 142
12.5 AGC............................................................................................... 146
12.6 APC ............................................................................................... 146
12.7 ADC............................................................................................... 146
12.8 Target Power ............................................................................. 146
13 EXPLODED VIEW & REPLACEMENT PART LIST .......... 147
13.1 EXPLODED VIEW...................................................................... 147
13.2 Replacement Parts.................................................................. 151
13.3 Accessory ................................................................................... 165
