LG TU750 User manual
Service Manual Model : TU750
Internal Use Only
Service Manual
TU750
Date: January, 2009 / Issue 1.0
- 3 -
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
Table Of Contents
1. INTRODUCTION...............................................5
1.1 Purpose......................................................................5
1.2 Regulatory Information.................................................5
2. PERFORMANCE............................................... 7
2.1 System Overview.........................................................7
2.2 Usable Environment.....................................................8
2.3 Radio Performance......................................................8
2.4 Current Consumption.................................................16
2.5 RSSI .........................................................................16
2.6 Battery Bar................................................................16
2.7 Sound Pressure Level ................................................17
2.8 Charging...................................................................18
3. TECHNICAL BRIEF......................................... 19
3.1 Digital Baseband(DBB) & Multimedia Processor ..........19
3.2 GAM Hardware Subsystem.........................................44
3.3 Audio Part.................................................................55
3.4 GPADC(General Purpose ADC) and AUTOADC2............62
3.5 Charger control .........................................................63
3.6 Voltage Regulation.....................................................69
3.7 RF Technical Description............................................70
4. TROUBLE SHOOTING..................................... 80
4.1 Power ON Trouble......................................................80
4.2 USB Trouble ..............................................................81
4.3 SIM Detect Trouble ....................................................82
4.4 MicroSD card Trouble ................................................83
4.5 Keypad , Touch Button and Touch Screen Trouble ........84
4.6 Multi EL lighting Trouble.............................................89
4.7 Camera Trouble.........................................................93
4.8 Main LCD Trouble ......................................................99
4.9 Keypad Backlight Trouble .........................................101
4.10 Folder ON/OFF Trouble...........................................103
4.11 Audio Trouble Shooting ..........................................105
4.12 Charger Trouble Shooting.......................................125
4.13 Checking PMIC Block.............................................127
4.14 RF Component ......................................................130
4.15 Procedure to check ...............................................131
4.16 Checking Common Power Source Block..................132
4.17 Checking VCXO Block ............................................137
4.18 Checking Front End Module Block ..........................141
4.19 Checking Front End Module Block input logic ..........142
4.20 Checking WCDMA Block ........................................145
4.21 Checking GSM Block .............................................154
4.22 Checking A-GPS Block...........................................167
5. Download ................................................... 170
5.1 LGDP2....................................................................170
5.2 Download................................................................172
6. BLOCK DIAGRAM........................................ 174
6.1 GSM & WCDMA RF Block.........................................174
6.2 Whole Block Diagram...............................................176
7. CIRCUIT DIAGRAM...................................... 177
8. BGA Pin Map ..............................................189
9. PCB LAYOUT ...............................................195
10. CALIBRATION............................................ 205
10.1 General Description ...............................................205
10.2 Environment..........................................................205
10.3 Calibration Environment .........................................206
10.4 Calibration Procedure ............................................206
10.5 Program Operation ................................................207
11. STAND-ALONE TEST ................................. 210
11.1 General Description ...............................................210
11.2 USB Communication Setting...................................211
11.3 Program Operation ................................................212
11.4 Stand-alone Test ...................................................215
12. EXPLODED VIEW & REPLACEMENT
PART LIST ................................................. 218
12.1 EXPLODED VIEW ...................................................218
12.2 Replacement Parts ................................................223
12.3 Accessory .............................................................252
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LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
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Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
1. INTRODUCTION
1. INTRODUCTION
1.1 Purpose
This manual provides the information necessary to repair, calibration, description and download the
features of this model.
1.2 Regulatory Information
A. Security
Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example,
persons other than your company’s employees, agents, subcontractors, or person working on your
company’s behalf) can result in substantial additional charges for your telecommunications services.
System users are responsible for the security of own system. There are may be risks of toll fraud
associated with your telecommunications system. System users are responsible for programming and
configuring the equipment to prevent unauthorized use. The manufacturer does not warrant that this
product is immune from the above case but will prevent unauthorized use of common-carrier
telecommunication service of facilities accessed through or connected to it. The manufacturer will not
be responsible for any charges that result from such unauthorized use.
B. Incidence of Harm
If a telephone company determines that the equipment provided to customer is faulty and possibly
causing harm or interruption in service to the telephone network, it should disconnect telephone
service until repair can be done. A telephone company may temporarily disconnect service as long as
repair is not done.
C. Changes in Service
A local telephone company may make changes in its communications facilities or procedure. If these
changes could reasonably be expected to affect the use of the phones or compatibility with the net
work, the telephone company is required to give advanced written notice to the user, allowing the user
to take appropriate steps to maintain telephone service.
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LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved.
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1. INTRODUCTION
D. Maintenance Limitations
Maintenance limitations on the phones must be performed only by the manufacturer or its authorized
agent. The user may not make any changes and/or repairs expect as specifically noted in this manual.
Therefore, note that unauthorized alternations or repair may affect the regulatory status of the system
and may void any remaining warranty.
E. Notice of Radiated Emissions
This model complies with rules regarding radiation and radio frequency emission as defined by local
regulatory agencies. In accordance with these agencies, you may be required to provide information
such as the following to the end user.
F. Pictures
The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly
different.
G. Interference and Attenuation
A phone may interfere with sensitive laboratory equipment, medical equipment, etc. Interference from
unsuppressed engines or electric motors may cause problems.
H. Electrostatic Sensitive Devices
ATTENTION
Boards, which contain Electrostatic Sensitive Device (ESD), are indicated by the sign.
Following information is ESD handling:
• Service personnel should ground themselves by using a wrist strap when exchange system boards.
• When repairs are made to a system board, they should spread the floor with anti-static mat which is
also grounded.
• Use a suitable, grounded soldering iron.
• Keep sensitive parts in these protective packages until these are used.
• When returning system boards or parts like EEPROM to the factory, use the protective package as
described.
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Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
2. PERFORMANCE
2. PERFORMANCE
2.1 System Overview
Item Specification
Shape GSM850/900/1800/1900 & WCDMA 850 & 1900 Slide type - Dual
Mode Handset
Size 50.8X103.8X13.1 mm
Weight 120g (with standard battery)
Power 900mAh Li-Ion
Over 180 Min (WCDMA, Tx=12 dBm, Voice)
Over 180 Min (GSM, Tx=Max, Voice)
Over 250 hrs (WCDMA, DRX=2.56)
Over 250 hrs (GSM, Paging period=5)
Antenna Intenna type
Main LCD 2.4"(320x240), 260K TFT Color LCD
Main LCD BL White LED Backlight
Vibrator Yes (Coin Type)
Speaker Yes
MIC Yes (SMD Type)
Receiver Yes
Earphone Jack Yes
SIM Socket Yes(SIM BlockType) : 3.0V & 1.8V
Volume Key Push Type ( +, - )
Voice Key Push Type
External Memory T - Flash Socket
I/O Connect 5 Pin
Talk Time
Standby Time
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2. PERFORMANCE
2.2 Usable Environment
1) Environment
2) Environment(Accessory)
* CLA : 12~24V (DC)
2.3 Radio Performance
1) Transmitter – GSM Mode
Item Spec. Unit
Voltage 3.7 (Typ), 3.4 (Min), (Shut Down: 3.26) V
Operating Temp. -20 ~ + 60 °C
Storage Temp. -30 ~ +85 °C
Humidity max. 85 %
Item Spec. Min Typ. Max Unit
Power Available power 100 220 240 Vac
No
9k ~ 1GHz -39dBm
1G ~ 1710MHz -33dBm
1710M ~ 1785MHz -39dBm
1785M ~ 12.75GHz -33dBm
100k ~ 880MHz -60dBm 100k ~ 880MHz -60dBm
880M ~ 915MHz -62dBm 880M ~ 915MHz -62dBm
915M ~ 1000Mz -60dBm 915M ~ 1000MHz -60dBm
1G ~ 1.71GHz -50dBm 1G ~ 1.71GHz -50dBm
1.71G ~ 1.785GHz -56dBm 1.71G ~ 1.785GHz -56dBm
1.785G ~ 12.75GHz -50dBm 1.785G ~ 12.75GHz -50dBm
Item
1
DCS/PCSGSM
Conducted
Spurious
Emission
-39dBm
-33dBm
MS allocated
Channel
100k ~ 1GHz
Idle Mode
1G ~ 12.75GHz
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Copyright © 2008 LG Electronics. Inc. All right reserved.
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LGE Internal Use Only
2. PERFORMANCE
No
30M ~ 1GHz -36dBm
MS allocated 1G ~ 1710MHz -30dBm
Channel 1710M ~ 1785MHz -36dBm
Radiated 1785M ~ 4GHz -30dBm
Spurious 30M ~ 880MHz -57dBm 30M ~ 880MHz -57dBm
Emission 880M ~ 915MHz -59dBm 880M ~ 915MHz -59dBm
Idle Mode 915M ~ 1000Mz -57dBm 915M ~ 1000MHz -57dBm
1G ~ 1.71GHz -47dBm 1G ~ 1.71GHz -47dBm
1.71G ~ 1.785GHz -53dBm 1.71G ~ 1.785GHz -53dBm
1.785G ~ 4GHz -47dBm 1.785G ~ 4GHz -47dBm
2
0 ~ 100kHz +0.5dB 0 ~ 100kHz +0.5dB
200kHz -30dB 200kHz -30dB
250kHz -33dB 250kHz -31dB
Due to 400kHz -60dB 400kHz -60dB
Output RF modulation 600 ~ 1800kHz -66dB 600 ~ 1800kHz -60dB
Spectrum 1800 ~ 3000kHz -69dB 1800 ~ 6000kHz -65dB
3000 ~ 6000kHz -71dB ≥6000kHz -73dB
≥6000kHz -77dB
400kHz -19dB 400kHz -22dB
600kHz -21dB 600kHz -24dB
1200kHz -21dB 1200kHz -24dB
1800kHz -24dB 1800kHz -27dB
TU3: ±150Hz TU1.5: ±200Hz
5Due to
Switching
transient
4
Multipath and Interference HT100: ±100Hz HT100: ±250Hz
Condition TU50: ±100Hz TU50: ±150Hz
3dB below reference sensitivity 3dB below reference sensitivity
Frequency Error Under RA250: ±200Hz RA250: ±250Hz
Frequency Error ±0.1ppm ±0.1ppm
3 Phase Error ±5(RMS) ±5(RMS)
±20(PEAK) ±20(PEAK)
1
DCS/PCSGSM
-36dBm
-30dBm
30M ~ 1GHz
1G ~ 4GHz
Item
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Only for training and service purposes
2. PERFORMANCE
No Item
800kHz
Power
control
Level
Power
(dBm) Tolerance
(dB)
Power
control
Level
Power
(dBm) Tolerance
(dB)
533±3030±3
631±3128±3
729±3226±3
827±3324±3
925±3422±3
10 23 ±3 5 20 ±3
11 21 ±3 6 18 ±3
12 19 ±3 7 16 ±3
13 17 ±3 8 14 ±3
14 15 ±3 9 12 ±4
15 13 ±3 10 10 ±4
16 11 ±5 11 8 ±4
17 9 ±5 12 6 ±4
18 7 ±5 13 4 ±4
19 5 ±5 14 2 ±5
15 0 ±5
9Bursttiming
GSM DCS/PCS
Frequency offset
Intermodulation product should
be Less than 55dB below the
level of Wanted signal
Mask IN
Intermodulation
attenuation –7
8Transmitter
Output Power
Mask IN
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Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
2. PERFORMANCE
2) Transmitter – WCDMA Mode
No Item Specification
1 Maximum Output Power Class3: +24dBm(+1/-3dB)
Class4: +21dBm(±2dB)
2 Frequency Error ±0.1ppm
3 Open Loop Power control in uplink ±9dB@normal, ±12dB@extreme
4 Inner Loop Power control in uplink
Adjust output (TPC command)
cmd 1dB 2dB 3dB
+1 +0.5/1.5 +1/3 +1.5/4.5
0 -0.5/+0.5 -0.5/+0.5 -0.5/+0.5
-1 -0.5/-1.5 -1/-3 -1.5/-4.5
group(10equal command group)
+1 +8/+12 +
5 Minimum Output Power -50dBm(3.84MHz)
6 Out-of-synchronization handling of output power Qin/Qout:DPCCH quality levels
Toff@DPCCH/lor:-22->-28dB
Ton@DPCCH/lor:-24->-18dB
7 TransmitOFFPower -56dBm(3.84M)
8 Transmit ON/OFF Time Mask ±25us
PRACH, CPCH, uplink compressed mode
9 Change of TFC
±25us
power varies according to the data rate
DTX: DPCH off
(minimize interference between UE)
10 Power setting in uplink compressed ±3dB(after 14slots transmission gap)
11 Occupied Bandwidth(OBW) 5MHz(99%)
12 Spectrum emission Mask
-35-15*(?f-2.5)dBc@?f=2.5~3.5MHz, 30k
-35-1*(?f-3.5)dBc@?f=3.5~7.5MHz, 1M
-39-10*(?f-7.5)dBc@?f=7.5~8.5MHz, 1M
-49 dBc@?f=8.5~12.5MHz, 1M
- 12 -
LGE Internal Use Only Copyright © 2008 LG Electronics. Inc. All right reserved.
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2. PERFORMANCE
No Item Specification
13 Adjacent Channel Leakage Ratio(ACLR) 33dB@5MHz, ACP>-50dBm
43dB@10MHz, ACP>-50dBm
14 Spurious Emissions
*: additional requirement
-36dBm@f=9~150KHz, 1k BW
-36dBm@f=150KHz~30MHz, 10k
-36dBm@f=30~1000MHz, 100k
-30dBm@f=1~12.75GHz, 1M
-41dBm*@1893.5~1919.6MHz, 300k
-67dBm*@925~935MHz, 100k
-79dBm*@935~960MHz, 100k
-71dBm*@1805~1880MHz, 100k
15 Transmit Intermodulation -31dBc@5MHz, Interferer -40dBc
-41dBc@10MHz, Interferer -40dBc
16 Error Vector Magnitude(EVM) 17.5% (>-20dBm)
(@12.2k, 1DPDCH+1DPCCH)
17 Transmit OFF Power -15dB@SF=4, 768kbps,
multi-code transmission
3) Receiver - GSM Mode
No GSM850/900 DCS/PCS
1 -105dBm -105dBm
2C/Ic=7dBC/Ic=7dB
3 Adjacent Channel 200kHz C/Ia1=-12dB C/Ia1=-12dB
Rejection 400kHz C/Ia2=-44dB C/Ia2=-44dB
4Wanted Signal: -98dBm
1’st interferer: -44dBm
2’st interferer: -45dBm
Wanted Signal: -96dBm
1’st interferer: -44dBm
2’st interferer: -44dBm
5Wanted Signal: -101dBm
Unwanted Signal: Depend on freq. Wanted Signal: -101dBm
Unwanted Signal: Depend on freq.
Blocking Response
(TCH/FS Class II, RBER)
Item
Sensitivity (TCH/FS Class II)
Co-Channel Rejection
(TCH/FS Class II, RBER,
TUhigh/FH)
Intermodulation Rejection
- 13 -
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
2. PERFORMANCE
4) Receiver – WCDMA Mode
No Item Specification
1 Reference Sensivitivity Level -106.7dBm(3.84M)
2 MaximumInputLevel -25dBm(3.84MHz)
-44dBm/3.84MHz(DPCH_Ec)
UE@+20dBm output power(class3)
3 Adjacent Channel Selectivity(ACS) 33dB
UE@+20dBm output power(class3)
-56dBm/3.84MHz@10MHz
UE@+20dBm output power(class3)
-44dBm/3.84MHz@15MHz
UE@+20dBm output power(class3)
-44dBm/3.84MHz@f=2050~2095 &
2185~2230MHz, band a)
UE@+20dBm output power(class3)
-30dBm/3.84MHz@f=2025~2050 &
2230~2255MHz, band a)
UE@+20dBm output power(class3)
-15dBm/3.84MHz@f=1~2025 &
2255~12500MHz, band a)
UE@+20dBm output power(class3)
6 Spurious Response -44dBm CW
UE@+20dBm output power(class3)
7 Intermodulation Characteristic -46dBm CW@10MHz &
-46dBm/3.84MHz@20MHz
UE@+20dBm output power(class3)
-57dBm@f=9KHz~1GHz, 100k BW
8 -47dBm@f=1~12.75GHz, 1M
-60dBm@f=1920~1980MHz, 3.84MHz
-60dBm@f=2110~2170MHz, 3.84MHz
Spurious Emissions
4 In-bandBlocking
5 Out-band Blocking
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2. PERFORMANCE
5) Bluetooth Mode
5.1) Transmitter
No It e m
1 OutPower
2 PowerDensity
3 PowerControl
4 TX Output Spectrum -Frequency range
5 TX Output Spectrum -20dB Bandwidth
6 Tx Output Spectrum -Adjacent channel Po
7 Modulation Characteristics
8 Init. Carrier Freq. Tolerance
9 Carrier Frequency Drift
Freq.Range Operating Standby
30MHz~1GHz -36dBm -57dBm
Above 1GHz~12.75GHz -30dBm -47dBm
1.8~1.9GHz -47dBm -47dBm
5.15~5.3GHz -47dBm -47dBm
Power density < 20dBm per 100kHz EIRP
Option
2dB ≤step size ≤8dB
fmax & fmin @ below the level of -30dBm
(100khz BW) within 2.4GHz~2.4835GHz
10
1 slot : ≤± 25kHz
3 slot : ≤± 40kHz
5 slot : ≤± 40kHz
Maximum drift rate ≤20KHz/50usec
Specification
Out of Band Spurious Emissions
≤1MHz
≤-20dBm @ C/I = 2MHz
≤-40dBm @ C/I ≥3MHz
140kHz ≤delta f1 avg ≤175kHz
delta f2max ≥115kHz at least 99.9% of all deltaf2max
delta f2avg/deata f1avg≥0.8
≤±75KHz
Class 2 : -6~4dBm
- 15 -
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2. PERFORMANCE
5.2) Receiver
No It e m
1 Sensitivity single slot packets
2 Sensitivity multi slot packets
Interference Ratio
Co-Channel interference, C/I co-channel 11dB
Adjacent(1MHz)interference, C/I 1MHz 0dB
Adjacent(2MHz)interference, C/I 2MHz -30dB
Adjacent(≥3MHz)interference, C/I ≥3MHz -40dB
Adjacent(≥3MHz)interference to in band -9dB
mirror frequency, C/I image ±1MHz -20dB
interfering Signal Frequency Power Level
30MHz~2000MHz -10dBm
2000MHz~2400MHz -27dBm
2500MHz~3000MHz -27dBm
3000MHz~12.75GHz -10dBm
5 Intermodluation Performance
6MaximumInputLevel
BER ≤0.1%@wanted signal -67dBm
BER ≤0.1%@wanted signal -64dBm
static sinwave signal at f1=-39dBm
a BT modulated signal f2=-39dBm(payload PRBS15)
BER ≤0.1%@-20dBm
Specification
BER0.1%@-70dBm
BER≤0.1%@-70dBm
BER ≤0.1%@ (Low,Mid,High Frequency)
2405MHz, 2441MHz, 2477MHz
C/I performance
Blocking Characteristic
3
4
- 16 -
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2. PERFORMANCE
2.4 Current Consumption
(VT test : Speaker off, LCD backlight On)
Stand by Voice Call VT
250 Hours = 3.4 mA 180 Min = 300 mA 125 Min= 380 mA
(DRX=2.56) (Tx=12dBm) (Tx=12dBm)
250 Hours = 3.4 mA 180 Min = 300 mA
(paging=5period) (Tx=Max)
WCDMA
GSM
2.5 RSSI
Æ
Æ
Æ
Æ
Æ
2.6 Battery Bar
Indication Voltage
BAR 3 →2 3.80 ± 0.05V
BAR 2 →1 3.75 ±0.05V
BAR 1 →Icon Blinking 3.65 ±0.05V
Low voltage, warning message 3.55 ±0.05V
Power OFF 3.20 ±0.05V
- 17 -
Copyright © 2008 LG Electronics. Inc. All right reserved.
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2. PERFORMANCE
2.7 Sound Pressure Level
No
NOM
MAX
NOM -1±3dB
MAX -15±3dB
NOM
MAX
NOM
MAX
5
6NOM
MAX
NOM -47dBPA under
MAX -36dBPA under
ANOM
CMAX
ONOM -1±3dB
UMAX -12±3dB
SNOM
TMAX
INOM
CMAX
13
14 NOM
MAX
NOM -45dBPA under
MAX -40dBPA under
SEND
REV.
SEND
REV.
SEND
REV.
SEND
REV.
Specification
1 Sending Loudness Rating (SLR) 8±3dB
Test Item
3 Side Tone Masking Rating (STMR)
2 Receiving Loudness Rating (RLR)
4 Echo Loss (EL) 40dB over
refer to TABLE 30.3
Receiving Distortion (RD) refer to TABLE 30.4
17dB over
8±3dB
-64dBm0p under
8 Idle Noise-Receiving (INR)
MS
7 Idle Noise-Sending (INS)
Sending Distortion (SD)
40dB over
Sending Distortion (SD) refer to TABLE 30.3
25dB over
refer to TABLE 30.4
15 Idle Noise-Sending (INS) -55dBm0p under
16 Idle Noise-Receiving (INR)
HEAD
SET
Receiving Distortion (RD)
17
TDMA NOISE
GSM: Power Level: 5
DCS: Power Level: 0
(Cell Power: -90 ~ -105dBm)
Acoustic(Max Vol.)
MS/HEADSET SLR: 8±3dB
MS/HEADSET RLR: -13±1dB/-15dB
(SLR/RLR: mid-Value Setting)
MS GSM
-62dBm under
DCS
Headset GSM
DCS
9 Sending Loudness Rating (SLR)
10 Receiving Loudness Rating (RLR)
11 Side Tone Masking Rating (STMR)
12 Echo Loss (EL)
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2. PERFORMANCE
2.8 Charging
·Normal mode: Complete Voltage: 4.2V
Charging Current: 500mA
·Await mode: In case of During a Call, should be kept 3.9V
(GSM: It should be kept 3.9V in all power level
WCDMA: It will not be kept 3.9V in some power level)
·Extend await mode: At Charging prohibited temperature(0C under or 45C over)
(GSM: It should be kept 3.7V in all power level
WCDMA: It will not be kept 3.7V in some power level)
- 19 -
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3. TECHNICAL BRIEF
3. TECHNICAL BRIEF
3.1 Digital Baseband(DBB) & Multimedia Processor
3.1.1 General Description
• Access subsystem
- Access Central Processing Unit (CPU) subsystem – ARM926, Joint Test Action Group (JTAG), Embedded
Trace Module (ETM), Instruction and Data (I&D)-cache, and I&D-TCM
- Access peripheral subsystems – Subscriber Identity Module (SIM) interface, IrDA®, Universal Serial Bus
(USB), Universal Asynchronous Receiver/Transmitter (UART), and so on
- Digital Signal Processor (DSP) subsystem – CEVA-X1620, JTAG, Static Random Access Memory (SRAM),
and Program Data Read Only Memory (PDROM)
- EDGE/GSM/GPRS (EGG) subsystem – EGG hardware accelerators
- WCDMA subsystem – WCDMA hardware accelerators
• Application subsystem
- Application CPU subsystem – containing ARM926, JTAG, ETM, I&D-cache, and I&D-TCM
- Application peripheral subsystems – I2C™, keypad, UART, and so on
- Graphics subsystem – XGAM subsystem
- Audio Processing Execution (APEX) and video encoder subsystems
In addition to the two subsystems above, there is also a test block, chip control block, and
a pad multiplexing block residing at the top level
yDSP
- The Digital Signal Processor Subsystem (DSPSUB) includes a DSP megacell, which
contains the DSP CPU together with a tightly coupled memory. The DSP is the Ceva-X
1620 core with a 64 kB instruction RAM and a 64 kB data RAM. It also contains debug
logic and interfaces. In addition to the megacell, the DSPSUB includes external memories,
peripheral units, and interfaces. The DSP megacell is clocked at 208 MHz.
- The DSPSUB includes an AHB master and an AHB slave interface. The AHB master
provides a direct access to the Internal Random Access Memory (IRAM) in the EGG core
through the AHB. The AHB slave interface allows the CPU and the DMA to access in the
program and data RAM residing in the DSPSUB.
yMulti-media Processor (MMIC : ZR3453X )
- The ZR3453X is an advanced multimedia coprocessor for cellular devices.
ZR3453X is an MCP that includes a multimedia core and SDRAM memory chip. The multimedia core
performs audio and video recording, playback, and editing; still image capture (DSC), viewing, and
editing; MIDI/MP3 playback (for ring tones); 3D acceleration (for gaming).
The memory chip in the MCP is a 16MB (2MB) mobile SDRAM (that can be enlarged by packaging to
64MB), used both for program code and for working data (both stream data and frame buffers).
yWCDMA subsystem
- The digital baseband controller WCDMA subsystem incorporate a WCDMA modem
- An interface to the WCMDA together with memory control and an internal single port
RAM. The WCDMA subsystem has three AHB slave interfaces.
- The Ericsson DB 3150 also includes HSDPA class 6 functionality.
- The WCDMA subsystem is handled and provided by Ericsson.
yXGAM subsystem
- The XGAM subsystem is a graphics acceleration module that provides hardware
support in the creation of visual imagery and the transfer of this data to a display.
The XGAM also provides support for connecting a Camera module. The visual data
could be graphics, still images, or video.
- The XGAM subsystem is handled and provided by Ericsson.
yOperation and Services
-I²C™Interface
- SIM Interfaces
- General Purpose I/O (GPIO) Interface
- External Memory Interface that supports NAND, NOR, PSRAM, SDRAM,
-JTAG
-RTC
- ETM (in Prototype Package)
- 20 -
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3. TECHNICAL BRIEF
HW Block Diagram, U330
07-04-25
Ericsson Mobile
Platform U330
B
Doc respons/Approved
Product name
RevDate
Prepared
Reference
Documentno She et
1/1
1424-LZN 901 1958
U330
VBAT
AFMS_L
AFMS_R
ATMS
Microphone
S U B - L C D VBAT
L C D
HOOK
GSM/EDGE
PA + Ant Sw.
ANT
VAPC
REG
1.8V
Bluetooth
Radio
PCMDLD
RESOUT2n
SYSCLKREQ1
SYSCLK1
RTCCLK
VBAT
L
S
1.8V
2.75V
AMPlo_FREQlo
IDATA_AMPhi
QDATA_FREQhi
RXTXCLK
RADDAT
RADCLK
RADSTR
TXADC
PWRRST
MCLK
MCLKREQ
IRQAcc
ACCSLEEP
APPSLEEP
SRST
SCLK
SDAT
I2S_CLK0
I2S_WS0
I2S_RX0
I2S_TX0
I2S_CLK1
I2S_WS1
I2S_RX1
I2S_TX1
12C BUS Internal
Acc and App
I2S BUS
1.8 V
VIO
REG
2.75V
Camera
Image
proc
A
D
CSensor
Control
2.75 V
VCAM
1.8 V
VIO
I2CSDA2
I2CSCL2
CIPCLK
CIVSYN
CIHSYN
CIRES
CIVSYN
CIHSYN
CIRES
CIPCLK
I2CSDA2
I2CSCL2
PHF
Jack
V?
V?
DB3200
MC_CMD/BS
MC_CMDDIR
MC_DATADIR
MC_DATA(0-3)
MC_CLK
I2CSCL2
I2CSDA2
IO Bridge
ANT_SW1
RF_DATA_STRB
RF_DATA0
RF_DATA2
RF_DATA1
IRAM
7k x 32
bit
32
32
52 MHz
AHB IF
SYS
CON GPIO
WCDMA
Integrity
Watch
Dog
Cable
Detect
Event
Hist
Bus
Tracer
I2C0
SPI
UART2
RS232
IRDA
BT UART I2S/PCM
(BT)
UART0
GPRS
CRYPTO
AHB2APB
(Fast)
CS0-2
DI/DO/CLK
RX/TX/CTS/RTS
ANT_SW0
SIMIF
AHB
Default
slave AHB
IF
DMA
48 Channels
48 Requests
AHB
IF AHB
IF
RESOUT0n
RESOUT1n
PWRRSTn
RESOUT2n
RTCCLKIN
MSACCIRQn
APPSLEEP
MSAPPIRQn
SYSCLKREQ
SYSCLK0
MCLK
MCLKREQ
ACCSLEEP
ARM9 Sub system
ARM926
D
Cache
16 kB
I
Cache
32 kB
AHB
Master
MMU
I Mem
Control D Mem
Control
ARM9EJ-S
TLB
DTCM
8 kB
ITCM
8 kB
ETM IF
ETM9
AHB BUS IF
JTAG DEBUG TCM IF
EICE
AHB
Master
I2C1
MS PRO
MMC/SD
AHB2APB
(Fast)
I2S/
PCM0
AHB
Slave
I2S/
PCM1
PDI
AHB
Slave
GRAM
64k byte
GAMCON
AHB
Master
MCiDCT
(Video)
PDICON
CDICON
GAMEACC
(3D) CI_VSYNC
CI_PCLK
CI_RESn
CI_D(0-7)
CI_HSYNC
PDIRESn
PDIC(0-5)
PDID(0-7)
XGAM
I2C2
KEYPAD
GPIO
INTCON
32
TIMER0
16
32
IRQ
16
WDOG 32
SYSCON
16
AHB2APB
(Slow)
AHB
Slave
RTC 16
BUS TR 32
Event H 32
KEYIN(0-5)
KEYOUT(0-4)
Boot ROM
tbd kB
DMA
32 Channels
2 x 16 Requests
AHB
Slave AHB
Master
APEX AHB
Slave
APEX
RAM APEX
ROM
APEX+
AHB
Slave
AHB
Master
Video
Enc
RAM
Video Enc
AAIF
AHB IF
MSL
AAIF
AHB IF
MSL
UART 0
SPI
RX/TX
CTS/RTS
CS0-2
DI/DO/CLK
AHB
Slave
DMA
AHB IF
AHB2APB
(Slow)
SERVICEn
DPLL
APLL
DPLL
208M
APLL
13M
2.75 V
VCARD
RADCLK
RADDAT
RADSTR
VBAT
ARB
WCDMA
Cipher
Random noise
generator
IRQApp
Optical
zoom GPIO
SDA SCL
DAC_I_NEG
DAC_I_POS
DAC_Q_POS
DAC_Q_NEG
ANT_SW2
ADC
SYSCLK2
TEMPBIAS
VIO
Backup
capacitor
1.8 V
VIO
1.5 V
VANA
VBAT
1.2/1.05V
VCORE
Backup
Cap
I2C
SLEEP
CONTROL
32 kHz
osc
SYSTEM
POR
100k
100k
100k
AB3100
Power Management
PWRRST
32kHz
RF LDO a
EGG/WBTX
125 mA ;
2.75 V
Camera
LDOh
100 mA ;
2.75 V
MemCard
LDOg
100 mA ;
2.75 V
IR LDOk
200 mA
2.75 V
Analog
LDOf
30 mA
2.5/1.8/1.3V
I/O/Core
LDOe
200 mA
1.8/1.3/1.05 V
Level
shift
G
LDO LP
1.5 V OTP
64 bits
1MHz
OSC
PLL
44/48
IRQa
FUEL
GAUGE
ADDER
VIBRATOR
CONTROL
LED Control
ADC
10bit
AUTO
CTL M
U
X
I2C
I2C
LDO d
200 mA ;
2.75 V
VDDLP
Internal BUCK
1.4/1.2/1.05 V
5%
600 mA
BOOST
(Soft start)
6-22 V, 30 mA
BAND
GAP
IRQb
2.5 V
VANA 2.75 V
VRAD
2.75 V
VCAM
2.75 V
VCARD
2.75 V
VIR
VBAT
VBAT
VBAT
VBAT
32KHZ
VBAT
VBAT
VBAT
On/Off
Switch
PWM
LDOc
200 mA
2.75 V
2.75 V
VAUDIO
VBACKUP
VANA
1.5 V
VANA PCM
DECODER
ENCODER
ADC
2
ADC
1
DAC
1
DAC
2
SIDE
TONE
TX
PGA2
TX
PGA1
RX
PGA1
RX
PGA2
CCO
AB3100 Audio Part
PCMO
PCMI
PCMSYN
PCMCLK
CCO1
ADC
3
TX
PGA3
DAC
3
RX
PGA2
CCO2
Vol
Vol
Vol
PCMO
PCMI
PCMSYN
PCMCLK
LINE1
LINE2
PGA
BEARP
BEARN
MIDR
AUXO1
AUXO2
VSSBEAR
VDDBEAR
SPKRP
SPKRN
VSS_SPKR
VDD_SPKR
MIC1N
MIC2N
MIC3N
MIC4N
VMID
PCM/
I2S
Inter-
face 2
PCM/
I2S
Inter-
face 1
DAC
4
RX
PGA2
Vol
PGA
PGA
PGA
VDDDIG
VDDCODEC
ADC2REF ADC3REF
ETM IF
JTAGIF
MUX
ETM
JTAG
2.5 V
VANA
APLL
1.8 V
VIO
1.8 V
VIO IO
1.2/1.05 V
VCORE
1.2/1.05 V
VCORE
IO
1.8 V
VIO
IO
1.8 V
VIO
IO
1.2/1.05 V
VCORE
Core
1.8 V
VIO
IO
1.2/1.05 V
VCORE
Core
2.75 V
VRAD
1.8 V
VIO
UART
VRTC
VBAT
2.75 V1.5 V
LED interfaceVibrator if WLEDinterface SIM interface
1.8 V
VIO
I2CSDA2 1.8 V
VIO
1.8 V
VIO
I2CSDA2
I2CSCL2
I2CSDA2
I2CSCL2
1.5 V
VANA
DAC_Q_POS
DAC_Q_NEG
DAC_I_POS
DAC_I_NEG
TX_POW
TXPA_POW_SENSE
WINT-
COM
WSYS-
CON
WTIM-
GEN
52 MHz
WCDMA SUB System
Hi Speed
IM
Bridge
AHB
Slave +
Sequ.
ADC_Q_POS
ADC_Q_NEG
ADC_I_POS
ADC_I_NEGADC_I_NEG
ADC_I_POS
ADC_Q_POS
ADC_Q_NEG
PA
PA
GSM850/
900Input
DCS/PCS
Input
ESD
EGG
Sub System
RF_WB_PA0_E
RFWB_PA1_E
RFWB_PWRDET_E
Arbitrate
& Mux
RF_CTRL_CLK
RF_CTRL_DATA
TIM
GEN
SER
CON
CLK
CON
VA
DFSE
GSM
CRYPTO
16
32+3
32+3
32+3
32+3
32+3
16
26MHz
16
16
32+3
16
16
TXIF
RXIF
RFIF
32+4
32+3
32+3
32+4
16
16
16
TX_ADC_STRB
26 MHz
100
mohm
25
mohm
uP SAFETY
VBAT
BDATA
BATTERY
GND
IMEAS
VMEAS
S-D
ADC
CHREG
CHSENSE+
CHSENSE-
FGSENSE+
FGSENSE-
DCIO
VBUS
UART
BDATA
I2C
VBAT
TRICKLE
VBAT
DCIO
Battery
DCIO
DET
USB
DET
USB CHRG
CONTROL
DCIO CHRG
CONTROL
SIM
LDO
SIM card
C1C2C3
C5C6C7
Digital
Baseband
Controller
Decaps
RX/TX/CTS/RTS
TX/RX/SD
ARM9 Sub system
ARM926
D
Cache
16 kB
I
Cache
32 kB
AHB
Master
MMU
I Mem
Control D Mem
Control
ARM9EJ-S
TLB
DTCM
8 kB
ITCM
26 kB
ETM IF
ETM9
AHB BUS IF
JTAG DEBUG TCM IF
EICE
AHB
Master
To Mux
LCDTEMP
Placed
close to
LCD
2.75 V
VRAD
8JTAG IF
JTAG
13
RF_CTRL_STRB1
NC
RF_CTRL_STRB0
INTCON
FS_USB/
HS_USB
EDC
ETX
Access
Timer
Boot ROM
8k x 32 bit
ARB ARB ARB
AHB Slave
JTAG
PDROM
400 kB
SSRAM
362 kB
CEVA-
X1620
GPIO ICU PMU
CRU Timer0 Timer1
64 kB
IRAM
64kB
DRAM
AHB MAHB SCEVA
AHB Master
DSP
Subsystem
DCON
DCON
SYSCLK1
SPI BUS
C
O
N
VBUS
D+
D-
GND
VIO 1.8V
HS_DIR
HS_STP
HS_CLOCK
HS_NXT
HS_DAT0-7
HS-USB Transceiver with ULPI, ISP 1508
ULPI
if logic
Serializer
Deserializer
CLOCK
D0-D7
DIR
STP
NXT Reg
map
USB 2.0 ATX
Termination
Resistor s
POR
PLL
DP
DM
OSC
RESET
XI
XO
Global reset
1
1ID det ID
VBUS
Comp
Chrg/
dischrg
resistors
Chrg.
pump
supply
VBUS
CA
Voltage
regulators
VBAT
VDD1V8
VDD3V3 Internal
power
FSW_N
Int Ref
Voltage
REF
ID
VBAT
VIO
SYSCLK2n
ULPI_CS CSn
VBAT
2.75 V
1.8 V
1.3 V
1.2/1.05V
Supply Colour
Codes
VIO
1.8V
Vcc VIR
2.75V
IRDA_RX
IRRC
IRDA_SD
IRDA_TX
RX
D
I/O & Supply
Log&
Contr
AMP
MODE
TXD
RC
COM
P
IRDA
Hall
sensor
VIO
1.8 V
Mobile SDRAM
xxx Mbit
A(0-11)
CKE
CLK
CS
WE
CAS
RAS
BA1
BA0
UDQM
LDQM D(0-15)
VDD
VDDQ
VSS
VSSQ
A15
A16
CKE
CKE
CKE
CKE
CKE
CKE
CKE
CKE
Mobile SDRAM
128 Mbit
A(0-11)
CKE
CLK
CS
WE
CAS
RAS
BA1
BA0
UDQM
LDQM D(0-15)
VDD
VDDQ
VSS
VSSQ
A14
A15
CKE
CKE
CKE
CKE
CKE
CKE
BE0
BE1
NAND Flash
128 Mbit ->
WP
CE
RE
WE
CLE
ALE
D(0-15
VDD
VSS
R/B
RESETO0
1.8 V
VIO
SDRAM Controller
SDRAM, NOR(p), PsRAM(p)
AHB
Slave
EMIF Control
AHB
Slave
Static Memory Controller
SRAM, PsRAM(p,b), NOR(p,b),
NAND(8,16) Ecc
AHB
Slave
SDRAM Controller
SDRAM, NOR(p), PsRAM(p)
AHB
Slave
Shared EMIF
1.8 V
VIO
1.8 V
VIO
1.8 V
VIO
39 56
M U X
A(16-26)
Memory interface
EMIF Arbiter
ARB ARB
Important:
The purpose of this block schematic is to give an
overview of the platform. It shall be used to find what
different asics are used and how they are connected
to each other. It alsoshows some devices connected
to the platform andwhich interfaces to use.It is not a
complete and finalisedschematic and shall notbe
used as such. The actual implementation in Reference
Design or customers design, can differ from what is
shown here.
However the intention is to show all functional signals
on the EMP asics, but not necessary on all devices
external to the platform.
Bluetooth
Baseband
To Camera
To Memory
External to Platform
Internal to Platform
24
TIMER1 32
DMUC
32
23
16
17
18
19
20
21
22
25
24
32
33
24
25
26
27
28
29
30
31
RX
TX
CTS
RTS
SERCON
DACO0
DACO1
DACO2
DACO3 DAC1
11 bits
DAC4
11 bits
DAC3
11 bits
DAC2
11 bits
LNA
LNA
LNA
LNA
LNA
AD
AD
090
LPF
+ChP PhD
÷
N.M
VCO
LPF ChP PhD
÷
N.M
+090
+
DAC
DAC
XO
DAC
VCO
VCO
LNA
LNA
WCDMA LB
WCDMAHB
WCDMAHB
WCDMAHB
CLK
DATA
STROBE
Serial
Control
WTxQB
WTxQA
WTxIB
WTxIA
GSM/EDGE
AM
DAC
RFCtrl1
RFCtrl2
RFCtrl1
RFCtrl2
GSM/
EDGE HB
GSM/
EDGE LB
WCDMA LB
WCDMA HB
WCDMAHB
GSM/EDGE
LB
GSM/EDGE
LB
GSM/EDGE
HB
GSM/EDGE
HB WRxIA
WRxIB
WRxQB
WRxQA
EDataA
EDataB
EDataC
EDataStr
WCDMA/GSM/GPRS/EDGE TRX
MCLK
CLKREQ
MCLKSec
XO
XOn
XOp
26MHz
X-tal
ANTSW2
ANTSW0
ANTSW1
ANTSW3 ANT_SW3
O
R
VBAT
WPA_A_EN
WPA_B_EN
WPOW_DET_EN
WPA_C_EN
VccWPA
VccWPA
Power
coupler
Power
coupler
VccWPA
VccWPA
RF Pow det
Det
En
Bias
DET En
Bias
DET En
Bias
DET En
UL: 1920 – 1980 MH z
DL: 2110 – 2170 MH z
UL: 1749.9 – 1784.9 MHz
DL: 1844.9 – 1879.9 MHz
UL: 830– 840 MHz
DL: 875– 885 MHz
824 – 915 MHz
1710 – 1910 MHz
1930 – 1990 MHz
1805 – 1880 MHz
925 – 960 MHz
869 – 894 MHz
WDCDCREF
WPOW_DET_EN
RFTEMP
TEMPBIAS
Placed
closeto RF
FB
Switch
PWM/PFM
En
Control
Logic
RFCtrl1
RS232
Debug
equipm.
CDI
ISP CDS
CDSISP
ToINTCON on App side
SERVICEn
R0
R1
R2
R3
R4
C0 C1 C2 C3 C4
1
87
654
32
0
9
#
*
C5
Memory Card
MS/MMC/SD
Pullups
/downs
WLAN
APP_GPIO INT
MCLK
32kHz
VIO
1.8V VBAT
RESOUTx RST
SPI
DVB-H
APP_GPIO INT
MCLK
32kHz
VIO
1.8V VBAT
RESOUTx RST
SPI
A_GPS
GPSSTART Synch
MCLK
32kHz
VIO
1.8V VBAT
RESOUTx RST
UART
MMC_DATA5
MMC_DATA4
MMC_DATA7
MMC_DATA6
MMC_DATADIR
FLASH_2
FLASH_0
FLASH_1
SHUTTER0
SHUTTER1
Flashgun and
shutter control
Camera
data
8 bit MMC
Figure 3-1-1 TU750 Block Diagram
- 21 -
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
3. TECHNICAL BRIEF
3.1.2 External memory interface
RF calibration data, Audio parameters and battery calibration data etc are stored in flash
memory area.
A. TU750
y2Gb NAND flash memory +1G SDRAM
Table 3- 1- 1. External Memory Interface Spec. of TU750
Figure 3- 1- 2. External Memory Configuration of TU750
yData Communication
-IrDA®(SIR)
- UARTs (ACB, EDB (RS232))
-SlaveUSB
yPackage
- 12 by 12 mm 344 balls, 0.5mm pitch FPBGA Production Package
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