LG 47WV30BS User manual

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Europe/Africa http://eic.lgservice.com
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Internal Use Only
Printed in KoreaP/NO : MFL63279926 (1112-REV00)
CHASSIS : LW01A
MODEL : 47WV30BS 47WV30BS-BL
CAUTION
BEFORE SERVICING THE CHASSIS,
READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
MONITOR SIGNAGE
SERVICE MANUAL

- 2 - LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
CONTENTS
CONTENTS .............................................................................................. 2
PRECAUTION ........................................................................................... 3
SERVICING PRECAUTIONS .................................................................... 4
SPECIFICATION ....................................................................................... 6
ADJUSTMENT INSTRUCTION ................................................................ 9
TROUBLE SHOOTING ........................................................................... 15
BLOCK DIAGRAM .................................................................................. 22
EXPLODED VIEW .................................................................................. 23
SCHEMATIC CIRCUIT DIAGRAM ..............................................................

- 3 - LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
WARNING FOR THE SAFETY-RELATED COMPONENT.
• There are some special components used in LCD
zmonitor that are important for safety. These parts are
marked on the schematic diagram and the
Exploded View. It is essential that these critical parts
should be replaced with the manufacturer' s specified
parts to prevent electric shock, fire or other hazard.
• Do not modify original design without obtaining written
permission from manufacturer or you will void the
original parts and labor guarantee.
TAKE CARE DURING HANDLING THE LCD MODULE
WITH BACKLIGHT UNIT.
• Must mount the module using mounting holes arranged
in four corners.
• Do not press on the panel, edge of the frame strongly or
electric shock as this will result in damage to the
screen.
• Do not scratch or press on the panel with any sharp
objects, such as pencil or pen as this may result in
damage to the panel.
• Protect the module from the ESD as it may damage the
electronic circuit (C-MOS).
• Make certain that treatment person' s body are grounded
through wrist band.
• Do not leave the module in high temperature and in
areas of high humidity for a long time.
• The module not be exposed to the direct sunlight.
• Avoid contact with water as it may a short circuit within
the module.
• If the surface of panel become dirty, please wipe it off
with a softmaterial. (Cleaning with a dirty or rough cloth
may damage the panel.)
WARNING
BE CAREFUL ELECTRIC SHOCK !
• If you want to replace with the new backlight (CCFL) or
inverter circuit, must disconnect the AC adapter
because high voltage appears at inverter circuit about
650Vrms.
• Handle with care wires or connectors of the inverter
circuit. If the wires are pressed cause short and may
burn or take fire.
Leakage Current Hot Check Circuit
• Replaceable batteries
* CAUTION
RISK OF EXPLOSION IF BATTERY IS REPLACED BY
AN INCORRECT TYPE.
DISPOSE OF USED BATTERIES ACCORDING TO
THE INSTRUCTIONS.
REPLACE ONLY WITH THE SAME OR EQUIVALENT
TYPE.
PRECAUTION
CAUTION
Please use only a plastic screwdriver to protect yourself
from shock hazard during service operation.

- 4 - LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conflict between the
following servicing precautions and any of the safety precautions on
page 3 of this publication, always follow the safety precautions.
Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board
module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an
explosion hazard.
2. Test high voltage only by measuring it with an appropriate high
voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unless specified otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10% (by volume) Acetone and 90% (by
volume) isopropyl alcohol (90%-99% strength)
CAUTION: This is a flammable mixture.
Unless specified otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks are
correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test fixtures specified in this
service manual.
CAUTION: Do not connect the test fixture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged easily
by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques
should be used to help reduce the incidence of component
damage caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground.
Alternatively, obtain and wear a commercially available
discharging wrist strap device, which should be removed to
prevent potential shock reasons prior to applying power to the
unit under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or
exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an anti-static type solder removal device. Some solder
removal devices not classified as "anti-static" can generate
electrical charges sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads
electrically shorted together by conductive foam, aluminum foil
or comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be
installed.
CAUTION: Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged
replacement ES devices. (Otherwise harmless motion such as
the brushing together of your clothes fabric or the lifting of your
foot from a carpeted floor can generate static electricity
sufficient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within the
range or 500 ˚F to 600 ˚F.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wire-
bristle (0.5 inch, or 1.25cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500 ˚F to 600 ˚F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500 ˚F to 600 ˚F)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only until the solder flows onto and around both the
component lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
splashed solder with a small wire-bristle brush.
SERVICING PRECAUTIONS

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Only for training and service purposes
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by gently
prying up on the lead with the soldering iron tip as the solder
melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing the
IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete Transistor
Removal/Replacement
1. Remove the defective transistor by clipping its leads as close as
possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as
possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC
connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the good
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly
connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.

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Only for training and service purposes
SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement .
1. Application range
This specification is applied to the LW01A chassis.
2. Requirement for Test
Each part is tested as below without special appointment.
(1) Temperature: 25 °C ± 5 °C(77 °F ± 9 °F),
CST: 40 °C ± 5 °C
(2) Relative Humidity: 65 % ± 10 %
(3) Power Voltage
: Standard input voltage (AC 100-240 V~, 50/60 Hz)
* Standard Voltage of each products is marked by models.
(4) Specification and performance of each parts are followed
each drawing and specification by part number in
accordance with BOM.
(5) The receiver must be operated for about 5 minutes prior to
the adjustment.
3. Test method
(1) Performance: LGE Monitor test method followed.
(2) Demanded other specification
- Safety : CE, IEC specification
- EMC : CE, IEC
No Item Specication Remark
1 Display Screen Device 47” wide Color Display Module
2 Aspect Ratio 16 : 9
3 LCD Module 47” LED LCD HD 47” LGD, LED LCD (HD)
4 Storage Environment Temp. : -20 ~ 60 deg
Humidity : 10 ~ 90 %
5 Input Voltage AC 100 ~ 240V, 50/60Hz
6 Pixel Pitch 0.5415mm x 0.5415mm
7 Back Light Direct LED
8 Display Colors 16.7M (HD)
9 Coating 3H, AG
4. Model General Specification
4.1. Module Specification
4.2. Model Specification
No Item Specication Remark
1 Market WORLD WIDE
2 Component In (1EA) Y/Cb/Cr
Y/Pb/Pr
3 HDMI In(EA) HDMI-DTV/DVI PC(HDMI version 1.3)
Support HDCP
4 RGB In/Out (1EA) RGB In/Out
5 DVI In/Out (1EA) Digital In/Out Input : Support HDCP
Output : Not support HDCP
6 RS 232C In/Out (1EA) RS 232C In/Out
7 Audio In (2EA) RGB/DVI Audio
Component Audio
L/R Input
8 RJ45 Ethernet WOL, NSU(Network Software Update)
9 USB DivX, JPEG, MP3, SVC(download)
10 Ext. IR (1EA) IR Receiver
11 Ext. Speaker Out (1EA) Ext. Speaker Out

- 7 - LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock (MHz) Proposed Remarks
1 720*400 31.468 70.08 28.321 For only DOS mode
2 640*480 31.469 59.94 25.17 VESA
3 800*600 37.879 60.31 40.00 VESA
4 832*624 49.725 74.55 55.00 MAC
5 1024*768 48.363 60.00 65.00 VESA(XGA)
6 1280*720 45.00 60.00 74.25 VESA
7 1360*768 47.72 59.8 84.75 WXGA
8 1366*768 47.71 59.79 85.50 WXGA
9 1280*1024 63.595 60.0 108.875 SXGA
No. Specication Remark
Resolution H-freq(kHz) V-freq(Hz) Proposed
1 720×480 15.73 60.00 SDTV, DVD 480i
2 720×480 15.63 59.94 SDTV, DVD 480i
3 720×480 31.47 59.94 480p
4 720×480 31.50 60.00 480p
5 720×576 15.625 50.00 SDTV, DVD 625 Line
6 720×576 31.25 50.00 HDTV 576p
7 1280×720 45.00 50.00 HDTV 720p
8 1280×720 44.96 59.94 HDTV 720p
9 1280×720 45.00 60.00 HDTV 720p
10 1920×1080 31.25 50.00 HDTV 1080i
11 1920×1080 33.75 60.00 HDTV 1080i
12 1920×1080 33.72 59.94 HDTV 1080i
6. RGB Input ( PC Only )
5. Component Video Input (Y, PB, PR)

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Only for training and service purposes
7. HDMI(PC/DTV) / DVI(PC Mode Only) input
7.1. PC mode
No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed Remarks
1 720*400 31.468 70.08 28.321 For only DOS mode
2 640*480 31.469 59.94 25.17 VESA
3 800*600 37.879 60.31 40.00 VESA
4 1024*768 48.363 60.00 65.00 VESA(XGA)
5 1280*720 45.00 60.00 74.25 VESA
6 1360*768 47.72 59.8 84.75 WXGA
7 1366*768 47.71 59.79 85.50 WXGA
8 1280*1024 63.595 60.0 108.875 SXGA
7.2. DTV mode
No Resolution H-freq(kHz) V-freq.(kHz) Pixel clock(MHz) Proposed Remarks
1 720*480 31.469 / 31.5 59.94 / 60 27.00/27.03 SDTV 480P HDCP
2 720*576 31.25 50 54 SDTV 576P HDCP
3 1280*720 37.500 50 74.25 HDTV 720P HDCP
4 1280*720 44.96 / 45 59.94 / 60 74.17/74.25 HDTV 720P HDCP
5 1920*1080 33.72 / 33.75 59.94 / 60 74.17/74.25 HDTV 1080I HDCP
6 1920*1080 28.125 50.00 74.25 HDTV 1080I HDCP

- 9 - LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
ADJUSTMENT INSTRUCTION
1. Application Range
This specification is applied all of the Digital Signage Product
with LW01A chassis.
2. Designation
(1) The adjustment is according to the order which is
designated and which must be followed, according to the
plan which can be changed only on agreeing.
(2) Power adjustment : Free Voltage.
(3) Magnetic Field Condition: Nil.
(4) Input signal Unit: Product Specification Standard.
(5) Reserve after operation: Above 5 Minutes (Heat Run)
Temperature : at 25 °C ± 5 °C
Relative humidity : 65 % ± 10 %
Input voltage : 220V, 60Hz
(6) Adjustment equipments : Color Analyzer (CA-210 or
CA-110), DDC Adjustment Jig equipment, SVC remote
controller.
(7) Push The “IN STOP KEY” – For memory initialization.
3. Main PCB check process
* APC - After Manual-Insult, executing APC
* Boot file Download
(1) Execute ISP program “Mstar ISP Utility” and then click
“Config” tab.
(2) Set as below, and then click “Auto Detect” and check “OK”
message
If “Error” is displayed, Check connection between computer,
jig, and set.
(3) Click “Read” tab, and then load download file (XXXX.bin)
by clicking “Read”
(4) Click “Connect” tab. If “Can’t ” is displayed, Check
connection between computer, jig, and set.
(5) Click “Auto” tab and set as below.
(6) Click "Run".
(7) After downloading, check "OK" message.
* USB DOWNLOAD(*.epk file download)
(1) Put the USB Stick to the USB socket
(2) Automatically detecting update file in USB Stick
- If your downloaded program version in USB Stick is Low,
it didn’t work.
- But your downloaded version is High, USB data is
automatically detecting
(3) Show the message “Copying files from memory”
(4) Updating is staring.
(5) Updating Completed, The Multi-vision will restart
automatically.
(6) If your Multi-vision is turned on, check your updated
version and Tool option. (explain the Tool option, next
stage)
Case1 : Software version up
1. After downloading S/W by USB , Multi-vision set will reboot
automatically
2. Push “In-stop” key
3. Push “Power on” key
4. Function inspection
5. After function inspection, Push “In-stop” key.
Case2 : Function check at the assembly line
1. When TV set is entering on the assembly line, Push “In-
stop” ke y at rst.
2. Push “Power on” key for turning it on.
-> If you push “Power on” key, TV set will recover channel
information by itself.
3. After function inspection, Push “In-stop” key.

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Only for training and service purposes
* After downloading, have to adjust TOOL OPTION again.
1) Push "IN-START" key in service remote controller.
2) Select "Tool Option 1" and Push “OK” button.
3) Punch in the number. (Each of models has their
number.)
4) Completed selecting Tool option.
3.1. ADC Process
3.1.1. ADC
■ Enter Service Mode by pushing “ADJ” key,
■ Enter Internal ADC mode by pushing “►” key at “5. ADC
Calibration”
* Caution : Using ‘power on’ button of the Adjustment R/C,
power on Multi-vision.
* ADC Calibration Protocol (RS232)
- Adjust Sequence
▪aa 00 00 [Enter Adjust Mode]
▪xb 00 40 [Component1 Input (480i)]
▪ad 00 10 [Adjust 480i Comp1]
▪xb 00 60 [RGB Input (1024*768)]
▪ad 00 10 [Adjust 1024*768 RGB]
▪aa 00 90 End Adjust mode
* Required equipment : Adjustment R/C.
3.2. Function Check
3.2.1. Check display and sound
■ Check Input and Signal items. (cf. work instructions)
1. COMPONENT (480i)
2. RGB (PC : 1024 x 768 @ 60hz)
3. HDMI
4. DVI
5. PC Audio In
* Display and Sound check is executed by Remote control-
ler.
* Caution : Not to push the INSTOP KEY after completion if the
function inspection.
4. Total Assembly line process
4.1. Adjustment Preparation
■ W/B Equipment condition
CA210 : CH 9, Test signal : Inner pattern (85IRE)
■ Above 5 minutes H/run in the inner pattern. (“power on” key
of adjust remote control)
Model 47WV30BS-BL
Module LGD
Global
EU sufx Exception for EU
Tool Option 1 33760 33760
Tool Option 2 8707 8707
Tool Option 3 49172 51220
Tool Option 4 29056 29056
Tool Option 5 1056 1056
Global
Exception for
US & Korea
US & Korea
sufx
Tool Option 1 33760 33760
Tool Option 2 8707 8707
Tool Option 3 49172 51220
Tool Option 4 29056 29056
Tool Option 5 1056 1056
NO Enter
Adjust MODE
ADC adjust
Item Adjust ‘Mode In’ ADC Adjust
CMD 1 A A
CMD 2 A D
Data 0 0 0
1 0
When transfer the
‘Mode In’,
Carry the command.
Automatically adjustment
(The use of a internal
pattern)
Color Temperature
Cool Medium Warm
13,000k 9,300k 6,500k
K K K
X=0.269 (±0.002)
Y=0.273 (±0.002)
X=0.285 (±0.002)
Y=0.293 (±0.002)
X=0.313 (±0.002)
Y=0.329 (±0.002)
47WV30
<Test Signal>
Inner pattern (216gray,85IRE)

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Only for training and service purposes
* Connecting picture of the measuring instrument (On Auto-
matic control)
- Inside PATTERN is used when W/B is controlled. Con-
nect to auto controller or push Adjustment R/C POWER-
ON -> Enter the mode of White-Balance, the pattern will
come out.
* Auto-control interface and directions
1) Adjust in the place where the inux of light like oodlight
around is blocked. (Illumination is less than 100Lux).
2) Adhere closely the Color Analyzer ( CA210 ) to the
module less than 10cm distance, keep it with the surface
of the Module and Color Analyzer’s Prove vertically.
(80~100°).
3) Aging time
- After aging start, keep the power on (no suspension of
power supply) and heat-run over 5 minutes.
- Using ‘no signal’ or ‘full white pattern’ or the others,
check the back light on.
■ Auto adjustment Map(RS-232C)
RS-232C COMMAND
[ CMD ID DATA ]
Wb 00 00 White Balance Start
Wb 00 ff White Balance End
*Caution
- Color Temperature : COOL, Medium, Warm.
- One of R Gain/G Gain/ B Gain should be kept on 0xC0, and
adjust other two lower than C0.
( when R/G/B Gain are all C0, it is the FULL Dynamic Range
of Module)
* Manual W/B process using adjusts Remote control.
■ After enter Service Mode by pushing “ADJ” key,
■ Enter White Balance by pushing “►” key at “6. White
Balance”.
* After You nish all adjustments, Press “In-start” button and
compare Tool option and Area option value with its BOM, if it
is correctly same then unplug the AC cable.
If it is not same, then correct it same with BOM and unplug
AC cable.
For correct it to the model’s module from factory JIG model.
* Push The “IN STOP KEY” after completing the function
inspection. And Mechanical Power Switch must be set “ON”.
4.2. MAC Address Download
■ Com 1,2,3,4 and 115200(Baudrate)
■ Port connection button click(1)
■ Load button click(2) for MAC Address write.
■ Start MAC Address write button(3)
■ Check the OK Or NG
4.3. LAN (Automatic IP)
4.3.1. Equipment & Condition
■ Each other connection to LAN Port of IP Hub and Jig
4.3.2. LAN inspection solution
■LAN Port connection with PCB
■ Network setting at MENU Mode of Menu
- “menu” key input -> Network -> Network Setting ->
Press “Enter” -> IP Auto Setting -> OK
■ setting automatic IP
■ Setting state conrmation
- If automatic setting is nished, you conrm IP and
MAC Address.
RS-232C
COMMAND
[CMD ID DATA]
M
I
N
CENTER
(DEFAULT)
M
A
X
Cool Mid Warm Cool Mid Warm
R Gain jg Ja jd 00 172 192 192 192
G Gain jh Jb je 00 172 192 192 192
B Gain ji Jc jf 00 192 192 172 192
R Cut 64 64 64 128
G Cut 64 64 64 128
B Cut 64 64 64 128

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Only for training and service purposes
4.3.3. LAN PORT INSPECTION (PING TEST)
Connect : SET->LAN Port == PC->LAN Port
4.3.3.1 Equipment setting
1) Play the LAN Port Test PROGRAM.
2) Input IP set up for an inspection to Test Program.
*IP Number : 12.12.2.2
4.3.3.2 LAN PORT inspection (PING TEST)
1) Play the LAN Port Test Program.
2) connect each other LAN Port Jack.
3) Play Test (F9) button and conrm OK Message.
4) remove LAN CABLE
4.4. DPM operation conrmation
4.5. DDC EDID Write (RGB 128Byte )
■ Connect D-sub Signal Cable to D-Sub Jack.
■ Write EDID DATA to EEPROM (24C02) by using DDC2B
protocol.
■ Check whether written EDID data is correct or not.
* For SVC main Ass’y, EDID have to be downloaded to Insert
Process in advance.
* In case of SKD Ass’y, it is no need to do EDID D/L. Ass’y,
Supplier does that in advance.
4.6. DDC EDID Write (DVI 128Byte)
■ Connect DVI Signal Cable to DVI Jack.
■ Write EDID DATA to EEPROM (24C02) by using DDC2B
protocol.
■ Check whether written EDID data is correct or not.
* For SVC main Ass’y, EDID have to be downloaded to Insert
Process in advance.
* In case of SKD Ass’y, it is no need to do EDID D/L. Ass’y,
Supplier does that in advance.
4.7. DDC EDID Write (HDMI 256Byte)
■ Connect HDMI Signal Cable to HDMI Jack.
■ Write EDID DATA to EEPROM(24C02) by using DDC2B
protocol.
■ Check whether written EDID data is correct or not.
* For SVC main Ass’y, EDID have to be downloaded to Insert
Process in advance.
* In case of SKD Ass’y, it is no need to do EDID D/L. Ass’y,
Supplier does that in advance.
4.8. EDID DATA
(1) All Data : HEXA Value
(2) Changeable Data : *: Serial No : Controlled / Data:01
**: Month : Controlled / Data:00
***:Year : Controlled
****:Check sum
- Auto Download
■ After enter Service Mode by pushing “ADJ” key,
■ Enter EDID D/L mode.
■ Enter “START” by pushing “OK” key.
*Caution : Never connect HDMI & D-sub Cable when EDID
downloaded.
* Edid data and Model option download (RS232)
- Manual Download
* Caution
■ Use the proper signal cable for EDID Download
- Analog EDID : Pin3 exists
- Digital EDID : Pin3 exists
* Caution
- Never connect HDMI & D-sub Cable at the same time.
- Use the proper cables below for EDID Writing.
- Download HDMI1, HDMI2 separately because HDMI1 is dif-
ferent from HDMI2.
NO Enter
download MODE
EDID data Model
option download
Item download ‘Mode In’ download
CMD 1 A A
CMD 2 A E
Data 0 0 00
0 10
When transfer the ‘Mode In’,
Carry the command.
Automatically download
(The use of a internal pattern)
No. Item Condition Hex Data
1 Manufacturer ID GSM 1E6D
2 Version Digital : 1 01
3 Revision Digital : 3 03
For Analog
EDID
For DVI EDID For HDMI EDID
D-sub to
D-sub
DVI to DVI DVI-D to HDMI
or HDMI to HDMI

- 13 - LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
1) RGB EDID data
2) DVI EDID data
3) HDMI EDID data
0123456789ABCDEF
00 00 FF FF FF FF FF FF 00 1E 6D 01 01 01 01 01 01
10 0C 15 01 03 6E 68 3A 78 EA 23 5B A7 54 4E 98 26
20 0F 47 4A A5 6B 80 81 40 81 80 71 40 64 4F 45 4F
30 31 4F 81 C0 01 01 66 21 56 AA 51 00 1E 30 46 8F
40 33 00 0F 48 42 00 00 1E 1B 21 50 A0 51 00 1E 30
50 48 88 35 00 0F 48 42 00 00 1C 00 00 00 FD 00 38
60 4B 1E 44 11 00 0A 20 20 20 20 20 20 00 00 00 FC
70 00 34 37 57 56 33 30 0A 20 20 20 20 20 20 00 47
0123456789ABCDEF
00 00 FF FF FF FF FF FF 00 1E 6D 01 01 01 01 01 01
10 0C 15 01 03 80 68 3A 78 EA 23 5B A7 54 4E 98 26
20 0F 47 4A A5 08 80 81 40 81 80 71 40 01 01 01 01
30 01 01 81 C0 01 01 66 21 56 AA 51 00 1E 30 46 8F
40 33 00 0F 48 42 00 00 1E 1B 21 50 A0 51 00 1E 30
50 48 88 35 00 0F 48 42 00 00 1C 00 00 00 FD 00 38
60 3F 1E 44 11 00 0A 20 20 20 20 20 20 00 00 00 FC
70 00 34 37 57 56 33 30 0A 20 20 20 20 20 20 00 62
0123456789ABCDEF
00 00 FF FF FF FF FF FF 00 1E 6D 01 01 01 01 01 01
10 0C 15 01 03 80 68 3A 78 EA 23 5B A7 54 4E 98 26
20 0F 47 4A A5 08 80 81 40 81 80 71 40 01 01 01 01
30 01 01 81 C0 01 01 66 21 56 AA 51 00 1E 30 46 8F
40 33 00 0F 48 42 00 00 1E 1B 21 50 A0 51 00 1E 30
50 48 88 35 00 0F 48 42 00 00 1C 00 00 00 FD 00 38
60 3F 1E 44 11 00 0A 20 20 20 20 20 20 00 00 00 FC
70 00 34 37 57 56 33 30 0A 20 20 20 20 20 20 00 62
80 02 03 1C 71 47 84 05 14 13 03 12 01 23 09 07 07
90 83 01 00 00 67 03 0C 00 10 00 00 2D 01 1D 00 72
A0 51 D0 1E 20 6E 28 55 00 0F 48 42 00 00 1E 01 1D
B0 80 18 71 1C 16 20 58 2C 25 00 0F 48 42 00 00 9E
C0 01 1D 80 D0 72 1C 16 20 10 2C 25 80 0F 48 42 00
D0 00 9E 01 1D 00 BC 52 D0 1E 20 B8 28 55 40 0F 48
E0 42 00 00 1E 8C 0A D0 8A 20 E0 2D 10 10 3E 96 00
F0 0F 48 42 00 00 18 00 00 00 00 00 00 00 00 00 94

- 14 - LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
* Detail EDID Options are below
1) Product ID
2) Serial No : Controlled on production line.
3) Month, Year: Week : ‘12’ -> ‘0C’ Year : ‘2011’ -> ‘15’
x
4) Model Name(Hex): Refer to the ASCII Code Table
Cf) TV set’s model name in EDID data is below.
5) Checksum: Changeable by total EDID data.
6) Vendor Specic
4.9. Outgoing condition Conguration
■ When pressing IN-STOP key by SVC remocon, Red LED
are blinked alternatively. And then automatically turn off.
(Must not AC power OFF during blinking)
4.10. Internal pressure
- Conrm whether is normal or not when between power
board's ac block and GND is impacted on 1.5kV(dc) or
2.2kV(dc) for one second
5. Model name & Serial number Download
5.1. Model name & Serial number D/L
■ Press “Power on” key of service remocon.(Baud rate :
115200 bps)
■ Connect RS232 Signal Cable to RS-232 Jack.
■ Write Serial number by use RS-232.
5.2. Signal TABLE
CMD: A0h
LENGTH : 85~94h (1~16 bytes)
ADH : EEPROM Sub Address high (00~1F)
ADL : EEPROM Sub Address low (00~FF)
Data : Write data
CS : CMD + LENGTH + ADH + ADL + Data_1 + … + Data_n
Delay : 20ms
5.3. Command Set
* Description
FOS Default write : <7mode data> write
Vtotal, V_Frequency, Sync_Polarity, Htotal, Hstart, Vstart,
0, Phase
Data write : Model Name and Serial Number write in EEP-
ROM,.
5.4. Method & notice
(1) Serial number D/L is using of scan equipment.
(2) Setting of scan equipment operated by Manufacturing
Technology Group.
(3) Serial number D/L must be conformed when it is produced
in production line, because serial number D/L is mandatory
by D-book 4.0
* Manual Download (Model Name and Serial Number)
If the TV set is downloaded By OTA or Service man,
Sometimes model name or serial number is initialized.( Not
always)
There is impossible to download by bar code scan, so It need
Manual download.
1) Press the ‘instart’ key of ADJ remote controller.
2) Go to the menu ‘5.Model Number D/L’ like below photo.
3) Input the Factory model name(ex 42LD450-ZA) or Serial
number like photo.
4) Check the model name Instart menu -> Factory name
displayed (ex 42LD450-ZA)
CMD LENGTH ADH ADL DATA_1 ... Data_n CS DELAY
INPUT MODEL NAME(HEX)
HDMI 3437575633300A
RGB 3437575633300A
DVI 3437575633300A
EDID C/S data HDMI DVI RGB
check sum
(Hex)
Block 0 56 56 47
Block 1 94 94 -
MODEL NAME MODEL NAME(HEX)
47WV30 00 00 00 FC 00 34 37 57 56 33 30 0A 20 20
20 20 20 20 (47WV30)
MODEL NAME HEX EDID Table DDC
Function
HD Model 0101 0101 Analog/Digital
No. 1
Adjust mode EEPROM WRITE
CMD(hex) A0h
LENGTH(hex) 84h+n
Description n-bytes Write (n = 1~16)

- 15 - LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
TROUBLE SHOOTING
uvGwv~ly
Owv~lyGpukpjh{vyGvmmP
joljrGwv~lyGivhyk
joljrGw\WWGwpuGXS`SXWSXXSXY
Oz{ZU\}P
uvOsP
joljrGwv~lyGivhyk
joljrGw\WWGwpuGX^SX`SYX
pu}XY}
uvOsP
XUGjGpjXWX
YUGjGG}GGpjXWX
lzOoP
lzOoP
lz
lzOoP
joljrGXWW
joljrGXWW
OY[to¡PGf
uv
joljrGz|iGtpjvtGpj
joljrGpj[
OysvuPGf
uvOsP
1. No Power

- 16 - LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
2. No RASTER(OSD IS NOT DISPLAYED)
NO RASTER
(OSD IS NOT DISPLAY)
CHECK THE PERIPHERALS
OF IC102
CHECK IC102
LVDS.
NO
CHECK WAFER,
CONNECTOR AND POWER
BOARD
CHECK
INVERTER
VOLTAGE POWER
(24V)?
NO
1. CHECK INVERTER
2. CHECK T-CON BOARD
YES
YES
YES
CHECK
MODULE LINK CONNECTOR
CHECK
MODULE INPUT
WAVE
NO
CHECK WAFER,
CONNECTOR AND POWER
BOARD
CHECK
INVERTER CONTROL
INV_ON
NO
YES

- 17 - LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
3. NO RASTER STATE ON RGB SIGNAL
NO RASTER STATE ON
RGB SIGNAL
CHECK SIGNAL CABLE AND
OUTPUT DEVICE
CHECK INPUT JACK
(P901)
NO
CHECK Vcc AND
PERIPHERALS OF IC902
CHECK SCHMITT
TRIGGER I/O
SYNC (IC902)
NO
1. CHECK IC101
2. CHECK Vcc OF IC101
3. CHECK PERIPHERALS OF
IC101
YES
YES

- 18 - LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
4. NO RASTER STATE ON DVI SIGNAL
NO RASTER STATE ON
VIDEO SIGNAL(DVI)
CHECK SIGNAL CABLE AND
OUTPUT DEVICE
CHECK INPUT JACK
(P801)
NO
CHECK Vcc AND
PERIPHERALS OF IC803
CHECK
Multiplexer IC803
NO
1. CHECK IC101
2. CHECK Vcc OF IC101
3. CHECK PERIPHERALS OF
IC101
YES
YES

- 19 - LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
5. NO RASTER STATE ON COMPONENT SIGNAL
NO RASTER STATE ON
COMPONENT SIGNAL
CHECK SIGNAL CABLE AND
OUTPUT DEVICE
CHECK INPUT JACK
(JK1001, JK1002)
NO
1. CHECK IC101
2. CHECK Vcc OF IC101
3. CHECK PERIPHERALS OF
IC101
YES

- 20 - LGE Internal Use OnlyCopyright © LG Electronics. Inc. All rights reserved.
Only for training and service purposes
6. NO RASTER STATE ON HDMI SIGNAL
NO RASTER STATE ON
HDMI SIGNAL
CHECK SIGNAL CABLE AND
OUTPUT DEVICE
CHECK INPUT JACK
(JK801)
NO
1. CHECK IC101
2. CHECK Vcc OF IC101
3. CHECK PERIPHERALS OF
IC101
YES