Table of Contents
Introduction.....................................................................................................................................................1
Features......................................................................................................................................................... 2
Applications....................................................................................................................................................2
1. Reference Documents............................................................................................................................ 5
2. Block Diagram.........................................................................................................................................6
3. Pinout ..................................................................................................................................................... 7
3.1. Pinout Overview........................................................................................................................... 7
3.2. Pin List..........................................................................................................................................7
4. Functional Description...........................................................................................................................21
4.1. MPU and Memory Subsystem....................................................................................................21
4.2. Power Management................................................................................................................... 25
4.3. LAN Subsystem..........................................................................................................................30
4.4. Voltage Threshold Detector........................................................................................................31
4.5. Radio Subsystem....................................................................................................................... 32
4.6. External Interfaces..................................................................................................................... 33
5. Electrical Characteristics.......................................................................................................................48
5.1. Absolute Maximum Ratings........................................................................................................48
5.2. Recommended Operating Conditions........................................................................................ 48
5.3. DC Characteristics..................................................................................................................... 48
5.4. Power Consumption...................................................................................................................49
5.5. Radio Performance.................................................................................................................... 51
6. Mechanical Characteristics................................................................................................................... 52
6.1. Module Outline Drawings........................................................................................................... 52
6.2. Module Land Pattern (Host Board PCB Footprint).....................................................................54
6.3. Other Characteristics..................................................................................................................55
7. Assembly and Storage Information....................................................................................................... 56
7.1. Storage Condition.......................................................................................................................56
7.2. Motherboard Solder Paste......................................................................................................... 56
7.3. Motherboard Stencil Design.......................................................................................................56
7.4. Bake Information........................................................................................................................ 56
7.5. Reflow Profile............................................................................................................................. 57
8. Regulatory Approval..............................................................................................................................59
8.1. United States..............................................................................................................................59
8.2. Canada.......................................................................................................................................60
8.3. Europe........................................................................................................................................61
8.4. Approved Antenna Types........................................................................................................... 63
9. Ordering Information............................................................................................................................. 66
SAMA5D27 Wireless SOM1
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and its subsidiaries
Complete Datasheet DS60001590D-page 3
