MicroSys miriac MPX-LX2160A User manual

miriac MPX-LX2160A
User Manual (HW Revision 2)
V1.4

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Table of Contents
1General Notes.............................................. 4
1.1 Warranty........................................................4
1.2 Links..............................................................4
1.3 Liability .......................................................... 4
1.4 Offer to Provide Source Code of Certain
Software ........................................................ 5
1.5 Symbols, Conventions and Abbreviations .....6
1.5.1 Symbols ........................................................ 6
1.5.2 Conventions .................................................. 6
2Introduction ................................................. 7
2.1 Safety and Handling Precautions .................. 7
2.2 Short Description........................................... 8
2.3 Shipping List.................................................. 8
3System Description..................................... 9
3.1 Block Diagram............................................... 9
3.2 System Components.....................................9
3.3 SoC ............................................................. 10
3.4 Power Consumption.................................... 10
3.5 Cooling ........................................................ 11
3.6 Ordering Information ................................... 11
4Technical Description ............................... 12
4.1 Connector References ................................ 12
4.2 Module Connector Pinout and Electrical
Characteristics............................................. 13
4.3 Connectors on Module ................................ 13
4.3.1 Fan Connectors [ST5, ST6]......................... 13
4.3.2 Programming Connector [ST7].................... 14
4.4 Management Engine (ME) .......................... 15
4.4.1 System Startup............................................ 15
4.4.2 System Monitoring....................................... 15
4.4.3 XML Configuration....................................... 16
4.4.4 Command Console...................................... 17
4.5 CPLD........................................................... 27
4.6 Power Structure........................................... 28
4.6.1 Power Monitoring ........................................ 29
4.7 Reset Structure ........................................... 30
4.8 Clock Structure............................................ 32
4.9 Boot Mode Configuration............................. 34
4.10 Memory DRAM............................................ 35
4.11 Memory eMMC............................................ 35
4.12 Memory XSPI .............................................. 36
4.13 Memory SPI ................................................ 37
4.14 RTC (Real-Time Clock) ............................... 38
4.15 Serdes clocking........................................... 39
4.16 Temperature sensors .................................. 40
4.17 LEDs............................................................41
4.18 I2C Devices –Address List..........................42
4.19 I2C (PMBUS) devices at ME .......................43
4.20 Carrier Interfaces.........................................43
4.20.1 Module Power Input.....................................43
4.20.2 Power from Module to Carrier......................43
4.20.3 Battery Backup ............................................44
4.20.4 SerDes.........................................................44
4.20.5 MAC Capabilities .........................................47
4.20.6 RGMII ..........................................................48
4.20.7 UART...........................................................49
4.20.8 I2C...............................................................51
4.20.9 CAN.............................................................51
4.20.10 SDHC-1 (SD)...............................................52
4.20.11 eSDHC ........................................................53
4.20.12 USB .............................................................54
4.20.13 XSPI ............................................................56
4.20.14 SPI...............................................................56
4.20.15 FTM .............................................................57
4.20.16 JTAG/COP...................................................57
4.20.17 Interrupts .....................................................58
4.20.18 Control / Reset.............................................58
4.20.19 Alternate function.........................................58
4.20.20 GPIOs..........................................................59
4.21 Management Engine (ME)...........................60
4.21.1 ME Console.................................................60
4.21.2 ME Programming.........................................60
4.21.3 ME I2C.........................................................60
4.21.4 ME SPI ........................................................60
4.21.5 ME USB.......................................................61
4.21.6 ME Power Control .......................................61
4.22 CPLD Interfaces ..........................................61
4.23 Fan ..............................................................61
5Mechanical Description.............................62
5.1 Board Outline...............................................62
5.2 Component Layout Top Side...............Fehler!
Textmarke nicht definiert.
5.3 Component Layout Bottom Side..........Fehler!
Textmarke nicht definiert.
5.4 Height ..........................................................64
5.5 PCB Thickness ............................................64
5.6 Carrier Connector Placement and
Mounting......................................................65
6Software .....................................................66
6.1 U-Boot .........................................................66

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6.2 Operating System........................................ 66
6.3 Flash Layout................................................ 66
7Safety Requirements and Protective
Regulations................................................ 67
7.1 EMC ............................................................ 67
7.2 ESD............................................................. 67
7.3 Reliability..................................................... 67
7.4 Climatic Conditions...................................... 68
7.5 RoHS........................................................... 68
8General notes.............................................69
9History ........................................................70
10 Appendix ....................................................71
10.1 Acronyms.....................................................71
10.2 Table of Figures...........................................71
10.3 Table of Tables............................................71

General Notes
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1 General Notes
Copyright MicroSys Electronics GmbH, January 2021
All rights reserved. All rights in any information which appears in this document
belong to MicroSys Electronics GmbH or our licensors. You may copy the
information in this manual for your personal, non-commercial use.
Copyrighted products are not explicitly indicated in this manual. The absence of the
copyright (©) and trademark (TM or ®) symbols does not imply that a product is not
protected. Additionally, registered patents and trademarks are similarly not
expressly indicated in this manual.
1.1 Warranty
To the extent permissible by applicable law all information in this document is
provided without warranty of any kind, whether expressed or implied, including but
not limited to any implied warranty of satisfactory quality or fitness for a particular
purpose, or of non-infringement of any third party’s rights. We try to keep this
document accurate and up to date but we do not make any warranty or
representation about such matters. In particular we assume no liability or
responsibility for any errors or omissions in this document.
MicroSys Electronics GmbH neither gives any guarantee nor accepts any liability
whatsoever for consequential damages resulting from the use of this manual or its
associated product.
MicroSys Electronics GmbH further reserves the right to alter the layout and/or
design of the hardware without prior notification and accepts no liability for doing
so.
1.2 Links
We make no warranty about any other sites that are linked to or from this
document, whether we authorize such links or not.
1.3 Liability
To the extent permissible by applicable law, in no circumstance, including (but not
limited to) negligence, shall we be liable for your reliance on any information in this
document, nor shall we be liable for any direct, incidental, special, consequential,
indirect or punitive damages nor any loss of profit that result from the use of, or the
inability to use, this document or any material on any site linked to this document
even if we have been advised of the possibility of such damage. In no event shall
our liability to you for all damages, losses and causes of action whatsoever,
whether in contract, tort (including but not limited to negligence) or otherwise
exceed the amount, if any, paid by you to us for gaining access to this document.
MicroSys Electronics GmbH
Muehlweg 1
82054 Sauerlach
Germany
Phone: [phone]
Fax: [phone]

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1.4 Offer to Provide Source Code of Certain
Software
This product contains copyrighted software that is licensed under the General
Public License (“GPL”) and under the Lesser General Public License Version
(“LGPL”). The GPL and LGPL licensed code in this product is distributed without
any warranty. Copies of these licenses are included in this product.
You may obtain the complete corresponding source code (as defined in the GPL)
for the GPL Software, and/or the complete corresponding source code of the LGPL
Software (with the complete machine-readable “work that uses the Library”) for a
period of three years after our last shipment of the product including the GPL
Software and/or LGPL Software, which will be no earlier than December 1, 2010,
for the cost of reproduction and shipment, which is dependent on the preferred
carrier and the location where you want to have it shipped to, by sending a request
to:
MicroSys Electronics GmbH
Muehlweg 1
82054 Sauerlach
Germany
In your request, please provide the product name and version for which you wish to
obtain the corresponding source code and your contact details so that we can
coordinate the terms and cost of shipment with you.
The source code will be distributed WITHOUT ANY WARRANTY and licensed
under the same license as the corresponding binary/object code.
This offer is valid to anyone in receipt of this information.
MicroSys Electronics GmbH is eager to duly provide complete source code as
required under various Free Open-Source Software licenses. If, however you
encounter any problems in obtaining the full corresponding source code we would
be much obliged if you give us a notification to the email address
[email protected], stating the product and describing the problem (please do NOT
send large attachments such as source code archives etc. to this email address)

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1.5 Symbols, Conventions and Abbreviations
1.5.1 Symbols
Throughout this document, the following symbols will be used:
Information marked with this symbol MUST be obeyed to avoid the risk
of severe injury, health danger, or major destruction of the unit and its
environment
Information marked with this symbol MUST be obeyed to avoid the risk
of possible injury, permanent damage or malfunction of the unit.
Information marked with this symbol gives important hints upon details
of this manual in order to get the best use out of the product and its
features.
Table 1-1 Symbols
1.5.2 Conventions
Symbol
Explanation
# / xxx_B
denotes a low active signal
←
denotes the signal flow in the shown direction
→
denotes the signal flow in the shown direction
↔
denotes the signal flow in both directions
→
denotes the signal flow in the shown direction with additional logic /
additional ICs in the signal path
I/O / INOUT
denotes a bidirectional pin
Input
denotes an input pin
Output
denotes an output pin
matched
denotes that the corresponding signal is to be routed impedance
controlled and length matched
Pin 1
refers to the numeric pin of a component package
Pin a1
refers to the array position of a pin within a component package
xxx- / xxx_N
denotes the negative signal of a differential pair
xxx+ / xxx_P
denotes the positive signal of a differential pair
xxx
denotes an optional not mounted or not assembled part
Table 1-2 Conventions

Introduction
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2 Introduction
Thank you for choosing the MicroSys MPX-LX2160A System-on-Modue (SoM).
This manual should help you get started and achieve the best performance from all
of its features.
2.1 Safety and Handling Precautions
DO NOT exceed the rated maximum values for the power
supply! This may result in severe permanent damage to
the unit, as well as possible serious injury.
ALWAYS keep the unit dry, clean and free of foreign
objects. Otherwise, irreparable damage may occur.
Parts of the unit may become hot during operation. Take
care not to touch any parts of the circuitry during
operation to avoid burns and operate the unit in a well-
ventilated location. Provide an appropriate cooling
solution as required.
Electrostatic discharge (ESD) can damage the unit.
Always take the necessary ESD precautions.
Many pins on the module connector are directly
connected to the CPU or other ESD sensitive devices.
Make or break ANY connection ONLY while the unit is
switched OFF.
Otherwise, permanent damage to the unit may occur,
which is not covered by warranty.
There is no separate SHIELD connection.
The module’s mounting holes are not connected to GND
Take this into account when handling and mounting the
unit.
EXERCISE EXTREME HARE WHEN INSERTING OR REMIVING
THE MODULE FROM ITS BOARD-TO-BOARD CONNECTORS.
DO NOT TILT OR SHIFT THE MODULE OR THE CONNECTORS
WILL BE DAMAGED. ALWAYS INSERT AND REMOVE THE
MODULE WITH EQUAL PRESSURE ON BOTH CONNECTORS IN
A LINEAR MOTION
Table 2-1 Safety and Handling Precautions

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2.2 Short Description
The LX2160A multicore processor from NXP is a member of the Layerscape family
of SoCs with 16 Arm Cortex-A72 cores. It exposes a wide variety of external
interfaces, which are explained in detail in the following chapters. The cores feature
dedicated L2 Cache for each dual-core cluster, as well as a unified L3 cache.
The Cortex-A72 cores run at a maximum clock speed of 2200 MHz, 2000 MHz or
1800 MHz depending on the speed grade ordered. The core frequency can be
clocked down, if needed, to lower the power consumption.
MicroSys Electronics GmbH offers a Development Kit consisting of:
■the MPX-LX2160A module itself,
■and the CRX08 carrier board.
It targets both
■evaluation of the chosen MPX-LX2160A SoM variant
■usage in an industrial application as a high-performance edge computing device,
file server, AI edge cluster or other application
This document gives an overview of the board's connectors and how to take the first
steps with the initial setup.
2.3 Shipping List
Tbd

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3 System Description
3.1 Block Diagram
3.2 System Components
■QorIQ Layerscape processor LX2160A or LX2120A or LX2080A
■Microcontroller as monitoring and supervising unit with power management
and configuration tasks (ME)
■DDR4 SDRAM
■Clock Generators for CPU and interface clocks
■XSPI flash as boot or storage device
■eMMC flash as boot or storage device
■I²C EEPROM
■I²C temperature sensor
■I²C RTC
■Voltage regulators for onboard generated voltages
Figure 3-1 Block Diagram

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3.3 SoC
There are several variants of the LX2160A SoC available from NXP.
For availability of different versions ask your local sales representative.
3.4 Power Consumption
The MPX-LX2160A can be supplied by a single input power rail ranging from 5V to
12V. The efficiency of the voltage regulators differs in that range.
Power Measurements, VIN = 12V, CRX-08 Carrier with single RJ45 1G Ethernet
for measurement data transfer:
Table 3-1: Power Consumption over Tj Range
Stress
Level
Tamb [°C] (steady
state climate
chamber)
Tj[°C] from internal
Probe in Cluster 6/7
Ptotal [w]
Pvdd/vddq [w]
Premain [w] (other
voltages, 1V2, 1V8, etc.)
idle
-40
3
18,528
9,150
9,378
stress
-40
9
34,124
25,944
8,180
idle
-20
10
18,792
9,128
9,664
Stress
-20
23
34,527
25,709
8,818
idle
0
26
18,984
9,345
9,639
stress
0
40
35,167
25,928
9,239
idle
20
49
19,705
9,963
9,742
stress
20
62
36,100
26,577
9,523
idle
40
75
21,845
11,648
10,197
stress
40
83
38,995
28,725
10,270
idle
50
78
22,113
11,960
10,153
stress
50
94
40,644
30,194
10,450
Figure 3-2 LX2160A part numbering system

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Linux Stress: stressapptest (https://github.com/stressapptest/stressapptest) (start
parameters: -M 8192 -s 120, all cores)
Linux idle: without power optimization –based on LSDK 20.12 (U-Boot + AFT),
LSDK 20.04 (Linux) without modifications.
3.5 Cooling
The cooling solution needs to be designed with the final use case in mind. If
desired, MicroSys Electronics GmbH can support you with your cooling concept.
Please ask your sales representative or send an email inquiry to
[e-mail].
The following maximum component temperatures should not be exceeded.
Commercial temperature grade (0/+70° C) variants:
Component
Temperature
(max.)
Description
SoC
105° C
Junction Temperature
SoC
70° C
Junction Temperature during secure fuse programming
DDR
85° C
Case Temperature
Core Regulator
150° C
Junction Temperature
Table 3-2 Commercial grade variants: maximum temperature
Industrial temperature grade (-40/+85° C) variants:
Component
Temperature
(max.)
Description
SoC
105° C
Junction Temperature
SoC
70° C
Junction Temperature during secure fuse programming
DDR
95° C
Case Temperature
Core Regulator
150° C
Junction Temperature
Table 3-3 Industrial grade variants: maximum temperature
3.6 Ordering Information
Ordering information can be found on the following website
miriac MPX-LX2160A
or contact your local sales representative.

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4 Technical Description
4.1 Connector References
Reference
Function
Ass
Mating Parts
ST1
Module connector
Samtec
SEAF-50-05.0-L-08-2-A-K-TR
✓
SEAM-50-02.0-L-08-2-A-K-TR
ST2
Module connector
Samtec
SEAF-50-05.0-L-08-2-A-K-TR
✓
SEAM-50-02.0-L-08-2-A-K-TR
ST3
SODIMM
TE-2309409-2
SODIMM module
ST4
SODIMM
TE-2309409-2
SODIMM module
ST5
Fan connector
Würth Electronic
WE-648-104-131-822
✓
WE-648-104-113-322
ST6
Fan connector
Würth Electronic
WE-648-104-131-822
✓
WE-648-104-113-322
ST7
Programming connector
Würth Electronic
WE-648-104-131-822
✓
WE-648-104-113-322
Table 4-1 Connector reference overview
The Samtec board-to-board connectors allow for some mounting height
adjustment. Not all mated height combinations are permitted, however. The
following figure shows mating combinations.
Figure 4-1 Samtec –Mated Heights

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4.2 Module Connector Pinout and Electrical
Characteristics
The signal direction is from the module’s view. For example TDO (pin ST1:A19) is an
output from the module and an input to peripheral devices on the carrier board.
The following pinout is specific to the MPX-LX2160A module and its variants.
Nevertheless, different variants do not claim to be pin compatible. Individual modules
may have deviating assignments for some functions, however power and ground are
always assigned to the same pins.
For detailed connector pinning, as well as electrical characteristics (such as series
and parallel elements, impedances, signal lengths, etc.) refer to the spreadsheet:
“Pinning-Modulstecker_R2.xls”
4.3 Connectors on Module
4.3.1 Fan Connectors [ST5, ST6]
There are 2 identical connectors:
Part:
ST5, ST6
Manufacturer:
Würth Electronic
Type:
WE-648-104-131-822
mating
WE-648-104-113-322
ST5 / ST6
Pin
Signal
I/O
Range
Signal Conditioning
1
GND
2
VFAN
5/12V
Power supply
3
TACHO
5V
Speed of fan
4
PWM
5V
Controls fan speed
Table 4-2 Fan connector: Pinout and pin assignments

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4.3.2 Programming Connector [ST7]
Programming connector for management engine (ME) microcontroller. Production
use at MicroSys - do not use unless instructed by MicroSys.
Part:
ST7
Manufacturer:
Würth Electronic
Type:
WE-648-106-131-822
mating
WE-648-104-113-322
ST7
Pin
Signal
I/O
Range
Signal Conditioning
1
GND
2
SWDIO
3,3V
For production use only
–do not connect
3
SWCLK
3,3V
For production use only
–do not connect
4
SOUT1
RS232
For production use only
–do not connect
5
SIN1
RS232
For production use only
–do not connect
6
GND
Table 4-3 Programming Connector: Pinout and pin assignments

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4.4 Management Engine (ME)
The management engine is handled by a Renesas S128 microcontroller
R7FS128783A01CFM.
The microcontroller (µC) is responsible for power sequencing and supervision,
configuration of on-board supplies, voltage monitoring and safety as well as
security aspects.
The microcontroller’s firmware can be modified for customer specific applications
on request.
4.4.1 System Startup
On application of an input voltage, the µC is the first component to start (once VIN
>= 3.0V). The uC runs the initialization and setup for
•Clock Generator
•Temperature Sensor Limits
•Fan Controller
•Checking programmed values of Power Switches for VDD and VDDQ
After a successful setup and check, the uC will start the Power Sequencer which
monitors all Power Rails. Next, the VDD and VDDQ are ramped up, so that the
SoC is powered. Finally, the CPLD is instructed to select the RCW source and
release the PowerOn Reset to the SoC.
The complete System Startup Sequence takes around 240msec.
4.4.2 System Monitoring
The ME is one part of the complex System Monitoring. Others are
•Power Switches for VDD and VDDQ are monitoring their own voltages.
•Power Sequencer checks voltages are in range (see 4.6.1).
•Temperature Sensors are monitoring temperatures against set limits.
The components are all able to shut down the system on their own. The ME
collects all information for 'black box recording' of emergency shutdowns.
The SoC fan speed is determined by SoC temperature readings.
All the different voltage, fan and temperature sensors are read by the ME in a
cyclic loop. By setting lower limits than those used for a hard shutdown, the ME
can react earlier to potential problems and inform the SoC thus allowing it to take
evasive action.

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4.4.3 XML Configuration
The ME is setting and monitoring the various sensors in the System based on an
XML configuration file. This XML file is parsed and included in the Firmware during
compilation - this saves memory that would otherwise be consumed in the µC. In a
future version of Firmware, it is planned to have an upload option for an externally
generated configuration.
Example for setting the SoC Temperature Sensor limits:
<!-- Temp Sensor. Local Chip Sensor -->
<sensor name="MON_CPU_L" number="21" interval="1000"
flags="dont_check"
record="analog"
bus="I2C0"
address="0x48"
device="sa56004">
<formula
raw="(value/0.125)*32.0"
cooked="(value/32.0)*0.125"/>
<!-- The limits are set to the ALERT Temperature if mux==0xFF
T_CRIT will be set 15.0C above ALERT if mux==0xFF
Otherwise set by Format B mux value -->
<limits mode="cooked" lower="-20.0" upper="85.0"/>
<port instance="A"><!-- Format A = read temp -->
<pin number="0x00"/><!-- Local Temp High Register -->
<pin number="0x22"/><!-- Local Temp Low Register -->
<pin number="0x02"/><!-- Status Register -->
</port>
<port instance="B"><!-- Format B = setpoint write register -->
<pin number="0x0B" mux="0xFF"/><!-- Local High Setpoint Register = upper -->
<pin number="0x0C" mux="0xFF"/><!-- Local Low Setpoint Register = lower -->
<pin number="0x20" mux="0xFF"/><!-- Local T_CRIT Setpoint Register = upper+15 -->
</port>
</sensor>
The sensor MON_CPU_L will be read every 1000msec from the I²C device
SA56004 at 0x48. The above example sets the Warning temperature to 85°C and
Critical Alert to 85+15°C = 100°C. The user can modify these values depending on
the chosen cooling solution.

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4.4.4 Command Console
As the ME is monitoring a lot of sensors and setting up the surrounding
components, a command console has been added to the ME to configure, upload,
view and modify the setup. In production systems, the command console is used to
upload CPLD images and setup the Power Sequencer.
The command console uses 115200Bd, 8N1, no handshake. Startup messages
are kept short to reduce System boot time:
MPX-LX2160A MCU
Coldstart (Power-On-Reset)
82: PWR_UP_START
87: PWR_UP_CHECK_VIN
93: PWR_UP_SWITCH_ON
112: PWR_UP_ON_DELAY
117: PWR_UP_VIN_EN
120: check_limits complete
156: set PWR_UP_DONE
=>
The example above shows a Coldstart. The numbers at the beginning of a line
show milliseconds since start of the µC. In this example the Power Up Done is set
after 156msec. Then the Power Sequencer ramps all the Power Rails step by step.
=> Is the command prompt.
The following examples are showing the values for the Module on a CRX08-R1
and ME version 0.5:
=> version
ME Information:
Manufacturer: MicroSys Electronics GmbH
Product : Management Engine MCU on LX2160A
Version : 0.5 for MPX-LX2160A
4.4.4.1 Command overview and help
=> ?
Commands in this monitor
help: show commands
?: show commands
status: board status
clock_cfg: show clock generator (Si5332) configuration
power_off: set power off
power_on: set power on
power_cfg: show power switch (ISL68301) configuration
power_bb_erase: erase power sequencer (ADM1266) BlackBox Log. Usage:
power_seq_erase <key>
power_bb: show power sequencer (ADM1266) Black Box Log
power_seq: show power sequencer (ADM1266)
power: show power
vdd_on: switch VDD 0.8V on
vdd_off: switch VDD 0.8V off
quiet: Don't monitor anything on I2C and PMBUS until hit Return
monitor: show all controller status
fan: show fan
temp: show temperatur
oszi: Oszilloskop VDD-Pout VDDQ-Pout TP2-Temperature
cpld_flash: show SPI-NOR Flash information for CPLD
Parameter: <load address (default 10000 (hex))>
cpld_download: download CPLD image via Kermit to SPI-NOR Flash
Parameter: <load address (default 10000(hex))>
cpld_dump: dump CPLD SPI-NOR Flashimage
Parameter: <load address (default 10000 (hex))>
cpld_erase: erase SPI-NOR Flash
cpld_reset: reset CPLD via PROGRAMN
cpld: show cpld status

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version: show versions
scan_i2c: Scan I2C Busses
write_seq_config: write ADM1266 Sequencer Configuration
write_seq_fw: write ADM1266 Sequencer Firmware and Configuration
write_seq_rtc: set ADM1266 RTC Time
read_seq_rtc: read ADM1266 RTC Time
config_isl68301: write the default ISL68301 Power Switch Configuration
rtc: read RTC or set RTC: rtc set year:month:day hour:min:sec
time: show time & date based on System Start Time
4.4.4.2 I²C Bus scanning
It will scan the 3 I²C busses of the µC and show all devices found. This is important
for debugging if an I²C chip is dead or a bus not reacting for some reason. The I2C-
SYSTEM is the I²C Bus connected to the LX2160A and can also be read from the
µC.
=> scan_i2c
I2C-MON-CFG:
20 2c 41 48 4a 4c 50 6a
I2C-SYSTEM:
42 48 4a 4c 50 51 55
I2C-PMBUS:
68 69 6a
4.4.4.3 Clock Generator Configuration
The Clock Generator is one of the first elements initialized by the ME. The
configuration can be read out:
=> clock_cfg
Si5332-GM3 Clock Information:
I2C Dev ID : 0x37
I2C Derivate: 0xd0
I2C Ana ID : 0x40
I2C ROM ID : 0x03
Dev PN Base : 0x00
Dev Revision: 0x31
Dev Grade : 0x01
Factory OPN : 0x000002
I2C_ADDR : 0x6a
Status : ACTIVE
PLLRefFreq : 25 MHz
VCOFreq : 2500 MHz
Out0 Freq : 125.000 MHz CMOS on positive output only 50 Ohm. Output Enabled
Out1 Freq : 100.000 MHz HCSL 50 Ohm (int. termination). Output Enabled
Out2 Freq : 0.000 MHz HCSL 50 Ohm (int. termination). Output Disabled
Out3 Freq : 100.000 MHz CMOS on positive output only 50 Ohm. Output Enabled
Out4 Freq : 100.000 MHz HCSL 50 Ohm (int. termination). Output Enabled
Out5 Freq : 100.000 MHz HCSL 50 Ohm (int. termination). Output Enabled
Out6 Freq : 100.000 MHz HCSL 50 Ohm (int. termination). Output Enabled
Out7 Freq : 100.000 MHz HCSL 50 Ohm (int. termination). Output Enabled
Out8 Freq : 100.000 MHz HCSL 50 Ohm (int. termination). Output Enabled
Out9 Freq : 161.132 MHz HCSL 50 Ohm (int. termination). Output Enabled
Out10 Freq : 156.250 MHz HCSL 50 Ohm (int. termination). Output Enabled
Out11 Freq : 156.250 MHz HCSL 50 Ohm (int. termination). Output Enabled
Please see 0 for the Clock Structure.
4.4.4.4 Power Switch (VDD and VDDQ)
Read out the Power Switch configuration for the VDD (0.85V) and VDDQ (1.2V)
switches.

Technical Description
miriac MPX-LX2160A User Manual
V1.4
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© MicroSys Electronics GmbH 2020
Two value types can be seen. One is the 'Cyclic updated Sensor' value, which are
the values monitored by the ME during runtime. The Register Values are the
values read during this command execution.
=> power_cfg
ISL68301 Power Switch Information:
ISL Device 0:
I2C Address = 0x68
DEVICE_ID = 0x49a02f00
Cyclic updated Sensor values:
VOUT nominal = 0.849V
VOUT trim = 0.000V
VIN = 12.312V
VOUT = 0.848V
IIN = 0.356A
IOUT = 4.546A
PIN = 4.476W
POUT = 3.847W
Register values:
OPERATION = 0x80
ON_OFF_CONFIG = 0x1e
VOUT_COMMAND = 0.849 V
READ_VOUT = 0.848 V
READ_IOUT = 4.445 A
VOUT_TRIM = 0.000 V
VOUT_MAX = 0.920 V
VOUT_OV_FAULT_LIMIT = 0.934 V
VOUT_OV_WARN_LIMIT = 0.917 V
VOUT_UV_FAULT_LIMIT = 0.658 V
VOUT_UV_WARN_LIMIT = 0.722 V
VIN_OV_FAULT_LIMIT = 16.000 V
VIN_OV_WARN_LIMIT = 15.500 V
VIN_UV_FAULT_LIMIT = 4.500 V
VIN_UV_WARN_LIMIT = 4.796 V
IOUT_OC_FAULT_LIMIT = 30.000 A
IOUT_OC_WARN_LIMIT = 21.000 A
IOUT_AVG_OC_FAULT_L = 24.000 A
READ_TEMPERATURE_1 = 47.750 C
READ_TEMPERATURE_2 = 0.000 C
READ_TEMPERATURE_3 = 46.562 C
FREQUENCY_SWITCH = 500.000 KHz
READ_FREQUENCY = 500.000 KHz
ISL Device 1:
I2C Address = 0x69
DEVICE_ID = 0x49a02f00
Cyclic updated Sensor values:
VOUT nominal = 0.849V
VOUT trim = 0.000V
VIN = 12.312V
VOUT = 0.848V
IIN = 0.359A
IOUT = 4.570A
PIN = 4.398W
POUT = 3.843W
Register values:
OPERATION = 0x80
ON_OFF_CONFIG = 0x1e
VOUT_COMMAND = 0.849 V
READ_VOUT = 0.849 V
READ_IOUT = 4.515 A
VOUT_TRIM = 0.000 V
VOUT_MAX = 0.920 V
VOUT_OV_FAULT_LIMIT = 0.934 V
VOUT_OV_WARN_LIMIT = 0.917 V
VOUT_UV_FAULT_LIMIT = 0.658 V
VOUT_UV_WARN_LIMIT = 0.722 V
VIN_OV_FAULT_LIMIT = 16.000 V

Technical Description
miriac MPX-LX2160A User Manual
V1.4
20/73
© MicroSys Electronics GmbH 2020
VIN_OV_WARN_LIMIT = 15.500 V
VIN_UV_FAULT_LIMIT = 4.500 V
VIN_UV_WARN_LIMIT = 4.796 V
IOUT_OC_FAULT_LIMIT = 30.000 A
IOUT_OC_WARN_LIMIT = 21.000 A
IOUT_AVG_OC_FAULT_L = 24.000 A
READ_TEMPERATURE_1 = 46.187 C
READ_TEMPERATURE_2 = 0.000 C
READ_TEMPERATURE_3 = 44.875 C
FREQUENCY_SWITCH = 500.000 KHz
READ_FREQUENCY = 500.000 KHz
ISL Device 2:
I2C Address = 0x6a
DEVICE_ID = 0x49a02f00
Cyclic updated Sensor values:
VOUT nominal = 1.199V
VOUT trim = 0.000V
VIN = 12.312V
VOUT = 1.199V
IIN = 0.139A
IOUT = 1.105A
PIN = 1.716W
POUT = 1.332W
Register values:
OPERATION = 0x80
ON_OFF_CONFIG = 0x1e
VOUT_COMMAND = 1.199 V
READ_VOUT = 1.199 V
READ_IOUT = 1.109 A
VOUT_TRIM = 0.000 V
VOUT_MAX = 1.339 V
VOUT_OV_FAULT_LIMIT = 1.319 V
VOUT_OV_WARN_LIMIT = 1.284 V
VOUT_UV_FAULT_LIMIT = 0.929 V
VOUT_UV_WARN_LIMIT = 1.020 V
VIN_OV_FAULT_LIMIT = 16.000 V
VIN_OV_WARN_LIMIT = 15.500 V
VIN_UV_FAULT_LIMIT = 4.500 V
VIN_UV_WARN_LIMIT = 4.796 V
IOUT_OC_FAULT_LIMIT = 30.000 A
IOUT_OC_WARN_LIMIT = 27.000 A
IOUT_AVG_OC_FAULT_L = 28.000 A
READ_TEMPERATURE_1 = 41.062 C
READ_TEMPERATURE_2 = 0.000 C
READ_TEMPERATURE_3 = 39.750 C
FREQUENCY_SWITCH = 500.000 KHz
READ_FREQUENCY = 500.000 KHz
4.4.4.5 Power Sequencer
This shows the state of the state-machine and the actual values of the voltage
sensors and signals the Power Sequencer is monitoring.
=> power_seq
Device ID n=3 421266
ADM1266 in Normal Mode
Chip Revision 3B
Bootload Revision 0.0.9
Firmware Revision 1.14.3
Status Word: $0000
STATUS_VOUT $00
STATUS_CML $00
ADM_STATUS_MFR_SPEC $04
PART_LOCKED: device is locked.
No Faults or Warnings in System
ADM1266 at Address 0x41 is refreshed 0 time(s) since power-up
ADM1266 at Address 0x41 saw CRC Error 0 time(s) since power-up
MFR_ID for ADM1266 at Address 0x41 is : Analo2