Table of Contents
1General Notes...................................................3
1.1 Warranty..............................................................3
1.2 Links.....................................................................3
1.3 Liability.................................................................3
1.4Offer to Provide Source Codeof Certain
Software...............................................................4
1.5 Symbols, Conventions and Abbreviations.....5
1.5.1 Symbols...............................................................5
1.5.2 Conventions........................................................5
1.6 Safety and Handling Precautions....................6
2Short Description.............................................7
3System Description.........................................8
3.1 Block Diagram....................................................8
3.2 System Components.........................................8
3.3 Ordering Information..........................................8
3.4 Power Consumption..........................................9
3.5 Cooling.................................................................9
4Technical Description...................................10
4.1 Pinouts...............................................................10
4.1.1 Module Connector –Top Pins.......................10
4.1.2 Module Connector –Bottom Pins..................15
4.2 Power Structure................................................20
4.3 Reset Structure.................................................21
4.4 Clock Structure.................................................22
4.5 Boot Mode Configuration................................25
4.6 LEDs...................................................................26
4.7 RTC....................................................................27
4.8 Temperature sensor........................................28
4.9 GPIO Expander................................................29
4.10 Serial Boot EEPROM (RCON).......................30
4.11 Electronic DIP Switch......................................31
4.12 Interface Description........................................33
4.12.1 Definition of “Primary Interfaces”...................33
4.12.2 JTAG..................................................................33
4.12.3 AURORA ...........................................................33
4.12.4 ADC....................................................................33
4.12.5 CAN....................................................................34
4.12.6 RGMII.................................................................34
4.12.7 ULPI (USB).......................................................35
4.12.8 I2C......................................................................35
4.12.9 QSPI (Flash)......................................................37
4.12.10 SPI......................................................................38
4.12.11 UART..................................................................38
4.12.12 LIN......................................................................38
4.12.13 FlexRay..............................................................38
4.12.14 SDHC.................................................................39
4.12.15 SerDes...............................................................40
5Mechanical Description................................42
5.1 Edge Connector................................................42
5.2 Previous Numbering Scheme.........................43
5.3 Current Numbering Scheme...........................43
5.4 Pin-Layout..........................................................44
5.5 Mounting/Unmounting......................................46
5.6 Board Outline....................................................47
5.7 Height.................................................................48
5.8 Thickness...........................................................48
5.9 Component Layout - Top Side.......................49
5.10 Component Layout –Bottom Side.................51
6Software............................................................53
6.1 U-Boot................................................................53
6.2 Operating System.............................................53
7SafetyRequirements And Protective
Regulations......................................................54
7.1 EMC....................................................................54
7.2 ESD....................................................................54
7.3 Reliability............................................................54
7.4 Climatic conditions...........................................55
7.5 RoHS..................................................................55
8General notes..................................................56
9History...............................................................57
10 Appendix ..........................................................58
10.1 Acronyms...........................................................58
10.2 Table of Figures................................................59
10.3 Table of Tables.................................................60
10.4 Pin Definitions –Top........................................61
10.5 Pin Definitions –Bottom..................................68
10.6 Pins not available for pinmultiplexing...........75
