iWave iW-RainboW-G25S Installation manual

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Snapdragon 820 SBC Hardware User Guide
iWave Systems Technologies Pvt. Ltd.
iW-RainboW-G25S
Snapdragon 820 Single Board Computer
Hardware User Guide

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Snapdragon 820 SBC Hardware User Guide
iWave Systems Technologies Pvt. Ltd.
Document Revision History
Document Number
iW-PRFDD-UM-01-R3.0-REL1.0-Hardware
Revision
Date
Description
1.0
23rd Sep 2017
Intial Release Version
PROPRIETARY NOTICE: This document contains proprietary material for the sole use of the intended recipient(s). Do
not read this document if you are not the intended recipient. Any review, use, distribution or disclosure by others
is strictly prohibited. If you are not the intended recipient (or authorized to receive for the recipient), you are
hereby notified that any disclosure, copying distribution or use of any of the information contained within this
document is STRICTLY PROHIBITED. Thank you. “iWave Systems Tech. Pvt. Ltd.”

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Snapdragon 820 SBC Hardware User Guide
iWave Systems Technologies Pvt. Ltd.
Disclaimer
iWave Systems reserves the right to change details in this publication including but not limited to any Product
specification without notice.
No warranty of accuracy is given concerning the contents of the information contained in this publication. To the
extent permitted by law no liability (including liability to any person by reason of negligence) will be accepted by
iWave Systems, its subsidiaries or employees for any direct or indirect loss or damage caused by omissions from or
inaccuracies in this document.
CPU and other major components used in this product may have several silicon errata associated with it. Under no
circumstances, iWave Systems shall be liable for the silicon errata and associated issues.
Trademarks
All registered trademarks, product names mentioned in this publication are the property of their respective owners
and used for identification purposes only.
Certification
iWave Systems Technologies Pvt. Ltd. is an ISO 9001:2015 Certified Company.
Warranty & RMA
Warranty support for Hardware: 1 Year from iWave or iWave's EMS partner.
For warranty terms, go through the below web link,
http://www.iwavesystems.com/support/warranty.html
For Return Merchandise Authorization (RMA), go through the below web link,
http://www.iwavesystems.com/support/rma.html
Technical Support
iWave Systems technical support team is committed to provide the best possible support for our customers so that
our Hardware and Software can be easily migrated and used.
For assistance, contact our Technical Support team at,
Email : support.ip@iwavesystems.com
Website : www.iwavesystems.com
Address : iWave Systems Technologies Pvt. Ltd.
# 7/B, 29th Main, BTM Layout 2nd Stage,
Bangalore, Karnataka,
India –560076

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Snapdragon 820 SBC Hardware User Guide
iWave Systems Technologies Pvt. Ltd.
Table of Contents
1. INTRODUCTION ..................................................................................................................................................7
1.1 Purpose .......................................................................................................................................................7
1.2 Snapdrgon 820 SBC Overview......................................................................................................................7
1.3 List of Acronyms ..........................................................................................................................................7
1.4 Terminlogy Description................................................................................................................................9
1.5 References...................................................................................................................................................9
1.6 Important Note..........................................................................................................................................10
2. ARCHITECTURE AND DESIGN ............................................................................................................................11
2.1 Snapdragon 820 SBC Block Diagram...........................................................................................................11
2.2 Snapdragon 820 SBC Features ...................................................................................................................12
2.3 Qualcomm APQ8096 CPU ..........................................................................................................................14
2.4 Power Management..................................................................................................................................14
2.4.1 PM8996 PMIC........................................................................................................................................14
2.4.2 PMI8996 Battery Charger.......................................................................................................................14
2.5 Memory.....................................................................................................................................................15
2.5.1 LPDDR4 RAM .........................................................................................................................................15
2.5.2 eMMC Flash...........................................................................................................................................15
2.5.3 Micro SD Connector slot.........................................................................................................................15
2.6 Audio/Video Feature .................................................................................................................................16
2.6.1 Audio IN/OUT Port.................................................................................................................................16
2.6.2 HDMI Port..............................................................................................................................................17
2.7 Communication Features...........................................................................................................................18
2.7.1 Wi-Fi and Bluetooth...............................................................................................................................18
2.7.2 GPS/GNSS..............................................................................................................................................19
2.7.3 USB 2.0 OTG Port...................................................................................................................................20
2.7.4 USB 3.0 OTG Port (Optional) ..................................................................................................................20
2.8 Serial Interface Features............................................................................................................................21
2.8.1 Debug UART Header ..............................................................................................................................21
2.9 On Board Switches.....................................................................................................................................22
2.9.1 ON/OFF Switch ......................................................................................................................................22
2.9.2 VOL+ SWITCH.........................................................................................................................................22
2.9.3 RST/VOL- SWITCH ..................................................................................................................................23
2.9.4 Forced USB Boot Selection Switch ..........................................................................................................23
2.10 I/O Connectors ..........................................................................................................................................24
2.10.1 30Pin I/O Connector...............................................................................................................................24
2.10.2 6Pin Connector.......................................................................................................................................26
3. TECHNICAL SPECIFICATION...............................................................................................................................27
3.1 Electrical Characteristics ............................................................................................................................27
3.1.1 Power Jack.............................................................................................................................................27
3.1.2 Battery Connector..................................................................................................................................28

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Snapdragon 820 SBC Hardware User Guide
iWave Systems Technologies Pvt. Ltd.
3.1.3 Power Consumption...............................................................................................................................29
3.2 Environmental Characteristics ...................................................................................................................30
3.2.1 Environmental Specification...................................................................................................................30
3.2.2 RoHS Compliance...................................................................................................................................30
3.2.3 Electrostatic Discharge...........................................................................................................................30
3.3 Mechanical Characteristics ........................................................................................................................31
3.3.1 Snapdragon 820 SBC Mechanical Dimensions ........................................................................................31
4. ORDERING INFORMATION................................................................................................................................32

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Snapdragon 820 SBC Hardware User Guide
iWave Systems Technologies Pvt. Ltd.
List of Figures
Figure 1: Snapdragon 820 SBC Block Diagram............................................................................................................11
Figure 2: Micro SD Connector....................................................................................................................................15
Figure 3: Audio IN/OUT Connector............................................................................................................................16
Figure 4: Micro HDMI Connector...............................................................................................................................17
Figure 5: WLAN/BT Antenna Connector ....................................................................................................................18
Figure 6: GPS Antenna Connector .............................................................................................................................19
Figure 7: Micro USB Connector .................................................................................................................................20
Figure 8: Debug UART Connector ..............................................................................................................................21
Figure 9: ON/OFF Switch ...........................................................................................................................................22
Figure 10: Volume + Switch.......................................................................................................................................22
Figure 11: RESET/Volume Switch...............................................................................................................................23
Figure 12: USB Boot Selection Switch ........................................................................................................................23
Figure 13: 30Pin I/O Connector .................................................................................................................................24
Figure 14: 6Pin Connector.........................................................................................................................................26
Figure 15: Power Jack................................................................................................................................................27
Figure 16: Battery Connector ....................................................................................................................................28
Figure 17: Mechanical dimension of Snapdragon 820 SBC Top View..........................................................................31
Figure 18: Mechanical dimension of Snapdragon 820 SBC- Side View........................................................................31
List of Tables
Table 1: Acronyms & Abbreviations.............................................................................................................................7
Table 2: Terminology ..................................................................................................................................................9
Table 3: Audio In/Out Jack Pin Out ............................................................................................................................16
Table 4: Debug UART Header Pin Out........................................................................................................................21
Table 5: 30Pin I/O Connector Pin Out........................................................................................................................24
Table 6: 6Pin Connector Pin Out................................................................................................................................26
Table 7: Power Input Requirement............................................................................................................................27
Table 8: Power Jack...................................................................................................................................................27
Table 9: Battery Connector Pin Out ...........................................................................................................................28
Table 10: Power Consumption ..................................................................................................................................29
Table 11: Environmental Specification.......................................................................................................................30
Table 12: Orderable Product Part Numbers...............................................................................................................32

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Snapdragon 820 SBC Hardware User Guide
iWave Systems Technologies Pvt. Ltd.
1. INTRODUCTION
1.1 Purpose
This document is the Hardware User Guide for the Snapdragon 820 SBC based on the Qualcomm APQ8096
Application processor (without Modem). This board is fully supported by iWave Systems Technologies Pvt. Ltd. This
Guide provides detailed information on the overall design and usage of the Snapdragon 820 SBC from a Hardware
Systems perspective.
1.2 Snapdrgon 820 SBC Overview
A single-board computer (SBC) is a complete computer built on a single circuit board, with microprocessor, memory,
input/output (I/O) and other features required of a functional computer. This concept is an off-the-shelf, Single-
Board-Computer that integrates all the core features of a common PC with form factor 56mm X 50mm.
1.3 List of Acronyms
The following acronyms will be used throughout this document.
Table 1: Acronyms & Abbreviations
Acronyms
Abbreviations
ARM
Advanced RISC Machine
BT
Bluetooth
CMOS
Complementary Metal-Oxide Semiconductor
CPU
Central Processing Unit
CSI
Camera Serial Interface
DSI
Display Serial Interface
eMMC
Enhanced Multi Media Card
GB
Giga Byte
Gbps
Gigabits per sec
GNSS
Global Navigation Satellite System
GPIO
General Purpose Input Output
GPS
Global Positioning System
I2C
Inter-Integrated Circuit
IC
Integrated Circuit
LPDDR
Low Power Double Data Rate
MHz
Mega Hertz
MIPI
Mobile Industry Processor Interface
PCB
Printed Circuit Board
PDM
Pulse Density Modulation
PoP
Package on Package
RF
Radio Frequency

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Snapdragon 820 SBC Hardware User Guide
iWave Systems Technologies Pvt. Ltd.
Acronyms
Abbreviations
RoHS
Restriction of Hazardous Substances
RTC
Real Time Clock
SBC
Single Board Computer
SD
Secure Digital
SDRAM
Synchronous Dynamic Random Access Memory
SPMI
Serial power management interface
TBD
To Be Defined
UART
Universal Asynchronous Receiver/Transmitter
USB
Universal Serial Bus
USB OTG
USB On The Go
V
Voltage
Wi-Fi
Wireless Fidelity

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Snapdragon 820 SBC Hardware User Guide
iWave Systems Technologies Pvt. Ltd.
1.4 Terminlogy Description
In this document, wherever Signal Type is mentioned, below terminology is used.
Table 2: Terminology
Terminology
Description
I
Input Signal
O
Output Signal
IO
Bidirectional Input/output Signal
CMOS
Complementary Metal Oxide Semiconductor Signal
DIFF
Differential Signal
LVDS
Low Voltage Differential Signal
OD
Open Drain Signal
OC
Open Collector Signal
Power
Power Pin
PU
Pull Up
PD
Pull Down
NA
Not Applicable
NC
Not Connected
Note: Signal Type does not include internal pull-ups or pull-downs implemented by the chip vendors and only includes
the pull-ups or pull-downs implemented On-SBC.
1.5 References
•APQ8096 Hardware User Manuals

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Snapdragon 820 SBC Hardware User Guide
iWave Systems Technologies Pvt. Ltd.
1.6 Important Note
In this document, wherever APQ8096 CPU signal name is mentioned, it is followed as per below format for easy
understanding.
•If CPU pin has multiplexing option and selected particular function, then the signal name is mentioned as
“Selected Function Name (GPIO Number)”
Example: BLSP8_UART_TX(GPIO_4)
In this signal, BLSP8_UART_TX is the functionality which we are using and GPIO_4 is the GPIO number.
•If CPU pin has multiplexing option and selected as GPIO function, then the signal name is mentioned as
“GPIO_Functionality Description(GPIO Number)”
Example: GPIO_TOUCH_INT(GPIO_125)
In this signal, TOUCH_INT is the GPIO functionality which we are using and GPIO_125 is the GPIO number.
•If CPU pin doesn’t have multiplexing option, then the signal name is mentioned as,
“Function name”
Example: SPMI_CLK
In this signal, functionality which we are using SPMI_CLK
Note: The above naming is not applicable for other signals which are not connected to CPU.

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Snapdragon 820 SBC Hardware User Guide
iWave Systems Technologies Pvt. Ltd.
2. ARCHITECTURE AND DESIGN
This section provides detailed information about the Snapdragon 820 SBC features and Hardware architecture with
high level block diagram.
2.1 Snapdragon 820 SBC Block Diagram
CPU
Snapdragon 820
(APQ8096)
USB1_HS
LPDDR4 PoP-3GB
(Upgradable)
iW-RainboW-G25S - Snapdragon 820 SBC Block Diagram
eMMC –32GB
(Upgradable)
MMC(8bit)
EBI0
EBI1
SDC1
LPDDR4 (64bit)
SDC2
PCIe0
SLIMbus
PCM1/
MI2S_1
PMIC
Interfaces
WiFi + BT BLSP2-UART
HDMI x 1
HDMI
USB Device x 1
SD (4bit)
GNSS
GNSS RF
Receiver
GNSS
MIPI_DSI0
I2C x 3
BLSP8-UART
UART x 1
MIPI_CSI0
Power to
Peripherals
SLIMbus
Audio
In/Out
PCIe
UART
PCM
Wi-Fi Antenna
GPS Antenna
Connector
Battery Header
Micro USB
Connector
Micro HDMI
Connector
Headphone
Jack
30pin I/O
Connector
Debug UART
Header CCI_I2C0,
BLSP7_I2C,
BLSP8_I2C
MIPI Camera x 1 (4lane)
MIPI Display x 1 (2lane)
PMIC &
Battery
Charger
5V
Control
Switches GPIOs
DMIC1
EAROP
GPIO
GPIO x 4
Audio Codec
Micro SD
Connector
6pin
Connector
GPIO x 2
USB3.0 x 1
USB_SS
USB TypeC
Connector
(Optional)
Power Jack
4.2V
Figure 1: Snapdragon 820 SBC Block Diagram

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Snapdragon 820 SBC Hardware User Guide
iWave Systems Technologies Pvt. Ltd.
2.2 Snapdragon 820 SBC Features
Snapdragon 820 SBC supports the following features.
CPU
•64-bit Quad Kryo Snapdragon 820 CPU
➢Dual Kryo cores Gold cluster @ (2.15 GHz)
➢Dual Kryo cores Silver cluster @ (1.6 GHz)
Power Management
•PM8996 PMIC
•PMI8996 Charger
Memory
•3GB LPDDR4 (Expandable to 6GB)
•32GB eMMC (Expandable to 128GB)
•Micro SD Slot
Audio/Video Features
•Audio In/Out Jack
•Micro HDMI Connector
Communication Features
•802.11ac Wi-Fi + BT BLE Module
•GPS/GNSS
•USB2.0 OTG Port through USB Micro B Connector
•USB3.0 OTG Port through USB Type-C Connector (Optional)
Serial Interface Features
•Debug UART through 3Pin Header
On Board Switches
•ON/OFF Switch
•VOL+ Switch
•RST/VOL- Switch
•Forced USB Boot selection Switch

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Snapdragon 820 SBC Hardware User Guide
iWave Systems Technologies Pvt. Ltd.
I/O Connectors
•30pin I/O Connector
➢MIPI CSI x 4 lanes
➢MIPI DSI x 2 lanes
➢I2C x 3 Ports
➢GPIOs (2nos)
•6pin Connector
➢Power Out : 4.2V,2A
➢Digital MIC Input
General Specification
•Power Supply : 4.2V,2A
•Power Jack & Battery Connector
•Form Factor : 56mm x 50mm

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Snapdragon 820 SBC Hardware User Guide
iWave Systems Technologies Pvt. Ltd.
2.3 Qualcomm APQ8096 CPU
The Snapdragon 820 SBC is based on APQ8096 CPU with built-in 64-bit ARMv8-compliant Quad Core (Dual Kryo Gold
cluster cores running @ 2.15 GHz and Dual Kryo Silver cluster cores running @ 1.6 GHz). The Kryo CPU uses
Qualcomm® Symphony System Manager as an intelligent resource management tool for Snapdragon that extends
control of task scheduling and power management across the entire processor.
The Hexagon 680 DSP enables the CPU to offload many tasks for more efficient processing. Featuring Qualcomm All-
Ways Aware™ technology, the Hexagon 680 DSP also allows for ultra-low power “always-on” sensors and advanced
low power-image processing.
The Adreno 530 in the Snapdragon 820 processor along with the Kryo CPU are capable of generating photorealistic
graphics for console-quality gaming and next-generation virtual reality apps, while delivering up to 40%
improvement to graphics performance and compute capabilities when compared to the Adreno 430.
2.4 Power Management
2.4.1 PM8996 PMIC
Snapdragon 820 SBC supports Qualcomm’s PM8996 PMIC for SBC power management. The versatile design is
suitable for multimode, multiband phones, and other wireless products such as data cards and PDAs. The PM8996
mixed-signal BiCMOS device is available in the 225-pin wafer-level nanoscale package (225 WLNSP) that includes
ground pins for improved electrical ground, mechanical stability, and thermal continuity.
The PM8996 PMIC provides all required power to APQ8096 CPU and on board peripherals. This PMIC supports up to
12 switch mode regulators, 32 linear regulators, on chip ADCs, Clock Sources, GPIOs and RTC charging.Dedicated
Serial power management interface (SPMI) used between CPU and PMIC for controlling and programming the PMIC.
2.4.2 PMI8996 Battery Charger
The PMI8996 battery charger supplements the PM8996 device to integrate all wireless power management
requirements. PMIC is powered through PMI8996 IC, the main power is directly connected to PMI8996 for Input
power management, Output power management, battery monitoring and charging.
The PMI8996 mixed-signal BiCMOS device is available in the 210-pin wafer-level nanoscale package (210 WLNSP)
that includes ground pins for improved electrical ground, mechanical stability, and thermal conductivity.

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Snapdragon 820 SBC Hardware User Guide
iWave Systems Technologies Pvt. Ltd.
2.5 Memory
2.5.1 LPDDR4 RAM
The Snapdragon 820 SBC supports 3GB LPDDR4 RAM in PoP package by default. The PoP memory provides four 16-
bit channels combining to form two 32-bit channels on the CPU. The package-on-package implementation adds
LPDDR4 SDRAM memory without increasing the device’s footprint or PCB area. APQ8096 CPU is the first QTI device
to support LPDDR4 memory. Each LPDDR4 die contains two independent channels as specified by JEDEC and
supports for 6 Gb/8 Gb/12 Gb/16 Gb LPDDR4 SDRAM device. The RAM size can be expandable upto 6GB.
2.5.2 eMMC Flash
The Snapdragon 820 SBC supports 32GB eMMC as default boot device and storage. This is connected to SDC1
controller of the APQ8096 CPU and operates at 1.8V (I/O supply) and 2.95V (NAND core supply) Voltage levels.
The eMMC flash (U15) memory is physically located on bottom side of the SBC. The memory size of the eMMC Flash
can be expandable and the APQ8096 CPU supports eMMC version 5.1V
2.5.3 Micro SD Connector slot
The Snapdragon 820 SBC supports Micro SD slot which can be used to connect Micro SD card as Mass storage. Micro
SD card connector (J11) is directly connected to the SDC2 controller of the APQ8096 CPU. The main power to Micro
SD Card Connector is 2.95 Voltage. Micro SD Connector is physically located on bottom side of the Snapdragon 820
SBC as shown below.
Figure 2: Micro SD Connector

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Snapdragon 820 SBC Hardware User Guide
iWave Systems Technologies Pvt. Ltd.
2.6 Audio/Video Feature
2.6.1 Audio IN/OUT Port
Snapdragon 820 SBC supports Audio In/Out through on board Audio codec WCD-9335 from Qualcomm. This audio
codec is interfaced with APQ8096 CPU through SLIMbus interface. WCD-9335 audio codec can support up to Six
audio analog-to-digital converters (ADCs) and seven digital-to-analog converters (DACs), Six digital microphone
inputs (three clock/data pairs) and Multi-button headset control (MBHC) for smart accessory detection features
Snapdragon 820 SBC supports one 3.5mm stereo Headphone Jack to support Headphone In/Out. This Headphone
In/Out Jack (J3) is physically located at the top of the board as shown below. Also Snapdragon 820 SBC supports
DMIC1 interface from WCD-9335 on 6Pin connector (J5) to support digital mic input and Earphone Output from
WCD-9335 on 30Pin I/O connector (J4) to support audio output. Refer Section 2.10.1 and 2.10.2 for DMIC1 &
Earphone Output interface pinout details.
Figure 3: Audio IN/OUT Connector
Table 3: Audio In/Out Jack Pin Out
Pin
No
Pin Name
Signal Name
Signal Type /
Termination
Description
1
HPH_L
HPH_L
O, Analog
Headphone Output Left.
2
HPH_R
HPH_R
O, Analog
Headphone Output Right.
3
HSDET_L
HSDET_L
I, Analog
Headphone Detection.
4
MIC
AMIC
I, Analog
Microphone Input Signal.
5
GND
HPH_REF
Power
Ground.

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Snapdragon 820 SBC Hardware User Guide
iWave Systems Technologies Pvt. Ltd.
2.6.2 HDMI Port
The Snapdragon 820 SBC supports HDMI 2.0 output connector for HDMI interface. HDMI signals from APQ8096 CPU
are connected to Micro HDMI Type-D port with protection circuitry. This Micro HDMI Type-D port (J2) is physically
located on top side board as shown below.
APQ8096 CPU’s HDMI 2.0 output supports,
•1080p at 60 Hz refresh; 24-bit RGB color
•4k × 2k at 60 fps + 4k × 2k at 30 fps HDMI
•Up to 8-channel audio for 7.1 surround sound
•Dolby Digital Plus, Dolby True-HD, and DTS-HD Master
Figure 4: Micro HDMI Connector

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Snapdragon 820 SBC Hardware User Guide
iWave Systems Technologies Pvt. Ltd.
2.7 Communication Features
2.7.1 Wi-Fi and Bluetooth
The Snapdragon 820 SBC is integrated with Wi-Fi & Bluetooth combo module from FOXCONN. This WiFI/BT module
is based on Qualcomm Atheros’s QCA6174A-1 chipset and interfaced with CPU through PCIe and UART interface.
APQ8096 CPU’s PCIe0 interface is used for WLAN and BLSP2-UART interface is used for BT.
Wi-Fi & Bluetooth module supports,
•WLAN dual-band 2x2 11a/b/g/n/ac and Bluetooth V4.1
•Support WLAN 20MHz/40MHz at 2.4GHz and 20/40/80 MHz at 5GHz
•Support BT4.1+HS, BLE and be backwards compatible with BT1.x,2.x+EDR.
•Support BT for class 1 power level transmissions without requiring an external PA.
•Support BT-WLAN coexistence.
Two antenna connectors (ANT1 for WLAN/BT and ANT2 for WLAN only) are available on the module to connect
external antennas. MHF-4 Micro RF Coax connectors are used for interfacing the RF antenna as shown below.
Receptacle: 20449-001E from IPEX
Example Mating Antenna Cable: FXP830.24.0100B from Taoglas
Figure 5: WLAN/BT Antenna Connector

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Snapdragon 820 SBC Hardware User Guide
iWave Systems Technologies Pvt. Ltd.
2.7.2 GPS/GNSS
The Snapdragon 820 SBC supports GPS/GNSS through Qualcomm WGR7640 chipset. The WGR7640 IC is a dedicated
GNSS RF receiver for GPS, GLONASS and COMPASS operations and fabricated using an advanced RF CMOS process
that accommodates high-frequency, high-precision analog circuits and low-power CMOS functions. The GNSS
receiver supports input frequency 1574.42 MHz to 1576.42 MHz for GPS and 1598 MHz to 1606 MHz for GLONASS.
RF antenna need to be connected for better GPS locking function. MHF-4 Micro R Coax connector (J12) is used for
interfacing the GPS antenna as shown in below figure. Also connector details mentioned below.
Receptacle: 20449-001E from IPEX
Example Mating Antenna Cable: FXP830.24.0100B from Taoglas
Figure 6: GPS Antenna Connector

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Snapdragon 820 SBC Hardware User Guide
iWave Systems Technologies Pvt. Ltd.
2.7.3 USB 2.0 OTG Port
The Snapdragon 820 SBC supports USB 2.0 OTG port through USB Micro B connector (J1). APQ8096 CPU’s USB1
interface is used for USB OTG port. This port can also be used for Forced USB boot mode of APQ8096 CPU where we
can program the boot device & debug the CPU.
The Power from USB Micro B Connector (J1) is connected to PMI8996 Battery charger IC as input power to Charge
the battery if supported. The USB Micro B Connector (J1) is physically located on top side board edge of the SBC as
shown in figure.
Figure 7: Micro USB Connector
2.7.4 USB 3.0 OTG Port (Optional)
The Snapdragon 820 SBC optionally supports one USB3.0 OTG port through USB TypeC connector (J10). APQ8096
CPU’s USB1 super speed USB3.0 interface and USB2 high speed USB2.0 interface is used for USB3.0 OTG port. Also
Snapdragon 820 SBC supports reversible cable insertion functionality for USB Type C connector a per Type C
specification. The USB Type-C connector (J10) is optional feature and default not populated.
Note: To add support of this optional feature in Snapdragon 820 SBC, please contact iWave Systems.
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