Mitsubishi Electric Melsec A Series User manual

MELSEC A/Q Series
Programmable Logic Controller
Manual
Analog Input Module
A68ADN
FACTORY AUTOMATION
MITSUBISHI ELECTRIC EUROPE B.V.

REVISIONS
*The manual number is given on the bottom left ofthe back cover.
Print Date *Manual Number Revision
Jul., 1991 IB (NA) 66307-A First edition
Jul., 1992 IB (NA) 66307-B Correction
Sections 3.2 (Table 3.2), 4.2, 5.3 , APPENDIX 2
Jun., 1994 IB (NA) 66307-C Correction
Sections 4.2, 5.1, APPENDIX 2
Addition
Section 2.2

•
••
•SAFETY PRECAUTIONS •
••
•
(Read these precautions before using.)
When using Mitsubishi equipment, thoroughly read this manual and the associated manuals introduced in
this manual. Also pay careful attention to safety and handle the moduleproperly.
These precautions apply only to Mitsubishi equipment. Refer to the CPU module user'smanual for a
description of the PC system safety precautions.
These SAFETY PRECAUTIONS classify the safety precautions into two categories: "DANGER" and
"CAUTION".
DANGER Procedures which may lead to a dangerous condition and cause death or serious
injury if not carried out properly.
CAUTION Procedures which may lead to a dangerous condition and cause superficial to
medium injury, or physical damage only, if not carried out properly.
Depending on circumstances, procedures indicated by CAUTION may also be linked to serious results.
In any case, it is important to follow the directions for usage.
Store this manual in a safe place so that you can take it out andread it whenever necessary.
Always forward it to the end user.

[System Design Precautions]
DANGER
•Safety circuits should be installed external to the programmable controller to ensure that the system as a
whole will continue to operate safely in the event of an external power supply malfunction or a
programmable controller failure.
Erroneous outputs and operation could result in an accident.
1) Thefollowing circuitry should be installed outside the programmable controller:
Interlock circuitry for the emergency stop circuit protective circuit, and for reciprocal operations such
as forward/reverse, etc., and interlock circuitry for upper/lower positioning limits,etc., to prevent
machine damage.
2) When the programmable controller detects an abnormal condition, processing is stopped and all
outputs are switched OFF. This happens in the following cases
•When the power supply module's over-current or over-voltage protection device is activated
•When an error (watchdog timererror, etc.) is detected at the PC CPU by the self-diagnosis
function.
Some errors, such as input/output control errors, cannot be detected by the PC CPU, and there may
be cases when all outputs are turned ON when such errors occur. In order to ensure that the
machine operates safely in such cases,a failsafe circuit or mechanism should be provided outside
the programmable controller. Refer to the CPU module user's manual for an example of such a
failsafe circuit.
3) Outputs may become stuck at ON or OFF due to an output module relay or transistor failure. An
external circuit should therefore be provided to monitor output signals whose incorrect operation
could cause serious accidents.
•A circuit should be installed which permitsthe external power supply to be switched ON only after the
programmable controller power has been switched ON. Accidents caused by erroneous outputs and
motion could result if the external power supply is switched ON first.
•When a data link communication error occurs, the status shown below will be established at the faulty
station. In order to ensure that the system operates safely at such times, an interlock circuit should be
provided in the sequence program (using the communication status information).
Erroneous outputs and operation could result in an accident.
1) The data link data which existed prior to the error will be held.
2) All outputs will be switched OFF at MELSECNET (II, /B, /10) remote I/Ostations.
3) At the MELSECNET/MINI-S3 remote I/O stations, all outputs will be switched OFF or output statuses
will be held, depending on the E.C. mode setting.
For details on procedures for checking faulty stations, and for operation statuses when such errors
occur, refer to the appropriate data link manual.

[System Design Precautions ]
CAUTION
•Do not bundle control lines or communication wires together with main circuit or power lines, or lay them
close to these lines.
As a guide, separate the lines by a distance of at least 100 mm, otherwise malfunctions may occur due
to noise.
When file register R that are outside the range are read, e.g. by a MOV instruction, the file register data
will become FFFFHand use of this data will cause malfunctions. Take care not to use file registers that
are outside the range when designing programs
For details on instructions, refer to the Programming Manual.
[Cautions on Mounting]
CAUTION
•Use the PC in an environment that conforms to the general specifications in the manual.
Using the PC in environments outside the ranges stated in the general specifications will cause electric
shock, fire, malfunction, or damage to/deterioration of the product.
•Make sure that the module fixing projection on the base of the module is properly engaged in the
module fixing hole in the base unit before mounting the module.
Failure to mount the module properly will result in malfunction or failure, or in the module falling.
•Extension cables should be securely connected to base unit and module connectors. Check for loose
connection after installation
A poor connection could result in contact problems and erroneous inputs/outputs.
•Plug the memory card firmly into the memory card mounting connector. Check for loose connection after
installation. A poor connection could result in erroneous operation.

[Cautions on Wiring]
DANGER
•Switch off the external power supply before staring installation and wiring work
Failure to do so could result in electrical shocks and equipment damage.
•After installation and wiring is completed, be sure to attach the terminal cover before switching the power
ON and starting operation
Failure to do so could result in electrical shocks.
CAUTION
•Be sure to ground the FG and LG terminals, carrying out at least class 3 grounding work with a ground
exclusive to the PC.
Otherwise there will be a danger of electric shock and malfunctions.
•Carry out wiring to the PC correctly, checking the rated voltage and terminal arrangement of the product.
Using a power supply that does not conform to the rated voltage, or carrying out wiring incorrectly, will
cause fire or failure.
•Outputs from multiple power supply modules should not be connected inparallel. Failure to do so could
cause the power supply module to overheat, resulting in a fire or module failure.
•Tighten the terminal screws to the stipulated torque.
Loose screws will cause short circuits, fire, or malfunctions.
•Make sure that no foreign matter such as chips or wiring offcuts gets inside the module. It will cause fire,
failure or malfunction.
•Connectors forexternal connections should be crimped, pressure welded, or soldered in the correct
manner using the correct tools
For details regarding crimping and pressure welding tools, refer to the input/output module user's
manual.
A poor connection could cause shorts, fire, and erroneous operation.

[Cautions on Startup and Maintenance]
DANGER
•Do not touch terminals while the power is ON.
This will cause malfunctions.
•Make sure that the battery is connected properly. Do not attempt to charge or disassemble the battery,
do not heat the battery or place it in a flame, and do not short or solder the battery.
Incorrect handling of the battery can cause battery heat generation and ruptures which could result in
fire or injury.
•Switch the power off before cleaning or re-tightening terminal screws.
Carrying out this work while the power is ON willcause failure or malfunction of the module.
CAUTION
•In order to ensure safe operation, read the manual carefully to acquaint yourself with procedures for
program changes,forced outputs, RUN,STOP,and PAUSE operations, etc., while operation is in
progress.Incorrect operation could result in machinefailure and injury.
•Do not disassemble or modify any module.
This will cause failure, malfunction, injuries, or fire.
•Switch the power OFF before mounting or removing the module.
Mounting or removing it with the power ON can cause failure or malfunction of the module.
•When replacing fuses, be sure to use the prescribed fuse.
A fuse of the wrong capacity could cause a fire.
[Cautions on Disposal]
CAUTION
•Dispose of this product as industrial waste.

−i −
CONTENTS
1. INTRODUCTION.......................................................................................................................1 −
−−
−1 ~ 1 −
−−
−2
1.1 Features......................................................................................................................................1 −1
2. SYSTEM CONFIGURATIONS..................................................................................................2 −
−−
−1 ~ 2 −
−−
−3
2.1 Overall Configurations.................................................................................................................2 −1
2.2 Applicable Systems.....................................................................................................................2 −3
3. SPECIFICATIONS ..................................................................................................................3 −
−−
−1 ~ 3 −
−−
−18
3.1 General Specifications................................................................................................................3 −1
3.2 Performance Specifications ........................................................................................................3 −2
3.3 I/O Conversion Characteristics...................................................................................................3 −3
3.3.1 Voltage input characteristics..........................................................................................3 −4
3.3.2 Current input characteristics..........................................................................................3 −5
3.3.3 Relationship between the offset/gain setting and the digital output values...................3 −6
3.4 Functions ....................................................................................................................................3 −9
3.5 Maximum Conversion Speed....................................................................................................3 −10
3.5.1 Conversion speed per channel....................................................................................3 −10
3.5.2 Influence of [FROM]/[TO] instruction executions on maximum conversion speed. .....3 −10
3.6 I/O List for PC CPU...................................................................................................................3 −11
3.7 Buffer Memory ..........................................................................................................................3 −13
3.7.1 A-D conversion-enabled/disabled setting ....................................................................3 −14
3.7.2 Setting for sampling processing/averaging processing ...............................................3 −15
3.7.3 Digital output values.....................................................................................................3 −17
3.7.4 Write data error code...................................................................................................3 −17
3.7.5 A-D conversion-completion flag...................................................................................3 −18
3.7.6 Setting resolution.........................................................................................................3 −18
4. PRE-OPERATION SETTINGS AND PROCEDURES..............................................................4 −
−−
−1 ~ 4 −
−−
−5
4.1 Handling Instructions..................................................................................................................4 −1
4.2 Nomenclature..............................................................................................................................4 −2
4.3 Offset/Gain Settings....................................................................................................................4 −3
4.4 Wiring..........................................................................................................................................4 −5
4.4.1 Wiring instructions .........................................................................................................4 −5
4.4.2 Module connection example..........................................................................................4 −5
4.5 Inspection and Maintenance.......................................................................................................4 −5
5. PROGRAMMING......................................................................................................................5 −
−−
−1 ~ 5 −
−−
−9
5.1 Initial setting program and digital output value read program.....................................................5 −1
5.2 Sample programs when the A68ADN is loaded onto remote I/O station ...................................5 −3
5.3 Sample program when an A68ADN is loaded to a remote I/O station
(using AnACPU dedicated instructions).....................................................................................5 −7

−ii −
6. TROUBLESHOOTING..............................................................................................................6 −
−−
−1 ~ 6 −
−−
−2
6.1 Error Code Table.........................................................................................................................6 −1
6.2 Troubleshooting...........................................................................................................................6 −2
6.2.1 RUN LED (A68ADN) is flashing.....................................................................................6 −2
6.2.2 RUN LED (A68ADN) is OFF..........................................................................................6 −2
6.2.3 Digital output value cannot be read ...............................................................................6 −2
APPENDICES .......................................................................................................................APP −
−−
−1 ~ APP −
−−
−2
APPENDIX 1 Comparison of A68ADN and A68AD/A68AD-S2/A616AD Functions......................APP −1
APPENDIX 2 External Dimensions.................................................................................................APP −2

1. INTRODUCTION
1 −1
MELSEC-A
1. INTRODUCTION
This manual gives specifications, handling, programming procedures, etc. for the
A68ADN analog to digital converter module (hereafter called the A68ADN) for use
with MELSEC-A series PC CPU modules.
An A68ADN converts analog signals (voltage or current) into 16-bit, signed binary
digital values, as shown in the following figure.
A chart showing differences between the A68ADN and the A68AD, A68AD-S2, and
A616AD is given in Appendix 1.
1.1 Features
(1) 8-channel analog to digital (hereafter A-D) conversion is possible with a single
module.
The A616ADN has 8-channel A-D conversion capability, with each channel
selectable for voltage or current input.
(2) 1/12000 high resolution (all channels)
Resolution is selectable from 1/4000, 1/8000, and 1/12000. High resolution
digital values can be obtained. Resolution setting applies to all channels.
(3) Averaging processing by designating time or frequency (for each channel)
In addition to sampling processing (in which the digital value obtained in A-D
conversion is output each time the A-D conversion is executed) averaging
processing can be done in a designated time or frequency. The A-D conversion
mode is selectable for each channel.
PC CPU
TO instruction
FROM
instruction
Initial setting
(averaging
processing
designation,
etc.)
Digital value
read
FROM
Instruction
Digital value
read
Setting data
Digital value
Digital value
Buffer memory
A68ADN
(Input terminal)
Channel 1
Channel 8
0 to ±10 V or
0 to ±20 mA Analog
output
device
0 to ±10 V or
0 to ±20 mA Analog
output
device
Analog to digital conversion
Figure 1.1 Analog to Digital Conversion

1. INTRODUCTION
1 −2
MELSEC-A
(4) Conversion enable/disable setting (for each channel)
Whether A-D conversion is enabled or disabled can be set for each channel. By
setting "disable" for the unused channels, conversion speed can be increased.
(5) Offset/gain adjustment without dials (for each channel)
Offset and gain can be set by simply inputting the required value (voltage or
current) and turning the setting switch ON.

2. SYSTEM CONFIGURATIONS
2 −1
MELSEC-A
2. SYSTEM CONFIGURATIONS
2.1 Overall Configurations
(1) Figure 2.1 shows the overall system configuration when the A68ADN is used
with a building block-type PC CPU
Fig.2.1 Overall Configuration Using a Building Block–Type PC CPU
Main base unit
Type A38B A35B
A32B
Extension cable
Type AC06B AC12B
AC30B
Extension base unit
Type
A68B
A65B
A58B
A55B
RUN
A
CH.
68ADN
OFFSET
GAIN
38
1
2 3
4 5
6 7
8 9
10 11
12 13
14 15
16 17
18 19
20 21
22 23
24 25
26 27
28 29
30 31
32
37
34
33
35
36
1
3
TEST
ANALOG
GND
AD
0
V.
I.
FG
COM
V.
I.
FG
COM
V.
I.
FG
COM
V.
I.
FG
COM
V.
I.
FG
COM
V.
I.
FG
COM
V.
I.
FG
COM
C
H
C
H
C
H
C
H
C
H
C
H
C
H
8
7
6
2
3
4
5
V.
I.
FG
COM
C
H
1
10V
4~20mA
A-D converter module
Type A68ADN
Building block-type
PC CPU

2. SYSTEM CONFIGURATIONS
2 −2
MELSEC-A
(2) Figure 2.2 shows the overall system configuration when the A68ADN is used
with a compact-type PC CPU
Fig. 2.2 Overall Configuration Using a Compact-Type PC CPU
Compact-typ
PC CPU
I/O cable
Type A0J2C01 A0J2C03
A0J2C10
A0J2 I/O module
Type 
Extension cable
Type A0J2C04B
A0J2C10B
A–D converter module
Type A68ADN
RUN
A
CH.
68ADN
OFFSET
GAIN
38
1
2 3
4 5
6 7
8 9
10 11
12 13
14 15
16 17
18 19
20 21
22 23
24 25
26 27
28 29
30 31
32
37
34
33
35
36
1
3
TEST
ANALOG
GND
A D
0
V.
I.
FG
COM
V.
I.
FG
COM
V.
I.
FG
COM
V.
I.
FG
COM
V.
I.
FG
COM
V.
I.
FG
COM
V.
I.
FG
COM
C
H
C
H
C
H
C
H
C
H
C
H
C
H
8
7
6
2
3
4
5
V.
I.
FG
COM
C
H
1
10V
4~20mA
Extension base unit
Type
A68B
A65B
A58B
A55B

2. SYSTEM CONFIGURATIONS
2 −3
MELSEC-A
2.2 Applicable Systems
The A68ADN can beused for the systems indicated below. Please note that
installation of the A68ADN in other systems is not possible.
(1) The following PC CPU modules and remote I/O module can be used with an
A68ADN:
POINT
The A68ADN cannot be used with the A0J2P25/R25 (remote I/O station)
(2) The A68ADN can be attached to any slot of the base unit. However, the follow-
ing precautions must be taken:
(a) The power supply capacity will be exceeded if the A68ADN is attached to
an extension base unit (A55B and A58B) which contains no power supply.
When attaching the A68ADN to an extension base unit not loaded with a
power supply module, the voltage drop of the power capacity of a power
supply module of a main base unit and the extension cable must be
considered. Keep these factors in mind when selecting a power supply
module and an extension cable.
The User's Manual for each PC CPU module gives details.
(b) In an A3CPU(P21/R21) system, do not use the final slot of the seventh
extension unit to attach the A68ADN. (This restriction does not apply to the
A3NCPU, A3HCPU, A3MCPU, and A3ACPU.)
Applicable models
A0J2CPU(P21/R21) AOJ2CPU(P23/R23) A2ASCPU-S1
A1NCPU(P21/R21) A1CPU(P21/R21) A52GCPU(T21B)
A2NCPU(P21/R21) A2CPU(P21/R21) A2ACPU(P21/R21)
A2NCPU(P21/R21)-S1 A2CPU(P21/R21)-S1 A2ACPU(P21/R21)-S1
A3NCPU(P21/R21) A3CPU(P21/R21) A3ACPU(P21/R21)
A3HCPU(P21/R21) A1SCPU-S1 A2UCPU
A3MCPU(P21/R21) A1SJCPU A2UCPU-S1
A73CPU(P21/R21) A2SCPU-S1 A3UCPU
Applicable remote I/O module A4UCPU
AJ71P25/R25

3. SPECIFICATIONS
3 −1
MELSEC-A
3. SPECIFICATIONS
3.1 General Specifications
Thefollowing table shows the general specifications of the A68ADN.
Table 3.1 General Specifications
Item Specifications
Operating ambient
temperature 0 to 55 °C
Storage ambient
temperature -20 to 75 °C
Operating ambient
humidity 10 to 90 %RH, non-condensing
Storage ambient
humidity 10 to 90 %RH, non-condensing
Frequency Acceleration Amplitude Sweep Count
10 to 50 Hz — 0.075 mm
(0.003 in)
Vibration resistance Conforms t
*JIS C 0911
55 to 150 Hz 1 g —
10 times
*(1 octave/minute)
Shock resistance Conforms to *JIS C 0912 (10 g ×3 times in 3 directions)
Noise Durability By noise simulator of 1500Vpp noise voltage, 1 µs noise width and 25 to 60 Hz noise frequency.
Dielectric withstand
voltage 1500VAC for 1 minute across AC external terminals and ground 500VAC for 1 minute across DCexternal terminals and ground
Insulation resistance 5 MΩor largerby 500VDC insulation resistance tester acrossAC external terminals and ground
Grounding Class 3 grounding; grounding is not required whenit is impossible.
Operating ambience Free of corrosive gases. Dust should be minimal.
Cooling metho Self-cooling
REMARK
One octave marked * indicates a change from the initial frequency to double or half frequency.
For example, any of the changes from 10 Hz to 20 Hz, 20 Hz to 40 Hz, 40 Hz to 20 Hz, and 20
Hz to 10 Hz are referred to as one octave.
* Japanese Industrial Standard

3. SPECIFICATIONS
3 −2
MELSEC-A
3.2 Performance Specifications
Thefollowing table gives the performance specifications of the A68ADN.
Table 3.2 Performance Specifications
Item Specifications
Analog input Voltage : -10 to 0 to 10 VDC (Input resistance: 1 MΩ)
Current : -20 to 0 to 20 mA (Input resistance: 250 kΩ)
Digital output
Signed 16-bit binary
1/4000 setting : -4096 to 4095
1/8000 setting : -8192 to 8191
1/12000 setting : -12287 to 12287
I/ O characteristics
Maximum
resolution
Overall accuracy Within ±1 % (Accuracy with respect to the maximum value)
Maximum
conversion speed 20 ms/1 channel
Absolute maximum
input Voltage: ±15 V Current: ±30 mA
Number of analo
inputdevice points 8 channels/1 module
Insulation Between input terminals and PC CPU : Photocoupler insulation
Between channels : Not insulated
Number of
occupied I/O points 32 device points (special)
Connection
terminal 38-device point terminal block
Applicable wire size 0.75 to 2 mm2(18 to 14 AWG) (Applicable tightening torque 7 kg-cm (6.06 lb-in))
Applicable solder-
less terminal V1.25–3, V1.25–YS3A, V2–S3, V2–YS3A
Internal current
consumption (5 V) 0.4 A
Weight kg (lb) 0.51 kg (1.13 lb)
External dimen-
sions mm (in) 250 (9.84) (H) ×37.5 (1.48) (W ×131 (5.16) (D)
POINT
Analog input allowed for maximum resolution and overall accuracy is from –10
to 0 to 10 V or from –20 to 0 to 20 mA
Can be set with th
input terminal
1/4000 setting 1/8000 setting 1/12000 setting
Voltage Input 2.5 mV 1.25 mV 0.83 mV
Current input 10 µA5
µA 3.33 µA
Digital output value (gain : 5V/20 mA, offset: 0V/0 mA)
1/4000 setting 1/8000 setting 1/12000 setting
10 V +4000 +8000 +12000
+5 V or +20 mA +2000 +4000 +6000
0 V or 0 mA 0 0 0
+5 V or -20 mA -2000 -4000 -6000
-10 V -4000 -8000 -12000
(Factory setting: gain.....5 V, offset.... 0 V)
Analog Input

3. SPECIFICATIONS
3 −3
MELSEC-A
3.3 I/O Conversion Characteristics
Input/output (hereafter I/O) conversion characteristics are expressed by the angle of
the line connecting the offset value and gain value used to convert the analog
signals, input to the PC CPU, into digital values. This is shown in Figure 3.1 below.
*1 Analog input value (voltage or current) corresponding to the digital output value
of "0"
*2 Analog input value (voltage or current) corresponding to the following digital
output values:
2000 with resolution setting of 1/4000
4000 with resolution setting of 1/8000
6000 with resolution setting of 1/12000
Example : Resolution setting : 1/4000
Offset value : 0 V
Gain value : 5 V
Fig.3.1 I/O Conversion Characteristics
Digital output value 0
2000
4000
4095
-2000
-4000
-4096
-15 -10 0 10 15
Gain value *2
Offset value *1
Analog input voltage (V)
Practical analog input range

3. SPECIFICATIONS
3 −4
MELSEC-A
3.3.1 Voltage input characteristics
Figure 3.2 shows the voltage input characteristics for three different offset/gain
combinations.
Figure 3.2 Voltage Input Characteristics
POINTS
(1) If the input voltage is in the range of -10 to 0 to 10 V, the maximum re-
solution and overall accuracy are within the range of performance specifi-
cations. However, if the input voltage exceeds this range, resolution and
accuracy will be impaired
(2) Inputting an analog voltage that causes the digital output value to exceed
the maximum value (4095/8191/12287) or to become smaller than the
minimum value (-4096/-8192/-12288), locks the result of the A-D conver-
sion (digital output value) at either the maximum value (4095/8191/12287)
or the minimum value (-4096/-8192/-12288).
(3) Do not apply ± 15 V or more. This will damage the module.
(4) When setting the gain or offset, the following must be satisfied:
(Gain value) – (Offset value) ≥1 V (1/4000 setting)/1.5 V (1/8000
setting)/2 V (1/12000 setting)
If the set values do not satisfy the relationship stated above, the obtained
digital output values will not be correct.
Digital OutputValue with +3V
Analog Input Digital OutputValue with -3V Analog Input
Setting
Example No. Offset Value Gain value 1/4000
Setting 1/8000 Setting 1/12000 Setting 1/4000 Setting 1/8000 Setting 1/12000 Setting
1 0 V 2.5 V 2400 4800 7200 -2400 -4800 -7200
2 0 V 5 V 1200 2400 3600 -1200 -2400 -3600
3 -5 V 10 V 1066 2132 3198 266 532 798
Settingexample [1]
Set value: 0 V
Gain value: 25 V
Settingexample [2]
Offset value: 0 V
Gain value: 5 V
Settingexample [3]
Offset value: -5 V
Gain value: 10 V
Practical analo
g
input ran
g
e
-15 -10 0 10 15
Analog input voltage (V)
-5 5
1/4000
setting 1/8000 setting 1/12000 setting
4095 8191 12287
2000 4000 6000
000
-4096 -8192 -12288
Digital
output
value

3. SPECIFICATIONS
3 −5
MELSEC-A
3.3.2 Current input characteristics
Figure 3.3 shows the voltage input characteristics for three different offset/gain
combinations
Figure 3.3 Current Input Characteristics
POINTS
(1) When the input voltage is in the range from -20 to 0 to +20 mA, the maxi-
mum resolution and overall accuracy are within the range of performance
specifications. However, if input current exceeds this range, resolution and
accuracy will be impaired
(2) Inputting an analog current that causes the digital output value to exceed
the maximum value (4095/8191/12287) or to become smaller than the
minimum value (-4096/-8192/-12288), locks the result of the A-D conver-
sion (digital output value) at either the maximum value (4095/8191/12287)
or the minimum value (-4096/8192/-12288).
(3) Do not apply ± 30 mA or more. This will damage the module.
(4) When setting the gain or offset, the following must be satisfied:
(Gain value) – (Offset value) ≥4 mA (1/4000 setting)/6 mA (1/8000
setting)/8 mA (1/12000 setting)
If the set values do not satisfy the relationship stated above, the obtained
digital output values will not be correct.
Digital OutputValue with +7 mA
Analog Input Digital OutputValue with -3 mA Analog Input
Setting
Example No. Offset Value Gain value 1/4000
Setting 1/8000 Setting 1/12000 Setting 1/4000 Setting 1/8000 Setting 1/12000 Setting
1 0 mA 5 mA 2800 5600 8400 -1200 -2400 -3600
2 4 mA 20 mA 374 748 1122 -874 -1748 -2622
3 0 mA 20 mA 700 1400 2100 -300 -600 -900
Settingexample [1]
Offset value: 0 mA
Gain value: 5 mA
Settingexample [2]
Offset value: 4 mA
Gain value: 20 mA
Settingexample [3]
Offset value: 0 mA
Gain value: 20 mA
Practical analo
g
input ran
g
e
Analog input voltage (V)
4
-30 -20 0 20 30
1/4000
setting 1/8000 setting 1/12000 setting
4095 8191 12287
2000 4000 6000
000
-2000 -4000 -6000
-4096 -8192 -12288
Digital
output
value