
MContents
810
Product Description………………………………
5Audio Control Circuitry………………………….…… 21
Introduction to 810…………………………….……
5 Audio Lineup……….……………………………………. 21
CDMA Dual Band-Tri-mode………………………
5 Sidetone (DSP)...……………………………………..…
22
Non Qualcomm IC’s………………………………… 6 Transmit Path Audio…………………………….………. 22
CDMA-PCS 1900Mhz Band………………………
7 MSM Block Diagram…………..………………………
23
CDMA Dual Band Trimode Phone………………… 7 A/D Converter and Filtering………………..…………… 23
Performance Specification…………………………
7 TX Volume Control…….………………………………
23
Channel Number………….…………………………. 7 Headset Microphone Path………...…………………….. 23
External Microphone Path………...…………………….. 23
Specifications……….……………………….……… 9 Receive Audio Path……….…………….………………
24
CDMA 800Mhz Channel Numberin…..……………. 9 RX FIR Filter……………………………………………
24
Brief IC functional description……………………… 8 Codec RX Gain…………………………………………
24
Foreward………………………………….…………
12 Ear Speaker Path…………………………………………
24
Scope of Manual…………….………………..…….. 12 Headset Speaker Path……………………………………. 24
Replacement parts ordering………………………… 12 External Speaker Path……………………………………
25
Serivce…………………………………….……..…
12 MIDI Alert Interface……………………………………
25
Genaral Safety Information……….………………… 13 MMI Alert Interface……………………………………
25
Portable Operation………………….………….……. 13 Keypad Interface…………………………………………
25
Mobile Operation……………….……………..…….. 13 Flip Open/Close Detection……………………….……… 26
Display Module Interface……………………………….. 26
Camera…………………………………………………… 26
Cellular Overvie
………………………...………
14 LED's……………………………………………………
26
Overall Concept……………………………………
14
Hypothetical Cell System…………………………… 15 Disassembly Procedure…………………………….…
30
Operation……………………………………………
15 Remove Main Board……………………………………
30
Service Area…………………………………………
15 Remove Keypad………………………………………….
30
PCS System…………………………………………
15 Remove Flip Assembly………………………………….. 31
Remove Flip Hinge………………………………………
31
Remove Flip Assembly……………………………….….
32
Circuit Description & Theory of operation……… 16 Remove Rubber Bumper………………………………… 32
Receiver…………………………….………………
16 Remove Flip Screws……………………………………
33
Block Diagram.……………………………………… 17 Remove Flip Cover………………………………………
33
Transmitter…………………………….……………
18 Remove Bracket Sub LCD………………………………. 34
Systhesizer…….……………………………………
18 Remove Camera Connector……………………………… 34
Control Logic Circuitry……………………………
19 Remove Camera Assembly………………………………
35
Overview……..…………………….………………
19 Remove Vibrator……………………………………… 35
Baseband Processor IC….……...…………………… 19 Display Disassembly……………………………………
36
PM6000……………………………………………… 20 Main Display Connector…………………………………
36
Flash/PSRam Memory…………......………………
20
Accessory Interface…………...……………………. 20 Product Support Tools…………………………………. 39
Battery Interface……………………………………
21 Gate 24………………………………………..……….…
40
Power Distribution………………………..…………. 21 Troubleshooting………………………………………. 41
Exploded View Diagram………..……………………... 46
3