MSI MS-98H2 User manual

i
MS-98H2
Qseven R 2.0 CPU Module Board

ii
Preface
Copyright Notice
The material in this document is the intellectual property of MICRO-STAR IN-
TERNATIONAL. We take every care in the preparation of this document, but no
guarantee is given as to the correctness of its contents. Our products are under
continual improvement and we reserve the right to make changes without notice.
Trademarks
All trademarks are the properties of their respective owners.
Revision History
Revision Date
V1.0 2015/11
Technical Support
If a problem arises with your system and no solution can be obtained from the
user’s manual, please contact your place of purchase or local distributor.Alterna-
tively, please try the following help resources for further guidance.
Visit the MSI website for technical guide, BIOS updates, driver updates and other
information, or contact our technical sta󰘯 via http://www.msi.com/support/

iii
MS-98H2
Safety Instructions
￭Always read the safety instructions carefully.
￭Keep this User’s Manual for future reference.
￭Keep this equipment away from humidity.
￭Lay this equipment on a reliable at surface before setting it up.
￭The openings on the enclosure are for air convection hence protects the
equipment from overheating. DO NOT COVER THE OPENINGS.
￭Make sure the voltage of the power source and adjust properly 110/220V
before connecting the equipment to the power inlet.
￭Place the power cord such a way that people can not step on it. Do not place
anything over the power cord.
￭Always Unplug the Power Cord before inserting any add-on card or module.
￭All cautions and warnings on the equipment should be noted.
￭Never pour any liquid into the opening that could damage or cause electrical
shock.
￭If any of the following situations arises, get the equipment checked by ser-
vice personnel:
◯The power cord or plug is damaged.
◯Liquid has penetrated into the equipment.
◯The equipment has been exposed to moisture.
◯The equipment does not work well or you can not get it work according
to User’s Manual.
◯The equipment has dropped and damaged.
◯The equipment has obvious sign of breakage.
￭DO NOT LEAVE THIS EQUIPMENT IN AN ENVIRONMENT UNCONDI-
TIONED, STORAGE TEMPERATURE ABOVE 60oC (140oF), IT MAY DAM-
AGE THE EQUIPMENT.

iv
Preface
Chemical Substances Information
In compliance with chemical substances regulations, such as the EU REACH
Regulation (Regulation EC No. 1907/2006 of the European Parliament and the
Council), MSI provides the information of chemical substances in products at:
http://www.msi.com/html/popup/csr/evmtprtt_pcm.html
Battery Information
European Union:
Batteries, battery packs, and accumulators should not be
disposed of as unsorted household waste. Please use the
public collection system to return, recycle, or treat them in
compliance with the local regulations.
廢電池請回收
Taiwan:
For better environmental protection, waste batteries should
be collected separately for recycling or special disposal.
California, USA:
The button cell battery may contain perchlorate material
and requires special handling when recycled or disposed
of in California.
For further information please visit:
http://www.dtsc.ca.gov/hazardouswaste/perchlorate/
Danger of explosion if battery is incorrectly replaced. Replace only with the
same or equivalent type recommended by the manufacturer.

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MS-98H2
CE Conformity
Hereby, Micro-Star International CO., LTD declares that this device
is in compliance with the essential safety requirements and other
relevant provisions set out in the European Directive.
FCC-A Radio Frequency
Interference Statement
This equipment has been tested and found to comply with the
limits for a Class A digital device, pursuant to Part 15 of the
FCC Rules. These limits are designed to provide reasonable protection against
harmful interference when the equipment is operated in a commercial environ-
ment. This equipment generates, uses and can radiate radio frequency energy
and, if not installed and used in accordance with the instruction manual, may
cause harmful interference to radio communications. Operation of this equipment
in a residential area is likely to cause harmful interference, in which case the user
will be required to correct the interference at his own expense.
Notice 1
The changes or modications not expressly approved by the party responsible for
compliance could void the user’s authority to operate the equipment.
Notice 2
Shielded interface cables and AC power cord, if any, must be used in order to
comply with the emission limits.
VOIR LA NOTICE D’INSTALLATION AVANT DE RACCORDER AU RESEAU.
This device complies with Part 15 of the FCC Rules. Operation is subject to the
following two conditions:
1) this device may not cause harmful interference, and
2) this device must accept any interference received, including interference that
may cause undesired operation.
WEEE Statement
Under the European Union (“EU”) Directive on Waste Electrical and
Electronic Equipment, Directive 2002/96/EC, which takes e󰀨ect on
August 13, 2005, products of “electrical and electronic equipment”
cannot be discarded as municipal waste anymore and manufacturers
of covered electronic equipment will be obligated to take back such
products at the end of their useful life. MSI will comply with the product take back
requirements at the end of life of MSI-branded products that are sold into the EU.
You can return these products to local collection points.

vi
Preface
Japan JIS C 0950 Material
Declaration
A Japanese regulatory requirement, de󰘰ned by speci󰘰cation JIS C 0950, man-
dates that manufacturers provide material declarations for certain categories of
electronic products o󰘯ered for sale after July 1, 2006.
http://www.msi.com/html/popup/csr/cemm_jp.html
http://tw.msi.com/html/popup/csr_tw/cemm_jp.html
日本JIS C 0950材質宣言
日本工業規格JIS C 0950により、2006年7月1日以降に販売される特定分野の
電気および電子機器について、製造者による含有物質の表示が義務付けられま
す。
http://www.msi.com/html/popup/csr/cemm_jp.html
http://tw.msi.com/html/popup/csr_tw/cemm_jp.html
India RoHS
This product complies with the "India E-waste (Management and Handling) Rule
2011" and prohibits use of lead, mercury, hexavalent chromium, polybrominat-
ed biphenyls or polybrominated diphenyl ethers in concentrations exceeding
0.1 weight % and 0.01 weight % for cadmium, except for the exemptions set in
Schedule 2 of the Rule.
Turkey EEE Regulation
Conforms to the EEE Regulations of the Republic Of Turkey
Türkiye EEE yönetmeliği
Türkiye Cumhuriyeti: EEE Yönetmeliğine Uygundur
Ukraine Restriction of Hazardous
Substances
The equipment complies with requirements of the Technical Regulation, ap-
proved by the Resolution of Cabinet of Ministry of Ukraine as of December 3,
2008 № 1057, in terms of restrictions for the use of certain dangerous substances
in electrical and electronic equipment.
Україна обмеження на наявність небезпечних речовин
Обладнання відповідає вимогам Технічного регламенту щодо обмеження
використання деяких небезпечних речовин в електричному та електронному
обладнані, затвердженого постановою Кабінету Міністрів України від 3
грудня 2008 № 1057.

vii
MS-98H2
Vietnam RoHS
As from December 1, 2012, all products manufactured by MSI comply with
Circular 30/2011/TT-BCT temporarily regulating the permitted limits for a number
of hazardous substances in electronic and electric products.
Việt Nam RoHS
Kể từ ngày 01/12/2012, tất cả các sản phẩm do công ty MSI sản xuất tuân thủ
Thông tư số 30/2011/TT-BCT quy định tạm thời về giới hạn hàm lượng cho phép
của một số hóa chất độc hại có trong các sản phẩm điện, điện tử"

viii
Preface
Contents
Copyright Notice............................................................................................ ii
Trademarks................................................................................................... ii
Revision History............................................................................................ ii
Technical Support.......................................................................................... ii
Safety Instructions.........................................................................................iii
Chemical Substances Information ............................................................... iv
Battery Information....................................................................................... iv
CE Conformity............................................................................................... v
FCC-A Radio Frequency Interference Statement .........................................v
WEEE Statement..........................................................................................v
Japan JIS C 0950 Material Declaration........................................................ vi
India RoHS................................................................................................... vi
Turkey EEE Regulation................................................................................ vi
Ukraine Restriction of Hazardous Substances............................................. vi
Vietnam RoHS .............................................................................................vii
1. Overview.......................................................................................1-1
Board Specications ..................................................................................1-2
Board Layout..............................................................................................1-4
Block Diagram............................................................................................1-5
2. Hardware Setup...........................................................................2-1
Edge Fingers..............................................................................................2-2
Hardware Installation .................................................................................2-6
3. BIOS Setup...................................................................................3-1
Entering Setup ...........................................................................................3-2
The Menu Bar ............................................................................................3-4
Main ...........................................................................................................3-5
Advanced...................................................................................................3-6
Boot..........................................................................................................3-11
Security....................................................................................................3-12
Chipset.....................................................................................................3-16
Power.......................................................................................................3-17
Save & Exit...............................................................................................3-19

1-1-1
Thank you for choosing the MS-98H2, an excellent Qseven R 2.0 CPU
Module Board. Integrating core CPU and memory functionality, it is the
entry-level model for applications looking to transition from other small
form factor solutions to Qseven and o󰀨ers full PCI Express, USB, SATA,
audio, graphics and network support.
1Overview

1-2
Overview
Board Specications
Processor (Optional)
■Intel®Pentium®Processor N3710 (QC/1.6GHz/2.56GHz for Burst/TDP-6W)
■Intel®Celeron®Processor N3160 (QC/1.6GHz/2.24GHz for Burst/TDP-6W)
Memory
■Onboard DDR3L 1600 MHz memory modules
■Supports the maximum of 4 GB
LAN
■Intel I211-AT Gigabit Fast Ethernet controller
Graphics
■Graphics integrated in Intel processor
■DDI (Digital Display Interface): 3 x DDI-ports supports HDMI/DP1.1a/eDP
multiplexed
-HDMI up to 2560 x 1600 @ 60 Hz, 3840x2160 @ 30 Hz
-DP1.1a up to 2560 x 1600 @ 60 Hz, 3840x2160 @ 30 Hz
-eDP up to 2560 x 1600 @ 60 Hz
Audio
■Supports High Denition Audio interface to the carrier board
SATA
■Supports 2 Serial ATA interfaces
-2 x SATA 6Gb/s ports
-Integrated Advanced Host Controller Interface (AHCI) controller
USB
■4 x USB 2.0 (to the carrier board)
■2 x USB 3.0 (to the carrier board)
Expansion Interface
■4 x PCIe x1 compliant to PCIe Gen2 (5.0 GT/s) (to the carrier board)
■Supports SD 3.0 Spec (SD/SDHC/SDXC)
■Supports I2C/SMBus/UART under Windows 7
Form Factor
■Qseven Module: 70 (L) x 70 (W) x 1.2 (H) mm