MSI MS-98H2 User manual

i
MS-98H2
Qseven R 2.0 CPU Module Board

ii
Preface
Copyright Notice
The material in this document is the intellectual property of MICRO-STAR IN-
TERNATIONAL. We take every care in the preparation of this document, but no
guarantee is given as to the correctness of its contents. Our products are under
continual improvement and we reserve the right to make changes without notice.
Trademarks
All trademarks are the properties of their respective owners.
Revision History
Revision Date
V1.0 2015/11
Technical Support
If a problem arises with your system and no solution can be obtained from the
user’s manual, please contact your place of purchase or local distributor.Alterna-
tively, please try the following help resources for further guidance.
Visit the MSI website for technical guide, BIOS updates, driver updates and other
information, or contact our technical sta󰘯 via http://www.msi.com/support/

iii
MS-98H2
Safety Instructions
￭Always read the safety instructions carefully.
￭Keep this User’s Manual for future reference.
￭Keep this equipment away from humidity.
￭Lay this equipment on a reliable at surface before setting it up.
￭The openings on the enclosure are for air convection hence protects the
equipment from overheating. DO NOT COVER THE OPENINGS.
￭Make sure the voltage of the power source and adjust properly 110/220V
before connecting the equipment to the power inlet.
￭Place the power cord such a way that people can not step on it. Do not place
anything over the power cord.
￭Always Unplug the Power Cord before inserting any add-on card or module.
￭All cautions and warnings on the equipment should be noted.
￭Never pour any liquid into the opening that could damage or cause electrical
shock.
￭If any of the following situations arises, get the equipment checked by ser-
vice personnel:
◯The power cord or plug is damaged.
◯Liquid has penetrated into the equipment.
◯The equipment has been exposed to moisture.
◯The equipment does not work well or you can not get it work according
to User’s Manual.
◯The equipment has dropped and damaged.
◯The equipment has obvious sign of breakage.
￭DO NOT LEAVE THIS EQUIPMENT IN AN ENVIRONMENT UNCONDI-
TIONED, STORAGE TEMPERATURE ABOVE 60oC (140oF), IT MAY DAM-
AGE THE EQUIPMENT.

iv
Preface
Chemical Substances Information
In compliance with chemical substances regulations, such as the EU REACH
Regulation (Regulation EC No. 1907/2006 of the European Parliament and the
Council), MSI provides the information of chemical substances in products at:
http://www.msi.com/html/popup/csr/evmtprtt_pcm.html
Battery Information
European Union:
Batteries, battery packs, and accumulators should not be
disposed of as unsorted household waste. Please use the
public collection system to return, recycle, or treat them in
compliance with the local regulations.
廢電池請回收
Taiwan:
For better environmental protection, waste batteries should
be collected separately for recycling or special disposal.
California, USA:
The button cell battery may contain perchlorate material
and requires special handling when recycled or disposed
of in California.
For further information please visit:
http://www.dtsc.ca.gov/hazardouswaste/perchlorate/
Danger of explosion if battery is incorrectly replaced. Replace only with the
same or equivalent type recommended by the manufacturer.

v
MS-98H2
CE Conformity
Hereby, Micro-Star International CO., LTD declares that this device
is in compliance with the essential safety requirements and other
relevant provisions set out in the European Directive.
FCC-A Radio Frequency
Interference Statement
This equipment has been tested and found to comply with the
limits for a Class A digital device, pursuant to Part 15 of the
FCC Rules. These limits are designed to provide reasonable protection against
harmful interference when the equipment is operated in a commercial environ-
ment. This equipment generates, uses and can radiate radio frequency energy
and, if not installed and used in accordance with the instruction manual, may
cause harmful interference to radio communications. Operation of this equipment
in a residential area is likely to cause harmful interference, in which case the user
will be required to correct the interference at his own expense.
Notice 1
The changes or modications not expressly approved by the party responsible for
compliance could void the user’s authority to operate the equipment.
Notice 2
Shielded interface cables and AC power cord, if any, must be used in order to
comply with the emission limits.
VOIR LA NOTICE D’INSTALLATION AVANT DE RACCORDER AU RESEAU.
This device complies with Part 15 of the FCC Rules. Operation is subject to the
following two conditions:
1) this device may not cause harmful interference, and
2) this device must accept any interference received, including interference that
may cause undesired operation.
WEEE Statement
Under the European Union (“EU”) Directive on Waste Electrical and
Electronic Equipment, Directive 2002/96/EC, which takes e󰀨ect on
August 13, 2005, products of “electrical and electronic equipment”
cannot be discarded as municipal waste anymore and manufacturers
of covered electronic equipment will be obligated to take back such
products at the end of their useful life. MSI will comply with the product take back
requirements at the end of life of MSI-branded products that are sold into the EU.
You can return these products to local collection points.

vi
Preface
Japan JIS C 0950 Material
Declaration
A Japanese regulatory requirement, de󰘰ned by speci󰘰cation JIS C 0950, man-
dates that manufacturers provide material declarations for certain categories of
electronic products o󰘯ered for sale after July 1, 2006.
http://www.msi.com/html/popup/csr/cemm_jp.html
http://tw.msi.com/html/popup/csr_tw/cemm_jp.html
日本JIS C 0950材質宣言
日本工業規格JIS C 0950により、2006年7月1日以降に販売される特定分野の
電気および電子機器について、製造者による含有物質の表示が義務付けられま
す。
http://www.msi.com/html/popup/csr/cemm_jp.html
http://tw.msi.com/html/popup/csr_tw/cemm_jp.html
India RoHS
This product complies with the "India E-waste (Management and Handling) Rule
2011" and prohibits use of lead, mercury, hexavalent chromium, polybrominat-
ed biphenyls or polybrominated diphenyl ethers in concentrations exceeding
0.1 weight % and 0.01 weight % for cadmium, except for the exemptions set in
Schedule 2 of the Rule.
Turkey EEE Regulation
Conforms to the EEE Regulations of the Republic Of Turkey
Türkiye EEE yönetmeliği
Türkiye Cumhuriyeti: EEE Yönetmeliğine Uygundur
Ukraine Restriction of Hazardous
Substances
The equipment complies with requirements of the Technical Regulation, ap-
proved by the Resolution of Cabinet of Ministry of Ukraine as of December 3,
2008 № 1057, in terms of restrictions for the use of certain dangerous substances
in electrical and electronic equipment.
Україна обмеження на наявність небезпечних речовин
Обладнання відповідає вимогам Технічного регламенту щодо обмеження
використання деяких небезпечних речовин в електричному та електронному
обладнані, затвердженого постановою Кабінету Міністрів України від 3
грудня 2008 № 1057.

vii
MS-98H2
Vietnam RoHS
As from December 1, 2012, all products manufactured by MSI comply with
Circular 30/2011/TT-BCT temporarily regulating the permitted limits for a number
of hazardous substances in electronic and electric products.
Việt Nam RoHS
Kể từ ngày 01/12/2012, tất cả các sản phẩm do công ty MSI sản xuất tuân thủ
Thông tư số 30/2011/TT-BCT quy định tạm thời về giới hạn hàm lượng cho phép
của một số hóa chất độc hại có trong các sản phẩm điện, điện tử"

viii
Preface
Contents
Copyright Notice............................................................................................ ii
Trademarks................................................................................................... ii
Revision History............................................................................................ ii
Technical Support.......................................................................................... ii
Safety Instructions.........................................................................................iii
Chemical Substances Information ............................................................... iv
Battery Information....................................................................................... iv
CE Conformity............................................................................................... v
FCC-A Radio Frequency Interference Statement .........................................v
WEEE Statement..........................................................................................v
Japan JIS C 0950 Material Declaration........................................................ vi
India RoHS................................................................................................... vi
Turkey EEE Regulation................................................................................ vi
Ukraine Restriction of Hazardous Substances............................................. vi
Vietnam RoHS .............................................................................................vii
1. Overview.......................................................................................1-1
Board Specications ..................................................................................1-2
Board Layout..............................................................................................1-4
Block Diagram............................................................................................1-5
2. Hardware Setup...........................................................................2-1
Edge Fingers..............................................................................................2-2
Hardware Installation .................................................................................2-6
3. BIOS Setup...................................................................................3-1
Entering Setup ...........................................................................................3-2
The Menu Bar ............................................................................................3-4
Main ...........................................................................................................3-5
Advanced...................................................................................................3-6
Boot..........................................................................................................3-11
Security....................................................................................................3-12
Chipset.....................................................................................................3-16
Power.......................................................................................................3-17
Save & Exit...............................................................................................3-19

1-1-1
Thank you for choosing the MS-98H2, an excellent Qseven R 2.0 CPU
Module Board. Integrating core CPU and memory functionality, it is the
entry-level model for applications looking to transition from other small
form factor solutions to Qseven and o󰀨ers full PCI Express, USB, SATA,
audio, graphics and network support.
1Overview

1-2
Overview
Board Specications
Processor (Optional)
■Intel®Pentium®Processor N3710 (QC/1.6GHz/2.56GHz for Burst/TDP-6W)
■Intel®Celeron®Processor N3160 (QC/1.6GHz/2.24GHz for Burst/TDP-6W)
Memory
■Onboard DDR3L 1600 MHz memory modules
■Supports the maximum of 4 GB
LAN
■Intel I211-AT Gigabit Fast Ethernet controller
Graphics
■Graphics integrated in Intel processor
■DDI (Digital Display Interface): 3 x DDI-ports supports HDMI/DP1.1a/eDP
multiplexed
-HDMI up to 2560 x 1600 @ 60 Hz, 3840x2160 @ 30 Hz
-DP1.1a up to 2560 x 1600 @ 60 Hz, 3840x2160 @ 30 Hz
-eDP up to 2560 x 1600 @ 60 Hz
Audio
■Supports High Denition Audio interface to the carrier board
SATA
■Supports 2 Serial ATA interfaces
-2 x SATA 6Gb/s ports
-Integrated Advanced Host Controller Interface (AHCI) controller
USB
■4 x USB 2.0 (to the carrier board)
■2 x USB 3.0 (to the carrier board)
Expansion Interface
■4 x PCIe x1 compliant to PCIe Gen2 (5.0 GT/s) (to the carrier board)
■Supports SD 3.0 Spec (SD/SDHC/SDXC)
■Supports I2C/SMBus/UART under Windows 7
Form Factor
■Qseven Module: 70 (L) x 70 (W) x 1.2 (H) mm

1-3
MS-98H2
Power
■+5 V and +5 VSB (standby power)
Environmental
■Operating Temperature: -10 ~ 60oC (Constrain: Heatspreader for 0~40°C )
■Storage Temperature: -20 ~ 80oC
■Humidity: 10 ~ 90% RH, non-condensing
Regulatory Compliance
■ EMC: CE, FCC, BSMI, RCM, VCCI
■ RoHS compliant
OS Support
■Window 10 64-Bit
■Windows 8.1 64-Bit
■Windows 7 32/64-Bit
■Linux Kernel (Kernel 3.19)

1-4
Overview
Board Layout
CPU
Memory
Edge Fingers

1-5
MS-98H2
Block Diagram

2-2-1
This chapter provides you with the information about hardware
setup procedures. While doing the installation, be careful in holding
the components and follow the installation procedures. For some
components, if you install in the wrong orientation, the components will
not work properly.
Use a grounded wrist strap before handling computer components. Static
electricity may damage the components.
2Hardware Setup

2-2
Hardware Setup
Edge Fingers
On the top and bottom side of the Qseven Module Board are 115 edge ngers
that mate with the MXM connector. The following table lists the pin assignments
for all 230 edge ngers.

2-3
MS-98H2
Qseven® Specification 2.0
3 Connector Pin Assignments
There are 115 edge fingers on the top and bottom side of the Qseven® module that
mate with the MXM connector. Table 3-1 lists the pin assignments for all 230 edge
fingers.
Table 3-1 Connector Pinout Description
Pin Signal Pin Signal
1 GND 2 GND
3 GBE_MDI3- 4 GBE_MDI2-
5 GBE_MDI3+ 6 GBE_MDI2+
7 GBE_LINK100# 8 GBE_LINK1000#
9 GBE_MDI1- 10 GBE_MDI0-
11 GBE_MDI1+ 12 GBE_MDI0+
13 GBE_LINK# 14 GBE_ACT#
15 GBE_CTREF 16 SUS_S5#
17 WAKE# 18 SUS_S3#
19 SUS_STAT# 20 PWRBTN#
21 NC 22 NC
23 GND 24 GND
KEY KEY
25 GND 26 PWGIN
27 BATLOW# 28 RSTBTN#
29 SATA0_TX+ 30 SATA1_TX+
31 SATA0_TX- 32 SATA1_TX-
33 SATA_ACT# 34 GND
35 SATA0_RX+ 36 SATA1_RX+
37 SATA0_RX- 38 SATA1_RX-
39 GND 40 GND
41 BIOS_DISABLE# / BOOT_ALT# 42 SDIO_CLK#
43 SDIO_CD# 44 NC
45 SDIO_CMD 46 SDIO_WP
47 SDIO_PWR# 48 SDIO_DAT1
49 SDIO_DAT0 50 SDIO_DAT3
51 SDIO_DAT2 52 NC
53 NC 54 NC
55 SDIO_DAT6 56 RSVD
57 GND 58 GND
59 HDA_SYNC / I2S_WS 60 SMB_CLK / GP1_I2C_CLK
61 HDA_RST# / I2S_RST# 62 SMB_DAT / GP1_I2C_DAT
63 HDA_BITCLK / I2S_CLK 64 SMB_ALERT#
65 HDA_SDI / I2S_SDI 66 GP0_I2C_CLK
67 HDA_SDO / I2S_SDO 68 GP0_I2C_DAT
Copyright © 2012 Qseven® Consortium Qseven-Spec_2.0 25/54

2-4
Hardware Setup
Qseven® Specification 2.0
Pin Signal Pin Signal
69 THRM# 70 WDTRIG#
71 THRMTRIP# 72 NC
73 GND 74 GND
75 USB_P7- / USB_SSTX0- 76 USB_P6- / USB_SSRX0-
77 USB_P7+ / USB_SSTX0+ 78 USB_P6+ / USB_SSRX0+
79 NC 80 NC
81 USB_P5- / USB_SSTX1- 82 USB_P4- / USB_SSRX1-
83 USB_P5+ / USB_SSTX1+ 84 USB_P4+ / USB_SSRX1+
85 USB_2_3_OC# 86 USB_0_1_OC#
87 USB_P3- 88 USB_P2-
89 USB_P3+ 90 USB_P2+
91 NC 92 USB_ID
93 USB_P1- 94 USB_P0-
95 USB_P1+ 96 USB_P0+
97 GND 98 GND
99 eDP0_TX0+ / LVDS_A0+ 100 eDP1_TX0+ / LVDS_B0+
101 eDP0_TX0- / LVDS_A0- 102 eDP1_TX0- / LVDS_B0-
103 eDP0_TX1+ / LVDS_A1+ 104 eDP1_TX1+ / LVDS_B1+
105 eDP0_TX1- / LVDS_A1- 106 eDP1_TX1- / LVDS_B1-
107 eDP0_TX2+ / LVDS_A2+ 108 eDP1_TX2+ / LVDS_B2+
109 eDP0_TX2- / LVDS_A2- 110 eDP1_TX2- / LVDS_B2-
111 LVDS_PPEN 112 LVDS_BLEN
113 eDP0_TX3+ / LVDS_A3+ 114 eDP1_TX3+ / LVDS_B3+
115 eDP0_TX3- / LVDS_A3- 116 eDP1_TX3- / LVDS_B3-
117 GND 118 GND
119 eDP0_AUX+ / LVDS_A_CLK+ 120 eDP1_AUX+ / LVDS_B_CLK+
121 eDP0_AUX- / LVDS_A_CLK- 122 eDP1_AUX- / LVDS_B_CLK-
123 LVDS_BLT_CTRL
/GP_PWM_OUT0
124 NC
125 GP2_I2C_DAT /
LVDS_DID_DAT
126 eDP0_HPD# /
LVDS_BLC_DAT
127 GP2_I2C_CLK /
LVDS_DID_CLK
128 eDP1_HPD# /
LVDS_BLC_CLK
129 NC 130 NC
131 DP_LANE3+ / TMDS_CLK+ 132 RSVD (Differential Pair)
133 DP_LANE3- / TMDS_CLK- 134 RSVD (Differential Pair)
135 GND 136 GND
137 DP_LANE1+ / TMDS_LANE1+ 138 DP_AUX+
139 DP_LANE1- / TMDS_LANE1- 140 DP_AUX-
141 GND 142 GND
143 DP_LANE2+ / TMDS_LANE0+ 144 RSVD (Differential Pair)
145 DP_LANE2- / TMDS_LANE0- 146 RSVD (Differential Pair)
147 GND 148 GND
Copyright © 2012 Qseven® Consortium Qseven-Spec_2.0 26/54

2-5
MS-98H2
Qseven® Specification 2.0
Pin Signal Pin Signal
149 DP_LANE0+ / TMDS_LANE2+ 150 HDMI_CTRL_DAT
151 DP_LANE0- / TMDS_LANE2- 152 HDMI_CTRL_CLK
153 DP_HDMI_HPD# 154 RSVD
155 PCIE_CLK_REF+ 156 PCIE_WAKE#
157 PCIE_CLK_REF- 158 PCIE_RST#
159 GND 160 GND
161 NC 162 NC
163 NC 164 NC
165 GND 166 GND
167 PCIE2_TX+ 168 PCIE2_RX+
169 PCIE2_TX- 170 PCIE2_RX-
171 UART0_TX 172 UART0_RTS#
173 PCIE1_TX+ 174 PCIE1_RX+
175 PCIE1_TX- 176 PCIE1_RX-
177 UART0_RX 178 UART0_CTS#
179 PCIE0_TX+ 180 PCIE0_RX+
181 PCIE0_TX- 182 PCIE0_RX-
183 GND 184 GND
185 LPC_AD0 / GPIO0 186 LPC_AD1 / GPIO1
187 LPC_AD2 / GPIO2 188 LPC_AD3 / GPIO3
189 LPC_CLK / GPIO4 190 LPC_FRAME# / GPIO5
191 SERIRQ / GPIO6 192 LPC_LDRQ# / GPIO7
193 VCC_RTC 194 SPKR / GP_PWM_OUT2
195 NC 196 NC
197 GND 198 GND
199 SPI_MOSI 200 SPI_CS0#
201 SPI_MISO 202 SPI_CS1#
203 SPI_SCK 204 MFG_NC4
205 VCC_5V_SB 206 VCC_5V_SB
207 MFG_NC0 208 MFG_NC2
209 MFG_NC1 210 MFG_NC3
211 VCC 212 VCC
213 VCC 214 VCC
215 VCC 216 VCC
217 VCC 218 VCC
219 VCC 220 VCC
221 VCC 222 VCC
223 VCC 224 VCC
225 VCC 226 VCC
227 VCC 228 VCC
229 VCC 230 VCC
Copyright © 2012 Qseven® Consortium Qseven-Spec_2.0 27/54

2-6
Hardware Setup
Hardware Installation
hInstalling Module Board onto Carrier Board
Important
The illustrations are provided to guide users on how to install the module board
onto the carrier board of their choice and should be held for reference only.
1. Locate the threaded stando󰀨s on the carrier board.
2. Locate the MXM slot on the carrier board and insert the edge ngers of
the module board into the slot at a 45-degree angle.