Murata GCQ1555C1H120GB01 Series User manual

GCQ1555C1H120GB01_ (0402, C0G:EIA, 12pF, DC50V)
_: packaging code Reference Sheet
1.Scope
2.MURATA Part NO. System
(Ex.)
3. Type & Dimensions
(Unit:mm)
4.Rated value
5.Package
Product specifications in this catalog are as of Jul.11,2017,and are subject to change or obsolescence without notice.
Please consult the approval sheet before ordering.
Please read rating and !Cautions first.
Only Reflow Soldering
0.3 min.
(1)-1 L
1.0±0.05
(1)-2 W
0.5±0.05
e
High Q Chip Multilayer Ceramic Capacitors for Automotive
mark
(4)
Rated
Voltage
Packaging Unit
DC 50 V
Temp. Range
(Ref.Temp.)
(8) Packaging
Temp. coeff
or Cap. Change
This product specification is applied to High Q Chip Multilayer Ceramic Capacitors used for Automotive Electronic equipment.
This product is applied for Only Reflow Soldering.
(2) T
0.5±0.05
-55 to 125 °C
0±30 ppm/°C
25 to 125 °C
(25 °C)
(6)
Capacitance
Tolerance
12 pF
Specifications and Test
Methods
(Operating
Temp. Range)
±2 %
(3) Temperature Characteristics
(Public STD Code):C0G(EIA)
g
0.15 to 0.35
(5) Nominal
Capacitance
J
f330mm Reel
PAPER W8P2
50000 pcs./Reel
D
f180mm Reel
PAPER W8P2
10000 pcs./Reel
W
f180mm Reel
PAPER W8P1
20000 pcs./Reel
(1)L/W
Dimensions (2)T
Dimensions (3)Temperature
Characteristics (4)Rated
Voltage (5)Nominal
Capacitance (6)Capacitance
Tolerance (8)Packaging Code

Code
GCQ 15 55C 1H 120 G B01 D
GCQ1555C1H120GB01-01 1

Pre-and Post-Stress 
Electrical Test
2High Temperature The measured and observed characteristics should satisfy the Solder the capacitor on the test board (glass epoxy board).
Exposure (Storage) specifications in the following table.
Set the capacitor for 1000+/-12h at 150+/-3℃.
Appearance No marking defects Set for 24+/-2h at room temperature, then measure.
Capacitance Within ±2.5% or ±0.25pF (Whichever is larger)
Change
Q Within the specified initial value.
I.R.
More than 10,000MΩor 500Ω・F(Whichever is smaller)
25℃
3 Temperature Cycling The measured and observed characteristics should satisfy the Solder the capacitor on the test board (glass epoxy board).
specifications in the following table. Perform 1000 cycle test according to the four heat treatments listed
Appearance No marking defects in the following table.
Set for 24+/-2h at room temperature, then measure.
Capacitance Within ±2.5% or ±0.25pF (Whichever is larger)
Change
Q Within the specified initial value.
I.R.
More than 10,000MΩor 500Ω・F(Whichever is smaller)
25℃
4 Destructive No defects or abnormalities Per EIA-469.
Physical Analysis
5 Moisture Resistance The measured and observed characteristics should satisfy the Solder the capacitor on the test board (glass epoxy board).
specifications in the following table.
Apply the 24h heat (25 to 65℃) and humidity (80 to 98%)
Appearance No marking defects
treatment shown below, 10 consecutive times.
Set for 24+/-2h at room temperature, then measure.
Capacitance Within ±3.0% or ±0.30pF (Whichever is larger)
Change
Q
30pFmin. : Q≧350
10pF and over, 30pF and below : Q≧275+5C/2
10pFmax. : Q ≧200+10C
C: Nominal Capacitance(pF)
I.R.
More than 10,000MΩor 500Ω・F(Whichever is smaller)
25℃
6Biased Humidity The measured and observed characteristics should satisfy the Solder the capacitor on the test substrate(glass epoxy board).
specifications in the following table.

Appearance No marking defects
at 85+/-3℃and 80%RH to 85%RH humidity for 1000+/-12h.
The charge/discharge current is less than 50mA.
Capacitance Within ±3.0% or ±0.30pF (Whichever is larger)
Remove and set for 24+/-2h at room temperature, then measure.
Change
Q
30pF and over : Q≧200
30pF and below : Q≧100+10C/3
C: Nominal Capacitance(pF)
I.R.
More than 1,000MΩor 50Ω・F (Whichever is smaller)
25℃
■AEC-Q200 Murata Standard Specification and Test Methods
No
AEC-Q200 Test Item
Specification.
AEC-Q200 Test Method
1
-
Step
Time(min)
Temp.(℃)
1
15±3
-55℃+0/-3
2
1
Room
3
15±3
125℃+3/-0
4
1
Room
One cycle 24hours
Hours
Initial measuremt
+10
- 2 ℃
Humidity
90～98%
Humidity
80～98%
Humidity
80～98%
Humidity
90～98%
Humidity
90～98%
0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24
Temperature
70
65
60
55
50
45
40
35
30
25
20
15
10
5
0
-5
-10
(℃)
JEMCGS-04995B 2

7 Operational Life The measured and observed characteristics should satisfy the Solder the capacitor on the test board (glass epoxy board).
specifications in the following table.
Apply 200% of the rated voltage for 1000+/-12h at 125+/-3℃.
Appearance No marking defects The charge/discharge current is less than 50mA.
Set for 24+/-2h at room temperature, then measure.
Capacitance Within ±3.0% or ±0.30pF (Whichever is larger)
Change
Q
30pFmin. : Q≧350
10pF and over, 30pF and below : Q≧275+5C/2
10pFmax. : Q ≧200+10C
C: Nominal Capacitance(pF)
I.R.
・F (Whichever is smaller)
25℃
8 External Visual No defects or abnormalities Visual inspection
9 Physical Dimension Within the specified dimensions Using Measuring instrument of dimension.
10 Resistance to Appearance No marking defects
Per MIL-STD-202 Method 215
Solvents Solvent 1 : 1 part (by volume) of isopropyl alcohol
Capacitance Within the specified initial value. 3 parts (by volume) of mineral spirits
Solvent 2 : Terpene defluxer
Q Within the specified initial value. Solvent 3 : 42 parts (by volume) of water
1 part (by volume) of propylene glycol monomethyl ether
I.R.
More than 10,000MΩor 500Ω・F(Whichever is smaller) 1 part (by volume) of monoethanolamine
25℃
11 Mechanical Appearance No marking defects Solder the capacitor on the test board (glass epoxy board).
Shock
Three shocks in each direction should be applied along 3 mutually
Capacitance Within the specified initial value.
perpendicular axes of the test specimen (18 shocks).
The specified test pulse should be Half-sine and should have a
Q Within the specified initial value.
duration :0.5ms, peak value:1500g and velocity change: 4.7m/s.
I.R.
More than 10,000MΩor 500Ω・F(Whichever is smaller)
25℃
12 Vibration Appearance No marking defects Solder the capacitor on the test board (glass epoxy board).
The capacitor should be subjected to a simple harmonic motion
Capacitance Within the specified initial value.
having a total amplitude of 1.5mm, the frequency being varied
uniformly betweenthe approximate limits of 10 and 2000Hz.
Q Within the specified initial value. The frequency range, from10 to 2000Hz and return to 10Hz,
should be traversed in approximately 20min.
I.R.
More than 10,000MΩor 500Ω・F(Whichever is smaller) This motion should be applied for 12 items in each 3 mutually
25℃perpendicular directions (total of 36 times).
13 Resistance to The measured and observed characteristics should satisfy the
Immerse the capacitor in Sn-3.0Ag-0.5Cu solder solution at 260+/-5℃
Soldering Heat specifications in the following table.
for 10+/-1s. Set at room temperature for 24+/-2h, then measure.
Appearance No marking defects
Capacitance Within the specified initial value.
Q Within the specified initial value.
I.R.
More than 10,000MΩor 500Ω・F(Whichever is smaller)
25℃
■AEC-Q200 Murata Standard Specification and Test Methods
No
AEC-Q200 Test Item
Specification.
AEC-Q200 Test Method
JEMCGS-04995B 3

14 Thermal Shock The measured and observed characteristics should satisfy the Solder the capacitor on the test board (glass epoxy board).
specifications in the following table.
Perform the 300 cycles according to the two heat treatments listed
Appearance No marking defects
in the following table(Maximum transfer time is 20s).
Set for 24+/-2h at room temperature, then measure.
Capacitance Within ±2.5% or ±0.25pF (Whichever is larger)
Change
Q Within the specified initial value.
I.R.
More than 10,000MΩor 500Ω・F(Whichever is smaller)
25℃
15 ESD Appearance No marking defects
Per AEC-Q200-002
Capacitance Within the specified initial value.
Q Within the specified initial value.
I.R.
More than 10,000MΩor 500Ω・F(Whichever is smaller)
25℃
16 Solderability
(a) Preheat at 155℃for 4h. After preheating, immerse the capacitor
in a solution of ethanol(JIS-K-8101) and rosin (JIS-K-5902)
(Solution of rosin ethanol 25(mass)%).
Immerse in Sn-3.0Ag-0.5Cu solder solution for 5+0/-0.5s at 245±5℃.
(b) should be placed into steam aging for 8 hours±15min.
After preheating, immerse the capacitor in a solution of
ethanol(JIS-K-8101) and rosin (JIS-K-5902) (Solution of rosin
ethanol 25(mass)%). Immerse in Sn-3.0Ag-0.5Cu solder solution
for 5+0/-0.5s at 245±5℃.
(c) should be placed into steam aging for 8h±15min.
After preheating, immerse the capacitor in a solution of
ethanol(JIS-K-8101) and rosin (JIS-K-5902) (Solution of rosin
ethanol 25(mass)%). Immerse in Sn-3.0Ag-0.5Cu solder solution
for 120±5s at 260±5℃.
17 Electrical Appearance No defects or abnormalities Visual inspection.
Chatacteri-
zation Capacitance Within the specified tolerance
The capacitance/Q should be measured at 25℃at the
frequency and voltage shown in the table.
Q
30pFmin. : Q≧1000
30pFmax.: Q ≧400+20C
C: Nominal Capacitance(pF)
I.R. 25℃・F (Whichever is smaller) The insulation resistance should be measured with a DC voltage not
exceeding the rated voltage at 25℃and 125℃within 1min of charging.
I.R. 125℃・F (Whichever is smaller)
Dielectric No failure No failure should be observed when 250% of the rated voltage is
Strength applied between the terminations for 1 to 5s, provided the
charge/ discharge current is less than 50mA.
■AEC-Q200 Murata Standard Specification and Test Methods
No
AEC-Q200 Test Item
Specification.
AEC-Q200 Test Method
95% of the terminations is to be soldered evenly and continuously.
Step
1
2
Temp.
(℃）
-55+0/-3
125+3/-0
Time
(min.)
15+/-3
15+/-3
Char.
Item
ΔC
(1000 pF and below)
ΔC
(more than 1000pF)
Frequency
1.0+/-0.1MHz
1.0+/-0.1kHz
Voltage
0.5 to 5Vrms
1.0+/-0.2Vrms
JEMCGS-04995B 4

18 Board Flex Appearance No marking defects
Solder the capacitor on the test jig (glass epoxy board) shown in Fig1.
Then apply a force in the direction shown in Fig 2 for 60s.
Capacitance Within ±5.0% or ±0.5pF (Whichever is larger)
The soldering should be done by the reflow method and should be
Change
conducted with care so that the soldering is uniform and free of defects
Q Within the specified initial value.
such as heat shock.
I.R.
More than 10,000MΩor 500Ω・F(Whichever is smaller)
25℃
19 Terminal Appearance No marking defects Solder the capacitor to the test jig (glass epoxy board) shown in Fig.3.
Strength Then apply 2N force in parallel with the test jig for 60s.
Capacitance Within the specified initial value. The soldering should be done either with an iron or using the reflow
method and should be conducted with care so that the soldering is
Q Within the specified initial value. uniform and free of defects such as heat shock
I.R.
More than 10,000MΩor 500Ω・F(Whichever is smaller)
25℃
(in mm)
Fig.3
20 Beam Load Test Destruction value should be exceed following one. Place the capacitor in the beam load fixture as Fig 4.
< Chip L dimension : 2.5mm max. > Apply a force.
< Chip Length : 2.5mm max. >
Fig.4
Speed supplied the Stress Load : 0.5mm/s
Chip thickness = 0.5mm rank : 8N
■AEC-Q200 Murata Standard Specification and Test Methods
No
AEC-Q200 Test Item
Specification.
AEC-Q200 Test Method
t : 0.8mm
＊2
4.0±0.1
8.0±0.3
3.5±0.05
0.05以下
＊1
φ1.5
+0.1
-0
Ａ
t
*1,2：2.0±0.05
1.75±0.1
Ｂ
100
40
a
c
b
f4.5
c
Fig.1
Type
a
b
c
GCQ15
0.4
1.5
0.5
＊2
4.0±0.1
8.0±0.3
3.5±0.05
0.05以下
＊1
φ1.5
+0.1
-0
Ａ
t
*1,2：2.0±0.05
1.75±0.1
Ｂ
a
a
c
b
ﾗﾝﾄﾞ
f4.5
c
Solder resist
Baked electrode or
Copper foil
b
t: 0.8mm
Iron Board
45
45
Flexure：≦2
Capacitance meter
Pressurizing
speed:1.0mm/s
Pressurize
支持台
ｺﾝﾃﾞﾝｻ
45
45
Fig.2
R4
20
50 min.
Type
a
b
c
GCQ15
0.5
1.5
0.6
(in mm)
JEMCGS-04995B 5

21 Capacitance Temperature Nominal values of the temperature coefficient is The capacitance change should be measured after 5 minutes
Characteristics shown in Rated value. at each specified temp. stage.
Capacitance Change under 25℃is shown in Table A. Capacitance value as a reference is the value in step 3.
Capacitance Drift The capacitance drift is calculated by dividing the differences
Within +/-0.2% or +/-0.05pF between the maximum and minimum measured values in the
(Whichever is larger.) step 1,3 and 5 by the cap. value in step 3.
■AEC-Q200 Murata Standard Specification and Test Methods
No
AEC-Q200 Test Item
Specification.
AEC-Q200 Test Method
Table A
Char.
-55℃
-30
-10℃
Max.
Min.
Max.
Min.
Max.
Min.
5C
0.58
-0.24
0.40
-0.17
0.25
-0.11
Step
Temperature(C)
1
Reference Temp.+/-2
2
Min. Operating Temp.+/-3
3
Reference Temp.+/-2
4
Max. Operating Temp.+/-3
5
Reference Temp.+/-2
JEMCGS-04995B 6

1.Tape Carrier Packaging(Packaging Code:D/E/W/J/F)
1.1 Minimum Quantity(pcs./reel)

Code:D/E Code:W Code:J/F
GCQ15 10000(W8P2) 20000(W8P1) 50000(W8P2)
1.2 Dimensions of Tape
(1)GCQ15(W8P2 CODE:D/E/J/F) (in mm)
(2)GCQ15(W8P1 CODE:W)
GCQ15
Package
GCQ Type
Type
Paper Tape

L W
T
GCQ15 5 1.0±0.05 0.5±0.05 0.5±0.05 0.65 1.15 0.8 max.
*3 Nominal value
Type
Dimensions(Chip)
A*3
B *3
t
L W
T
GCQ15 5 1.0±0.05 0.5±0.05 0.5±0.05 0.65 1.15 0.8 max.
*3 Nominal value
Type
Dimensions(Chip)
A*3
B *3
t
*1,*2：2.0±0.05
＊2
4.0±0.1
8.0±0.3
3.5±0.05
0.05以下
＊1
φ1.5
+0.1
-0
Ａ
t
*1,2：2.0±0.05
1.75±0.1
Ｂ
4.0±0.1
*1
φ1.5
+0.1
-0
1.75±0.1
8.0±0.3
3.5±0.05
Ａ
Ｂ
t
*2
0.05 max.
1.0±0.05
4.0±0.1
φ1.5
+0.1
-0
1.75±0.1
8.0±0.3
3.5±0.05
Ａ
Ｂ
t
1.0±0.05
JEMCGP-04996A 7

Package
GCQ Type
図
1
ﾁｯﾌﾟ詰め状態
(
単位：
mm)

w1
W
Top Tape : Thickness 0.06
Feeding Hole :As specified in 1.2.
Hole for Chip : As specified in 1.2.
Base Tape : As specified in 1.2.
Bottom Tape :Thickness 0.05
(Only a bottom tape existence )
-3.0

 min.

2.0±0.5
Chip
(in mm)
Fig.1 Package Chips
Fig.2 Dimensions of Reel
Fig.3 Taping Diagram
W
w1
16.5 max.
10±1.5
JEMCGP-04996A 8

1.3 Tapes for capacitors are wound clockwise shown in Fig.3.
(The sprocket holes are to the right as the tape is pulled toward the user.)
1.4 Part of the leader and part of the vacant section are attached as follows.
(in mm)
1.5 Accumulate tolerance of sprocket holes pitch = ±0.3mm / 10 pitch
1.6 Chip in the tape is enclosed by top tape and bottom tape as shown in Fig.1.
1.7 The top tape and base tape are not attached at the end of the tape for a minimum of 5 pitches.
1.8 There are no jointing for top tape and bottom tape.
1.9 There are no fuzz in the cavity.
1.10 Break down force of top tape : 5N min.
Break down force of bottom tape : 5N min. (Only a bottom tape existence )
1.11 Reel is made by resin and appeaser and dimension is shown in Fig 2.
There are possibly to change the material and dimension due to some impairment.
1.12 Peeling off force : 0.1N to 0.6N in the direction as shown below.
1.13 Label that show the customer parts number, our parts number, our company name, inspection
number and quantity, will be put in outside of reel.
Package
GCQ Type
図
1
ﾁｯﾌﾟ詰め状態
(
単位：
mm)
Tail vacant Section
Chip-mounting Unit
Leader vacant Section
Leader Unit
(Top Tape only)
Direction
of Feed
160 min.
190 min.
210 min.
図
1
ﾁｯﾌﾟ詰め状態
(
単位：
mm)
165～180°
Top tape
JEMCGP-04996A 9

Caution
■Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high reliability
for the prevention of defects which might directly cause damage to the third party's life, body or property.
①Aircraft equipment ②Aerospace equipment ③Undersea equipment ④Power plant control equipment
⑤Medical equipment ⑥Transportation equipment(vehicles,trains,ships,etc.) ⑦Traffic signal equipment
⑧Disaster prevention / crime prevention equipment ⑨Data-processing equipment
⑩Application of similar complexity and/or reliability requirements to the applications listed in the above.
■Storage and Operation condition
1. The performance of chip multilayer ceramic capacitors may be affected by the storage conditions.
1-1. Store the capacitors in the following conditions:
Room Temperature of +5℃to +40℃and a Relative Humidity of 20% to 70%.
(1) High temperature and humidity conditions may accelerate the deterioration of solderability due to oxidation
of the terminal electrodes and deterioration of taping/packaging performance.
Therefore, maintain the appropriate storage temperature and humidity.
(2) Prolonged storage may cause oxidation of the electrodes and deterioration of the packaging materials.
If more than six months have elapsed since delivery, check the mounting before use.
If more than one year has elapsed since delivery, also check the solderability before use.
Even if the storage period is short, do not exceed the specified atmospheric conditions.
(3) Store the capacitors in the original packaging without opening the smallest packing unit.
Do not exceed the above atmospheric conditions for any length of time.
1-2. Corrosive gas can react with the termination (external) electrodes or lead wires of capacitors, and result
in poor solderability. Do not store the capacitors in an atmosphere consisting of corrosive gas (e.g.,hydrogen
sulfide, sulfur dioxide, chlorine, ammonia gas etc.).
1-3. Due to moisture condensation caused by rapid humidity changes, or the photochemical change caused
by direct sunlight on the terminal electrodes and/or the resin/epoxy coatings, the solderability and
electrical performance may deteriorate. Do not store capacitors under direct sunlight or in high huimidity
conditions
■Rating
1.Temperature Dependent Characteristics
1. The electrical characteristics of the capacitor can change with temperature.
1-1. For capacitors having larger temperature dependency, the capacitance may change with temperature
changes. The following actions are recommended in order to ensure suitable capacitance values.
(1) Select a suitable capacitance for the operating temperature range.
(2) The capacitance may change within the rated temperature.
When you use a high dielectric constant type capacitor in a circuit that needs a tight (narrow) capacitance
tolerance (e.g., a time-constant circuit), please carefully consider the temperature characteristics, and
carefully confirm the various characteristics in actual use conditions and the actual system.
[Example of Temperature Caracteristics X7R(R7)] [Example of Temperature Characteristics X5R(R6)]

!
-20
-10
-15
-5
5
0
10
15
20
Temperature (C)
-75 -50 -25 025 50 75 100 125 150
Capacitance Change(%)
-20
-10
-15
-5
5
0
10
15
20
Temperature (C)
-75 -50 -25 025 50 75 100
Capacitance Change(%)
JEMCGC-04997A 10