Murata GJM1555C1H110GB01 Series User manual

GJM1555C1H110GB01_ (0402, C0G:EIA, 11pF, DC50V)
_: packaging code Reference Sheet
1.Scope
2.MURATA Part NO. System
(Ex.)
3. Type & Dimensions
(Unit:mm)
4.Rated value
5.Package
Product specifications in this catalog are as of Mar.13,2017,and are subject to change or obsolescence without notice.
Please consult the approval sheet before ordering.
Please read rating and !Cautions first.
(3) Temperature Characteristics
(Public STD Code):C0G(EIA)
g
0.15 to 0.35
(5) Nominal
Capacitance
mark
(4)
Rated
Voltage
Packaging Unit
DC 50 V
Temp. Range
(Ref.Temp.)
(8) Packaging
0±30 ppm/°C
25 to 125 °C
(25 °C)
Only Reflow Soldering
0.3 min.
(1)-1 L
1.0±0.05
(1)-2 W
0.5±0.05
This product specification is applied to Chip Monolithic Ceramic Capacitor High-Q Type used for General Electronic equipment.
This product is applied for Only Reflow Soldering.
(2) T
e
Chip Monolithic Ceramic Capacitor High-Q Type for General
Specifications and Test
Methods
(Operating
Temp. Range)
Temp. coeff
or Cap. Change
±2 %
(6)
Capacitance
Tolerance
11 pF
0.5±0.05
-55 to 125 °C
J
f330mm Reel
PAPER W8P2
50000 pcs./Reel
D
f180mm Reel
PAPER W8P2
10000 pcs./Reel
W
f180mm Reel
PAPER W8P1
20000 pcs./Reel
(1)L/W
Dimensions (2)T
Dimensions (3)Temperature
Characteristics (4)Rated
Voltage (5)Nominal
Capacitance (6)Capacitance
Tolerance (8)Packaging Code

Code
GJM 15 55C 1H 110 G B01 D
GJM1555C1H110GB01-01 1

1 Rated Voltage Shown in Rated value. The rated voltage is defined as the maximum voltage
which may be applied continuously to the capacitor.
When AC voltage is superimposed on DC voltage,
VP-P or VO-P, whichever is larger, should be maintained
within the rated voltage range.
2 Appearance No defects or abnormalities. Visual inspection.
3 Dimension Within the specified dimensions. Using Measuring instrument of dimension.
4 Voltage proof No defects or abnormalities. Measurement Point : Between the terminations
Test Voltage : 300% of the rated voltage
Applied Time : 1s to 5 s
Charge/discharge current : 50mA max.
5 Insulation Resistance(I.R.)
C≦ Measurement Point : Between the terminations
C＞ Measurement Voltage : DC Rated Voltage
C:Nominal Capacitance Charging Time : 2 min
Charge/discharge current : 50mA max.
Measurement Temperature : Room Temperature
6 Capacitance Shown in Rated value. Measurement Temperature : Room Temperature
7Q
30pF and over:Q≧1000
30pF and below:Q≧400+20C
C:Nominal Capacitance(pF)
8 Temperature Characteristics
Nominal values of the temperature coefficient is shown in Rated value.
The capacitance change should be measured after 5 minutes
of Capacitance
But,the Capacitance Change under 20℃is shown in Table A. at each specified temp. stage.
Capacitance value as a reference is the value in step 3.
Capacitance Drift
Within +/-0.2% or +/-0.05pF The capacitance drift is calculated by dividing the differences
(Whichever is larger.) between the maximum and minimum measured values in the
step 1,3 and 5 by the cap. value in step 3.
9 Adhesive Strength No removal of the terminations or other defect Solder the capacitor on the test substrate shown in Fig.3.
of Termination should occur.
Holding Time : 10+/-1s
Applied Direction : In parallel with the test substrate and vertical with
the capacitor side.
10 Vibration  Appearance No defects or abnormalities. Solder the capacitor on the test substrate shown in Fig.3.
Capacitance Within the specified initial value. Kind of Vibration : A simple harmonic motion
10Hz to 55Hz to 10Hz (1min)
Q Within the specified initial value. Total amplitude : 1.5mm
This motion should be applied for a period of 2h in each 3 mutually
perpendicular directions(total of 6h).
11 Substrate Appearance No defects or abnormalities. Solder the capacitor on the test substrate shown in Fig.1.
Bending test
Capacitance Within +/-5% or +/-0.5pF Pressurization method : Shown in Fig.2
Change (Whichever is larger) Flexure : 1mm
Holding Time : 5+/-1s
Soldering Method : Reflow soldering
12 Solderability 95% of the terminations is to be soldered evenly and continuously. Test Method : Solder bath method
Flux Solution of rosin ethanol 25(mass)%
Preheat :
80℃to 120℃for 10s to 30s
Solder : Sn-3.0Ag-0.5Cu
Solder Temp. :
245+/-5℃
Immersion time :
2+/-0.5s
■Specifications and Test Methods
No
Item
Specification
Test Method
(Ref. Standard:JIS C 5101, IEC60384）
Type Applied Force(N)
GJM02 1
GJM03 2
GJM15 5
Step
Temperature(C)
1
Reference Temp.+/-2
2
Min. Operating Temp.+/-3
3
Reference Temp.+/-2
4
Max. Operating Temp.+/-3
5
Reference Temp.+/-2
Capacitance
Frequency
Voltage
C≦1000pF
1.0+/-0.1MHz
0.5 to 5.0Vrms
Step
Temperature(C)
1
Reference Temp.+/-2
2
Min. Operating Temp.+/-3
3
Reference Temp.+/-2
4
Max. Operating Temp.+/-3
5
Reference Temp.+/-2
JEMCGS-0004M 2

13
Resistance to Appearance No defects or abnormalities. <GJM02 size only>
Soldering Heat Test Method : Reflow soldering (hot plate)
Capacitance Within +/-2.5% or +/- 0.25pF Solder : Sn-3.0Ag-0.5Cu
Change (Whichever is larger) Solder Temp. : 270+/-5℃
Reflow Time : 10+/-0.5s
Q Within the specified initial value. Test Substrate : Glass epoxy PCB
Exposure Time : 24+/-2h
I.R. Within the specified initial value. Preheat :
120℃to 150℃for 1 min
Voltage proof No defects. <GJM03/GJM15 size>
Test Method : Solder bath method
Solder : Sn-3.0Ag-0.5Cu
Solder Temp. :
270+/-5℃
Immersion time :
10+/-0.5s
Exposure Time : 24+/-2h
Preheat :
120℃to 150℃for 1 min
14
Temperature Appearance No defects or abnormalities. Solder the capacitor on the test substrate shown in Fig.3.
Sudden Change
Capacitance Within +/-2.5% or +/- 0.25pF Perform the five cycles according to the four heat treatments
Change (Whichever is larger) shown in the following table.
Q Within the specified initial value.
I.R. Within the specified initial value.
Voltage proof No defects.
Exposure Time : 24+/-2h
15
High Appearance No defects or abnormalities. Solder the capacitor on the test substrate shown in Fig.3.
Temperature
High Humidity Capacitance Within +/-7.5% or +/-0.75pF
Test Temperature :
40+/-2℃
(Steady) Change (Whichever is larger)
Test Humidity :
90%RH to 95%RH
Test Time :
500+/-12h
Q
30pF and over : Q≧200 Applied Voltage : DC Rated Voltage
30pF and below : Q≧100+10C/3 Charge/discharge current : 50mA max.
Exposure Time :
24+/-2h
C:Nominal Capacitance(pF)
I.R. 
16 Durability Appearance No defects or abnormalities. Solder the capacitor on the test substrate shown in Fig.3.
Capacitance Within +/-3% or +/-0.3pF Test Temperature : Max. Operating Temp. +/-3℃
Change (Whichever is larger)
Test Time :
1000+/-12h
Applied Voltage : 200% of the rated voltage
Q
30pF and over : Q≧350 Charge/discharge current : 50mA max.
10pF and over , 30pF and below : Q≧275+5C/2 Exposure Time : 24+/-2h
10pF and below : Q≧200+10C
C:Nominal Capacitance (pF)
I.R. 
17 ESR
0.2pF ≦C ≦
Measurement Frequency :
1.0+/-0.1GHz
(GJM02)
1pF < C ≦ Measurement Temperature : Room Temp.
2pF < C ≦ Measurement Instrument : Equivalent to E4991A
5pF < C ≦
10pF < C ≦
C:Nominal Capacitance (pF)
ESR
0.1pF ≦C ≦
Measurement Frequency :
1.0+/-0.2GHz
(GJM03/GJM15)
1pF < C ≦ Measurement Temperature : Room Temp.
5pF < C ≦ Measurement Instrument : Equivalent to BOONTON Model 34A
C:Nominal Capacitance (pF)
10pF < C ≦
Measurement Frequency :
500+/-50MHz
Measurement Temperature : Room Temp.
Measurement Instrument : Equivalent to HP8753B
No
Item
Specification
Test Method
(Ref. Standard:JIS C 5101, IEC60384）
Step
Temp.(C)
Time (min)
1
Min.Operating Temp.+0/-3
30+/-3
2
Room Temp.
2 to 3
3
Max.Operating Temp.+3/-0
30+/-3
4
Room Temp
2 to 3
JEMCGS-0004M 3

Substrate Bending test
・Test substrate
Material : Copper-clad laminated sheets for PCBs
(Glass fabric base, epoxy resin)
Thickness :0.8mm
: Solder resist
(Coat with heat resistant resin for solder)
for GJM02 for GJM03/15
Copper foil thickness : 0.018mm Copper foil thickness : 0.035mm
Fig.1 (in mm)
・Test substrate
Kind of Solder : Sn-3.0Ag-0.5Cu
・Test substrate
Pressurization method
Fig.2 (in mm)
Adhesive Strength of Termination, Vibration, Temperature Sudden Change, Resistance to Soldering Heat (Reflow method)
High Temperature High Humidity(Steady) , Durability
・Test substrate
Material : Copper-clad laminated sheets for PCBs
(Glass fabric base, epoxy resin)
Thickness : 1.6mm or 0.8mm
Copper foil thickness : 0.035mm
・Test substrate
Kind of Solder : Sn-3.0Ag-0.5Cu
・Test substrate
Land Dimensions
Fig.3
＊2
4.0±0.1
8.0±0.3
3.5±0.05
0.05以下
＊1
φ1.5
+0.1
-0
Ａ
t
*1,2：2.0±0.05
1.75±0.1
Ｂ
100
40
a
c
b
Land
f4.5
c
Type
Dimension (mm)
a
b
c
GJM02
0.2
0.56
0.23
GJM03
0.3
0.9
0.3
GJM15
0.4
1.5
0.5
Table A
Char.
Capacitance Change from Value at Reference temp. (%)
-55℃
-30
-25℃
-10℃
Max.
Min.
Max.
Min.
Max.
Min.
Max.
Min.
1C
0.54
-0.23
-
-
0.33
-0.14
0.22
-0.09
2C
0.82
-0.45
-
-
0.49
-0.27
0.33
-0.18
3C
1.37
-0.90
-
-
0.82
-0.54
0.55
-0.36
4C
2.56
-1.88
-
-
1.54
-1.13
1.02
-0.75
5C
0.58
-0.24
0.40
-0.17
-
-
0.25
-0.11
6C
0.87
-0.48
0.59
-0.33
-
-
0.38
-0.21
c
b
a
Solder Resist
Chip Capacitor
Land
45
45
Flexure
Capacitance meter
Pressurization
speed
1.0mm/s
Support
Capacitor
Pressurize
45
45
R5
20
50 min.
Type
Dimension (mm)
a
b
c
GJM02
0.2
0.56
0.23
GJM03
0.3
0.9
0.3
GJM15
0.4
1.5
0.5
JEMCGS-0004M 4

1.Tape Carrier Packaging(Packaging Code:D/E/W/L/J/F)
1.1 Minimum Quantity(pcs./reel)

Plastic Tape Paper Tape
Code:D/E Code:W Code:L Code:J/F
GJM02
40000 (W4P1)
GJM03
15000(W8P2) 30000(W8P1) 50000(W8P2)
GJM15 10000(W8P2) 20000(W8P1) 50000(W8P2)
1.2 Dimensions of Tape (in mm)
(1)GJM02 <Plastic Tape W4P1 CODE:L>
L W T
GJM02 2 0.4±0.02 0.2±0.02 0.2±0.02 0.23 0.43 0.5 max.
*3 Nominal value
(2)GJM03/GJM15 <Paper Tape W8P2 CODE:D/E/J/F> (in mm)
L W T
GJM03 3 0.6±0.03 0.3±0.03 0.3±0.03 0.37 0.67 0.5 max.
GJM15 5 1.0±0.05 0.5±0.05 0.5±0.05 0.65 1.15 0.8 max.
*3 Nominal value
Type
Dimensions(Chip)
A *3
B *3
t
B *3
t
Type
Dimensions(Chip)
A *3
Package
GJM Type
Type

Paper Tape
*1,*2：1.0±0.02
2.0±0.04
*1
0.9±0.05
4.0±0.05
1.8±0.02
Ａ
Ｂ
t
*2
0.05 max.
φ0.8±0.04
0.15～0.25
*1,2：2.0±0.05
＊2
4.0±0.1
8.0±0.3
3.5±0.05
0.05以下
＊1
φ1.5
+0.1
-0
Ａ
t
*1,2：2.0±0.05
1.75±0.1
Ｂ
4.0±0.1
*1
φ1.5
+0.1
-0
1.75±0.1
8.0±0.3
3.5±0.05
Ａ
Ｂ
t
*2
0.05 max.
JEMCGP-01914B 5