Murata GQM1875C2E3R9WB12 Series User manual

GQM1875C2E3R9WB12_ (0603, C0G, 3.9pF, 250Vdc)
_: packaging code Reference Sheet
1.Scope
2.MURATA Part NO. System
(Ex.)
3. Type & Dimensions
(Unit:mm)
4.Rated value
5.Package
Product specifications in this catalog are as of Jan.28,2013,and are subject to change or obsolescence without notice.
Please consult the approval sheet before ordering.
Please read rating and !Cautions first.
mark
(4)
DC Rated
Voltage
Packaging Unit
RF HIGH FREQUENCY CHIP MONOLITHIC CERAMIC CAPACITOR
g
0.2 to 0.5
(5) Nominal
Capacitance
(6)
Capacitance
Tolerance
250 Vdc
3.9 pF
Temp. Range
(Ref.Temp.)
(8) Packaging
(1)-2 W
0.8±0.15
e
±0.05 pF
-55 to 125 °C
0±30 ppm/°C
25 to 125 °C
(25 °C)
(3) Temperature Characteristics
(Public STD Code):C0G(EIA)
Specifications and Test
Methods
(Operationg
Temp. Range)
Temp. coeff
or Cap. Change
D
f180mm Reel
PAPER W8P4
4000 pcs./Reel
0.5 min.
(2) T
0.7±0.1
This product specification is applied to RF High Frequency Chip Monolithic Ceramic Capacitor used for RF High frequency
Electronic equipment.
(1)-1 L
1.6±0.15
(1)L/W
Dimensions
(2)T
Dimensions
(3)Temperature
Characteristics
(4)DC Rated
Voltage
(5)Nominal
Capacitance
(6)Capacitance
Tolerance
(8)Packaging
Code
(7)Murata’s
Control Code
T
L
W
e
e
g
GQM 18 75C 2E 3R9 W B12 D
GQM1875C2E3R9WB12-01 1

No Item Test Method
1 Operating
2C,5C : -55℃to 125℃
Temperature Range
2 Rated Voltage See the previous pages. The rated voltage is defined as the maximum voltage which may be
applied continuously to the capacitor.
When AC voltage is superimposed on DC voltage, VP-P or VO-P,
whichever is larger, should be maintained within the rated
voltage range.
3 Appearance No defects or abnormalities. Visual inspection.
4 Dimension Within the specified dimensions. Using calipers.
5 Dielectric Strength No defects or abnormalities. No failure should be observed when 250% of the rated
voltage is applied between the terminations for 1 to 5
seconds, provided the charge/discharge current is less
than 50mA.
6 Insulation
More than 10,000MΩThe insulation resistance should be measured with a DC
Resistance
voltage not exceeding the rated voltage at 20℃/25℃
and 75%RH max. and within 2 minutes of charging.
7 Capacitance Within the specified tolerance.
The capacitance/Q should be measured at 20℃/25℃
at the frequency and voltage shown in the table.
8 Q
30pFmin. : Q≧1400
30pFmax.: Q≧800+20C
C:NominalCapacitance (pF)
9Capacitance Capacitance Within the specified tolerance.(Table A-1) The temperature coefficient is determind using the
Temperature
Change capacitance measured in step 3 as a reference.
Characteristics When cycling the temperature sequentially from step 1
through 5 the capacitance should be within the specified
tolerance for the temperature coefficient and capacitance
Temperature Within the specified tolerance.(Table A-1) change as Table A-1.
Coefficent The capacitance drift is caluculated by dividing the
differences betweeen the maximum and minimum measured
values in the step 1,3 and 5 by the cap. value in step 3.
Capacitance Within ±0.2% or ±0.05pF
Drift (Whichever is larger.)
10 Adhesive Strength of No removal of the terminations or other defect should occur. Solder the capacitor on the test jig (glass epoxy
Termination board)shown in Fig.3 using an eutectic solder. Then apply
10N* force in parallel with the test jig for 10+/-1sec.
The soldering should be done either with an iron or using the
reflow method and should be conducted with care so that the
soldering is uniform and free of defects such as heat shock.
*5N（GQM18)
11 Vibration  Appearance No defects or abnormalities.
Solder the capacitor on the test jig (glass epoxy board) in the
Resistance same manner and under the same conditions as (10).
Capacitance Within the specified tolerance. The capacitor should be subjected to a simple harmonic
motion having a total amplitude of 1.5mm, the frequency
Q
30pFmin. : Q≧1400 being varied uniformly between the approximate limits of 10
30pFmax.: Q≧800+20C and 55Hz. The frequency range, from 10 to 55Hz and return
to 10Hz, should be traversed in approximately 1 minute. This
C:NominalCapacitance (pF)
motion should be applied for a period of 2 hours in each 3
mutually perpendicular directions(total of 6 hours).
12 Deflection Appearance No marking defects.
Solder the capacitor on the test jig (glass epoxy board)
shown in Fig.1 using an eutectic solder. Then apply a force
Capacitance
Within ±5％or ±0.5pF in the direction shown in Fig 2. The soldering
Change (Whichever is larger) should be done by the reflow method and should be
conducted with care so that the soldering is uniform and free
of defects such as heat shock.
13 Solderability 75% of the terminations is to be soldered evenly Immerse the capacitor in a solution of ethanol (JIS-K-8101)
of Termination and continuously. and rosin (JIS-K-5902) (25% rosin in weight propotion) .
Preheat at 80 to 120℃for 10 to 30 seconds.
After preheating, immerse in an eutectic solder solution for
2+/-0.5 seconds at 230+/-5℃or Sn-3.0Ag-0.5Cu solder
solution for 2+/-0.5 seconds at 245+/-5℃
■SPECIFICATIONS AND TEST METHODS
Specification
Char.
Item
ΔC
(1000pF and below)
Frequency
10.1MHz
Voltage
0.5 to 5Vrms
Step
Temperature(C)
1
202 / 252
2
-553
3
202 / 252
4
1253
5
202 / 252
JEMCNS-0022C 2

No Item Test Method
14 Resistance to The measured and observed characteristics shall satisfy
Preheat the capacitor at 120 to 150℃for 1 minute.
Soldering Heat the specifications in the following table. Immerse the capacitor in an eutectic solder solution or
Appearance No defects or abnormalities.
Sn-3.0Ag-0.5Cu solder solution at 270+/-5℃for
10+/-0.5 seconds. Let sit at room temperature for 24+/-2
Capacitance
Within ±2.5% or ±0.25 pF hours.
Change (Whichever is larger)
Q
30pFmin.:Q≧1400
30pFmax.:Q≧800+20C
C:NominalCapacitance (pF)
I.R. More than 10,000MΩ
Dielectric No defects.
Strength
15 Temperature The measured and observed characteristics shall satisfy
Fix the capacitor to the supporting jig in the same
Cycle the specifications in the following table. manner and under the same conditions as (10).
Appearance No defects or abnormalities.
Perform the five cycles according to the four heat
treatments listed in the following table.
Capacitance
Within ±2.5% or ±0.25pF Let sit for 24+/-2 hours at room temperature, then measure.
Change (Whichever is larger)
Q
30pFmin. : Q≧1400
30pFmax.: Q≧800+20C
C:NominalCapacitance (pF)
I.R. More than 10,000MΩ
Dielectric No defects.
Strength
16
Humidity The measured and observed characteristics shall satisfy Sit the capacitor at 40±2℃and 90 to 95% humiduty for
Steady
State
the specifications in the following table.
500±12 hours.
Appearance No defects or abnormalities.
Remove and let sit for 24±2 hours (temperature compensating type)
at room temperature, then measure.
Capacitance
Within ±5％or ±0.5pF
Change (Whichever is larger)
Q
30pF and over : Q≧350
10pF and over, 30pF and below : Q≧275+5C/2
C:Nominal Capacitance(pF)
I.R. More than 1,000MΩ
17
Humidity
Load
The measured and observed characteristics shall satisfy
Apply the rated voltage at 40±2℃and 90 to 95% humidity
the specifications in the following table.
for 500±12 hours.
Appearance No defects or abnormalities.
Remove and let sit for 24±2 hours at room temprature then
muasure. The charge/discharge current is less than 50mA.
Capacitance
Within ±7.5% or ±0.75pF
Change (Whichever is larger)
Q
30pF and over : Q≧200
30pF and below : Q≧100+10C/3
I.R. More than 500MΩ
18 The measured and observed characteristics shall satisfy
Apply 200% of the rated voltage for 1000±12 hours at the
Load the specifications in the following table. maximun operating temperature±3℃.
Appearance No defects or abnormalities.
Let sit for 24±2 hours (temperature compensating type) aｔ
room temperature, then measure.
Capacitance
Within ±3% or ±0.3pF The charge/discharge current is less than 50mA
Change (Whichever is larger)
Q
30pF and over : Q≧350
10pF and over, 30pF and below : Q≧275+5C/2
C:Nominal Capacitance(pF)
I.R. More than 1,000MΩ
Table A-1
■SPECIFICATIONS AND TEST METHODS
Specification
10pF and below : Q≧200+10C
C:Nominal Capacitance(pF)
10pF and below : Q≧200+10C
High Temperature
Step
Temp.(C)
Time (min)
1
Min.
Operating Temp.+0/-3
30±3
2
Room Temp
2 to 3
3
Max.
Operating Temp.+3/-0
30±3
4
Room Temp
2 to 3
Char.
Nominal Values
(ppm/C) Note 2
Capacitance Change from 25C (%)
-55
-30
-10
Max.
Min.
Max.
Min.
Max.
Min.
5C
030
0.58
-0.24
0.40
-0.17
0.25
-0.11
Note2:Nominal values denote the temperature coefficient within a range of 25℃to 125℃(for 5C)
Char.
Nominal Values
(ppm/C) Note 1
Capacitance Change from 20C (%)
-55
-25
-10
Max.
Min.
Max.
Min.
Max.
Min.
2C
060
0.82
-0.45
0.49
-0.27
0.33
-0.18
Note1:Nominal values denote the temperature coefficient within a range of 20℃to 125℃(for 2C)
JEMCNS-0022C 3

Test method : Deflection
・Test substrate ・Test substrate
Material : Copper-clad laminated sheets for PCBs Material : Copper-clad laminated sheets for PCBs
(Glass fabric base, epoxy resin) (Glass fabric base, epoxy resin)
Thickness : 1.6mm
Thickness : 1.6mm
Copper foil thickness : 0.035mm Copper foil thickness : 0.035mm
Gray colored part of Fig.1: Solder resist
（Coat with heat resistant resin for solder）
Fig.1 (in:mm) Fig.3 (in:mm)
Fig.2 (in:mm)
■SPECIFICATIONS AND TEST METHODS
＊2
4.0±0.1
8.0±0.3
3.5±0.05
0.05以下
＊1
φ1.5
+0.1
-0
Ａ
t
*1,2：2.0±0.05
1.75±0.1
Ｂ
100
40
a
c
b
Land
f4.5
c
＊2
4.0±0.1
8.0±0.3
3.5±0.05
0.05以下
＊1
φ1.5
+0.1
-0
Ａ
t
*1,2：2.0±0.05
1.75±0.1
Ｂ
a
c
b
ﾗﾝﾄﾞ
f4.5
c
Glass epoxy board
Solder resist
Baked electrode or
copper foil
b
45
45
R230
20
50
Flexure:≦1
Capacitance meter
Pressurizing
speed
1.0mm/sec.
Support
Capacitor
Pressurize
45
45
Type
a
b
c
GQM18
1.0
3.0
1.2
GQM21
1.2
4.0
1.65
Type
a
b
c
GQM18
1.0
3.0
1.2
GQM21
1.2
4.0
1.65
JEMCNS-0022C 4

1.Tape Carrier Packaging(Packaging Code:D/E/L/J/F/K)
1.1 Minimum Quantity(pcs./reel)
φ180mm reel φ330mm reel
Paper Tape Plastic Tape Paper Tape Plastic Tape
Code:D/E Code:L Code:J/ F Code:K
GQM18 4000 10000
GQM2
4000 10000
GQM2
1000 4000
1.2 Dimensions of Tape
(1)GQM18/21 (in mm)
Code GQM18 GQM21
A 1.05±0.1 1.55±0.15
B 1.85±0.1 2.3±0.15
(2)GQM22
Code GQM22
A 2.8*
B 3.5* *Nominal Value
PACKAGING
GQM Type
Type
4.0±0.1
4.0±0.1
2.0±0.05
φ1.5
+0.1
-0
1.75±0.1
8.0±0.3
3.5±0.05
1.1 max.
Ａ
Ｂ
8.0±0.3
4.0±0.1
3.5±0.05
1.75±0.1
Ａ
Ｂ
2.5 max.
2.0±0.1
φ1.5
+0.1
-0
4.0±0.1
0.25±0.1
JEMCNP-01900 5

PACKAGING
GQM Type
図
1
ﾁｯﾌﾟ詰め状態
(
単位：
mm)
φ21±0.8
10±1.5
16.5 max.
Top Tape : Thickness 0.06
Feeding Hole :As specified in 1.2.
Hole for Chip : As specified in 1.2.
Base Tape : As specified in 1.2.
Bottom Tape :Thickness 0.05
(Only a bottom tape existence )
φ180+0/-3.0
φ330±2.0
φ50 min.
φ13±0.5
2.0±0.5
Chip
(in mm)
Fig.1 Package Chips
Fig.2 Dimensions of Reel
Fig.3 Taping Diagram
JEMCNP-01900 6

1.3 Tapes for capacitors are wound clockwise shown in Fig.3.
(The sprocket holes are to the right as the tape is pulled toward the user.)
1.4 Part of the leader and part of the vacant section are attached as follows. (in mm)
1.5 Accumulate pitch : 10 of sprocket holes pitch = 40±0.3mm
1.6 Chip in the tape is enclosed by top tape and bottom tape as shown in Fig.1.
1.7 The top tape and base tape are not attached at the end of the tape for a minimum of 5 pitches.
1.8 There are no jointing for top tape and bottom tape.
1.9 There are no fuzz in the cavity.
1.10 Break down force of top tape : 5N min.
Break down force of bottom tape : 5N min. (Only a bottom tape existence )
1.11 Reel is made by resin and appeaser and dimension is shown in Fig 1.
There are possibly to change the material and dimension due to some impairment.
1.12 Peeling off force : 0.1N to 0.6N in the direction as shown below.
1.13 Label that show the customer part number, our part number, our company name, inspection
number and quantity, will be put in outside of reel.
PACKAGING
GQM Type
図
1
ﾁｯﾌﾟ詰め状態
(
単位：
mm)
Tail vacant Section
Chip-mounting Unit
Leader vacant Section
Leader Unit
(Top Tape only)
Direction
of Feed
160 min.
190 min.
210 min.
図
1
ﾁｯﾌﾟ詰め状態
(
単位：
mm)
165～180°
Top tape
JEMCNP-01900 7

Caution
■Limitation of use
Please contact our sales representatives or product engineers before using our products for the applications
listed below which require of our products for other applications than specified in this product.
①Aircraft equipment ②Aerospace equipment ③Undersea equipment ④Power plant control equipment
⑤Medical equipment ⑥Transportation equipment(vehicles,trains,ships,etc.) ⑦Traffic signal equipment
⑧Disaster prevention / crime prevention equipment ⑨Data-processing equipment
⑩Application of similar complexity and/or requirements to the applications listed in the above
■Storage and Operation condition
1. The performance of chip monolithic ceramic capacitors may be affected by the storage conditions.
1-1. Store capacitors in the following conditions: Temperature of +5℃to +40℃and a Relative Humidity
of 20% to 70%.
(1) Sunlight, dust, rapid temperature changes, corrosive gas atmosphere or high temperature and humidity
conditions during storage may affect the solderability and the packaging performance
Please use product within six months of receipt.
(2) Please confirm solderability before using after six months.
Store the capacitors without opening the original bag.
Even if the storage period is short, do not exceed the specified atmospheric conditions.
1-2. Corrosive gas can react with the termination (external) electrodes or lead wires of capacitors, and result
in poor solderability. Do not store the capacitors in an atmosphere consisting of corrosive gas (e.g.,
hydrogen sulfide, sulfur dioxide, chlorine, ammonia gas etc.).
1-3. Due to moisture condensation caused by rapid humidity changes, or the photochemical change caused
by direct sunlight on the terminal electrodes and/or the resin/epoxy coatings, the solderability and
electrical performance may deteriorate. Do not store capacitors under direct sunlight or in high huimidity
conditions
!
JEMCNC-0012L 8

■Rating
1.Temperature Dependent Characteristics
1. The electrical characteristics of the capacitor can change with temperature.
1-1. For capacitors having larger temperature dependency, the capacitance may change with temperature changes.
The following actions are recommended in order to insure suitable capacitance values.
(1) Select a suitable capacitance for the operating temperature range.
(2) The capacitance may change within the rated temperature.
When you use a high dielectric constant type capacitors in a circuit that needs a tight (narrow) capacitance
tolerance.
Example: a time constant circuit., please carefully consider the characteristics of these capacitors,
such as their aging, voltage, and temperature characteristics.
And check capacitors using your actual appliances at the intended environment and operating conditions.
□Typical temperature characteristics Char.R6 (X5R)
□Typical temperature characteristics Char.R7 (X7R)
□Typical temperature characteristics Char.F5 (Y5V)
2.Measurement of Capacitance
1. Measure capacitance with the voltage and the frequency specified in the product specifications.
1-1. The output voltage of the measuring equipment may decrease when capacitance is high occasionally.
Please confirm whether a prescribed measured voltage is impressed to the capacitor.
1-2. The capacitance values of high dielectric constant type capacitors change depending on the AC voltage
applied.
Please consider the AC voltage characteristics when selecting a capacitor to be used in a AC circuit.
Caution
-20
-15
-10
-5
0
5
10
15
20
-75 -50 -25 025 50 75 100
Capacitance Change (%)
Temperature (℃)
-100
-80
-60
-40
-20
0
20
40
-50 -25 025 50 75 100
Capacitance Change (%)
Temperature (℃)
-20
-15
-10
-5
0
5
10
15
20
-75 -50 -25 025 50 75 100 125 150
Capacitance Change (%)
Temperature (℃)
!
JEMCNC-0012L 9

3.Applied Voltage
1. Do not apply a voltage to the capacitor that exceeds the rated voltage as called-out in the specifications.
1-1. Applied voltage between the terminals of a capacitor shall be less than or equal to the rated voltage.
(1) When AC voltage is superimposed on DC voltage, the zero-to-peak voltage shall not exceed the
rated DC voltage.
When AC voltage or pulse voltage is applied, the peak-to-peak voltage shall not exceed the
rated DC voltage.
(2) Abnormal voltages (surge voltage, static electricity, pulse voltage, etc.) shall not exceed the
rated DC voltage.
Typical voltage applied to the DC capacitor
DC voltage DC voltage+AC AC voltage Pulse voltage
（E：Maximum possible applied voltage.）
1-2. Influence of overvoltage
Overvoltage that is applied to the capacitor may result in an electrical short circuit caused by the
breakdown of the internal dielectric layers .
The time duration until breakdown depends on the applied voltage and the ambient temperature.
4. Applied Voltage and Self-heating Temperature
1. When the capacitor is used in a high-frequency voltage, pulse voltage, application,
be sure to take into account self-heating may be caused by resistant factors of the capacitor.
1-1. The load should be contained to the level such that when measuring at atomospheric temperature of 25℃,
the product's self-heating remains below 20℃and surface temperature of the capacitor in the actual circuit
remains wiyhin the maximum operating temperature.
Caution
E E E E
0 0
0
0
!
JEMCNC-0012L 10