Murata GQM2195C2E3R6CB12 Series User manual

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GQM2195C2E3R6CB12_ (0805, C0G, 3.6pF, 250Vdc)
_: packaging code Reference Sheet
1.Scope
2.MURATA Part NO. System
(Ex.)
3. Type & Dimensions
(Unit:mm)
4.Rated value
5.Package
Product specifications in this catalog are as of Jan.25,2013,and are subject to change or obsolescence without notice.
Please consult the approval sheet before ordering.
Please read rating and !Cautions first.
mark
(4)
DC Rated
Voltage
Packaging Unit
RF HIGH FREQUENCY CHIP MONOLITHIC CERAMIC CAPACITOR
g
0.2 to 0.7
(5) Nominal
Capacitance
(6)
Capacitance
Tolerance
250 Vdc
3.6 pF
Temp. Range
(Ref.Temp.)
(8) Packaging
(1)-2 W
1.25±0.15
e
±0.25 pF
-55 to 125 °C
0±30 ppm/°C
25 to 125 °C
(25 °C)
(3) Temperature Characteristics
(Public STD Code):C0G(EIA)
Specifications and Test
Methods
(Operationg
Temp. Range)
Temp. coeff
or Cap. Change
D
f180mm Reel
PAPER W8P4
4000 pcs./Reel
0.7 min.
(2) T
0.85±0.15
This product specification is applied to RF High Frequency Chip Monolithic Ceramic Capacitor used for RF High frequency
Electronic equipment.
(1)-1 L
2.0±0.15
(1)L/W
Dimensions
(2)T
Dimensions
(3)Temperature
Characteristics
(4)DC Rated
Voltage
(5)Nominal
Capacitance
(6)Capacitance
Tolerance
(8)Packaging
Code
(7)Murata’s
Control Code
T
L
W
e
e
g
GQM 21 95C 2E 3R6 C B12 D
GQM2195C2E3R6CB12-01 1

No Item Test Method
1 Operating
2C,5C : -55℃to 125℃
Temperature Range
2 Rated Voltage See the previous pages. The rated voltage is defined as the maximum voltage which may be
applied continuously to the capacitor.
When AC voltage is superimposed on DC voltage, VP-P or VO-P,
whichever is larger, should be maintained within the rated
voltage range.
3 Appearance No defects or abnormalities. Visual inspection.
4 Dimension Within the specified dimensions. Using calipers.
5 Dielectric Strength No defects or abnormalities. No failure should be observed when 250% of the rated
voltage is applied between the terminations for 1 to 5
seconds, provided the charge/discharge current is less
than 50mA.
6 Insulation
More than 10,000MΩThe insulation resistance should be measured with a DC
Resistance
voltage not exceeding the rated voltage at 20℃/25℃
and 75%RH max. and within 2 minutes of charging.
7 Capacitance Within the specified tolerance.
The capacitance/Q should be measured at 20℃/25℃
at the frequency and voltage shown in the table.
8 Q
30pFmin. : Q≧1400
30pFmax.: Q≧800+20C
C:NominalCapacitance (pF)
9Capacitance Capacitance Within the specified tolerance.(Table A-1) The temperature coefficient is determind using the
Temperature
Change capacitance measured in step 3 as a reference.
Characteristics When cycling the temperature sequentially from step 1
through 5 the capacitance should be within the specified
tolerance for the temperature coefficient and capacitance
Temperature Within the specified tolerance.(Table A-1) change as Table A-1.
Coefficent The capacitance drift is caluculated by dividing the
differences betweeen the maximum and minimum measured
values in the step 1,3 and 5 by the cap. value in step 3.
Capacitance Within ±0.2% or ±0.05pF
Drift (Whichever is larger.)
10 Adhesive Strength of No removal of the terminations or other defect should occur. Solder the capacitor on the test jig (glass epoxy
Termination board)shown in Fig.3 using an eutectic solder. Then apply
10N* force in parallel with the test jig for 10+/-1sec.
The soldering should be done either with an iron or using the
reflow method and should be conducted with care so that the
soldering is uniform and free of defects such as heat shock.
*5N（GQM18)
11 Vibration  Appearance No defects or abnormalities.
Solder the capacitor on the test jig (glass epoxy board) in the
Resistance same manner and under the same conditions as (10).
Capacitance Within the specified tolerance. The capacitor should be subjected to a simple harmonic
motion having a total amplitude of 1.5mm, the frequency
Q
30pFmin. : Q≧1400 being varied uniformly between the approximate limits of 10
30pFmax.: Q≧800+20C and 55Hz. The frequency range, from 10 to 55Hz and return
to 10Hz, should be traversed in approximately 1 minute. This
C:NominalCapacitance (pF)
motion should be applied for a period of 2 hours in each 3
mutually perpendicular directions(total of 6 hours).
12 Deflection Appearance No marking defects.
Solder the capacitor on the test jig (glass epoxy board)
shown in Fig.1 using an eutectic solder. Then apply a force
Capacitance
Within ±5％or ±0.5pF in the direction shown in Fig 2. The soldering
Change (Whichever is larger) should be done by the reflow method and should be
conducted with care so that the soldering is uniform and free
of defects such as heat shock.
13 Solderability 75% of the terminations is to be soldered evenly Immerse the capacitor in a solution of ethanol (JIS-K-8101)
of Termination and continuously. and rosin (JIS-K-5902) (25% rosin in weight propotion) .
Preheat at 80 to 120℃for 10 to 30 seconds.
After preheating, immerse in an eutectic solder solution for
2+/-0.5 seconds at 230+/-5℃or Sn-3.0Ag-0.5Cu solder
solution for 2+/-0.5 seconds at 245+/-5℃
■SPECIFICATIONS AND TEST METHODS
Specification
Char.
Item
ΔC
(1000pF and below)
Frequency
10.1MHz
Voltage
0.5 to 5Vrms
Step
Temperature(C)
1
202 / 252
2
-553
3
202 / 252
4
1253
5
202 / 252
JEMCNS-0022C 2

No Item Test Method
14 Resistance to The measured and observed characteristics shall satisfy
Preheat the capacitor at 120 to 150℃for 1 minute.
Soldering Heat the specifications in the following table. Immerse the capacitor in an eutectic solder solution or
Appearance No defects or abnormalities.
Sn-3.0Ag-0.5Cu solder solution at 270+/-5℃for
10+/-0.5 seconds. Let sit at room temperature for 24+/-2
Capacitance
Within ±2.5% or ±0.25 pF hours.
Change (Whichever is larger)
Q
30pFmin.:Q≧1400
30pFmax.:Q≧800+20C
C:NominalCapacitance (pF)
I.R. More than 10,000MΩ
Dielectric No defects.
Strength
15 Temperature The measured and observed characteristics shall satisfy
Fix the capacitor to the supporting jig in the same
Cycle the specifications in the following table. manner and under the same conditions as (10).
Appearance No defects or abnormalities.
Perform the five cycles according to the four heat
treatments listed in the following table.
Capacitance
Within ±2.5% or ±0.25pF Let sit for 24+/-2 hours at room temperature, then measure.
Change (Whichever is larger)
Q
30pFmin. : Q≧1400
30pFmax.: Q≧800+20C
C:NominalCapacitance (pF)
I.R. More than 10,000MΩ
Dielectric No defects.
Strength
16
Humidity The measured and observed characteristics shall satisfy Sit the capacitor at 40±2℃and 90 to 95% humiduty for
Steady
the specifications in the following table.
500±12 hours.
Appearance No defects or abnormalities.
Remove and let sit for 24±2 hours (temperature compensating type)
at room temperature, then measure.
Capacitance
Within ±5％or ±0.5pF
Change (Whichever is larger)
Q
30pF and over : Q≧350
10pF and over, 30pF and below : Q≧275+5C/2
C:Nominal Capacitance(pF)
I.R. More than 1,000MΩ
17
Humidity
The measured and observed characteristics shall satisfy
Apply the rated voltage at 40±2℃and 90 to 95% humidity
the specifications in the following table.
for 500±12 hours.
Appearance No defects or abnormalities.
Remove and let sit for 24±2 hours at room temprature then
muasure. The charge/discharge current is less than 50mA.
Capacitance
Within ±7.5% or ±0.75pF
Change (Whichever is larger)
Q
30pF and over : Q≧200
30pF and below : Q≧100+10C/3
I.R. More than 500MΩ
18 The measured and observed characteristics shall satisfy
Apply 200% of the rated voltage for 1000±12 hours at the
Load the specifications in the following table. maximun operating temperature±3℃.
Appearance No defects or abnormalities.
Let sit for 24±2 hours (temperature compensating type) aｔ
room temperature, then measure.
Capacitance
Within ±3% or ±0.3pF The charge/discharge current is less than 50mA
Change (Whichever is larger)
Q
30pF and over : Q≧350
10pF and over, 30pF and below : Q≧275+5C/2
C:Nominal Capacitance(pF)
I.R. More than 1,000MΩ
Table A-1
■SPECIFICATIONS AND TEST METHODS
Specification
10pF and below : Q≧200+10C
C:Nominal Capacitance(pF)
10pF and below : Q≧200+10C
High Temperature
Step
Temp.(C)
Time (min)
1
Min.
Operating Temp.+0/-3
30±3
2
Room Temp
2 to 3
3
Max.
Operating Temp.+3/-0
30±3
4
Room Temp
2 to 3
Char.
Nominal Values
(ppm/C) Note 2
Capacitance Change from 25C (%)
-55
-30
-10
Max.
Min.
Max.
Min.
Max.
Min.
5C
030
0.58
-0.24
0.40
-0.17
0.25
-0.11
Note2:Nominal values denote the temperature coefficient within a range of 25℃to 125℃(for 5C)
Char.
Nominal Values
(ppm/C) Note 1
Capacitance Change from 20C (%)
-55
-25
-10
Max.
Min.
Max.
Min.
Max.
Min.
2C
060
0.82
-0.45
0.49
-0.27
0.33
-0.18
Note1:Nominal values denote the temperature coefficient within a range of 20℃to 125℃(for 2C)
JEMCNS-0022C 3

Test method : Deflection
・Test substrate ・Test substrate
Material : Copper-clad laminated sheets for PCBs Material : Copper-clad laminated sheets for PCBs
(Glass fabric base, epoxy resin) (Glass fabric base, epoxy resin)
Thickness : 1.6mm
Thickness : 1.6mm
Copper foil thickness : 0.035mm Copper foil thickness : 0.035mm
Gray colored part of Fig.1: Solder resist
（Coat with heat resistant resin for solder）
Fig.1 (in:mm) Fig.3 (in:mm)
Fig.2 (in:mm)
■SPECIFICATIONS AND TEST METHODS
＊
±
±
±
以下
＊
φ1.5
Ａ
： ±
±
Ｂ
100
40
a
c
b
Land
f4.5
c
＊
±
±
±
以下
＊
φ1.5
Ａ
： ±
±
Ｂ
a
ﾗﾝﾄﾞ f
c
Glass epoxy board
Solder resist
Baked electrode or
copper foil
b
R230
20
50
Flexure:≦1
Capacitance meter
Pressurizing
speed
1.0mm/sec.
Pressurize
45
45
Type
a
b
c
GQM18
1.0
3.0
1.2
GQM21
1.2
4.0
1.65
Type
a
b
c
GQM18
1.0
3.0
1.2
GQM21
1.2
4.0
1.65
JEMCNS-0022C 4

1.Tape Carrier Packaging(Packaging Code:D/E/L/J/F/K)
1.1 Minimum Quantity(pcs./reel)
φ180mm reel φ330mm reel
Paper Tape Plastic Tape Paper Tape Plastic Tape
Code:D/E Code:L Code:J/ F Code:K
GQM18 4000 10000
GQM2
4000 10000
GQM2
1000 4000
1.2 Dimensions of Tape
(1)GQM18/21 (in mm)
Code GQM18 GQM21
A 1.05±0.1 1.55±0.15
B 1.85±0.1 2.3±0.15
(2)GQM22
Code GQM22
A 2.8*
B 3.5* *Nominal Value
PACKAGING
GQM Type
Type
4.0±0.1
4.0±0.1
2.0±0.05
φ1.5
+0.1
-0
1.75±0.1
8.0±0.3
3.5±0.05
1.1 max.
Ａ
Ｂ
8.0±0.3
4.0±0.1
3.5±0.05
1.75±0.1
Ａ
Ｂ
2.5 max.
2.0±0.1
φ1.5
+0.1
-0
4.0±0.1
0.25±0.1
JEMCNP-01900 5

PACKAGING
GQM Type
図 ﾁｯﾌﾟ詰め状態 単位：
φ21±0.8
10±1.5
16.5 max.
Top Tape : Thickness 0.06
Feeding Hole :As specified in 1.2.
Hole for Chip : As specified in 1.2.
Base Tape : As specified in 1.2.
Bottom Tape :Thickness 0.05
(Only a bottom tape existence )
φ180+0/-3.0
φ330±2.0
φ50 min.
φ13±0.5
2.0±0.5
Chip
(in mm)
Fig.1 Package Chips
Fig.2 Dimensions of Reel
Fig.3 Taping Diagram
JEMCNP-01900 6

1.3 Tapes for capacitors are wound clockwise shown in Fig.3.
(The sprocket holes are to the right as the tape is pulled toward the user.)
1.4 Part of the leader and part of the vacant section are attached as follows.
(in mm)
1.5 Accumulate pitch : 10 of sprocket holes pitch = 40±0.3mm
1.6 Chip in the tape is enclosed by top tape and bottom tape as shown in Fig.1.
1.7 The top tape and base tape are not attached at the end of the tape for a minimum of 5 pitches.
1.8 There are no jointing for top tape and bottom tape.
1.9 There are no fuzz in the cavity.
1.10 Break down force of top tape : 5N min.
Break down force of bottom tape : 5N min. (Only a bottom tape existence )
1.11 Reel is made by resin and appeaser and dimension is shown in Fig 1.
There are possibly to change the material and dimension due to some impairment.
1.12 Peeling off force : 0.1N to 0.6N in the direction as shown below.
1.13 Label that show the customer part number, our part number, our company name, inspection
number and quantity, will be put in outside of reel.
PACKAGING
GQM Type
図 ﾁｯﾌﾟ詰め状態 単位：
Tail vacant Section
Chip-mounting Unit
Leader vacant Section
Leader Unit
(Top Tape only)
Direction
of Feed
160 min.
190 min.
210 min.
図 ﾁｯﾌﾟ詰め状態 単位：
165～180°
Top tape
JEMCNP-01900 7

Caution
■Limitation of use
Please contact our sales representatives or product engineers before using our products for the applications
listed below which require of our products for other applications than specified in this product.
①Aircraft equipment ②Aerospace equipment ③Undersea equipment ④Power plant control equipment
⑤Medical equipment ⑥Transportation equipment(vehicles,trains,ships,etc.) ⑦Traffic signal equipment
⑧Disaster prevention / crime prevention equipment ⑨Data-processing equipment
⑩Application of similar complexity and/or requirements to the applications listed in the above
■Storage and Operation condition
1. The performance of chip monolithic ceramic capacitors may be affected by the storage conditions.
1-1. Store capacitors in the following conditions: Temperature of +5℃to +40℃and a Relative Humidity
of 20% to 70%.
(1) Sunlight, dust, rapid temperature changes, corrosive gas atmosphere or high temperature and humidity
conditions during storage may affect the solderability and the packaging performance
Please use product within six months of receipt.
(2) Please confirm solderability before using after six months.
Store the capacitors without opening the original bag.
Even if the storage period is short, do not exceed the specified atmospheric conditions.
1-2. Corrosive gas can react with the termination (external) electrodes or lead wires of capacitors, and result
in poor solderability. Do not store the capacitors in an atmosphere consisting of corrosive gas (e.g.,
hydrogen sulfide, sulfur dioxide, chlorine, ammonia gas etc.).
1-3. Due to moisture condensation caused by rapid humidity changes, or the photochemical change caused
by direct sunlight on the terminal electrodes and/or the resin/epoxy coatings, the solderability and
electrical performance may deteriorate. Do not store capacitors under direct sunlight or in high huimidity
conditions
!
JEMCNC-0012L 8

■Rating
1.Temperature Dependent Characteristics
1. The electrical characteristics of the capacitor can change with temperature.
1-1. For capacitors having larger temperature dependency, the capacitance may change with temperature chang
The following actions are recommended in order to insure suitable capacitance values.
(1) Select a suitable capacitance for the operating temperature range.
(2) The capacitance may change within the rated temperature.
When you use a high dielectric constant type capacitors in a circuit that needs a tight (narrow) capacitance
tolerance.
Example: a time constant circuit., please carefully consider the characteristics of these capacitors,
such as their aging, voltage, and temperature characteristics.
And check capacitors using your actual appliances at the intended environment and operating conditions.
□Typical temperature characteristics Char.R6 (X5R)
□Typical temperature characteristics Char.R7 (X7R)
□Typical temperature characteristics Char.F5 (Y5V)
2.Measurement of Capacitance
1. Measure capacitance with the voltage and the frequency specified in the product specifications.
1-1. The output voltage of the measuring equipment may decrease when capacitance is high occasionally.
Please confirm whether a prescribed measured voltage is impressed to the capacitor.
1-2. The capacitance values of high dielectric constant type capacitors change depending on the AC voltage
applied.
Please consider the AC voltage characteristics when selecting a capacitor to be used in a AC circuit.
Caution
-20
-15
-10
-5
0
5
10
15
20
-75 -50 -25 025 50 75 100
Capacitance Change (%)
Temperature (℃)
-100
-80
-60
-40
-20
0
20
40
-50 -25 025 50 75 100
Capacitance Change (%)
Temperature (℃)
-20
-15
-10
-5
0
5
10
15
20
-75 -50 -25 025 50 75 100 125 150
Capacitance Change (%)
Temperature (℃)
!
JEMCNC-0012L 9

3.Applied Voltage
1. Do not apply a voltage to the capacitor that exceeds the rated voltage as called-out in the specifications.
1-1. Applied voltage between the terminals of a capacitor shall be less than or equal to the rated voltage.
(1) When AC voltage is superimposed on DC voltage, the zero-to-peak voltage shall not exceed the
rated DC voltage.
When AC voltage or pulse voltage is applied, the peak-to-peak voltage shall not exceed the
rated DC voltage.
(2) Abnormal voltages (surge voltage, static electricity, pulse voltage, etc.) shall not exceed the
rated DC voltage.
Typical voltage applied to the DC capacitor
DC voltage DC voltage+AC AC voltage Pulse voltage
（E：Maximum possible applied voltage.）
1-2. Influence of overvoltage
Overvoltage that is applied to the capacitor may result in an electrical short circuit caused by the
breakdown of the internal dielectric layers .
The time duration until breakdown depends on the applied voltage and the ambient temperature.
4. Applied Voltage and Self-heating Temperature
1. When the capacitor is used in a high-frequency voltage, pulse voltage, application,
be sure to take into account self-heating may be caused by resistant factors of the capacitor.
1-1. The load should be contained to the level such that when measuring at atomospheric temperature of 25℃,
the product's self-heating remains below 20℃and surface temperature of the capacitor in the actual circuit
remains wiyhin the maximum operating temperature.
Caution
E E E E
0 0
0
0
!
JEMCNC-0012L 10

5. DC Voltage and AC Voltage Characteristic
1. The capacitance value of a high dielectric constant type capacitor changes depending on the DC
voltage applied.
Please consider the DC voltage characteristics when a capacitor is selected for use in a DC circuit.
1-1. The capacitance of ceramic capacitors may change sharply depending on the applied voltage. (See figure)
Please confirm the following in order to secure the capacitance.
(1) Whether the capacitance change caused by the
applied voltage is within the range allowed or not.
□DC voltage characteristics
(2) In the DC voltage characteristics, the rate of capacitance
change becomes larger as voltage increases.
Even if the applied voltage is below the rated voltage.
When a high dielectric constant type capacitor is in a
circuit that needs a tight (narrow) capacitance tolerance.
Example: a time constant circuit., please carefully
consider the characteristics of these capacitors, such as
their aging, voltage, and temperature characteristics.
And check capacitors using your actual appliances at the
intended environment and operating conditions.
2. The capacitance values of high dielectric constant type capacitors change depending on the AC voltage applied.
Please consider the AC voltage characteristics when selecting a capacitor to be used in a AC circuit.
□AC voltage characteristics
6. Capacitance Aging
1. The high dielectric constant type capacitors have the characteristic
in which the capacitance value decreases with passage of time.
When you use a high dielectric constant type capacitors in a circuit that needs a tight (narrow) capacitance
tolerance. Example: a time constant circuit., please carefully consider the characteristics of these capacitors,
such as their aging, voltage, and temperature characteristics.
And check capacitors using your actual appliances at the intended environment and operating conditions.
Caution
-60
-50
-40
-30
-20
-10
0
10
20
30
0.0 0.5 1.0 1.5 2.0 2.5
Capacitance Change (%)
AC Voltage (Vr.ms.)
-100
-80
-60
-40
-20
0
20
02468
Capacitance Change(%)
DC Voltage (VDC)
-40
-30
-20
-10
0
10
20
10.0 100.0 1000.0 10000.0
Capacitor Change (%)
Time (Hr)
5
C
!
JEMCNC-0012L 11

7.Vibration and Shock
1. Please confirm the kind of vibration and/or shock, its condition, and any generation of resonance.
Please mount the capacitor so as not to generate resonance, and do not allow any impact on the terminals.
2. Mechanical shock due to falling may cause damage or a crack in the dielectric material of the capacitor.
Do not use a fallen capacitor because the quality and reliability may be deteriorated.
3. When printed circuit boards are piled up or handled, the corners of another printed circuit board
should not be allowed to hit the capacitor in order to avoid a crack or other damage to the capacitor.
■Soldering and Mounting
1.Mounting Position
1. Confirm the best mounting position and direction that minimizes the stress imposed on the capacitor
during flexing or bending the printed circuit board.
1-1.Choose a mounting position that minimizes the stress imposed on the chip during flexing or bending
of the board.
[Component Direction]
Locate chip
horizontal to the
direction in
which stress
acts
[Chip Mounting Close to Board Separation Point]
Chip arrangement
Worst A-C-(B~D) Best
Caution
Floor
Crack
Mounting printed circuit board
Crack
!
A
B
C
D
Perforation
Slit
JEMCNC-0012L 12

2.Information before mounting
1. Do Not re-use capacitors that were removed from the equipment.
2. Confirm capacitance characteristics under actual applied voltage.
3. Confirm the mechanical stress under actual process and equipment use.
4. Confirm the rated capacitance, rated voltage and other electrical characteristics before assembly.
5. Prior to use, confirm the Solderability for the capacitors that were in long-term storage.
6. Prior to measuring capacitance, carry out a heat treatment for capacitors that were in long-term storage.
7.The use of Sn-Zn based solder will deteriorate the reliability of the MLCC.
Please contact our sales representative or product engineers on the use of Sn-Zn based solder in advanc
3.Maintenance of the Mounting (pick and place) Machine
1. Make sure that the following excessive forces are not applied to the capacitors.
1-1. In mounting the capacitors on the printed circuit board, any bending force against them shall be kept
to a minimum to prevent them from any bending damage or cracking. Please take into account the
following precautions and recommendations for use in your process.
(1) Adjust the lowest position of the pickup nozzle so as not to bend the printed circuit board.
(2) Adjust the nozzle pressure within a static load of 1N to 3N during mounting.
[Incorrect]
[Correct]
2.Dirt particles and dust accumulated between the suction nozzle and the cylinder inner wall prevent
the nozzle from moving smoothly. This imposes greater force upon the chip during mounting,
causing cracked chips. Also the locating claw, when worn out, imposes uneven forces on the chip
when positioning, causing cracked chips. The suction nozzle and the locating claw must be maintained,
checked and replaced periodically.
Caution
Suction Nozzle
Board
Deflection
Support Pin
Board Guide
!
JEMCNC-0012L 13

4-1.Reflow Soldering
1. When sudden heat is applied to the components, the [Standard Conditions for Reflow Soldering]
mechanical strength of the components will decrease
because a sudden temperature change causes Infrared Reflow
deformation inside the components. In order to prevent
mechanical damage to the components, preheating is
required for both the components and the PCB board.
Preheating conditions are shown in table 1. It is required to
keep the temperature differential between the solder and
the components surface (ΔT) as small as possible.
2. Solderability of Tin plating termination chips might be
deteriorated when a low temperature soldering profile where
the peak solder temperature is below the melting point of
Tin is used. Please confirm the Solderability of Tin plated
termination chips before use. Vapor Reflow
3. When components are immersed in solvent after mounting,
be sure to maintain the temperature difference (ΔT)
between the component and the solvent within the range
shown in the table 1.
Table 1
GQM18/21
ΔT≦190℃
GQM22
ΔT≦130℃[Allowable Soldering Temperature and Time]
Recommended Conditions
Pb-Sn Solder Lead Free Solder
Infrared Reflow Vapor Reflow
Peak Temperature
230～250℃230～240℃240～260℃
Atmosphere Air Air Air or N2
Pb-Sn Solder: Sn-37Pb Lead Free Solder: Sn-3.0Ag-0.5Cu
In case of repeated soldering, the accumulated
soldering time must be within the range shown above.
4. Optimum Solder Amount for Reflow Soldering
4-1. Overly thick application of solder paste results in
a excessive solder fillet height.
This makes the chip more susceptible to mechanical
and thermal stress on the board and may cause
the chips to crack. in section
4-2. Too little solder paste results in a lack of adhesive
strength on the outer electrode, which may result in
chips breaking loose from the PCB.
4-3. Make sure the solder has been applied smoothly to the end surface to a height of 0.2mm min.
Make sure not to impose any abnormal mechanical shocks to the PCB.
Inverting the PCB
Part Number
Temperature Differential
Caution
0.2mm min.
!
Soldering
Soldering
60-120 seconds
60-120 seconds
30-60 seconds
20 seconds
Soldering Temperature(℃)
280
270
260
250
240
230
220
Time
Time
Temperature(℃)
Peak Temperature
200℃
170℃
150℃
130℃
Gradual
Cooling
Temperature(℃)
Peak Temperature
170℃
150℃
130℃
Gradual
Cooling
0
30
60
90
120
Soldering Time(sec.)
Preheating
Preheating
JEMCNC-0012L 14

4-2.Flow Soldering
1. When sudden heat is applied to the components, the
mechanical strength of the components will decrease [Standard Conditions for Flow Soldering]
because a sudden temperature change causes
deformation inside the components. In order to prevent
mechanical damage in the components, preheating should
be required for both of the components and the PCB board.
Preheating conditions are shown in table 2. It is required to
keep temperature differential between the solder and
the components surface (ΔT) as small as possible.
2. Excessively long soldering time or high soldering
temperature can result in leaching of the outer electrodes,
causing poor adhesion or a reduction in capacitance value
due to loss of contact between electrodes and end termination.
3. When components are immersed in solvent after mounting, [Allowable Soldering Temperature and Time]
be sure to maintain the temperature difference (ΔT)
between the component and solvent within the range
shown in the table 2.
4. Do not apply flow soldering to GQM22 Series.
Table 2
GQM18/21/31
ΔT≦150℃
In case of repeated soldering, the accumulated
soldering time must be within the range shown above.
Recommended Conditions
Pb-Sn Solder
Lead Free Solder
90～110℃100～120℃
240～250℃250～260℃
Air N2
Pb-Sn Solder: Sn-37Pb Lead Free Solder: Sn-3.0Ag-0.5Cu
5. Optimum Solder Amount for Flow Soldering
5-1. The top of the solder fillet should be lower than the
thickness of components. If the solder amount is
excessive, the risk of cracking is higher during
board bending or any other stressful condition. in section
Preheating Peak Temperature
Soldering Peak Temperature
Atmosphere
Part Number
Caution
Temperature Differential
Up to Chip Thickness
Adhesive
!
Temperature(℃)
Soldering Peak
Preheating Peak
Soldering
Gradual
Cooling
Preheating
△Ｔ
30-90 seconds
5 seconds max.
Time
280
270
260
240
230
220
250
Soldering Temperature(℃)
0
30
60
90
120
Soldering Time(sec.)
JEMCNC-0012L 15

4-3.Correction with a Soldering Iron
1. When sudden heat is applied to the components when using a soldering iron, the mechanical strength of
the components will decrease because the extreme temperature change can cause deformations inside the
components. In order to prevent mechanical damage to the components, preheating is required for both
the components and the PCB board. Preheating conditions, (The "Temperature of the Soldering Iron tip",
"Preheating Temperature", "Temperature Differential" between the iron tip and the components and the
PCB), should be within the conditions of table 3. It is required to keep the temperature differential
between the soldering Iron and the component surfaces (ΔT) as small as possible.
2. After soldering, do not allow the component/PCB to rapidly cool down.
3. The operating time for the re-working should be as short as possible. When re-working time is
too long, it may cause solder leaching, and that will cause a reduction in the adhesive
strength of the terminations.
Table 3
*Applicable for both Pb-Sn and Lead Free Solder. Pb-Sn Solder: Sn-37Pb
Lead Free Solder: Sn-3.0Ag-0.5Cu
4. Optimum Solder amount when re-working with a Soldering lron
4-1. In case of sizes smaller than 0603, (GQM18), the top of
the solder fillet should be lower than 2/3's of the thickness
of the component or 0.5mm whichever is smaller.
In case of 0805 and larger sizes, (GQM21/22), the top of
the solder fillet should be lower than 2/3's of the thickness in section
of the component. If the solder amount is excessive, the
risk of cracking is higher during board bending or under
any other stressful condition.
4-2. A Soldering iron with a tip of ø3mm or smaller should be used. It is also necessary to keep
the soldering iron from touching the components during the re-work.
4-3. Solder wire with ø0.5mm or smaller is required for soldering.
4-4.Leaded Component Insertion
1. If the PCB is flexed when leaded components (such as transformers and ICs) are being mounted,
chips may crack and solder joints may break.
Before mounting leaded components, support the PCB using backup pins or special jigs to prevent warping.
Caution
Air
Temperature
of Soldering
Iron tip
Preheating
Temperature
GQM22
280℃max.
150℃min.
ΔT≦130℃
350℃max.
150℃min.
ΔT≦190℃
Air
Part Number
Temperature
Differential
(ΔT)
Atmosphere
GQM18/21
Solder Amount
!
JEMCNC-0012L 16

5.Washing
Excessive ultrasonic oscillation during cleaning can cause the PCBs to resonate,
resulting in cracked chips or broken solder joints. Take note not to vibrate PCBs.
6.Electrical Test on Printed Circuit Board
1. Confirm position of the support pin or specific jig, when inspecting the electrical performance of a
capacitor after mounting on the printed circuit board.
1-1. Avoid bending printed circuit board by the pressure of a test pin, etc.
The thrusting force of the test probe can flex the PCB, resulting in cracked chips or open solder joints.
Provide support pins on the back side of the PCB to prevent warping or flexing.
1-2. Avoid vibration of the board by shock when a test pin contacts a printed circuit board.
□Not recommended □Recommended
Caution
←Support pin
←Test-pin
←Peeling
←Test-pin
!
JEMCNC-0012L 17

7.Printed Circuit Board Cropping
1. After mounting a capacitor on a printed circuit board, do not apply any stress to the capacitor that is
caused by bending or twisting the board.
1-1. In cropping the board, the stress as shown right may cause the capacitor to crack.
Try not to apply this type of stress to a capacitor.
Bending Twisting
2. Check of the cropping method for the printed circuit board in advance.
2-1. Printed circuit board cropping shall be carried out by using a jig or an apparatus to prevent the
mechanical stress which can occur to the board.
(1) Example of a suitable jig
Recommended example: the board should be pushed as close to the near the cropping jig as possible
and from the back side of board in order to minimize the compressive stress applied to capacitor.
Not recommended example* when the board is pushed at a point far from the cropping jig and from
the front side of board as below, the capacitor may form a crack caused by the tensile stress applied
to capacitor.
Outline of jig
(2) Example of a suitable machine
An outline of a printed circuit board cropping machine is shown as follows. Along the lines with the
V-grooves on printed circuit board, the top and bottom blades are aligned to one another when
cropping the board.
The misalignment of the position between top and bottom blades may cause the capacitor to crack.
Outline of machine Principle of operation
Cross-section diagram
Top blade Top blade Top blade Top blade
Bottom blade Bottom blade Bottom blade Bottom blade
Caution
Recommended
Not recommended
Top-bottom misalignment
Left-right misalignment
Front-rear misalignment
Recommended
Not recommended
Printed circuit
board
V-groove
Board cropping jig
Printed circuit board
Top blade
V-groove
Bottom blade
Load point
Direction of
load
Components
Printed circuit
board
Direction of
load
Load point
Components
Printed circuit
board
Top blade
Printed circuit board
V-groove
!
JEMCNC-0012L 18

■Others
1. Under Operation of Equipment
1-1. Do not touch a capacitor directly with bare hands during operation in order to avoid the danger of
a electric shock.
1-2. Do not allow the terminals of a capacitor to come in contact with any conductive objects (short-circuit).
Do not expose a capacitor to a conductive liquid, inducing any acid or alkali solutions.
1-3. Confirm the environment in which the equipment will operation is under the specified conditions.
Do not use the equipment under the following environment.
(1) Being spattered with water or oil.
(2) Being exposed to direct sunlight.
(3) Being exposed to Ozone, ultraviolet rays or radiation.
(4) Being exposed to toxic gas (e.g., hydrogen sulfide, sulfur dioxide, chlorine, ammonia gas etc.)
(5) Any vibrations or mechanical shocks exceeding the specified limits.
(6) Moisture condensing environments.
1-4. Use damp proof countermeasures if using under any conditions that can cause condensation.
2. Others
2-1. In an Emergency
(1) If the equipment should generate smoke, fire or smell, immediately turn off or unplug the equipment.
If the equipment is not turned off or unplugged, the hazards may be worsened by supplying
continuous power.
(2) In this type of situation, do not allow face and hands to come in contact with the capacitor or burns
may be caused by the capacitors high temperature.
2-2. Disposal of waste
When capacitors are disposed, they must be burned or buried by the industrial waste vender with
the appropriate licenses.
2-3. Circuit Design
GQM Series capacitors in this specification are not safety recognized products.
And do not use for general power supplies and lighting.
2-4. Remarks
Failure to follow the cautions may result, worst case, in a short circuit and smoking when the product
is used.
The above notices are for standard applications and conditions. Contact us when the products are
used in special mounting conditions.
Select optimum conditions for operation as they determine the reliability of the product after assembly.
The data herein are given in typical values, not guaranteed ratings.
Caution
!
JEMCNC-0012L 19