Murata GRM0225C1C150JD05 Series User manual

GRM0225C1C150JD05_ (01005, C0G, 15pF, DC16V)
_: packaging code Reference Sheet
1.Scope
2.MURATA Part NO. System
(Ex.)
3. Type & Dimensions
(Unit:mm)
4.Rated value
5.Package
Product specifications in this catalog are as of Apr.12,2015,and are subject to change or obsolescence without notice.
Please consult the approval sheet before ordering.
Please read rating and !Cautions first.
0.13 min.
(1)-1 L
0.4±0.02
(1)-2 W
0.2±0.02
e
Chip Monolithic Ceramic Capacitor for General
Packaging Unit
DC 16 V
Temp. Range
(Ref.Temp.)
(8) Packaging
(6)
Capacitance
Tolerance
15 pF
Temp. coeff
or Cap. Change
±5 %
This product specification is applied to Chip Monolithic Ceramic Capacitor used for General Electronic equipment.
(2) T
0.2±0.02
-55 to 125 °C
0±30 ppm/°C
25 to 125 °C
(25 °C)
(4)
Rated
Voltage
Specifications and Test
Methods
(Operating
Temp. Range)
L
f180mm Reel
EMBOSSED W4P1
40000 pcs./Reel
(3) Temperature Characteristics
(Public STD Code):C0G(EIA)
g
0.07 to 0.14
(5) Nominal
Capacitance
mark
(1)L/W
Dimensions
(2)T
Dimensions
(3)Temperature
Characteristics
(4)Rated
Voltage
(5)Nominal
Capacitance
(6)Capacitance
Tolerance
(8)Packaging
Code

Control Code
GRM 02 25C 1C 150 J D05 L
GRM0225C1C150JD05-01 1

Temperature
Compensating Type
High Dielectric
Constant Type
1 Operating －55℃to 125℃R6 : －55℃to 85℃Reference Temperature : 25℃
Temperature Range
R7 : －55℃to 125℃
C8 : －55℃to 105℃
E4 : 10℃to 85℃
F5 : －30℃to 85℃
L8, R9 : －55℃to 150℃
2 Rated Voltage See the previous pages. The rated voltage is defined as the maximum voltage which may be applied
continuously to the capacitor.
When AC voltage is superimposed on DC voltage, VP-P or VO-P, whichever is
larger, should be maintained within the rated voltage range.
3 Appearance No defects or abnormalities. Visual inspection.
4 Dimension Within the specified dimensions.
Using calipers.
(GRM02 size is based on Microscope.)
5 Dielectric Strength No defects or abnormalities.
No failure should be observed when 300% of the rated voltage

is applied between the terminations for 1 to 5 seconds, provided the
charge/discharge current is less than 50mA.
6 Insulation Resistance
More than 10,000Mor 500∙FThe insulation resistance should be measured with a DC voltage
(whichever is smaller)
not exceeding the rated voltage at 25℃and 75%RH max.
and within 2 minutes of charging, provided the charge/discharge
current is less than 50mA.
7 Capacitance Within the specified tolerance.
The capacitance/Q/D.F. should be measured at 25℃at the frequency
and voltage shown in the table.
8Q/
30pF and over:Q≧1000 ［R6,R7,C8,L8］(1)Temperature Compensating Type
Dissipation Factor (D.F.)
30pF and below:Q≧400+20C W.V.:100V : 0.025max.(C＜0.068mF)
: 0.05max.(C≧0.068mF)
C:Nominal Capacitance(pF) W.V.:50V/25V : 0.025max.
W.V.:16V/10V : 0.035max.
W.V.:6.3V/4V : 0.05max.(C＜3.3mF)
: 0.1max.(C≧3.3mF) (2)High Dielectric Constant Type
[R9]
W.V.:50V : 0.05max.
[E4]
W.V.:25Vmin : 0.025max.
[F5]
W.V.:25Vmin : 0.05max. (C＜0.1mF)
: 0.09max.(C≧0.1mF)
W.V.:16V/10V : 0.125max.
W.V.:6.3V : 0.15max.
9Capacitance No bias Within the specified
R6 : Within ±15% The capacitance change should be measured after 5min. at each
Temperature tolerance.(Table A-1)
(-55°C to +85°C) specified temp. stage.
Characteristics
R7 : Within ±15%
(-55°C to +125°C) (1)Temperature Compensating Type
C8 : Within ±22% The capacitance drift is calculated by dividing the differences between
(-55°C to +105°C) the maximum and minimum measured values in the step 1,3 and 5
Capacitance Drift *
L8 : Within ±15% by the cap. value in step 3.
Within ±0.2% or ±0.05pF (-55°C to +125°C)
(Whichever is larger.) : Within +15/-40%
*Not apply to 1X/25V (+125°C to +150°C)
R9 : Within ±15%
(-55°C to +150°C)
E4 : Within +22/-56%
(+10°C to +85°C)
F5 : Within +22/-82%
(-30°C to +85°C)
(2)High Dielectric Constant Type
Temp. of Step 2 : R7,R6,C8,L8,R9 : -55±3°C
E4 : +10±3°C
F5 : -30±3°C
Temp. of Step 4 : R7 : +125±3°C
R9,L8 : +150±3°C
R6,E4,F5 : +85±3°C
C8 : +105±3°C
･Initial measurement for high dielectric constant type
Perform a heat treatment at 150 +0/-10°C for one hour and
then set for 24±2 hours at room temperature.
Perform the initial measurement.
10 Adhesive Strength No removal of the terminations or other defect should occur. Solder the capacitor on the test jig(glass epoxy board) shown in Fig.3
of Termination
using a eutectic solder.
Then apply 10N* force in parallel with the test jig for 10±1sec.
The soldering should be done either with an iron or using the reflow
method and should be conducted with care so that the soldering is
uniform and free of defects such as heat shock.
*1N(GRM02), 2N(GRM03), 5N(GRM15,GRM18)
■SPECIFICATIONS AND TEST METHODS
No
Item
Specification
Test Method
Step
Temperature(C)
1
25±2
2
-55±3
3
25±2
4

85±3(for other TC)
5
25±2
Capacitance
Frequency
Voltage
C≦
1±0.1kHz
1±0.2Vrms
C＞
120±24Hz
0.5±0.1Vrms
E4
1±0.1kHz
0.5±0.05Vrms
Capacitance
Frequency
Voltage
C≦1000pF
1±0.1MHz
0.5 to 5Vrms
C＞1000pF
1±0.1kHz
1±0.2Vrms
Step
Temperature(C)
1
25±2
2
Min.Operating Temp.±3
3
25±2
4
Max.Operating Temp.±3
5
25±2
JEMCGS-0015R 2

Temperature
Compensating Type
High Dielectric
Constant Type
11 Vibration  Appearance No defects or abnormalities. Solder the capacitor on the test jig(glass epoxy board) shown in Fig.3
Resistance
using a eutectic solder.
Capacitance Within the specified tolerance. The capacitor should be subjected to a simple harmonic motion having
a total amplitude of 1.5mm, the frequency being varied uniformly between
Q/D.F. 30pF and over:Q≧1000 ［R6,R7,C8,L8］the approximate limits of 10 and 55Hz.
30pF and beloow:Q≧400+20C W.V.:100V : 0.025max.(C＜0.068mF) The frequencyrange, from 10 to 55Hz and return to 10Hz, should be
: 0.05max.(C≧0.068mF) traversed in approximately 1 minute. This motion should be applied for
C:Nominal Capacitance(pF) W.V.:50V/25V : 0.025max.
a period of 2 hours in each 3 mutuallyperpendicular directions
W.V.:16V/10V : 0.035max.
(total of 6 hours).
W.V.:6.3V/4V : 0.05max. (C＜3.3mF)
: 0.1max.(C≧3.3mF)
[R9]
W.V.:50V : 0.05max.
[E4]
W.V.:25V : 0.025max.
[F5]
W.V.:25Vmin : 0.05max. (C＜0.1mF)
: 0.09max.(C≧0.1mF)
W.V.:16V/10V : 0.125max.
W.V.:6.3V : 0.15max.
12 Deflection Appearance No defects or abnormalities.
Solder the capacitor on the test jig(glass epoxy board) shown in Fig.1
using an eutectic solder.
Capacitance
Within ±5% or± 0.5pF Within ±10% Then apply a force in the direction shown in Fig 2 for 5±1 seconds.
Change (Whichever is larger) The soldering should be done by the reflow method and should be
conducted with care so that the soldering is uniform and free of defects
such as heat shock.
13 Solderability 75% of the terminations is to be soldered evenly and continuously. Immerse the capacitor in a solution of ethanol (JIS-K-8101) and
of Termination rosin (JIS-K-5902) (25% rosin in weight proportion) .
Preheat at 80 to 120℃for 10 to 30 seconds.
After preheating , immerse in an eutectic solder solution for
2±0.5 seconds at 230±5℃or Sn-3.0Ag-0.5Cu solder solution
for 2±0.5 seconds at 245±5℃.
14 Resistance to The measured and observed characteristics should satisfy <GRM03 size min.>
Soldering Heat the specifications in the followingtable. Preheat the capacitor at 120 to 150℃for 1 min.(GRM31 size max.)
Preheat the capacitor at 100 to 120℃for 1 min and
Appearance No defects or abnormalities.
170 to 200℃for 1 min.(GRM32 size min.)
Capacitance
Within ±2.5% or±0.25pF R6,R7,R9,C8,L8 : Within ±7.5% Immerse the capacitor in an eutectic solder solution or
Change (Whichever is larger) E4,F5 : Within ±20% Sn-3.0Ag-0.5Cu solder solution at 270±5℃for 10±0.5 seconds.
Q/D.F.
30pF and over:Q≧1000 ［R6,R7,C8,L8］Set at room temperature for 24±2 hours, then measure.
30pF and beloow:Q≧400+20C W.V.:100V : 0.025max.(C＜0.068mF) · Initial measurement for high dielectric constant type
: 0.05max.(C≧0.068mF) Perform a heat treatment at 150+0/-10°C for one hour and then set
C:Nominal Capacitance(pF) W.V.:50V/25V : 0.025max.
at room temperature for 24±2 hours.
W.V.:16V/10V : 0.035max. Perform the initial measurement.
W.V.:6.3V/4V : 0.05max. (C＜3.3mF)
: 0.1max.(C≧3.3mF) <GRM02 size only>
[R9]
Set the capacitor by reflow soldering on the glass epoxy PCB with
W.V.:50V : 0.05max.
Sn-3.0Ag-0.5Cu solder. Preheat the capacitor on the PCB at 120 to
[E4]
150℃for 1 minute by use of hot plate. Heat the capacitor on the
W.V.:25V : 0.025max.
PCB at 270±5℃for 10±0.5 seconds on the hot plate.
[F5]
Set at room temperature for 24±2 hours, then measure.
W.V.:25Vmin : 0.05max. (C＜0.1mF) · Initial measurement for high dielectric constant type
: 0.09max.(C≧0.1mF) Perform a heat treatment at 150+0/-10°C for one hour and then set
W.V.:16V/10V : 0.125max.
at room temperature for 24±2 hours.
W.V.:6.3V : 0.15max.
Perform the initial measurement.
I.R.
More than 10,000MWor 500W·F(Whichever is smaller)
Dielectric No defects.
Strength
15 Temperature Cycle The measured and observed characteristics should satisfy Solder the capacitor on the test jig(glass epoxy board) shown in Fig.3
the specifications in the following table.
using an eutectic solder.
Perform the five cycles according to the four heat treatments shown
Appearance No defects or abnormalities.
in the following table.
Set for 24±2 hours at room temperature, then measure.
Capacitance
Within ±2.5% or±0.25pF R6,R7,R9,C8,L8 : Within ±7.5%
Change (Whichever is larger)
E4,F5 : Within ±20%
Q/D.F.
30pF and over:Q≧1000 ［R6,R7,C8,L8］
30pF and beloow:Q≧400+20C W.V.:100V : 0.025max.(C＜0.068mF)
: 0.05max.(C≧0.068mF)
C:Nominal Capacitance(pF) W.V.:50V/25V : 0.025max.
W.V.:16V/10V : 0.035max.
W.V.:6.3V/4V : 0.05max. (C＜3.3mF)
: 0.1max.(C≧3.3mF) · Initial measurement for high dielectric constant type
[R9]
Perform a heat treatment at 150+0/-10C for one hour and then set
W.V.:50V : 0.05max.
at room temperature for 24±2 hours.
[E4]
Perform the initial measurement.
W.V.:25V : 0.025max.
[F5]
W.V.:25Vmin : 0.05max. (C＜0.1mF)
: 0.09max.(C≧0.1mF)
W.V.:16V/10V : 0.125max.
W.V.:6.3V : 0.15max.
I.R.
More than 10,000MWor 500W·F(Whichever is smaller)
Dielectric No defects.
Strength
■SPECIFICATIONS AND TEST METHODS
No
Item
Specification
Test Method
Step
Temperature
Time
1
100C to 120C
1 min.
2
170C to 200C
1 min.
Step
Temp.(C)
Time (min)
1
Min.
Operating Temp.+0/-3
30±3
2
Room Temp
2 to 3
3
Max.
Operating Temp.+3/-0
30±3
4
Room Temp
2 to 3
JEMCGS-0015R 3

Temperature
Compensating Type
High Dielectric
Constant Type
16
Humidity The measured and observed characteristics should satisfy Solder the capacitor on the test jig(glass epoxy board) shown in Fig.3
(Steady
State)
the specifications in the following table. using an eutectic solder.
Appearance No defects or abnormalities.
Capacitance
Within ±5% or ±0.5pF R6,R7,R9,C8,L8 : Within ±12.5% Set the capacitor at 40±2℃and in 90 to 95% humidity for 500±12 hours.
Change (Whichever is larger) E4,F5 : Within ±30% Remove and set for 24±2 hours at room temperature, then measure.
Q/D.F.
30pF and over: Q≧350 ［R6,R7,R9,C8,L8］
10pF and over W.V.:100V : 0.05max.( C＜0.068mF)
30pF and below: Q≧275+5C/2 : 0.075max.(C≧0.068mF)
10pF and below: Q≧200+10C W.V.:50V/25V : 0.05max.
W.V.:16V/10V : 0.05max.
C:Nominal Capacitance(pF) W.V.:6.3V/4V : 0.075max.(C＜3.3mF)
: 0.125max.(C≧3.3mF)
[R9]
W.V.:50V : 0.075max.
[E4]
W.V.:25V : 0.05max.
[F5]
W.V.:25Vmin : 0.075max. (C＜0.1mF)
: 0.125max. (C≧0.1mF)
W.V.:16V/10V : 0.15max.
W.V.:6.3V : 0.2max.
I.R. More than 1,000MWor 50W·F(Whichever is smaller)
17 Humidity Load The measured and observed characteristics should satisfy Solder the capacitor on the test jig(glass epoxy board) shown in Fig.3
the specifications in the following table. using an eutectic solder.
Appearance No defects or abnormalities.
Capacitance
Within ±7.5% or ±0.75pF R6,R7,R9,C8,L8 : Within ±12.5% Apply the rated voltage at 40±2℃and 90 to 95% humidity for
Change (Whichever is larger) E4 : Within ±30% 500±12 hours. Remove and set for 24±2 hours at room temperature,
F5 : Within ±30%(W.V.>10V) then measure. The charge/discharge current is less than 50mA.
F5 : Within +30/-40%(W.V.≦10V)
Q/D.F.
30pF and over: Q≧200 ［R6,R7,R9,C8,L8］·Initial measurement for F5/10Vmax.
30pF and below: Q≧100+10C/3 W.V.:100V : 0.05max.( C＜0.068mF) Apply the rated DC voltage for 1 hour at 40±2°C.
: 0.075max.(C≧0.068mF) Remove and set for 24±2 hours at room temperature.
C:Nominal Capacitance(pF)
W.V.:50V/25V : 0.05max. Perform initial measurement.
W.V.:16V/10V : 0.05max.
W.V.:6.3V/4V : 0.075max.(C＜3.3mF)
: 0.125max.(C≧3.3mF)
[R9]
W.V.:50V : 0.075max.
[E4]
W.V.:25V : 0.05max.
[F5]
W.V.:25Vmin : 0.075max. (C＜0.1mF)
: 0.125max. (C≧0.1mF)
W.V.:16V/10V : 0.15max.
W.V.:6.3V : 0.2max.
I.R. 
18 High Temperature The measured and observed characteristics should satisfy Solder the capacitor on the test jig(glass epoxy board) shown in Fig.3
Load the specifications in the following table. using an eutectic solder.
Appearance No defects or abnormalities.
Capacitance
Within ±3% or ±0.3pF R6,R7,R9,C8,L8:Within ±12.5% Apply 200% of the rated voltage at the maximum operating
Change (Whichever is larger) E4 :Within ±30% temperature ±3℃for 1000±12 hours.
F5 :Within ±30%(Cap<1.0 mF) Set for 24±2 hours at room temperature, then measure.
F5 :Within+30/-40%(Cap≧1.0 mF) The charge/discharge current is less than 50mA.
Q/D.F.
30pF and over: Q≧350 ［R6,R7,R9,C8,L8］
10pF and over W.V.:100V : 0.05max.( C＜0.068mF) ·Initial measurement for high dielectric constant type.
30pF and below: Q≧275+5C/2 : 0.075max.(C≧0.068mF) Apply 200% of the rated DC voltage at the maximum operating
10pF and below: Q≧200+10C W.V.:50V/25V : 0.05max. temperature ±3°C for one hour.
W.V.:16V/10V : 0.05max. Remove and set for 24±2 hours at room temperature.
C:Nominal Capacitance (pF)
W.V.:6.3V/4V : 0.075max.(C＜3.3mF) Perform initial measurement.
: 0.125max.(C≧3.3mF)
[R9]
W.V.:50V : 0.075max.
[E4]
W.V.:25V : 0.05max.
[F5]
W.V.:25Vmin : 0.075max. (C＜0.1mF)
: 0.125max. (C≧0.1mF)
W.V.:16V/10V : 0.15max.
W.V.:6.3V : 0.2max.
I.R. More than 1,000MWor 50W·F(Whichever is smaller)
■SPECIFICATIONS AND TEST METHODS
No
Item
Specification
Test Method
Table A-1
Char.
Nominal
Values
(ppm/C) *
Capacitance Change from 25C (%)
-55
-30
-10
Max.
Min.
Max.
Min.
Max.
Min.
5C
0±30
0.58
-0.24
0.40
-0.17
0.25
-0.11
6C
0±60
0.87
-0.48
0.59
-0.33
0.38
-0.21
6P
-150±60
2.33
0.72
1.61
0.50
1.02
0.32
6R
-220±60
3.02
1.28
2.08
0.88
1.32
0.56
6S
-330±60
4.09
2.16
2.81
1.49
1.79
0.95
6T
-470±60
5.46
3.28
3.75
2.26
2.39
1.44
7U
-750±120
8.78
5.04
6.04
3.47
3.84
2.21
1X
+350～-1000
-
-
-
-
-
-
* Nominalvaluesdenotethetemperaturecoefficientwithinarangeof25Cto125C(forC)/85C(forotherTC).
JEMCGS-0015R 4

Adhesive Strength of Termination, Vibration Resistance, Temperature Cycle, Humidity,
Test method : Deflection Humidity Load, High Temperature Load, Resistance to Soldering Heat (Reflow method)
･Test substrate ･Test substrate
Material : Copper-clad laminated sheets for PCBs Material : Copper-clad laminated sheets for PCBs
(Glass fabric base, epoxy resin) (Glass fabric base, epoxy resin)
Thickness : 1.6mm (GRM02/GRM03/GRM15: t:0.8mm) Thickness : 1.6mm (GRM02/GRM03/GRM15: t:0.8mm)
Copper foil thickness : 0.035mm Copper foil thickness : 0.035mm
Gray colored part of Fig.1: Solder resist
(Coat with heat resistant resin for solder)
Fig.1 (in mm) Fig.3 (in mm)
Fig.2 (in mm)
■SPECIFICATIONS AND TEST METHODS
Type
Dimension (mm)
a
b
c
GRM02
0.2
0.56
0.23
GRM03
0.3
0.9
0.3
GRM15
0.4
1.5
0.5
GRM18
1.0
3.0
1.2
GRM21
1.2
4.0
1.65
GRM31
2.2
5.0
2.0
GRM32
2.2
5.0
2.9
GRM43
3.5
7.0
3.7
GRM55
4.5
8.0
5.6
＊2
4.0±0.1
8.0±0.3
3.5±0.05
0.05以下
＊1
φ1.5
+0.1
-0
Ａ
t
*1,2：2.0±0.05
1.75±0.1
Ｂ
100
40
a
c
b
Land
f4.5
c
＊2
4.0±0.1
8.0±0.3
3.5±0.05
0.05以下
＊1
φ1.5
+0.1
-0
Ａ
t
*1,2：2.0±0.05
1.75±0.1
Ｂ
a
c
b
ﾗﾝﾄﾞ
f4.5
c
Glass epoxy board
Solder resist
Baked electrode or
copper foil
b
45
45
R230
20
50
Flexure:≦1
Capacitance meter
Pressurization
speed
1.0mm/s
Support
Capacitor
Pressurize
45
45
Type
Dimension (mm)
a
b
c
GRM02
0.2
0.56
0.23
GRM03
0.3
0.9
0.3
GRM15
0.4
1.5
0.5
GRM18
1.0
3.0
1.2
GRM21
1.2
4.0
1.65
GRM31
2.2
5.0
2.0
GRM32
2.2
5.0
2.9
GRM43
3.5
7.0
3.7
GRM55
4.5
8.0
5.6
JEMCGS-0015R 5

1.Tape Carrier Packaging(Packaging Code:D/E/W/F/L/J/K)
1.1 Minimum Quantity(pcs./reel)
 
Plastic Tape Paper Tape Plastic Tape
Code:D/E Code:W Code:L Code:J/ F Code:K
GR□01 50000 (W4P1)
GR□02 40000 (W4P1)
GR□03 15000(W8P2) 30000(W8P1) 50000(W8P2)
2
20000(W8P2) 50000(W8P2)
3/X
10000(W8P2) 50000(W8P2)
5 (Dimensions Tolerance:±0.05)
10000(W8P2) 20000(W8P1) 50000(W8P2)
5 (Dimensions Tolerance:±0.1min.)
10000(W8P2) 40000(W8P2)
GR□18 4000 10000
64000 10000
94000 3000 10000 10000
A/B 3000 10000
6/9 4000 10000
M/X 3000 10000
C2000 6000
94000 10000
A/M 3000 10000
N2000 8000
C2000 6000
R/D/E 1000 4000
M1000 5000
N/R/D 1000 4000
E500 2000
S500 1500
M1000 5000
N/C/R/D 1000 4000
E500
F300 1500
1.2 Dimensions of Tape
(1)GR□01/02 (W4P1 CODE:L) (in:mm)
Package
GRM/F Type
Type
GR□21
GR□31
GR□32
GR□43
Paper Tape
GR□55
GR□15
t
2.0±0.04
＊2
＊1
φ0.8±0.04
0.9±0.05
4.0±0.05
1.8±0.02
＊1,2：1.0±0.02
0.05以下
Ａ
Ｂ
0.15～0.4
*1,2：1.0±0.02
2.0±0.04
*1
0.9±0.05
4.0±0.05
1.8±0.02
Ａ
Ｂ
t
*2
0.05 max.
φ0.8±0.04
0.15～0.25
Type
T Dimensions
(Chip)
A *3
B *3
t
GR□011
0.125±0.013
0.145
0.27
0.4 max.
GR□022
0.2±0.02
0.23
0.43
0.5 max.
*3 Nominal value
JEMCGP-01796C 6

(in:mm)
(2)GR□03/15(W8P2 CODE:D/E/J/F)
(3)GRM033/155(W8P1 CODE:W) (in:mm)
Package
GRM/F Type
*1,2：2.0±0.05
＊2
4.0±0.1
8.0±0.3
3.5±0.05
0.05以下
＊1
φ1.5
+0.1
-0
Ａ
t
*1,2：2.0±0.05
1.75±0.1
Ｂ
4.0±0.1
*1
φ1.5
+0.1
-0
1.75±0.1
8.0±0.3
3.5±0.05
Ａ
Ｂ
t
*2
0.05 max.
1.0±0.05
4.0±0.1
φ1.5
+0.1
-0
1.75±0.1
8.0±0.3
3.5±0.05
Ａ
Ｂ
t
1.0±0.05
Type
LW Dimensions
Tolerance(Chip)
A *3
B *3
t
GR□03
±0.03
0.37
0.67
0.5 max.
±0.05
0.39
0.69
GR□15
±0.05
0.65
1.15
0.8 max.
±0.1
0.70
1.20
±0.15
0.72
1.25
±0.2
0.75
1.35
*3 Nominal value
Type
LW Dimensions
Tolerance(Chip)
A *
B *
t
GRM033
±0.03
±0.05
0.37
0.67
0.5max.
GRM155
±0.05
0.65
1.15
0.8max.
* Nominal value
JEMCGP-01796C 7

(4)GR□18/21/31/32 (in:mm)
<Paper Tape>
<Plastic Tape>
Package
GRM/F Type
4.0±0.1
4.0±0.1
2.0±0.1
φ1.5
+0.1
-0
1.75±0.1
8.0±0.3
3.5±0.05
t
Ａ
Ｂ
8.0±0.3
4.0±0.1
3.5±0.05
1.75±0.1
Ａ
Ｂ
t
2.0±0.1
φ1.5
+0.1
-0
4.0±0.1
0.25±0.1(T≦2.0mm)
0.3±0.1(T：2.5mm)
Type
LW Dimensions
Tolerance(Chip)
T Dimensions
(Chip)
A
B
t
Dimensions
of Tape
GR□18
5
±0.1 max.
0.5+0/-0.1
1.05±0.10
1.85±0.10
0.8 max.
Paper Tape
±0.2
0.5±0.05
0.5+0/-0.1
1.10±0.10
2.00±0.10
8
±0.15 max.
0.8±0.1
0.8±0.15
1.05±0.10
1.85±0.10
1.15 max.
±0.2
0.8±0.2
1.10±0.10
2.00±0.10
GR□21
6
±0.1
0.6±0.1
1.55±0.15
2.30±0.15
1.15 max.
9
±0.2 max.
0.85±0.05
0.85±0.1
0.85+0.15/-0.1
0.85+0/-0.2
±0.2
0.85±+0.15/-0.05
1.50±0.20
2.30±0.20
1.7 max.
Plastic
Tape
A
±0.1
1.0 +0/-0.2
1.45±0.20
2.25±0.20
±0.2
1.0±0.2
1.50±0.20
2.30±0.20
B
±0.1
1.25±0.1
1.45±0.20
2.25±0.20
±0.15
1.25±0.15
1.50±0.20
2.30±0.20
2.0 max.
±0.2
1.25±0.2
GR□31
6
±0.15
0.6±0.1
2.00±0.20
3.60±0.20
1.15 max.
Paper Tape
9
±0.2 max.
0.85±0.1
M
±0.15
1.15±0.1
1.90±0.20
3.50±0.20
1.7 max.
Plastic
Tape
±0.2
1.15±0.15
X
±0.2
1.2±0.1
C
±0.2
1.6±0.2
2.5 max.
±0.3
1.6±0.3
2.10±0.20
3.60±0.20
GR□32
9
L:±0.3
W:±0.2
0.85+0.15/-0.05
2.80±0.20
3.60±0.20
1.15 max.
Paper Tape
A
1.0±+0/-0.2
3.50±0.20
1.7 max.
Plastic
Tape
M
1.15±0.1
N
1.35±0.15
2.5 max.
C
1.6±0.2
R
1.8±0.2
3.0 max.
D
2.0±0.2
E
2.5±0.2
3.7 max.
JEMCGP-01796C 8

(5)GR□43/55 (in:mm)
Package
GRM/F Type
φ1.5
+0.1
-0
4.0±0.1
8.0±0.1
φ1.5
+0.2
-0
12.0±0.3
5.5±0.1
1.75±0.1
Ａ
*
2.0±0.1
*1
2.5 max.(T≦1.8mm)
3.7 max.(T=2.0/2.5mm)
4.7 max.(2.8≦T≦3.2mm)
4.0±0.1
Ｂ
*1
*：2.0±0.1
0.3±0.1
Type
A *2
B *2
GR□43
3.60
4.90
GR□55
5.20
6.10
*2 Nominal value
JEMCGP-01796C 9

Package
GRM/F Type
図
1
ﾁｯﾌﾟ詰め状態
(
単位：
mm)

ｗ1
W
Top Tape : Thickness 0.06
Feeding Hole :As specified in 1.2.
Hole for Chip : As specified in 1.2.
Base Tape : As specified in 1.2.
Bottom Tape :Thickness 0.05
(Only a bottom tape existence )
W
w1
GR□01/02
8.0 max.
5±1.5
GR□32 max.
16.5 max.
10±1.5
GR□43/55
20.5 max.
14±1.5
-3.0

 min.

2.0±0.5
Chip
(in:mm)
Fig.1 Package Chips
Fig.2 Dimensions of Reel
Fig.3 Taping Diagram
JEMCGP-01796C 10

1.3 Tapes for capacitors are wound clockwise shown in Fig.3.
(The sprocket holes are to the right as the tape is pulled toward the user.)
1.4 Part of the leader and part of the vacant section are attached as follows.
(in:mm)
1.5 Accumulate pitch : 10 of sprocket holes pitch = 20±0.3mm(GR□01/02)
40±0.3mm(GR□03 min.)
1.6 Chip in the tape is enclosed by top tape and bottom tape as shown in Fig.1.
1.7 The top tape and base tape are not attached at the end of the tape for a minimum of 5 pitches.
1.8 There are no jointing for top tape and bottom tape.
1.9 There are no fuzz in the cavity.
1.10 Break down force of top tape : 5N min.
Break down force of bottom tape : 5N min. (Only a bottom tape existence )
1.11 Reel is made by resin and appeaser and dimension is shown in Fig 2.
There are possibly to change the material and dimension due to some impairment.
1.12 Peeling off force : 0.1N to 0.6N*in the direction as shown below.
* GR□01/02/03:0.05N～0.5N
1.13 Label that show the customer parts number, our parts number, our company name, inspection
number and quantity, will be put in outside of reel.
Package
GRM/F Type
図
1
ﾁｯﾌﾟ詰め状態
(
単位：
mm)
Tail vacant Section
Chip-mounting Unit
Leader vacant Section
Leader Unit
(Top Tape only)
Direction
of Feed
160 min.
190 min.
210 min.
図
1
ﾁｯﾌﾟ詰め状態
(
単位：
mm)
165～180°
Top tape
JEMCGP-01796C 11

Caution
■Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high reliability
for the prevention of defects which might directly cause damage to the third party's life, body or property.
①Aircraft equipment ②Aerospace equipment ③Undersea equipment ④Power plant control equipment
⑤Medical equipment ⑥Transportation equipment(vehicles,trains,ships,etc.) ⑦Traffic signal equipment
⑧Disaster prevention / crime prevention equipment ⑨Data-processing equipment
⑩Application of similar complexity and/or reliability requirements to the applications listed in the above.
■Storage and Operation condition
1. The performance of chip monolithic ceramic capacitors may be affected by the storage conditions.
1-1. Store the capacitors in the following conditions: Room Temperature of +5℃to +40℃and a Relative Humidity
of 20% to 70%.
(1) Sunlight, dust, rapid temperature changes, corrosive gas atmosphere or high temperature and humidity
conditions during storage may affect solderability and packaging performance.
Therefore, please maintain the storage temperature and humidity. Use the product within six months,
as prolonged storage may cause oxidation of the electrodes.
(2) Please confirm solderability before using after six months.
Store the capacitors without opening the original bag.
Even if the storage period is short, do not exceed the specified atmospheric conditions.
1-2. Corrosive gas can react with the termination (external) electrodes or lead wires of capacitors, and result
in poor solderability. Do not store the capacitors in an atmosphere consisting of corrosive gas (e.g.,hydrogen
sulfide, sulfur dioxide, chlorine, ammonia gas etc.).
1-3. Due to moisture condensation caused by rapid humidity changes, or the photochemical change caused
by direct sunlight on the terminal electrodes and/or the resin/epoxy coatings, the solderability and
electrical performance may deteriorate. Do not store capacitors under direct sunlight or in high huimidity
conditions
■Rating
1.Temperature Dependent Characteristics
1. The electrical characteristics of the capacitor can change with temperature.
1-1. For capacitors having larger temperature dependency, the capacitance may change with temperature
changes. The following actions are recommended in order to ensure suitable capacitance values.
(1) Select a suitable capacitance for the operating temperature range.
(2) The capacitance may change within the rated temperature.
When you use a high dielectric constant type capacitors in a circuit that needs a tight (narrow) capacitance
tolerance (e.g., a time-constant circuit), please carefully consider the temperature characteristics, and
carefully confirm the various characteristics in actual use conditions and the actual system.
[Example of Temperature Caracteristics R7] [Example of Temperature Characteristics R6]

!
-20
-10
-15
-5
5
0
10
15
20
Temperature (C)
-75 -50 -25 025 50 75 100 125 150
Capacitance Change(%)
-20
-10
-15
-5
5
0
10
15
20
Temperature (C)
-75 -50 -25 025 50 75 100
Capacitance Change(%)
JEMCGC-2701W 12

2.Measurement of Capacitance
1. Measure capacitance with the voltage and frequency specified in the product specifications.
1-1. The output voltage of the measuring equipment may decrease occasionally when capacitance is high.
Please confirm whether a prescribed measured voltage is impressed to the capacitor.
1-2. The capacitance values of high dielectric constant type capacitors change depending on the AC voltage applied.
Please consider the AC voltage characteristics when selecting a capacitor to be used in a AC circuit.
3.Applied Voltage
1. Do not apply a voltage to the capacitor that exceeds the rated voltage as called out in the specifications.
1-1. Applied voltage between the terminals of a capacitor shall be less than or equal to the rated voltage.
(1) When AC voltage is superimposed on DC voltage, the zero-to-peak voltage shall not exceed the rated DC voltage.
When AC voltage or pulse voltage is applied, the peak-to-peak voltage shall not exceed the rated DC voltage.
(2) Abnormal voltages (surge voltage, static electricity, pulse voltage, etc.) shall not exceed the rated DC voltage.
Typical voltage applied to the DC capacitor
DC voltage DC voltage+AC AC voltage Pulse voltage
(E：Maximum possible applied voltage.)
1-2. Influence of over voltage
Over voltage that is applied to the capacitor may result in an electrical short circuit caused by the breakdown
of the internal dielectric layers .
The time duration until breakdown depends on the applied voltage and the ambient temperature.
4.Type of Applied Voltage and Self-heating Temperature
1.Confirm the operating conditions to make sure that nolarge current is flowing into the capacitor due to the
continuous application of an AC voltage or pulse voltage.
When a DC rated voltage product is used in an AC voltage circuit or a pulse voltage circuit, the AC current
or pulse current will flow into the capacitor; therefore check the self-heating condition.
Please confirm the surface temperature of the capacitor so that the temperature remains within the upper limits
of the operating temperature, including the rise in temperature due to self-heating. When the capacitor is
used with a high-frequency voltage or pulse voltage, heat may be generated by dielectric loss.
<Applicable to Rated Voltage of less than 100VDC>
1-1. The load should be contained to the level
such that when measuring at atmospheric
temperature of 25°C, the product's self-heating
remains below 20°C and the surface
temperature of the capacitor in the actual circuit
remains within the maximum operating
temperature.
Caution
!
1
10
100
0123
Current (Ar.m.s.) 456
Temperature Rise (C)
[Example of Temperature Rise (Heat Generation) in Chip
Monolithic Ceramic Capacitors in Contrast to Ripple
Current]
Sample: R1 characteristics 10 Rated voltage: DC10V
Ripple Current
100kHz
500kHz
1MHz
E
E
E
E
0
0
0
0
JEMCGC-2701W 13

5. DC Voltage and AC Voltage Characteristic
1. The capacitance value of a high dielectric constant type
capacitor changes depending on the DC voltage applied.
Please consider the DC voltage characteristics when a
capacitor is selected for use in a DC circuit.
1-1. The capacitance of ceramic capacitors may change
sharply depending on the applied voltage. (See figure)
Please confirm the following in order to secure the
capacitance.
(1) Determine whether the capacitance change caused
by the applied voltage is within the allowed range .
(2) In the DC voltage characteristics, the rate of
capacitance change becomes larger as voltage
increases, even if the applied voltage is below
the rated voltage. When a high dielectric constant
type capacitor is used in a circuit that requires a
tight (narrow) capacitance tolerance (e.g., a time
constant circuit), please carefully consider the
voltage characteristics, and confirm the various
characteristics in actual operating conditions in
an actual system.
2. The capacitance values of high dielectric
constant type capacitors changes depending
on the AC voltage applied.
Please consider the AC voltage characteristics
when selecting a capacitor to be used in a
AC circuit.
6. Capacitance Aging
[Example of Change Over Time (Aging characteristics) ]
1. The high dielectric constant type capacitors
have the characteristic in which the capacitance
value decreases with the passage of time.
When you use a high dielectric constant type
capacitors in a circuit that needs a tight (narrow)
capacitance tolerance (e.g., a time-constant circuit),
please carefully consider the characteristics
of these capacitors, such as their aging, voltage,
and temperature characteristics. In addition,
check capacitors using your actual appliances
at the intended environment and operating conditions.
7.Vibration and Shock
1. Please confirm the kind of vibration and/or shock, its condition, and any generation of resonance.
Please mount the capacitor so as not to generate resonance, and do not allow any impact on the terminals.
2. Mechanical shock due to being dropped may cause damage or
a crack in the dielectric material of the capacitor.
Do not use a fallen capacitor because the quality and reliability
may be deteriorated.
3. When printed circuit boards are piled up or handled, the corner
of another printed circuit board
should not be allowed to hit the capacitor in order to avoid
a crack or other damage to the capacitor.
Caution
-100
-80
-60
-40
-20
0
20
010 20 30
DC Voltage (V) 40 50
[Example of DC Voltage Characteristics]
Sample: R7 Characteristics 
Capacitance Change (%)
00.5 1
AC Voltage (Vr.m.s.) 1.5 2
[Example of AC Voltage Characteristics]
Sample: R7 Characteristics 
Capacitance Change (%)
30
20
10
0
-10
-20
-30
-40
-50
-60
Floor
Crack
Mounting printed circuit board
Crack
!
20
10
0
-10
-20
-30
-40
10
100
1000
10000
Time(h)
Capacitance Change(%)
5C
R7
R6
JEMCGC-2701W 14

■Soldering and Mounting
1.Mounting Position
1. Confirm the best mounting position and direction that minimizes the stress imposed on the capacitor during flexing
or bending the printed circuit board.
1-1.Choose a mounting position that minimizes the stress imposed on the chip during flexing or bending of the board.
[Component Direction]
Locate chip horizontal to the
direction in which stress acts.
[Chip Mounting Close to Board Separation Point]
It is effective to implement the following measures, to reduce stress in separating the board.
It is best to implement all of the following three measures; however, implement as many measures as possible
to reduce stress.
Stress Level
(1) Turn the mounting direction of the component parallel to the board separation surface.
A > D
(2) Add slits in the board separation part.
A > B
(3) Keep the mounting position of the component away from the board separation surface.
A > C
[Mounting Capacitors Near Screw Holes]
When a capacitor is mounted near a screw hole, it may be affected by the board deflection that occurs during
the tightening of the screw. Mount the capacitor in a position as far away from the screw holes as possible.
2.Information before Mounting
1. Do not re-use capacitors that were removed from the equipment.
2. Confirm capacitance characteristics under actual applied voltage.
3. Confirm the mechanical stress under actual process and equipment use.
4. Confirm the rated capacitance, rated voltage and other electrical characteristics before assembly.
5. Prior to use, confirm the solderability for the capacitors that were in long-term storage.
6. Prior to measuring capacitance, carry out a heat treatment for capacitors that were in long-term storage.
7.The use of Sn-Zn based solder will deteriorate the reliability of the MLCC.
Please contact our sales representative or product engineers on the use of Sn-Zn based solder in advance.
Caution
Contents of Measures
Screw Hole Recommended
!
①
②
③
1C
1B
1A
Perforation
Slit
A
B
C
D
①
1A
JEMCGC-2701W 15

3.Maintenance of the Mounting (pick and place) Machine
1. Make sure that the following excessive forces are not applied to the capacitors.
1-1. In mounting the capacitors on the printed circuit board, any bending force against them shall be kept
to prevent them from any bending damage or cracking. Please take into account the following precautions
and recommendations for use in your process.
(1) Adjust the lowest position of the pickup nozzle so as not to bend the printed circuit board.
(2) Adjust the nozzle pressure within a static load of 1N to 3N during mounting.
[Incorrect]
[Correct]
2.Dirt particles and dust accumulated between the suction nozzle and the cylinder inner wall prevent
the nozzle from moving smoothly. This imposes greater force upon the chip during mounting,
causing cracked chips. Also, the locating claw, when worn out, imposes uneven forces on the chip
when positioning, causing cracked chips. The suction nozzle and the locating claw must be maintained,
checked and replaced periodically.
Caution
!
Board Guide
Board
Suction Nozzle
Deflection
Backup Pin
JEMCGC-2701W 16

4-1.Reflow Soldering
1. When sudden heat is applied to the components, the [Standard Conditions for Reflow Soldering]
mechanical strength of the components will decrease
because a sudden temperature change causes
deformation inside the components. In order to prevent
mechanical damage to the components, preheating is
required for both the components and the PCB.
Preheating conditions are shown in table 1. It is required to
keep the temperature differential between the solder and

2. Solderability of tin plating termination chips might be
deteriorated when a low temperature soldering profile where
the peak solder temperature is below the melting point of
tin is used. Please confirm the solderability of tin plated
termination chips before use.
3. When components are immersed in solvent after mounting,

between the component and the solvent within the range [Allowable Reflow Soldering Temperature and Time]
shown in the table 1.
Table 1
GRM01/02/03/15/18/21/31
GRM32/43/55
In the case of repeated soldering, the accumulated
Recommended Conditions
soldering time must be within the range shown above.
Lead Free Solder: Sn-3.0Ag-0.5Cu
4. Optimum Solder Amount for Reflow Soldering
4-1. Overly thick application of solder paste results in
a excessive solder fillet height.
This makes the chip more susceptible to mechanical
and thermal stress on the board and may cause
the chips to crack.
4-2. Too little solder paste results in a lack of adhesive *GRM01 : 1/2 of Chip Thickness min.
strength on the outer electrode, which may result in GRM02/03: 1/3 of Chip Thickness min.
chips breaking loose from the PCB. in section
4-3. Make sure the solder has been applied smoothly
to the end surface to a height of 0.2mm* min.
Make sure not to impose any abnormal mechanical shocks to the PCB.
Part Number
Temperature Differential
Caution
≦190℃
≦130℃
Lead Free Solder
Peak Temperature
Air or N2
Atmosphere
Inverting the PCB
240 to 260℃
!
Temperature(℃)
PeakTemperature
Soldering
Gradual
Cooling
Preheating
ΔT
60-120seconds
30-60 seconds
Time
190℃
170℃
150℃
220℃
SolderingTemperature(℃)
Soldering Time(s)
280
270
260
250
240
230
220
0
30
60
120
90
0.2mm min*
JEMCGC-2701W 17

4-2.Flow Soldering
1. Do not apply flow soldering to chips not listed in Table 2.
[Standard Conditions for Flow Soldering]
Table 2
2. When sudden heat is applied to the components, the
mechanical strength of the components will decrease
because a sudden temperature change causes
deformation inside the components. In order to prevent
mechanical damage to the components, preheating is
required for both of the components and the PCB.
Preheating conditions are shown in table 2. It is required to
[Allowable Flow Soldering Temperature and Time]
keep the temperature differential between the solder and

3. Excessively long soldering time or high soldering
temperature can result in leaching of the outer electrodes,
causing poor adhesion or a reduction in capacitance value
due to loss of contact between the electrodes and end termination.
4. When components are immersed in solvent after mounting,

between the component and solvent within the range
shown in the table 2. In the case of repeated soldering, the accumulated
soldering time must be within the range shown above.
Recommended Conditions
Lead Free Solder: Sn-3.0Ag-0.5Cu
5. Optimum Solder Amount for Flow Soldering
5-1. The top of the solder fillet should be lower than the
thickness of components. If the solder amount is
excessive, the risk of cracking is higher during
board bending or any other stressful condition.
Atmosphere
100 to 120℃
250 to 260℃
Air
Part Number
GRM18/21/31
Temperature Differential
≦150℃
Caution
Lead Free Solder
Preheating Peak Temperature
Soldering Peak Temperature
!
Soldering mperature(℃)
Soldering Time(s)
280
270
260
250
240
230
220
0
10
20
40
30
Temperature(℃)
Soldering
Peak
Temperature
Preheating
Peak
Temperature
30-90seconds
Preheating
5 seconds max.
Time
Gradual
Cooling
Soldering
ΔT
Up to ChipThickness
Adhesive
in section
JEMCGC-2701W 18

4-3.Correction of Soldered Portion
When sudden heat is applied to the capacitor, distortion caused by the large temperature difference occurs internally,
and can be the cause of cracks. Capacitors also tend to be affected by mechanical and thermal stress depending
on the board preheating temperature or the soldering fillet shape, and can be the cause of cracks.
Please refer to "1. PCB Design" or "3. Optimum solder amount" for the solder amount and the fillet shapes.
1. Correction with a Soldering Iron
1-1. In order to reduce damage to the capacitor, be sure to preheat the capacitor and the mounting board.
Preheat to the temperature range shown in Table 3. A hot plate, hot air type preheater, etc. can be used for preheating.
1-2. After soldering, do not allow the component/PCB to cool down rapidly.
1-3. Perform the corrections with a soldering iron as quickly as possible. If the soldering iron is applied too long,
there is a possibility of causing solder leaching on the terminal electrodes, which will cause deterioration of the
adhesive strength and other problems.
Table 3
Lead Free Solder: Sn-3.0Ag-0.5Cu
2. Correction with Spot Heater
Compared to local heating with a soldering iron, hot air heating by a spot heater heats the overall component
and board, therefore, it tends to lessen the thermal shock. In the case of a high density mounted board,
a spot heater can also prevent concerns of the soldering iron making direct contact with the component.
2-1. If the distance from the hot air outlet of the spot heater to the component is too close, cracks may occur due to
thermal shock. To prevent this problem, follow the conditions shown in Table 4.
2-2. In order to create an appropriate solder fillet shape, it is recommended that hot air be applied at the angle shown
in Figure 1.
Table 4
Distance 5mm or more
Hot Air Application angle 45° *Figure 1
Hot Air Temperature Nozzle Outlet 400°C max.
Less than 10 seconds
Application Time (1206 (in inch) / (3216 (in mm) size or smaller)
Less than 30 seconds
(1210 (in inch) / 3225 (in mm) size or larger)
3. Optimum solder amount when re-working with a soldering iron
3-1. In the case of 0603 (in inch) / 1608 (in mm) and smaller
sizes (GRM03/15/18), the top of the solder fillet should
be lower than 2/3 of the thickness of the component or
0.5mm, whichever is smaller.
In the case of 0805 (in inch) / 2012(in mm) and larger
sizes (GRM21/31/32/43/55), the top of the solder fillet in section
should be lower than 2/3 of the thickness of the component.
If the solder amount is excessive, the risk of cracking is higher
during board bending or under any other stressful condition.
3-2. A soldering iron with a tip of ø3mm or smaller should be used.
It is also necessary to keep the soldering iron from touching
the components during the re-work.
3-3. Solder wire with ø0.5mm or smaller is required for soldering.
Temperature

Atmosphere
Caution
Air
Air
≦190℃
≦130℃
150℃min.
150℃min.
GRM32/43/55
Part Number
GRM03/15/18/21/31
Temperature of
Soldering Iron tip
350℃max.
280℃max.
Preheating
Temperature
!
One-hole Nozzle
an Angle of 45
[Figure 1]
SolderAmount
JEMCGC-2701W 19

5.Washing
Excessive ultrasonic oscillation during cleaning can cause the PCBs to resonate, resulting in cracked chips
or broken solder joints. Take note not to vibrate PCBs.
6.Electrical Test on Printed Circuit Board
1. Confirm position of the backup pin or specific jig, when inspecting the electrical performance of a
capacitor after mounting on the printed circuit board.
1-1. Avoid bending the printed circuit board by the pressure of a test-probe, etc.
The thrusting force of the test probe can flex the PCB, resulting in cracked chips or open solder
joints. Provide backup pins on the back side of the PCB to prevent warping or flexing.
Install backup pins as close to the test-probe as possible.
1-2. Avoid vibration of the board by shock when a test -probe contacts a printed circuit board.
[Not Recommended] [Recommended]
7.Printed Circuit Board Cropping
1. After mounting a capacitor on a printed circuit board, do not apply any stress to the capacitor that
caused bending or twisting the board.
1-1. In cropping the board, the stress as shown at right may cause the capacitor to crack.
Cracked capacitors may cause deterioration of the insulation resistance, and result in a short.
Avoid this type of stress to a capacitor.
[Bending] [Twisting]
2. Check the cropping method for the printed circuit board in advance.
2-1. Printed circuit board cropping shall be carried out by using a jig or an apparatus (Disk separator, router
type separator, etc.) to prevent the mechanical stress that can occur to the board.
* When a board separation jig or disk separator is used, if the following precautions are not observed,
a large board deflection stress will occur and the capacitors may crack.
Use router type separator if at all possible.
Caution
Notes
Hand and nipper
separation apply a high
level of stress.
Use another method.
· Board handling
· Board bending direction
· Layout of capacitors
· Board handling
· Layout of slits
· Design of V groove
· Arrangement of blades
· Controlling blade life
Board handling
Recommended
High
Medium
Medium
Low
Level of stress on board
×
△*
△*
◯
Board Separation Method
Hand Separation
Nipper Separation
(1) Board Separation Jig
Board Separation Apparatus
2) Disk Separator
3) Router Type Separator
!
Peeling
Test-probe
Backup
Pin
Test-probe
①
1A
JEMCGC-2701W 20