Murata GRM1555C1H331FA01 Series User manual

GRM1555C1H331FA01_ (0402, C0G:EIA, 330pF, DC50V)
_: packaging code Reference Sheet
1.Scope
2.MURATA Part NO. System
(Ex.)
3. Type & Dimensions
(Unit:mm)
4.Rated value
5.Package
Product specifications in this catalog are as of Feb.9,2017,and are subject to change or obsolescence without notice.
Please consult the approval sheet before ordering.
Please read rating and !Cautions first.
(3) Temperature Characteristics
(Public STD Code):C0G(EIA)
g
0.15 to 0.35
(5) Nominal
Capacitance
mark
(4)
Rated
Voltage
Packaging Unit
DC 50 V
Temp. Range
(Ref.Temp.)
(8) Packaging
0±30 ppm/°C
25 to 125 °C
(25 °C)
0.3 min.
(1)-1 L
1.0±0.05
(1)-2 W
0.5±0.05
This product specification is applied to Chip Monolithic Ceramic Capacitor used for General Electronic equipment.
(2) T
e
Chip Monolithic Ceramic Capacitor for General
Specifications and Test
Methods
(Operating
Temp. Range)
Temp. coeff
or Cap. Change
±1 %
(6)
Capacitance
Tolerance
330 pF
0.5±0.05
-55 to 125 °C
J
f330mm Reel
PAPER W8P2
50000 pcs./Reel
D
f180mm Reel
PAPER W8P2
10000 pcs./Reel
W
f180mm Reel
PAPER W8P1
20000 pcs./Reel
(1)L/W
Dimensions (2)T
Dimensions (3)Temperature
Characteristics (4)Rated
Voltage (5)Nominal
Capacitance (6)Capacitance
Tolerance (8)Packaging Code

Code
GRM 15 55C 1H 331 F A01 D
GRM1555C1H331FA01-01 1

1 Rated Voltage Shown in Rated value. The rated voltage is defined as the maximum voltage
which may be applied continuously to the capacitor.
When AC voltage is superimposed on DC voltage,
VP-P or VO-P, whichever is larger, should be maintained
within the rated voltage range.
2 Appearance No defects or abnormalities. Visual inspection.
3 Dimension Within the specified dimensions. Using calipers. (GRM02 size is based on Microscope)
4 Voltage proof No defects or abnormalities. Measurement Point : Between the terminations
Test Voltage : 300% of the rated voltage
(Temperature compensating type)
250% of the rated voltage
(High dielectric constant type)
Applied Time : 1s to 5 s
Charge/discharge current : 50mA max.
5 Insulation Resistance(I.R.)
C≦ Measurement Point : Between the terminations
C＞ Measurement Voltage : DC Rated Voltage
C:Nominal Capacitance Charging Time : 2 min
Charge/discharge current : 50mA max.
Measurement Temperature : Room Temperature
6 Capacitance Shown in Rated value. Measurement Temperature : Room Temperature
7 Q
30pF and over:Q≧1000
30pF and below:Q≧400+20C
C:Nominal Capacitance(pF)
8
Temperature No bias
Nominal values of the temperature coefficient is shown in Rated value.
The capacitance change should be measured after 5 min
Characteristics at each specified temp. stage.
of Capacitance
But,the Capacitance Change under 25℃is shown in Table A. In case of applying voltage, the capacitance change should be
measured after 1 min with applying voltage in equilibration of
Capacitance Drift each temp. stage.
Within +/-0.2% or +/-0.05pF Capacitance value as a reference is the value in step 3.
(Whichever is larger.) The capacitance drift is calculated by dividing the differences
between the maximum and minimum measured values in the
step 1,3 and 5 by the cap. value in step 3.
9 Adhesive Strength No removal of the terminations or other defect Solder the capacitor on the test substrate shown in Fig.3.
of Termination should occur.
Holding Time : 10+/-1s
Applied Direction : In parallel with the test substrate and vertical with
the capacitor side.
■Specifications and Test Methods
No
Item
Specification
Test Method
(Ref. Standard:JIS C 5101, IEC60384）
Type Applied Force(N)
GRM02 1
GRM03 2
GRM15/GRM18 5
GRM21/GRM31/GRM32 10
Step
Temperature(C)
1
Reference Temp.+/-2
2
Min. Operating Temp.+/-3
3
Reference Temp.+/-2
4
Max. Operating Temp.+/-3
5
Reference Temp.+/-2
Capacitance
Frequency
Voltage
C≦1000pF
1.0+/-0.1MHz
0.5 to 5.0Vrms
C＞1000pF
1.0+/-0.1kHz
1.0+/-0.2Vrms
JEMCGS-0015S 2

10 Vibration  Appearance No defects or abnormalities. Solder the capacitor on the test substrate shown in Fig.3.
Capacitance Within the specified initial value.
Q Within the specified initial value. Kind of Vibration : A simple harmonic motion
10Hz to 55Hz to 10Hz (1min)
Total amplitude : 1.5mm
This motion should be applied for a period of 2h in each 3 mutually
perpendicular directions(total of 6h).
11 Substrate Appearance No defects or abnormalities. Solder the capacitor on the test substrate shown in Fig.1.
Bending test
Capacitance Within +/-5% or +/-0.5pF
Change (Whichever is larger) Pressurization method : Shown in Fig.2
Flexure : 1mm
Holding Time : 5+/-1s
Soldering Method : Reflow soldering
12 Solderability 95% of the terminations is to be soldered evenly and continuously. Test Method : Solder bath method
Flux Solution of rosin ethanol 25(wt)%
Preheat :
80℃to 120℃for 10s to 30s
Solder : Sn-3.0Ag-0.5Cu
Solder Temp. :
245+/-5℃
Immersion time :
2+/-0.5s
13
Resistance to Appearance No defects or abnormalities. <GRM03 size min.>
Soldering Heat Capacitance Within +/-2.5% or +/- 0.25pF Test Method : Solder bath method
Change (Whichever is larger) Solder : Sn-3.0Ag-0.5Cu
Solder Temp. :
270+/-5℃
Q Within the specified initial value.
Immersion time :
10+/-0.5s
Exposure Time : 24+/-2h
I.R. Within the specified initial value. Preheat :
GRM31 size max.: 120℃to 150℃for 1 min
GRM32 size : 100℃to 120℃for 1 min
Voltage proof No defects.
and 170℃to 200℃for 1 min
<GRM02 size only>
Test Method : Reflow soldering (hot plate)
Solder : Sn-3.0Ag-0.5Cu
Solder Temp. :
270+/-5℃
Reflow Time : 10+/-0.5s
Test Substrate : Glass epoxy PCB
Exposure Time : 24+/-2h
Preheat :
120℃to 150℃for 1 min
14
Temperature Appearance No defects or abnormalities. Solder the capacitor on the test substrate shown in Fig.3.
Sudden Change Capacitance Within +/-2.5% or+/- 0.25pF
Change (Whichever is larger) Perform the five cycles according to the four heat treatments
shown in the following table.
Q Within the specified initial value.
I.R. Within the specified initial value.
Voltage proof No defects.
Exposure Time : 24+/-2h
No
Item
Specification
Test Method
(Ref. Standard:JIS C 5101, IEC60384）
Step
Temp.(C)
Time (min)
1
Min.Operating Temp.+0/-3
30+/-3
2
Room Temp.
2 to 3
3
Max.Operating Temp.+3/-0
30+/-3
4
Room Temp
2 to 3
JEMCGS-0015S 3

15
High Appearance No defects or abnormalities. Solder the capacitor on the test substrate shown in Fig.3.
Temperature
High Humidity Capacitance Within +/-7.5% or +/-0.75pF
Test Temperature :
40+/-2℃
(Steady) Change (Whichever is larger)
Test Humidity :
90%RH to 95%RH
Test Time :
500+/-12h
Q 30pF and over:Q≧200 Applied Voltage : DC Rated Voltage
30pF and below :Q≧100+10C/3 Charge/discharge current : 50mA max.
Exposure Time :
24+/-2h
C:Nominal Capacitance(pF)
I.R. 
16 Durability Appearance No defects or abnormalities. Solder the capacitor on the test substrate shown in Fig.3.
Capacitance Within +/-3% or +/-0.3pF Test Temperature : Max. Operating Temp. +/-3℃
Change (Whichever is larger)
Test Time :
1000+/-12h
Applied Voltage : 200% of the rated voltage
Q 30pF and over:Q≧350 Charge/discharge current : 50mA max.
10pF and over Exposure Time : 24+/-2h
30pF and below : Q≧275+5C/2
10pF and below : Q≧200+10C
C:Nominal Capacitance (pF)
I.R. 
No
Item
Specification
Test Method
(Ref. Standard:JIS C 5101, IEC60384）
Table A
Char.
Capacitance Change from 25C (%)
-55C
-30C
-10C
Max.
Min.
Max.
Min.
Max.
Min.
5C
0.58
-0.24
0.40
-0.17
0.25
-0.11
6C
0.87
-0.48
0.59
-0.33
0.38
-0.21
6P
2.33
0.72
1.61
0.50
1.02
0.32
6R
3.02
1.28
2.08
0.88
1.32
0.56
6S
4.09
2.16
2.81
1.49
1.79
0.95
6T
5.46
3.28
3.75
2.26
2.39
1.44
7U
8.78
5.04
6.04
3.47
3.84
2.21
JEMCGS-0015S 4

Substrate Bending test
・Test substrate
Material : Copper-clad laminated sheets for PCBs
(Glass fabric base, epoxy resin)
Thickness : 1.6mm (GRM02/GRM03/GRM15: t:0.8mm)
Copper foil thickness : 0.035mm
: Solder resist
(Coat with heat resistant resin for solder)
Fig.1 (in mm)
・Test substrate
Kind of Solder : Sn-3.0Ag-0.5Cu
・Test substrate
Pressurization method
Fig.2 (in mm)
Adhesive Strength of Termination, Vibration, Temperature Sudden Change, Resistance to Soldering Heat (Reflow method)
High Temperature High Humidity(Steady) , Durability
・Test substrate
Material : Copper-clad laminated sheets for PCBs
(Glass fabric base, epoxy resin)
Thickness : 1.6mm or 0.8mm
Copper foil thickness : 0.035mm
・Test substrate
Kind of Solder : Sn-3.0Ag-0.5Cu
・Test substrate
Land Dimensions
Fig.3
＊2
4.0±0.1
8.0±0.3
3.5±0.05
0.05以下
＊1
φ1.5
+0.1
-0
Ａ
t
*1,2：2.0±0.05
1.75±0.1
Ｂ
100
40
a
c
b
Land
f4.5
c
Type
Dimension (mm)
a
b
c
GRM02
0.2
0.56
0.23
GRM03
0.3
0.9
0.3
GRM15
0.4
1.5
0.5
GRM18
1.0
3.0
1.2
GRM21
1.2
4.0
1.65
GRM31
2.2
5.0
2.0
GRM32
2.2
5.0
2.9
Type
Dimension (mm)
a
b
c
GRM02
0.2
0.56
0.23
GRM03
0.3
0.9
0.3
GRM15
0.4
1.5
0.5
GRM18
1.0
3.0
1.2
GRM21
1.2
4.0
1.65
GRM31
2.2
5.0
2.0
GRM32
2.2
5.0
2.9
c
b
a
Solder Resist
ChipCapacitor
Land
45
45
Flexure
Capacitance meter
Pressurization
speed
1.0mm/s
Support
Capacitor
Pressurize
45
45
R5
20
50 min.
JEMCGS-0015S 5

1.Tape Carrier Packaging(Packaging Code:D/E/W/L/J/F/K)
1.1 Minimum Quantity(pcs./reel)
1.2 Dimensions of Tape
(1)GRM01/GRM02 (W4P1 CODE:L) (in:mm)
Package
GRM Type
1
*3 Nominal value
0.2±0.05
0.2±0.05
0.26
0.46
0.4 max.
GRM02
2
0.4±0.02
0.2±0.02
0.2±0.02
0.23
0.43
0.5 max.
0.4±0.05
GRM01
0.25±0.013
0.125±0.013
0.125±0.013
0.145
0.27
Type
Dimensions(Chip)
A*3
B *3
t
L
W
T
3
5
Type
GRMMD
5(LWTDimensions Tolerance:±0.05)
180mm reel
330mm reel
Paper Tape
Plastic Tape
Paper Tape
Plastic Tape
Code:D/E
Code:W
Code:L
Code:J/ F
Code:K
GRM01
50000(W4P1)
GRM02
40000(W4P1)
15000(W8P2)
50000(W8P2)
GRM03
2
15000(W8P2)
50000(W8P2)
15000(W8P2)
30000(W8P1)
50000(W8P2)
10000(W8P2)
50000(W8P2)
GRM15
2
20000(W8P2)
50000(W8P2)
3/X
10000(W8P2)
50000(W8P2)
10000(W8P2)
20000(W8P1)
50000(W8P2)
5(LWTDimensions Tolerance:±0.1min.)
10000(W8P2)
40000(W8P2)
5 (LW Dimensions Tolerance:±0.1min.
and TDimensions Tolerance:±0.05)
10000(W8P2)
50000(W8P2)
5(LW Dimensions Tolerance:±0.2
and TDimensions:0.5 +0/-0.1)
10000(W8P2)
GRM18/GRMJN
4000
10000
GRM21
6
4000
10000
A/B
3000
9
4000
3000
10000
10000
10000
GRM31
6/9
4000
10000
B/M/X
3000
10000
C
2000
6000
GRM32
9
4000
10000
A/M
3000
10000
N
2000
8000
C
2000
6000
R/D/E
1000
4000
GRM43
M
1000
E
500
5000
N/R/D
1000
4000
2000
S
500
1500
GRM55
M
1000
E
500
5000
N/C/R/D
1000
4000
F
300
1500
5(LWTDimensions Tolerance:±0.07)
10000(W8P2)
50000(W8P2)
t
2.0±0.04
＊2
＊1
φ0.8±0.04
0.9±0.05
4.0±0.05
1.8±0.02
＊1,2：1.0±0.02
0.05以下
Ａ
Ｂ
0.15～0.4
*1,2：1.0±0.02
2.0±0.04
*1
0.9±0.05
4.0±0.05
1.8±0.02
Ａ
Ｂ
t
*2
0.05 max.
φ0.8±0.04
0.15～0.25
JEMCGP-01796F 6

(2)GRMMD/GRM03/GRM15(W8P2 CODE:D/E/J/F)
(in:mm)
L W
T
GRMMD
X 0.5±0.025 0.25±0.025 0.25±0.025 0.32 0.58
0.6±0.03 0.3±0.03 0.2 +0.02/-0.04 0.37 0.67
0.6±0.09 0.3±0.09 0.2±0.02 0.42 0.72
0.6±0.03 0.3±0.03 0.3±0.03 0.37 0.67
0.6±0.05 0.3±0.05 0.3±0.05 0.39 0.69
0.3±0.09 0.6 max.
5 0.5±0.05
2 0.2 +0.02/-0.04
X 0.25±0.05
1.0±0.2 0.5±0.2 0.78 1.29
1.0±0.05 0.5±0.05 0.5±0.05
1.0±0.07 0.5±0.07 0.5±0.07
1.0±0.1 0.5±0.1 0.5±0.1 0.70 1.20
1.0±0.15 0.5±0.15 0.5±0.15 0.72 1.25
0.5 +0/-0.1
0.5±0.2
0.5±0.05 *3 Nominal value
(3)GRM033/155(W8P1 CODE:W) (in:mm)
L W
T
0.6±0.03 0.3±0.03 0.3±0.03 0.37 0.67
0.6±0.05 0.3±0.05 0.3±0.05 0.39 0.69
0.6±0.09 0.3±0.09 0.3±0.09 0.44 0.74 0.6 max.
GRM15 5 1.0±0.05 0.5±0.05 0.5±0.05 0.65 1.15 0.8 max.
*3 Nominal value
Type
Dimensions(Chip)
A *3
B *3
t
GRM03
3
0.5 max.
5
0.65
1.15
1.0±0.2
0.5±0.2
0.78
1.29
1.0±0.05
0.5±0.05
0.65
1.15
3
0.3±0.03
0.5 max.
GRM03
2
3
0.6±0.09
0.3±0.09
0.44
0.74
0.8 max.
GRM15
Package
GRM Type
Type
Dimensions(Chip)
A *3
B *3
t
1.0±0.05
4.0±0.1
φ1.5
+0.1
-0
1.75±0.1
8.0±0.3
3.5±0.05
Ａ
Ｂ
t
1.0±0.05
*1,2：2.0±0.05
＊2
4.0±0.1
8.0±0.3
3.5±0.05
0.05以下
＊1
φ1.5
+0.1
-0
Ａ
t
*1,2：2.0±0.05
1.75±0.1
Ｂ
4.0±0.1
*1
φ1.5
+0.1
-0
1.75±0.1
8.0±0.3
3.5±0.05
Ａ
Ｂ
t
*2
0.05 max.
JEMCGP-01796F 7

(4)GRM18/GRMJN/GRM21/GRM31/GRM32
(in:mm)
<Paper Tape> <Plastic Tape>
L W
T
1.6±0.1 0.8±0.1 1.05±0.10 1.85±0.10
50.5±0.05
0.6 +0.05/-0.1
0.6 +0/-0.1
7 0.7±0.1
1.6±0.1 0.8±0.1 0.8±0.1
8 1.6±0.15 0.8±0.15 0.8±0.15
1.6±0.2 0.8±0.2 0.8±0.2 1.10±0.10 2.00±0.10
GRMJN 7 1.8±0.1 1.0±0.1 0.7±0.1 1.20±0.10 2.10±0.10
0.6±0.1
0.6 +0/-0.15
0.85±0.05
0.85±0.1
0.85 +0.15/-0.1
0.85 +0/-0.2
2.0±0.15 1.25±0.15
0.85 +0.15/-0.05 1.50±0.20 2.30±0.20
2.0±0.1 1.25±0.1 1.0 +0/-0.2 1.45±0.20 2.25±0.20
2.0±0.2 1.25±0.2 1.0±0.2 1.50±0.20 2.30±0.20
2.0±0.1 1.25±0.1 1.25±0.1 1.45±0.20 2.25±0.20
B 2.0±0.15 1.25±0.15 1.25±0.15
2.0±0.2 1.25±0.2 1.25±0.2
6 0.6±0.1
3.2±0.2 1.6±0.2
B 1.25±0.1
1.15±0.1
1.15±0.15
X 1.2±0.1
1.6±0.2
3.2±0.3 1.6±0.3 1.6±0.3 2.10±0.20 3.60±0.20
9 0.85 +0.15/-0.05 2.80±0.20 3.60±0.20 1.15 max.
Paper Tape
A 1.0 +0/-0.2
M 1.15±0.1
N 1.35±0.15
C 1.6±0.2
R 1.8±0.2
D 2.0±0.2
2.5±0.2
2.5±0.3 2.5±0.3
Plastic Tape
2.5 max.
3.0 max.
E
3.7 max.
GRM32
3.2±0.3
2.5±0.2
2.80±0.20
3.50±0.20
1.7 max.
Paper Tape
9
0.85±0.1
3.2±0.15
1.6±0.15
1.90±0.20
3.50±0.20
1.7 max.
Plastic Tape
M
GRM31
3.2±0.15
1.6±0.15
2.00±0.20
3.60±0.20
1.15 max.
3.2±0.2
1.6±0.2
C
2.5 max.
2.0±0.2
1.25±0.2
1.7 max.
Plastic Tape
A
2.0 max.
1.50±0.20
2.30±0.20
1.05±0.10
1.85±0.10
GRM21
6
2.0±0.1
1.25±0.1
1.55±0.15
2.30±0.15
9
0.85±0.1
GRM18
0.5 +0/-0.1
0.8 max.
Paper Tape
1.6±0.2
0.8±0.2
1.10±0.10
2.00±0.10
6
1.15 max.
Package
GRM Type
Type
Dimensions(Chip)
A
B
t
Dimensions
of Tape
4.0±0.1
4.0±0.1
2.0±0.1
φ1.5
+0.1
-0
1.75±0.1
8.0±0.3
3.5±0.05
t
Ａ
Ｂ
8.0±0.3
4.0±0.1
3.5±0.05
1.75±0.1
Ａ
Ｂ
t
2.0±0.1
φ1.5
+0.1
-0
4.0±0.1
0.25±0.1(T≦2.0mm)
0.3±0.1(T：2.5mm)
JEMCGP-01796F 8

(5)GRM43/55 (in:mm)
L W
T
M 1.15±0.1
N 1.35±0.15
R 1.8±0.2
D 2.0±0.2
E 2.5±0.2
S 2.8±0.2 4.7 max.
M 1.15±0.1
N 1.35±0.15
C 1.6±0.2
R 1.8±0.2
D 2.0±0.2
E 2.5±0.2
F 3.2±0.2 4.7 max.
*1 Nominal value
GRM55
5.7±0.4
5.0±0.4
5.2
6.1
2.5 max.
3.7 max.
GRM43
4.5±0.4
3.2±0.3
3.6
4.9
2.5 max.
3.7 max.
Package
GRM Type
Type
Dimensions(Chip)
A *1
B *1
t
φ1.5
+0.1
-0
4.0±0.1
8.0±0.1
φ1.5
+0.2
-0
12.0±0.3
5.5±0.1
1.75±0.1
Ａ
*
2.0±0.1
4.0±0.1
Ｂ
t
*：2.0±0.1
0.3±0.1
JEMCGP-01796F 9

Package
GRM Type
図
1
ﾁｯﾌﾟ詰め状態
(
単位：
mm)

ｗ1
W
Top Tape : Thickness 0.06
Feeding Hole :As specified in 1.2.
Hole for Chip : As specified in 1.2.
Base Tape : As specified in 1.2.
Bottom Tape :Thickness 0.05
(Only a bottom tape existence )
W
w1
GRM01/02
8.0 max.
5±1.5
GRMMD/03/15/18/
JN/21/31/32
16.5 max.
10±1.5
GRM43/55
20.5 max.
14±1.5
-3.0

 min.

2.0±0.5
Chip
(in:mm)
Fig.1 Package Chips
Fig.2 Dimensions of Reel
Fig.3 Taping Diagram
JEMCGP-01796F 10