Murata GRM155C80J105KE15 Series User manual

GRM155C80J105KE15_ (0402, X6S:EIA, 1uF, DC6.3V)
_: packaging code Reference Sheet
1.Scope
2.MURATA Part NO. System
(Ex.)
3. Type & Dimensions
(Unit:mm)
4.Rated value
5.Package
Product specifications in this catalog are as of Mar.5,2016,and are subject to change or obsolescence without notice.
Please consult the approval sheet before ordering.
Please read rating and !Cautions first.
(3) Temperature Characteristics
(Public STD Code):X6S(EIA)
g
0.15 to 0.35
(5) Nominal
Capacitance
mark
(4)
Rated
Voltage
Packaging Unit
DC 6.3 V
Temp. Range
(Ref.Temp.)
(8) Packaging
-22 to 22 %
-55 to 105 °C
(25 °C)
0.3 min.
(1)-1 L
1.0±0.05
(1)-2 W
0.5±0.05
This product specification is applied to Chip Monolithic Ceramic Capacitor used for General Electronic equipment.
(2) T
e
Chip Monolithic Ceramic Capacitor for General
Specifications and Test
Methods
(Operating
Temp. Range)
Temp. coeff
or Cap. Change
±10 %
(6)
Capacitance
Tolerance
1 uF
0.5±0.05
-55 to 105 °C
J
f330mm Reel
PAPER W8P2
50000 pcs./Reel
D
f180mm Reel
PAPER W8P2
10000 pcs./Reel
W
f180mm Reel
PAPER W8P1
20000 pcs./Reel
(1)L/W
Dimensions
(2)T
Dimensions
(3)Temperature
Characteristics
(4)Rated
Voltage
(5)Nominal
Capacitance
(6)Capacitance
Tolerance
(8)Packaging
Code

Control Code
GRM 15 5C8 0J 105 K E15 D
GRM155C80J105KE15-02 1

■Specifications and Test Methods
No
1 Rated Voltage Shown in Rated value. The rated voltage is defined as the maximum voltage which may be
applied continuously to the capacitor.
When AC voltage is superimposed on DC voltage, VP-P or VO-P,
whichever is larger, should be maintained within the rated voltage
range.
2 Appearance No defects or abnormalities. Visual inspection.
3 Dimension Within the specified dimensions. Using calipers. (GRM02 size is based on Microscope)
4 Voltage proof No defects or abnormalities.
Measurement Point :
Between the terminations
Test Voltage :
250% of the rated voltage
Applied Time :
1 to 5 s
Charge/discharge current :
50mA max.
5 Insulation Resistance(I.R.) 
Measurement Point : Between the terminations
Measurement Voltage :
DC Rated Voltage
Charging Time :
1 min
Charge/discharge current :
50mA max.
Measurement Temperature :
Room Temperature
6 Capacitance Shown in Rated value.
Measurement Temperature :
Room Temperature
7 Dissipation Factor (D.F.) 0.1 max.
8
Temperature No bias C8 : Within +/-22% (-55°C to +105°C) The capacitance change should be measured after 5 min.
Characteristics at each specified temp. stage.
of Capacitance Capacitance value as a reference is the value in step 3.
･Initial measurement
Perform a heat treatment at 150+0/-10°C for 1h and then
let sit for 24+/-2h at room temperature,then measure.
9 Adhesive Strength No removal of the terminations or other defect Solder the capacitor on the test substrate shown in Fig.3.
of Termination should occur.
Holding Time : 10+/-1s
Applied Direction : In parallel with the test substrate and vertical with the
capacitor side.
10 Vibration  Appearance No defects or abnormalities. Solder the capacitor on the test substrate shown in Fig.3.
Capacitance Within the specified initial value.
D.F. Within the specified initial value.
Kind of Vibration :
A simple harmonic motion
10Hz to 55Hz to 10Hz (1min)
Total amplitude :
1.5mm
This motion should be applied for a period of 2h in each 3 mutually
perpendicular directions(total of 6h).
11 Substrate Appearance No defects or abnormalities. Solder the capacitor on the test substrate shown in Fig.1.
Bending test
Capacitance Within +/-10% Pressurization method : Shown in Fig.2
Change Flexure : 1mm
Holding Time :
5+/-1s
Soldering Method :
Reflow soldering
12 Solderability 95% of the terminations is to be soldered evenly and
Test Method :
Solder bath method
continuously. Flux Solution of rojin ethanol 25(wt)%
Preheat :
80℃to 120℃for 10s to 30s
Solder : Sn-3.0Ag-0.5Cu
Solder Temp. :
245+/-5℃
Immersion time
:
2+/-0.5s
Item
Specification
Test Method
(Ref. Standard:JIS C 5101, IEC60384）
c
b
a
SolderResist
Chip Capacitor
Land
Type Applied Force(N)
GRM15 5
These Part Numbers are designed for use in the circuits w here
continuous applied voltage to the capacitor is derated than rated
voltage, and guarantee Durability Test w ith 120% × rated voltage
as testing voltage at the maximumoperating temperature.
The voltage and temperature derating conditions on the left are
recommended for use to ensure the same reliability level as
normal specification.
Capacitance
Frequency
Voltage
C≦
(10V min.)
1+/-0.1kHz
1.0+/-0.2Vrms
C≦
(6.3V max.)
1+/-0.1kHz
0.5+/-0.1Vrms
C＞
120+/-24Hz
0.5+/-0.1Vrms
Step
Temperature(C)
Applying Voltage(Vdc)
1
Reference Temp.+/-2
No bias
2
Min.Operating Temp. +/-3
3
Reference Temp. +/-2
4
Max.Operating Temp. +/-3
5
Reference Temp. +/-2
JEMCGS-0152P 2

No
13
Resistance Appearance No defects or abnormalities. <GRM03 size min.>
to Test Method : Solder bath method
Soldering Solder : Sn-3.0Ag-0.5Cu
Heat
Capacitance Within +/-7.5% Solder Temp. : 270+/-5℃
Change
Immersion time
:
10+/-0.5s
Exposure Time : 24+/-2h
D.F. Within the specified initial value. Preheat :
120℃to 150℃for 1 min
· Initial measurement
I.R. Within the specified initial value. Perform a heat treatment at 150+0/-10°C for 1h and then
let sit for 24+/-2h at room temperature,then measure.
Voltage proof No defects.
14
Temperature Appearance No defects or abnormalities. Solder the capacitor on the test substrate shown in Fig.3.
Sudden Change Perform the five cycles according to the four heat treatments
shown in the following table.
Capacitance Within +/-7.5%
Change
D.F. Within the specified initial value.
I.R. Within the specified initial value. Exposure Time : 24+/-2h
Voltage proof No defects. · Initial measurement
Perform a heat treatment at 150+0/-10°C for 1h and then
let sit for 24+/-2h at room temperature,then measure.
15 High Appearance No defects or abnormalities. Solder the capacitor on the test substrate shown in Fig.3.
Temperature
Test Temperature :
40+/-2℃
High
Test Humidity :
90%RH to 95%RH
Humidity Capacitance Within +/-12.5%
Test Time :
500+/-12h
(Steady) Change
Applied Voltage :
DC Rated Voltage
Charge/discharge current : 50mA max.
D.F. 0.2 max.
Exposure Time :
24+/-2h
· Initial measurement
I.R.
∙F Perform a heat treatment at 150+0/-10°C for 1h and then
let sit for 24+/-2h at room temperature,then measure.
· Measurement after test
Perform a heat treatment at 150+0/-10°C for 1h and then
let sit for 24+/-2h at room temperature,then measure.
16 Durability Appearance No defects or abnormalities. Solder the capacitor on the test substrate shown in Fig.3.
Test Temperature :
Max. Operating Temp. +/-3℃
Capacitance Within +/-12.5%
Test Time :
1000+/-12h
Change
Applied Voltage :
120% of the rated voltage
Charge/discharge current : 50mA max.
Exposure Time :
24+/-2h
D.F. 0.2 max. · Initial measurement
Perform a heat treatment at 150+0/-10°C for 1h and then
let sit for 24+/-2h at room temperature,then measure.
I.R.  · Measurement after test
Perform a heat treatment at 150+0/-10°C for 1h and then
let sit for 24+/-2h at room temperature,then measure.
Recommended derating conditions on voltage and temperature
Item
Specification
Test Method
(Ref. Standard:JIS C 5101, IEC60384）
c
b
a
SolderResist
Chip Capacitor
Land
Type Applied Force(N)
GRM15 5
These Part Numbers are designed for use in the circuits w here
continuous applied voltage to the capacitor is derated than rated
voltage, and guarantee Durability Test w ith 120% × rated voltage
as testing voltage at the maximumoperating temperature.
The voltage and temperature derating conditions on the left are
recommended for use to ensure the same reliability level as
normal specification.
Step
Temp.(C)
Time
(min)
1
Min.Operating Temp.+0/-3
30+/-3
2
Room Temp
2 to 3
3
Max.Operating Temp.+3/-0
30+/-3
4
Room Temp
2 to 3
JEMCGS-0152P 3

Test method : Substrate Bending test
・Test substrate
Material : Copper-clad laminated sheets for PCBs
(Glass fabric base, epoxy resin)
Thickness : 0.8mm
Copper foil thickness : 0.035mm
: Solder resist
(Coat with heat resistant resin for solder)
Fig.1 (in mm)
・Kind of Solder : Sn-3.0Ag-0.5Cu
・Pressurization method
Fig.2 (in mm)
Adhesive Strength of Termination, Vibration, Temperature Sudden Change, Resistance to Soldering Heat (Reflow method)
High Temperature High Humidity(Steady) , Durability
・Test substrate
Material : Copper-clad laminated sheets for PCBs
(Glass fabric base, epoxy resin)
Thickness : 1.6mm or 0.8mm
Copper foil thickness : 0.035mm
・Kind of Solder : Sn-3.0Ag-0.5Cu
・Land Dimensions
Fig.3
c
b
a
SolderResist
Chip Capacitor
Land
Type Applied Force(N)
GRM15 5
These Part Numbers are designed for use in the circuits w here
continuous applied voltage to the capacitor is derated than rated
voltage, and guarantee Durability Test w ith 120% × rated voltage
as testing voltage at the maximumoperating temperature.
The voltage and temperature derating conditions on the left are
recommended for use to ensure the same reliability level as
normal specification.
＊2
4.0±0.1
8.0±0.3
3.5±0.05
0.05以下
＊1
φ1.5
+0.1
-0
Ａ
t
*1,2：2.0±0.05
1.75±0.1
Ｂ
100
40
a
c
b
Land
f4.5
c
45
45
Flexure
Capacitance meter
Pressurization
speed
1.0mm/s
Support
Capacitor
Pressurize
45
45
R5
20
50 min.
Type
Dimension (mm)
a
b
c
GRM15
0.4
1.5
0.5
Type
Dimension (mm)
a
b
c
GRM15
0.4
1.5
0.5
JEMCGS-0152P 4

1.Tape Carrier Packaging(Packaging Code:D/E/W/L/J/F/K)
1.1 Minimum Quantity(pcs./reel)
3
5
1.2 Dimensions of Tape
(1)GRM01/02 (W4P1 CODE:L) (in:mm)
1
*3 Nominal value
10000(W8P2)
50000(W8P2)
4000
4000
GRM55
GRM43
F
E
S
M
GRM32
GRM31
GRM21
GRM15
5(LW Dimensions Tolerance:±0.2
and T Dimensions:0.5 +0/-0.1)
5(LWT Dimensions Tolerance:±0.1min.)
5(LWT Dimensions Tolerance:±0.05)
N
C
R/D/E
GRM01
GRM02
2
3/X
5 (LW Dimensions Tolerance:±0.1min.
and T Dimensions Tolerance:±0.05)
GRM03
2
GRM18
6
9
A/B
6/9
M/X
10000(W8P2)
10000(W8P2)
10000(W8P2)
4000
M
N/R/D
4000
50000(W4P1)
E
N/C/R/D
C
9
A/M
Package
GRM Type
15000(W8P2)
20000(W8P2)
10000(W8P2)
10000(W8P2)
Paper Tape
Plastic Tape
Paper Tape
Plastic Tape
4000
30000(W8P1)
20000(W8P1)
40000(W4P1)
3000
2000
3000
3000
300
50000(W8P2)
50000(W8P2)
50000(W8P2)
50000(W8P2)
2000
2000
1000
1000
10000
10000
500
1000
1000
500
1000
500
3000
10000
10000
40000(W8P2)
50000(W8P2)
10000
10000
1500
Code:D/E
Code:W
Code:L
Code:J/ F
Code:K
8000
6000
4000
10000
10000
6000
10000
L


Type
1500
5000
4000
5000
4000
2000
W
T
t
0.145
0.27
0.4 max.
0.2±0.02
0.2±0.02
0.23
0.43
0.125±0.013
0.125±0.013
0.4±0.05
0.25±0.013
Type
0.2±0.05
0.2±0.05
0.26
GRM02
GRM01
2
0.4±0.02
15000(W8P2)
50000(W8P2)
0.5 max.
0.46
Dimensions(Chip)
A *3
B *3
t
2.0±0.04
＊2
＊1
φ0.8±0.04
0.9±0.05
4.0±0.05
1.8±0.02
＊1,2：1.0±0.02
0.05以下
Ａ
Ｂ
0.15～0.4
*1,2：1.0±0.02
2.0±0.04
*1
0.9±0.05
4.0±0.05
1.8±0.02
Ａ
Ｂ
t
*2
0.05 max.
φ0.8±0.04
0.15～0.25
JEMCGP-01796E 5

(2)GRM03/15(W8P2 CODE:D/E/J/F)
(in:mm)
L W
T
2 0.2 +0.02/-0.04
0.3±0.03 0.5 max.
0.6±0.05 0.3±0.05 0.3±0.05 0.39 0.69
0.3±0.09 0.6 max.
5 0.5±0.05
2 0.2 +0.02/-0.04
X 0.25±0.05
1.0±0.2 0.5±0.2 0.78 1.29
1.0±0.05 0.5±0.05 0.5±0.05
1.0±0.07 0.5±0.07 0.5±0.07
1.0±0.1 0.5±0.1 0.5±0.1 0.70 1.20
1.0±0.15 0.5±0.15 0.5±0.15 0.72 1.25
0.5 +0/-0.1
0.5±0.2
0.5±0.05 *3 Nominal value
(3)GRM033/155(W8P1 CODE:W) (in:mm)
L W
T
0.6±0.03 0.3±0.03 0.3±0.03 0.37 0.67
0.6±0.05 0.3±0.05 0.3±0.05 0.39 0.69
0.6±0.09 0.3±0.09 0.3±0.09 0.44 0.74 0.6 max.
GRM15 5 1.0±0.05 0.5±0.05 0.5±0.05 0.65 1.15 0.8 max.
*3 Nominal value
0.5 max.
Dimensions(Chip)
A *3
B *3
t
1.0±0.2
0.5±0.2
0.65
0.78
1.15
1.29
0.74
0.8 max.
0.5±0.05
0.3±0.03
0.65
1.15
Type
Dimensions(Chip)
0.6±0.03
GRM03
3
0.6±0.09
0.3±0.03
0.3±0.09
Package
GRM Type
A *3
B *3
t
0.37
5
0.67
GRM03
3
GRM15
3
1.0±0.05
Type
0.44
*1,2：2.0±0.05
＊2
4.0±0.1
8.0±0.3
3.5±0.05
0.05以下
＊1
φ1.5
+0.1
-0
Ａ
t
*1,2：2.0±0.05
1.75±0.1
Ｂ
4.0±0.1
*1
φ1.5
+0.1
-0
1.75±0.1
8.0±0.3
3.5±0.05
Ａ
Ｂ
t
*2
0.05 max.
1.0±0.05
4.0±0.1
φ1.5
+0.1
-0
1.75±0.1
8.0±0.3
3.5±0.05
Ａ
Ｂ
t
1.0±0.05
JEMCGP-01796E 6

(4)GRM18/21/31/32 (in:mm)
<Paper Tape> <Plastic Tape>
L W
T
1.6±0.1 0.8±0.1 1.05±0.10 1.85±0.10
50.5±0.05
6 0.6 +0/-0.1
7 0.7±0.1
1.6±0.1 0.8±0.1 0.8±0.1
8 1.6±0.15 0.8±0.15 0.8±0.15
1.6±0.2 0.8±0.2 0.8±0.2 1.10±0.10 2.00±0.10
0.6±0.1
0.6 +0/-0.15
0.85±0.05
0.85±0.1
0.85 +0.15/-0.1
0.85 +0/-0.2
2.0±0.15 1.25±0.15
0.85 +0.15/-0.05 1.50±0.20 2.30±0.20
2.0±0.1 1.25±0.1 1.0 +0/-0.2 1.45±0.20 2.25±0.20
2.0±0.2 1.25±0.2 1.0±0.2 1.50±0.20 2.30±0.20
2.0±0.1 1.25±0.1 1.25±0.1 1.45±0.20 2.25±0.20
B 2.0±0.15 1.25±0.15 1.25±0.15
2.0±0.2 1.25±0.2 1.25±0.2
6 0.6±0.1
3.2±0.2 1.6±0.2
B 1.25±0.1
1.15±0.1
1.15±0.15
X 1.2±0.1
1.6±0.2
3.2±0.3 1.6±0.3 1.6±0.3 2.10±0.20 3.60±0.20
9 0.85 +0.15/-0.05 2.80±0.20 3.60±0.20 1.15 max.
Paper Tape
A 1.0 +0/-0.2
M 1.15±0.1
N 1.35±0.15
C 1.6±0.2
R 1.8±0.2
D 2.0±0.2
E 2.5±0.2 3.7 max.
Dimensions
of Tape
Package
GRM Type
1.15 max.
2.0±0.1
2.0±0.2
1.25±0.1
0.85±0.1
1.7 max.
Plastic Tape
A
Type
Dimensions(Chip)
A
B
t
1.6±0.2
Plastic Tape
2.5 max.
3.0 max.
M
C
2.5 max.
3.2±0.3
1.6±0.15
1.6±0.2
2.5±0.2
GRM32
2.80±0.20
3.50±0.20
1.7 max.
GRM31
2.00±0.20
3.60±0.20
1.15 max.
0.85±0.1
1.6±0.15
Paper Tape
9
1.90±0.20
3.50±0.20
1.7 max.
Plastic Tape
2.0 max.
1.50±0.20
2.30±0.20
3.2±0.15
3.2±0.15
3.2±0.2
GRM21
6
1.55±0.15
2.30±0.15
9
Paper Tape
1.05±0.10
1.85±0.10
1.25±0.2
0.8±0.2
0.8 max.
0.5 +0/-0.1
GRM18
1.10±0.10
2.00±0.10
4.0±0.1
4.0±0.1
2.0±0.1
φ1.5
+0.1
-0
1.75±0.1
8.0±0.3
3.5±0.05
t
Ａ
Ｂ
8.0±0.3
4.0±0.1
3.5±0.05
1.75±0.1
Ａ
Ｂ
t
2.0±0.1
φ1.5
+0.1
-0
4.0±0.1
0.25±0.1(T≦2.0mm)
0.3±0.1(T：2.5mm)
JEMCGP-01796E 7

(5)GRM43/55 (in:mm)
L W
T
M 1.15±0.1
N 1.35±0.15
R 1.8±0.2
D 2.0±0.2
E 2.5±0.2
S 2.8±0.2 4.7 max.
M 1.15±0.1
N 1.35±0.15
C 1.6±0.2
R 1.8±0.2
D 2.0±0.2
E 2.5±0.2
F 3.2±0.2 4.7 max.
*1 Nominal value
t
3.7 max.
4.5±0.4
3.2±0.3
5.7±0.4
5.0±0.4
GRM55
5.2
6.1
2.5 max.
3.7 max.
Package
GRM Type
GRM43
3.6
4.9
2.5 max.
Type
Dimensions(Chip)
A *1
B *1
φ1.5
+0.1
-0
4.0±0.1
8.0±0.1
φ1.5
+0.2
-0
12.0±0.3
5.5±0.1
1.75±0.1
Ａ
*
2.0±0.1
4.0±0.1
Ｂ
t
*：2.0±0.1
0.3±0.1
JEMCGP-01796E 8

Package
GRM Type
図
1
ﾁｯﾌﾟ詰め状態
(
単位：
mm)

ｗ1
W
Top Tape : Thickness 0.06
Feeding Hole :As specified in 1.2.
Hole for Chip : As specified in 1.2.
Base Tape : As specified in 1.2.
Bottom Tape :Thickness 0.05
(Only a bottom tape existence )
W
w1
GRM01/02
8.0 max.
5±1.5
GRM03/15/18/21/31/32
16.5 max.
10±1.5
GRM43/55
20.5 max.
14±1.5
-3.0

 min.

2.0±0.5
Chip
(in:mm)
Fig.1 Package Chips
Fig.2 Dimensions of Reel
Fig.3 Taping Diagram
JEMCGP-01796E 9

1.3 Tapes for capacitors are wound clockwise shown in Fig.3.
(The sprocket holes are to the right as the tape is pulled toward the user.)
1.4 Part of the leader and part of the vacant section are attached as follows.
(in:mm)
1.5 Accumulate pitch : 10 of sprocket holes pitch = 20±0.3mm(GRM01/02)
40±0.3mm(GRM03 min.)
1.6 Chip in the tape is enclosed by top tape and bottom tape as shown in Fig.1.
1.7 The top tape and base tape are not attached at the end of the tape for a minimum of 5 pitches.
1.8 There are no jointing for top tape and bottom tape.
1.9 There are no fuzz in the cavity.
1.10 Break down force of top tape : 5N min.
Break down force of bottom tape : 5N min. (Only a bottom tape existence )
1.11 Reel is made by resin and appeaser and dimension is shown in Fig 2.
There are possibly to change the material and dimension due to some impairment.
1.12 Peeling off force : 0.1N to 0.6N*in the direction as shown below.
* GRM01/02/03:0.05N～0.5N
1.13 Label that show the customer parts number, our parts number, our company name, inspection
number and quantity, will be put in outside of reel.
Package
GRM Type
図
1
ﾁｯﾌﾟ詰め状態
(
単位：
mm)
Tail vacant Section
Chip-mounting Unit
Leader vacant Section
Leader Unit
(Top Tape only)
Direction
of Feed
160 min.
190 min.
210 min.
図
1
ﾁｯﾌﾟ詰め状態
(
単位：
mm)
165～180°
Top tape
JEMCGP-01796E 10