Murata GRM188R61A105MA61 Series User manual

GRM188R61A105MA61_ (0603, X5R:EIA, 1uF, DC10V)
_: packaging code Reference Sheet
1.Scope
2.MURATA Part NO. System
(Ex.)
3. Type & Dimensions
(Unit:mm)
4.Rated value
5.Package
Product specifications in this catalog are as of May.17,2017,and are subject to change or obsolescence without notice.
Please consult the approval sheet before ordering.
Please read rating and !Cautions first.
(3) Temperature Characteristics
(Public STD Code):X5R(EIA)
g
0.2 to 0.5
(5) Nominal
Capacitance
mark
(4)
Rated
Voltage
Packaging Unit
DC 10 V
Temp. Range
(Ref.Temp.)
(8) Packaging
-15 to 15 %
-55 to 85 °C
(25 °C)
0.5 min.
(1)-1 L
1.6±0.1
(1)-2 W
0.8±0.1
This product specification is applied to Chip Monolithic Ceramic Capacitor used for General Electronic equipment.
(2) T
e
Chip Monolithic Ceramic Capacitor for General
Specifications and Test
Methods
(Operating
Temp. Range)
Temp. coeff
or Cap. Change
±20 %
(6)
Capacitance
Tolerance
1 uF
0.8±0.1
-55 to 85 °C
D
f180mm Reel
PAPER W8P4
4000 pcs./Reel
J
f330mm Reel
PAPER W8P4
10000 pcs./Reel
(1)L/W
Dimensions (2)T
Dimensions (3)Temperature
Characteristics (4)Rated
Voltage (5)Nominal
Capacitance (6)Capacitance
Tolerance (8)Packaging Code

Code
GRM 18 8R6 1A 105 M A61 D
GRM188R61A105MA61-01 1

Temperature
Compensating Type
High Dielectric
Constant Type
1 Rated Voltage Shown in Rated value. The rated voltage is defined as the maximum voltage
which may be applied continuously to the capacitor.
When AC voltage is superimposed on DC voltage,
VP-P or VO-P, whichever is larger, should be maintained
within the rated voltage range.
2 Appearance No defects or abnormalities. Visual inspection.
3 Dimension Within the specified dimensions. Using calipers. (GRM02 size is based on Microscope)
4 Voltage proof No defects or abnormalities. Measurement Point : Between the terminations
Test Voltage : 300% of the rated voltage
(Temperature compensating type)
250% of the rated voltage
(High dielectric constant type)
Applied Time : 1s to 5 s
Charge/discharge current : 50mA max.
5 Insulation Resistance(I.R.)
C≦ Measurement Point : Between the terminations
C＞ Measurement Voltage : DC Rated Voltage
C:Nominal Capacitance Charging Time : 2 min
Charge/discharge current : 50mA max.
Measurement Temperature : Room Temperature
6 Capacitance Shown in Rated value. Measurement Temperature : Room Temperature
(1)Temperature Compensating Type
7 Q or Dissipation Factor (D.F.)
30pF and over:Q≧1000 W.V.:100Vdc :0.025max.(C<0.068µF)
30pF and below:Q≧400+20C :0.05max.(C≧0.068µF)
C:Nominal Capacitance(pF) W.V.:50/35/25Vdc :0.025max.
W.V.:16/10Vdc :0.035max. (2)High Dielectric Constant Type
W.V.:6.3/4Vdc :0.05max.(C<3.3µF)
:0.1max. (C≧3.3µF)
8
Temperature No bias Nominal values of the B1,B3 : Within +/-10% The capacitance change should be measured after 5 min
Characteristics temperature coefficient is
(-25°C to +85°C) at each specified temp. stage.
of Capacitance
shown in Rated value. R1,R7 : Within +/-15% In case of applying voltage, the capacitance change should be
(-55°C to +125°C) measured after 1 min with applying voltage in equilibration of
But,the Capacitance Change R6 : Within +/-15% each temp. stage.
under 20℃is shown (-55°C to +85°C) Capacitance value as a reference is the value in step 3.
in Table A. C7 : Within +/-22%
(-55°C to +125°C) (1)Temperature Compensating Type
C8 : Within +/-22% The capacitance drift is calculated by dividing the differences
Capacitance Drift *
(-55°C to +105°C) between the maximum and minimum measured values in the
Within +/-0.2% or +/-0.05pF L8 : Within +/-15% step 1,3 and 5 by the cap. value in step 3.
(Whichever is larger.)
(-55°C to +125°C)
*Not apply to 1X/25V : Within +15/-40%
(+125°C to +150°C)
50% of - B1 : Within +10/-30% (2)High Dielectric Constant Type
the rated R1 : Within +15/-40%
voltage
· Initial measurement for high dielectric constant type
Perform a heat treatment at 150+0/-10°C for 1h and then
let sit for 24+/-2h at room temperature, then measure.
9 Adhesive Strength No removal of the terminations or other defect Solder the capacitor on the test substrate shown in Fig.3.
of Termination should occur.
Holding Time : 10+/-1s
Applied Direction : In parallel with the test substrate and vertical with
the capacitor side.
■Specifications and Test Methods
No
Item
Specification
Test Method
(Ref. Standard:JIS C 5101, IEC60384）
Type Applied Force(N)
GRM02 1
GRM03 2
GRM15/GRM18 5
GRM21/GRM31/GRM32 10
Step
Temperature(C)
1
Reference Temp.+/-2
2
Min. Operating Temp.+/-3
3
Reference Temp.+/-2
4
Max. Operating Temp.+/-3
5
Reference Temp.+/-2
Step
Temperature(C)
Applying Voltage(VDC)
1
Reference Temp.+/-2
No bias
2
Min.Operating Temp.+/-3
3
Reference Temp.+/-2
4
Max.Operating Temp.+/-3
5
Reference Temp.+/-2
50% of
the rated voltage
(For B1,R1)
6
Min.Operating Temp.+/-3
7
Reference Temp.+/-2
8
Max.Operating Temp.+/-3
Capacitance
Frequency
Voltage
C≦1000pF
1.0+/-0.1MHz
0.5 to 5.0Vrms
C＞1000pF
1.0+/-0.1kHz
1.0+/-0.2Vrms
Capacitance
Frequency
Voltage
C≦
1.0+/-0.1kHz
1.0+/-0.2Vrms
C＞
120+/-24Hz
0.5+/-0.1Vrms
JEMCGS-0001U 2

Temperature
Compensating Type
High Dielectric
Constant Type
10 Vibration  Appearance No defects or abnormalities. Solder the capacitor on the test substrate shown in Fig.3.
Capacitance Within the specified initial value.
Q or D.F. Within the specified initial value. Kind of Vibration : A simple harmonic motion
10Hz to 55Hz to 10Hz (1min)
Total amplitude : 1.5mm
This motion should be applied for a period of 2h in each 3 mutually
perpendicular directions(total of 6h).
11 Substrate Appearance No defects or abnormalities. Solder the capacitor on the test substrate shown in Fig.1.
Bending test
Capacitance Within +/-5% or +/-0.5pF Within +/-10%
Change (Whichever is larger) Pressurization method : Shown in Fig.2
Flexure : 1mm
Holding Time : 5+/-1s
Soldering Method : Reflow soldering
12 Solderability 95% of the terminations is to be soldered evenly and continuously. Test Method : Solder bath method
Flux Solution of rosin ethanol 25(wt)%
Preheat :
80℃to 120℃for 10s to 30s
Solder : Sn-3.0Ag-0.5Cu
Solder Temp. :
245+/-5℃
Immersion time :
2+/-0.5s
13
Resistance to Appearance No defects or abnormalities. <GRM03 size min.>
Soldering Heat Capacitance Within +/-2.5% or +/- 0.25pF Within +/-7.5% Test Method : Solder bath method
Change (Whichever is larger) Solder : Sn-3.0Ag-0.5Cu
Solder Temp. :
270+/-5℃
Q or D.F. Within the specified initial value.
Immersion time :
10+/-0.5s
Exposure Time : 24+/-2h
I.R. Within the specified initial value. Preheat :
GRM31 size max.: 120℃to 150℃for 1 min
GRM32 size : 100℃to 120℃for 1 min
Voltage proof No defects.
and 170℃to 200℃for 1 min
· Initial measurement for high dielectric constant type
Perform a heat treatment at 150+0/-10°C for 1h and then
let sit for 24+/-2h at room temperature, then measure.
<GRM02 size only>
Test Method : Reflow soldering (hot plate)
Solder : Sn-3.0Ag-0.5Cu
Solder Temp. :
270+/-5℃
Reflow Time : 10+/-0.5s
Test Substrate : Glass epoxy PCB
Exposure Time : 24+/-2h
Preheat :
120℃to 150℃for 1 min
· Initial measurement for high dielectric constant type
Perform a heat treatment at 150+0/-10°C for 1h and then
let sit for 24+/-2h at room temperature, then measure.
14
Temperature Appearance No defects or abnormalities. Solder the capacitor on the test substrate shown in Fig.3.
Sudden Change Capacitance Within +/-2.5% or+/- 0.25pF Within +/-7.5%
Change (Whichever is larger) Perform the five cycles according to the four heat treatments
shown in the following table.
Q or D.F. Within the specified initial value.
I.R. Within the specified initial value.
Voltage proof No defects.
Exposure Time : 24+/-2h
· Initial measurement for high dielectric constant type
Perform a heat treatment at 150+0/-10°C for 1h and then
let sit for 24+/-2h at room temperature, then measure.
No
Item
Specification
Test Method
(Ref. Standard:JIS C 5101, IEC60384）
Step
Temp.(C)
Time (min)
1
Min.Operating Temp.+0/-3
30+/-3
2
Room Temp.
2 to 3
3
Max.Operating Temp.+3/-0
30+/-3
4
Room Temp
2 to 3
JEMCGS-0001U 3

Temperature
Compensating Type
High Dielectric
Constant Type
15
High Appearance No defects or abnormalities. Solder the capacitor on the test substrate shown in Fig.3.
Temperature
High Humidity Capacitance Within +/-7.5% or +/-0.75pF Within +/-12.5%
Test Temperature :
40+/-2℃
(Steady) Change (Whichever is larger)
Test Humidity :
90%RH to 95%RH
Test Time :
500+/-12h
Q or D.F. 30pF and over:Q≧200 W.V.:100Vdc :0.05max.(C<0.068µF) Applied Voltage : DC Rated Voltage
30pF and below
:0.075max.(C≧0.068µF)
Charge/discharge current : 50mA max.
:Q≧100+10C/3 W.V.:50/35/25Vdc :0.05max.
Exposure Time :
24+/-2h
W.V.:16/10Vdc :0.05max.
C:Nominal Capacitance(pF) W.V.:6.3/4Vdc :0.075max.(C<3.3µF)
:0.125max.(C≧3.3µF)
I.R. 
16 Durability Appearance No defects or abnormalities. Solder the capacitor on the test substrate shown in Fig.3.
Capacitance Within +/-3% or +/-0.3pF Within +/-12.5% Test Temperature : Max. Operating Temp. +/-3℃
Change (Whichever is larger)
Test Time :
1000+/-12h
Applied Voltage : 200% of the rated voltage
Q or D.F. 30pF and over:Q≧350 W.V.:100Vdc :0.05max.(C<0.068µF) Charge/discharge current : 50mA max.
10pF and over
:0.075max.(C≧0.068µF)
Exposure Time : 24+/-2h
30pF and below W.V.:50/35/25Vdc :0.05max.
: Q≧275+5C/2 W.V.:16/10Vdc :0.05max. ･Initial measurement for high dielectric constant type
10pF and below W.V.:6.3/4Vdc :0.075max.(C<3.3µF) Apply 200% of the rated DC voltage at the max. operating
: Q≧200+10C :0.125max.(C≧3.3µF) temp. +/-3°C for 1h and then let sit for 24+/-2h at room temperature,
then measure.
C:Nominal Capacitance (pF)
I.R. 
No
Item
Specification
Test Method
(Ref. Standard:JIS C 5101, IEC60384）
Table A
Char.
Capacitance Change from 20C (%)
-55℃
-25℃
-10℃
Max.
Min.
Max.
Min.
Max.
Min.
2C/0C
0.82
-0.45
0.49
-0.27
0.33
-0.18
3C
1.37
-0.90
0.82
-0.54
0.55
-0.36
4C
2.56
-1.88
1.54
-1.13
1.02
-0.75
2P
-
-
1.32
0.41
0.88
0.27
3P
-
-
1.65
0.14
1.10
0.09
4P
-
-
2.36
-0.45
1.57
-0.30
2R
-
-
1.70
0.72
1.13
0.48
3R
-
-
2.03
0.45
1.35
0.30
4R
-
-
2.74
-0.14
1.83
-0.09
2S
-
-
2.30
1.22
1.54
0.81
3S
-
-
2.63
0.95
1.76
0.63
4S
-
-
3.35
0.36
2.23
0.24
2T
-
-
3.07
1.85
2.05
1.23
3T
-
-
3.40
1.58
2.27
1.05
4T
-
-
4.12
0.99
2.74
0.66
3U
-
-
4.94
2.84
3.29
1.89
4U
-
-
5.65
2.25
3.77
1.50
1X
-
-
-
-
-
-
JEMCGS-0001U 4

Substrate Bending test
・Test substrate
Material : Copper-clad laminated sheets for PCBs
(Glass fabric base, epoxy resin)
Thickness : 1.6mm (GRM02/GRM03/GRM15: t:0.8mm)
Copper foil thickness : 0.035mm
: Solder resist
(Coat with heat resistant resin for solder)
Fig.1 (in mm)
・Test substrate
Kind of Solder : Sn-3.0Ag-0.5Cu
・Test substrate
Pressurization method
Fig.2 (in mm)
Adhesive Strength of Termination, Vibration, Temperature Sudden Change, Resistance to Soldering Heat (Reflow method)
High Temperature High Humidity(Steady) , Durability
・Test substrate
Material : Copper-clad laminated sheets for PCBs
(Glass fabric base, epoxy resin)
Thickness : 1.6mm or 0.8mm
Copper foil thickness : 0.035mm
・Test substrate
Kind of Solder : Sn-3.0Ag-0.5Cu
・Test substrate
Land Dimensions
Fig.3
＊2
4.0±0.1
8.0±0.3
3.5±0.05
0.05以下
＊1
φ1.5
+0.1
-0
Ａ
t
*1,2：2.0±0.05
1.75±0.1
Ｂ
100
40
a
c
b
Land
f4.5
c
Type
Dimension (mm)
a
b
c
GRM02
0.2
0.56
0.23
GRM03
0.3
0.9
0.3
GRM15
0.4
1.5
0.5
GRM18
1.0
3.0
1.2
GRM21
1.2
4.0
1.65
GRM31
2.2
5.0
2.0
GRM32
2.2
5.0
2.9
Type
Dimension (mm)
a
b
c
GRM02
0.2
0.56
0.23
GRM03
0.3
0.9
0.3
GRM15
0.4
1.5
0.5
GRM18
1.0
3.0
1.2
GRM21
1.2
4.0
1.65
GRM31
2.2
5.0
2.0
GRM32
2.2
5.0
2.9
c
b
a
SolderResist
Chip Capacitor
Land
45
45
Flexure
Capacitance meter
Pressurization
speed
1.0mm/s
Support
Capacitor
Pressurize
45
45
R5
20
50 min.
JEMCGS-0001U 5

1.Tape Carrier Packaging(Packaging Code:D/E/W/L/J/F/K)
1.1 Minimum Quantity(pcs./reel)
1.2 Dimensions of Tape
(1)GRM01/GRM02 (W4P1 CODE:L) (in mm)
Package
GRM Type
1
*3 Nominal value
0.2±0.05
0.2±0.05
0.26
0.46
0.4 max.
GRM02
2
0.4±0.02
0.2±0.02
0.2±0.02
0.23
0.43
0.5 max.
0.4±0.05
GRM01
0.25±0.013
0.125±0.013
0.125±0.013
0.145
0.27
Type
Dimensions(Chip)
A*3
B *3
t
L
W
T
t
2.0±0.04
＊2
＊1
φ0.8±0.04
0.9±0.05
4.0±0.05
1.8±0.02
＊1,2：1.0±0.02
0.05以下
Ａ
Ｂ
0.15～0.4
*1,2：1.0±0.02
2.0±0.04
*1
0.9±0.05
4.0±0.05
1.8±0.02
Ａ
Ｂ
t
*2
0.05 max.
φ0.8±0.04
0.15～0.25
3
5


Paper Tape
Plastic Tape
Paper Tape
Plastic Tape
Code:D/E
Code:W
Code:L
Code:J/ F
Code:K
GRM01
50000(W4P1)
GRM02
40000(W4P1)
15000(W8P2)
50000(W8P2)
GRM03
2
15000(W8P2)
50000(W8P2)
15000(W8P2)
30000(W8P1)
50000(W8P2)
50000(W8P2)
GRM15
2
20000(W8P2)
50000(W8P2)
3/X
10000(W8P2)
50000(W8P2)
50000(W8P2)
5(LWTDimensions Tolerance:±0.1min.)
10000(W8P2)
40000(W8P2)
5 (LW Dimensions Tolerance:±0.1min.
and T Dimensions Tolerance:±0.05)
10000(W8P2)
50000(W8P2)
5(LW Dimensions Tolerance:±0.2
and TDimensions:0.5 +0/-0.1)
10000(W8P2)
40000(W8P2)
GRM18/GRMJN
4000
10000
GRM21
6
4000
10000
A/B
3000
9
4000
3000
10000
10000
10000
GRM31
6/9
4000
10000
B/M/X
3000
10000
C
2000
6000
GRM32
9
4000
10000
A/M
3000
10000
N
2000
8000
C
2000
6000
R/D/E
1000
4000
GRM43
M
1000
E
500
5000
N/R/D
1000
4000
500
2000
S
500
1500
4000
GRM55
M
1000
E
F
300
1500
50000(W8P2)
5000
N/R/D
1000
5(LWTDimensions Tolerance:±0.05)
GRMMD
Type
5(LWTDimensions Tolerance:±0.07)
10000(W8P2)
10000(W8P2)
20000(W8P1)
10000(W8P2)
JEMCGP-01796G 6

(2)GRMMD/GRM03/GRM15(W8P2 CODE:D/E/J/F) (in mm)
L W
T
GRMMD
X 0.5±0.025 0.25±0.025 0.25±0.025 0.32 0.58
0.6±0.03 0.3±0.03 0.2 +0.02/-0.04 0.37 0.67
0.6±0.09 0.3±0.09 0.2±0.02 0.42 0.72
0.6±0.03 0.3±0.03 0.3±0.03 0.37 0.67
0.6±0.05 0.3±0.05 0.3±0.05 0.39 0.69
0.3±0.09 0.6 max.
5 0.5±0.05
2 0.2 +0.02/-0.04
X 0.25±0.05
1.0±0.2 0.5±0.2 0.78 1.29
1.0±0.05 0.5±0.05 0.5±0.05
1.0±0.07 0.5±0.07 0.5±0.07
1.0±0.1 0.5±0.1 0.5±0.1 0.70 1.20
1.0±0.15 0.5±0.15 0.5±0.15 0.72 1.25
0.5 +0/-0.1
0.5±0.2
0.5±0.05 *3 Nominal value
(3)GRM033/GRM155(W8P1 CODE:W) (in mm)
L W
T
0.6±0.03 0.3±0.03 0.3±0.03 0.37 0.67
0.6±0.05 0.3±0.05 0.3±0.05 0.39 0.69
0.6±0.09 0.3±0.09 0.3±0.09 0.44 0.74 0.6 max.
GRM15 5 1.0±0.05 0.5±0.05 0.5±0.05 0.65 1.15 0.8 max.
*3 Nominal value
Type
Dimensions(Chip)
A *3
B *3
t
GRM03
3
0.5 max.
5
0.65
1.15
1.0±0.2
0.5±0.2
0.78
1.29
1.0±0.05
0.5±0.05
0.65
1.15
3
0.3±0.03
0.5 max.
GRM03
2
3
0.6±0.09
0.3±0.09
0.44
0.74
0.8 max.
GRM15
Package
GRM Type
Type
Dimensions(Chip)
A *3
B *3
t
1.0±0.05
4.0±0.1
φ1.5
+0.1
-0
1.75±0.1
8.0±0.3
3.5±0.05
Ａ
Ｂ
t
1.0±0.05
*1,2：2.0±0.05
＊2
4.0±0.1
8.0±0.3
3.5±0.05
0.05以下
＊1
φ1.5
+0.1
-0
Ａ
t
*1,2：2.0±0.05
1.75±0.1
Ｂ
4.0±0.1
*1
φ1.5
+0.1
-0
1.75±0.1
8.0±0.3
3.5±0.05
Ａ
Ｂ
t
*2
0.05 max.
JEMCGP-01796G 7

(4)GRM18/GRMJN/GRM21/GRM31/GRM32 (in mm)
<Paper Tape> <Plastic Tape>
L W
T
1.6±0.1 0.8±0.1 1.05±0.10 1.85±0.10
50.5±0.05
0.6 +0.05/-0.1
0.6 +0/-0.1
7 0.7±0.1
1.6±0.1 0.8±0.1 0.8±0.1
8 1.6±0.15 0.8±0.15 0.8±0.15
1.6±0.2 0.8±0.2 0.8±0.2 1.10±0.10 2.00±0.10
GRMJN 7 1.8±0.1 1.0±0.1 0.7±0.1 1.20±0.10 2.10±0.10
0.6±0.1
0.6 +0/-0.15
0.85±0.05
0.85±0.1
0.85 +0.15/-0.1
0.85 +0/-0.2
2.0±0.15 1.25±0.15
0.85 +0.15/-0.05 1.50±0.20 2.30±0.20
2.0±0.1 1.25±0.1 1.0 +0/-0.2 1.45±0.20 2.25±0.20
2.0±0.2 1.25±0.2 1.0±0.2 1.50±0.20 2.30±0.20
2.0±0.1 1.25±0.1 1.25±0.1 1.45±0.20 2.25±0.20
B 2.0±0.15 1.25±0.15 1.25±0.15
2.0±0.2 1.25±0.2 1.25±0.2
6 0.6±0.1
3.2±0.2 1.6±0.2
B 1.25±0.1
1.15±0.1
1.15±0.15
X 1.2±0.1
1.6±0.2
3.2±0.3 1.6±0.3 1.6±0.3 2.10±0.20 3.60±0.20
9 0.85 +0.15/-0.05 2.80±0.20 3.60±0.20 1.15 max.
Paper Tape
A 1.0 +0/-0.2
M 1.15±0.1
N 1.35±0.15
C 1.6±0.2
R 1.8±0.2
D 2.0±0.2
2.5±0.2
2.5±0.3 2.5±0.3
Plastic Tape
2.5 max.
3.0 max.
E
3.7 max.
GRM32
3.2±0.3
2.5±0.2
2.80±0.20
3.50±0.20
1.7 max.
Paper Tape
9
0.85±0.1
3.2±0.15
1.6±0.15
1.90±0.20
3.50±0.20
1.7 max.
Plastic Tape
M
GRM31
3.2±0.15
1.6±0.15
2.00±0.20
3.60±0.20
1.15 max.
3.2±0.2
1.6±0.2
C
2.5 max.
2.0±0.2
1.25±0.2
1.7 max.
Plastic Tape
A
2.0 max.
1.50±0.20
2.30±0.20
1.05±0.10
1.85±0.10
GRM21
6
2.0±0.1
1.25±0.1
1.55±0.15
2.30±0.15
9
0.85±0.1
GRM18
0.5 +0/-0.1
0.8 max.
Paper Tape
1.6±0.2
0.8±0.2
1.10±0.10
2.00±0.10
6
1.15 max.
Package
GRM Type
Type
Dimensions(Chip)
A
B
t
Dimensions
of Tape
4.0±0.1
4.0±0.1
2.0±0.1
φ1.5
+0.1
-0
1.75±0.1
8.0±0.3
3.5±0.05
t
Ａ
Ｂ
8.0±0.3
4.0±0.1
3.5±0.05
1.75±0.1
Ａ
Ｂ
t
2.0±0.1
φ1.5
+0.1
-0
4.0±0.1
0.25±0.1(T≦2.0mm)
0.3±0.1(T：2.5mm)
JEMCGP-01796G 8

(5)GRM43/GRM55 (in mm)
L W
T
M 1.15±0.1
N 1.35±0.15
R 1.8±0.2
D 2.0±0.2
E 2.5±0.2
S 2.8±0.2 4.7 max.
M 1.15±0.1
N 1.35±0.15
R 1.8±0.2
D 2.0±0.2
E 2.5±0.2
F 3.2±0.2 4.7 max.
*1 Nominal value
GRM55
5.7±0.4
5.0±0.4
5.2
6.1
2.5 max.
3.7 max.
GRM43
4.5±0.4
3.2±0.3
3.6
4.9
2.5 max.
3.7 max.
Package
GRM Type
Type
Dimensions(Chip)
A *1
B *1
t
φ1.5
+0.1
-0
4.0±0.1
8.0±0.1
φ1.5
+0.2
-0
12.0±0.3
5.5±0.1
1.75±0.1
Ａ
*
2.0±0.1
4.0±0.1
Ｂ
t
*：2.0±0.1
0.3±0.1
JEMCGP-01796G 9

Package
GRM Type
図
1
ﾁｯﾌﾟ詰め状態
(
単位：
mm)

ｗ1
W
Top Tape : Thickness 0.06
Feeding Hole :As specified in 1.2.
Hole for Chip : As specified in 1.2.
Base Tape : As specified in 1.2.
Bottom Tape :Thickness 0.05
(Only a bottom tape existence )
W
w1
GRM01/GRM02
8.0 max.
5±1.5
GRMMD/GRM03/GRM15/
GRM18/GRMJN/GRM21/
GRM31/GRM32
16.5 max.
10±1.5
GRM43/GRM55
20.5 max.
14±1.5
-3.0

 min.

2.0±0.5
Chip
(in mm)
Fig.1 Package Chips
Fig.2 Dimensions of Reel
Fig.3 Taping Diagram
JEMCGP-01796G 10