Murata GRT32ER61E226ME13 Series User manual

GRT32ER61E226ME13_ (1210, X5R:EIA, 22uF, DC25V)
_: packaging code Reference Sheet
1.Scope
2.MURATA Part NO. System
(Ex.)
3. Type & Dimensions
(Unit:mm)
4.Rated value
5.Package
Product specifications in this catalog are as of May.10,2017,and are subject to change or obsolescence without notice.
Please consult the approval sheet before ordering.
Please read rating and !Cautions first.
(3) Temperature Characteristics
(Public STD Code):X5R(EIA)
g
0.3 min.
(5) Nominal
Capacitance
mark
(4)
Rated
Voltage
Packaging Unit
DC 25 V
Temp. Range
(Ref.Temp.)
(8) Packaging
-15 to 15 %
-55 to 85 °C
(25 °C)
1.0 min.
(1)-1 L
3.2±0.3
(1)-2 W
2.5±0.2
This product specification is applied to Chip Monolithic Ceramic Capacitor used for Car Multimedia, Car Interior, Car Comfort application and General Electronic
equipment.
Please contact us when using this product for any other applications than described in the above.
Do not use these products in applications critical to passenger safety and car driving function (e.g. ABS, AIRBAG, etc.).
(2) T
e
Chip Monolithic Ceramic Capacitor meet AEC-Q200 for Infotainment
Specifications and Test
Methods
(Operating
Temp. Range)
Temp. coeff
or Cap. Change
±20 %
(6)
Capacitance
Tolerance
22 uF
2.5±0.2
-55 to 85 °C
L
f180mm Reel
EMBOSSED W8P4
1000 pcs./Reel
K
f330mm Reel
EMBOSSED W8P4
4000 pcs./Reel
(1)L/W
Dimensions (2)T
Dimensions (3)Temperature
Characteristics (4)Rated
Voltage (5)Nominal
Capacitance (6)Capacitance
Tolerance (8)Packaging Code
(7)Murata’s Control
Code
GRT 32 ER6 1E 226 M E13 L
GRT32ER61E226ME13-01 1

Pre-and Post-Stress 
Electrical Test
2 High Temperature The measured and observed characteristics should satisfy the Solder the capacitor on the test substrate(glass epoxy board).
Exposure (Storage) specifications in the following table.
Set the capacitor for 1000±12h at maximum operating temperature ±3℃.
Appearance No marking defects Set for 24±2h at room temperature, then measure.
Capacitance R6, C8: Within ±12.5%
Change
Dissipation R6, C8: 0.2 max.
Factor
Insulation
More than 500MΩ or 25Ω ∙F (Whichever is smaller)
Resistance
3 Temperature Cycling The measured and observed characteristics should satisfy the Solder the capacitor on the test substrate(glass epoxy board).
specifications in the following table. Perform the 1000 cycles test according to the four heat treatments
Appearance No marking defects in the following table.
Set for 24±2h at room temperature, then measure.
Capacitance R6, C8: Within ±12.5%
Change
Dissipation R6, C8: 0.2 max.
Factor
・Initial measurement
Insulation Within the specified initial value.
Perform a heat treatment at 150+0/-10 ℃for 1h and then set
Resistance for 24±2h at room temperature.
Perform the initial measurement.
4 Destructive No defects or abnormalities Per EIA-469
Physical Analysis
5 Biased Humidity The measured and observed characteristics should satisfy the Solder the capacitor on the test substrate(glass epoxy board).
specifications in the following table.
Apply the rated voltage and 1.3+0.2/-0vdc (add 6.8kΩ resister)
Appearance No marking defects
at 85±3℃and 80 to 85% humidity for 1000±12h.
Remove and set for 24±2h at room temperature, then measure.
Capacitance R6,C8: Within ±12.5%
The charge/discharge current is less than 50mA.
Change
Dissipation R6,C8: 0.2 max
・Measurement after test
Factor
Perform a heat treatment at 150+0/–10°C for 1h and then let
sit for 24±2h at room temperature, then measure.
Insulation
More than 100MΩ or 5Ω ∙F (Whichever is smaller)
Resistance
■AEC-Q200 Murata Standard Specification and Test Methods
No
AEC-Q200 Test Item
Specifications.
AEC-Q200 Test Method
1
-
Step
1
2
3
4
Temp.
(C)
-55+0/-3
Room
Temp.
85 +3/-0 (For R6)
105+3/-0 (For C8)
Room
Temp.
Time
(min.)
153
1
153
1
JEMCGS-02088H 2

6 Operational Life The measured and observed characteristics should satisfy the Solder the capacitor on the test substrate(glass epoxy board).
specifications in the following table. Apply 100% of the rated voltage for 1000±12h at maximum operating
Appearance No marking defects
temperature ±3℃. Set for 24±2h at room temperature, then measure.
The charge/discharge current is less than 50mA.
Capacitance R6,C8: Within ±12.5%
Change
・Initial measurement
Dissipation R6,C8: 0.2max
Perform a heat treatment at 150+0/-10℃for 1h and then set
Factor for 24±2h at room temperature.
Perform the initial measurement.
・Measurement after test
Insulation
More than 100MΩ or 5Ω ∙F (Whichever is smaller) Perform a heat treatment at 150+0/–10°C for 1h and then let
Resistance
sit for 24±2h at room temperature, then measure.
7 External Visual No defects or abnormalities Visual inspection
8 Physical Dimension Within the specified dimensions Using Measuring instrument of dimension.
9 Resistance to Appearance No marking defects
Per MIL-STD-202 Method 215
Solvents Solvent 1 : 1 part (by volume) of isopropyl alcohol
Capacitance Within the specified tolerance 3 parts (by volume) of mineral spirits
Solvent 2 : Terpene defluxer
Solvent 3 : 42 parts (by volume) of water
Dissipation Within the specified initial value.
1 part (by volume) of propylene glycol monomethyl ether
Factor
1 part (by volume) of monoethanolamine
Insulation Within the specified initial value.
Resistance
10 Mechanical Appearance No marking defects Solder the capacitor on the test substrate(glass epoxy board).
Shock
Three shocks in each direction should be applied along 3 mutually
Capacitance Within the specified tolerance
perpendicular axes of the test specimen (18 shocks).
The specified test pulse should be Half-sine and should have a
Dissipation Within the specified initial value.
duration :0.5ms, peak value:1500g and velocity change: 4.7m/s.
Factor
Insulation Within the specified initial value.
Resistance
11 Vibration Appearance No defects or abnormalities Solder the capacitor on the test substrate(glass epoxy board).
The capacitor should be subjected to a simple harmonic motion having
Capacitance Within the specified tolerance
a total amplitude of 1.5mm, the frequency being varied uniformly between
the approximate limits of 10 and 2000Hz. The frequency range, from
Dissipation Within the specified initial value. 10 to 2000Hz and return to 10Hz, should be traversed in
Factor approximately 20min. This motion should be applied for 12
items in each 3 mutually perpendicular directions (total of 36 times).
Insulation Within the specified initial value.
Resistance
12 Resistance to The measured and observed characteristics should satisfy the Immerse the capacitor in Sn-3.0Ag-0.5Cu solder solution or an eutectic
Soldering Heat specifications in the following table.
solder solution at 260±5℃for 10±1s.
Appearance No marking defects
Set at room temperature for 24±2h, then measure.
Capacitance Within the specified tolerance
・Initial measurement
Perform a heat treatment at 150+0/-10 ℃for 1h and then set
Dissipation Within the specified initial value.
for 24±2h at room temperature.
Factor Perform the initial measurement.
Insulation Within the specified initial value.
Resistance
■AEC-Q200 Murata Standard Specification and Test Methods
No
AEC-Q200 Test Item
Specifications.
AEC-Q200 Test Method
JEMCGS-02088H 3

13 Thermal Shock The measured and observed characteristics shall satisfy the Solder the capacitor on the test substrate(glass epoxy board).
specifications in the following table.
Perform the 300 cycles according to the two heat treatments listed
Appearance No marking defects
in the following table(Maximum transfer time is 20s).
Set for 24+/-2h at room temperature, then measure.
Capacitance R6,C8: Within ±12.5%
Change
Dissipation Within the specified initial value.
Factor
Insulation Within the specified initial value.
・Initial measurement
Resistance
Perform a heat treatment at 150+0/-10 for 1h and then set
for 24±2h at room temperature.
Perform the initial measurement.
14 ESD Appearance No marking defects
Per AEC-Q200-002
Voltage setting level : 2kV
Capacitance Within the specified tolerance
Dissipation Within the specified initial value.
Factor
Insulation Within the specified initial value.
Resistance
15 Solderability
(a) Preheat at 155℃for 4h. After preheating, immerse the capacitor
in a solution of ethanol(JIS-K-8101) and rosin (JIS-K-5902)
(25% rosin in mass proportion).
Immerse in Sn-3.0Ag-0.5Cu solder solution at 245+/-5℃or
an eutectic solder solution at 235+/-5℃for 5+0/-0.5s.
(b) should be placed into steam aging for 8h+/-15min.
After preheating, immerse the capacitor in a solution of ethanol
(JIS-K-8101) and rosin (JIS-K-5902) (25% rosin in mass
proportion). Immerse in Sn-3.0Ag-0.5Cu solder solution at 245+/-5℃
or an eutectic solder solution at 235+/-5℃for 5+0/-0.5s.
(c) should be placed into steam aging for 8h+/-15min.
After preheating, immerse the capacitor in a solution of ethanol
(JIS-K-8101) and rosin (JIS-K-5902) (25% rosin in mass
proportion). Immerse in Sn-3.0Ag-0.5Cu solder solution or
an eutectic solder solution for 120+/-5s at 260+/-5℃.
16 Electrical Appearance No defects or abnormalities Visual inspection.
Chatacteri-
zation Capacitance Within the specified tolerance
The capacitance/Q/D.F. should be measured at 25℃at the
frequency and voltage shown in the table.
Dissipation R6.C8 :0.125max
Factor
Insulation More than 1000MΩ or 50Ω ∙ F (Whichever is smaller) The insulation resistance should be measured with a DC voltage not
Resistance
exceeding the rated voltage at 25℃and maximumoperating temperature※
25℃within 1min of charging.
Insulation More than 100MΩ or 5Ω ∙ F (Whichever is smaller)
Resistance
※85+3/-0℃(For R6), 105+3/-0℃(For C8)
85℃(For R6)
105℃(For C8)
Dielectric No failure No failure should be observed when 250% of the rated voltage is
Strength applied between the terminations for 1 to 5s, provided the
charge/ discharge current is less than 50mA.
■AEC-Q200 Murata Standard Specification and Test Methods
No
AEC-Q200 Test Item
Specifications.
AEC-Q200 Test Method
95% of the terminations is to be soldered evenly and continuously.
Step
1
2
Temp.
(℃)
-55+0/-3
105+3/-0 (For C8)
85+3/-0 (For R6)
Time
(min.)
15±3
15±3
Char.
Item
R6,C8
6.3V max.
(C≦10F)
R6,C8
10V min.
(C≦10F)
R6,C8
(10F< C)
Frequency
10.1kHz
10.1kHz
12024Hz
Voltage
0.50.1Vrms
10.2Vrms
0.50.1Vrms
JEMCGS-02088H 4

17 Board Flex Appearance No marking defects
Solder the capacitor on the test substrate(glass epoxy board)
shown in Fig1.
Then apply a force in the direction shown in Fig 2 for 5±1s
Capacitance Within specified tolerance
The soldering should be done by the reflow method and should be
conducted with care so that the soldering is uniform and free of defects
such as heat shock.
Dissipation Within the specified initial value.
Factor
Insulation Within the specified initial value.
Resistance
(in mm)
Fig.2
18 Terminal Appearance No marking defects
Solder the capacitor on the test substrate(glass epoxy board)
Strength
shown in Fig3.
Capacitance Within specified tolerance Then apply 18N* force in parallel with the test jig for 60s.
The soldering should be done either with an iron or using the reflow
Dissipation Within the specified initial value. method and should be conducted with care so that the soldering is
Factor uniform and free of defects such as heat shock
Insulation Within the specified initial value.
Resistance
（in mm）
19 Beam Load Test Destruction value should be exceed following one. Place the capacitor in the beam load fixture as Fig 4.
< Chip L dimension : 2.5mm max. > Apply a force.
< Chip Length : 2.5mm max. >
< Chip L dimension : 3.2mm min. >
< Chip Length : 3.2mm min. >
Speed supplied the Stress Load : *0.5mm / s
*GRT03: 0.1mm/s
Chip thickness ≧1.25mm rank : 54.5N
Chip thickness > 0.5mm rank : 20N
Chip thickness = 0.5mm rank : 8N
Chip thickness = 0.3mm rank : 5N
Chip thickness < 0.3mm rank : 2.5N
Chip thickness < 1.25mm rank : 15N
■AEC-Q200 Murata Standard Specification and Test Methods
No
AEC-Q200 Test Item
Specifications.
AEC-Q200 Test Method
t : 1.6mm
(GRT03,15:0.8mm)
Fig.3
Fig.4
*2N(GRT03,15)
t : 1.6mm
(GRT03,15:0.8mm)
＊2
4.0±0.1
8.0±0.3
3.5±0.05
0.05以下
＊1
φ1.5
+0.1
-0
Ａ
t
*1,2：2.0±0.05
1.75±0.1
Ｂ
100
40
a
c
b
C
Fig.1
＊2
4.0±0.1
8.0±0.3
3.5±0.05
0.05以下
＊1
φ1.5
+0.1
-0
Ａ
t
*1,2：2.0±0.05
1.75±0.1
Ｂ
a
a
c
b
ﾗﾝﾄﾞ
f4.5
c
Solder resist
Baked electrode
or copper foil
b
Iron Board
L
0.6L
Type
a
b
c
GRT03
0.3
0.9
0.3
GRT15
0.5
1.5
0.6
GRT18
0.6
2.2
0.9
GRT21
0.8
3.0
1.3
GRT31
2.0
4.4
1.7
GRT32
2.0
4.4
2.6
Type
a
b
c
GRT03
0.3
0.9
0.3
GRT15
0.4
1.5
0.5
GRT18
1.0
3.0
1.2
GRT21
1.2
4.0
1.65
GRT31
2.2
5.0
2.0
GRT32
2.2
5.0
2.9
45
45
Flexure：≦2
(Chip thickness＞0.85mm rank
High Dielectric Type)
Flexure：≦1
(Chip thickness≦0.85mm rank
High Dielectric Type)
Capacitance meter
Pressurization
speed
1.0mm/s
Support
Capacitor
Pressurize
45
45
20
50
R4
20
50 min.
JEMCGS-02088H 5

20 Capacitance Temperature R6 : Within ±15% The capacitance change should be measured after 5min at
Characteristics (-55℃to +85℃) each specified temperature stage.
Capacitance value as a reference is the value in step 3.
C8 : Within ±22%
(-55℃to +105℃)
・Initial measurement
Perform a heat treatment at 150+0/-10℃for one hour
and then set for 24±2 hours at room temperature.
Perform the initial measurement.
■AEC-Q200 Murata Standard Specification and Test Methods
No
AEC-Q200 Test Item
Specifications.
AEC-Q200 Test Method
Step
Temperature(C)
1
Reference Temp.+/-2
2
Min. Operating Temp.+/-3
3
Reference Temp.+/-2
4
Max. Operating Temp.+/-3
5
Reference Temp.+/-2
JEMCGS-02088H 6

1.Tape Carrier Packaging(Packaging Code:D/E/W/F/L/J/K)
1.1 Minimum Quantity(pcs./reel)
GRT03
GRT18
1.2 Dimensions of Tape
(1)GRT03/15(Paper Tape W8P2 Code:D/E/J/F) (in mm)
2
*3 Nominal value
1.0±0.2
0.5±0.2
0.5±0.2
0.78
1.29
1.0±0.15
0.5±0.15
0.5±0.15
0.72
1.25
1.0±0.1
0.5±0.1
0.5±0.1
0.70
1.20
5
0.5±0.05
GRT15
1.0±0.05
0.5±0.05
0.2 +0.02/-0.04
0.65
1.15
0.8 max.
0.6±0.05
0.3±0.05
0.3±0.05
0.39
0.69
0.37
0.67
0.5 max.
GRT03
3
0.6±0.03
0.3±0.03
0.3±0.03
Type
Dimensions Tolerance(Chip)
A *3
B *3
t
L
W
T
8000
D/E
1000
4000
GRT32
N
2000
10000
C
2000
6000
4000
10000
M
3000
10000
GRT31
6
4000
10000
9
9
4000
10000
GRT21
6
4000
10000
B
3000
4000
10000
5(LWTDimensions
Tolerance:±0.1min.)
10000(W8P2)
40000(W8P2)
5(LWTDimensions
Tolerance:±0.05)
10000(W8P2)
20000(W8P1)
50000(W8P2)
GRT15
2
20000(W8P2)
50000(W8P2)
15000(W8P2)
30000(W8P1)
50000(W8P2)
Code:K
Paper Tape
Plastic Tape
Paper Tape
Plastic Tape
Package
GRT Type
Type
φ180mm reel
φ330mm reel
Code:D/E
Code:W
Code:L
Code:J/F
*1,2：2.0±0.05
＊2
4.0±0.1
8.0±0.3
3.5±0.05
0.05以下
＊1
φ1.5
+0.1
-0
Ａ
t
*1,2：2.0±0.05
1.75±0.1
Ｂ
4.0±0.1
*1
φ1.5
+0.1
-0
1.75±0.1
8.0±0.3
3.5±0.05
Ａ
Ｂ
t
*2
0.05 max.
JEMCGP-01742H 7

(2)GRT03/15Paper Tape W8P1 Code:W) (in mm)
L
W T
0.6±0.03 0.3±0.03 0.3±0.03 0.37 0.67
0.6±0.05 0.3±0.05 0.3±0.05 0.39 0.69
GRT15 5 1.0±0.05 0.5±0.05 0.5±0.05 0.65 1.15 0.8 max.
(3)GRT18/21/31/32(Paper Tape) (in mm)
L
W T
1.6±0.1 0.8±0.1 0.8±0.1
1.6±0.15 0.8±0.15 0.8±0.15
1.6±0.2 0.8±0.2 0.8±0.2 1.10±0.10 2.00±0.10
0.6±0.1
0.6+0/-0.15
0.85±0.1
0.85+0/-0.2
2.0±0.15 1.25±0.15 0.85±0.1
6 0.6±0.1
3.2±0.2 1.6±0.2
9
0.85±0.1
1.6±0.15
2.00±0.20
3.60±0.20
9
GRT21
6
2.0±0.1
1.25±0.1
1.55±0.15
GRT18
8
1.05±0.10
1.85±0.10
1.1 max.
2.30±0.15
GRT31
3.2±0.15
GRT03
3
0.5 max.
Type
Dimensions Tolerance(Chip)
A
B
t
Package
GRT Type
Type
Dimensions Tolerance(Chip)
A
B
t
4.0±0.1
4.0±0.1
2.0±0.1
φ1.5
+0.1
-0
1.75±0.1
8.0±0.3
3.5±0.05
t
Ａ
Ｂ
1.0±0.05
4.0±0.1
φ1.5
+0.1
-0
1.75±0.1
8.0±0.3
3.5±0.05
Ａ
Ｂ
t
1.0±0.05
JEMCGP-01742H 8

(4)GRT21/31/32(Plastic Tape) (in mm)
L
W T
2.0±0.1 1.25±0.1 1.25±0.1 1.45±0.20 2.25±0.20 1.7 max.
2.0±0.15 1.25±0.15 1.25±0.15
2.0±0.2 1.25±0.2 1.25±0.2
3.2±0.15 1.6±0.15 1.15±0.1
1.15±0.15
C 1.6±0.2 2.5 max.
N 1.35±0.15 2.5 max.
D 2.0±0.2 3.0 max.
E 2.5±0.2 3.7 max.
GRT32
3.2±0.3
2.5±0.2
2.80±0.20
3.50±0.20
3.2±0.2
1.6±0.2
2.30±0.20
2.0 max.
GRT31
M
1.90±0.20
3.50±0.20
1.7 max.
GRT21
B
1.50±0.20
Type
Dimensions Tolerance(Chip)
A
B
t
Package
GRT Type
8.0±0.3
4.0±0.1
3.5±0.05
1.75±0.1
Ａ
Ｂ
t
2.0±0.1
φ1.5
+0.1
-0
4.0±0.1
0.25±0.1(T≦2.0mm)
0.3±0.1(T：2.5mm)
JEMCGP-01742H 9

Package
GRT Type
図
1
ﾁｯﾌﾟ詰め状態
(
単位：
mm)
φ21±0.8
ｗ1
W
Top Tape : Thickness 0.06
Feeding Hole :As specified in 1.2.
Hole for Chip : As specified in 1.2.
Base Tape : As specified in 1.2.
Bottom Tape :Thickness 0.05
(Only a bottom tape existence )
W
w1
GRT32 max.
16.5 max.
10±1.5
φ180+0/-3.0
φ330±2.0
φ50 min.
φ13±0.5
2.0±0.5
Chip
(in mm)
Fig.1 Package Chips
Fig.2 Dimensions of Reel
Fig.3 Taping Diagram
JEMCGP-01742H 10