Murata LLA215C70G475ME19 Series User manual

LLA215C70G475ME19_ (0805, X7S:EIA, 4.7uF, DC4V)
_: packaging code Reference Sheet
1.Scope
2.MURATA Part NO. System
(Ex.)
3. Type & Dimensions
a)Equivalent Circuit
(Unit:mm)
4.Rated value
5.Package
Product specifications in this catalog are as of Jun.8,2017,and are subject to change or obsolescence without notice.
Please consult the approval sheet before ordering.
Please read rating and !Cautions first.
Only Reflow Soldering
(1)-1 L
2.0±0.1
(1)-2 W
1.25±0.1
p
8 Terminals Low ESL Chip Multilayer Ceramic Capacitors for General Purpose
mark
(4)
Rated
Voltage
Packaging Unit
DC 4 V
Temp. Range
(Ref.Temp.)
(8) Packaging
Temp. coeff
or Cap. Change
This product specification is applied to 8 Terminals Low ESL Chip Multilayer Ceramic Capacitors used for General Electronic equipment.
This product is applied for Only Reflow Soldering.
(2) T
0.5+0.05/-0.1
-55 to 125 °C
-22 to 22 %
-55 to 125 °C
(25 °C)
(6)
Capacitance
Tolerance
4.7 uF
Specifications and Test
Methods
(Operating
Temp. Range)
±20 %
(3) Temperature Characteristics
(Public STD Code):X7S(EIA)
0.5±0.05
(5) Nominal
Capacitance
L
f180mm Reel
EMBOSSED W8P4
4000 pcs./Reel
K
f330mm Reel
EMBOSSED W8P4
10000 pcs./Reel
(1)L/W
Dimensions (2)T
Dimensions (3)Temperature
Characteristics (4)Rated
Voltage (5)Nominal
Capacitance (6)Capacitance
Tolerance (8)Packaging Code

Code
LLA 21 5C7 0G 475 M E19 L
LLA215C70G475ME19-01 1

1 Rated Voltage Shown in Rated value. The rated voltage is defined as the maximum voltage
which may be applied continuously to the capacitor.
When AC voltage is superimposed on DC voltage,
VP-P or VO-P, whichever is larger, should be maintained
within the rated voltage range.
2 Appearance No defects or abnormalities. Visual inspection.
3 Dimension Within the specified dimensions. Using Measuring instrument of dimension.
4 Voltage proof No defects or abnormalities. Measurement Point : Between the terminations
Test Voltage : 250% of the rated voltage
Applied Time : 1s to 5 s
Charge/discharge current : 50mA max.
5 Insulation Resistance(I.R.)
∙F (Whichever is smaller) Measurement Point : Between the terminations
Measurement Voltage : DC Rated Voltage
Charging Time : 1 min
Charge/discharge current : 50mA max.
Measurement Temperature : Room Temperature
6 Capacitance Shown in Rated value. Measurement Temperature : Room Temperature
7 Dissipation Factor (D.F.) 0.120max.
8
Temperature No bias C7 : Within +/-22% (-55°C to +125°C) The capacitance change should be measured after 5 min
Characteristics at each specified temp. stage.
of Capacitance Capacitance value as a reference is the value in step 3.
· Initial measurement
Perform a heat treatment at 150+0/-10°C for 1h and then
let sit for 24+/-2h at room temperature,then measure.
9 Adhesive Strength of No removal of the terminations or other defect Solder the capacitor on the test substrate (glass epoxy board).
Termination should occur.
Applied Force : 5N
Holding Time : 10+/-1s
Applied Direction : In parallel with the test substrate and vertical with
the capacitor side.
10 Vibration  Appearance No defects or abnormalities. Solder the capacitor on the test substrate (glass epoxy board).
Capacitance Within the specified initial value. Kind of Vibration : A simple harmonic motion
10Hz to 55Hz to 10Hz (1min)
D.F. Within the specified initial value. Total amplitude : 1.5mm
This motion should be applied for a period of 2h in each 3 mutually
perpendicular directions(total of 6h).
■Specifications and Test Methods
No
Item
Specification
Test Method
(Ref. Standard:JIS C 5101, IEC60384）
Step
Temperature(C)
Applying Voltage(Vdc)
1
Reference Temp.+/-2
No bias
2
Min.Operating Temp.+/-3
3
Reference Temp.+/-2
4
Max.Operating Temp.+/-3
5
Reference Temp.+/-2
Capacitance
Frequency
Voltage
C≦
(10V min.)
1.0+/-0.1kHz
1.0+/-0.2Vrms
C≦
(6.3V max.)
1.0+/-0.1kHz
0.5+/-0.1Vrms
C＞
120+/-24Hz
0.5+/-0.1Vrms
JEMCAS-00669B 2

11 Solderability 75% of the terminations is to be soldered evenly and continuously. Test Method : Solder bath method
Flux : Solution of rosin ethanol 25(mass)%
Preheat :
80℃to 120℃for 10s to 30s
Solder : Sn-3.0Ag-0.5Cu
Solder Temp. :
245+/-5℃
Immersion time :
2+/-0.5s
12
Temperature Appearance No defects or abnormalities. Solder the capacitor on the test substrate (glass epoxy board).
Sudden Change
Capacitance Within +/-12.5% Perform the 5 cycles according to the four heat treatments
Change shown in the following table.
D.F. Within the specified initial value.
I.R. Within the specified initial value.
Voltage proof No defects.
Exposure Time : 24+/-2h
· Initial measurement
Perform a heat treatment at 150+0/-10°C for 1h and then
let sit for 24+/-2h at room temperature,then measure.
13
High Appearance No defects or abnormalities. Solder the capacitor on the test substrate (glass epoxy board).
Temperature
High Humidity Capacitance Within +/-12.5%
Test Temperature :
40+/-2℃
(Steady) Change
Test Humidity :
90%RH to 95%RH
Test Time :
500+/-12h
D.F. 0.2 max. Applied Voltage : DC Rated Voltage
Charge/discharge current : 50mA max.
I.R.
∙F (Whichever is smaller) · Initial measurement
Perform a heat treatment at 150+0/-10°C for 1h and then
let sit for 24+/-2h at room temperature,then measure.
· Measurement after test
Perform a heat treatment at 150+0/-10°C for 1h and then
let sit for 24+/-2h at room temperature,then measure.
14 Durability Appearance No defects or abnormalities. Solder the capacitor on the test substrate (glass epoxy board).
Capacitance Within +/-12.5% Test Temperature : Max. Operating Temp. +/-3℃
Change
Test Time :
1000+/-12h
Applied Voltage : 150% of the rated voltage
D.F. 0.2 max. Charge/discharge current : 50mA max.
· Initial measurement
I.R.
∙F (Whichever is smaller) Perform a heat treatment at 150+0/-10°C for 1h and then
let sit for 24+/-2h at room temperature,then measure.
· Measurement after test
Perform a heat treatment at 150+0/-10°C for 1h and then
let sit for 24+/-2h at room temperature,then measure.
No
Item
Specification
Test Method
(Ref. Standard:JIS C 5101, IEC60384）
Step
Temp.(C)
Time (min)
1
Min.Operating Temp.+0/-3
30+/-3
2
Room Temp.
2 to 3
3
Max.Operating Temp.+3/-0
30+/-3
4
Room Temp
2 to 3
JEMCAS-00669B 3

1.Tape Carrier Packaging(Packaging Code:L/K)
1.1 Minimum Quantity(pcs./reel)
1.2 Dimensions of Tape (in mm)
Package
LLA Type
4.0±0.1
4.0±0.1
2.0±0.1
0.2±0.1
1.7max.
A
B
1.75±0.1
3.5±0.05
8.0±0.3
＋０．１
－０
Type
Dimensions(Chip)
A
B
L
W
T
LLA18
5
1.6±0.1
0.8±0.1
0.5 +0.05/-0.1
1.05±0.10
1.85±0.10
LLA21
2.0±0.1
1.25±0.1
1.45±0.20
2.25±0.20
9
0.85±0.1
Type
f180mm reel
f330mm reel
Plastic Tape
Code : L
Code : K
LLA18
5
4000
10000
LLA21
5
4000
10000
9
3000
10000
JEMCAP-01912A 4

Package
LLA Type
Chip
2.0±0.5
φ21±0.8
φ180+0/-3.0 φ330±2.0
φ50 min.
φ13±0.5
10±1.5
16.5 max.
Hole for Chip : As specified in 1.2
Base Tape : As specified in 1.2
Top Tape : Thickness 0.06
(*LLA18 /LLA215 type: Thickness 0.05)
Feeding Hole : As specified in 1.2
Fig 1 Package Chip
Fig.2 Dimension of Reel
Fig3 Taping Diagram
(in mm)
JEMCAP-01912A 5

1.3 Tapes for capacitors are wound clockwise shown in Fig.3.
(The sprocket holes are to the right as the tape is pulled toward the user.)
1.4 Part of the leader and part of the vacant section are attached as follows. (in mm)
1.5 Accumulate tolerance of sprocket holes pitch = ±0.3mm / 10 pitch
1.6 Chip in the tape is enclosed by top tape and bottom tape as shown in Fig.1.
1.7 The top tape and base tape are not attached at the end of the tape for a minimum of 5 pitches.
1.8 There are no jointing for top tape and bottom tape.
1.9 There are no fuzz in the cavity.
1.10 Break down force of top tape : 5N min.
1.11 Reel is made by resin and appeaser and dimension is shown in Fig 2.
There are possibly to change the material and dimension due to some impairment.
1.12 Peeling off force : 0.1N to 0.6N in the direction as shown below.
1.13 Label that show the customer parts number, our parts number, our company name, inspection
number and quantity, will be put in outside of reel.
Package
LLA Type
図
1
ﾁｯﾌﾟ詰め状態
(
単位：
mm)
Tail vacant Section
Chip-mounting Unit
Leader vacant Section
Leader Unit
(Top Tape only)
Direction
of Feed
160 min.
190 min.
210 min.
165 to 180°
Top Tape
JEMCAP-01912A 6

Caution
■Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high reliability
for the prevention of defects which might directly cause damage to the third party's life, body or property.
①Aircraft equipment ②Aerospace equipment ③Undersea equipment ④Power plant control equipment
⑤Medical equipment ⑥Transportation equipment(vehicles,trains,ships,etc.) ⑦Traffic signal equipment
⑧Disaster prevention / crime prevention equipment ⑨Data-processing equipment
⑩Application of similar complexity and/or reliability requirements to the applications listed in the above.
■Storage and Operation condition
1. The performance of chip multilayer ceramic capacitors may be affected by the storage conditions.
1-1. Store the capacitors in the following conditions:
Room Temperature of +5℃to +40℃and a Relative Humidity of 20% to 70%.
(1) High temperature and humidity conditions may accelerate the deterioration of solderability due to oxidation
of the terminal electrodes and deterioration of taping/packaging performance.
Therefore, maintain the appropriate storage temperature and humidity.
(2) Prolonged storage may cause oxidation of the electrodes and deterioration of the packaging materials.
If more than six months have elapsed since delivery, check the mounting before use.
If more than one year has elapsed since delivery, also check the solderability before use.
Even if the storage period is short, do not exceed the specified atmospheric conditions.
(3) Store the capacitors in the original packaging without opening the smallest packing unit.
Do not exceed the above atmospheric conditions for any length of time.
1-2. Corrosive gas can react with the termination (external) electrodes or lead wires of capacitors, and result
in poor solderability. Do not store the capacitors in an atmosphere consisting of corrosive gas (e.g.,hydrogen
sulfide, sulfur dioxide, chlorine, ammonia gas etc.).
1-3. Due to moisture condensation caused by rapid humidity changes, or the photochemical change caused
by direct sunlight on the terminal electrodes and/or the resin/epoxy coatings, the solderability and
electrical performance may deteriorate. Do not store capacitors under direct sunlight or in high huimidity
conditions
■Rating
1.Temperature Dependent Characteristics
1. The electrical characteristics of the capacitor can change with temperature.
1-1. For capacitors having larger temperature dependency, the capacitance may change with temperature
changes. The following actions are recommended in order to ensure suitable capacitance values.
(1) Select a suitable capacitance for the operating temperature range.
(2) The capacitance may change within the rated temperature.
When you use a high dielectric constant type capacitor in a circuit that needs a tight (narrow) capacitance
tolerance (e.g., a time-constant circuit), please carefully consider the temperature characteristics, and
carefully confirm the various characteristics in actual use conditions and the actual system.
[Example of Temperature Caracteristics X7R(R7)] [Example of Temperature Characteristics X5R(R6)]

!
-20
-10
-15
-5
5
0
10
15
20
Temperature (C)
-75 -50 -25 025 50 75 100 125 150
Capacitance Change(%)
-20
-10
-15
-5
5
0
10
15
20
Temperature (C)
-75 -50 -25 025 50 75 100
Capacitance Change(%)
JEMCAC-00640E 7

2.Measurement of Capacitance
1. Measure capacitance with the voltage and frequency specified in the product specifications.
1-1. The output voltage of the measuring equipment may decrease occasionally when capacitance is high.
Please confirm whether a prescribed measured voltage is impressed to the capacitor.
1-2. The capacitance values of high dielectric constant type capacitors change depending on the AC voltage applied.
Please consider the AC voltage characteristics when selecting a capacitor to be used in a AC circuit.
3.Applied Voltage
1. Do not apply a voltage to the capacitor that exceeds the rated voltage as called out in the specifications.
1-1. Applied voltage between the terminals of a capacitor shall be less than or equal to the rated voltage.
(1) When AC voltage is superimposed on DC voltage, the zero-to-peak voltage shall not exceed the rated DC voltage.
When AC voltage or pulse voltage is applied, the peak-to-peak voltage shall not exceed the rated DC voltage.
(2) Abnormal voltages (surge voltage, static electricity, pulse voltage, etc.) shall not exceed the rated DC voltage.
Typical Voltage Applied to the DC capacitor
DC Voltage DC Voltage+AC AC Voltage Pulse Voltage
(E：Maximum possible applied voltage.)
1-2. Influence of over voltage
Over voltage that is applied to the capacitor may result in an electrical short circuit caused by the breakdown
of the internal dielectric layers .
The time duration until breakdown depends on the applied voltage and the ambient temperature.
4.Type of Applied Voltage and Self-heating Temperature
1.Confirm the operating conditions to make sure that no large current is flowing into the capacitor due to the
continuous application of an AC voltage or pulse voltage.
When a DC rated voltage product is used in an AC voltage circuit or a pulse voltage circuit, the AC current
or pulse current will flow into the capacitor; therefore check the self-heating condition.
Please confirm the surface temperature of the capacitor so that the temperature remains within the upper limits
of the operating temperature, including the rise in temperature due to self-heating. When the capacitor is
used with a high-frequency voltage or pulse voltage, heat may be generated by dielectric loss.
<Applicable to Rated Voltage of less than 100VDC>
The load should be contained so that the self-heating
of the capacitor body remains below 20°C ,
whenmeasuring at an ambient temperature of 25°C.
Caution
!
1
10
100
0 1 2 3
Current (Ar.m.s.) 4 5 6
TemperatureRise (C)
[Example of Temperature Rise (Heat Generation) in Chip
Multilayer Ceramic Capacitors in Contrast to Ripple Current]
Sample: R(R1) characteristics 10 Rated voltage: DC10V
Ripple Current
100kHz
500kHz
1MHz
E
E
E
E
0
0
0
0
JEMCAC-00640E 8

5. DC Voltage and AC Voltage Characteristic
1. The capacitance value of a high dielectric constant type
capacitor changes depending on the DC voltage applied.
Please consider the DC voltage characteristics when a
capacitor is selected for use in a DC circuit.
1-1. The capacitance of ceramic capacitors may change
sharply depending on the applied voltage. (See figure)
Please confirm the following in order to secure the
capacitance.
(1) Determine whether the capacitance change caused
by the applied voltage is within the allowed range .
(2) In the DC voltage characteristics, the rate of
capacitance change becomes larger as voltage
increases, even if the applied voltage is below
the rated voltage. When a high dielectric constant
type capacitor is used in a circuit that requires a
tight (narrow) capacitance tolerance (e.g., a time
constant circuit), please carefully consider the
voltage characteristics, and confirm the various
characteristics in the actual operating conditions
of the system.
2. The capacitance values of high dielectric
constant type capacitors changes depending
on the AC voltage applied.
Please consider the AC voltage characteristics
when selecting a capacitor to be used in a
AC circuit.
6. Capacitance Aging
[Example of Change Over Time (Aging characteristics) ]
1. The high dielectric constant type capacitors
have an Aging characteristic in which the capacitance
value decreases with the passage of time.
When you use a high dielectric constant type
capacitors in a circuit that needs a tight (narrow)
capacitance tolerance (e.g., a time-constant circuit),
please carefully consider the characteristics
of these capacitors, such as their aging, voltage,
and temperature characteristics. In addition,
check capacitors using your actual appliances
at the intended environment and operating conditions.
7.Vibration and Shock
1. Please confirm the kind of vibration and/or shock, its condition, and any generation of resonance.
Please mount the capacitor so as not to generate resonance, and do not allow any impact on the terminals.
2. Mechanical shock due to being dropped may cause damage or
a crack in the dielectric material of the capacitor.
Do not use a dropped capacitor because the quality and reliability
may be deteriorated.
3. When printed circuit boards are piled up or handled, the corner
of another printed circuit board
should not be allowed to hit the capacitor in order to avoid
a crack or other damage to the capacitor.
Caution
-100
-80
-60
-40
-20
0
20
010 20 30
DC Voltage (V) 40 50
[Example of DC Voltage Characteristics]
Sample: X7R(R7) Characteristics 
Capacitance Change (%)
00.5 1
AC Voltage (Vr.m.s.) 1.5 2
[Example of AC Voltage Characteristics]
Sample: X7R(R7) Characteristics 
Capacitance Change (%)
30
20
10
0
-10
-20
-30
-40
-50
-60
Floor
Crack
Mounting printed circuit board
Crack
!
20
10
0
-10
-20
-30
-40
10
100
1000
10000
Time(h)
Capacitance Change(%)
C0G(5C)
X7R(R7)
X5R(R6)
JEMCAC-00640E 9

■Soldering and Mounting
1.Mounting Position
1. Confirm the best mounting position and direction that minimizes the stress imposed on the capacitor during flexing
or bending the printed circuit board.
1-1.Choose a mounting position that minimizes the stress imposed on the chip during flexing or bending of the board.
[Component Direction]
Locate chip horizontal to the
direction in which stress acts.
(Bad Example) (Good Example)
[Chip Mounting Close to Board Separation Point]
It is effective to implement the following measures, to reduce stress in separating the board.
It is best to implement all of the following three measures; however, implement as many measures as possible
to reduce stress.
Stress Level
(1) Turn the mounting direction of the component parallel to the board separation surface.
A > D *1
(2) Add slits in the board separation part.
A > B
(3) Keep the mounting position of the component away from the board separation surface.
A > C
*1 A > D is valid when stress is added vertically to the perforation as with Hand Separation.
If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid.
[Mounting Capacitors Near Screw Holes]
When a capacitor is mounted near a screw hole, it may be affected by the board deflection that occurs during
the tightening of the screw. Mount the capacitor in a position as far away from the screw holes as possible.
2.Information before Mounting
1. Do not re-use capacitors that were removed from the equipment.
2. Confirm capacitance characteristics under actual applied voltage.
3. Confirm the mechanical stress under actual process and equipment use.
4. Confirm the rated capacitance, rated voltage and other electrical characteristics before assembly.
5. Prior to use, confirm the solderability of capacitors that were in long-term storage.
6. Prior to measuring capacitance, carry out a heat treatment for capacitors that were in long-term storage.
7.The use of Sn-Zn based solder will deteriorate the reliability of the MLCC.
Please contact our sales representative or product engineers on the use of Sn-Zn based solder in advance.
Caution
Contents of Measures
Screw Hole Recommended
!
①
②
③
1C
1B
1A
Perforation
Slit
A
B
C
D
①
1A
JEMCAC-00640E 10