Murata LLA215R71E103MA14 Series User manual

LLA215R71E103MA14_ (0805, X7R:EIA, 10000pF, DC25V)
_: packaging code Reference Sheet
1.Scope
2.MURATA Part NO. System
(Ex.)
3. Type & Dimensions
a)Equivalent Circuit
(Unit:mm)
4.Rated value
5.Package
Product specifications in this catalog are as of Sep.12,2016,and are subject to change or obsolescence without notice.
Please consult the approval sheet before ordering.
Please read rating and !Cautions first.
(3) Temperature Characteristics
(Public STD Code):X7R(EIA)
0.5±0.05
(5) Nominal
Capacitance
mark
(4)
Rated
Voltage
Packaging Unit
DC 25 V
Temp. Range
(Ref.Temp.)
(8) Packaging
-15 to 15 %
-55 to 125 °C
(25 °C)
Only Reflow Soldering
(1)-1 L
2.0±0.1
(1)-2 W
1.25±0.1
This product specification is applied to Low ESL Chip Monolithic Ceramic Capacitor used for General Electronic equipment.
This product is applied for Only Reflow Soldering.
(2) T
p
Low ESL Chip Monolithic Ceramic Capacitor for General
Specifications and Test
Methods
(Operating
Temp. Range)
Temp. coeff
or Cap. Change
±20 %
(6)
Capacitance
Tolerance
10000 pF
0.5+0.05/-0.1
-55 to 125 °C
L
f180mm Reel
EMBOSSED W8P4
4000 pcs./Reel
K
f330mm Reel
EMBOSSED W8P4
10000 pcs./Reel
(1)L/W
Dimensions
(2)T
Dimensions
(3)Temperature
Characteristics
(4)Rated
Voltage
(5)Nominal
Capacitance
(6)Capacitance
Tolerance
(8)Packaging Code

Code
LLA 21 5R7 1E 103 M A14 L
LLA215R71E103MA14-01 1

No Item Test Method
1 Operating
R7 / C7：－55℃to ＋125℃
Temperature Range
2 Rated Voltage See the previous pages. The rated voltage is defined as the maximum voltage which may be
applied continuously to the capacitor.
When AC voltage is superimposed on DC voltage, VP-P or VO-P,
whichever is larger, should be maintained within the rated
voltage range.
3 Appearance No defects or abnormalities. Visual inspection.
4 Dimension Within the specified dimensions. Using calipers.
5 Dielectric Strength No defects or abnormalities. No failure shall be observed when 250% of the rated voltage is
applied between the terminations for 1 to 5 seconds, provided the
charge/discharge current is less than 50mA.
6 Insulation
･F. The insulation resistance shall be measured with a DC voltage
Resistance (whichever is smaller)
not exceeding the rated voltage at 25℃and 75%RH max. and
within 2 minutes of charging.
7 Capacitance Within the specified tolerance.
The capacitance/D.F. shall be measured at 25℃at the
frequency and voltage shown in the table.
8 Dissipation Factor W.V.:25Vmin. ;0.025 max.
(D.F.) W.V.:16V/10V;0.035 max.
W.V.:6.3V/4V;0.05 max.
*1 For LLA185 C7 0G 274-474, the capacitance should be measured
using a voltage of 0.5+/-0.1Vrms instead of 1.0+/-0.2Vrms.
*2 For LLA185/215 C7 0G 473, the capacitance should be measured
using a voltage of 0.5+/-0.2Vrms instead of 1.0+/-0.2Vrms.
9 Capacitance The capacitance change shall be measured after 5 min. at
Temperature each specified temperature stage.
Characteristics
The ranges of capacitance change compared with the 25℃value
over the temperature ranges shown in the table shall be within
the specified ranges.
10 Adhesive Strength of No removal of the terminations or other defect Solder the capacitor to the test jig (glass epoxy board) using a
Termination should occur. eutectic solder. Then apply 5N force in parallel with the test
jig for 10±1 sec. The soldering shall be done either with an
iron or using the reflow method and shall be conducted with
care so that the soldering is uniform and free of defects such as
heat shock.
11 Vibration  Appearance No defects or abnormalities.
Solder the capacitor to the test jig (glass epoxy board) in the same
Resistance manner and under the same conditions as (10). The capacitor shall
Capacitance Within the specified tolerance. be subjected to a simple harmonic motion having a total amplitude
of 1.5mm, the frequency being varied uniformly between the approximate
D.F. W.V.:25Vmin. ;0.025 max.
limits of 10 and 55Hz. The frequency range, from 10 to 55Hz and return
W.V.:16V/10V;0.035 max.
to 10Hz, shall be traversed in approximately 1 minute.
W.V.:6.3V/4V;0.05 max.
This motion shall be applied for a period of 2 hours in each 3 mutually
perpendicular directions (total of 6 hours).
12 Solderability
75% of the terminations is to be soldered evenly
Immerse the capacitor in a solution of ethanol (JIS-K-8101) and
of Termination and continuously. rosin (JIS-K-5902) (25% rosin in weight proportion). Preheat at
80 to 120℃for 10 to 30 seconds. After preheating, immerse in
eutectic solder solution for 2±0.5 seconds at 230±5℃,or
Sn-3.0Ag-0.5Cu solder solution for 2±0.5 seconds at 245±5℃.
■SPECIFICATIONS AND TEST METHODS
Specification
Capacitance
Frequency
Voltage
*1 C≦
1±0.1kHz
1.0±0.2Vrms
Step
Temperature(C)
1
25±2
2
-55±3
3
25±2
4
125±3
5
25±2
Char.
Temp.Range
(℃)
Reference
Temp.
Cap.Change
R7
-55 to +125
25℃
Within ±15%
C7
-55 to +125
25℃
Within ±22%
JEMCAS-00670B 2

No Item Test Method
13
Temperature Appearance No marking defects. Fix the capacitor to the supporting jig in the same manner and under
Cycle the same conditions as (10). Perform the five cycles according to the
Capacitance Within ±7.5%
four heat treatments listed in the following table. Let sit for 24±2
Change hours at room temperature, then measure.
D.F.
W.V.:25Vmin. ;0.025 max.
W.V.:16V/10V;0.035 max.
W.V.:6.3V/4V;0.05 max.
I.R.
･F.
(whichever is smaller)
・Initial measurement
Dielectric No failure Perform a heat treatment at 150+0/-10°C for one hour and then let sit
Strength for 24±2 hours at room temperature.
Perform the initial measurement.
14
Humidity Appearance No marking defects. Sit the capacitor at 40±2℃and 90 to 95% humidity for 500±12
(Steady State) hours. Remove and let sit for 24±2 hours at room temperature,
Capacitance Within ±12.5% then measure.
Change
D.F. W.V.:10Vmin. ;0.05 max.
W.V.:6.3V/4V;0.075 max.
I.R.
･F.
(whichever is smaller)
15 Humidity Load Appearance No marking defects.
Apply the rated voltage at 40±2℃and 90 to 95% humidity
for 500±12 hours. Remove and let sit for 24±2 hours at room
Capacitance Within ±12.5% temperature, then measure. The charge/discharge current
Change is less than 50mA.
D.F. W.V.:10Vmin. ;0.05 max.
W.V.:6.3V/4V;0.075 max.
I.R.
･F.
(whichever is smaller)
16 High Appearance No marking defects. Apply 200% of the rated voltage for 1000±12 hours at the
Temperature
maximum operating temperature ±3℃. Let sit for 24±2 hours at
Load Capacitance Within ±12.5% room temperature, then measure.
Change The charge/discharge current is less than 50mA.
・Initial measurement
D.F. W.V.:10Vmin. ;0.05 max. Apply 200% of the rated DC voltage for one hour at the
W.V.:6.3V/4V;0.075 max.
maximum operating temperature ±3℃. Remove and let
sit for 24±2 hours at room temperature. Perform initial
I.R.
･F. measurement.
(whichever is smaller)
■SPECIFICATIONS AND TEST METHODS
Specification
Step
1
2
3
4
Temp.(℃)
Min.
Operating
Temp.＋0/-3
Room
Temp.
Max.
Operating
Temp.+3/-0
Room
Temp.
Time(min.)
30±3
2 to 3
30±3
2 to 3
JEMCAS-00670B 3

1.Tape Carrier Packaging(Packaging Code:L/K)
1.1 Minimum Quantity(pcs./reel)
1.2 Dimensions of Tape (in mm)
Package
LLA Type
4.0±0.1
4.0±0.1
2.0±0.1
0.2±0.1
1.7max.
A
B
1.75±0.1
3.5±0.05
8.0±0.3
＋０．１
－０
Code
LLA18
LLA21
LLA31
A
1.05±0.1
1.45±0.2
1.9±0.2
B
1.85±0.1
2.25±0.2
3.5±0.2
Type
f180mm reel
f330mm reel
Plastic Tape
Plastic Tape
Code : L
Code : K
LLA18
5
4000
10000
LLA21
5
4000
10000
9
3000
10000
LLA31
5
4000
10000
9/M
3000
10000
JEMCAP-01912 4

Package
LLA Type
Chip
2.0±0.5
21±0.8
180+0/-3.0 330±2.0
50 min.
13±0.5
10±1.5
16.5 max.
Hole for Chip : As specified in 1.2
Base Tape : As specified in 1.2
Top Tape : Thickness 0.06
(*LLA18 /LLA215/LLA315 type: Thickness 0.05)
Feeding Hole : As specified in 1.2
Fig 1 Package Chip
Fig.2 Dimension of Reel
Fig3 Taping Diagram
(in mm)
JEMCAP-01912 5

1.3 Tapes for capacitors are wound clockwise shown in Fig.3.
(The sprocket holes are to the right as the tape is pulled toward the user.)
1.4 Part of the leader and part of the vacant section are attached as follows. (in mm)
1.5 Accumulate pitch : 10 of sprocket holes pitch = 40±0.3mm
1.6 Chip in the tape is enclosed by top tape and bottom tape as shown in Fig.1.
1.7 The top tape and base tape are not attached at the end of the tape for a minimum of 5 pitches.
1.8 There are no jointing for top tape and bottom tape.
1.9 There are no fuzz in the cavity.
1.10 Break down force of top tape : 5N min.
1.11 Reel is made by resin and appeaser and dimension is shown in Fig 3.
There are possibly to change the material and dimension due to some impairment.
1.12 Peeling off force : 0.1N to 0.6N in the direction as shown below.
1.13 Label that show the customer parts number, our parts number, our company name, inspection
number and quantity, will be put in outside of reel.
Package
LLA Type
図
1
ﾁｯﾌﾟ詰め状態
(
単位：
mm)
Tail vacant Section
Chip-mounting Unit
Leader vacant Section
Leader Unit
(Top Tape only)
Direction
of Feed
160 min.
190 min.
210 min.
165 to 180°
Top Tape
JEMCAP-01912 6

Caution
■Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high reliability
for the prevention of defects which might directly cause damage to the third party's life, body or property.
①Aircraft equipment ②Aerospace equipment ③Undersea equipment ④Power plant control equipment
⑤Medical equipment ⑥Transportation equipment(vehicles,trains,ships,etc.) ⑦Traffic signal equipment
⑧Disaster prevention / crime prevention equipment ⑨Data-processing equipment
⑩Application of similar complexity and/or reliability requirements to the applications listed in the above.
■Storage and Operation condition
1. The performance of chip monolithic ceramic capacitors may be affected by the storage conditions.
1-1. Store the capacitors in the following conditions:
Room Temperature of +5℃to +40℃and a Relative Humidity of 20% to 70%.
(1) Sunlight, dust, rapid temperature changes, corrosive gas atmosphere, or high temperature and humidity
conditions during storage may affect solderability and packaging performance.
Therefore, please maintain the storage temperature and humidity. Use the product within six months after receipt ,
as prolonged storage may cause oxidation of the terminations (outer electrodes).
(2) Please confirm solderability before using after six months.
Store the capacitors without opening the original bag.
Even if the storage period is short, do not exceed the specified atmospheric conditions.
1-2. Corrosive gas can react with the termination (external) electrodes or lead wires of capacitors, and result
in poor solderability. Do not store the capacitors in an atmosphere consisting of corrosive gas (e.g.,hydrogen
sulfide, sulfur dioxide, chlorine, ammonia gas etc.).
1-3. Due to moisture condensation caused by rapid humidity changes, or the photochemical change caused
by direct sunlight on the terminal electrodes and/or the resin/epoxy coatings, the solderability and
electrical performance may deteriorate. Do not store capacitors under direct sunlight or in high huimidity
conditions
■Rating
1.Temperature Dependent Characteristics
1. The electrical characteristics of the capacitor can change with temperature.
1-1. For capacitors having larger temperature dependency, the capacitance may change with temperature
changes. The following actions are recommended in order to ensure suitable capacitance values.
(1) Select a suitable capacitance for the operating temperature range.
(2) The capacitance may change within the rated temperature.
When you use a high dielectric constant type capacitor in a circuit that needs a tight (narrow) capacitance
tolerance (e.g., a time-constant circuit), please carefully consider the temperature characteristics, and
carefully confirm the various characteristics in actual use conditions and the actual system.
[Example of Temperature Caracteristics X7R(R7)] [Example of Temperature Characteristics X5R(R6)]

!
-20
-10
-15
-5
5
0
10
15
20
Temperature (C)
-75 -50 -25 025 50 75 100 125 150
Capacitance Change(%)
-20
-10
-15
-5
5
0
10
15
20
Temperature (C)
-75 -50 -25 025 50 75 100
Capacitance Change(%)
JEMCAC-00640D 7

2.Measurement of Capacitance
1. Measure capacitance with the voltage and frequency specified in the product specifications.
1-1. The output voltage of the measuring equipment may decrease occasionally when capacitance is high.
Please confirm whether a prescribed measured voltage is impressed to the capacitor.
1-2. The capacitance values of high dielectric constant type capacitors change depending on the AC voltage applied.
Please consider the AC voltage characteristics when selecting a capacitor to be used in a AC circuit.
3.Applied Voltage
1. Do not apply a voltage to the capacitor that exceeds the rated voltage as called out in the specifications.
1-1. Applied voltage between the terminals of a capacitor shall be less than or equal to the rated voltage.
(1) When AC voltage is superimposed on DC voltage, the zero-to-peak voltage shall not exceed the rated DC voltage.
When AC voltage or pulse voltage is applied, the peak-to-peak voltage shall not exceed the rated DC voltage.
(2) Abnormal voltages (surge voltage, static electricity, pulse voltage, etc.) shall not exceed the rated DC voltage.
Typical Voltage Applied to the DC capacitor
DC Voltage DC Voltage+AC AC Voltage Pulse Voltage
(E：Maximum possible applied voltage.)
1-2. Influence of over voltage
Over voltage that is applied to the capacitor may result in an electrical short circuit caused by the breakdown
of the internal dielectric layers .
The time duration until breakdown depends on the applied voltage and the ambient temperature.
4.Type of Applied Voltage and Self-heating Temperature
1.Confirm the operating conditions to make sure that no large current is flowing into the capacitor due to the
continuous application of an AC voltage or pulse voltage.
When a DC rated voltage product is used in an AC voltage circuit or a pulse voltage circuit, the AC current
or pulse current will flow into the capacitor; therefore check the self-heating condition.
Please confirm the surface temperature of the capacitor so that the temperature remains within the upper limits
of the operating temperature, including the rise in temperature due to self-heating. When the capacitor is
used with a high-frequency voltage or pulse voltage, heat may be generated by dielectric loss.
<Applicable to Rated Voltage of less than 100VDC>
1-1. The load should be contained to the level
such that when measuring at atmospheric
temperature of 25°C, the product's self-heating
remains below 20°C and the surface
temperature of the capacitor in the actual circuit
remains within the maximum operating
temperature.
Caution
!
1
10
100
0123
Current (Ar.m.s.) 456
Temperature Rise (C)
[Example of Temperature Rise (Heat Generation) in Chip
Monolithic Ceramic Capacitors in Contrast to Ripple Current]
Sample: R(R1) characteristics 10 Rated voltage: DC10V
Ripple Current
100kHz
500kHz
1MHz
E
E
E
E
0
0
0
0
JEMCAC-00640D 8

5. DC Voltage and AC Voltage Characteristic
1. The capacitance value of a high dielectric constant type
capacitor changes depending on the DC voltage applied.
Please consider the DC voltage characteristics when a
capacitor is selected for use in a DC circuit.
1-1. The capacitance of ceramic capacitors may change
sharply depending on the applied voltage. (See figure)
Please confirm the following in order to secure the
capacitance.
(1) Determine whether the capacitance change caused
by the applied voltage is within the allowed range .
(2) In the DC voltage characteristics, the rate of
capacitance change becomes larger as voltage
increases, even if the applied voltage is below
the rated voltage. When a high dielectric constant
type capacitor is used in a circuit that requires a
tight (narrow) capacitance tolerance (e.g., a time
constant circuit), please carefully consider the
voltage characteristics, and confirm the various
characteristics in the actual operating conditions
of the system.
2. The capacitance values of high dielectric
constant type capacitors changes depending
on the AC voltage applied.
Please consider the AC voltage characteristics
when selecting a capacitor to be used in a
AC circuit.
6. Capacitance Aging
[Example of Change Over Time (Aging characteristics) ]
1. The high dielectric constant type capacitors
have an Aging characteristic in which the capacitance
value decreases with the passage of time.
When you use a high dielectric constant type
capacitors in a circuit that needs a tight (narrow)
capacitance tolerance (e.g., a time-constant circuit),
please carefully consider the characteristics
of these capacitors, such as their aging, voltage,
and temperature characteristics. In addition,
check capacitors using your actual appliances
at the intended environment and operating conditions.
7.Vibration and Shock
1. Please confirm the kind of vibration and/or shock, its condition, and any generation of resonance.
Please mount the capacitor so as not to generate resonance, and do not allow any impact on the terminals.
2. Mechanical shock due to being dropped may cause damage or
a crack in the dielectric material of the capacitor.
Do not use a dropped capacitor because the quality and reliability
may be deteriorated.
3. When printed circuit boards are piled up or handled, the corner
of another printed circuit board
should not be allowed to hit the capacitor in order to avoid
a crack or other damage to the capacitor.
Caution
-100
-80
-60
-40
-20
0
20
010 20 30
DC Voltage (V) 40 50
[Example of DC Voltage Characteristics]
Sample: X7R(R7) Characteristics 
Capacitance Change (%)
00.5 1
AC Voltage (Vr.m.s.) 1.5 2
[Example of AC Voltage Characteristics]
Sample: X7R(R7) Characteristics 
Capacitance Change (%)
30
20
10
0
-10
-20
-30
-40
-50
-60
Floor
Crack
Mounting printed circuit board
Crack
!
20
10
0
-10
-20
-30
-40
10
100
1000
10000
Time(h)
Capacitance Change(%)
C0G(5C)
X7R(R7)
X5R(R6)
JEMCAC-00640D 9

■Soldering and Mounting
1.Mounting Position
1. Confirm the best mounting position and direction that minimizes the stress imposed on the capacitor during flexing
or bending the printed circuit board.
1-1.Choose a mounting position that minimizes the stress imposed on the chip during flexing or bending of the board.
[Component Direction]
Locate chip horizontal to the
direction in which stress acts.
(Bad Example) (Good Example)
[Chip Mounting Close to Board Separation Point]
It is effective to implement the following measures, to reduce stress in separating the board.
It is best to implement all of the following three measures; however, implement as many measures as possible
to reduce stress.
Stress Level
(1) Turn the mounting direction of the component parallel to the board separation surface.
A > D *1
(2) Add slits in the board separation part.
A > B
(3) Keep the mounting position of the component away from the board separation surface.
A > C
*1 A > D is valid when stress is added vertically to the perforation as with Hand Separation.
If a Cutting Disc is used, stress will be diagonal to the PCB, therefore A > D is invalid.
[Mounting Capacitors Near Screw Holes]
When a capacitor is mounted near a screw hole, it may be affected by the board deflection that occurs during
the tightening of the screw. Mount the capacitor in a position as far away from the screw holes as possible.
2.Information before Mounting
1. Do not re-use capacitors that were removed from the equipment.
2. Confirm capacitance characteristics under actual applied voltage.
3. Confirm the mechanical stress under actual process and equipment use.
4. Confirm the rated capacitance, rated voltage and other electrical characteristics before assembly.
5. Prior to use, confirm the solderability of capacitors that were in long-term storage.
6. Prior to measuring capacitance, carry out a heat treatment for capacitors that were in long-term storage.
7.The use of Sn-Zn based solder will deteriorate the reliability of the MLCC.
Please contact our sales representative or product engineers on the use of Sn-Zn based solder in advance.
Caution
Contents of Measures
Screw Hole Recommended
!
①
②
③
1C
1B
1A
Perforation
Slit
A
B
C
D
①
1A
JEMCAC-00640D 10

3.Maintenance of the Mounting (pick and place) Machine
1. Make sure that the following excessive forces are not applied to the capacitors.
1-1. In mounting the capacitors on the printed circuit board, any bending force against them shall be kept
to a minimum to prevent them from any damage or cracking. Please take into account the following precautions
and recommendations for use in your process.
(1) Adjust the lowest position of the pickup nozzle so as not to bend the printed circuit board.
(2) Adjust the nozzle pressure within a static load of 1N to 3N during mounting.
[Incorrect]
[Correct]
2.Dirt particles and dust accumulated between the suction nozzle and the cylinder inner wall prevent
the nozzle from moving smoothly. This imposes greater force upon the chip during mounting,
causing cracked chips. Also, the locating claw, when worn out, imposes uneven forces on the chip
when positioning, causing cracked chips. The suction nozzle and the locating claw must be maintained,
checked and replaced periodically.
Caution
!
Board Guide
Board
Suction Nozzle
Deflection
Support Pin
JEMCAC-00640D 11

4-1.Reflow Soldering
1. When sudden heat is applied to the components, the [Standard Conditions for Reflow Soldering]
mechanical strength of the components will decrease
because a sudden temperature change causes
deformation inside the components. In order to prevent
mechanical damage to the components, preheating is
required for both the components and the PCB.
Preheating conditions are shown in table 1. It is required to
keep the temperature differential between the solder and

2. Solderability of tin plating termination chips might be
deteriorated when a low temperature soldering profile where
the peak solder temperature is below the melting point of
tin is used. Please confirm the solderability of tin plated
termination chips before use.
3. When components are immersed in solvent after mounting,

between the component and the solvent within the range [Allowable Reflow Soldering Temperature and Time]
shown in the table 1.
Table 1
Series
LLA
In the case of repeated soldering, the accumulated
Recommended Conditions
soldering time must be within the range shown above.
Lead Free Solder: Sn-3.0Ag-0.5Cu
4. Optimum Solder Amount for Reflow Soldering
4-1. Overly thick application of solder paste results in a excessive solder fillet height.
This makes the chip more susceptible to mechanical and thermal stress on the board and may cause the chips to crack.
4-2. Too little solder paste results in a lack of adhesive strength on the termination, which may result in chips breaking loose
from the PCB.
4-3. Please confirm that solder has been applied smoothly to the termination.
Make sure not to impose any abnormal mechanical shocks to the PCB.
4-2.Flow Soldering
1. This product is not apply flow soldering.
Caution
Lead Free Solder
Peak Temperature
Air or N2
Atmosphere
18/21/31
Inverting the PCB
240 to 260℃
Chip Dimension(L/W) Code
≦130℃
Temperature Differential
!
Temperature(℃)
Peak Temperature
Soldering
Gradual
Cooling
Preheating
ΔT
60-120 seconds
30-60seconds
Time
190℃
170℃
150℃
220℃
SolderingTemperature(℃)
SolderingTime(s)
280
270
260
250
240
230
220
0
30
60
120
90
JEMCAC-00640D 12

5.Washing
Excessive ultrasonic oscillation during cleaning can cause the PCBs to resonate, resulting in cracked chips
or broken solder joints. Take note not to vibrate PCBs.
6.Electrical Test on Printed Circuit Board
1. Confirm position of the support pin or specific jig, when inspecting the electrical performance of a
capacitor after mounting on the printed circuit board.
1-1. Avoid bending the printed circuit board by the pressure of a test-probe, etc.
The thrusting force of the test probe can flex the PCB, resulting in cracked chips or open solder
joints. Provide support pins on the back side of the PCB to prevent warping or flexing.
Install support pins as close to the test-probe as possible.
1-2. Avoid vibration of the board by shock when a test -probe contacts a printed circuit board.
[Not Recommended] [Recommended]
7.Printed Circuit Board Cropping
1. After mounting a capacitor on a printed circuit board, do not apply any stress to the capacitor that
caused bending or twisting the board.
1-1. In cropping the board, the stress as shown may cause the capacitor to crack.
Cracked capacitors may cause deterioration of the insulation resistance, and result in a short.
Avoid this type of stress to a capacitor.
[Bending] [Twisting]
2. Check the cropping method for the printed circuit board in advance.
2-1. Printed circuit board cropping shall be carried out by using a jig or an apparatus (Disc separator, router
type separator, etc.) to prevent the mechanical stress that can occur to the board.
* When a board separation jig or disc separator is used, if the following precautions are not observed,
a large board deflection stress will occur and the capacitors may crack.
Use router type separator if at all possible.
Caution
High
Medium
Medium
Notes
Hand and nipper
separation apply a high
level of stress.
Use another method.
· Board handling
· Board bending direction
· Layout of capacitors
· Board handling
· Layout of slits
· Design of V groove
· Arrangement of blades
· Controlling blade life
Board handling
Recommended
Low
Level of stress on board
×
△*
△*
◯
Board Separation Method
Hand Separation
Nipper Separation
(1) Board Separation Jig
Board Separation Apparatus
2) Disc Separator
3) Router Type Separator
!
Peeling
Test-probe
Support Pin
Test-probe
①
1A
JEMCAC-00640D 13

(1) Example of a suitable jig
[In the case of Single-side Mounting]
An outline of the board separation jig is shown as follows.
Recommended example: Stress on the component mounting position can be minimized by holding the
portion close to the jig, and bend in the direction towards the side where the capacitors are mounted.
Not recommended example: The risk of cracks occurring in the capacitors increases due to large stress
being applied to the component mounting position, if the portion away from the jig is held and bent in the
direction opposite the side where the capacitors are mounted.
[Outline of jig] [Hand Separation]
[In the case of Double-sided Mounting]
Since components are mounted on both sides of the board, the risk of cracks occurring can not be avoided with the
above method. Therefore, implement the following measures to prevent stress from being applied to the components.
(Measures)
(1) Consider introducing a router type separator.
If it is difficult to introduce a router type separator, implement the following measures.
(Refer to item 1. Mounting Position)
(2) Mount the components parallel to the board separation surface.
(3) When mounting components near the board separation point, add slits in the separation position
near the component.
(4) Keep the mounting position of the components away from the board separation point.
(2) Example of a Disc Separator
An outline of a disc separator is shown as follows. As shown in the Principle of Operation, the top
blade and bottom blade are aligned with the V-grooves on the printed circuit board to separate the board.
In the following case, board deflection stress will be applied and cause cracks in the capacitors.
(1) When the adjustment of the top and bottom blades are misaligned, such as deviating in the top-bottom,
left-right or front-rear directions
(2) The angle of the V groove is too low, depth of the V groove is too shallow, or the V groove is misaligned
top-bottom
IF V groove is too deep, it is possible to brake when you handle and carry it. Carefully design depth of the
V groove with consideration about strength of material of the printed circuit board.
[ Outline of Machine ] [ Principle of Operation ] [ Cross-section Diagram ]
[Disc Separator]
Top Blade Top Blade Top Blade Top Blade
Bottom Blade Bottom Blade Bottom Blade Bottom Blade
[V-groove Design]
Not recommended
Recommended
Top-bottom Misalignment
Left-right Misalignment
Front-rear Misalignment
Caution
Recommended
Not recommended
Depth too Shallow
Depth too Deep
Example of
Recommended
V-groove Design
Not Recommended
Left-right Misalignment
Low-Angle
Printed Circuit Board
Top Blade
V-groove Bottom Blade
Top Blade Printed Circuit Board
V-groove
!
Board Cropping Jig
V-groove
Printed Circuit Board
Printed circuit
board
Components
Load point
Direction of
load
Printed circuit
board
Component
s
Load point
Direction of load
JEMCAC-00640D 14

(3) Example of Router Type Separator
The router type separator performs cutting by a router
rotating at a high speed. Since the board does not
bend in the cutting process, stress on the board can
be suppressed during board separation.
When attaching or removing boards to/from the router type
separator, carefully handle the boards to prevent bending.
8. Assembly
1. Handling
If a board mounted with capacitors is held with one hand, the board may bend.
Firmly hold the edges of the board with both hands when handling.
If a board mounted with capacitors is dropped, cracks may occur in the capacitors.
Do not use dropped boards, as there is a possibility that the quality of the capacitors may be impaired.
2. Attachment of Other Components
2-1. Mounting of Other Components
Pay attention to the following items, when mounting other components on the back side of the board after
capacitors have been mounted on the opposite side.
When the bottom dead point of the suction nozzle is set too low, board deflection stress may be applied
to the capacitors on the back side (bottom side), and cracks may occur in the capacitors.
· After the board is straightened, set the bottom dead point of the nozzle on the upper surface of the board.
· Periodically check and adjust the bottom dead point.
2-2. Inserting Components with Leads into Boards
When inserting components (transformers, IC, etc.) into boards, bending the board may cause cracks in the
capacitors or cracks in the solder. Pay attention to the following.
· Increase the size of the holes to insert the leads, to reduce the stress on the board during insertion.
· Fix the board with support pins or a dedicated jig before insertion.
· Support below the board so that the board does not bend. When using multiple support pins on the board,
periodically confirm that there is no difference in the height of each support pin.
2-3. Attaching/Removing Sockets
When the board itself is a connector, the board may bend when a socket is attached or removed.
Plan the work so that the board does not bend when a socket is attached or removed.
2-4. Tightening Screws
The board may be bent, when tightening screws, etc. during the attachment of the board to a shield or
chassis. Pay attention to the following items before performing the work.
· Plan the work to prevent the board from bending.
· Use a torque screwdriver, to prevent over-tightening of the screws.
· The board may bend after mounting by reflow soldering, etc. Please note, as stress may be applied
to the chips by forcibly flattening the board when tightening the screws.
Caution
!
Suction Nozzle
Component with Leads
Socket
Screwdriver
[ Outline Drawing ] Router
JEMCAC-00640D 15

■Others
1. Under Operation of Equipment
1-1. Do not touch a capacitor directly with bare hands during operation in order to avoid the danger of an electric shock.
1-2. Do not allow the terminals of a capacitor to come in contact with any conductive objects (short-circuit).
Do not expose a capacitor to a conductive liquid, inducing any acid or alkali solutions.
1-3. Confirm the environment in which the equipment will operate is under the specified conditions.
Do not use the equipment under the following environments.
(1) Being spattered with water or oil.
(2) Being exposed to direct sunlight.
(3) Being exposed to ozone, ultraviolet rays, or radiation.
(4) Being exposed to toxic gas (e.g., hydrogen sulfide, sulfur dioxide, chlorine, ammonia gas etc.)
(5) Any vibrations or mechanical shocks exceeding the specified limits.
(6) Moisture condensing environments.
1-4. Use damp proof countermeasures if using under any conditions that can cause condensation.
2. Others
2-1. In an Emergency
(1) If the equipment should generate smoke, fire, or smell, immediately turn off or unplug the equipment.
If the equipment is not turned off or unplugged, the hazards may be worsened by supplying continuous power.
(2) In this type of situation, do not allow face and hands to come in contact with the capacitor or burns may be caused
by the capacitor's high temperature.
2-2. Disposal of waste
When capacitors are disposed of, they must be burned or buried by an industrial waste vendor with the appropriate
licenses.
2-3. Circuit Design
(1) Addition of Fail Safe Function
Capacitors that are cracked by dropping or bending of the board may cause deterioration of the
insulation resistance, and result in a short. If the circuit being used may cause an electrical shock,
smoke or fire when a capacitor is shorted, be sure to install fail-safe functions, such as a fuse,
to prevent secondary accidents.
(2) This series are not safety standard certified products.
2-4. Remarks
Failure to follow the cautions may result, worst case, in a short circuit and smoking when the product is used.
The above notices are for standard applications and conditions. Contact us when the products are used in special
mounting conditions.
Select optimum conditions for operation as they determine the reliability of the product after assembly.
The data herein are given in typical values, not guaranteed ratings.
Caution
!
JEMCAC-00640D 16

■Rating
1.Operating Temperature
1. The operating temperature limit depends on the capacitor.
1-1. Do not apply temperatures exceeding the maximum operating temperature.
It is necessary to select a capacitor with a suitable rated temperature that will cover the operating temperature range.
It is also necessary to consider the temperature distribution in equipment and the seasonal temperature variable
factor.
1-2. Consider the self-heating factor of the capacitor
The surface temperature of the capacitor shall not exceed the maximum operating temperature including self-heating.
2.Atmosphere Surroundings (gaseous and liquid)
1. Restriction on the operating environment of capacitors.
1-1. Capacitors, when used in the above, unsuitable, operating environments may deteriorate due to the corrosion
of the terminations and the penetration of moisture into the capacitor.
1-2. The same phenomenon as the above may occur when the electrodes or terminals of the capacitor are subject
to moisture condensation.
1-3. The deterioration of characteristics and insulation resistance due to the oxidization or corrosion of terminal
electrodes may result in breakdown when the capacitor is exposed to corrosive or volatile gases or solvents
for long periods of time.
3.Piezo-electric Phenomenon
1. When using high dielectric constant type capacitors in AC or pulse circuits, the capacitor itself vibrates
at specific frequencies and noise may be generated.
Moreover, when the mechanical vibration or shock is added to capacitor, noise may occur.
Notice
JEMCAC-00640D 17

■Soldering and Mounting
1.PCB Design
1. Notice for Pattern Forms
1-1. Unlike leaded components, chip components are susceptible to flexing stresses since they are mounted
directly on the substrate.
They are also more sensitive to mechanical and thermal stresses than leaded components.
Excess solder fillet height can multiply these stresses and cause chip cracking.
When designing substrates, take land patterns and dimensions into consideration to eliminate the possibility
of excess solder fillet height.
1-2. There is a possibility of chip cracking caused by PCB expansion/contraction with heat, because stress  
on a chip is different depending on PCB material and structure.When the thermal expansion coefficient
greatly differs between the board used for mounting and the chip,it will cause cracking of the chip due to
the thermal expansion and contraction. When capacitors are mounted on a fluorine resin printed circuit
board or on a single-layered glass epoxy board, it may also cause cracking of the chip for the same reason.
Pattern Forms
in section in section
in section in section
in section in section
Notice
Placing of Leaded
Components
after Chip Component
Lateral Mounting
Prohibited
Correct
Placing Close to Chassis
Placing of Chip
Components
and Leaded
Components
Chassis
Solder (ground)
Electrode Pattern
Solder Resist
Lead Wire
Solder Resist
Lead Wire
Soldering Iron
Solder Resist
ｿﾙﾀﾞﾚｼﾞｽﾄ
Solder Resist
JEMCAC-00640D 18

2. Land Dimensions
2-1. Chip capacitors can be cracked due to the stress
of PCB bending , etc. if the land area is larger than
needed and has an excess amount of solder.
Please refer to the land dimensions in table 1
for reflow soldering.
Please confirm the suitable land dimension by
evaluating of the actual SET / PCB.
Table 1 Reflow Soldering Method
(in mm)
3. Board Design
When designing the board, keep in mind that the amount of strain which occurs will increase depending on the size
and material of the board.
Notice
b
0.5 to 0.7
LLA
21
LLA
18
0.35 to 0.6
Chip(L×W)
Chip Dimension
(L/W) Code
a
0.4
1.6×0.8
0.25 to 0.35
0.3 to 0.4
LLA
31
3.2×1.6
0.7 to 0.9
0.4 to 0.7
2.0×1.25
0.8
Series
p
0.5
c
0.15 to 0.25
0.2 to 0.3
0.3 to 0.4
SolderResist
pc
ab
ChipCapacitor
Land
Relationship with amount of strain to the board thickness, length, width, etc.]

3PL
2Ewh2
Relationshipbetweenloadandstrain
When the load is constant, the following relationship can be established.
· As the distance between the supporting points (L) increases,the amount of strain also increases.
uce the distance between the supporting points.
· As the elastic modulus (E) decreases, the amount of strain increases.

·As the board width (w) decreases, the amount of strain increases.

·As the board thickness (h) decreases, the amount of strain increases.

Since the board thickness is squared, the effect on the amount of strain becomes even greater.
：Strain on center of board (st)
L：Distance between supporting points (mm)
w：Board width (mm)
h：Board thickness (mm)
E：Elastic modulus of board (N/m2=Pa)
Y：Deflection (mm)
P：Load (N)
Y
P
h
w
L
JEMCAC-00640D 19

2.Reflow soldering
The halogen system substance and organic acid are included in solder paste, and a chip corrodes
by this kind of solder paste.
Do not use strong acid flux.
Do not use water-soluble flux.*
(*Water-soluble flux can be defined as non-rosin type flux including wash-type flux and non-wash-type flux.)
3.Washing
1. Please evaluate the capacitor using actual cleaning equipment and conditions to confirm the quality,
and select the solvent for cleaning.
2. Unsuitable cleaning solvent may leave residual flux or other foreign substances, causing deterioration of
electrical characteristics and the reliability of the capacitors.
3. Select the proper cleaning conditions.
3-1. Improper cleaning conditions (excessive or insufficient) may result in the deterioration of the performance
of the capacitors.
4.Coating
1. A crack may be caused in the capacitor due to the stress of the thermal contraction of the resin during curing process.
The stress is affected by the amount of resin and curing contraction. Select a resin with low curing contraction.
The difference in the thermal expansion coefficient between a coating resin or a molding resin and the capacitor
may cause the destruction and deterioration of the capacitor such as a crack or peeling, and lead to the deterioration
of insulation resistance or dielectric breakdown.
Select a resin for which the thermal expansion coefficient is as close to that of the capacitor as possible.
A silicone resin can be used as an under-coating to buffer against the stress.
2. Select a resin that is less hygroscopic.
Using hygroscopic resins under high humidity conditions may cause the deterioration of the insulation resistance
of a capacitor. An epoxy resin can be used as a less hygroscopic resin.
3．The halogen system substance and organic acid are included in coating material, and a chip corrodes
by the kind of Coating material. Do not use strong acid type.
Notice
JEMCAC-00640D 20