Murata ZRB15XR61A106ME01 Series User manual

ZRB15XR61A106ME01_ (0402, X5R:EIA, 10uF, DC10V)
_: packaging code Reference Sheet
1.Scope
2.MURATA Part NO. System
(Ex.)
3. Type & Dimensions
(Unit:mm)
4.Rated value
5.Package
Product specifications in this catalog are as of Mar.28,2019,and are subject to change or obsolescence without notice.
Please consult the approval sheet before ordering.
Please read rating and !Cautions first.
This product specification is applied to Chip Multilayer Ceramic Capacitors on Interposer Board used for General Electronic equipment.
This product is applied for Only Reflow Soldering.
(2) T
0.65±0.2
-55 to 85 °C
-15 to 15 %
-55 to 85 °C
(25 °C)
(6)
Capacitance
Tolerance
10 uF
Specifications and Test
Methods
(Operating
Temp. Range)
±20 %
(3) Temperature Characteristics
(Public STD Code):X5R(EIA)
g
0.1 to 0.4
(5) Nominal
Capacitance
DC 10 V
Temp. Range
(Ref.Temp.)
(8) Packaging
Temp. coeff
or Cap. Change
D
f180mm Reel
PAPER W8P2
8000 pcs./Reel
J
f330mm Reel
PAPER W8P2
30000 pcs./Reel
Only Reflow Soldering
0.3 min.
(1)-1 L
1.0±0.22
(1)-2 W
0.5±0.2
e
Chip Multilayer Ceramic Capacitors on Interposer Board for General Purpose
mark
(4)
Rated
Voltage
Packaging Unit
(1)L/W
Dimensions (2)T
Dimensions (3)Temperature
Characteristics (4)Rated
Voltage (5)Nominal
Capacitance (6)Capacitance
Tolerance (8)Packaging Code

Code
ZRB 15 XR6 1A 106 M E01 D
ZRB15XR61A106ME01-01 1
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■Specifications and Test Methods (Only for mobile devices)
No
1 Rated Voltage Shown in Rated value. The rated voltage is defined as the maximum voltage which may be
applied continuously to the capacitor.
When AC voltage is superimposed on DC voltage, VP-P or VO-P,
whichever is larger, should be maintained within the rated voltage
range.
2 Appearance No defects or abnormalities. Visual inspection.
3 Dimension Within the specified dimensions. Using Measuring instrument of dimension.
4 Voltage proof No defects or abnormalities.
Measurement Point :
Between the terminations
Test Voltage :
250% of the rated voltage
Applied Time :
1 to 5 s
Charge/discharge current :
50mA max.
To apply the test voltage through the Interposer board termination.
5 Insulation Resistance(I.R.)
∙F (Whichever is smaller) Measurement Point : Between the terminations
Measurement Voltage :
DC Rated Voltage
Charging Time :
1 min
Charge/discharge current :
50mA max.
Measurement Temperature:
Room Temperature
To apply the test voltage through the Interposer board termination.
6 Capacitance Shown in Rated value.
Measurement Temperature:
Room Temperature
7 Dissipation Factor (D.F.) 0.1 max.
To apply the test voltage through the Interposer board termination.
8
Temperature No bias R6 : Within +/-15% (-55°C to +85°C) The capacitance change should be measured after 5 min.
Characteristics
R7 : Within +/-15% (-55°C to +125°C) at each specified temp. stage.
of Capacitance C8 : Within +/-22% (-55°C to +105°C) Capacitance value as a reference is the value in step 3.
D7 : Within +22/-33% (-55°C to +125°C) · Measurement Voltage : Less than 1.0Vrms
(Refer to the individual data sheet)
To apply the test voltage through the Interposer board termination.
･Initial measurement
Perform a heat treatment at 150+0/-10°C for 1h and then
let sit for 24+/-2h at room temperature,then measure.
9 Adhesive Strength No removal of the terminations or other defect Solder the capacitor on the test substrate shown in Fig.3.
of Termination should occur.
Applied Force : 5N
Holding Time : 10+/-1s
Applied Direction : In parallel with the test substrate and vertical with the
capacitor side.
10 Vibration  Appearance No defects or abnormalities. Solder the capacitor on the test substrate shown in Fig.3.
Capacitance Within the specified initial value.
Kind of Vibration :
A simple harmonic motion
10Hz to 55Hz to 10Hz (1min)
Total amplitude :
1.5mm
D.F. Within the specified initial value. This motion should be applied for a period of 2h in each 3 mutually
perpendicular directions(total of 6h).
Item
Specification
Test Method
(Ref. Standard:JIS C 5101, IEC60384）
Capacitance
Frequency
Voltage
C≦
(10V min.)
1.0+/-0.1kHz
1.0+/-0.2Vrms
C≦
(6.3V max.)
1.0+/-0.1kHz
0.5+/-0.1Vrms
C＞
120+/-24Hz
0.5+/-0.1Vrms
Step
Temperature(C)
Applying Voltage(VDC)
1
Reference Temp.+/-2
No bias
2
Min.Operating Temp. +/-3
3
Reference Temp. +/-2
4
Max.Operating Temp. +/-3
5
Reference Temp. +/-2
JEMCGS-05971 2
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No
11 Substrate Appearance No defects or abnormalities. Solder the capacitor on the test substrate shown in Fig.1.
Bending test Pressurization method : Shown in Fig.2
Flexure : 1mm
Capacitance Within +/-10%
Holding Time :
5+/-1s
Change
Soldering Method :
Reflow soldering
12 Solderability of 95% of the terminations is to be soldered evenly and
Test Method :
Solder bath method
Interposer board termination continuously.
Flux :
Solution of rosin ethanol 25(mass)%
Preheat :
80℃to 120℃for 10s to 30s
Solder : Sn-3.0Ag-0.5Cu
Solder Temp. :
245+/-5℃
Immersion time
:
2+/-0.5s
13
Resistance Appearance No defects or abnormalities.
Test Conditions :
Reflow method
to Solder : Sn-3.0Ag-0.5Cu
Soldering Capacitance Within +/-7.5% Solder Temp. : 255+/-10℃[Peak Temperature]
Heat
Change Heat Time of over 200°C : 120s max.
Exposure Time : 24+/-2h
D.F. Within the specified initial value. Preheat :
150℃to 160℃for 2 min
I.R. Within the specified initial value. · Initial measurement
Perform a heat treatment at 150+0/-10°C for 1h and then
Voltage proof No defects. let sit for 24+/-2h at room temperature,then measure.
14
Temperature Appearance No defects or abnormalities. Solder the capacitor on the test substrate shown in Fig.3.
Sudden Change Perform the five cycles according to the four heat treatments
shown in the following table.
Capacitance Within +/-7.5%
Change
D.F. Within the specified initial value.
I.R. Within the specified initial value. Exposure Time : 24+/-2h
Voltage proof No defects. · Initial measurement
Perform a heat treatment at 150+0/-10°C for 1h and then
let sit for 24+/-2h at room temperature,then measure.
15 High Appearance No defects or abnormalities. Solder the capacitor on the test substrate shown in Fig.3.
Temperature
Test Temperature :
40+/-2℃
High
Test Humidity :
90%RH to 95%RH
Humidity Capacitance Within +/-12.5%
Test Time :
500+/-12h
(Steady) Change
Test Voltage :
DC Rated Voltage
Charge/discharge current : 50mA max.
D.F. 0.2 max. · Initial measurement
Perform a heat treatment at 150+0/-10°C for 1h and then
I.R.  let sit for 24+/-2h at room temperature,then measure.
· Measurement after test
Perform a heat treatment at 150+0/-10°C for 1h and then
let sit for 24+/-2h at room temperature,then measure.
16 Durability Appearance No defects or abnormalities. Solder the capacitor on the test substrate shown in Fig.3.
Test Temperature :
Max. Operating Temp. +/-3℃
Capacitance Within +/-12.5%
Test Time :
1000+/-12h
Change
Test Voltage :
100% of the rated voltage
Charge/discharge current : 50mA max.
D.F. 0.2 max. · Initial measurement
Perform a heat treatment at 150+0/-10°C for 1h and then
let sit for 24+/-2h at room temperature,then measure.
· Measurement after test
I.R.  Perform a heat treatment at 150+0/-10°C for 1h and then
let sit for 24+/-2h at room temperature,then measure.
Item
Specification
Test Method
(Ref. Standard:JIS C 5101, IEC60384）
Step
Temp.(C)
Time
(min)
1
Min.Operating Temp.+0/-3
30+/-3
2
Room Temp
2 to 3
3
Max.Operating Temp.+3/-0
30+/-3
4
Room Temp
2 to 3
JEMCGS-05971 3
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Derating conditions on Voltage and Temperature (for Rated Voltage 100Vdc max.)
Useful Lifetime for mobile application specific MLCC
These MLCCproducts are designed for use in devices with a typical lifetime of less than 5 years.
(Examples: Cellular phone, Smartphone, Tablet PC, Digital camera, Watch, Electronics dictionary,
Small-scale server, IPC-9592B class1 equipment, etc.)
These MLCC products are designed so that the useful lifetime can be extended longer than 5 years
under the following conditions:
「80% of the rated voltage or less, Maximumoperating temperature -20 degree Cor less」
Extended useful lifetime, under specific operating conditions, can be estimated from
the chart on the left.
※The useful lifetime is the time when cumulative failure rate becomes 1%.
※Please note that the useful lifetime data is for reference only and not guaranteed.
0.1
1
10
100
40 50 60 70 80 90 100 110 120 130
Useful Lifetime [Year]
Product Temperture [℃]
at rated voltage x 80%
85℃Type 105℃Type
Derated products*1 are suitable for use in circuits w here continuous
applied voltage and temperature to the capacitor is derated (below
rated voltage and temperature).
A reliability assurance level equivalent to standard products*2 can be
secured by restricting the voltage and temperature according to the
derating conditions in the chart.
*1 Derated Products: The test voltage of these products is less than
150% of the rated voltage in the Durability / OperationalLife Test.
*2 Standard Products: The test voltage of these products is 150% of
the rated voltage and over in the Durability / OperationalLife Test.
JEMCGS-05971 4
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Test method : Substrate Bending test
・Test substrate
Material : Copper-clad laminated sheets for PCBs
(Glass fabric base, epoxy resin)
Thickness : 1.6mm (ZRB15: t:0.8mm)
Copper foil thickness : 0.035mm
: Solder resist
(Coat with heat resistant resin for solder)
Fig.1 (in mm)
・Kind of Solder : Sn-3.0Ag-0.5Cu
・Pressurization method
Fig.2 (in mm)
Adhesive Strength of Termination, Vibration, Temperature Sudden Change, Resistance to Soldering Heat (Reflow method)
High Temperature High Humidity(Steady) , Durability
・Test substrate
Material : Copper-clad laminated sheets for PCBs
(Glass fabric base, epoxy resin)
Thickness : 1.6mm or 0.8mm
Copper foil thickness : 0.035mm
・Kind of Solder : Sn-3.0Ag-0.5Cu
・Land Dimensions
Fig.3
c
b
a
Solder Resist
Chip Capacitor
Land
＊2
4.0±0.1
8.0±0.3
3.5±0.05
0.05以下
＊1
φ1.5
+0.1
-0
Ａ
t
*1,2：2.0±0.05
1.75±0.1
Ｂ
100
40
a
c
b
Land
f4.5
c
45
45
Flexure
Capacitance meter
Pressurization
speed
1.0mm/s
Support
Capacitor
Pressurize
45
45
R5
20
50 min.
Type
Dimension (mm)
a
b
c
ZRB15
0.4
1.5
0.5
ZRB18
1.0
3.0
1.2
Type
Dimension (mm)
a
b
c
ZRB15
0.4
1.5
0.5
ZRB18
1.0
3.0
1.2
JEMCGS-05971 5
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1.Tape Carrier Packaging(Packaging Code:D/L/J/K)
1.1 Minimum Quantity(pcs./reel)
1.2 Dimensions of Tape
(1)ZRB15 (in:mm)
7
*3 Nominal value
1.0+0.22/-0.2
0.7±0.15
1.0±0.2
0.5±0.2
1.0±0.22
0.65±0.2
1.3
0.95
ZRB15
X
1.0±0.15
0.5±0.15
0.65±0.15
0.8
L
W
T
A *3
B *3
t *3
Type
Product Dimensions
10000
ZRB18
A
3000
8000
6
4000
ZRB15
X/7
8000
30000
Code:D
Code:L
Code:J
Code:K
Package
ZRB Type
Type


Paper Tape
Plastic Tape
Paper Tape
Plastic Tape
*1,2：2.0±0.05
＊2
4.0±0.1
8.0±0.3
3.5±0.05
0.05以下
＊1
φ1.5
+0.1
-0
Ａ
t
*1,2：2.0±0.05
1.75±0.1
Ｂ
4.0±0.1
*1
φ1.5
+0.1
-0
1.75±0.1
8.0±0.3
3.5±0.05
Ａ
Ｂ
t
*2
0.05 max.
JEMCGP-02345F 6
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(2)ZRB18 (in:mm)
L W T
6 1.6±0.22 0.6±0.2
A 1.6±0.2 1.0±0.2
*1 Nominal value
Type
Product Dimensions
A *1
B *1
t
ZRB18
0.8±0.2
1.1
2.0
1.7 max.
Package
ZRB Type
8.0±0.3
4.0±0.1
3.5±0.05
1.75±0.1
Ａ
Ｂ
t
2.0±0.1
φ1.5
+0.1
-0
4.0±0.1
0.25±0.1
JEMCGP-02345F 7
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Package
ZRB Type
図
1
ﾁｯﾌﾟ詰め状態
(
単位：
mm)

ｗ1
W
W
w1
ZRB15/18
16.5 max.
10±1.5
180+0/-3.0
330±2.0
 min.

2.0±0.5
(in:mm)
Fig.1 Package Chips
Fig.2 Dimensions of Reel
Fig.3 Taping Diagram
Top Tape : Thickness 0.06
Feeding Hole :As specified in 1.2.
Hole for Chip : As specified in 1.2.
Chip
JEMCGP-02345F 8
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1.3 Tapes for capacitors are wound clockwise shown in Fig.3.
(The sprocket holes are to the right as the tape is pulled toward the user.)
1.4 Part of the leader and part of the vacant section are attached as follows.
(in:mm)
1.5 Accumulate pitch : 10 of sprocket holes pitch = 40±0.3mm
1.6 Chip in the tape is enclosed by top tape and bottom tape as shown in Fig.1.
1.7 The top tape and base tape are not attached at the end of the tape for a minimum of 5 pitches.
1.8 There are no jointing for top tape and bottom tape.
1.9 There are no fuzz in the cavity.
1.10 Break down force of top tape : 5N min.
Break down force of bottom tape : 5N min. (Only a bottom tape existence )
1.11 Reel is made by resin and appeaser and dimension is shown in Fig 2.
There are possibly to change the material and dimension due to some impairment.
1.12 Peeling off force : 0.1 to 0.6N in the direction as shown below.
1.13 Label that show the customer parts number, our parts number, our company name, inspection
number and quantity, will be put in outside of reel.
Package
ZRBType
図
1
ﾁｯﾌﾟ詰め状態
(
単位：
mm)
Tail vacant Section
Chip-mounting Unit
Leader vacant Section
Leader Unit
(Top Tape only)
Direction
of Feed
160 min.
190 min.
210 min.
図
1
ﾁｯﾌﾟ詰め状態
(
単位：
mm)
165～180°
Top tape
JEMCGP-02345F 9
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Caution
■Limitation of Applications
Please contact us before using our products for the applications listed below which require especially high reliability
for the prevention of defects which might directly cause damage to the third party's life, body or property.
①Aircraft equipment ②Aerospace equipment ③Undersea equipment ④Power plant control equipment
⑤Medical equipment ⑥Transportation equipment(vehicles,trains,ships,etc.) ⑦Traffic signal equipment
⑧Disaster prevention / crime prevention equipment ⑨Data-processing equipment
⑩Application of similar complexity and/or reliability requirements to the applications listed in the above.
■Storage and Operation condition
1. The performance of chip MLCC on Interposer (ZR□series, henceforth just "capacitors") may be affected by the
storage conditions. Please use them promptly after delivery.
1-1. Maintain appropriate storage for the capacitors using the following conditions:
Room Temperature of +5℃to +40℃and a Relative Humidity of 20% to 70%.
High temperature and humidity conditions and/or prolonged storage may cause deterioration of the packaging
materials. If more than six months have elapsed since delivery, check packaging, mounting, etc. before use.
In addition, this may cause oxidation of the electrodes. If more than one year has elapsed since delivery,
also check the solderability before use.
1-2. Corrosive gas can react with the termination (external) electrodes or lead wires of capacitors, and result
in poor solderability. Do not store the capacitors in an atmosphere consisting of corrosive gas (e.g.,hydrogen
sulfide, sulfur dioxide, chlorine, ammonia gas etc.).
1-3. Due to moisture condensation caused by rapid humidity changes, or the photochemical change caused
by direct sunlight on the terminal electrodes and/or the resin/epoxy coatings, the solderability and
electrical performance may deteriorate. Do not store capacitors under direct sunlight or in high huimidity
conditions
■Rating
1.Temperature Dependent Characteristics
1. The electrical characteristics of the capacitor can change with temperature.
1-1. For capacitors having larger temperature dependency, the capacitance may change with temperature
changes. The following actions are recommended in order to ensure suitable capacitance values.
(1) Select a suitable capacitance for the operating temperature range.
(2) The capacitance may change within the rated temperature.
When you use a high dielectric constant type capacitor in a circuit that needs a tight (narrow) capacitance
tolerance (e.g., a time-constant circuit), please carefully consider the temperature characteristics, and
carefully confirm the various characteristics in actual use conditions and the actual system.
[Example of Temperature Caracteristics X7R(R7)] [Example of Temperature Characteristics X5R(R6)]

!
-20
-10
-15
-5
5
0
10
15
20
Temperature (C)
-75 -50 -25 025 50 75 100 125 150
Capacitance Change(%)
-20
-10
-15
-5
5
0
10
15
20
Temperature (C)
-75 -50 -25 025 50 75 100
Capacitance Change(%)
JEMCGC-02188E 10
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