NAD T 747 User manual

LAUNAMECIVRES
AV Surround Sound Receiver
T747
AV Surround Sound Receiver
T747

1-2
SECTION 1
SUMMARY
CONTENTS
PRODUCT SAFETY SERVICING GUIDELINES.......................................................................................... 1-3
SERVICING PRECAUTIONS ....................................................................................................................... 1-4
* General Servicing Precautions
* Insulation checking prodedure
* Electrostatically Sensitive Devices
SPECIFICATIONS ......................................................................................................................................... 1-5
DISASSEMBLY .............................................................................................................................................. 1-6
PRINCIPAL PART LOCATION ...................................................................................................................... 1-7
.............. 1-8
EXPLODED VIEW ...........................................................................................................................

1-3
PRODUCT SAFETY SERVICING GUIDELINES
CAUTION : DO NOT ATTEMPT TO MODIFY THIS PRODUCT IN
ANY WAY. NEVER PERFORM CUSTOMIZED INSTALLATIONS
WITHOUT MANUFACTURER’S APPROVAL. UNAUTHORIZED
MODIFICATIONS WILL NOT ONLY VOID THE WARRANTY, BUT
MAY LEAD TO YOUR BEING LIABLE FOR ANY RESULTING
PROPERTY DAMAGE OR USER INJURY.
SERVICE WORK SHOULD BE PERFORMED ONLY AFTER YOU
ARE THOROUGHLY FAMILIAR WITH ALL OF THE FOLLOWING
SAFETY CHECKS AND SERVICING GUIDELINES. TO DO
OTHERWISE, INCREASES THE RISK OF POTENTIAL HAZARDS
AND INJURY TO THE USER.
WHILE SERVICING, USE AN ISOLATION TRANSFORMER FOR
PROTECTION FROM AC LINE SHOCK.
SAFETY CHECKS
AFTER THE ORIGINAL SERVICE PROBLEM HAS BEEN
CORRECTED. A CHECK SHOULD BE MADE OF THE
FOLLOWING.
SUBJECT : FIRE & SHOCK HAZARD
1. BE SURE THAT ALL COMPONENTS ARE POSITIONED IN
SUCH A WAY AS TO AVOID POSSIBILITY OF ADJACENT
COMPONENT SHORTS. THIS IS ESPECIALLY IMPORTANT
ON THOSE MODULES WHICH ARE TRANSPORTED TO AND
FROM THE REPAIR SHOP.
2. NEVER RELEASE A REPAIR UNLESS ALL PROTECTIVE
DEVICES SUCH AS INSULATORS, BARRIERS, COVERS,
SHIELDS, STRAIN RELIEFS, POWER SUPPLY CORDS, AND
OTHER HARDWARE HAVE BEEN REINSTALLED PER
ORIGINAL DESIGN. BE SURE THAT THE SAFETY PURPOSE
OF THE POLARIZED LINE PLUG HAS NOT BEEN DEFEATED.
3. SOLDERING MUST BE INSPECTED TO DISCOVER POSSIBLE
COLD SOLDER JOINTS, SOLDER SPLASHES OR SHARP
SOLDER POINTS. BE CERTAIN TO REMOVE ALL LOOSE
FOREIGN PARTICLES.
4. CHECK FOR PHYSICAL EVIDENCE OF DAMAGE OR
DETERIORATION TO PARTS AND COMPONENTS. FOR
FRAYED LEADS, DAMAGED INSULATION (INCLUDING AC
CORD). AND REPLACE IF NECESSARY FOLLOW ORIGINAL
LAYOUT, LEAD LENGTH AND DRESS.
5. NO LEAD OR COMPONENT SHOULD TOUCH A RECEIVING
TUBE OR A RESISTOR RATED AT 1 WATT OR MORE. LEAD
TENSION AROUND PROTRUDING METAL SURFACES MUST
BE AVOIDED.
6. ALL CRITICAL COMPONENTS SUCH AS FUSES,
FLAMEPROOF RESISTORS, CAPACITORS, ETC. MUST BE
REPLACED WITH EXACT FACTORY TYPES, DO NOT USE
REPLACEMENT COMPONENTS OTHER THAN THOSE
SPECIFIED OR MAKE UNRECOMMENDED CIRCUIT
MODIFICATIONS.
7. AFTER RE-ASSEMBLY OF THE SET ALWAYS PERFORM AN
AC LEAKAGE TEST ON ALL EXPOSED METALLIC PARTS OF
THE CABINET, (THE CHANNEL SELECTOR KNOB, ANTENNA
TERMINALS. HANDLE AND SCREWS) TO BE SURE THE SET
IS SAFET TO OPERATE WITHOUT DANGER OF ELECTRICAL
SHOCK. DO NOT USE A LINE ISOLATION TRANSFORMER
DURING THIS TEST USE AN AC VOLTMETER, HAVING 5000
OHMS PER VOLT OR MORE SENSITIVITY, IN THE
FOLLOWING MANNER; CONNECT A 1500 OHM 10 WATT
RESISTOR, PARALLELED BY A .15 MFD, 150V AC TYPE
CAPACITOR BETWEEN A KNOWN GOOD EARTH GROUND
(WATER PIPE, CONDUIT, ETC.) AND THE EXPOSED
METALLIC PARTS, ONE AT A TIME.
MEASURE THE AC VOLTAGE ACROSS THE COMBINATION
OF 1500 OHM RESISTOR AND .15 MFD CAPACITOR.
REVERSE THE AC PLUG AND REPEAT AC VOLTAGE
MEASUREMENTS FOR EACH EXPOSED METALLIC PART.
VOLTAGE MEASURE MUST NOT EXCEED 75 VOLTS R.M.S.
THIS CORRESPONDS TO 0.5 MILLIAMP AC ANY VALUE
EXCEEDING THIS LIMIT CONSTITUTES A POTENTIAL
SHOCK HAZARD AND MUST BE CORRECTED IMMEDIATELY.
SUBJECT : GRAPHIC SYMBOLS
SUBJECT : TIPS ON PROPER INSTALLATION
1. NEVER INSTALL ANY PRODUCT IN A CLOSED-IN RECESS,
CUBBYHOLE OR CLOSELY FITTING SHELF SPACE. OVER
OR CLOSE TO HEAT DUCT, OR IN THE PATH OF HEATED
AIR FLOW.
2. AVOID CONDITIONS OF HIGH HUMIDITY SUCH AS:
OUTDOOR PATIO INSTALLATIONS WHERE DEW IS A
FACTOR, NEAR STEAM RADIATORS WHERE STEAM
LEAKAGE IS A FACTOR, ETC.
3. AVOID PLACEMENT WHERE DRAPERIES MAY OBSTRUCT
REAR VENTING. THE CUSTOMER SHOULD ALSO AVOID THE
USE OF DECORATIVE SCARVES OR OTHER COVERINGS
WHICH MIGHT OBSTRUCT VENTILATION.
4. WALL AND SHELF MOUNTED INSTALLATIONS USING A
COMMERCAL MOUNTING KIT MUST FOLLOW THE FACTORY
APPROVED MOUNTING INSTRUCTIONS A PRODUCT
MOUNTED TO A SHELF OR PLATFORM MUST RETAIN ITS
ORIGINAL FEET (OR THE EQUIVALENT THICKNESS IN
SPACERS) TO PROVIDE ADEQUATE AIR FLOW ACROSS
THE BOTTOM, BOLTS OR SCREWS USED FOR FASTENERS
MUST NOT TOUCH ANY PARTS OR WIRING. PERFORM
LEAKAGE TEST ON CUSTOMIZED INSTALLATIONS.
5. CAUTION CUSTOMERS AGAINST THE MOUNTING OF A
PRODUCT ON SLOPING SHELF OR A TILTED POSITION,
UNLESS THE PRODUCT IS PROPERLY SECURED.
6. A PRODUCT ON A ROLL-ABOUT CART SHOULD BE STABLE
ON ITS MOUNTING TO THE CART. CAUTION THE
CUSTOMER ON THE HAZARDS OF TRYING TO ROLL A CART
WITH SMALL CASTERS ACROSS THRESHOLDS OR DEEP
PILE CARPETS.
7. CAUTION CUSTOMERS AGAINST THE USE OF A CART OR
STAND WHICH HAS NOT BEEN LISTED BY UNDERWRITERS
LABORATORIES, INC. FOR USE WITH THEIR SPECIFIC
MODEL OF TELEVISION RECEIVER OR GENERICALLY
APPROVED FOR USE WITH T.V.’S OF THE SAME OR
LARGER SCREEN SIZE.
8. CAUTION CUSTOMERS AGAINST THE USE OF EXTENSION
CORDS, EXPLAIN THAT A FOREST OF EXTENSIONS
SPROUTING FROM A SINGLE OUTLET CAN LEAD TO
DISASTROUS CONSEQUENCES TO HOME AND FAMILY.
THE LIGHTNING FLASH WITH ARROWHEAD SYMBOL, WITHIN AN
EQUILATERAL TRIANGLE, IS INTENDED TO ALERT THE USER TO THE
PRESENCE OF UNINSULATED “DANGEROUS VOLTAGE” WITHIN THE
PRODUCT’S ENCLOSURE THAT MAY BE OF SUFFICIENT MAGNITUDE TO
CONSTITUTE A RISK OF ELECTRIC SHOCK.
THE EXCLAMATION POINT WITHIN AN EQUILATERAL TRIANGLE IS
INTENDED TO ALERT THE USER TO THE PRESENCE OF IMPORTANT
OPERATING AND MAINTENANCE (SERVICING) INSTRUCTIONS IN THE
LITERATURE ACCOMPANYING THE APPLIANCE.

1-4
SERVICING PRECAUTIONS
CAUTION : Before servicing the A/V Receiver covered by this
service data and its supplements and addends, read and follow the
SAFETY PRECAUTIONS. NOTE : if unforeseen circumstances
create conflict between the following servicing precautions and any
of the safety precautions in this publication, always follow the safety
precautions.
Remember Safety First:
General Servicing Precautions
1. Always unplug the A/V Receiver AC power cord from the AC
power source before:
(1) Removing or reinstalling any component, circuit board,
module, or any other assembly.
(2) Disconnecting or reconnecting any internal electrical plug or
other electrical connection.
(3) Connecting a test substitute in parallel with an electrolytic
capacitor.
Caution : A wrong part substitution or incorrect polarity installation
of electrolytic capacitors may result in an explosion hazard.
2. Do not spray chemicals on or near this A/V Receiver or any of its
assemblies.
3. Unless specified otherwise in this service data, clean electrical
contacts by applying an appropriate contact cleaning solution to
the contacts with a pipe cleaner, cottontipped swab, or
comparable soft applicator.
Unless specified otherwise in this service data, lubrication of
contacts is not required.
4. Do not defeat any plug/socket B+ voltage interlocks with which
instruments covered by this service manual might be equipped.
5. Do not apply AC power to this A/V Receiver and/or any of its
electrical assemblies unless all solid-state device heat sinks are
correctly installed.
6. Always connect test instrument ground lead to the appropriate
ground before connecting the test instrument positive lead. Always
remove the test instrument ground lead last.
Insulation Checking Procedure
Disconnect the attachment plug from the AC outlet and turn the
power on. Connect an insulation resistance meter(500V) to the
blades of the attachment plug. The insulation resistance between
each blade of the attachment plug and accessible conductive parts
(Note 1) should be more than 1M-ohm.
Note 1 : Accessible Conductive Parts including Metal panels, Input
terminals, Earphone jacks, etc.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid state) devices can be damaged easily by
static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical Es
devices are integrated circuits and some field effect transistors and
semiconductor chip components.
The following techniques should be used to help reduce the
incidence of component damage caused by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground.
Alternatively, obtain and wear a commercially available
discharging wrist strap device, which should be removed for
potential shock reasons prior to applying power to the unit under
test.
2. After removing an electrical assembly equipped with ES devices,
place the assembly on a conductive surface such as aluminum
foil, to prevent electrostatic charge buildup or exposure of the
assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an antistatic solder removal device. Some solder
removal devices not classified a “anti-static” can generate
electrical charges sufficient to damage ES devices.
5. Do not use freonpropelled chemicals. These can generate
electrical charge sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it. (Most
replacement ES devices are packaged with leads electrically
shorted together by conductive foam, aluminum foil, or
comparable conductive material).
7. lmmediately before removing the protective material from the
leads of a replacement ES device, touch the protective material to
the chassis or circuit assembly into which the device will be
installed.
Caution : Be sure no power is applied to the chassis or circuit, and
observe all other safety precautions.
8. Minimize bodily motions when handing unpackaged replacement
ES devices. (Normally harmless motion such as the brushing
together of your clothes fabric or the lifting of your foot from a
carpeted floor can generate static electricity sufficient to damage
an ES device.)

ͲΞΡΝΚΗΚΖΣ΄ΖΔΥΚΠΟ ͷ;΅ΦΟΖΣ΄ΖΔΥΚΠΟ
ΈΚΥΙΠΦΥΟΠΥΖΤ;͹ΫΕͳΗ
΀ΦΥΡΦΥ΁ΠΨΖΣͷΣΠΟΥ
ͷ΅ʹ΃ΒΥΚΠΟ ΅ΦΟΚΟΘ΃ΒΟΘΖ
ΨΒΥΥΤ΃;΄ΡΖΣΔΙΒΟΟΖΝΞΚΟΚΞΦΞ ;͹Ϋ;͹Ϋʹͼ͹ΫΤΥΖΡΤ
ΓΠΥΙΔΙΒΟΟΖΝΤΕΣΚΧΖΟΚΟΥΠΠΙΞΤΗΣΠΞ Ͳ͹ͼ͹ΫΤΥΖΡΤ
͹ΫΥΠͼ͹ΫΨΚΥΙΟΠΞΠΣΖΥΙΒΟ
ΥΠΥΒΝΙΒΣΞΠΟΚΔΕΚΤΥΠΣΥΚΠΟ Ͳ;΄ΦΡΡΣΖΤΤΚΠΟ΃ΒΥΚΠʹΕͳ
Ͳ͹Εͳ
΄ΦΣΣΠΦΟΕ΀ΦΥΡΦΥ΁ΠΨΖΣ΅͹͵ͼ͹ΫΠΙΞΤ
 ΈΒΥΥͷΣΠΟΥ ΅ΠΥΒΝ͹ΒΣΞΠΟΚΔ͵ΚΤΥΠΣΥΚΠΟͼ͹Ϋ
ΈΒΥΥʹΖΟΥΖΣ ;ΠΟΠ
ΈΒΥΥ΄ΦΣΣ ΄ΥΖΣΖΠ
ΈΒΥΥͳΒΔΜ΄ΦΣΣ
ͷΣΖ΢ΖΟΔΪ΃ΖΤΡΠΟΤΖ͹Ϋͼ͹ΫΕͳ
΅ΠΥΒΝ͹ΒΣΞΠΟΚΔ͵ΚΤΥΠΣΥΚΠΟͷΣΠΟΥ ΄ΥΖΣΖΠ΄ΖΡΒΣΒΥΚΠΟͼ͹ΫʹΕͳ
ΒΥΈΒΥΥΤͼ͹Ϋ  Ͳ͹Εͳ
ͲΦΕΚΠΚΟΡΦΥ΄ΖΟΤΚΥΚΧΚΥΪͺΞΡΖΕΒΟΔΖ ΄ΚΘΟΒΝΥΠͿΠΚΤΖ΃ΒΥΚΠ
ͽΚΟΖΞ·ͼΠΙΞΤ  ;ΠΟΠΕͳ
΄ΥΖΣΖΠΕͳ
΀ΦΥΡΦΥͽΖΧΖΝͺΞΡΖΕΒΟΔΖ
΃ͶʹΞ·ͼΠΙΞΤ
Ͳ;΅ΦΟΖΣ΄ΖΔΥΚΠΟ
ͷΣΖ΢ΖΟΔΪ΃ΖΤΡΠΟΤΖ ΅ΦΟΚΟΘ΃ΒΟΘΖ
ͽΚΟΖ͹Ϋͼ͹ΫΕͳ ʹͼ͹Ϋͼ͹Ϋͼ͹ΫΤΥΖΡΤ
Ͳ͹ͼ͹Ϋͼ͹Ϋͼ͹ΫΤΥΖΡΤ
΄ΚΘΟΒΝΥΠͿΠΚΤΖ΃ΒΕΚΠΈΒΥΥ
ͽΚΟΖΕͳͺ͹ͷͲ ΆΤΒΓΝΖ΄ΖΟΤΚΥΚΧΚΥΪΕͳ
΅ΠΥΒΝ͹ΒΣΞΠΟΚΔ͵ΚΤΥΠΣΥΚΠΟ
΅ΠΟΖʹΠΟΥΣΠΝ ΄ΚΘΟΒΝΥΠͿΠΚΤΖ΃ΒΥΚΠΕͳ
ͳͲ΄΄ΕͳΒΥ͹Ϋ
΅΃ͶͳͽͶΕͳΒΥͼ͹Ϋ
͸ΖΟΖΣΒΝ
΁ΠΨΖΣ΃Ζ΢ΦΚΣΖΞΖΟΥΤ
͵ΚΘΚΥΒΝΒΦΕΚΠ΄ΖΔΥΚΠΟ
ʹ·Ͳʹ͹Ϋ
΄ΒΞΡΝΖΚΟΘͷΣΖ΢ΖΟΔΪ Ͳ͹·Ͳʹ͹Ϋ
ͼ͹Ϋͼ͹Ϋͼ͹Ϋͼ͹Ϋ ΁ΠΨΖΣʹΠΟΤΦΞΡΥΚΠΟʹͲ
Ͳ͹Ͳ
͵ΚΘΚΥΒΝͺΟΡΦΥͽΖΧΖΝͺΞΡΖΕΒΟΔΖ Ͳʹ΀ΦΥΝΖΥΤΦΟΤΨΚΥΙΖΕΩ΅ΠΥΒΝΈΞΒΩͲ
ʹΠΒΩΚΒΝ·ΡΡΠΙΞΤ ͵ΚΞΖΟΤΚΠΟΤΈΩ͹Ω͵ΩΩ
΀΁΅ͺʹͲͽΕͳΞίΕͳΞ ΈΖΚΘΙΥΟΖΥͼΘ
·ΚΕΖΠ΄ΖΔΥΚΠΟ
ͺΟΡΦΥ΄ΖΟΤΚΥΚΧΚΥΪͺΞΡΖΕΒΟΔΖ·ΡΡΠΙΞΤ
΀ΦΥΡΦΥͽΖΧΖΝͺΞΡΖΕΒΟΔΖ·ΡΡΠΙΞΤ
ͽΚΟΖΞΖΒΟΤ΄ΠΦΣΔΖίͷΣΠΟΥ;΁
ͺΞΡΣΠΧΖΞΖΟΥΤΞΒΪΣΖΤΦΝΥΚΟΤΡΖΔΚΗΚΔΒΥΚΠΟΤΒΟΕΗΖΒΥΦΣΖΤ
ΔΙΒΟΘΚΟΘΨΚΥΙΠΦΥΟΠΥΚΔΖ
ͺΝΝΦΤΥΣΒΥΚΠΟΤΞΒΪΕΚΗΗΖΣΤΝΚΘΙΥΝΪΗΣΠΞΡΣΠΕΦΔΥΚΠΟΞΠΕΖΝΤ
SPECIFICATIONS
1-5

1-6
DISASSEMBLY
1> REMOVAL OF TOP COVER
2> REMOVAL OF FRONT PANEL

1-7
PRINCIPAL PARTS LOCATION

T747AH EXPLODED VIEW PARTS LIST (Graphite)
1-8
NOTE **
AMP ASSEMBLY #31 & CHASSIS #19
ARE SOLD TOGETHER
FASCIA ASSEMBLY #1, #3, & #4
ARE SOLD TOGETHER
BUTTON

T747AH EXPLODED VIEW (Graphite)
1-9 1-10
SEE
NOTE**
SEE
NOTE**
SEE
NOTE**

T747C EXPLODED VIEW PARTS LIST (Graphite)
1-11
NOTE **
AMP ASSEMBLY #31 & CHASSIS #19
ARE SOLD TOGETHER
FASCIA ASSEMBLY #1, #3, & #4
ARE SOLD TOGETHER
BUTTON

T747C EXPLODED VIEW (Graphite)
1-12 1-13
SEE
NOTE**
SEE
NOTE**
SEE
NOTE**

T747CT EXPLODED VIEW PARTS LIST (Titanium)
1-14
NOTE **
AMP ASSEMBLY #31 & CHASSIS #19
ARE SOLD TOGETHER
FASCIA ASSEMBLY #1, #3, & #4
ARE SOLD TOGETHER
BUTTON

T747CTEXPLODED VIEW (Titanium)
1-15 1-16
SEE
NOTE**
SEE
NOTE**
SEE
NOTE**

2-1
SECTION 2
ELECTRICAL CONTENTS
CONTENTS
IC BLOCK DIAGRAMS & PIN DESCRIPTION .......................................................................................... 2-2
DIAGRAM .................................................................................................................................................... 2-31
1. BLOCK DIAGRAM ................................................................................................................................ 2-31
2. WIRING DIAGRAM .............................................................................................................................. 2-39
3. SCHEMATIC DIAGRAM ...................................................................................................................... 2-41
•FRONT PART ............................................................................................................................. 2-41
•POWER PART............................................................................................................................ 2-43
•MCU PART................................................................................................................................. 2 -45
•DSP&CODEC WITH DIR PART................................................................................................... 2-47
•INPUT&VOLUME PART....................................................................................................................... 2-49
•XM&TUNER PART............................................................................................................................... 2-51
•VIDEO PART.................................................................................................................................. 2-53
•HDMI PART................................................................................................................................... 2-55
•AMP PART................................................................................................................................... 2-63
4. PRINTED CIRCUIT BOARDS ............................................................................................................. 2-67
•FRONT ............................................................................................................................... ........ 2-67
•MAIN............................................................................................................................................ 2-71
•INPUT........................................................................................................................................... 2-73
•VIDEO ......................................................................................................................................... 2-77
•HDMI............................................................................................................................................... 2-79
•AMP.................................................................................................................................................... 2-81
5. TROUBLESHOOTING .......................................................................................................................... 2-85
6. SPECIAL FUNCTION KEYS ................................................................................................................ 2-89

ڌ·΃Ͷͷͽ ڢکڟ
ڍͲ·΄΄ ڢکڟ
ڎͲ·ʹʹ ڎډڎڱ
ڏ΁΅ͲͺͿ ΀ ڱڡڟںڞڮ
ڐ΁΅Ͳ΀Ά΅ ΀ ڱڡڟںڞڧڦ
ڑ΁΅Ͳ΀Ά΅ ΀ ڱڡڟںڟڜگڜ
ڒ΁΅ͲͺͿ ΀ ڱڡڟںڭڮگ
ړ΁΅Ͳ΀Ά΅ ͺ ڣګںڤک
ڔ΁΅Ͳ΀Ά΅ ΀ ڰڜڭگڌںڭڠڮڠگ
ڌڋ ΁΅ͳͺͿͺͿ΅ ͺ ڰڭڜگڌںڤڭڬ
ڌڌ ΁΅ͳͺͿͺͿ΅ ΀ ڰڜڭگڌںڞڧڦ
ڌڍ ΁΅ͳ΀Ά΅ ΀ ڰڜڭگڌںڞڮ
ڌڎ ΁΅ͳ΀Ά΅ ͺ ڰڜڭگڌںڟڜگڜںڤک
ڌڏ ΁΅ͳͺͿͺͿ΅ ΀ ڰڜڭگڌںڟڜگڜںڪڰگ
ڌڐ ΁΅ͳͺͿͺͿ΅ ͺ گڪڭڤکڪںڨڰگڠںڤک
ڌڑ ΁΅ͳ΀Ά΅ ΀ ڣڟڨڤںڮڲڌ
ڌڒ ΁΅ͳ΀Ά΅ ΀ ڣڟڨڤںڮڲڍ
ڌړ ΁΅Ή͵ ΀ گڪڭڤکڪںگڳ
ڌڔ ΁΃Ή͵ ͺ گڪڭڤکڪںڭڳ
ڍڋ ΁΄ʹͽͼڞگڮڋ ΀گڪڭڤکڪںڭڠڮڠگ
ڍڌ ΁΅Ή͵ ΀ ڰڜڭگںگڳ
ڍڍ ΁΃Ή͵ ͺ ڰڜڭگںڭڳ
ڍڎ ΁΄ʹͽͼڞگڮڌ ͺ ͵΄΁ΐ;΀͵Ͷΐ΄Ͷͽ
ڍڏ Ͳ; ڎډڎڱ
ڍڐ ͵·ʹʹ ڎډڎڱ
ڍڑ Ή ΀ ڳںگڜڧںڪڰگ
ڍڒ ͵·΄΄ ڢکڟ
ڍړ Ή ͺ ڳںگڜڧںڤک
ڍڔ Ͳ; ڎډڎڱ
ڎڋ ڭڠ ڤ ڭڠڮڠگ
ڎڌ ΁Ή΅ ͺ
ڎڍ ΁Ή΅ ͺ
ڎڎ Ͷ;Ά
ڎڏ Ͷ;Ά
ڎڐ ΁ͲͺͿ΅ ڭڠڨڪگڠںڤک
ڎڑ ΁ͲͺͿ΅ ڨڰڧگڤںڤڭںڤک
ڎڒ ΁ͲͺͿ΅ ڭڟڮںڞڧڦ
ڎړ ΁ͲͺͿ΅ ڤ ڝڜڞڦںڰګ
ڎڔ ΁Ͳ ΀ ګڧڧڈڞڠ
ڏڋ ΁Ͳ ͺ ګڧڧںڟڜگڜںڤک
ڏڌ ΁Ͳ ΀ ګڧڧںڞڧڦ
ڏڍ ΁Ͳ ΀ ګڧڧںڟڜگڜںڪڰگ
ڏڎ ͲͽͶ کډڞ
ڏڏ ΁Ͳ͵ ͺ گڰکڠڟ
ڏڐ ΁Ͳ͵ ͺ ڮگڠڭڠڪ
ڏڑ ΁Ͳ͵ ڤڭڟڮںڟڜگڜ
ڏڒ ΁Ͳ͵ ڤ ڪګگڤڪک
ڏړ ΁Ͳ͵ ͺ ڪګگڤڪک
ڏڔ ΁Ͳ͵ ΀ ڮڞڧڃڠڠګڭڪڨڄ
ڐڋ ΁Ͳ͵ ͺ΀ ڮڟڜڃڠڠګڭڪڨڄ
ګڤکٻکۊ ګۊۍۏٻکڼۈۀ ڃڤڊڪڄ ڡڰکڞگڤڪک
ڤڞٻګڤکٻڟڠڞڭڤڝگڤڪکڮڃڤڞڍڋڌٻڕٻڡڧڜڮڣٻېڈڞڪڨٻڕٻگڐڞڞڌڄ
IC BLOCK DIAGRAMS & PIN DESCRIPTION
2-2

ڐڌ ΁Ͳ͵ ڤ ګڭڪگڠڞگںڤک
ڐڍ ΁Ͳ͵Ͳ ΀ ڮڰڝںڱڪڧںڮگڝ
ڐڎ ΁Ͳ͵Ͳ ΀ ڮڰڝںڱڪڧںڞڧڦ
ڐڏ ΁Ͳ͵Ͳ ΀ ڮڰڝںڱڪڧںڟڜگڜ
ڐڐ ΁Ͳ͵Ͳ ΀ ڨڜڤکںڱڪڧںڨڰگڠ
ڐڑ ΁Ͳ͵Ͳ ΀ ڨڜڤکںڱڪڧںڞڧڦ
ڐڒ ΁Ͳ͵Ͳ ΀ ڨڜڤکںڱڪڧںڟڜگڜ
ڐړ ΁Ͳ͵Ͳ ΀ ͷΆͿʹ΅ͺ΀Ϳΐ;Ά΅Ͷ
ڐڔ ΁Ͳ͵Ͳ ΀ ͶΉ΁ΐʹͶ
ڑڋ ΁ͲͲ ΀ ڟڤڭںڭڠڮڠگ
ڑڌ ΁ͲͲ ΀ ڟڤڭںڞڮ
ڑڍ ͵·΄΄ ڢکڟ
ڑڎ کڨڤ ڎډڎڱٻ
ڑڏ ͵·ʹʹ ڎډڎڱ
ڑڐ ΁ͲͲ ͺ ڟڤڭںڟںڪڰگ
ڑڑ ΁ͲͲ ͺ ڟڮګںڮګڞڤںڤڭڬ
ڑڒ ΁ͲͲ ΀ ڟڮګںڟڤڭںڞڧڦ
ڑړ ΁ͲͲ ͺ ڟڮګںڟڜگڜ
ڑڔ ΁ͲͲ ΀ ڟڮګںڞڮٻ
ڒڋ ΁ͲͲ ΀ ڟڮګںڟڤڭںڟڜگڜ
ڒڌ ΁ڭڟ ΀ڣڟڨڤںڮڲڌ
ڒڍ ΁ڲڭ ΀ڣڟڨڤںڮڲڍ
ڒڎ ΁ڣڲڭ ͺڟڮګںګڞګںڝڮڴ
ڒڏ ΁ڲڜڤگ ΀ڟڮګںڭڠڮڠگ
ڒڐ ΁ڝڰڮڭڬ ΀ڠڳګںڞڠڌ
ڒڑ ΁ڝڰڮڜڦ ΀ڠڳګںڞڧڦ
ڒڒ ΁΃ڲ΀ڠڳګںڟڜگڜ
ڒړ ΁ڝڪڪگ ڤ ڝڪڪگںڨڪڟڠ
ڒڔ ΁ڞڮڋ ͺڰڭڜگڍںڤڭڬ
ړڋ ΁ڞڮڌ ΀ڰڜڭگںڞڧڦ
ړڌ ΁ڞڮڍ ΀ڰڜڭگڍںڞڮ
ړڍ ΁ڞڮڎ ͺڰڜڭگڍںڟڜگڜںڤک
ړڎ ΁΄ʹͼ ΀ ڰڜڭگڍںڟڜگڜںڪڰگ
ړڏ ΁΄΀΄͵Ͳ ΀ ڰڜڭگڍںڭڠڮڠگ
ړڐ ΁΄ͺ΄ʹͽ ΀ ڱڤڟڠڪںڮڟڜ
ړڑ ΁ͺͿ΅ ڱڤڟڠڪںڮڞڧ
ړڒ ΁΄ʹ΀Ά΅ ΀ ګڪڲڠڭںڪک
ړړ ΁ ΀ ڨڤڞںڪک
ړڔ ͵·ʹʹ ڎډڎڱ
ڔڋ ΁ ͺ ڤګڪڟںڟڠگڠڞگ
ڔڌ ͵·΄΄ ڢکڟ
ڔڍ ΁ͲͿ ͺ ڦڠڴڌ
ڔڎ ΁ͲͿ ͺ ڦڠڴڍ
ڔڏ ΁ͲͿ ͺ ڦڠڴڎ
ڔڐ ΁ͲͿڜڟگڭڢ ͺڱڪڧںڠکڌ
ڔڑ ΁ͲͿ ͺ ڱڪڧںڠکڍ
ڔڒ ΁ͲͿ ڡڰکڞٻڠکڌ
ڔړ ΁ͲͿ ڡڰکڞٻڠکڍ
ڔڔ ΁ͲͿ ڣڟڨڤںڤکگ
ڌڋڋ ·΃Ͷͷ͹ ڎډڎڱ
ګڤکٻکۊ ګۊۍۏٻکڼۈۀ ڃڤڊڪڄ ڡڰکڞگڤڪک
2-3

2-4
IC201: T5CC1: Microcontrollers
2-4

64
GND_IO
63
CLKIN_B
62
S7
61
S6
60
S5
59
S4
58
S3
57
DGND
56
VDD
55
S2
54
S1
53
S0
52
TEST5
51
TEST4
50
S_HSYNC
49
S_VSYNC
47 RSET1
46 VREF
45 COMP1
42 DAC 3
43 DAC 2
44 DAC 1
48 SFL/MISO
41 VAA
40 AGND
39 DAC 4
37 DAC 6
36 RSET2
35 COMP2
34 PVDD
33 EXT_LF1
38 DAC 5
2
TEST0
3
TEST1
4
Y0
7
Y3
6
Y2
5
Y1
1
VDD_IO
8
Y4
9
Y5
10
VDD
12
Y6
13
Y7
14
TEST2
15
TEST3
16
C0
11
DGND
17
C1
18
C2
19
ALSB/SPI_SS
20
SDA/SCLK
21
SCL/MOSI
22 23
P_HSYNC
24
P_VSYNC
25
P_BLANK
26
C4 C3
27
C5
28
C6
29
C7
30
CLKIN_A
31 32
PGND
PIN 1
ADV7342/ADV7343
TOP VIEW
(Not to Scale)
EXT_LF2
Pin No. Mnemonic
Input/
Output Description
13, 12,
9 to 4
Y7 to Y0 I 8-Bit Pixel Port. Y0 is the LSB. Refer to Table 31 for input modes.
29 to 25,
18 to 16
C7 to C0 I 8-Bit Pixel Port. C0 is the LSB. Refer to Table 31 for input modes.
62 to 58,
55 to 53
S7 to S0 I 8-Bit Pixel Port. S0 is the LSB. Refer to Table 31 for input modes.
52, 51, 15,
14, 3, 2
TEST5 to
TEST0
I Unused. These pins should be connected to DGND.
30 CLKIN_A I Pixel Clock Input for HD Only (74.25 MHz), ED1Only (27 MHz or 54 MHz) or SD Only (27 MHz).
63 CLKIN_B I Pixel Clock Input for Dual Modes Only. Requires a 27 MHz reference clock for ED operation or a
74.25 MHz reference clock for HD operation.
50 S_HSYNC I/O SD Horizontal Synchronization Signal. This pin can also be configured to output an SD, ED, or HD
horizontal synchronization signal. See the External Horizontal and Vertical Synchronization
Control section.
49 S_VSYNC I/O SD Vertical Synchronization Signal. This pin can also be configured to output an SD, ED, or HD
vertical synchronization signal. See the External Horizontal and Vertical Synchronization Control
section.
22 P_HSYNC I ED/HD Horizontal Synchronization Signal. See the External Horizontal and Vertical
Synchronization Control section.
23 P_VSYNC I ED/HD Vertical Synchronization Signal. See the External Horizontal and Vertical Synchronization
Control section.
24 P_BLANK I ED/HD Blanking Signal. See the External Horizontal and Vertical Synchronization Control section.
48 SFL/MISO I/O
Multifunctional Pin: Subcarrier Frequency Lock (SFL) Input/SPI Data Output. The SFL input is
used to drive the color subcarrier DDS system, timing reset, or subcarrier reset.
47 RSET1 I
This pin is used to control the amplitudes of the DAC 1, DAC 2, and DAC 3 outputs. For full-drive
operation (for example, into a 37.5 Ω load), a 510 Ω resistor must be connected from RSET1 to
AGND. For low drive operation (for example, into a 300 Ω load), a 4.12 kΩ resistor must be
connected from RSET1 to AGND.
IC PIN DESCRIPTION (IC158: ADV7342: VIDEO ENCODER)
2-5

Pin No. Mnemonic
Input/
Output Description
36 RSET2 I
This pin is used to control the amplitudes of the DAC 4, DAC 5, and DAC 6 outputs. A 4.12 kΩ
resistor must be connected from RSET2 to AGND.
45, 35 COMP1,
COMP2
O Compensation Pins. Connect a 2.2 nF capacitor from both COMP pins to VAA.
44, 43, 42 DAC 1, DAC 2,
DAC 3
O DAC Outputs. Full and low drive capable DACs.
39, 38, 37 DAC 4, DAC 5,
DAC 6
O DAC Outputs. Low drive only capable DACs.
21 SCL/MOSI I Multifunctional Pin: I2C Clock Input/SPI Data Input.
20 SDA/SCLK I/O Multifunctional Pin: I2C Data Input/Output. Also, SPI clock input.
19 ALSB/SPI_SS I Multifunctional Pin: This signal sets up the LSB2of the MPU I2C address. Also, SPI slave select.
46 VREF Optional External Voltage Reference Input for DACs or Voltage Reference Output.
41 VAA P Analog Power Supply (3.3 V).
10, 56 VDD P
Digital Power Supply (1.8 V). For dual-supply configurations, VDD can be connected to other 1.8 V
supplies through a ferrite bead or suitable filtering.
1 VDD_IO P Input/Output Digital Power Supply (3.3 V).
34 PVDD P
PLL Power Supply (1.8 V). For dual-supply configurations, PVDD can be connected to other 1.8 V
supplies through a ferrite bead or suitable filtering.
33 EXT_LF1 I External Loop Filter for On-Chip PLL 1.
31 EXT_LF2 I External Loop Filter for On-Chip PLL 2.
32 PGND G PLL Ground Pin.
40 AGND G Analog Ground Pin.
11, 57 DGND G Digital Ground Pin.
64 GND_IO G Input/Output Supply Ground Pin.
2-6

GPIO11, PCP_A3, AS#, SCP2_MISO / SDA
SD_A11, EXT_A11
GPIO26
G
PIO21, DAO2_DATA3 / XMTB, UART_TX_ENABLE
SD_A12, EXT_A12
G
PIO42, BDI_REQ# , DAI2_LRCLK, PCP_IRQ# / BSY#
113
116
119
122
126
129
130
133
136
139
109
110
115
120
125
135
140
144
CS497xx4
144-Pin LQFP
GPIO25, UART_TXD, EE_CS#
GPIO24, UART_RXD
GPIO31, UART_CLK
SD_D7, EXT_D7 SD_D6, EXT_D6 SD_D5, EXT_D5
SD_DQM0
SD_D4, EXT_D4 SD_D3, EXT_D3 SD_D2, EXT_D2
GPIO17, DAO1_DATA3 / XMTA
GPIO15, DAO1_DATA1, HS1
DAO1_DATA0, HS0
DAO1_LRCLK
DAO_MCLK
GPIO20, DAO2_DATA2
VDD1
GND1
DAO1_SCLK
GPIO16, DAO1_DATA2, HS2
GPIO23, DAO2_LRCLK
VDDIO1
GPIO22, DAO2_SCLK
GNDIO1
GPIO18, DAO2_DATA0, HS3 GPIO19, DAO2_DATA1, HS4
VDD2
GND2
VDDIO2
GNDIO2
GPIO28, DDAC
GPIO29, XMTA_IN
TEST
DBDA DBCK
1 5 9
10 13 18 21 24 27 33 36 15 25 30 35
SD_A3, EXT_A3
SD_A2, EXT_A2
SD_A1, EXT_A1
SD_A0, EXT_A0
VDD4
GND4
SD_A4, EXT_A4
SD_A5, EXT_A5
SD_A6, EXT_A6
SD_A7, EXT_A7
SD_A8, EXT_A8
SD_CLKEN
SD_A9, EXT_A9
VDDIO4
GNDIO4
SD_CLKOUT
SD_CLKIN
SD_D10, EXT_D1
0
SD_D11, EXT_D1
1
SD_D12, EXT_D1
2
VDD3
GND3
SD_D13, EXT_D1
3
SD_D14, EXT_D1
4
SD_D15, EXT_D1
5
SD_DQM1
VDDIO3
GNDIO3
SD_D0, EXT_D0
SD_D1, EXT_D1
SD_D8, EXT_D8
SD_D9, EXT_D9
EXT_CS2#
EXT_WE#
69
66
63
60
57
54
47
44
37
40
45
50
55
65
70
72
GPIO39, PCP_CS#, SCP2_CS# GPIO38, PCP_WR# / DS#, SCP2_CLK
VDD6
GPIO40, PCP_RD# / RW#
GND6
GPIO10, PCP_A2 / A10, SCP2_MOSI
GPIO41, PCP_IRQ#, SCP2_IRQ#
GPIO37, SCP1_BSY#, PCP_BSY#
VDDIO6
GNDIO6
GPOI36, SCP1_IRQ# GPIO34, SCP1__MISO / SDA
GPIO33, SCP1_MOSI GPIO35, SCP1_CLK VDD5 VDDIO5 GND5 GNDIO5
SD_CAS# SD_RAS#
SD_A10, EXT_A10
SD_CS# RESET# SD_WE# SD_BA1, EXT_A14
SD_BA0, EXT_A13
GPIO32, SCP1_CS#, IOWAIT
EXT_A15 EXT_A16 EXT_A17 EXT_A18 EXT_A19 EXT_CS1# EXT_OE#
GPIO30, XMTB_IN
101
98 94 91 86 83 76 73 75 80 85 90 95
100 105 108
GPIO1, PCP_AD1 / D1
GPIO0, PCP_AD0 / D0
XTO
VDD7
GND7
VDDIO7
XTI
GNDIO7
GNDA
NC
PLL_REF_RES
VDDA (3.3V)
VDD8
GND8
GPIO13, DAI1_DATA2, TM2, DSD2
GPIO14, DAI1_DATA3, TM3, DSD3
DAI1_DATA0, TM0, DSD0
GPIO12, DAI1_DATA1, TM1, DSD1
GPIO2, PCP_AD2 / D2
GPIO3, PCP_AD3 / D3
GPIO4, PCP_AD4 / D4
GPIO5, PCP_AD5 / D5
GPIO6, PCP_AD6 / D6
GPIO7, PCP_AD7 / D7
GPIO9, PCP_A1 / A9
DAI1_LRCLK, DSD4
DAI1_SCLK, DSD-CLK
VDDIO8
GNDIO8
GPIO8, PCP_A0 / A8
GPIO27
XTAL_OUT
GPIO43, BDI_CLK, DAI2_SCLK
BDI_DATA, DAI2_DATA, DSD5
IC240: CS497004: DSP
2-7