Nokia RH-37 Series User manual

Nokia Customer Care
RH-37 Series Transceivers
Issue 1 07/04 © 2004 Nokia Corporation Page 1
Company Confidential
7 - System Module

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Table of Contents Page No
Glossary of Terms..................................................................................................................................... 7
Baseband................................................................................................................................................. 10
Block diagram ......................................................................................................................................11
Environmental Specifications............................................................................................................ 13
Absolute maximum ratings ..............................................................................................................13
Temperature conditions ....................................................................................................................13
Humidity and water resistance ......................................................................................................13
Frequencies in baseband ..................................................................................................................14
PWB ........................................................................................................................................................14
Characteristics of the PWB.......................................................................................................... 14
Key components.............................................................................................................................. 14
Technical Specifications ..................................................................................................................... 16
Baseband core .....................................................................................................................................16
UPP...................................................................................................................................................... 16
UEMEK ............................................................................................................................................... 16
External SRAM and Flash ............................................................................................................. 17
Energy management ..........................................................................................................................17
Modes of operation........................................................................................................................ 17
No Supply.......................................................................................................................................... 18
Backup ............................................................................................................................................... 18
Acting Dead...................................................................................................................................... 18
Active ................................................................................................................................................. 18
Sleep Mode....................................................................................................................................... 19
Charging............................................................................................................................................ 19
Power distribution ..............................................................................................................................19
DC characteristics ..............................................................................................................................20
Supply voltage ranges ................................................................................................................... 20
Baseband regulators ...................................................................................................................... 21
Function Groups.................................................................................................................................... 22
Battery ...................................................................................................................................................22
Audio ......................................................................................................................................................22
Internal microphone ...................................................................................................................... 22
Internal speaker............................................................................................................................... 23
IHF speaker ....................................................................................................................................... 23
External audio.................................................................................................................................. 24
External microphone connection ............................................................................................... 24
Headset connections...................................................................................................................... 24
Test possibilities .............................................................................................................................. 24
Camera ..................................................................................................................................................24
Key features...................................................................................................................................... 25
Specifications................................................................................................................................... 26
CCP bus.............................................................................................................................................. 26
CCI bus............................................................................................................................................... 26
UIF bus ............................................................................................................................................... 27
Clocks ................................................................................................................................................. 27
Test possibility ................................................................................................................................. 27
Vibra .......................................................................................................................................................27

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Test possibility ................................................................................................................................. 27
FCI ...........................................................................................................................................................27
Function............................................................................................................................................. 28
Test possibility ................................................................................................................................. 29
LCD module ..........................................................................................................................................29
Characteristics................................................................................................................................. 30
LCD connector ................................................................................................................................. 31
Test possibility ................................................................................................................................. 32
Keypad ...................................................................................................................................................32
Test possibility ................................................................................................................................. 32
Illumination ..........................................................................................................................................33
Test possibility ................................................................................................................................. 34
XPress on grip LEDs ............................................................................................................................34
Test possibility ................................................................................................................................. 34
SIM .........................................................................................................................................................35
Test possibility ................................................................................................................................. 35
Interfaces ................................................................................................................................................ 36
BB-RF interface ...................................................................................................................................36
System connector interface .............................................................................................................36
System connector ........................................................................................................................... 36
ACI....................................................................................................................................................... 38
FBUS ................................................................................................................................................... 38
VOUT................................................................................................................................................... 39
DC plug .............................................................................................................................................. 39
Component Placement Hints............................................................................................................. 40
Power switch (S2419) .......................................................................................................................40
Helgo RF-chip (N7500) .....................................................................................................................41
Camera socket (X1470) .....................................................................................................................42
Hardware accelerator (D1470) .......................................................................................................42
UEM (D2800) .......................................................................................................................................43
Flash (D3000) .......................................................................................................................................43
SIM card reader (X2700) ..................................................................................................................43
System connector (X2002) ...............................................................................................................43
UEM (D2200) .......................................................................................................................................44
Battery connector (X2000) ..............................................................................................................45
X-press on grip LED’s (V2402, V2403, V2404, V2405, V2406, V2407) ...............................45
Label placement ..................................................................................................................................46
RF Module Description........................................................................................................................ 47
General specifications of the transceiver ....................................................................................48
Frequency concept .............................................................................................................................48
RF power supply configuration .......................................................................................................49
RF block diagram ................................................................................................................................50
Antenna switch (TX/RX switch) ......................................................................................................51
Receiver ............................................................................................................................................. 52
Transmitter ....................................................................................................................................... 52
Frequency synthesizer ................................................................................................................... 52
Signal paths .........................................................................................................................................53
Receiver signal paths..................................................................................................................... 53

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Transmitter signal paths............................................................................................................... 55
Frequency synthesizer signals..................................................................................................... 56
Printed Wired Board ............................................................................................................................ 57
RF key component placement .........................................................................................................58
Appendix 7A: Differentiation between RH-37 and RH-49 ............................................. 61
Differentiation between 900 MHz and 850 MHz (US) version (RH-37 vs. RH-49)........... 62
Antenna radiator (I039) and deco foil (I041) .............................................................................62
RF components ....................................................................................................................................62
MCU-SW ................................................................................................................................................. 65
Tuning ....................................................................................................................................................65
Flash exchange...................................................................................................................................... 66
Tuning and testing.......................................................................................................................... 67
Power Amplifier / Antenna Switch Exchange............................................................................... 69

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Glossary of Terms
ACI Accessory Control Interface
ADC Analogue to Digital Converter
AFC Automatic Frequency Control
ASIC Application Specific Integrated Circuit
ASM Antenna switch module
BB Baseband
BSI Battery Size Indicator
DCT4 Digital Core Technology, generation 4
DSP Digital Signal Processor
DUT Device under test
EDGE Enhanced Data Rates for Global Evolution
EGPRS Enhanced General Packed Radio Service
EMC Electro Magnetic Compatibility
ESD Electro Static Discharge
FC Functional Cover
FR Full Rate
GMSK Gaussian Minimum Shift Keying
GPRS General Packed Radio Service
GSM Global System for Mobile Communication
GSM900 GSM900 (channels 1 - 124)+extended GSM900 (channels 975 - 1023, 0)
HSCSD High Speed Circuit Switched Data
HW Hardware
IF Interface
IHF Integrated Hands Free

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IMEI International Mobile Equipment Identity
I/O Input/Output
IR Infrared
IrDA Infrared Data Association
LCD Liquid Crystal Display
LED Light Emitting Diode
LDO Low Drop Out
LNA Low Noise Amplifier
LO Local Oscillator
MCU Micro Controller Unit
PA Power Amplifier
Phoenix SW tool of DCT4
PLL Phase Locked Loop
PWB Printed Wired Board
RF Radio Frequency
RTC Real Time Clock
RX Receiver
SA Spectrum analyzer
SIM Subscriber Identification Module
SW Software
TP Test point
TX Transmitter
UEMEK Universal Energy Management ASIC enhanced version
UI User Interface

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UPP Universal Phone Processor
USB Universal Serial Bus
VBU<COFF> Back-up Battery Cut Off voltage (typical: 2.0 V)
VCO Voltage controlled oscillator
VCTCXO Voltage controlled temperature compensated oscillator
V<MSTR+> Master Reset Threshold (typical: 2.1 V)
8-PSK Phase Shift Keying with 8 states (Modulation scheme for EDGE/EGPRS)

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Baseband
The RH-37 product is a DCT4.5 Expression segment phone. There are two variants: An
EGSM900/GSM1800/GSM1900 phone and a US variant, RH 49, with GSM850/1800/
1900.
The HW has the following features:
• GPRS and HSCSD with EDGE in up to (2RX + 2TX) (MCS5), without EDGE also in
(3RX + 1TX) (MCS6)
• DCT4 with AMR and 16 MIDI tones
• 128/16 Mbit Combo memory
• Amazon Active display with 64k colours
•BatteryBL-5B
• Illuminated XPress on grips
• PopPortTM interface
• 5-way navigation key with select
• FCI rear side (C-cover)
•VGACamera
•Vibra
•IHF
The RH-37 BB is based on the DCT4/4.5 engine and is compatible to the PopPortTM
accessories. The DCT4/4.5 engine consists basically of two ASICs. The UEMEK (Universal
Energy Management IC including voltage regulators, charge control and audio circuits,
audio IFH amplifier from DCT4.5) and the UPP (Universal Phone Processor including MCU,
DSP and RAM from DCT4).

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Block diagram
Figure 1: Baseband block diagram
UEMEK supplies both baseband and RF with power via built in voltage regulators, which
are connected to the battery. The RF parts use mainly 2.78 V and the baseband parts 1.8V
I/O voltage. The UPP core is supplied with programmable core voltage of 1.0V, 1.3V or
1.5V. UEMEK includes 7 linear LDO (Low Drop-Out) regulators for baseband and 7 regula-
tors for RF. It also includes 4 current sources for biasing purposes and internal usage. The
UEMEK is furthermore supplying the SIM interface with a programmable voltage of 1.8V
or 3V.
Note: 5V SIM cards are no longer supported by DCT-4 generation Baseband.
UPP operates from a 26 MHz clock coming from the RF ASIC Helgo. The clock signal is
divided by two down to the nominal system clock frequency of 13 MHz. The DSP and
MCU contain PLLs, which can multiply the system clock to a higher frequency.
A real time clock function is integrated into the UEMEK, which utilizes the same 32kHz
clock supply as the sleep clock.
The communication between UEMEK and UPP is implemented using two bi-directional
serial busses, CBUS and DBUS. The CBUS is controlled by the MCU and operates at a

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speed of 1 MHz. The DBUS is controlled by the MCU and operates at a speed of 13 MHz.
Both processors are located in the UPP.
The UEMEK ASIC handles the analog interface between the Baseband and the RF section.
UEMEK provides A/D and D/A conversion of the in-phase and quadrature receive and
transmit signal paths and also A/D and D/A conversions of received and transmitted
audio signals to and from the user interface. The UEMEK supplies the analog TXC and
AFC signals to the RF section according to UPP signal control. There are also separate
signals for PDM coded audio. Digital speech processing is handled by the DSP inside UPP
ASIC.
UEMEK is a dual voltage circuit, the digital parts are running from the baseband supply
1.8V and the analog parts are running from the analog supply 2.78V. Also VBAT is
directly used (Vibra, LED-driver, Camera Regulator, FCI).
The Baseband supports both internal and external microphone inputs and speaker out-
puts. Keypad tones, DTMF, and other audio tones are generated and encoded by the UPP
and transmitted to the UEMEK for decoding. An external vibra alert control signals are
generated by the UEMEK with separate PWM outputs.
EMC shielding is implemented using a soldered shielding, RF cans and PWB grounding.

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Environmental Specifications
Absolute maximum ratings
Table 1: Absolute maximum ratings
Temperature conditions
Table 2: Temperature conditions
Humidity and water resistance
Table 3: Humidity conditions
The module is not protected against water.
Signal Note
Battery Voltage (Idle) -0.3…5.5V
Battery Voltage (Call) Max 4.8V
Charger Input Voltage -0.3V …16V
Condition Min Max
Normal operating temperature -10°C+55°C
Reduced functionality -25°C+75°C
Storage -40°C+85°C
Condition Min Max
Relative Humidity 5%
C
95%

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Frequencies in baseband
Table 4: Frequencies in baseband
PWB
Characteristics of the PWB
• Single PWB
• 8 layer board
• Double side assembled
Key components
Figure 2: Key components
Frequency Context UPP UEMEK Flash SIM Comment
100 kHz FCI X X
32 kHz SleepClk X
1 MHz CBUS X X
Up to 1 MHz RFConvClk X X Estimation
6,5 MHz Display IF X
3,25 MHz SIMIF X X Min
13 MHz DBUS, RFBUClik X X
26 MHz RF Clk X
52 MHz Memory Clock X X
D2800 UPP
D1470 HW Accelerator
D3000 Combo
D2200 UEMEK

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Table 5: Key components
Position Component Name Code
D1470 HW Accelerator 4377033
D2800 UPP8M v 3.5 4371105
D2200 UEMEKv2.0 4376371
D3000 Combo Memory (128M NOR + 16M UTRAM) 4347043

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Technical Specifications
Baseband core
UPP
Main characteristics of the used UPP are:
• DSP, LEAD3 16 bit DSP core 32 bit IF max. 200 MHz
• MCU based on ARM7 RISC MCU core max 50 MHz
• Internal 8 Mbit SRAM (PDRAM)
• General purpose UARTS
• SIM card interface
• Accessory interface (ACI)
• Interface control for Keypad, LCD, Audio and UEM control
• Handling of BB-RF Interface
UEMEK
Main characteristics of the used UEMEK are:
• ACI support
• Audio codec
• 11 Channel A/D converter
• Auxiliary A/D converter
• 32 KHz crystal oscillator
• SIM interface and drivers
• Security logic
• Storage of IMEI code
• Buzzer and vibra motor drivers
•PWM
• 2 LED drivers, keyboard and display backlight drivers

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• Voltage reference for analogue blocks
• Charging function
• Baseband regulators
• RF regulators
• RF interface converters
External SRAM and Flash
The Combo-Memory is a multi chip package memory which combines 128 Mbit (8Mx16)
muxed burst multibank flash and 16 Mbit muxed CMOS PSRAM (Pseudo SRAM: DRAM
with SRAM interface).
The combo is supplied by single 1,8 V for read, write and erase operations. For acceler-
ated flash programming, Vpp = 9.0 V has to be applied to VPP input of the combo device.
The combo memory is housed in a 44-ball FBGA.
Figure 3: Combo memory
Energy management
The energy management of RH-37 is based on BB 4.0 architecture. A so-called semi fixed
battery (BL-5B) supplies power primarily to UEMEK ASIC and the RF PA. The UEMEK
includes several regulators to supply RF and Baseband. It provides energy management
including power up/down procedure.
Modes of operation
The baseband engine has six different functional modes: Since the UEMEK controls the
regulated power distribution; each of these states affects the general functionality of the
phone.
1 No supply
2nd
e
PI
1st Chip

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2 Backup
3ActingDead
4Active
5 Sleep
6 Charging
No Supply
In NO_SUPPLY mode, the phone has no supply voltage. This mode is due to the discon-
nection of the main battery and backup battery or low battery voltage level in both of
the batteries.
The phone is exiting from NO_SUPPLY mode when sufficient battery voltage level is
detected. The battery voltage can rise either by connecting a new battery with VBAT >
VMSTR+ or by connecting charger and charging the battery above VMSTR+.
Backup
In BACKUP mode the backup battery has sufficient charge but the main battery can be
disconnected or empty (VBAT < VMSTR and VBACK > VBUCOFF).
The VRTC regulator is disabled in BACKUP mode. VRTC output is supplied without regula-
tion from the backup battery (VBACK). All the other regulators are disabled.
BACKUP mode is not used in RH-37 since the product has no backup battery.
Acting Dead
If the phone is off when the charger is connected, the phone is powered on but enters a
state called ”Acting Dead”. To the user, the phone acts as if it was switched off. A bat-
tery-charging alert is given and/or a battery charging indication on the display is shown
to acknowledge the user that the battery is being charged.
Active
In the Active mode the phone is in normal operation, scanning for channels, listening to
a base station, transmitting and processing information. There are several sub-states in
the active mode depending on if the phone is in burst reception, burst transmission, if
DSP is working etc.
In Active mode the RF regulators are controlled by SW writing into UEMEK´s registers
wanted settings: VR1A can be enabled or disabled. VR2 can be enabled or disabled and
its output voltage can be programmed to be 2.78V or 3.3V. VR4-VR7 can be enabled, dis-
abled, or forced into the low quiescent current mode. VR3 is always enabled in Active
mode.

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Sleep Mode
Sleep mode is entered when both MCU and DSP are in stand–by mode. Both processors
control the sleep mode. When SLEEPX signal (low) is detected UEMEK enters SLEEP
mode. VCORE, VIO and VFLASH1 regulators are put into low quiescent current mode. All
the RF regulators are off in SLEEP. When SLEEPX=1 detected UEMEK enters ACTIVE mode
and all functions are activated.
The sleep mode is exited either by the expiration of a sleep clock counter in the UEMEK
or by some external interrupt, generated by a charger connection, key press, headset
connection etc.
In the sleep mode, VCTCXO is shut down and 32 kHz sleep clock oscillator is used as ref-
erence clock for the Baseband.
Charging
In RH-37, the battery type/size is indicated by a BSI-resistor. The resistor value corre-
sponds to a specific battery capacity. Also BTEMP, NTC resistor, is located on an engine
board.
The battery voltage, temperature, size and current are measured by the UEMEK con-
trolled by the charging software running in the UPP.
The charging control circuitry (CHACON) inside the UEMEK controls the charging current
delivered from the charger to the battery. The battery voltage rise is limited by turning
the UEMEK switch off when the battery voltage has reached 4.2 V. Charging current is
monitored by measuring the voltage drop across a 220 mΩresistor.
Power distribution
Under normal conditions, the battery powers the baseband module. Individual regulators
located within the UEMEK regulate the battery voltage VBAT. These regulators supply the
different parts of the phone. 7 regulators are dedicated to the RF module and 7 to the
baseband module.
The VSIM regulator is able to deliver both 1,8V and 3,0 V DC and thus supporting two
different SIM technologies.
The regulator VCORE is likewise adjustable by the MCU. VCORE supplies the core logic of
the UPP.
The system connector provides a voltage to supply accessories.
The white LEDs need a higher voltage supply than the battery can supply and are fed by a
separate external voltage regulator.
VBAT is directly distributed to the RF power amplifier, FCI and external baseband regula-
tors.

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Figure 4: Power Distribution Diagram
DC characteristics
Supply voltage ranges
Table 6: Battery voltage ranges
Signal Min Nom Max Note
VBAT 3.1V 3.7V 4.2V 3.2V SW cut off
2.95V HW power off
FCI
CAMERA
System Connector
Battery CHACON
RF Regulators
Baseband
Regulators
6
VR2-7
VR1A
VR1B
VIO
VSIM
VCORE
VANA
VFLASH1
RTC
PA Supply
SIM
UPP
Combo
Memor
y
Baseband
UEME
VBAT
VFLASH1
Vout
White LED
Driver
VLED+
VBAT
LCD
VAUX2
VAUX3
LEDs
To RF Parts