NPM Motionnet G9006 User manual

TA600032-EN0/0
Motionnet® Function Expansion LSI
G9006
User’s Manual
RoHS2
2011/65/EU
10

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INDEX
1. Introduction ...............................................................................................................................................................1
1.1 How to use this manual..................................................................................................................................1
1.1.1 Symbol description .......................................................................................................................................1
1.1.2 Terminology ..................................................................................................................................................3
1.1.3 Notations ......................................................................................................................................................4
1.2 Handling the product ......................................................................................................................................5
1.2.1 Storing ..........................................................................................................................................................5
1.2.2 Unpacking.....................................................................................................................................................5
1.2.3 Safety ...........................................................................................................................................................5
1.3 Product Warranty............................................................................................................................................9
1.3.1 Warranty period ............................................................................................................................................9
1.3.2 Warranty scope.............................................................................................................................................9
1.4 Notice .............................................................................................................................................................9
1.5 Confirmation ...................................................................................................................................................9
2. Overview .................................................................................................................................................................10
2.1 Features .......................................................................................................................................................10
2.1.1 'I/O communication' state monitor ..............................................................................................................10
2.1.2 Communication between CPUs .................................................................................................................11
2.1.3 General-purpose one-shot signal output....................................................................................................12
2.1.4 Broadcast command reception...................................................................................................................13
2.1.5 Interrupt occurrence ...................................................................................................................................13
2.2 Configuration ................................................................................................................................................14
2.2.1 Local operation mode (message communication) .....................................................................................14
2.2.2 Monitor operation mode (local information monitor)...................................................................................15
3. Specification............................................................................................................................................................16
3.1 Motionnet® specifications .............................................................................................................................16
3.2 G9006 specifications....................................................................................................................................17
4. Hardware description..............................................................................................................................................18
4.1 External dimensions.....................................................................................................................................18
4.2 Pin layout......................................................................................................................................................20
4.3 Pin list...........................................................................................................................................................21
4.4 Pin description..............................................................................................................................................23
4.4.1 CLK [8]........................................................................................................................................................23
4.4.2 CKSL [5] .....................................................................................................................................................23
4.4.3 RST [23] .....................................................................................................................................................23
4.4.4 SPD0 [1], SPD1 [2].....................................................................................................................................23
4.4.5 SI [44], SO [41], SOEH [43]........................................................................................................................23

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4.4.6 SOEI [46] ....................................................................................................................................................23
4.4.7 MRER [37] ..................................................................................................................................................24
4.4.8 MSEL [38]...................................................................................................................................................24
4.4.9 TOUT [40]...................................................................................................................................................24
4.4.10 BCST [3] ...................................................................................................................................................24
4.4.11 DMOD [47]................................................................................................................................................24
4.4.12 SS [16], SCK [17], MOSI [19], MISO [14].................................................................................................25
4.4.13 A0 [20], A1 [22] .........................................................................................................................................25
4.4.14 PORT0 [25], PORT1 [26], PORT2 [28] ....................................................................................................25
4.4.15 PORT3 [29], PORT4 [31], PORT5 [32], PORT6 [34], PORT7 [35] ..........................................................25
4.4.16 DN0 [28], DN1 [29], DN2 [31], DN3 [32], DN4 [34], DN5 [35]..................................................................25
4.4.17 RSV0 [37], RSV1 [38], RSV2 [40] ............................................................................................................26
4.4.18 SHT0 [11], SHT1 [12] ...............................................................................................................................26
4.4.19 INT [13] .....................................................................................................................................................26
4.4.20 VDD [4, 15, 21, 27, 33, 39, 45].................................................................................................................26
4.4.21 GND [6, 7, 9, 10, 18, 24, 30, 36, 42, 48] ..................................................................................................26
4.5 'Motionnet®' interface....................................................................................................................................27
4.5.1 Single-step connection circuit.....................................................................................................................27
4.5.2 Multi-steps connection circuit .....................................................................................................................28
4.6 '4-wire serial' interface..................................................................................................................................29
4.6.1 Single connection circuit.............................................................................................................................29
4.6.2 Multiple connection circuit ..........................................................................................................................29
5. Software description ...............................................................................................................................................30
5.1 'Motionnet®' access ......................................................................................................................................30
5.1.1 I/O communication......................................................................................................................................30
5.1.2 System communication ..............................................................................................................................30
5.1.3 Broadcast communication ..........................................................................................................................31
5.1.4 Break communication.................................................................................................................................31
5.2 '4-wire serial' access ....................................................................................................................................32
5.2.1 Control method...........................................................................................................................................32
5.2.2 Control commands .....................................................................................................................................35
5.2.3 Registers ....................................................................................................................................................47
5.2.4 Operation commands .................................................................................................................................57
5.2.5 Status (MSTS)............................................................................................................................................59
5.2.6 Port data memory.......................................................................................................................................61
5.2.7 Port change interrupt setting memory ........................................................................................................62
5.2.8 Port change interrupt flag memory .............................................................................................................63
5.2.9 Local LSI connection state memory ...........................................................................................................63
6. Feature Description ................................................................................................................................................64
6.1 Reset ............................................................................................................................................................64
6.1.1 Hardware reset...........................................................................................................................................64
6.1.2 Software reset ............................................................................................................................................64
6.2 Operation mode............................................................................................................................................65
6.2.1 Local operation mode (message communication) .....................................................................................65
6.2.2 Monitor operation mode (local information monitor)...................................................................................67

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6.3 Device number setting..................................................................................................................................69
6.3.1 Device number ...........................................................................................................................................69
6.3.2 Virtual local LSI additional count ................................................................................................................70
6.3.3 Virtual local LSI additional count setting error............................................................................................71
6.4 One-shot signal output .................................................................................................................................72
6.4.1 'General-purpose one-shot 0' signal (SHT0 pin) ........................................................................................72
6.4.2 'General-purpose one-shot 1' signal (SHT1 pin) ........................................................................................74
6.4.3 'Broadcast one-shot' signal (BCST pin)......................................................................................................76
6.5 General-purpose input / output pin control...................................................................................................77
6.6 Relative time management ..........................................................................................................................78
6.6.1 Relative time management counter (RTMC)..............................................................................................78
6.6.2 Relative time latch (RTLT) ..........................................................................................................................78
6.7 ID code reading ............................................................................................................................................78
6.8 Interrupt request ...........................................................................................................................................79
6.8.1 Interrupt request signal...............................................................................................................................79
6.8.2 Interrupt factors ..........................................................................................................................................80
7. Electrical characteristics .........................................................................................................................................86
7.1 Absolute maximum ratings...........................................................................................................................86
7.2 Recommended operating conditions............................................................................................................86
7.3 DC characteristics ........................................................................................................................................87
7.4 AC characteristics ........................................................................................................................................88
7.4.1 Reference clock..........................................................................................................................................88
7.4.2 '4-wire serial' bus........................................................................................................................................89

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1. Introduction
Thank you for choosing "Motionnet®" Function Expansion LSI "G9006" for your application this time.
This manual describes the specifications, functions, connecting methods, and usages of "G9006".
Be sure to read this manual thoroughly and keep it handy in order to use this product appropriately.
1.1 How to use this manual
1. Reproduction of this manual in whole or in part without permission is prohibited by the Copyright Act.
2. The contents of this manual are subject to change without prior notice along with the improvement of performance and
quality.
3. Although this manual is produced with the utmost care, please contact our sales representative if there are any questions,
errors or omissions.
1.1.1 Symbol description
1.1.1.1 Physical damage level
In this manual, the physical damage level is defined as follows.
•Serious injury
Those that might cause aftereffects such as loss of sight, injury, burn, electric shock, fracture, poisoning, or those
requiring hospitalization or long-term outpatient treatment.
•Minor injury
Those not requiring hospitalization or long-term outpatient treatment. (Other than "serious injury" above)
1.1.1.2 Hazardous level
The product is designed with the top priority for the safety of operators. However, due to the nature of the product, there are
risks that cannot be eliminated. In this manual, the seriousness and level of these risks are divided into three categories:
"Danger," "Warning," and "Caution". Be sure to read and understand the symbols descriptions thoroughly before operating or
performing maintenance work on the product.
"Danger", "Warning", and "Caution" are indicated in the order of severity of hazard: (danger > warning > caution), and the
meanings are described underneath.
D a n g e r
"Danger" indicates that it might cause an imminent risk that could result in the death or serious injury of the operator during
operations of this product.
War n i n g
"Warning" indicates that it may result in the death or serious injury of the operator during operations of this product.
C a u t i o n
"Caution" indicates that it may result in minor injury of the operator during operations of this product.

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Cau t i o n
"Caution" without warning symbol indicates that the operator is not likely to be injured, but it can cause damage or
result in a malfunction to this product or your instruments.
In addition to the hazardous level classifications described above, the following notations are also used.
I m p o r t a n c e
"Importance" indicates the information and contents that must be known particularly in operations and maintenance works of
this product.
R e m a r k s
"Remarks" indicates the useful information or contents for operations and maintenance works of this product.
1.1.1.3 Warning symbol
In this manual, the following symbols are added along with the notations "danger," "Warning," "Caution," and "Importance" to
indicate the warning contents in an easy-to-understand manner.
This symbol indicates that mishandling may cause a fire.
This symbol indicates "prohibited” actions that must not be performed in the
operation and the maintenance work of this product.
This symbol indicates “mandatory” actions that must be performed in the
operation and the maintenance work of this product.
This symbol indicates that a high voltage may be applied.
Failure to confirm safety or mishandling of the product might cause a risk of
electric shock, burn, or death.
This symbol indicates that some parts have a high surface temperature and
the mishandling can cause a risk of burns.

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1.1.2 Terminology
Terminology used in this manual is described below.
Refer to the following web page for terms that are not described in this section:
<https://www.pulsemotor.com/technology/terms/> [only Japanese]
Table 1.1-1 Motionnet® Product Lineup
Device
Type
Model
Product
CPU
Center
Center LSI
-
G9001A
Necessary
Local
Local LSI
I/O device
G9002A
Unnecessary
G9205A
Unnecessary
G9006
Necessary
Data device
G9103C
Optional
G9004A
Optional
Monitor
-
-
G9006
Necessary
Hub
HUB-LSI
-
G9H50A
Unnecessary
⚫Center LSI
LSI product "G9001A".
⚫Local LSI
LSI products such as "G9002A", "G9103C", "G9004A", and "G9205A".
⚫Center CPU
CPU connected to "Center LSI".
⚫Local CPU
CPU connected to "Local LSI".
⚫Request frame
Request from "Center LSI" to "Local LSI".
This includes the "Device number" of the destination.
⚫Response frame
Response from "Local LSI" to "Center LSI".
This includes the "Device number" of the sender.

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1.1.3 Notations
(1) Negative logic pin names and negative logic signal names are not decorated with overline, etc.
For details on the logic, see "4.3 Pin list".
(2) "0" in bit description of registers indicates that only "0" can be written and only "0" can be read out.
(3) The specific bit of status and register are shown as "status name. bit name" or "register name. bit name".
(For example, RADD.MONI represents the MONI bit in RADD register.)
(4) If there is a description of time, the value at "Internal clock frequency = 40 MHz" is shown unless otherwise
specified.
(5) Regarding the signal state of "ON" or "OFF", "H level" or "1" indicates "ON" in the case of positive logic.
"L level" or "0" indicates "ON" in the case of negative logic.
(6) The numeric suffix "b" represents a binary number, and "h" represents a hexadecimal number.
No suffix is added to a decimal number.
Even if it is a binary or hexadecimal number, a suffix is not added in some graphs when the binary or hexadecimal
number is the same as the decimal number.
(7) The range of consecutive bit positions is indicated by " : ".
(For example, MSTS [7:0] represents the 7th to 0th bits of MSTS.)

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1.2 Handling the product
1.2.1 Storing
Store the product in an environment where condensation does not occur at a temperature of -65 to +150°C.
1.2.2 Unpacking
When unpacking, make sure that the ordered quantity of product and moisture-proof desiccant are included.
1.2.3 Safety
This section describes basic safety precautions for safer operations.
Follow the instructions below when you use the product. Failure to comply with the items may result in injuries or disasters.
1.2.3.1 Precautions for design
C a u t i o n
⚫Use a product within the range of rated voltage, temperature, input / output voltage, and current. If it
is used outside the rated range, the failure rate may increase even if it operates normally during a
short period of time. Even within a rated range, the failure rates vary with the operating temperature
and the voltage. Take this into account when designing your equipment. Do not exceed the absolute
maximum rating even for a moment.
⚫Avoid the influence of heat generation from the surroundings and keep the ambient temperature of
the LSI as low as possible.
⚫Latch-up phenomenon can cause heat and smoke, so be aware of the following:
Be sure to keep the voltage levels of input / output pins within the absolute maximum rating ranges.
Consider the power-on timing.
Make sure that no abnormal noise enters LSI.
Unused input pins must be connected to VDD or GND, or must be pulled-up or pulled-down.
Pull-up or pull-down the potential of unused bidirectional pins.
Do not short-circuit the output.
Protect against induction or static electricity etc. from a high-voltage generator circuit.
⚫Do not apply excessive voltage to the LSI due to noise, surge, static electricity, etc.

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1.2.3.2 Precautions for transportation and storage
C a u t i o n
⚫Handle LSIs and LSI packages with care. Do not throw or drop LSIs. Otherwise, the LSI may be
damaged, or the aluminum laminate package may be broken so that the airtightness may be impaired.
⚫Do not store it where there is a risk of getting wet or being exposed to direct sunlight.
⚫Do not store it where toxic gas (corrosive gas, etc.) is generated or where there is a lot of dust.
⚫When storing the product, use an antistatic storage container to prevent pressure on the LSI.
⚫Follow the shipping box precautions during transportation and storage.
⚫Keep storage temperature and humidity below 30°C and 70% RH.
⚫Store in a place with little temperature change.
⚫Rapid temperature changes during storage can cause condensation which cause lead wire oxidation
and corrosion that reduce solder wettability.
⚫Install an antistatic mat on the surface of storage shelf and ground the mat surface.
(resistance between surface and ground is 7.5 × 105 to 1 × 109 Ω)
⚫When re-storing LSI after removing it from its package, use an antistatic storage container.

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1.2.3.3 Precautions for handling environment
C a u t i o n
⚫Considering the moisture absorption after opening a moisture-proof packaging product, the humidity
level should be 40 to 70% as a guide.
⚫Ground the device and the jig in the work area.
⚫To prevent static electricity, place a conductive mat on the floor surface, and ground the work floor.
(resistance between the surface and ground is 1 × 109 Ω or less)
⚫Place a conductive mat to ground the workbench surface.
(resistance between the surface and ground is 7.5 × 105 to 1 × 109 Ω)
⚫Workbench surface must not be metal. If it is made of metal, it has a low resistance and an electrified
LSI may be discharged suddenly when touched.
⚫When lifting LSI surface with an aspirator, take an antistatic measure such as using conductive rubber
at the tip of contacting area.
⚫Do not allow any charged objects (work clothes, human body, etc.) to touch the LSI.
⚫The surface of displays (such as CRTs) in the work area must have an office automation device filter
to shield static electricity. Refrain from turning the power on or off during work.
⚫Use a conductive cover or a conductive caster for a work chair, and ground it to the floor.
(resistance between the seating surface and ground is 1 × 1010 Ω or less)
⚫The operator must wear a wrist strap and ground through a resistor.
(resistance between the surface and ground is 7.5 x 105 to 3.5 x 107 Ω when wearing the wrist strap)
⚫Handle LSIs and LSI packages carefully, and avoid mechanical vibration or shock as much as
possible.

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1.2.3.4 Precautions for mounting
C a u t i o n
⚫Plastic packages absorb moisture easily. Even if they are stored indoors, they can absorb moisture as
time passes. If you put the LSI in a reflow oven leaving moisture absorbed, cracks may occur in the
resin or adhesion between the resin and the frame may deteriorate.
⚫If you are worried about moisture absorption, dry the package thoroughly before reflowing the solder.
Dry the packages for 20 hours or more to 36 hours or less at 125 ± 5°C.
Can be dried up to twice.
⚫Basically, if 30 days passes after opening the moisture proof bag, the LSI will need to be dried. When
soldering by a complete heating method such as infrared reflow, please work under the following
conditions. Reflow can be done up to twice.
The temperature profile of an infrared reflow furnace must be within the range shown in the figure below
(the temperatures shown are at the surface of the plastic package).
⚫Dip soldering method can cause rapid temperature change in the package and may damage the LSI.
Therefore, do not use this method.
⚫Hand soldering work using a soldering iron should be done under the following conditions:
Maximum temperature of the soldering iron at 350°C, maximum for 5 seconds, and twice or less.
Be careful that the soldering iron does not touch anywhere other than lead part, such as the package
body.
[Profile (compatible with lead-free soldering)]
200
255
Package body surface temperature ℃
260
220
Preheating
140 to 200 ℃
60 to 120 seconds
Main heating
220 ℃or more
Within 60 seconds
255℃, within 10 seconds
Time s
140

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1.3 Product Warranty
1.3.1 Warranty period
The warranty period is one year from the date of delivery to an assigned place.
1.3.2 Warranty scope
If any defect is found in a product during the warranty period under the normal use following this document, NPM will replace
the product without charge.
However, the following cases are not covered by the warranty even during the warranty period.
1) Products modified or repaired by anyone other than NPM or anyone not authorized by NPM.
2) Defects that result from dropping after the delivery or mishandling in transit.
3) Natural deterioration, wearing, and fatigue of parts.
4) Defects result from any usage other than the original described in this manual.
5) Defects result from natural disaster or force majeure such as fires, earthquakes, lightning strikes, winds, floods, salts or
electrical surges.
6) Defects or damages result by a cause that is not the fault of NPM.
When the product is purchased from a supplier other than NPM, please contact that supplier regarding the product’s warranty.
This warranty covers the product itself. The detriments induced by the product failure etc. will not be covered by the warranty.
1.4 Notice
This document aims to describe the details of functions of the product. It does not warrant fitness for a particular purpose of the
customer. The examples of applications and circuit diagrams in this manual are included only for your reference. Please confirm
the features and the safeties of devices or equipment before use.
1.5 Confirmation
Please do not use this product in the following applications. If you need to use in the following applications, please contact our
sales representatives:
1. Any equipment that may require a high reliability or a safety, such as nuclear facilities, electricity or gas supply systems,
transportation facilities, vehicles, various safety systems, medical equipment, etc.
2. Any equipment that may directly affect human survivals or properties.
3. Usages under conditions or circumstances that are not specified in the catalog, manual, etc.
For applications that may cause serious damages to a human life or property due to failure of this product, ensure high reliability
and safety by redundant design.

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2. Overview
"G9006" receives all "I/O communication" of the connected transmission line.
The same data as "Port data area" of "Center LSI" is automatically saved in "Port data memory" of "G9006".
2.1 Features
"G9006" has a 256-byte "Port data memory".
This is shared by "Motionnet®" control circuit and "4-wire serial" control circuit.
2.1.1 'I/O communication' state monitor
The "Port data memory" is divided into 4 bytes as follows, and a total of 64 blocks are managed.
Each block corresponds to the "Device number" assigned to "Local LSI" on the transmission line.
"G9006" receives all "I/O communication" on the transmission line and stores "Port data" in each block of "Port data memory".
The "Local CPU" can monitor the state of all "I/O communication" on the transmission line by reading this "Port data memory".
This function does not work before connecting to "Motionnet®" with "Operation command" from "Local CPU".
Motionnet®
transmission line
G9006
Motionnet®
control
circuit
4-wire serial
control circuit
0
1
2
3
4
5
6
7
251
252
253
254
255
Local CPU
Address Memory (8 bit)
250
8
9
0
1
2
3
4
5
6
7
250
251
252
253
254
255
Address Memory (8 bit)Block
8
9
0
1
2
62
63

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2.1.2 Communication between CPUs
For example, assume that the "Device number" of "G9006" is set to "1".
In addition, assume that all "Port attributes" of "G9006" are set to "Input attribute".
At this time, the "Local CPU" can write to block "1".
The "Local CPU" can read all blocks.
The "Port data" written to block "1" is automatically transferred to the "Center LSI" by "I/O communication".
The "Center CPU" can exchange data with the "Local CPU" by accessing the "Center LSI".
At this time, "G9006" on the transmission path can be handled as "I/O device" from "Center LSI".
"I/O communication" of "Motionnet®" can communicate 4 bytes of data for each "Local LSI".
"G9006" can communicate data exceeding 4 bytes by adding a "Virtual local LSI".
The "Virtual local LSI" can add up to seven stations.
"G9006" can communicate up to 32 bytes of data using the "Device numbers" of a total of eight stations.
The "Device number" of the "Virtual local LSI" is a consecutive number from the "Device number" of "G9006".
0
1
2
3
4
5
6
7
250
251
252
253
254
255
Address Memory (8 bit)Block
8
9
0
1
2
62
63
G9006
4-wire serial
control circuit Local CPU
Device number
(Set to "1")
Port attributes
(Set all to input ports)
0
1
2
3
4
5
6
7
Address Memory (8 bit)Block
20
21
0
1
5
G9006
4-wire serial
control circuit Local CPU
Device number
(Set to "1")
Virtual local LSI
("3" added)
8
9
10
11
2
12
13
14
15
3
16
17
18
19
4

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For example, suppose three "Virtual local LSIs" are added and the "Device numbers" are "1" to "4".
The "Local CPU" can access to these four consecutive blocks.
When all "Port attribute" of "G9006" is set to "Input attribute", the "Local CPU" can write "Port data" to these blocks.
The "Center LSI" can be controlled in the same way as the configuration where four "I/O devices" are connected to the
transmission line.
This function does not work when "Monitor operation mode" is set from "Local CPU".
This function does not work even before connecting to "Motionnet®" with "Operation command" from "Local CPU".
2.1.3 General-purpose one-shot signal output
A "General-purpose one-shot" signal can be output from a dedicated external pin according to the trigger signal input.
The relationship between the trigger signal input and the "General-purpose one-shot" signal output is shown below.
(1) Trigger signal
The following four trigger signals can be selected from "Local CPU".
1. "Operation command" execution from "Local CPU"
2. Signal input from external pin of general-purpose port 0
3. Signal input from external pin of general-purpose port 1
4. Signal input from external pin of general-purpose port 2
When a general-purpose port is selected for the trigger signal, a filter can be set for the trigger signal.
The signal logic of the trigger signal can also be selected.
The trigger signal is ignored while delaying the output of the "General-purpose one-shot" signal.
The trigger signal is ignored while the "General-purpose one-shot" signal is being output.
(2) One-shot signal output delay
The delay time from trigger signal input to "General-purpose one-shot" signal output can be set from "Local CPU".
The delay time can be set in the range of 0 μs to 6553500 μs (6.5535 s) in 100 μs increments.
G9006
Device number
(Set to "1")
Virtual local LSI
("3" added)
Cneter LSI
I/O device
(Own device)
I/O device
(Virtual local LSI)
I/O device
(Virtual local LSI)
I/O device
(Virtual local LSI)
Block "1" Block "2" Block "3" Block "4"
Real Virtual Virtual Virtual
Trigger
One-shot
(3)
(2)
(1)

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(3) Pulse width of "General-purpose one-shot" signal
The pulse width of the "General-purpose one-shot" signal can be set from "Local CPU".
The pulse width can be set in the range from 0 μs to 12700 μs (12.7 ms) in 100 μs steps.
The logic of the "General-purpose one-shot" signal can also be selected.
2.1.4 Broadcast command reception
"G9006" can receive a "Request frame" of "Broadcast communication".
The "Request frame" is composed of "Broadcast command" including "Group number" ("ggg" bit).
Only the following "Broadcast commands" can be executed with "G9006".
Broadcast command
Symbol
Description
0010 0ggg 0001 0000
BCSHT
Output "Broadcast one-shot" signal from external pin.
This function does not work when "Monitor operation mode" is set from "Local CPU".
This function does not work even before connecting to "Motionnet®" with "Operation command" from "Local CPU".
2.1.5 Interrupt occurrence
"G9006" can output an "Interrupt request" signal to the "Local CPU".
The "Interrupt factors" that output the "Interrupt request" signal are as follows.
1. Device setting change error
2. Port data write error
3. Port data write processing error
4. Port change event
5. Broadcast command reception event
6. Relative time management counter digit overflow event
7. Port change interrupt information acquisition failure event
8. Motionnet® communication timeout event
To stop outputting the "Interrupt request" signal, clear all "Interrupt factors" in "Status".
The method of clearing the "Interrupt factor" differs depending on the "Interrupt factor".

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2.2 Configuration
"G9006" can be used as "Local" (peripheral device) to participate in "Motionnet®".
It can also be used as a "Monitor" (monitoring device) for monitoring "Motionnet®".
In either case, a "Local CPU" is required.
The "Local CPU" is connected to "G9006" using a 4-wire serial bus.
2.2.1 Local operation mode (message communication)
"G9006" is connected as "Local" of "Motionnet®".
"Center LSI" recognizes the connected "G9006" as an "I/O device".
The "Center CPU" can communicate with "Local CPU" via "G9006".
The "Local CPU" can read the "Port data" of all "Local LSI" via "G9006".
Communication can be performed between each "Local CPU" via each "G9006".
For "G9006" in "Local operation mode", "Device number" and "Virtual local LSI additional count" can be set.
"Device number" is the number to identify "G9006" as a "Local LSI".
"Virtual local LSI addition count" is the number of "virtual local LSIs" to be added to "G9006".
The "Device number" of the "Virtual local LSI" is a consecutive number from the "Device number" of "G9006".
For example, set "Device Number" of "G9006" to "3" and add two "Virtual Local LSI" stations.
In this case, "4" and "5" are set in "Device number" of "Virtual local LSI".
"G9006" with seven additional "Virtual local LSIs" is recognized as an "I/O device" of eight stations from the "Center LSI".
The data size that the "I/O device" can communicate is 4 bytes per device, so the "Local CPU" can communicate a total of 32
bytes.
Center
Local
G9006
(local)
G9001A
G9002A G9103C
Local
CPU
Local
CPU
virtual
(local)
Virtual
(local)
G9006
(local)
Center
CPU
D/A
Converter
etc.

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2.2.2 Monitor operation mode (local information monitor)
"G9006" is connected as a "Monitor" for "Motionnet®".
"Center LSI" does not recognize the connected "G9006".
The "Local CPU" can read the "Port data" of all "Local LSI" via "G9006".
"G9006" in "Monitor operation mode" does not use "Device number".
The "Device number" set to "G9006" does not affect "Motionnet®".
"G9006" can also be connected to "Motionnet®" where 64 "Local LSIs" are already connected.
"G9006" receives all "I/O communication", but it does not transmit any signals.
Local
Monitor
Center
Local
G9001A
Local
CPU
Center
CPU
G9006
(monitor)
G9004A
G9205A
G9006
(local)
G9006
(local)
Local
CPU
Local
CPU

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3. Specification
This chapter shows specifications such as the performance of "G9006".
3.1 Motionnet® specifications
This section shows the specifications of "Motionnet®".
Item
Content
Reference clock [MHz]
40 or 80
*1
Transmission speed [Mbps]
2.5, 5, 10 or 20
*2
Response speed [μs]
15.1 / Local LSI (at a transmission speed of 20 Mbps)
*3
Communication interface
RS-485 and pulse transformer
*4
Communication cable type
Dedicated cable or LAN cable (category 5 or higher)
Communication cable length [m]
100 (max), 0.6 (min)
*5
Total extension of communication cable [m/line]
100
Connection method
Multi-drop
Number of local LSI connections
Up to 64 stations
R e m a r k s
*1 CLK signals of 40 MHz can be input to the reference clock.
If the duty ratio is unlikely to be 50%, such as when connecting multiple LSIs to a single crystal oscillator, it is
recommended that CLK signals of 80 MHz be input as the reference clock.
Which reference clock is input can be selected with the "CKSL" pin.
Whichever you choose, the internal clock frequency is always 40 MHz. The maximum speed is unchanged at 20 Mbps.
*2 The transmission speed is selected with the "SPD0" and "SPD1" pins.
The transmission speed of all LSIs used in one "Motionnet®" must be the same.
*3 When the transmission speed is 20 Mbps, the transmission cycle is less than 1 ms (966.4 μs) in a network of up to 64
stations.
*4 A system using a pulse transformer is recommended.
*5 When the length of the communication cable connecting the "Local LSI" is shorter than 0.6 m, consider a multi-stage
connection circuit on the same board.
For details, see "4.5.2 Multi-steps connection circuit".