NPM Motionnet G9006 User manual

TA600032-EN0/0
Motionnet® Function Expansion LSI
G9006
User’s Manual
RoHS2
2011/65/EU
10

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INDEX
1. Introduction ...............................................................................................................................................................1
1.1 How to use this manual..................................................................................................................................1
1.1.1 Symbol description .......................................................................................................................................1
1.1.2 Terminology ..................................................................................................................................................3
1.1.3 Notations ......................................................................................................................................................4
1.2 Handling the product ......................................................................................................................................5
1.2.1 Storing ..........................................................................................................................................................5
1.2.2 Unpacking.....................................................................................................................................................5
1.2.3 Safety ...........................................................................................................................................................5
1.3 Product Warranty............................................................................................................................................9
1.3.1 Warranty period ............................................................................................................................................9
1.3.2 Warranty scope.............................................................................................................................................9
1.4 Notice .............................................................................................................................................................9
1.5 Confirmation ...................................................................................................................................................9
2. Overview .................................................................................................................................................................10
2.1 Features .......................................................................................................................................................10
2.1.1 'I/O communication' state monitor ..............................................................................................................10
2.1.2 Communication between CPUs .................................................................................................................11
2.1.3 General-purpose one-shot signal output....................................................................................................12
2.1.4 Broadcast command reception...................................................................................................................13
2.1.5 Interrupt occurrence ...................................................................................................................................13
2.2 Configuration ................................................................................................................................................14
2.2.1 Local operation mode (message communication) .....................................................................................14
2.2.2 Monitor operation mode (local information monitor)...................................................................................15
3. Specification............................................................................................................................................................16
3.1 Motionnet® specifications .............................................................................................................................16
3.2 G9006 specifications....................................................................................................................................17
4. Hardware description..............................................................................................................................................18
4.1 External dimensions.....................................................................................................................................18
4.2 Pin layout......................................................................................................................................................20
4.3 Pin list...........................................................................................................................................................21
4.4 Pin description..............................................................................................................................................23
4.4.1 CLK [8]........................................................................................................................................................23
4.4.2 CKSL [5] .....................................................................................................................................................23
4.4.3 RST [23] .....................................................................................................................................................23
4.4.4 SPD0 [1], SPD1 [2].....................................................................................................................................23
4.4.5 SI [44], SO [41], SOEH [43]........................................................................................................................23

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4.4.6 SOEI [46] ....................................................................................................................................................23
4.4.7 MRER [37] ..................................................................................................................................................24
4.4.8 MSEL [38]...................................................................................................................................................24
4.4.9 TOUT [40]...................................................................................................................................................24
4.4.10 BCST [3] ...................................................................................................................................................24
4.4.11 DMOD [47]................................................................................................................................................24
4.4.12 SS [16], SCK [17], MOSI [19], MISO [14].................................................................................................25
4.4.13 A0 [20], A1 [22] .........................................................................................................................................25
4.4.14 PORT0 [25], PORT1 [26], PORT2 [28] ....................................................................................................25
4.4.15 PORT3 [29], PORT4 [31], PORT5 [32], PORT6 [34], PORT7 [35] ..........................................................25
4.4.16 DN0 [28], DN1 [29], DN2 [31], DN3 [32], DN4 [34], DN5 [35]..................................................................25
4.4.17 RSV0 [37], RSV1 [38], RSV2 [40] ............................................................................................................26
4.4.18 SHT0 [11], SHT1 [12] ...............................................................................................................................26
4.4.19 INT [13] .....................................................................................................................................................26
4.4.20 VDD [4, 15, 21, 27, 33, 39, 45].................................................................................................................26
4.4.21 GND [6, 7, 9, 10, 18, 24, 30, 36, 42, 48] ..................................................................................................26
4.5 'Motionnet®' interface....................................................................................................................................27
4.5.1 Single-step connection circuit.....................................................................................................................27
4.5.2 Multi-steps connection circuit .....................................................................................................................28
4.6 '4-wire serial' interface..................................................................................................................................29
4.6.1 Single connection circuit.............................................................................................................................29
4.6.2 Multiple connection circuit ..........................................................................................................................29
5. Software description ...............................................................................................................................................30
5.1 'Motionnet®' access ......................................................................................................................................30
5.1.1 I/O communication......................................................................................................................................30
5.1.2 System communication ..............................................................................................................................30
5.1.3 Broadcast communication ..........................................................................................................................31
5.1.4 Break communication.................................................................................................................................31
5.2 '4-wire serial' access ....................................................................................................................................32
5.2.1 Control method...........................................................................................................................................32
5.2.2 Control commands .....................................................................................................................................35
5.2.3 Registers ....................................................................................................................................................47
5.2.4 Operation commands .................................................................................................................................57
5.2.5 Status (MSTS)............................................................................................................................................59
5.2.6 Port data memory.......................................................................................................................................61
5.2.7 Port change interrupt setting memory ........................................................................................................62
5.2.8 Port change interrupt flag memory .............................................................................................................63
5.2.9 Local LSI connection state memory ...........................................................................................................63
6. Feature Description ................................................................................................................................................64
6.1 Reset ............................................................................................................................................................64
6.1.1 Hardware reset...........................................................................................................................................64
6.1.2 Software reset ............................................................................................................................................64
6.2 Operation mode............................................................................................................................................65
6.2.1 Local operation mode (message communication) .....................................................................................65
6.2.2 Monitor operation mode (local information monitor)...................................................................................67

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6.3 Device number setting..................................................................................................................................69
6.3.1 Device number ...........................................................................................................................................69
6.3.2 Virtual local LSI additional count ................................................................................................................70
6.3.3 Virtual local LSI additional count setting error............................................................................................71
6.4 One-shot signal output .................................................................................................................................72
6.4.1 'General-purpose one-shot 0' signal (SHT0 pin) ........................................................................................72
6.4.2 'General-purpose one-shot 1' signal (SHT1 pin) ........................................................................................74
6.4.3 'Broadcast one-shot' signal (BCST pin)......................................................................................................76
6.5 General-purpose input / output pin control...................................................................................................77
6.6 Relative time management ..........................................................................................................................78
6.6.1 Relative time management counter (RTMC)..............................................................................................78
6.6.2 Relative time latch (RTLT) ..........................................................................................................................78
6.7 ID code reading ............................................................................................................................................78
6.8 Interrupt request ...........................................................................................................................................79
6.8.1 Interrupt request signal...............................................................................................................................79
6.8.2 Interrupt factors ..........................................................................................................................................80
7. Electrical characteristics .........................................................................................................................................86
7.1 Absolute maximum ratings...........................................................................................................................86
7.2 Recommended operating conditions............................................................................................................86
7.3 DC characteristics ........................................................................................................................................87
7.4 AC characteristics ........................................................................................................................................88
7.4.1 Reference clock..........................................................................................................................................88
7.4.2 '4-wire serial' bus........................................................................................................................................89

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1. Introduction
Thank you for choosing "Motionnet®" Function Expansion LSI "G9006" for your application this time.
This manual describes the specifications, functions, connecting methods, and usages of "G9006".
Be sure to read this manual thoroughly and keep it handy in order to use this product appropriately.
1.1 How to use this manual
1. Reproduction of this manual in whole or in part without permission is prohibited by the Copyright Act.
2. The contents of this manual are subject to change without prior notice along with the improvement of performance and
quality.
3. Although this manual is produced with the utmost care, please contact our sales representative if there are any questions,
errors or omissions.
1.1.1 Symbol description
1.1.1.1 Physical damage level
In this manual, the physical damage level is defined as follows.
•Serious injury
Those that might cause aftereffects such as loss of sight, injury, burn, electric shock, fracture, poisoning, or those
requiring hospitalization or long-term outpatient treatment.
•Minor injury
Those not requiring hospitalization or long-term outpatient treatment. (Other than "serious injury" above)
1.1.1.2 Hazardous level
The product is designed with the top priority for the safety of operators. However, due to the nature of the product, there are
risks that cannot be eliminated. In this manual, the seriousness and level of these risks are divided into three categories:
"Danger," "Warning," and "Caution". Be sure to read and understand the symbols descriptions thoroughly before operating or
performing maintenance work on the product.
"Danger", "Warning", and "Caution" are indicated in the order of severity of hazard: (danger > warning > caution), and the
meanings are described underneath.
D a n g e r
"Danger" indicates that it might cause an imminent risk that could result in the death or serious injury of the operator during
operations of this product.
War n i n g
"Warning" indicates that it may result in the death or serious injury of the operator during operations of this product.
C a u t i o n
"Caution" indicates that it may result in minor injury of the operator during operations of this product.

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Cau t i o n
"Caution" without warning symbol indicates that the operator is not likely to be injured, but it can cause damage or
result in a malfunction to this product or your instruments.
In addition to the hazardous level classifications described above, the following notations are also used.
I m p o r t a n c e
"Importance" indicates the information and contents that must be known particularly in operations and maintenance works of
this product.
R e m a r k s
"Remarks" indicates the useful information or contents for operations and maintenance works of this product.
1.1.1.3 Warning symbol
In this manual, the following symbols are added along with the notations "danger," "Warning," "Caution," and "Importance" to
indicate the warning contents in an easy-to-understand manner.
This symbol indicates that mishandling may cause a fire.
This symbol indicates "prohibited” actions that must not be performed in the
operation and the maintenance work of this product.
This symbol indicates “mandatory” actions that must be performed in the
operation and the maintenance work of this product.
This symbol indicates that a high voltage may be applied.
Failure to confirm safety or mishandling of the product might cause a risk of
electric shock, burn, or death.
This symbol indicates that some parts have a high surface temperature and
the mishandling can cause a risk of burns.

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1.1.2 Terminology
Terminology used in this manual is described below.
Refer to the following web page for terms that are not described in this section:
<https://www.pulsemotor.com/technology/terms/> [only Japanese]
Table 1.1-1 Motionnet® Product Lineup
Device
Type
Model
Product
CPU
Center
Center LSI
-
G9001A
Necessary
Local
Local LSI
I/O device
G9002A
Unnecessary
G9205A
Unnecessary
G9006
Necessary
Data device
G9103C
Optional
G9004A
Optional
Monitor
-
-
G9006
Necessary
Hub
HUB-LSI
-
G9H50A
Unnecessary
⚫Center LSI
LSI product "G9001A".
⚫Local LSI
LSI products such as "G9002A", "G9103C", "G9004A", and "G9205A".
⚫Center CPU
CPU connected to "Center LSI".
⚫Local CPU
CPU connected to "Local LSI".
⚫Request frame
Request from "Center LSI" to "Local LSI".
This includes the "Device number" of the destination.
⚫Response frame
Response from "Local LSI" to "Center LSI".
This includes the "Device number" of the sender.

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1.1.3 Notations
(1) Negative logic pin names and negative logic signal names are not decorated with overline, etc.
For details on the logic, see "4.3 Pin list".
(2) "0" in bit description of registers indicates that only "0" can be written and only "0" can be read out.
(3) The specific bit of status and register are shown as "status name. bit name" or "register name. bit name".
(For example, RADD.MONI represents the MONI bit in RADD register.)
(4) If there is a description of time, the value at "Internal clock frequency = 40 MHz" is shown unless otherwise
specified.
(5) Regarding the signal state of "ON" or "OFF", "H level" or "1" indicates "ON" in the case of positive logic.
"L level" or "0" indicates "ON" in the case of negative logic.
(6) The numeric suffix "b" represents a binary number, and "h" represents a hexadecimal number.
No suffix is added to a decimal number.
Even if it is a binary or hexadecimal number, a suffix is not added in some graphs when the binary or hexadecimal
number is the same as the decimal number.
(7) The range of consecutive bit positions is indicated by " : ".
(For example, MSTS [7:0] represents the 7th to 0th bits of MSTS.)

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1.2 Handling the product
1.2.1 Storing
Store the product in an environment where condensation does not occur at a temperature of -65 to +150°C.
1.2.2 Unpacking
When unpacking, make sure that the ordered quantity of product and moisture-proof desiccant are included.
1.2.3 Safety
This section describes basic safety precautions for safer operations.
Follow the instructions below when you use the product. Failure to comply with the items may result in injuries or disasters.
1.2.3.1 Precautions for design
C a u t i o n
⚫Use a product within the range of rated voltage, temperature, input / output voltage, and current. If it
is used outside the rated range, the failure rate may increase even if it operates normally during a
short period of time. Even within a rated range, the failure rates vary with the operating temperature
and the voltage. Take this into account when designing your equipment. Do not exceed the absolute
maximum rating even for a moment.
⚫Avoid the influence of heat generation from the surroundings and keep the ambient temperature of
the LSI as low as possible.
⚫Latch-up phenomenon can cause heat and smoke, so be aware of the following:
Be sure to keep the voltage levels of input / output pins within the absolute maximum rating ranges.
Consider the power-on timing.
Make sure that no abnormal noise enters LSI.
Unused input pins must be connected to VDD or GND, or must be pulled-up or pulled-down.
Pull-up or pull-down the potential of unused bidirectional pins.
Do not short-circuit the output.
Protect against induction or static electricity etc. from a high-voltage generator circuit.
⚫Do not apply excessive voltage to the LSI due to noise, surge, static electricity, etc.

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1.2.3.2 Precautions for transportation and storage
C a u t i o n
⚫Handle LSIs and LSI packages with care. Do not throw or drop LSIs. Otherwise, the LSI may be
damaged, or the aluminum laminate package may be broken so that the airtightness may be impaired.
⚫Do not store it where there is a risk of getting wet or being exposed to direct sunlight.
⚫Do not store it where toxic gas (corrosive gas, etc.) is generated or where there is a lot of dust.
⚫When storing the product, use an antistatic storage container to prevent pressure on the LSI.
⚫Follow the shipping box precautions during transportation and storage.
⚫Keep storage temperature and humidity below 30°C and 70% RH.
⚫Store in a place with little temperature change.
⚫Rapid temperature changes during storage can cause condensation which cause lead wire oxidation
and corrosion that reduce solder wettability.
⚫Install an antistatic mat on the surface of storage shelf and ground the mat surface.
(resistance between surface and ground is 7.5 × 105 to 1 × 109 Ω)
⚫When re-storing LSI after removing it from its package, use an antistatic storage container.