Texas Instruments TMUXRTJ-RRQEVM User manual

User’s Guide
TMUXRTJ-RRQEVM User's Guide
ABSTRACT
This document is the EVM user’s guide for the TMUXRTJ-RRQEVM, which provides a quick way to evaluate TI
devices that use a 20-pin RTJ or RRQ package.
Table of Contents
1 Introduction.............................................................................................................................................................................2
2 General Texas Instruments High Voltage Evaluation Module (TI HV EVM) User Safety Guidelines...............................5
3 Information About Cautions and Warnings..........................................................................................................................6
4 Features...................................................................................................................................................................................6
5 Header Connections and Test Points................................................................................................................................... 7
6 Setup...................................................................................................................................................................................... 11
7 Layout.................................................................................................................................................................................... 14
8 Schematics............................................................................................................................................................................15
9 Bill of Materials..................................................................................................................................................................... 19
List of Figures
Figure 1-1. TMUXRTJ-RRQEVM Top View................................................................................................................................. 2
Figure 1-2. TMUXRTJ-RRQEVM Bottom View............................................................................................................................3
Figure 1-3. TMUXRTJ-RRQEVM 3D View.................................................................................................................................. 4
Figure 5-1. Header J1 for U1.1.................................................................................................................................................... 7
Figure 5-2. Pinout of Headers......................................................................................................................................................8
Figure 5-3. Thermal Pad Selector................................................................................................................................................8
Figure 5-4. Test Point Colors....................................................................................................................................................... 9
Figure 6-1. DUT Footprint U1.....................................................................................................................................................11
Figure 6-2. Signal Line Circuitry (3D).........................................................................................................................................11
Figure 6-3. Signal Line Circuitry................................................................................................................................................ 12
Figure 6-4. Signal Line Circuitry Bottom Layer.......................................................................................................................... 12
Figure 6-5. Thermal Pad Selector with Shunt............................................................................................................................13
Figure 7-1. Illustration of TMUXRTJ-RRQEVM Layout..............................................................................................................14
Figure 8-1. TMUXRTJ-RRQEVM Schematic Page 1 (Editor View)........................................................................................... 15
Figure 8-2. TMUXRTJ-RRQEVM Schematic Page 2 (Editor View)........................................................................................... 16
Figure 8-3. TMUXRTJ-RRQEVM Schematic Page 1 (DNI).......................................................................................................17
Figure 8-4. TMUXRTJ-RRQEVM Schematic Page 2 (DNI).......................................................................................................18
List of Tables
Table 5-1. Connections by Header Pin Number.......................................................................................................................... 8
Table 5-2. Test Point Connections............................................................................................................................................... 9
Table 9-1. TMUXRTJ-RRQEVM Bill of Materials.......................................................................................................................19
Trademarks
All trademarks are the property of their respective owners.
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TMUXRTJ-RRQEVM User's Guide 1
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1 Introduction
The TMUXRTJ-RRQEVM evaluation module (EVM) and its intended use is described in this user's guide. This
board allows for the quick prototyping and DC characterization of TI’s line of TMUX products that use 20-pin
QFN packages (RTJ or RRQ).
Figure 1-1. TMUXRTJ-RRQEVM Top View
Introduction www.ti.com
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Figure 1-2. TMUXRTJ-RRQEVM Bottom View
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Figure 1-3. TMUXRTJ-RRQEVM 3D View
Introduction www.ti.com
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2 General Texas Instruments High Voltage Evaluation Module (TI HV EVM) User Safety
Guidelines
WARNING
Always follow TI’s setup and application instructions, including use of all interface components within their
recommended electrical rated voltage and power limits. Always use electrical safety precautions to help
ensure your personal safety and those working around you. Contact TI's Product Information Center http://
support/ti./com for further information.
Save all warnings and instructions for future reference.
WARNING
Failure to follow warnings and instructions may result in personal injury, property damage or death
due to electrical shock and burn hazards.
The term TI HV EVM refers to an electronic product typically provided as an open framed, unenclosed
printed circuit board assembly. It is intended strictly for use in development laboratory environments, solely
for qualified professional users having training, expertise and knowledge of electrical safety risks in development
and application of high voltage electrical circuits. Any other use or application are strictly prohibited by Texas
Instruments. If you are not suitably qualified, you should immediately stop from further use of the HV EVM.
1. Work Area Safety
a. Keep work area clean and orderly.
b. One or more qualified observers must be present anytime circuits are energized.
c. Effective barriers and signage must be present in the area where the TI HV EVM and its interface
electronics are energized, indicating operation of accessible high voltages may be present, for the
purpose of protecting inadvertent access.
d. All interface circuits, power supplies, evaluation modules, instruments, meters, scopes and other related
apparatus used in a development environment exceeding 50Vrms/75VDC must be electrically located
within a protected Emergency Power Off EPO protected power strip.
e. Use stable and nonconductive work surface.
f. Use adequately insulated clamps and wires to attach measurement probes and instruments. No
freehand testing whenever possible.
2. Electrical Safety
As a precautionary measure, it is always a good engineering practice to assume that the entire EVM may
have fully accessible and active high voltages.
a. De-energize the TI HV EVM and all its inputs, outputs and electrical loads before performing any
electrical or other diagnostic measurements. Revalidate that TI HV EVM power has been safely de-
energized.
b. With the EVM confirmed de-energized, proceed with required electrical circuit configurations, wiring,
measurement equipment connection, and other application needs, while still assuming the EVM circuit
and measuring instruments are electrically live.
c. After EVM readiness is complete, energize the EVM as intended.
WARNING
While the EVM is energized, never touch the EVM or its electrical circuits, as they could be at
high voltages capable of causing electrical shock hazard.
3. Personal Safety
a. Wear personal protective equipment (for example, latex gloves or safety glasses with side shields) or
protect EVM in an adequate lucent plastic box with interlocks to protect from accidental touch.
Limitation for safe use:
EVMs are not to be used as all or part of a production unit.
www.ti.com General Texas Instruments High Voltage Evaluation Module (TI HV EVM) User Safety Guidelines
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3 Information About Cautions and Warnings
The information in the warning statement is provided for personal protection and the information in the caution
statement is provided to protect the equipment from damage. Read each caution and warning statement
carefully.
CAUTION
This EVM contains components that can potentially be damaged by electrostatic discharge. Always
transport and store the EVM in its supplied ESD bag when not in use. Handle using an antistatic
wristband. Operate on an antistatic work surface. For more information on proper handling, see
Electrostatic Discharge (ESD).
4 Features
The TMUXRTJ-RRQEVM has the following features:
• 3 power supply decoupling capacitors from VDD to GND (three 3.3 µF capacitors)
• 1 protection diode pad from VDD to GND available near power supply (6.9 mm × 5.8 mm)
• 3 power supply decoupling capacitors from VSS to GND (three 3.3 μF capacitors)
• 1 protection diode pad from VSS to GND available near power supply (6.9 mm × 5.8 mm)
• Terminal block power supply connection
• DUT footprint compatible with 20-pin RTJ and RRQ (WQFN) packages
• 20 length-matched signal inputs corresponding to the 20 pins of the DUT
• Selectable connections to VDD, VSS, or GND for each signal input using 2.54 mm shunt
• Footprints for pull-up and pull-down resistors for each signal input (two 0603 footprints on each of 20 signals)
• Footprints for series resistors for each signal input (two 0805 footprints on each of 20 signals)
• Footprints for decoupling capacitors for each input (one 1206 footprint and one 1812 footprint on each of 20
signals)
• 2 test points for each signal input
• Selectable thermal pad connection
• Multiple GND test point connections around board
Information About Cautions and Warnings www.ti.com
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5 Header Connections and Test Points
There are 20 headers located around the board with designators J1 through J20. These 3-by-2 headers serve as
connections to power planes and to signals of the DUT (U1). Each pin of the DUT has similar header and test
point configuration. At four different locations around the board, a legend shows the connections of the pins of
the nearby five headers. Figure 5-1 shows a representation of the header associated with pin 1 of U1.
Figure 5-1. Header J1 for U1.1
The silkscreen legend represents the connections of the pins of J1. Figure 5-2 shows the pin numbers of this
header from this same perspective.
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1 2
5 6
3 4
x VDD
GND VSS
GND U1
Figure 5-2. Pinout of Headers
Table 5-1 also shows the connections.
Table 5-1. Connections by Header Pin Number
Header Pin Number Connection
1 No connection
2 VDD
3 GND
4 U1
5 GND
6 VSS
For all headers J1 through J20, the connections are the same, but are rotated by a multiple of 90° according to
their position on the board. A legend is included for each rotation.
There is one 3-by-1 header located near the DUT (J21). Pin 2 of this header is connected to the thermal pad of
the DUT. Pin 1 of this header is connected to GND, and pin 3 of this header is connected to VSS.
Figure 5-3. Thermal Pad Selector
The connections of J21 are also labeled on the board's silkscreen layer next to the header.
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In addition to headers, multiple test points are located around the board. Black test points (TP22 and TP24-
TP30) are connected to GND, the red test point (TP21) is connected to VDD, and the green test point (TP23) is
connected to VSS. The remaining blue test points (TP1-TP20 and TP101-TP120) are connected along the signal
paths of the pins of U1.
Figure 5-4. Test Point Colors
The last two digits of the blue test point number represent the pin with which the test point is associated. For
example, TP16 and TP116 are both pin 16 of U1.
Table 5-2 also shows the test point connections.
Table 5-2. Test Point Connections
Designator Connection
TP1 J1.4
TP2 J2.4
TP3 J3.4
TP4 J4.4
TP5 J5.4
TP6 J6.4
TP7 J7.4
TP8 J8.4
TP9 J9.4
TP10 J10.4
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Table 5-2. Test Point Connections (continued)
Designator Connection
TP11 J11.4
TP12 J12.4
TP13 J13.4
TP14 J14.4
TP15 J15.4
TP16 J16.4
TP17 J17.4
TP18 J18.4
TP19 J19.4
TP20 J20.4
TP21 VDD
TP22 GND
TP23 VSS
TP24 GND
TP25 GND
TP26 GND
TP27 GND
TP28 GND
TP29 GND
TP30 GND
TP101 U1.1
TP102 U1.2
TP103 U1.3
TP104 U1.4
TP105 U1.5
TP106 U1.6
TP107 U1.7
TP108 U1.8
TP109 U1.9
TP110 U1.10
TP111 U1.11
TP112 U1.12
TP113 U1.13
TP114 U1.14
TP115 U1.15
TP116 U1.16
TP117 U1.17
TP118 U1.18
TP119 U1.19
TP120 U1. 20
Terminal block J25 is the power input for the board. Three power rails (VSS, GND, and VDD) are labeled on the
board’s silkscreen layer, indicating the identities of the input pins of the header. Connect the power supply rails at
this terminal block to power the board.
Header Connections and Test Points www.ti.com
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6 Setup
Figure 6-1. DUT Footprint U1
The TMUXRTJ-RRQEVM will not have any device connected at footprint U1, and there are not any devices
included with the EVM for this footprint. Attach any compatible Texas Instruments 20-pin TMUX device to this
location, which will serve as the Device Under Test (DUT). Compatible devices include parts with RTJ or RRQ
package names.
By default, the TMUXRTJ-RRQEVM will have 2.54 mm shunts on headers J1 through J20 connected such
that the pins of U1 are connected to GND. Remove these shunts from J1 through J20 as necessary if these
connections are not desired. Alternatively, the pins of U1 can be shorted to VDD or VSS by connecting between
pin 4 of the header and one of the other pins on the header. Figure 5-2 and Table 5-1 include detailed
descriptions of the connections on J1 through J20.
Figure 6-2. Signal Line Circuitry (3D)
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As shown in Figure 6-2 and Figure 6-3 as R5 and R6 on the J1 (pin 1 of U1) signal line, the TMUXRTJ-
RRQEVM includes 0 Ω series resistors (0805 package) on each signal line.
Figure 6-3. Signal Line Circuitry
These can be substituted for different resistors as desired. Additionally, there are pads for pull-up and pull-down
resistors to VDD and GND respectively. Add any 0603 resistor to the footprint shown here as R1 to provide
pull-up to VDD, and add any 0603 resistor to the footprint shown here as R13 to provide pull-down to GND.
Each signal line also includes two footprints that allow for the user to attach capacitors or other devices with
matching footprints. On the top side of the board, shown in Figure 6-2 and Figure 6-3 as C1, a standard 1206
footprint exists between the U1 pin signal and the GND signal. The user can solder a capacitor to this footprint to
provide capacitance to the signal line.
Figure 6-4. Signal Line Circuitry Bottom Layer
Figure 6-4 shows that a standard 1812 footprint exists as C101 on the backside of the board, which also allows a
capacitor to be connected between the U1 pin signal and GND. The user can solder a capacitor to this footprint
to provide capacitance to the signal line.
The user can select the connection of the thermal pad of U1 by using the three-by-one header located near U1
(J21).
Setup www.ti.com
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Figure 6-5. Thermal Pad Selector with Shunt
Connecting a shunt between pins 1 and 2 of this header will tie the thermal pad of U1 to GND, while connecting
pins 2 and 3 will tie the thermal pad of U1 to VSS. Leave pin 2 of this header unconnected to allow the thermal
pad to float, or use an external connection to tie the thermal pad to any other potential.
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7 Layout
Figure 7-1 shows the layout of the EVM PCB.
Figure 7-1. Illustration of TMUXRTJ-RRQEVM Layout
Layout www.ti.com
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8 Schematics
Figure 8-1 and Figure 8-2 are schematic views of the TMUXRTJ-RRQEVM that includes all the parts and connections.
Figure 8-1. TMUXRTJ-RRQEVM Schematic Page 1 (Editor View)
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Figure 8-2. TMUXRTJ-RRQEVM Schematic Page 2 (Editor View)
Figure 8-3 and Figure 8-4 are schematic views of the TMUXRTJ-RRQEVM that show only the parts that are included in the EVM and excludes the parts
that are DNI.
Schematics www.ti.com
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1
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INT14 0_P a g e 1.S c hDo c
She e t Title :
Size :
Mod. Da te :
File:
S he e t: of
B http ://www.ti.com
Conta c t: http://www.ti.com /s upp ort
TMUXR TJ -RR QE VMProject Title:
Des ign e d for: Pu b lic Re le as e
Ass e mbly Va rian t: 001
© Te xas In s truments 2021
Dra wn By:
Engine e r: Da n n y Ba cic
Te xa s Ins trum e nts a nd/or its lic e ns ors do not wa rra n t the ac c ura c y or com plete n e s s of this s pe cifica tion or a ny informa tion co nta ine d the re in. Texa s Instrume n ts a n d /or its lice ns o rs do not
warra nt tha t this de sign will m e et the spe cific a tions, will be s uitable for yo ur a pplication or fit for a n y pa rtic ular purpo s e, or will o pe ra te in a n implem e nta tion . Te xa s Ins trum e nts a nd /o r its
lice n s ors d o n ot wa rra n t tha t the de s ign is production worthy. You s hou ld co m plete ly va lida te a n d te s t your de s ign implem e nta tion to confirm the s yste m function a lity for your a pplica tion.
Not in ve rs ion c ontrolSVN Re v:
INT140Num be r: Re v: A
TID #: N/A
Ord e ra ble : Ch a nge Me in va ria nt
TP101TP1
GND
1
VSS
VDD
1.0k
R13
GND
1 2
3 4
5 6
J1
613006 2 112 1
0
R5
GND
VDD
TP21
5005
100V
D1
5.0SMDJ10 0 A
GND
VSS
100V
D2
5.0SMDJ10 0 A
GND
450V
0.1uF
C1
250V
3.3uF
C23
250V
3.3uF
C22
250V
3.3uF
C26
250V
3.3uF
C25
250V
3.3uF
C21
250V
3.3uF
C24
1.0k
R1
VDD
TP105TP5
GND
5
VSS
VDD
1.0k
R29
GND
1 2
3 4
5 6
J5
613006 2 112 1
0
R21
GND
450V
0.1uF
C5
1.0k
R17
VDD
TP109TP9
GND
9
VSS
VDD
1.0k
R45
GND
1 2
3 4
5 6
J9
613006 2 112 1
0
R37
GND
450V
0.1uF
C9
1.0k
R33
VDD
TP26
5011
TP23
5126
GND
TP27
5011
TP28
5011
TP29
5011
TP30
5011
TP25
5011
TP24
5011
TP22
5011
GND
1uF
250V
C1 0 1
1uF
250V
C1 0 5
1uF
250V
C1 0 9
0
R38
0
R6
TP102TP2
GND
2
VSS
VDD
1.0k
R14
GND
1 2
3 4
5 6
J2
613006 2 112 1
0
R7
GND
450V
0.1uF
C2
1.0k
R2
VDD
TP106TP6
GND
6
VSS
VDD
1.0k
R30
GND
1 2
3 4
5 6
J6
613006 2 112 1
0
R23
GND
450V
0.1uF
C6
1.0k
R18
VDD
TP110TP10
GND
10
VSS
VDD
1.0k
R46
GND
1 2
3 4
5 6
J10
613006 2 112 1
0
R39
GND
450V
0.1uF
C10
1.0k
R34
VDD
1uF
250V
C1 0 2
1uF
250V
C1 0 6
1uF
250V
C1 1 0
0
R40
0
R24
0
R8
TP103TP3
GND
3
VSS
VDD
1.0k
R15
GND
1 2
3 4
5 6
J3
613006 2 112 1
0
R9
GND
450V
0.1uF
C3
1.0k
R3
VDD
TP7
GND
7
VSS
VDD
1.0k
R31
GND
1 2
3 4
5 6
J7
613006 2 112 1
0
R25
GND
450V
0.1uF
C7
1.0k
R19
VDD
TP111TP11
GND
11
VSS
VDD
1.0k
R47
GND
1 2
3 4
5 6
J11
613006 2 112 1
0
R41
GND
450V
0.1uF
C11
1.0k
R35
VDD
1uF
250V
C1 0 3
1uF
250V
C1 0 7
1uF
250V
C1 1 1
0
R42
0
R26
0
R10
TP104TP4
GND
4
VSS
VDD
1.0k
R16
GND
1 2
3 4
5 6
J4
613006 2 112 1
0
R11
GND
450V
0.1uF
C4
1.0k
R4
VDD
TP108TP8
GND
8
VSS
VDD
1.0k
R32
GND
1 2
3 4
5 6
J8
613006 2 112 1
0
R27
GND
450V
0.1uF
C8
1.0k
R20
VDD
TP112TP12
GND
12
VSS
VDD
1.0k
R48
GND
1 2
3 4
5 6
J12
613006 2 112 1
0
R43
GND
450V
0.1uF
C12
1.0k
R36
VDD
1uF
250V
C1 0 4
1uF
250V
C1 0 8
1uF
250V
C1 1 2
0
R44
0
R28
0
R12
0
R22
VDD VS S
1 2 3
J25
691 101 710 00 3
GND
1
1
2
2
3
3
4
4
5
5
6
6
7
7
8
8
9
9
1 0
1 0
1 1 1 1
1 2 1 2
1 3 1 3
1 4 1 4
1 5 1 5
1 6 1 6
1 7 1 7
1 8 1 8
1 9 1 9
2 0 2 0
2 1 2 1
20RRQ_Generic_Footprint
U1
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
PAD
TP107
Figure 8-3. TMUXRTJ-RRQEVM Schematic Page 1 (DNI)
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File:
S h ee t: o f
Le tte r h ttp://www.ti.co m
Conta ct: http://www.ti.com/s upport
TMUXRTJ -RRQEVMP roject Title :
De s igne d for: P u blic R e lea s e
Ass e mbly Va riant: 001
© Te xas Ins tru m e nts 2021
Dra wn By:
En gine e r: Da nny Ba cic
Te xa s Ins trume nts a n d/o r its lice n s o rs do not wa rra nt the a ccura cy or co m ple te ne s s of this s pe cifica tion or a n y informa tion conta ine d
the re in. Te xa s Ins trume nts a nd/or its lice ns ors d o not wa rra nt tha t this de s ign will me e t the s p e cifica tions , will be s uita ble for your
a pplica tion or fit for a n y pa rticula r purp os e , or will ope ra te in a n impleme n ta tion . Te xas Ins trume nts a nd/o r its lice n sors do n ot wa rra n t
tha t the d e s ign is p roduction worthy. Yo u s hould complete ly va lida te a nd te s t yo u r de s ign impleme n tation to c o nfirm the s yste m
functiona lity for you r a pplica tion.
Not in ve rs ion con trolS VN Re v:
INT140Numbe r: Re v: A
TID #: N/A
Ord e ra b le : Cha nge Me in va riant
VS S
VDD
1 2
3 4
5 6
J1 3
61300621121
TP13 0
R52
1.0k
R58
1.0k
R49
VDD
450V
0.1uF
C13
GNDGND
TP113
13
GND
1uF
250V
C1 1 3
0
R53
VS S
VDD
1 2
3 4
5 6
J1 4
61300621121
TP14 0
R54
1.0k
R59
1.0k
R50
VDD
450V
0.1uF
C14
GNDGND
TP114
14
GND
1uF
250V
C1 1 4
0
R55
VS S
VDD
1 2
3 4
5 6
J1 5
61300621121
TP15 0
R56
1.0k
R60
1.0k
R51
VDD
450V
0.1uF
C15
GNDGND
TP115
15
GND
1uF
250V
C1 1 5
0
R57
VS S
VDD
1 2
3 4
5 6
J1 6
61300621121
TP16 0
R64
1.0k
R70
1.0k
R61
VDD
450V
0.1uF
C16
GNDGND
TP116
16
GND
1uF
250V
C1 1 6
0
R65
VS S
VDD
1 2
3 4
5 6
J1 7
61300621121
TP17 0
R66
1.0k
R71
1.0k
R62
VDD
450V
0.1uF
C17
GNDGND
TP117
17
GND
1uF
250V
C1 1 7
0
R67
VS S
VDD
1 2
3 4
5 6
J1 8
61300621121
TP18 0
R68
1.0k
R72
1.0k
R63
VDD
450V
0.1uF
C18
GNDGND
TP118
18
GND
1uF
250V
C1 1 8
0
R69
VS S
VDD
1 2
3 4
5 6
J1 9
61300621121
TP19 0
R76
1.0k
R82
1.0k
R73
VDD
450V
0.1uF
C19
GNDGND
TP119
19
GND
1uF
250V
C1 1 9
0
R77
VS S
VDD
1 2
3 4
5 6
J2 0
61300621121
TP20 0
R78
1.0k
R83
1.0k
R74
VDD
450V
0.1uF
C20
GNDGND
TP120
20
GND
1uF
250V
C1 2 0
0
R79
J2 2
2 - 8 8 1 5 4 5 - 2
GND
VS S
PAD
1
2
3
J2 1
61300311121
In assembly, connect J22 between pins 1 and 2 of J21.
Figure 8-4. TMUXRTJ-RRQEVM Schematic Page 2 (DNI)
Schematics www.ti.com
18 TMUXRTJ-RRQEVM User's Guide SCDU027 – AUGUST 2021
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9 Bill of Materials
Table 9-1. TMUXRTJ-RRQEVM Bill of Materials
Designator Component Manufacturer Description Quantity
C21, C22, C23, C24, C25, C26 CKG57NX7T2E335M500JH TDK CAP, CERM, 3.3 µF, 250 V, ± 20%,
X7T, AEC-Q200 Grade 1, 6 × 5 × 5
mm
6
H1, H2, H3, H4 NY PMS 440 0025 PH B&F Fastener Supply Machine Screw, Round, #4-40 × 1/4,
Nylon, Philips panhead
4
H5, H6, H7, H8 1902C Keystone Standoff, Hex, 0.5"L #4-40 Nylon 4
J1, J2, J3, J4, J5, J6, J7, J8, J9, J10,
J11, J12, J13, J14, J15, J16, J17,
J18, J19, J20
61300621121 Wurth Elektronik Header, 2.54 mm, 3 × 2, Gold, TH 20
J21 61300311121 Wurth Elektronik Header, 2.54 mm, 3 × 1, Gold, TH 1
J22 2-881545-2 TE Default shunt positioning: between
pins 1 and 2 of J21
1
J23, J24, J26, J27, J28, J29, J30,
J31, J32, J33, J34, J35, J36, J37,
J38, J39, J40, J41, J42, J43
2-881545-2 TE Default shunt positioning: between
pins 3 and 4 of J1-J20
20
J25 691 101 710 003 Wurth Elektronik Terminal Block, 5 mm, 3 × 1, Tin, TH 1
LBL1 THT-14-423-10 Brady Thermal Transfer Printable Labels,
0.650" W x 0.200" H - 10,000 per roll
1
R5, R6, R7, R8, R9, R10, R11, R12,
R21, R22, R23, R24, R25, R26,
R27, R28, R37, R38, R39, R40,
R41, R42, R43, R44, R52, R53,
R54, R55, R56, R57, R64, R65,
R66, R67, R68, R69, R76, R77,
R78, R79
PMR10EZPJ000 Rohm RES, 0, 0%, W, AEC-Q200 Grade 0,
0805
40
TP1, TP2, TP3, TP4, TP5, TP6,
TP7, TP8, TP9, TP10, TP11, TP12,
TP13, TP14, TP15, TP16, TP17,
TP18, TP19, TP20, TP101, TP102,
TP103, TP104, TP105, TP106,
TP107, TP108, TP109, TP110,
TP111, TP112, TP113, TP114,
TP115, TP116, TP117, TP118,
TP119, TP120
5122 Keystone Test Point, Compact, Blue, TH 40
TP21 5005 Keystone Test Point, Compact, Red, TH 1
TP22, TP24, TP25, TP26, TP27,
TP28, TP29, TP30
5011 Keystone Test Point, Multipurpose, Black, TH 8
TP23 5126 Keystone Test Point, Multipurpose, Green, TH 1
www.ti.com Schematics
SCDU027 – AUGUST 2021
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TMUXRTJ-RRQEVM User's Guide 19
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