NXP Semiconductors UM11697 User manual

UM11697
RDGD31603PSMKEVM three-phase inverter kit
Rev. 1 — 10 December 2021 User manual
Document information
Information Content
Keywords GD3160, gate, driver, power, inverter, Automotive
Abstract The RDGD31603PSMKEVM three-phase inverter is a functional hardware
power inverter reference design which can be used as a foundation to
develop a complete ASIL-D compliant high voltage, high-power traction
motor inverter for electric vehicles. The kit can be used as a double pulse and
short circuit tester to measure key switching parameters, or as a three-phase
inverter for motor control.

NXP Semiconductors UM11697
RDGD31603PSMKEVM three-phase inverter kit
Revision History
Rev Date Description
UM11697 v.1 20211210 Initial version
Revision history
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RDGD31603PSMKEVM three-phase inverter kit
Important notice
NXP provides the enclosed product(s) under the following conditions:
This reference design is intended for use of ENGINEERING DEVELOPMENT OR
EVALUATION PURPOSES ONLY. It is provided as a sample IC pre-soldered to a printed
circuit board to make it easier to access inputs, outputs, and supply terminals. This
reference design may be used with any development system or other source of I/O
signals by simply connecting it to the host MCU or computer board via off-the-shelf
cables. The final device in an application will be heavily dependent on proper printed
circuit board layout and heat sinking design, as well as attention to supply filtering,
transient suppression, and I/O signal quality.
The goods provided may not be complete in terms of required design, marketing, and/
or manufacturing related protective considerations, including product safety measures
typically found in the end product incorporating the goods. Due to the open construction
of the product, it is the user's responsibility to take any and all appropriate precautions
with regard to electrostatic discharge. In order to minimize risks associated with the
customer's applications, adequate design and operating safeguards must be provided
by the customer to minimize inherent or procedural hazards. For any safety concerns,
contact NXP sales and technical support services.
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RDGD31603PSMKEVM three-phase inverter kit
1 Introduction
This document is the user guide for the RDGD31603PSMKEVM reference design. It
is intended for engineers involved in evaluation, design, implementation and validation
using GD3160, a single-channel gate driver for insulated-gate bipolar transistor/silicon
carbide (IGBT/SiC) devices.
The scope of this document is to provide the user with information to evaluate the
GD3160. The kit can be used as a double pulse and short circuit tester to measure
key switching parameters or used as a three phase inverter for motor control. This
document covers connecting the hardware, installing the software and tools, configuring
the environment and using the kit.
The RDGD31603PSMKEVM is a fully functional three-phase inverter evaluation
board populated with six GD3160 gate drivers with fault management and supporting
circuitry. This board supports SPI daisy chain communication for programming and
communication with three high-side gate drivers and three low-side gate drivers
independently.
This board has low-voltage and high-voltage isolation in conjunction with gate drive
integrated galvanic signal isolation. Other supporting features on the board include
desaturation short-circuit detection, IGBT/SiC temperature sensing, and DC Link bus
voltage monitoring. See the GD3160 data sheet for additional gate drive features.
2 Finding kit resources and information on the NXP web site
NXP Semiconductors provides online resources for this reference design and its
supported device(s) on http://www.nxp.com.
The information page for the RDGD31603PSMKEVM reference design is at
www.nxp.com/RDGD31603PSMKEVM. This page provides overview information,
documentation, software and tools, parametrics, ordering information and a Getting
Started tab. The Getting Started tab provides quick-reference information applicable to
using the RDGD31603PSMKEVM reference design, including the downloadable assets
referenced in this document.
2.1 Collaborate in the NXP community
The NXP community is for sharing ideas and tips, asking and answering technical
questions, and receiving input on just about any embedded design topic.
The NXP community is at http://community.nxp.com.
3 Getting started
Working with the RDGD31603PSMKEVM requires kit contents and a Windows PC
workstation with FlexGUI software installed.
3.1 Kit contents
•Assembled and tested RDGD31603PSMKEVM (three-phase inverter populated with
5.0 V compatible gate driver devices) board in an anti-static bag
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RDGD31603PSMKEVM three-phase inverter kit
•3.3 V to 5.0 V translator board connected to FRDM-KL25Z MCU (KITGD3160TREVB)
with micro-USB cable for using FlexGUI software control
•Quick Start Guide
3.2 Additional hardware
In addition to the kit contents, the following hardware is necessary or beneficial when
working with this kit.
•Microcontroller for SPI communication
•Compatible eMPack power module from Semikron
•DClink capacitor compatible with eMPack power module
•HV power supply with protection shield and hearing protection
•Current sensors for monitoring each phase current
•12 V, 1.0 A DC power supply
•4-channel oscilloscope with appropriate isolated probes
3.3 Windows PC workstation
This reference design requires a Windows PC workstation. Meeting these minimum
specifications should produce great results when working with this reference design.
•USB-enabled computer with Windows 8 or Windows 10
3.4 Software
The Flex GUI software must be installed in order to use this kit. All listed software is
available on the information page at http://www.nxp.com/RDGD31603PSMKEVM.
•Flex GUI software for using with KITGD3160TREVB MCU/translator board
4 Getting to know the hardware
4.1 RDGD31603PSMKEVM features
•Capability to perform double pulse and short-circuit tests on Phase U using
KITGD3160TREVB and FlexGUI. See schematics for phase U and FlexGUI Pulse tab
(Figure 32 and Figure 33)
•Evaluation board designed for and populated with GD3160 Gate Drivers and protection
circuitry
•Capability to connect to eMPack specific modules for full three-phase evaluation and
development (see Figure 8 for specific module pin placement)
•Daisy chain SPI communication (three high-side and three low-side gate drivers)
•Variable fly-back VCC power supply with GND reference and variable VEE supply
•Easy access power, ground, and signal test points
•Optional connection for DC bus voltage monitoring
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4.2 Kit featured components
4.2.1 Voltage domains, GD3160 pinout, logic header, and IGBT pinout
The low-voltage domain is an externally supplied 12 V DC (VPWR) primary supply for
non- isolated circuits, typically supplied by a vehicle battery. The low-voltage domain
includes the interface between the MCU and GD3160 control registers and logic control.
The low-side driver and high-side driver domains are isolated high-voltage driver control
domains for SiC MOSFET or IGBT single phase connections and control circuits. The
pins on the bottom of the board are designed to easily connect to a compatible three-
phase SiC MOSFET or IGBT module.
Figure 1. RDGD3160PSMKEVM three-phase inverter board voltage domains and interfaces
4.2.2 GD3160 pinout and MCU interface pinout
See the GD3160 advanced IGBT/SiC gate driver data sheet for specific information
about pinout, pin descriptions, specifications, and operating modes. The VSUP/VPWR
DC supply terminal is a low voltage input connection for supplying power to the low
voltage non- isolated die and related circuitry. A GD3160 application is typically supplied
by a +12 V DC vehicle battery.
The KITGD3160TREVB MCU/translator included with the kit can be attached to this
board at the 24 pin dual row header pin interface. All gate drivers can be accessed via
SPI control using FlexGUI software.
The external connector (20 pin) can be used for monitoring interrupts, PWM inputs, and
other miscellaneous logic I/O signals from gate drive devices. See schematic for details.
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RDGD31603PSMKEVM three-phase inverter kit
Note: Double pulse and short-circuit tests can be conducted on Phase U only. See
FlexGUI Pulse tab, see Figure 32 and Figure 33.
Figure 2. Gate driver pinout and board interface connections
Pin Name Function
1 AOUTLU GD3160 analog output signal low-side U phase
2 n.c. not connected
Table 1. MCU connector (J38) pin definitions
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RDGD31603PSMKEVM three-phase inverter kit
Pin Name Function
3 CSBL Chip select bar to low-side gate drivers
4 n.c. not connected
5 PWMLU Pulse width modulation low-side phase U
6 INTB LOW SIDE GD3160 fault reporting/monitoring output pin for low-side devicees
7 MOSI_MICRO SPI target in signal
8 SCLK SPI clock
9 MISO_MICRO_N SPI target out signal
10 n.c. not connected
11 FSSTATEL Fail-safe state low-side input
12 GND Ground
13 FSENB_MICRO Fail-safe enable bar input
14 n.c. not connected
15 INTALU GD3160 fault reporting/monitoring output pin for low-side phase U
16 n.c. not connected
17 INTAHU GD3160 fault reporting/monitoring output pin for high-side phase U
18 CSBH Chip select bar to high-side gate drivers
19 LED_PWR 5 V pull-up for LED interrupt indicators
20 AOUTHU GD3160 analog output signal high-side U phase
21 PWMHU Pulse width modulation high-side phase U
22 FSSTATEH Fail-safe state high-side input
23 GND Ground
24 INTB_HIGH SIDE GD3160 fault reporting/monitoring output pin for high-side
Table 1. MCU connector (J38) pin definitions...continued
Pin Name Function
1 GND ground
2 PWMHU Pulse width modulation input high-side phase U
3 GND ground
4 PWMLU Pulse width modulation input low-side phase U
5 GND ground
6 PWMHV Pulse width modulation input high-side phase V
7 AOUTLU GD3160 duty cycle encoded analog output signal low-side U phase
8 PWMLV Pulse width modulation input low-side phase U
9 INTAHU GD3160 fault reporting/monitoring output pin for high-side phase U
10 PWMHW Pulse width modulation input high-side phase W
11 INTALU GD3160 fault reporting/monitoring output pin for low-side phase U
Table 2. External connector (J38) pin definition
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RDGD31603PSMKEVM three-phase inverter kit
Pin Name Function
12 PWMLW Pulse width modulation input low-side phase W
13 INTAHV GD3160 fault reporting/monitoring output pin for high-side phase V
14 AOUTLW GD3160 analog output signal low-side W phase
15 INTALV GD3160 fault reporting/monitoring output pin for low-side phase V
16 INTB_HIGH SIDE GD3160 fault reporting output all high-side gate drivers
17 INTAHW GD3160 fault reporting/monitoring output pin for high-side phase W
18 INTB_LOW SIDE GD3160 fault reporting output all low-side gate drivers
19 INTALW GD3160 fault reporting/monitoring output pin for low-side phase W
20 FSENB EXT Active-low Fail Safe control input (leave open if unused)
Table 2. External connector (J38) pin definition...continued
4.2.3 Test points
All test points are clearly marked on the board. The following figure shows the location of
various test points.
Figure 3. RDGD31603PSMKEVM test points
Test point name Function
DSTHU DESAT high-side U phase VCE desaturation connected to DESAT pin circuitry
DSTLU DESAT low-side U phase VCE desaturation connected to DESAT pin circuitry
GHU Gate high-side U phase
GHV Gate high-side V phase
Table 3. Test points
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RDGD31603PSMKEVM three-phase inverter kit
Test point name Function
GHW Gate high-side W phase
GLU Gate low-side U phase
GLV Gate low-side V phase
GLW Gate low-side W phase
TSENSELU Temperature sense test point low-side U phase input to TSENSEA
VDCLINKW DC link voltage test point low-side W phase input to AMUXIN
Table 3. Test points...continued
4.2.4 Indicators
The RDGD31603PSMKEVM evaluation board contains LEDs as visual indicators on the
board.
Figure 4. RDGD31603PSMKEVM indicator locations
Name Description
INTBL LED Indicates that a GD3160 INTB fault interrupt has occurred on the low side devices
INTBH LED Indicates that a GD3160 INTB fault interrupt has occurred on the high side devices
Table 4. RDGD31603PSMKEVM indicator descriptions
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4.2.5 Connectors, jumpers and potentiometers
Figure 5. RDGD31603PSMKEVM jumpers with variable VCC and VEE potentiometer locations
Name Description
J2 Jumper 1-2 default - DC supply for VSUP to gate drivers supplied through J1 terminal
connection
Jumper Open VSUP supply to gate drivers isolated
J13 Jumper 1-2 default MOSI – Normal mode three device daisy chain three device high
side, three device low side (x3 – 2 channel)
Jumper 2-3 MOSI - Six device daisy chain all six gate drivers daisy chained together
(x6 – 1 channel)
J14 Jumper 1-2 default MISO-Normal mode three device daisy chain three device high
side, three device low side (x3 – 2 channel)
Jumper 2-3 MISO - Six device daisy chain all six gate drivers daisy chained together
(x6 – 1 channel)
J50 Jumper open default CSB-Normal mode three device high side, three device low side
(x3 - 2 channel)
Jumper 1-2 CSB - Six device daisy chain all six gate drivers daisy chained together (x6
- 1 channel)
J37 External signals Miscellaneous PWM and Interrupt signals (See schematic for details)
J38 MCU Signals Two-row header of all MCU signals for debug and development. (See schematic for
details)
J1 VPWR terminal connector Used for external low voltage power supply connection, typically 12 V Vbatt
R265 5 kΩ pot to adjust fly-back VCC level all high-side gate drivers
R235 5 kΩ pot to adjust fly-back VCC level all low-side gate drivers
Table 5. RDGD31603PSMKEVM connector, jumper and potentiometer descriptions
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Name Description
R243 1 kΩ pot to adjust VEE level high-side phase U
R219 1 kΩ pot to adjust VEE level low-side phase U
R256 1 kΩ pot to adjust VEE level high-side phase V
R232 1 kΩ pot to adjust VEE level low-side phase V
R263 1 kΩ pot to adjust VEE level high-side phase W
R239 1 kΩ pot to adjust VEE level low-side phase W
Table 5. RDGD31603PSMKEVM connector, jumper and potentiometer descriptions...continued
4.2.6 Power supply test points
Figure 6. RDGD31603PSMKEVM power supply test points
Name Function
VCCHU High-side phase U VCC voltage test point Isolated positive voltage supply (11 V to 28 V)
VEEHU High-side phase U VEE voltage test point
Isolated negative voltage supply (-1.25 V to -7.5 V)
GNDHU High-side phase U isolated ground
VCCHV High-side phase V VCC voltage test point Isolated positive voltage supply (11 V to 28 V)
VEEHV High-side phase V VEE voltage test point
Isolated negative voltage supply (-1.25 V to -7.5 V)
GNDHV High-side phase V isolated ground
VCCHW High-side phase W VCC voltage test point Isolated positive voltage supply (11 V to 28 V)
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Name Function
VEEHW High-side phase W VEE voltage test point
Isolated negative voltage supply (-1.25 V to -7.5 V)
GNDHW High-side phase V isolated ground
VCCLU Low-side phase U VCC voltage test point Isolated positive voltage supply (11 V to 28 V)
VEELU Low-side phase U VEE voltage test point
Isolated negative voltage supply (-1.25 V to -7.5 V)
GNDLU Low-side phase U isolated ground
VCCLV Low-side phase V VCC voltage test point Isolated positive voltage supply (11 V to 28 V)
VEELV Low-side phase V VEE voltage test point
Isolated negative voltage supply (-1.25 V to -7.5 V)
GNDLV Low-side phase V isolated ground
VCCLW Low-side phase W VCC voltage test point Isolated positive voltage supply (11 V to 28 V)
VEELW Low-side phase W VEE voltage test point
Isolated negative voltage supply (-1.25 V to -7.5 V)
GNDLW Low-side phase W isolated ground
VPWR/VSUP +12 V DC VPWR low voltage positive supply connection (+12 V DC)
GND VPWR/VSUP low voltage supply ground connection
4.2.7 Gate drive resistors
•RGH-gate high resistor in series with the GH pin at the output of the GD3160 driver and
SiC MOSFET gate that controls the turn on current for SiC gate.
•RGL-gate low resistor in series with the GL pin at the output of the GD3160 driver and
SiC MOSFET gate that controls the turn off current for SiC gate.
•RAMC-series resistor between SiC MOSFET gate and AMC input pin of the GD3160
high-side/low-side driver for gate sensing and Active Miller clamping.
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Figure 7. Gate drive resistors for each phase, high-side and low-side
4.2.8 Power module pin connections
Figure 8. RDGD31603PSMKEVM board bottom
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4.2.9 Advanced IGBT gate driver
4.2.9.1 General description
The GD3160 is an advanced single channel gate driver for IGBTs. Integrated Galvanic
isolation and low on-resistance drive transistors provide high charging and discharging
current, low dynamic saturation voltage, and rail-to-rail gate voltage control.
Current and temperature sense minimizes IGBT stress during faults. Accurate and
configurable under voltage lockout (UVLO) provides protection while ensuring sufficient
gate drive voltage headroom.
The GD3160 autonomously manages severe faults and reports faults and status via the
INTB pin and a SPI interface. It is capable of directly driving gates of most IGBTs. Self-
test, control, and protection functions are included for design of high reliability systems
(ASIL C/D). It meets the stringent requirements of automotive applications and is fully
AEC-Q100 grade 1 qualified.
4.2.9.2 GD3160 features
•Compatible with current sense and temp sense IGBTs
•Fast short circuit protection for IGBT/SiC with DESAT and current sense feedback
•Compliant with ASIL D ISO 26262 functional safety requirements
•SPI interface for safety monitoring, programmability, and flexibility
•Integrated Galvanic signal isolation
•Integrated gate drive power stage capable of 15 A peak source and sink
•Interrupt pin for fast response to faults
•Compatible with negative gate supply
•Compatible with 200 V to 1700 V IGBTs, power range > 125 kW
•AEC-Q100 grade 1 qualified
4.2.10 IGBT pin connections
Figure 9. Module connection pins
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Connection name Pin description
COL_HU Collector high-side U phase
COL_HV Collector high-side V phase
COL_HW Collector high-side W phase
COL_LU Collector low-side U phase
COL_LV Collector low-side V phase
COL_LW Collector low-side W phase
E_HU Emitter high-side U phase
E_HV Emitter high-side V phase
E_HW Emitter high-side W phase
E_LU Emitter low-side U phase
E_LV Emitter low-side V phase
E_LW Emitter low-side W phase
G_HU Gate high-side U phase
G_HV Gate high-side V phase
G_HW Gate high-side W phase
G_LU Gate low-side U phase
G_LV Gate low-side V phase
G_LW Gate low-side W phase
NTC1 Negative temperature coefficient resistor connections 1 U, V, and W phase
NTC2 Negative temperature coefficient resistor connections 2 U, V, and W phase
4.3 Kinetis KL25Z Freedom board
The Freedom KL25Z is an ultra-low-cost development platform for the Kinetis L series
MCU built on an ARM Cortex-M0+ processor.
Figure 10. Freedom development platform
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4.4 3.3 to 5.0 V translator board
The KITGD3160TREVB translator enables level shifting of signals from MCU 3.3 V to 5.0
V SPI communication.
Figure 11. Translator board
Jumper Position Function
1-2 selects 5.0 V for 5.0 V compatible gate driveVCCSEL (J3)
2-3 selects 3.3 V for 3.3 V compatible gate drive
1-2 selects PWM high-side control from KL25Z MCUPWMH_SEL (J4)
2-3 selects PWM high-side control from fiber optic receiver inputs
1-2 selects PWM low-side control from KL25Z MCUPWML_SEL (J5)
2-3 selects PWM low-side control from fiber optic receiver inputs
Table 6. Translator board jumper definitions
4.5 Schematic, board layout, and bill of materials
The schematic, board layout and bill of materials for the RDGD31603PSMKEVM
reference design are available at http://www.nxp.com/RDGD31603PSMKEVM.
5 Installing and configuring software and tools
Software for RDGD31603PSMKEVM is distributed with the FlexGUI tool (available on
NXP.com). Necessary firmware comes pre-installed on the FRDM-KL25Z with the kit.
Even if the user intends to test with other software or PWM, NXP recommends installing
this software as a backup, or to help with debugging.
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5.1 Installing FlexGUI on your computer
The latest version of FlexGUI supports the GD3100 and GD3160. It is designed to run on
any Windows 10 or Windows 8 based operating system. To install the software, do the
following:
1. Go to www.nxp.com/FlexGUI and click Download.
2. When the FlexGUI software page appears, click Download and select the version
associated with your PC operating system.
3. The FlexGUI wizard creates a shortcut, and an NXP FlexGUI icon appears on the
desktop. By default, the FlexGUI executable file is installed at C:\flexgui-app-des-
gd31xx.exe. Installing the device drivers overwrites any previous FlexGUI installation
and replaces it with a current version containing the GD31xx drivers. However,
configuration files (.spi) from the previous version remain intact.
5.2 Configuring the FRDM-KL25Z microcode
Figure 12. FRDM-KL25Z setup and interface
By default, the FRDM-KL25Z delivered with this kit is preprogrammed with the current
and most up-to-date firmware available for the kit.
To quickly check that the microcode is programmed and the board is functioning properly,
plug the KL25Z into the computer, open FlexGUI, and verify that the software version at
the bottom is 6.4 or later (see Figure 13).
If functionality is lost following a board reset, reprogramming, or a corrupted data issue,
the microcode may be rewritten per the following steps:
1. To clear the memory and place the board in bootloader mode, hold down the reset
button while plugging a USB cable into the OpenSDA USB port.
2. Verify that the board appears as a BOOTLOADER device and continue with step List
item. If the board appears as KL25Z, you may go to step List item.
3. Download the Firmware Apps .zip archive from the PEmicro OpenSDA web page
(http://www.pemicro.com/opensda/).Validate your email address to access the files.
4. Find the most recent MDS-DEBUG-FRDM-KL25Z_Pemicro_v118.SDA and copy/
drag-and-drop into the BOOTLOADER device.
5. Reboot the board by unplugging and replugging the connection to the OpenSDA port.
Verify now that the device appears as a KL25Z device to continue.
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6. Locate the most recent KL25Z firmware; which is distributed as part of the FlexGUI
package.
a. From the FlexGUI install directory, which is located in the flexgui-
app-des-gd31xx\binfolder and is named in the form “flexgui-fw-
KL25Z_usb_hid_gd31xxC_vx.x.x.bin”.
b. This .bin file is a product/family-specific configuration file for FRDM-KL25Z
containing the pin definitions, SPI/PWM generation code, and pin mapping
assignments necessary to interface with the translator board as part of
RDGD31603PSMKEVM.
7. With the KL25Z still plugged through the OpenSDA port, copy/drag-and-drop the .bin
file into the KL25Z device memory. Once done, disconnect the USB and plug into the
other USB port, labeled KL25Z.
•The device may not appear as a distinct device to the computer while connected
through the KL25Z USB port. This is normal.
8. TheFRDM-KL25Z board is now fully set up to work with RDGD31603PSMKEVM and
the FlexGUI.
•There is no software stored or present on either the driver or translator boards, only
on the FRDM-KL25Z MCU board.
All uploaded firmware is stored in non-volatile memory until the reset button is hit on the
FRDM-KL25Z. There is no need to repeat this process upon every power up, and there is
no loss of data associated with a single unplug event.
5.3 Using the FlexGUI
The FlexGUI is available from http://www.nxp.com/FlexGUI as an evaluation tool
demonstrating GD31xx-specific functionality, configuration, and fault reporting. FlexGUI
also includes basic capacity for the RDGD31603PSMKEVM to control an IGBT or SiC
module, enabling double pulse or short-circuit testing.
SPI messages can be realized graphically or in hexadecimal format. Chip Select Bar
(CSB) is selectable to address (x6 – 1 channel) or (x3 – 2 channels) GD31xx on the
board via daisy chain. See Figure 14 to Figure 33 or FlexGUI for GD31xx internal
register read and write access.
Starting FlexGUI for GD31xx
•FlexGUI install program (flexgui-app-des-gd31xx-0.x.x.exe)
•Download FlexGUI and run the install program on your PC
•When you start the application, Figure 13 allows you to select the target application
board, feature set (standard or daisy chain), target MCU, and USB interface. Leave all
settings as shown.
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Figure 13. Kit selection
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