NXP Semiconductors FRDMGD3162RPEVM User manual

UM11887
FRDMGD3162RPEVM half-bridge evaluation board
Rev. 1 — 13 February 2023 User manual
Document information
Information Content
Keywords gate drive, half bridge, RoadPak, GD3162
Abstract This document describes key features and usage requirements for performing
evaluation of GD3162 gate driver with FRDMGD3162RPEVM.

NXP Semiconductors UM11887
FRDMGD3162RPEVM half-bridge evaluation board
Revision Date Description
v.1 20230213 initial version
Revision history
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User manual Rev. 1 — 13 February 2023
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NXP Semiconductors UM11887
FRDMGD3162RPEVM half-bridge evaluation board
1 FRDMGD3162RPEVM
Figure 1. FRDMGD3162RPEVM
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FRDMGD3162RPEVM half-bridge evaluation board
2 Important notice
IMPORTANT NOTICE
For engineering development or evaluation purposes only
NXP provides the product under the following conditions:
This evaluation kit is for use of ENGINEERING DEVELOPMENT OR
EVALUATION PURPOSES ONLY. It is provided as a sample IC pre-soldere
d to a printed-circuit board to make it easier to access inputs, outputs
and supply terminals. This evaluation board may be used with any
development system or other source of I/O signals by connecting it to the
host MCU computer board via off-the-shelf cables. This evaluation board
is not a Reference Design and is not intended to represent a final design
recommendation for any particular application. Final device in an application
heavily depends on proper printed-circuit board layout and heat sinking
design as well as attention to supply filtering, transient suppression, and I/O
signal quality.
The product provided may not be complete in terms of required design,
marketing, and or manufacturing related protective considerations, including
product safety measures typically found in the end device incorporating the
product. Due to the open construction of the product, it is the responsibility of
the user to take all appropriate precautions for electric discharge. In order to
minimize risks associated with the customers’ applications, adequate design
and operating safeguards must be provided by the customer to minimize
inherent or procedural hazards. For any safety concerns, contact NXP sales
and technical support services.
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NXP Semiconductors UM11887
FRDMGD3162RPEVM half-bridge evaluation board
3 Getting started
The NXP analog product development boards provide an easy-to-use platform for
evaluating NXP products. The boards support a range of analog, mixed-signal, and
power solutions. They incorporate monolithic integrated circuits and system-in-package
devices that use proven high-volume technology. NXP products offer longer battery life, a
smaller form factor, reduced component counts, lower cost, and improved performance in
powering state-of-the-art systems.
The tool summary page for FRDMGD3162RPEVM is at http://www.nxp.com/
FRDMGD3162RPEVM. The overview tab provides an overview of the device, product
features, a description of the kit contents, a list of (and links to) supported devices, a list
of (and links to) any related products, and a Get Started section.
The Get Started section provides links to everything needed to start using the
device and contains the most relevant, current information applicable to the
FRDMGD3162RPEVM.
1. Go to http://www.nxp.com/FRDMGD3162RPEVM.
2. On the Overview tab, locate the Jump To navigation feature on the left side of the
window.
3. Select the Get Started link, review each entry, and download an entry by clicking the
title.
4. After reviewing the Overview tab, visit the other product-related tabs for additional
information:
• Documentation: download current documentation
• Software & Tools: download current hardware and software tools
• Buy/Parametrics: purchase the product and view the product parametrics
After downloading files, review each file, including the user guide, which includes setup
instructions. If applicable, the bill of materials (BOM) and supporting schematics are also
available for download in the Get Started section of the Overview tab.
3.1 Kit contents/packing list
The FRDMGD3162RPEVM kit contents include:
•Assembled and tested FRDMGD3162RPEVM board in an antistatic bag
•3.3 to 5.0 V translator board (KITGD316xTREVB) connected to FRDM-KL25Z MCU
board
•USB cable, type A male/type mini B male, 3 ft
•Quick start guide
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NXP Semiconductors UM11887
FRDMGD3162RPEVM half-bridge evaluation board
3.2 Required equipment
To use this kit, you need:
•Compatible SiC RoadPak module
•DC link capacitor compatible with the SiC RoadPak module
•1.27 mm jumpers for configuration (included with kit)
•30 to 50 µH, high-current air core inductor for double-pulse testing
•HV power supply with protection shield and hearing protection
•20 V, 1.0 A DC power supply
•500 MHz 2.5 GS/s 4-channel oscilloscope
•Rogowski coil, AC current probe (smaller diameter)
•Isolated high-voltage probes
•Digital voltmeter
3.3 System requirements
The kit requires the following to function properly with the software:
•Windows 10 or higher operating system
4 Getting to know the hardware
4.1 Overview
The FRDMGD3162RPEVM is a half-bridge evaluation kit populated with two GD3162
single-channel gate drive devices. The kit includes the Freedom KL25Z microcontroller
hardware for interfacing a PC installed with FlexGUI software for communication to the
Serial Peripheral Interface (SPI) registers on the GD3162 gate drive devices in either
daisy chain or standalone configuration.
The KITGD316xTREVB translator board is used to translate 3.3 V signals to 5.0 V
signals between the MCU and GD3162 gate drivers. The evaluation kit can be connected
to a compatible Insulated-Gate Bipolar Transistor (IGBT) or SiC MOSFET module for
half-bridge evaluations and applications development.
4.2 Board features
•Capability to connect to Hitachi RoadPak module for half-bridge evaluations
•Adjustable Negative VEE gate low drive level (–1.5 to –7.5 V DC)
•Adjustable VCC gate high drive level (10 to 25 V DC)
•Jumper configurable for disabling dead-time fault protection when short-circuit testing
•Easy access power, ground, and signal test points
•Easy to install and use FlexGUI for interfacing via SPI through PC; software includes
double-pulse and short-circuit testing capability
•DC link bus voltage monitor on low-side driver via AMUXIN and AOUT
•Negative Temperature Coefficient (NTC) connection and configurable for monitoring
module temperature
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NXP Semiconductors UM11887
FRDMGD3162RPEVM half-bridge evaluation board
4.3 Device features
Device Description Features
GD3162 The GD3162 is an
advanced single-
channel gate driver for
IGBT and SiC power
devices.
•Compatible with current sense and tempsense IGBT
and SiC MOSFET modules
•DESAT detection capability for detecting VCE
desaturation condition
•Fast short-circuit protection for IGBT and SiC
MOSFET with current sense feedback
•Compliant with automotive safety integrity level
(ASIL) C/D ISO 26262 functional safetyrequirements
•SPIinterface for safety monitoring, programmability,
and flexibility
•Integrated galvanic signalisolation up to 8 kV
•Integrated Boost capability for increased drive
strength.
•Interrupt pins for fast response to faults and real time
reporting capability
•Compatible with negative gate supply
•Active Bus Discharge functionality
Table 1. Device features
4.4 Board description
The FRDMGD3162RPEVM is a half-bridge evaluation board populated with two GD3162
single channel IGBT or SiC MOSFET gate drive devices. The board supports connection
to an FRDM-KL25Z microcontroller for SPI communication configuration programming
and monitoring. The board includes DESAT circuitry for short-circuit detection and
implementation of GD3162 shutdown protection capabilities.
The evaluation board is designed to connect to a RoadPak SiC
metal-oxide-semiconductor field-effect transistor (MOSFET) for evaluation of the GD3162
performance and capabilities.
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NXP Semiconductors UM11887
FRDMGD3162RPEVM half-bridge evaluation board
Figure 2. Connecting FRDM-KL25Z, GD31xx half-bridge EVB and translator board
4.4.1 Low-voltage logic and control connector
Low-voltage domain requires an externally supplied 12 V VSUP, which supplies an
onboard flyback supply for high-side and low-side driver domain VCC/VEE and an on
board regulator for low voltage domain 5 V VDD. The low-voltage domain interfaces with
the MCU and GD3162 control registers through the 24-pin connector interface.
Low-side driver and high-side driver domains are driver control interfaces to RoadPak
module single-phase connections and test points.
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FRDMGD3162RPEVM half-bridge evaluation board
Figure 3. Evaluation board voltage and interface domains
Pin Name Function
1 AOUTL analog output duty cycle encoded signal (low side) for reading temperature via
TSENSEA or voltage via AMUXIN
2 GS_ENH Gate Strength Enable High – Gate drive pull-up strength control logic
3 CSBL chip select bar (low side)
4 GS_ENL Gate Strength Enable Low – Gate drive pull-down strength control logic
5 PWML pulse width modulation (PWM) input (low side)
6 INTBL interrupt bar (low side)
7 MOSIL master out slave in (low side)
8 SCLK serial clock input
9 MISOL master in slave out (low side)
10 EN_PS MCU control of flyback power supply
11 FSSTATEL fail-safe state (low side)
12 GND ground
13 FSENB fail-safe enable (high side and low side)
Table 2. Low-voltage domain 24-pin connector definitions
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NXP Semiconductors UM11887
FRDMGD3162RPEVM half-bridge evaluation board
Pin Name Function
14 MISOH master in slave out (high side)
15 INTAL fault reporting and real time VCE and VGE monitoring (low side)
16 MOSIH master out slave in (high side)
17 INTAH fault reporting and real time VCE and VGE monitoring (high side)
18 CSBH chip select bar (high side)
19 LED_PWR USB 3.3 V power for INTB LEDs (high side and low side)
20 AOUTH duty cycle encoded signal (high side)
21 PWMH pulse width modulation (PWM) input (high side)
22 FSSTATEH fail-safe state (high side)
23 GND ground
24 INTBH interrupt bar (high side)
Table 2. Low-voltage domain 24-pin connector definitions...continued
4.4.2 Test point definitions
All test points are clearly marked on the evaluation board. Figure 4 shows the location of
various test points.
Figure 4. Key test point locations
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