NXP Semiconductors FRDMGD3162RPEVM User manual

UM11887
FRDMGD3162RPEVM half-bridge evaluation board
Rev. 1 — 13 February 2023 User manual
Document information
Information Content
Keywords gate drive, half bridge, RoadPak, GD3162
Abstract This document describes key features and usage requirements for performing
evaluation of GD3162 gate driver with FRDMGD3162RPEVM.

NXP Semiconductors UM11887
FRDMGD3162RPEVM half-bridge evaluation board
Revision Date Description
v.1 20230213 initial version
Revision history
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1 FRDMGD3162RPEVM
Figure 1. FRDMGD3162RPEVM
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2 Important notice
IMPORTANT NOTICE
For engineering development or evaluation purposes only
NXP provides the product under the following conditions:
This evaluation kit is for use of ENGINEERING DEVELOPMENT OR
EVALUATION PURPOSES ONLY. It is provided as a sample IC pre-soldere
d to a printed-circuit board to make it easier to access inputs, outputs
and supply terminals. This evaluation board may be used with any
development system or other source of I/O signals by connecting it to the
host MCU computer board via off-the-shelf cables. This evaluation board
is not a Reference Design and is not intended to represent a final design
recommendation for any particular application. Final device in an application
heavily depends on proper printed-circuit board layout and heat sinking
design as well as attention to supply filtering, transient suppression, and I/O
signal quality.
The product provided may not be complete in terms of required design,
marketing, and or manufacturing related protective considerations, including
product safety measures typically found in the end device incorporating the
product. Due to the open construction of the product, it is the responsibility of
the user to take all appropriate precautions for electric discharge. In order to
minimize risks associated with the customers’ applications, adequate design
and operating safeguards must be provided by the customer to minimize
inherent or procedural hazards. For any safety concerns, contact NXP sales
and technical support services.
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3 Getting started
The NXP analog product development boards provide an easy-to-use platform for
evaluating NXP products. The boards support a range of analog, mixed-signal, and
power solutions. They incorporate monolithic integrated circuits and system-in-package
devices that use proven high-volume technology. NXP products offer longer battery life, a
smaller form factor, reduced component counts, lower cost, and improved performance in
powering state-of-the-art systems.
The tool summary page for FRDMGD3162RPEVM is at http://www.nxp.com/
FRDMGD3162RPEVM. The overview tab provides an overview of the device, product
features, a description of the kit contents, a list of (and links to) supported devices, a list
of (and links to) any related products, and a Get Started section.
The Get Started section provides links to everything needed to start using the
device and contains the most relevant, current information applicable to the
FRDMGD3162RPEVM.
1. Go to http://www.nxp.com/FRDMGD3162RPEVM.
2. On the Overview tab, locate the Jump To navigation feature on the left side of the
window.
3. Select the Get Started link, review each entry, and download an entry by clicking the
title.
4. After reviewing the Overview tab, visit the other product-related tabs for additional
information:
• Documentation: download current documentation
• Software & Tools: download current hardware and software tools
• Buy/Parametrics: purchase the product and view the product parametrics
After downloading files, review each file, including the user guide, which includes setup
instructions. If applicable, the bill of materials (BOM) and supporting schematics are also
available for download in the Get Started section of the Overview tab.
3.1 Kit contents/packing list
The FRDMGD3162RPEVM kit contents include:
•Assembled and tested FRDMGD3162RPEVM board in an antistatic bag
•3.3 to 5.0 V translator board (KITGD316xTREVB) connected to FRDM-KL25Z MCU
board
•USB cable, type A male/type mini B male, 3 ft
•Quick start guide
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3.2 Required equipment
To use this kit, you need:
•Compatible SiC RoadPak module
•DC link capacitor compatible with the SiC RoadPak module
•1.27 mm jumpers for configuration (included with kit)
•30 to 50 µH, high-current air core inductor for double-pulse testing
•HV power supply with protection shield and hearing protection
•20 V, 1.0 A DC power supply
•500 MHz 2.5 GS/s 4-channel oscilloscope
•Rogowski coil, AC current probe (smaller diameter)
•Isolated high-voltage probes
•Digital voltmeter
3.3 System requirements
The kit requires the following to function properly with the software:
•Windows 10 or higher operating system
4 Getting to know the hardware
4.1 Overview
The FRDMGD3162RPEVM is a half-bridge evaluation kit populated with two GD3162
single-channel gate drive devices. The kit includes the Freedom KL25Z microcontroller
hardware for interfacing a PC installed with FlexGUI software for communication to the
Serial Peripheral Interface (SPI) registers on the GD3162 gate drive devices in either
daisy chain or standalone configuration.
The KITGD316xTREVB translator board is used to translate 3.3 V signals to 5.0 V
signals between the MCU and GD3162 gate drivers. The evaluation kit can be connected
to a compatible Insulated-Gate Bipolar Transistor (IGBT) or SiC MOSFET module for
half-bridge evaluations and applications development.
4.2 Board features
•Capability to connect to Hitachi RoadPak module for half-bridge evaluations
•Adjustable Negative VEE gate low drive level (–1.5 to –7.5 V DC)
•Adjustable VCC gate high drive level (10 to 25 V DC)
•Jumper configurable for disabling dead-time fault protection when short-circuit testing
•Easy access power, ground, and signal test points
•Easy to install and use FlexGUI for interfacing via SPI through PC; software includes
double-pulse and short-circuit testing capability
•DC link bus voltage monitor on low-side driver via AMUXIN and AOUT
•Negative Temperature Coefficient (NTC) connection and configurable for monitoring
module temperature
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4.3 Device features
Device Description Features
GD3162 The GD3162 is an
advanced single-
channel gate driver for
IGBT and SiC power
devices.
•Compatible with current sense and tempsense IGBT
and SiC MOSFET modules
•DESAT detection capability for detecting VCE
desaturation condition
•Fast short-circuit protection for IGBT and SiC
MOSFET with current sense feedback
•Compliant with automotive safety integrity level
(ASIL) C/D ISO 26262 functional safetyrequirements
•SPIinterface for safety monitoring, programmability,
and flexibility
•Integrated galvanic signalisolation up to 8 kV
•Integrated Boost capability for increased drive
strength.
•Interrupt pins for fast response to faults and real time
reporting capability
•Compatible with negative gate supply
•Active Bus Discharge functionality
Table 1. Device features
4.4 Board description
The FRDMGD3162RPEVM is a half-bridge evaluation board populated with two GD3162
single channel IGBT or SiC MOSFET gate drive devices. The board supports connection
to an FRDM-KL25Z microcontroller for SPI communication configuration programming
and monitoring. The board includes DESAT circuitry for short-circuit detection and
implementation of GD3162 shutdown protection capabilities.
The evaluation board is designed to connect to a RoadPak SiC
metal-oxide-semiconductor field-effect transistor (MOSFET) for evaluation of the GD3162
performance and capabilities.
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Figure 2. Connecting FRDM-KL25Z, GD31xx half-bridge EVB and translator board
4.4.1 Low-voltage logic and control connector
Low-voltage domain requires an externally supplied 12 V VSUP, which supplies an
onboard flyback supply for high-side and low-side driver domain VCC/VEE and an on
board regulator for low voltage domain 5 V VDD. The low-voltage domain interfaces with
the MCU and GD3162 control registers through the 24-pin connector interface.
Low-side driver and high-side driver domains are driver control interfaces to RoadPak
module single-phase connections and test points.
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Figure 3. Evaluation board voltage and interface domains
Pin Name Function
1 AOUTL analog output duty cycle encoded signal (low side) for reading temperature via
TSENSEA or voltage via AMUXIN
2 GS_ENH Gate Strength Enable High – Gate drive pull-up strength control logic
3 CSBL chip select bar (low side)
4 GS_ENL Gate Strength Enable Low – Gate drive pull-down strength control logic
5 PWML pulse width modulation (PWM) input (low side)
6 INTBL interrupt bar (low side)
7 MOSIL master out slave in (low side)
8 SCLK serial clock input
9 MISOL master in slave out (low side)
10 EN_PS MCU control of flyback power supply
11 FSSTATEL fail-safe state (low side)
12 GND ground
13 FSENB fail-safe enable (high side and low side)
Table 2. Low-voltage domain 24-pin connector definitions
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Pin Name Function
14 MISOH master in slave out (high side)
15 INTAL fault reporting and real time VCE and VGE monitoring (low side)
16 MOSIH master out slave in (high side)
17 INTAH fault reporting and real time VCE and VGE monitoring (high side)
18 CSBH chip select bar (high side)
19 LED_PWR USB 3.3 V power for INTB LEDs (high side and low side)
20 AOUTH duty cycle encoded signal (high side)
21 PWMH pulse width modulation (PWM) input (high side)
22 FSSTATEH fail-safe state (high side)
23 GND ground
24 INTBH interrupt bar (high side)
Table 2. Low-voltage domain 24-pin connector definitions...continued
4.4.2 Test point definitions
All test points are clearly marked on the evaluation board. Figure 4 shows the location of
various test points.
Figure 4. Key test point locations
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Test point Definition
Low-voltage domain
VSUP DC Voltage source connection point for low voltage domain to 5V LDO regulator.
Externally supplied 12 V DC supply voltage.
VDD Test point for 5V LDO regulator output. Supply voltage for VDD inputs and LED
indicator pull-up.
GND grounding points for low-voltage domain
INTAH fault monitor and VCE/VGE real time report monitor high-side test point
INTBL interrupt bar low-side test point
INTAL fault monitor and VCE/VGE real time report monitor low-side test point
INTBH interrupt bar high-side test point
Low-side driver domain
GNDL low-side domain ground point
VCCL positive voltage supply flyback output test point for isolated circuitry and low-side
driver domain
Drain LS Low side SiC MOSFET drain connection
VCOMP Test point for analog comparator input ISEN/COMP pin. Refer to datasheet for details
on this pin.
GL module gate test point on low-side driver domain which is the charging pin of gate;
including MMCX probe connection
DSTL VCE desaturation test point connected to low-side driver DESAT pin and circuitry
VEEL negative voltage supply flyback output test point for low-side driver gate of IGBT or
SiC module
VDC DC link voltage test point at voltage divider and input to AMUXIN pin on low side
High-side driver domain
VCCH positive voltage supply flyback output test point for isolated circuitry and high-side
driver domain
GNDH high-side domain ground point
Drain HS High side SiC MOSFET drain connection
TSNSH temperature sense connection high-side test point
GH module gate test point on high-side driver domain which is the charging pin of gate;
including MMCX probe connection
DSTH VCE desaturation test point connected to high-side driver DESAT pin and circuitry
VEEH negative voltage supply flyback output test point for high-side driver gate of IGBT or
SiC module
Table 3. Test point definitions
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4.4.3 Power supply and jumper configuration
Figure 5. Power supply and jumper configuration
Jumper Position Function
1-2 dead time fault protection enabled (high side)PWMHSEL (J10)
2-3 dead time fault protection disabled (use for short-circuit testing)
1-2 dead time fault protection enabled (low side)PWMLSEL (J9)
2-3 dead time fault protection disabled (use for short-circuit testing)
1-2 chip select for normal operationCSB (J17)
2-3 chip select for daisy chain operation
closed normal operationMOSIDC (J19)
open daisy chain operation
1-2 normal operationMISO (J21)
2-3 daisy chain operation
1-2 MCU control of flyback supply enablePS_EN (J6)
2-3 flyback supply enable tied to VSUP
R63 Adjust resistor VEEH negative supply voltage for high side VEE
R64 Adjust resistor VEEL negative supply voltage for low side VEE
R22 Adjust resistor VCCH (high side) and VCCL (low side) positive supply voltage
Table 4. Jumper definitions
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4.4.4 Bottom view
Figure 6. Evaluation board bottom view
4.4.5 Gate drive resistors
• RGH_1 – gate high resistor in series with the GH_1 pin at the output of the GD3162
gate high driver and RoadPak module gate that controls the strong turn-on current for
SiC MOSFET gate.
• RGH_2 – gate high resistor in series with the GH_2 pin at the output of the GD3162
gate high driver and RoadPak module gate that controls the weak turn-on current for
SiC MOSFET gate.
• RGL_1 – gate low resistor in series with the GL_1 pin at the output of the GD3162 gate
low driver and RoadPak module gate that controls the strong turn-off current for SiC
MOSFET gate.
• RGL_2 – gate low resistor in series with the GL_2 pin at the output of the GD3162 gate
low driver and RoadPak module gate that controls the weak turn-off current for SiC
MOSFET gate.
• RAMC – series resistor between RoadPak module gate and AMC input pin of the
GD3162 driver for gate sensing and active Miller clamping.
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Figure 7. Gate drive resistors
4.4.6 LED interrupt indicators
Figure 8. LED interrupt indicators
LED Description
Low-side
INTB
connected to the INTB output pin of low-side driver indicating reported fault status
when on (active LOW)
High-side
INTB
connected to the INTB interrupt output pin of high-side driver indicating reported
fault status when on (active LOW)
Table 5. LED interrupt indicators
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4.5 Kinetis KL25Z Freedom board
The Freedom KL25Z is an ultra low-cost development platform for Kinetis L series MCU
built on Arm Cortex-M0+ processor.
Figure 9. Freedom development platform
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4.6 3.3 to 5.0 V translator board
KITGD3162TREVB translator enables level shifting of signals from MCU 3.3 to 5.0 V SPI
communication.
Figure 10. 3.3 to 5.0 V translator board
Jumper Position Function
1-2 selects 5.0 V for 5.0 V compatible gate driveVCCSEL (J3)
2-3 selects 3.3 V for 3.3 V compatible gate drive
1-2 selects PWM high-side control from KL25Z MCUPWMH_SEL (J4)
2-3 selects PWM high-side control from fiber optic receiver inputs
1-2 selects PWM low-side control from KL25Z MCUPWML_SEL (J5)
2-3 selects PWM low-side control from fiber optic receiver inputs
Table 6. Translator board jumper definitions
5 Configuring the hardware
FRDMGD3162RPEVM is connected to compatible SiC MOSFET RoadPak module with
a DC link capacitor as shown in Figure 11. Double pulse and short-circuit testing can be
conducted utilizing a Windows-based PC with FlexGUI software.
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Suggested equipment needed for test:
•Rogowski coil high-current probe
•High-voltage differential voltage probe
•High sample rate digital oscilloscope with probes
•DC link capacitor compatible with RoadPak module
•SiC MOSFET RoadPak module
•Windows based PC
•High-voltage DC power supply for DC link voltage
•Low-voltage DC power supply for VSUP
–+12 V DC gate drive board low-voltage domain
•Voltmeter for monitoring high-voltage DC link supply
•Load coil for double pulse and short-circuit testing
Figure 11. Evaluation board and system setup
6 Installation and use of software tools
Software for the FRDMGD3162RPEVM is distributed with the FlexGUI tool (available on
NXP.com). Necessary firmware comes pre-installed on the FRDM-KL25Z with the kit.
Even if the user intends to test with other software or PWM, it is recommended to install
the software for the FRDMGD3162RPEVM as a backup or to help debugging.
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6.1 Installing FlexGUI on your computer
The latest version of FlexGUI supports all versions of GD31xx gate drivers. It is designed
to run on any Windows 10 or Windows 8 based operating system. To install the software,
do the following:
1. Go to www.nxp.com/FlexGUI and click Download.
2. When the FlexGUI software page appears, click Download and select the version
associated with your PC operating system.
3. FlexGUI wizard creates a shortcut, an NXP FlexGUI icon appears on the desktop. By
default, the FlexGUI executable file is installed at C:\NXP_GD31xx_GUI-x.x.x.msi.
Installing the device drivers overwrites any previous FlexGUI installation and replaces
it with a current version containing the GD31xx drivers. However, configuration files
from the previous version remain intact.
6.2 Configuring the FRDM-KL25Z microcode
Figure 12. FRDM-KL25Z setup and interface
By default, the FRDM-KL25Z delivered with this kit is preprogrammed with the current
and most up-to-date firmware available for the kit.
A way to check quickly that the microcode is programmed and the board is functioning
properly, is to plug the KL25Z into the computer, open FlexGUI, and verify that the
software version at the bottom is 6.4 or later (see Figure 13).
If a loss of functionality following a board reset, reprogramming, or a corrupted data
issue, the microcode may be rewritten per the following steps:
1. To clear the memory and place the board in boot loader mode, hold down the reset
button while plugging a USB cable into the OpenSDA USB port.
2. Verify that the board appears as a BOOTLOADER device and continue with step 3. If
the board appears as KL25Z, you may go to step 6.
3. Download the Firmware Apps .zip archive from the PEmicro OpenSDA webpage
(http://www.pemicro.com/opensda/). Validate your email address to access the files.
4. Find the most recent MDS-DEBUG-FRDM-KL25Z_Pemicro_v118.SDA and
copy/drag-and-drop into the BOOTLOADER device.
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5. Reboot the board by unplugging and replugging the connection to the OpenSDA
port. Verify now that the device appears as a KL25Z device to continue.
6. Locate the most recent KL25Z firmware; which is distributed as part of the FlexGUI
package.
a. From the FlexGUI install directory or zip file, downloaded, find the firmware bin
file “flexgui-fw-KL25Z_usb_hid_gd31xx-Vx.x.x.bin”.
b. This .bin file is a product/family-specific configuration file for FRDM-KL25Z
containing the pin definitions, SPI/PWM generation code, and pin mapping
assignments necessary to interface with the translator board as part of
FRDMGD3162RPEVM.
7. With the KL25Z still plugged through the OpenSDA port, copy/drag-and-drop the .bin
file into the KL25Z device memory. Once done, disconnect the USB for OpenSDA
port and plug into the other USB port, labeled KL25Z.
a. The device may not appear as a distinct device to the computer while connected
through the KL25Z USB port, this is normal.
8. The FRDM-KL25Z board is now fully set up to work with FRDMGD3162RPEVM and
the FlexGUI.
a. There is no software stored or present on either the driver or translator boards,
only on the FRDM-KL25Z MCU board.
All uploaded firmware is stored in non-volatile memory until the reset button is hit on the
FRDM-KL25Z. There is no need to repeat this process upon every power up, and there is
no loss of data associated with a single unplug event.
6.3 Using the FlexGUI
The FlexGUI is available from http://www.nxp.com/FlexGUI as an evaluation tool
demonstrating GD31xx-specific functionality, configuration, and fault reporting. FlexGUI
also includes basic capacity for the FRDMGD3162HBIEVM to control an IGBT or SiC
module, enabling double pulse or short-circuit testing.
SPI messages can be realized graphically or in hexadecimal format. CSB is selectable to
address one or both GD31xx on the board via daisy chain. See Figure 13 to Figure 33 for
FlexGUI for GD31xx internal register read and write access.
Starting FlexGUI for GD31xx
•FlexGUI install program (C:\NXP_GD31xx_GUI-x.x.x.msi)
•Download FlexGUI and run the install program on your PC.
•When you start the application, Figure 13 allows you to select the target application
board, feature set (standard or daisy chain), target MCU, and USB interface. Leave all
settings as shown.
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Figure 13. Kit selection
FlexGUI settings
•Access settings by selecting Settings from the File menu
Figure 14. GUI settings menu
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