Pace TF 1500 BGA User manual

TF 1500 BGA Rework Station
Operation and Maintenance Manual
Manual Number 5050-0525 (Revision B)

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Table of Contents
Packing Contents, Standard Items..................................3
Specifications ..................................................................3
Parts Identification...........................................................4
Safety Information ...........................................................5
Features ..........................................................................5
Set-Up.............................................................................7
Connect ................................................................7
Start up.................................................................7
Inserting vacuum pick...........................................7
Inserting nozzle.....................................................8
Set up screen features..........................................9
Alignment screen features..................................11
Production screen features.................................12
Profile development screen features ..................13
Inspection screen features..................................15
Calibration...........................................................16
Operation.......................................................................19
Production...........................................................19
Component removal............................................22
Profile development............................................23
Temperature Control .....................................................25
Available Nozzles/Accessories/Optional Items..............25
Maintenance..................................................................25
Heater Replacement......................................................27
Adjustments and Alignments.........................................34
Regulation .....................................................................39
Service and Warranty....................................................39

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1. Packing Contents, Standard Items
Description PartNumber
TF 1500 8007-0410 (120V)
8007-0411 (230V)
PC -
Monitor -
Keyboard -
Mouse -
Vacuum Pick 1272-0005-P1
Vacuum Pick Kit 6993-0060
Suction Cups 6993-0202-P1
Alignment Board 4018-0100-P1
Mounting Platform Stencil 1321-0725
Mounting Platform Flux Dip 1321-0735
Hot Grip Removal Pad 1100-0307
Thermocouples (4) 1340-0174-P1
Hex Wrench Kit 6016-0034
Power Cord 1332-0224
Video Cable 3008-0168
2. Specifications:
Part Number 8007-0410
Dimensions 737 mm H x 686 mm W x 737 mm D
(29” x 27” x 29”)
Weight (w/o computer) 45 kgs (100 lbs)
Power Requirements 115 VAC, 60 hz or 230 VAC, 50 Hz
2000 watts
PC Pentium 4, 256M Ram, Floppy, CD
Top Heater Adjustable convective air (air or N2),
Maximum 20 SLPM, 1600 watts
100 to 400 deg C, 212 to 750 deg F
Bottom Heater IR, 400 watts, 2 @ 200w each
100 to 221 deg C, 212 to 430 deg F
Vacuum 450 mm Hg
Optics High resolution, Dual Color Vision
Overlay System
Positioning Accuracy (Z travel) +/- 25 umeters (0.001”)
Video 2 Composite Video (external)
1 “S” Video (Internal)
15” Integrated color Flat Panel
Monitor
PC Board Size 305 x 305 mm, 12” x 12”
Component Size 35 mm x 35mm, 1.38” x 1.38” max.

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TF 1500 Parts Identification
Figure 1
A. Air Flow Meter This device is used to control and monitor the airflow
through the reflow head.
B. Sensor Input The sensor inputs are K-type thermo-couples.
Measured temperatures are displayed through the PC
software in real time for use in making profile graphs.
C. Cooling Fan The component and PCB are cooled by the cooling fan,
which can be set to activate automatically after the
reflow cycle is complete or operated manually.
D. LCD Display Monitor Displays PC software.
E. Keyboard Used to enter information into software.
F. Reflow Head Contains the top-side heater and moves up and down
via an electric motor that is controlled through the
software. The reflow head is clutched to prevent
excessive downward force from being applied.
A
B
C
D
E
F
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H
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G. Optics Housing Contains the camera and beam splitter (prism). The
housing is retractable and should be kept in the retracted
position when not in use. The lights for the optics will
turn on/off automatically when the housing is
extended/retracted.
H. Bottom Side Heater Used to warm the PCB from the underside. It is an IR
type heating source.
I. Board Holder The board holder is fully adjustable in the X direction
only. Fine adjustment of both the X and Y direction is
achieved by using the adjusting knobs on the end of the
holder for X and on the front of the machine for Y.
The right side of the holder is spring loaded to hold the
PCB securely.
J. On / Off Switch Used to turn the system on or off. When turning off the
system, always turn off the PC using the windows
interface first.
K. Mouse Used to enter information into software.
L. Emergency Off Switch In case an emergency shut down is necessary, press
this button.
3. Safety Information
a. Do not contact the Heater or its peripheral parts during operation.
b. Once turned off, let the unit cool completely before contacting.
c. When using fluxes, use fume extraction equipment or use in a well-ventilated
area to minimize operator exposure to fumes.
d. Do not use near combustible vapors.
e. Do not leave the equipment unattended when in use.
f. Do not open rear panel without disconnecting power cable.
4. Features
a. The TF 1500 is ideal for post assembly rework, repair, and low volume/short run
production operations. The TF 1500 can remove and install PBGAs, CSPs, FCs,
LGAs, LCC’s and other SMDs.
b. Featuring unparalleled thermal performance, The TF 1500’s flexibility and state
of the art process software means no other system is easier to use. The TF 1500
is a PC driven, semi-automated system that requires a Pentium ® 4 PC featuring
Windows XP® Professional OS. The unique standard software package offers
much more than just an operator interface. TF 1500’s advanced vision and
placement system is highly accurate and can quickly magnify even the smallest
components for easy alignment. TF 1500 uses a combination of convective top
heating coupled with powerful IR bottom heating for an effective, repeatable
heating process.
c. Economical and easy to use, the TF1500 Rework System delivers high-end
BGA/CSP functionality, moving far beyond expensive, bulky rework machines by
offering unparalleled performance at an affordable price.
d. REFLOW FUNCTION
i. Unequalled programmability and process control ensures successful,
repeatable installation.
ii. The powerful and responsive 1600 Watt top heater, with closed loop
temperature control, coupled with proven TF 3000 nozzle design ensures
uniform temperature distribution when heating.

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iii. High power bottom heaters allow for successful and repeatable reflow at
safe, low temperatures.
iv. Profiles are programmed through the PC software.
v. Creating the perfect profile is easy with real time adjustment of profile
parameters through the PC.
vi. Store and recall an infinite number of profiles.
vii. Two pre-defined profiles for use as baselines when developing custom
profiles are included.
viii. Self contained, no external air supply or vacuum connections required.
Can also be used with N2from external source.
ix. Semi-automated, motorized reflow head.
x. Four thermo-couple sensor inputs ensure successful profile development
and monitoring.
xi. External fan to cool PCB and component to below solder melt
temperatures after reflow.
e. ALIGNMENT AND PLACEMENT FUNCTION
i. The component is held by a precision vacuum placement pick, which is
located within the heater assembly.
ii. High resolution Dual Color Vision Overlay System (VOS) with color
camera and dichroic prism. VOS does not require routine calibration,
eliminating costly downtime and operator frustration.
iii. Color Camera with 72x zoom capability, featuring auto-focus zoom.
iv. Lighting system uses “Ultra Bright” Red and Blue LEDs for maximum
contrast of lands and solder balls on component.
v. Independent lighting controls for component and PCB to maximize
overlay contrast.
vi. Retractable optics housing protects VOS from dirt and contamination.
vii. Accurately places any array package up to 35mm (1.3") square and as
small as 1 mm (.04”) square.
viii. Precise micrometer adjustment for X, and Y axis with Theta adjustment
ensures placement accuracy.
ix. High-flow vacuum pick holds component securely.
x. Images are viewed through the PC in standard or full screen viewing
options.
f. PRE-HEAT FUNCTION AND BOARD HOLDER
i. Fully adjustable, precision, spring loaded board holder with top or bottom
PCB registration. Precise micrometer adjustment for X and Y adjustment
ensures placement accuracy for repeatability.
ii. Rugged, stable board platform to hold and support the PCB.
iii. Unique board holding fixtures that are able to hold very small and odd
shaped PCBs.
iv. Board supports are standard with the system.
v. Integrated, powerful, IR pre-heater with closed loop temperature control
ensures process integrity by delivering heat evenly, time after time.

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5. Set-Up
a. Connect
i. The TF 1500 comes configured for internal or external air. Select air
source; internal pump or external N2. (Figure 2a & 2b)
Warning: Do not run unit in N2mode unless N2supply is connected and
on. 1. Open rear panel.
2. Turn key to desired air supply.
3. Close rear panel.
Figure 2a Figure 2b
ii. Insert PC into brackets on back of PC.
iii. Monitor
4. Connect power cord.
5. Connect video cable to the 9-pin connector of the PC.
iv. Keyboard – connect cable to computer.
v. Mouse – connect cable to computer.
vi. Connect cables between PC and back of TF 1500 according to labels.
vii. Connect power cords to TF 1500 and PC.
b. Start up
i. Turn on circuit breaker on back of unit.
ii. Turn on power switch on front of unit.
iii. Turn on computer.
iv. Turn on monitor.
v. Mouse click on TF 1500 icon.
vi. Read and accept license.
N
2Ke
y
N
2Connection

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c. Inserting/changing vacuum pick.
i. Insert proper size vacuum pick. The diameter needs to be smaller than
the top of the component. The pick screws into place. (Figure 3a)
Figure 3a
d. Inserting/changing nozzle. (Figure 3b)
i. Insert proper size nozzle. The nozzle should be 3 mm larger than the
outside of the component. If the proper nozzle size cannot fit onto the
PCB due to adjacent components being to close, use a smaller nozzle or
keep the nozzle approximately 1mm above the part. Align the nozzle
under the square hole in the reflow head. The nozzle snaps into place.
The nozzle can be positioned with the front surface parallel to the PCB or
at a diagonal by moving the lever by the nozzle housing. To rotate the
nozzle, first loosen the retention screw in front of the housing.
Figure 3b
Vacuum
p
ic
k
N
ozzle

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e. Set up screen features. (Figure 4)
Figure 4
i. Set Password. Setup and profile settings can be password protected.
ii. Set Language. Software text language can be changed.
iii. Set temperature for Celsius or Fahrenheit.
iv. Set yellow temperature reference lines on the profile graph.
v. Set setback time. Machine will go into setback after selected idle time.
Setback reduces heater temperatures during extended idle times to
extend heater life.
vi. Set auto shutoff time. Machine will completely shut down after selected
idle time.
vii. Set the limit on the focus range and nozzle movement.
viii. Set setback and auto shutoff times for component release and PCB
removal.
ix. Type the text for these three displays.
x. Run the activity log.
xi. Initiate prism calibration sequence. Further explanation is in par. 5j.
xii. Initiate heater arm sensor test. Checks proper orientation and operation
of heater arm position sensors.
xiii. Initiate camera sensor test. Checks proper orientation and operation of
camera position sensor.
xiv. Initiate pick sensor test. Checks proper orientation and operation of pick
position sensor.
xv. Blower test. Checks operation of heater blower.
xvi. Cooling fan test. Checks operation of cooling fan.
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xvii. Vacuum pump test. Tests operation of vacuum pump.
xviii. Thermocouple test. Tests active thermocouple circuitry.
xix. Reset diagnostics. Must be clicked after any diagnostic test is performed
to reset the tests to default settings.

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f. Alignment Screen Features (Figure 5)
Figure 5
i. Component/PCB alignment image. Proper alignment is viewed here
showing the PCB pads (blue) directly under the component pads (red).
ii. Zoom bar. The image can be zoomed in or out using this bar or the up
and down arrows on the keyboard.
iii. Focus bar. The image can be manually focused using the slider on this
bar or it can be automatically focused by checking the box by ‘auto’.
iv. Instructions. Follow these instructions to proceed through the alignment
sequence.
v. Screen options.
1. Edit – Change Instructions.
2. Cancel – Cancel changes made to instructions.
3. Save – Save changes made to instructions.
4. Reset – Returns to factory set instructions.
vi. Full Screen. Click on here to view image full screen.
vii. Nozzle step adjustment. If component (red) cannot be aligned to PCB
(blue) or you cannot focus, adjust nozzle height up or down with this
option until better alignment or focus is achieved.
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g. Production Screen Features (Figure 6)
Figure 6
i. Profile Indicator. Indicates currently selected profile. A new profile can
be selected from a list of saved profiles by clicking on the arrow.
ii. Profile Instructions. Instructions entered by the developer can be viewed
here.
iii. Temperature and time settings. Settings for the profile are indicated
here.
iv. Sensor indicators. Real-time sensor readings can be viewed here if
thermocouples are used.
v. Graph. A saved graph and, if thermocouples are used, an active trace
graph are viewed here.
vi. Profile Status Bar. Indicates the current status of a running profile.
vii. Heater Button. Used to turn the heater back on after the machine has
been in setback. Blinks red if in setback and must be selected to
continue sequence.
viii. Status Bar.
1. System status – shows if system is ‘normal’, in ‘setback’ or
‘shutdown’.
2. Heater status – Shows ‘ready’ if bottom heater is in range.
Shows ‘not ready’ if bottom heater is not in range. The software
will not continue until it is in ‘ready’ status.
3. Bottom heater temperature – Shows real time bottom heater
temperature.
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ix. Operator’s Comments. Provides a space for the operator to write
comments.
x. Options. Save to save operator’s comments and reset to clear screen.
xi. Mode. Indicates whether this is an installation or removal profile.
xii. Flux Dip Option. Indicates if the Flux Dip option is selected.
xiii. Abort Button. Click at any time to abort the process and return to the
beginning.
xiv. Sequencing Button. Click here to proceed to next step in the operation.
xv. Nozzle Step Indicator. Indicates how many steps the nozzle will lower to
properly position itself for operation.
xvi. Fan On/Off Selector. Manual on/off switch for the cooling fan.
h. Profile Development Screen Features (Figure 7)
Figure 7
i. Temperature and Time Settings. Used to indicate and set the
temperatures and times for the profile.
ii. Graph. Draws a trace graph of temperatures measured by
thermocouples. Colored bars indicate the times and temperatures
selected in the settings. Times and temperatures can be changed before
and during a profile by dragging these lines to a different setting.
1. red – top heater
2. brown – bottom heater
3. purple – time dividing lines between zones
4. yellow – reference lines set in the setup screen
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iii. Sensor Indicators. Indicates real-time temperature of thermocouples in
use.
iv. Trial Run Window. Indicates which trial runs are showing on the graph.
There can only be three trial runs saved in this window.
v. Clear Trial Run Selector. Clears the checked trial runs when clicked.
vi. Profile Status Bar. Indicates the current status of a running profile.
vii. Status Bar. Same as production screen.
viii. Profile Name. Indicates current selected profile.
ix. Options.
1. New – clears all settings
2. Open – opens a profile saved on the computer
3. Save – saves profile to file name showing in the profile name
window
4. Save as – saves profile to new file name
5. Print – prints current settings
6. Export – saves profile as a spreadsheet file
x. Profile Instructions. Insert instructions for the operator.
xi. Cycle Start Button. Start the selected profile.
xii. Mode. Select whether this is to be an installation or removal profile.
xiii. Flux Dip Option Selector. Select whether this option will be used.
xiv. Home Button. Aborts the profile when clicked and returns to the
beginning screen.
xv. Nozzle Head Position Selector. When the reflow head lowers
automatically, it stops above the PCB. Use this to lower the PCB flush to
the PCB. The number of steps it is lowered is indicated in the window
below the buttons. This number is saved for operation.
xvi. Sequencing Button. Click here to proceed to next step in the operation.
xvii. Nozzle Steps Indicator. Indicates the number of steps the head is
lowered by the nozzle head buttons.
xviii. Fan On/Off Button. Manual on/off switch for the cooling fan.

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i. Inspection Screen Features
i. Inspection Image. The inspection image selected is viewed here.
ii. Select Inspection Source. Select whether the image is from an x-ray or
alternate source.
iii. Select Full Screen Image.
iv. Library Image. The computer has a stored library of x-ray images with
explanations of the viewed defects.
v. Select Library Image. Use these arrows to select a different library
image.
vi. Capture or Print Inspection Image. Click on capture to freeze the current
image in the window. Click print to send the image to a printer.
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j. Prism Calibration – This step is required to ensure the prism is properly aligned
so when the software shows the PCB and component visually aligned, they are
actually physically aligned.
i. Select setup screen. (Figure 8)
Figure 8
ii. Select prism calibration.
iii. Monitor now shows calibration screen. (Figure 9)
Figure 9
iv. Place alignment board with BGA in place in mounting brackets.
Prism Calibration

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v. Align PCB so red laser sighting light is roughly centered on BGA.
(Figure 10)
Figure 10
vi. Mouse click on green button, “Pickup.”
vii. Pull camera out. Make sure it is all the way out into the detent.
(Figure 11)
Figure 11
viii. Mouse click on green button, “Focus.”
ix. Adjust focus with up and down arrows on keyboard or by moving slide on
screen. Refer to para. 5g.
Camera Housin
g

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x. Image in the window should be aligned like figure 12.
Figure 12
xi. If it is not, adjust prism until it is.
1. Loosen the setscrews from the light adjustment knobs (Figure
13)
2. Remove the knobs
3. Remove the four screws (2 on each side) from the cameras’
sheet metal cover (Figure 13)
4. Remove the cover
5. Loosening the top screws (A) and tightening the bottom screws
(B) adjusts the prism down.
6. Loosening the bottom screws (B) and tightening the top screws
(A) adjusts the prism up.
7. Loosening the right center screw © allows you to rotate the prism
around the y-axis.
8. Replace the cover
9. Replace the four screws
10. Replace the knobs
11. Adjust the light adjustment knobs and tighten the setscrews
xii. Return to setup screen. Mouse click on button, “Return to Setup.”

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Figure 13 Figure 14
6. Operation
Note: It is recommended that the TF 1500 be turned on for at least 15 minutes before
use to ensure the bottom side heater has reached its set temperature and stabilized.
Once the bottom side heater is at operating temperature it will deliver consistent heating,
ensuring highly repeatable heating from operation to operation.
It is advisable to conduct a trial operation each day to ensure all systems are
operating properly. Also, it is important to verify the airflow of the unit with each profile to
be run.
Verify that the devices/parts being soldered to the PCB do not exceed the height
limitations. Exceeding the limitations may interfere with the operation of the machine.
The maximum height of any component or device on the top of the PCB is limited
to 30mm (1.2”).
The maximum height of any component or device on the bottom of the PCB is
limited to 15 mm (0.6”).
Section 5 Calibration and Section 11 Adjustments and Alignments must be
performed before operation.
a. Production. Component alignment and installation – Note: If at any time you
need to abort the process mouse click on the Red “Home” button.
i. Mouse click on Production to switch to the production screen. (Figure
6)
ii. Select a profile.
iii. Insert the proper vacuum pick. (Para. 5d)
iv. Insert the proper nozzle. (Para. 5e)
v. Place the PCB between the arms on the TF 1500 and tighten the
retention screw. (Figure 15)
Cover
Screws
Light
Adjustment
Knobs
A
B
C

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Figure 15
vi. Position the board so the red laser sighting light is roughly in the center
of the placement site. To move the board forward and back simply
move the PCB in the arms. To move the assembly left and right push
the release handle away from you and move the assembly. Pull the
release handle towards you to secure the assembly.
vii. Pull the camera out. (Figure 16)
Figure 16
viii. Mouse click on the green button.
ix. Place the component in the mounting plate on top of the camera
housing. (Figure 17a) The component needs to be oriented the same
as the nozzle. Adjust per paragraph 11.
Retention Screw Release Handle