transistorsand semiconductor "chip" components. The following techniques should
be used to help reduce the incidence of component damage caused by electro static
discharge (ESD).
1. Immediately before handling any semiconductor component or semiconductor-
equipped assembly, drain off any ESD on your body by touching a known earth
ground. Alternatively, obtain and wear a commercially available discharging ESD
wrist strap, whichshould be removed for potential shock reasons prior to applying
power to the unit under test.
2. After removing an electrical assembly equipped with ES devices, place the
assembly on a conductive surface such as alminum foil, to prevent electrostatic
charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4. Use only an anti-static solder removal device. Some solder removal devices not
classified as "anti-static (ESD protected)" can generate electrical charge sufficient
to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges
sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective package until
immediately before you are ready to install it. (Most replacement ES devices are
packaged with leads electrically shorted together by conductive foam, alminum foil
or comparableconductive material).
7. Immediately before removing the protective material from the leads of a replacement
ES device, touch the protective material to the chassis or circuit assembly into
which the device will be installed.
Caution
Be sure no power is applied to the chassis or circuit, and observe all other safety
precautions.
8. Minimize bodily motions when handling unpackaged replacement ES devices.
(Otherwise hamless motion such as the brushing together of your clothes fabric or
the lifting of your foot from a carpeted floor can generate static electricity (ESD)
sufficient todamage an ES device).
3. Precaution of Laser Diode
