Panasonic DMR-E85HP User manual

© 2004 Matsushita Electric Industrial CO., Ltd. All
rights reserved. Unauthorized copying and
distribution is a violation of law.
DMR-E85HP
DMR-E85HPC
Colour
(S).......................Silver Type
DVD Video Recorder
ORDER NO.DSD0403003C1
B24

1 Safety precautions 4
1.1. General guidelines 4
1.2. Caution for fuse replacement 4
2 Prevention of Electrostatic Discharge (ESD) to Electrostatic
Sensitive (ES) Devices 5
3 Precaution of Laser Diode 6
4 How to replace the Lithium Battery 7
5 Handling the Lead-free Solder 7
5.1. About lead free solder (PbF) 7
6 Each Buttons 8
7 New Features 9
7.1. Function of Power Circuit (IC1150) 9
8 Taking out the Disc from RAM-Drive Unit when the Disc
cannot be ejected by OPEN/CLOSE button 12
8.1. Forcible Disc Eject 12
8.2. When the Forcible Disc Eject can not be done. 12
9 Service Explorer 13
10 Self-Diagnosis and Special Mode Setting 16
CONTENTS Page Page
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DMR-E85HP / DMR-E85HPC

10.1. Self-Diagnosis Functions 16
10.2. Special Modes Setting 18
10.3. Service Modes 20
11 Assembling and Disassembling 25
11.1. Disassembly Flow Chart 25
11.2. P.C.B. Positions 25
11.3. Top Case 26
11.4. Digital P.C.B. 26
11.5. Front Panel 27
11.6. Front (R) P.C.B. 27
11.7. HDD 27
11.8. HDD Bracket 28
11.9. DVD-RAM Drive 28
11.10. Rear Panel 29
11.11. Main P.C.B. 29
11.12. Power P.C.B. 30
11.13. IR P.C.B. 30
12 Service Fixture and Tools 31
13 Service Positions 32
13.1. Checking and Repairing of Power P.C.B. 32
13.2. Checking and Repairing of Main P.C.B. 33
13.3. Checking and Repairing of Digital P.C.B. 34
13.4. Checking and Repairing of DVD-RAM Drive 35
13.5. Checking and Repairing of HDD 36
13.6. Checking of IR P.C.B. 37
14 Adjustment Procedures 38
14.1. After replacing the RAM Drive with new one 38
14.2. When the unit does not operate normally after replacing
the Timer Microprocessor with new one 38
15 Standard Inspection Specifications after Making Repairs 38
16 Voltage and Waveform Chart 39
16.1. Power P.C.B. 39
16.2. Main P.C.B. 39
16.3. IR P.C.B. 41
16.4. Front (R) P.C.B. 41
16.5. P9001 Connector 42
16.6. Waveform Chart 43
17 Abbreviations 44
18 Block Diagram 47
18.1. Power Supply Block Diagram 47
18.2. Analog Video Block Diagram 49
18.3. Analog Audio Block Diagram 50
18.4. Timer Block Diagram 51
18.5. Digital Block Diagram 52
18.6. Digital Block IC Pin Terminal Chart (TC1-22) 53
19 Schematic Diagram 55
19.1. Interconnection Schematic Diagram 55
19.2. Main Power Schematic Diagram 56
19.3. Sub Power Section (Main P.C.B. (1/5)) Schematic
Diagram (P) 57
19.4. Main Net Section (Main P.C.B. (2/5)) Schematic Diagram
(M) 58
19.5. Video I/O Section (Main P.C.B. (3/5)) Schematic Diagram
(V) 59
19.6. Audio Main Section (Main P.C.B. (4/5)) Schematic
Diagram (A) 61
19.7. Timer Section (Main P.C.B. (5/5)) Schematic Diagram (T)
62
19.8. Glue Net Section (Digital P.C.B. (1/5)) Schematic Diagram
(GN) 64
19.9. AV Encoder Section (Digital P.C.B. (2/5)) Schematic
Diagram (EN) 66
19.10. Real Time Stream Control (RTSC) Section (Digital P.C.B.
(3/5)) Schematic Diagram (TR) 69
19.11. AV Decoder/Main CPU Section (Digital P.C.B. (4/5))
Schematic Diagram (MC) 71
19.12. Audio I/O Section (Digital P.C.B. (5/5)) Schematic Diagram
(AI) 73
19.13. IR Schematic Diagram 74
19.14. Front (R) Schematic Diagram 75
20 Print Circuit Board 77
20.1. Power P.C.B. 77
20.2. Main P.C.B. 78
20.3. Digital P.C.B. 83
20.4. IR P.C.B. 86
20.5. Front (R) P.C.B. 87
21 Exploded Views 89
21.1. Casing Parts & Mechanism Section 1 89
21.2. Casing Parts & Mechanism Section 2 90
21.3. Packing & Accessories Section 91
22 Replacement Parts List 92
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DMR-E85HP / DMR-E85HPC

1.1.1. Leakage current cold check
1.Unplug the AC cord and connect a jumper between the two
prongs on the plug.
2.Measure the resistance value, with an ohmmeter, between
the jumpered AC plug and each exposed metallic cabinet
part on the equipment such as screwheads, connectors,
control shafts, etc. When the exposed metallic part has a
return path to the chassis, the reading should be between
1M9and 5.2M9.
When the exposed metal does not have a return path to
the chassis, the reading must be .
Figure 1
1.1.2. Leakage current hot check
(See Figure 1 .)
1.Plug the AC cord directly into the AC outlet. Do not use an
isolation transformer for this check.
2.Connect a 1.5k9, 10 watts resistor, in parallel with a 0.15µF
capacitors, between each exposed metallic part on the set
and a good earth ground such as a water pipe, as shown in
Figure 1.
3.Use an AC voltmeter, with 1000 ohms/volt or more
sensitivity, to measure the potential across the resistor.
4.Check each exposed metallic part, and measure the
voltage at each point.
5.Reverse the AC plug in the AC outlet and repeat each of the
above measurements.
6.The potential at any point should not exceed 0.75 volts
RMS. A leakage current tester (Simpson Model 229 or
equivalent) may be used to make the hot checks, leakage
current must not exceed 1/2 milliampere. In case a
measurement is outside of the limits specified, there is a
possibility of a shock hazard, and the equipment should be
repaired and rechecked before it is returned to the
customer.
1 Safety precautions
1.1. General guidelines
1.When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or
damaged by the short circuit.
2.After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly
installed.
3.After servicing, make the following leakage current checks to prevent the customer from being exposed to shock hazards.
1.2. Caution for fuse replacement
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DMR-E85HP / DMR-E85HPC

2 Prevention of Electrostatic Discharge (ESD) to
Electrostatic Sensitive (ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called
Electrostatic Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistor-sand
semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage
caused by electrostatic discharge (ESD).
1.Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your
body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.
2.After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.
3.Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4.Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static (ESD protected)" can
generate electrical charge sufficient to damage ES devices.
5.Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6.Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most
replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable
conductive material).
7.Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be installed.
Caution
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8.Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise hamless motion such as the brushing
together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity sufficient to damage
an ES device).
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DMR-E85HP / DMR-E85HPC

3 Precaution of Laser Diode
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DMR-E85HP / DMR-E85HPC

4 How to replace the Lithium Battery
REPLACEMENT PROCEDURE
1.Remove the Top case and DVD-RAM drive unit with Main P.C.B. by referring the Disassembling Procedure.
2.Unsolder the Lithium Batteries: B7501 and then replace it into new one.
( As shown in 20.2.1. The Main P.C.B. )
NOTE:
The lithium battery is a critical component. ( Type No.: CR2354-1GUF Manufactured by Panasonic. )
It must never be subjected to excessive heat or discharge.
It must therefore only be fitted in equipment designed specifically for its use.
Replacement batteries must be of the same type and manufacture.
They must be fitted in the same manner and location as the original battery, with the correct polarity contacts observed.
Do not attempt to re-charge the old battery or re-use it for any other purpose.
It should be disposed of in waste products destined for burial rather than incineration.
5 Handling the Lead-free Solder
5.1. About lead free solder (PbF)
Distinction of PbF P.C.B.:
P.C.B.s (manufactured) using lead free solder will have a PbF stamp on the P.C.B.
Caution:
·
· ·
· Pb free solder has a higher melting point than standard solder; Typically the melting point is 50 - 70°F (30 - 40°C) higher.
Please use a high temperature soldering iron. In case of the soldering iron with temperature control, please set it to 700 ±
20°F (370 ± 10°C).
·
· ·
· Pb free solder will tend to splash when heated too high (about 1100°F/600°C).
·
· ·
· When soldering or unsoldering, please completely remove all of the solder on the pins or solder area, and be sure to heat
the soldering points with the Pb free solder until it melts enough.
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DMR-E85HP / DMR-E85HPC

6 Each Buttons
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DMR-E85HP / DMR-E85HPC

2. Equivalence Circuit to IC1150
3. Startup Circuit
When power is turned on, input voltage of the Switching
Transformer is supplied to IC1150 as the startup power.
After IC1150 has started, the startup current is cut off.
The current of Startup Circuit is supplied as constant
current source in IC1150 and as charge current for the
capacitor connected between Vcc terminal and GND out
side of IC1150 until Vcc reaches 14.4V.
When Vcc reaches 14.4V, the Startup Circuit is cut off, then
oscillation starts.
After then, power of IC1150 is supplied from control coil.
In case, the power failure or short out of the load, when Vcc
becomes 9.0V; the oscillation stops, furthermore Vcc
becomes 7.1V the Startup Circuit starts up and Vcc starts to
rise.
Pin No. Symbol Description
1Z/C Trigger input terminal.
Zero detection voltage: 0.25V
It becomes less than 3V, the mode turns to
standby.
2F/B Bias current feedback input terminal.
lSwitching ON time (min.) ~ (max.)
1.5V ~ 4.5V / 0µsec. ~ 25µsec.
lIn standby mode
Oscillation stops: less than 0.8V
Oscillation starts: over 1.8V
3 GND GND terminal
4Vcc Power terminal of IC.
Oscillation starting voltage: Vcc = and over 14.5V
Oscillation stop voltage: Vcc = and less than 9.6V
Over voltage latching voltage: Vcc = 20V
5Drain Drain terminal for Main switching material.
7 New Features
7.1. Function of Power Circuit (IC1150)
1. General
We adopted IC module as the Switching Power Circuit for lower power consumption.
IC1150 is constructed with Switching materials and Control IC, and is partial resonance module.
We realized Switching Power with high efficiency, low noise and low power consumption.
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DMR-E85HP / DMR-E85HPC

Startup Circuit Timing Chart
Function of Z/C Terminal
When voltage of Z/C reaches 0.25V, Gate signal is output and Drain current starts to flow.
Function of F/B terminal
F/B signal decides Switching ON width in low voltage controlling.
The Switching ON width responds to change of F/B Voltage.
Standby Function
When Z/C Voltage becomes less than 3V, the unit changes to Standby mode.
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DMR-E85HP / DMR-E85HPC