Panasonic DMRE100HP User manual

ORDERNO.DSD0307011C7
B24
DVDVideoRecorder
DMR-E100HP/ DMR-E100HPC/ DMR-E100HPL
Colour
(S).......................SilverType
SPECIFICATIONS
Specifications
Powersupply: AC120 V, 60 Hz
Powerconsumption: 42 W
Recording system: DVDvideo recording
standards(DVD-RAM),
DVDvideo standards(DVD-
R)
Optical pick-up: System with 1lens, 2
integration units(662 nm
wavelength forDVDs, 790
nmwavelength forCDs)
Recordablediscs: 12 cm 4.7GBDVD-RAM
discs
12 cm 9.4GBDVD-RAM
discs
8cm 2.8GBDVD-RAMdiscs
12 cm 4.7GBDVD-Rdiscs
(forGeneral Ver. 2.0)
8cm 1.4GBDVD-Rdiscs
(forGeneral Ver. 2.0)
Recording time: Max. 6hours
(Using 4.7GBdisc): XP:60 minutes
SP:120 minutes
LP:240 minutes
EP:360 minutes
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(Using built-in HDD): Max. 160 hours
XP:26 hours
SP:52 hours
LP:104 hours
EP:160 hours
(HDD capacity120GB)
Region number: Region No.1
Discs played: 12 cm 4.7GBDVD-RAM
discs
12 cm 9.4GBDVD-RAM
discs
8cm 2.8GBDVD-RAMdiscs
12 cm 4.7GBDVD-Rdiscs
(forGeneral Ver. 2.0)
8cm 1.4GBDVD-Rdiscs
(forGeneral Ver. 2.0)
DVD-VIDEOdiscs
CD-Audio discs (CD-DA)
Video CDdiscs
DVD-Audio discs
CD-R/ CD-RW discs
(CD-DA, Video CD, MP3
formatted discs)
Video system
TVsystem: NTSCsystem, 525 lines, 60
fields
Recording system: MPEG2(Hybrid VBR)/
MPEG4
Input: LINE(pin jack)x3, 1.0Vp-p;
75
Sconnectorx3
Y:1.0Vp-p;75
C:0.286 Vp-p;75
Output: LINE(pin jack)x2, 1.0Vp-p;
75
Sconnectorx2
Y:1.0Vp-p;75
C:0.286 Vp-p;75
Componentvideo output(480p/
480i): Y:1.0Vp-p;75
PB:0.7Vp-p;75
PR:0.7Vp-p;75
D-connectoroutput: Notprovided
Antennareception input: TVChannel:2ch-69ch, 75
CATVChannel:1ch-125ch,
75
RF converteroutput: Notprovided
Audio system
Recording system: DolbyDigital (XP/SP/LP/EP)
LINEARPCM(XPmodeonly)
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Input: LINE(pin jack)x3
Reference input: 309 mVrms
FS: 2Vrms (1kHz, 0dB)
Inputimpedance:47 k
Output: LINE(pin jack)x2
Reference output: 309
mVrms
FS: 2Vrms (1kHz, 0dB)
Outputimpedance:1k
(Load impedance:10 k )
Numberofchannels: Recording:2channels
Playback:2channels
Otherinput/outputconnectors: Digital audio optical output
connector(PCM, Dolby
Digital, DTS)
Driveunit: High Speed Drive
Card unit:
@JPEG
Card Slot: SDmemorycard/ PCCard
Type U
CompatibleMedia: SDmemorycard, APCCard
adaptorconforming to PC
Card StandardsATAFlash
PCCard, PCCard Adaptor
(SDmemoryCard,
MultiMediaCard, Compact
Flash, SmartMedia, Memory
Stick, XDpicturecard, Micro
drive),MobileHDD
Format: FAT12, FAT16
ImageFormat: JPEGDCF (Design rulefor
camerafileSystem)
(subsampling:4:2:2or4:2:0)
TIFF (Uncompressed RGB
chunky)
DPOF CompatibleNumberof
Pixels320x240-6144x4196
Thawing Time: Approx. 7sec (2Mpixels)
ASDVideo (MPEG4)
Card Slot: SDmemorycard/ PCCard
Type U
CompatibleMedia: SDmemorycard, Multi
mediacard, (SDslotonly)
MobileHDD (PCslotonly,
read only)
Video recording system: MPEG4conforming
Numberofpixels: superfine/ fine320x240
(QVGA)normal/ economy
176x144 (QCIF)
Video transferrate: superfine1050kbps, fine
430kbps, normal 300kbps,
economy100kbps
Audio recording system: G.726 conforming
Audio transferrate: 32kbps
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BSDVideo (MPEG2) *AfterVRconversion and
transferto HDD, the
playback ispossible.
Card Slot: SDmemorycard
CompatibleMedia: SDmemorycard, Multi
mediacard, (SDslotonly),
MobileHDD (PCslotonly
read only)
Format: MPEG2(SD-Video
EntertainmentVideo Profile)
(VRconversion and transfer
to HDD only)
DVInput: IEEE1394 Standard, 4pin
Dimensions: Approx.
430 (W)×79 (H)×296 (D)mm
[Approx. 1615 /16 “(W)×31/8
”(H)×1111 /16 ”(D)]
(excludingprotrusions)
Mass: Approx. 5.5kg (12.13 lbs)
Operating temperaturerange: 5 °C-40°C(41 °F-104 °F)
Operating humidityrange: 10 %-80 %RH(no
condensation)
Clock unit: Quartz-controlled 12-hour
digital display
LASERSpecification
Class I LASERProduct
Wavelength: 775-815 nm655-666 nm
Laserpower: No hazardousradiation is
emitted with thesafety
protection.
Powerconsumption in standbymode:
approx. 3.5W
Solder:
Thismodel uses lead free solder(PbF).
Notes:
Mass and dimensionsareapproximate.
Specificationsaresubjectto changewithoutnotice.
Notes:
ThepartofDVDRAMDrive(VXY1789)islisted separately.
Please referto ORDERNO. RAM0307003C0.
2003 Matsushita ElectricIndustrial CO., Ltd. All rights reserved.
Unauthorizedcopying and distribution isaviolation oflaw.
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1. SAFETYPRECAUTIONS
1.1. GENERALGUIDELINES
1. Whenservicing, observetheoriginal leaddress. Ifashortcircuit
isfound, replace all parts whichhavebeenoverheatedor
damagedbytheshortcircuit.
2. Afterservicing, see toitthat all theprotectivedevices suchas
insulation barriers, insulation papersshieldsareproperlyinstalled.
3. Afterservicing, make thefollowing leakagecurrentchecks to
preventthecustomerfrombeing exposedtoshock hazards.
1.1.1. LEAKAGE CURRENTCOLDCHECK
1. Unplug theACcordand connect ajumperbetweenthetwoprongs
on theplug.
2. Measuretheresistance value, withanohmmeter, betweenthe
jumperedACplug and eachexposedmetalliccabinet parton the
equipmentsuchas screwheads, connectors, control shafts, etc.
Whentheexposedmetallicparthas areturnpathtothechassis,
thereading shouldbebetween1M and 5.2M . / Whenthe
exposedmetal does nothaveareturnpathtothechassis, the
reading must be . Figure1
1.1.2. LEAKAGE CURRENTHOTCHECK (See Figure 1 .)
1. Plug theACcorddirectlyintotheACoutlet. Donotuse an
isolation transformerforthischeck.
2. Connect a1.5k , 10 watts resistor, inparallel witha0.15 F
capacitors, betweeneachexposedmetallicparton theset and a
good earthground suchas awaterpipe, as shownin Figure 1.
3. Use anACvoltmeter, with1000 ohms/voltormoresensitivity, to
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measurethepotential across theresistor.
4. Check eachexposedmetallicpart, and measurethevoltageat
eachpoint.
5. Reverse theACplug intheACoutlet and repeat eachoftheabove
measurements.
6. Thepotential at anypointshouldnotexceed0.75 volts RMS. A
leakagecurrenttester(Simpson Model 229 orequivalent) maybe
usedtomake thehotchecks, leakagecurrentmu3st notexceed1/
2milliamp. Incase ameasurementisoutsideofthelimits
specified, thereisapossibilityofashock hazard, and the
equipmentshouldberepairedand recheckedbeforeitisreturned
tothecustomer.
2. PREVENTIONOFELECTRO STATICDISCHARGE
(ESD) TO ELECTROSTATICALLYSENSITIVE (ES)
DEVICES
Somesemiconductor (solidstate)devices canbedamagedeasilybystaticelectricity. Such
componentscommonlyarecalledElectrostaticallySensitive (ES)Devices. Examples oftypical
ES devices areintegratedcircuitsand somefield-effecttransistorsand semiconductor "chip"
components. Thefollowing techniques shouldbeusedtohelpreduce theincidence of
componentdamagecausedbyelectro staticdischarge(ESD).
1. Immediatelybeforehandling anysemiconductorcomponentor
semiconductor-equippedassembly, drainoff anyESDon your
bodybytouching aknownearthground. Alternatively, obtainand
wearacommerciallyavailabledischarging ESDwrist strap,
whichshouldberemovedforpotential shock reasonspriorto
applying powertotheunitundertest.
2. Afterremoving anelectrical assemblyequippedwithES devices,
place theassemblyon aconductivesurface suchas alminumfoil,
topreventelectrostaticchargebuildup orexposureofthe
assembly.
3. Use onlyagrounded-tipsoldering iron tosolderorunsolderES
devices.
4. Use onlyananti-staticsolderremoval device. Somesolder
removal devices notclassifiedas "anti-static(ESDprotected)"can
generate electrical chargesufficienttodamageES devices.
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5. Donotuse freon-propelledchemicals. These cangenerate
electrical charges sufficienttodamageES devices.
6. DonotremoveareplacementES device fromits protective
packageuntil immediatelybeforeyou arereadytoinstall it. (Most
replacementES devices arepackagedwithleadselectrically
shortedtogetherbyconductivefoam, alminumfoil or
comparableconductivematerial).
7. Immediatelybeforeremoving theprotectivematerial fromthe
leadsofareplacementES device, touchtheprotectivematerial to
thechassisorcircuitassemblyintowhichthedevice will be
installed.
Caution
Besureno powerisappliedtothechassisorcircuit, and observe
all othersafetyprecautions.
8. Minimizebodilymotionswhenhandling unpackagedreplacement
ES devices. (Otherwise hamless motion suchas thebrushing
togetherofyourclothes fabricorthelifting ofyourfootfroma
carpetedfloorcangenerate staticelectricity(ESD)sufficient
todamageanES device).
3. Precaution of LaserDiode
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4. Howtoreplace the LithiumBattery
REPLACEMENTPROCEDURE
1. RemovetheTop coverand DVD-RAMdriveunitwithMainP.C.B.
byreferring theDisassembling Procedure.
2. UnsoldertheLithiumBatteries:B7501 and thenreplace itintonew
one.
(Asshownin15.2.1. TheMainP.C.B. )
NOTE:
Thelithium batteryisacritical component. (TypeNo.:CR2032-1GUFManufacturedby
Panasonic. )
Itmustneverbesubjectedtoexcessive heator discharge.
Itmustthereforeonlybefittedinequipmentdesignedspecificallyfor itsuse.
Replacementbatteries mustbeofthesametypeand manufacture.
They mustbefittedinthesamemannerand location as theoriginal battery, withthecorrect
polaritycontactsobserved.
Donotattempttore-chargetheoldbatteryor re-use itfor anyotherpurpose.
Itshouldbedisposedofinwasteproductsdestinedfor burial ratherthanincineration.
8

5. Handling the Lead-free Solder
5.1. Aboutleadfree solder(PbF)
Distinction ofPbF P.C.B.:
P.C.B.s(manufactured)using leadfree solderwill have aPbF stampon theP.C.B.
Caution:
-Pbfree solderhas ahighermelting pointthanstandardsolder;
Typicallythemelting pointis50 -70°F(30 -40°C)higher. Please
use ahigh temperaturesoldering iron. Incase ofthesoldering iron
withtemperaturecontrol,please set itto700 ±20°F(370 ±10°C).
-Pbfree solderwill tend tosplashwhenheatedtoo high (about
1100°F/600°C).
-Whensoldering orunsoldering, please completelyremoveall ofthe
solderon thepinsorsolderarea, and besuretoheat thesoldering
points withthePbfree solderuntil itmelts enough.
6. Service Explorer
TheService Explorerprovides information aboutall possiblecauses basedon thesymptomsand
gives stepbystepinstructionsmaking parts. Itconsistsoftwoparts, basedon applications:the
firstisthe“Service ExplorerExpress”andthesecond is“Service ExplorerinDetail”.
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1. Fordetailsabouttheservice / test modesetting mentionedinthe
description, refertothe“List ofvariousmodes”.
-Service modesetting:Whilethepowerisoff, press TIMESLIP,
STOP, and OPEN/ CLOSE simultaneouslyforfiveseconds.
-Process mode1setting:Whilethepowerisoff, press SKIP(R),
TIMESLIP, and OPEN/ CLOSE simultaneouslyforfive
seconds.
2. Fordisassemblyand replacementprocedures, refertothe
“Assembling and Disassemling”.
6.1. Service ExplorerExpress
Thefollowing stepsallowyou tocheck eachblock separately(HDD, UARTP.C.B., Digital P.C.B.,
RAMdrive, Main/ PowerSupply/ FrontP.C.B.).
Itemsneeded:RAMdrive, Digital P.C.B., Digital extension cable, Remotecontrol HDD, UART
P.C.B..
Conditions:Nothing special.
10

6.2. Service ExplorerinDetail
6.2.1. Does notoperate
itemsneeded:RAMdrive, digital P.C.B., remotecontrol.
Conditions:Nothing special.
11

6.2.2. Poor Pictures
Itemsneeded:RAMdrive, Digital P.C.B., RFcable, AV cable.
Conditions:Check withTUIN-AV OUT(EE). Whenrecording or playback ispartiallyneeded,
followtheinstructions.
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6.2.3. Other
Itemsneeded:Digital P.C.B., HDD.
Conditions:Nothing special.
13

6.2.4. Somedefective functions
Itemsneeded:PCcard adaptor (media), Digital P.C.B.
conditions:Nothing special
14

6.2.5. Caution whenreplacing theparts
1. RAMDrive
Incase theunitdoes notoperate normallyafterreplacementofthe
RAMDrivewithnew one.
A. Whilepowerisoff, press [SKIP(R)], [TIMESLIP]and [OPEN/
CLOSE]keyssimultaneouslyforfiveseconds. Thentheunit
turnsinto“TESTMode”, and theregion codeisstoredon the
new RAMDriveautomatically.
Afterfew seconds, turnoff thepowerand turnon thepower
again, thentheunitoperates normally.
Note:
Inthiscase, all parametersareinitialized.
2. TimerMicroprocessor(IC7501)
Incase theunitdoes notoperate normallyafterreplacementofthe
TimerMicroprocessorwithnew one.
A. WhilepowerisON, shortIC7505-1 pin(RESET)and theGND in
ordertotransmitthe“RESET(L)”tothereset terminal ofTimer
Microprocessor(IC7501-18 pin), thentheunitoperates normally.
7. StandardInspection Specifications afterMaking
Repairs
7.1. StandardInspection Specification
Aftermaking repairs, werecommend performing thefollowing inspection, tocheck normal
operation.
15

No. Procedure Item toCheck
1Turn on thepower. ThePanasonicRAMdisc shouldbe
recognized.
2EntertheEE (TUIN/ AV IN-AV OUT)mode. Noabnormalityshouldbeseeninthe
picture,
sound or operation.
3Perform autorecording and playback for one
minuteusing theRAMdisc. Noabnormalityshouldbeseeninthe
picture,
sound or operation.
4Model withtheHDD :Perform autorecording and
playback for oneminuteusing theHDD Noabnormalityshouldbeseeninthe
picture,
sound or operation.
5Ifaproblem iscausedbyaVCD, DVD-R, DVD-
Video, Audio-CD, or MP3, playback thetestdisc. Noabnormalityshouldbeseeninthe
picture,
sound or operation.
6Incase ofthatthetroubleiscausedbySD/PC
card and/or DV terminal. 1)SD/PCcard:Check tobeableto
display
and
copythepicture.
2)DV terminal:Check tobeableto
record
from
DVC.
7Afterchecking and making repairs, upgradethe
firmwaretothelatestversion. Make surethat[FIRM_SUCCESS]
appears
in
the
FL displays.
8Transfer[9][9]intheservice modesetting, and
initializetheservice settings(return various
settingsand error information totheirdefault
values. Thelasertimeisnotincludedinthis
initialization).
Make surethat[FACTINIT]appearsin
the
FL
display.
Afterchecking it, turn thepoweroff.
9Toreplace theRAMdrive, resetall theinformation
(including thelasertime)intheprocess mode1
setting.
*Thelasertimeisthetotal timethatDVDsor CDs
have beenplayedor recorded.Itisrecordedon
theDigital P.C.B..
Makusurethat[TESTL1]appearsinthe
FL
display.
Afterchecking it, turn thepoweroff.
Use thefollowing checklisttoestablishthejudgementcriteriafor thepictureand sound.
Item Contents Check Item Contents
Picture
Block noise
Sound
Distortedsound
Crosscutnoise noise (static, background noise,
etc.)
Dotnoise Thesound level istoo low.
Picturedisruption Thesound level istoo high.
Notbrightenough Thesound level changes.
Too bright
Flickering color
Color fading
7.2. AdjustmentProcedures
7.2.1. PowerSupplyAdjustment
1. WhenchangethePowerSupplyP.C.B. orparts on PowerSupply
P.C.B., confirm thepowervoltages areinthespecification shown
16

below. Ifthevoltages areoutofspecification, adjust thevoltages
areinthespecification as shownbelow.
8. Assembling and Disassembling
8.1. Disassemblyflow chart
Thefollowing chartistheprocedurefor disassembling thecasing and insidepartsfor internal
inspection whencarrying outtheservicing.
Toassembletheunit, reverse thestepsshowninthechartbelow.
17

8.2. P.C.B. Positions
8.3. TheTop Cover
1. Removethe2screws(A)and 3screws(B).
2. Openthebothendsat thefrontsideoftheTop coverabitand lift
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theTop coverinthedirection ofthearrows.
8.4. TheFrontpanel
1. Removethe2connectors.
2. Removethe2tabs(A)and 3tabs(B)inthisorder. (Thetab(A)and
thetab(B)shouldberemovedat thesametime, respectively.)
3. Movethefrontpanel toyoursideslowlyand removeit.
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8.5. TheFront(R)P.C.B.
1. Removethe2screwsand removetheFrontAngle.
2. Removethe4screws(A)and removetheFront(R)P.C.B.
8.6. TheFront(L)and DVJack P.C.B.
1. Remove1screw insideoftheFrontpanel doorwithaprecision
screw driver.
2. Removethe2screwswithEarthplate and removetheFront(L)
and DVJack P.C.B.
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