Panasonic KX-MB2085CXW User manual

© Panasonic System Networks Co., Ltd. 2013
Unauthorized copying and distribution is a violation
of law.
ORDER NO.KMF1311431CE
Multi-Function printer
Model No. KX-MB2085CXW
KX-MB2090CXW
(for Middle East, Asia, Tunisia and Africa)

2
KX-MB2085CXW/KX-MB2090CXW
TABLE OF CONTENTS
PAGE PAGE
1 Safety Precautions -----------------------------------------------5
1.1. For Service Technicians ----------------------------------5
1.2. AC Caution---------------------------------------------------5
1.3. Personal Safety Precautions ----------------------------6
1.3.1. Moving Sections of the Unit-------------------------6
1.3.2. Live Electrical Sections ------------------------------6
1.4. Service Precautions ---------------------------------------6
1.4.1. Precautions to Prevent Damage from
Static Electricity ----------------------------------------6
2Warning--------------------------------------------------------------7
2.1. About Lead Free Solder (PbF: Pb free) --------------7
2.1.1. Suggested PbF Solder -------------------------------7
2.2. Discarding of P. C. Board --------------------------------8
2.3. Insulation Resistance Test -------------------------------8
2.4. Battery Caution ---------------------------------------------8
2.5. Laser Beam And Fuser Unit Section ------------------8
2.6. Note for Repairing------------------------------------------9
3 Specifications ---------------------------------------------------- 10
4 General/Introduction------------------------------------------- 12
4.1. Optional Accessories------------------------------------ 12
4.2. Translation Lists ------------------------------------------ 12
5Features------------------------------------------------------------ 13
5.1. General Features----------------------------------------- 13
5.2. Hardware Requirements for Multi-Function
Software ---------------------------------------------------- 13
6 Technical Descriptions---------------------------------------- 14
6.1. Connection Diagram------------------------------------- 14
6.2. General Block Diagram--------------------------------- 15
6.3. Main Board Section-------------------------------------- 17
6.3.1. Data Flow---------------------------------------------- 17
6.3.2. RTC Backup Circuit -------------------------------- 26
6.3.3. Modem Circuit Operation ------------------------- 27
6.3.4. TEL Line Section ----------------------------------- 27
6.4. NCU Section ---------------------------------------------- 29
6.4.1. General ------------------------------------------------ 29
6.4.2. EXT. TEL. Line Relay (RLY100) ----------------- 29
6.4.3. Bell Detection Circuit ------------------------------- 29
6.4.4. Pulse Dial Circuit ------------------------------------ 29
6.4.5. Line Amplifier and Side Tone Circuit------------ 29
6.4.6. Calling Line Identification Circuit (FSK)-------- 30
6.4.7. Calling Line Identification Circuit (DTMF) ----- 30
6.4.8. Calling Line Identification Circuit (FSK)-------- 30
6.4.9. Remote FAX Activation Circuit ------------------- 30
6.4.10. TAM Interface Circuit ------------------------------- 30
6.5. ITS (Integrated telephone System) and
Monitor Section ------------------------------------------- 31
6.5.1. General ------------------------------------------------ 31
6.6. CIS Control Section-------------------------------------- 32
6.7. Motor Drive Section-------------------------------------- 33
6.7.1. Engine Motor Control Circuit --------------------- 33
6.7.2. Scanner Motor Drive Circuit ---------------------- 34
6.8. Timing chart and wave form of scanner
motors------------------------------------------------------- 37
6.8.1. Normal 1-2 phase excitation (half step)-------- 37
6.8.2. Flat torque 1-2 phase excitation (half step) --- 38
6.8.3. W1-2 phase excitation (Quarter step) ---------- 39
6.8.4. Drive mode of FB and ADF motor--------------- 40
6.9. FAN Motor Section--------------------------------------- 40
6.9.1. General ------------------------------------------------ 40
6.9.2. Circuit Diagram of FAN ---------------------------- 41
6.9.3. Fan Control ------------------------------------------- 41
6.9.4. Control table------------------------------------------ 42
6.9.5. Waveform --------------------------------------------- 42
6.10. Solenoid Driver Section -------------------------------- 43
6.11. LSU (Laser Scanning Unit) Section----------------- 44
6.12. Sensors and Switches Section----------------------- 46
6.12.1. Drum Detection ------------------------------------- 47
6.12.2. Pickup Sensor --------------------------------------- 47
6.12.3. Exit Sensor ------------------------------------------- 48
6.12.4. Read Position Sensor------------------------------ 48
6.12.5. Registration & Manual Paper Sensor ---------- 49
6.12.6. Print Timing Sensor -------------------------------- 49
6.12.7. Document Sensor----------------------------------- 50
6.12.8. Top Cover Sensor----------------------------------- 50
6.12.9. Toner Sensor----------------------------------------- 51
6.12.10. Handset Hook Switch ----------------------------- 54
6.13. Operation Board Section ------------------------------ 55
6.14. LCD Section----------------------------------------------- 56
6.15. H.V.P.S. (High Voltage Power Supply) Section -- 57
6.15.1. HVPS Specification--------------------------------- 57
6.15.2. CHG-BIAS (Charge BIAS)/GRID/ UNIT------- 57
6.15.3. DEV DC BIAS UNIT-------------------------------- 58
6.15.4. DEV AC BIAS UNIT -------------------------------- 58
6.15.5. TRA (+) BIAS (Transfer (+) BIAS)/TRA (-)
BIAS (Transfer (-) BIAS) UNIT------------------- 58
6.16. Heat Lamp Control Circuit----------------------------- 59
6.17. Power Saving (Sleep) Function ---------------------- 64
6.18. Main Board Power Supply Section------------------ 65
6.18.1. 3.3V and 1.2V Power Supply Descriptions --- 65
6.18.2. 5V Power Supply Descriptions ------------------ 65
6.18.3. 24V Power Supply Descriptions----------------- 66
6.19. Power Supply Board Section ------------------------- 67
6.20. Mechanical Operation ---------------------------------- 68
6.20.1. Printing ------------------------------------------------ 68
7 Location of Controls and Components ----------------- 69
8 Installation Instructions -------------------------------------- 69
9 Operating Instructions---------------------------------------- 69
10 Test Mode --------------------------------------------------------- 70
10.1. Test Functions -------------------------------------------- 70
10.1.1. DTMF Single Tone Transmit Selection -------- 72
10.1.2. Button Code Table ---------------------------------- 72
10.1.3. Print Test Pattern------------------------------------ 73
11 Service Mode----------------------------------------------------- 74
11.1. Programming and Lists--------------------------------- 74
11.1.1. Operation --------------------------------------------- 74
11.1.2. Operation Flow -------------------------------------- 74
11.1.3. Service Function Table ---------------------------- 75
11.1.4. Memory Clear Specification ---------------------- 77
11.2. User Mode (The list below is an example of
the SYSTEM SETUP LIST the unit prints out.) -- 78
11.3. Service Mode Settings (Example of a printed
out list)------------------------------------------------------ 82
11.4. History (Example of a printed out list) -------------- 83
11.4.1. Descriptions of the History Report-------------- 84
12 Troubleshooting Guide --------------------------------------- 85
12.1. User Recoverable Errors ------------------------------ 85

3
KX-MB2085CXW/KX-MB2090CXW
12.2. Remote Programming-----------------------------------88
12.2.1. Entering the Remote Programming Mode
and Changing Service Codes --------------------89
12.2.2. Program Mode Table--------------------------------90
12.3. Troubleshooting Details---------------------------------94
12.3.1. Outline --------------------------------------------------94
12.3.2. Starting Troubleshooting ---------------------------94
12.3.3. Initialization--------------------------------------------95
12.3.4. Simple Check List -----------------------------------96
12.3.5. Simplified Troubleshooting Guide ---------------97
12.3.6. CALL SERVICE Troubleshooting Guide ----- 100
12.3.7. Print --------------------------------------------------- 107
12.3.8. Recording Paper Feed --------------------------- 113
12.3.9. Initializing Error------------------------------------- 120
12.3.10. ADF (Auto Document Feeder) Section------- 121
12.3.11. Special Service Journal Reports --------------- 123
12.3.12. Analog Section ------------------------------------- 138
12.3.13. Operation Panel Section ------------------------- 141
12.3.14. Sensor Section ------------------------------------- 141
12.3.15. Motor Section --------------------------------------- 144
12.3.16. LSU Section----------------------------------------- 147
12.3.17. CIS Control Section ------------------------------- 148
12.3.18. High Voltage Value Check Point --------------- 150
12.3.19. High Voltage Section------------------------------ 152
12.3.20. USB Section ---------------------------------------- 157
12.3.21. LAN SECTION ------------------------------------- 161
12.3.22. Main Board Section ------------------------------- 166
12.3.23. Power Supply Board Section ------------------- 167
12.4. RECORDING PAPER JAM -------------------------- 170
13 Service Fixture & Tools-------------------------------------- 171
14 Disassembly and Assembly Instructions ------------- 172
14.1. Bottom Section ------------------------------------------ 173
14.2. Left Side Section---------------------------------------- 173
14.3. Operation Panel Section------------------------------ 174
14.4. Open Top Cover ---------------------------------------- 174
14.5. Remove Operation Panel ---------------------------- 175
14.6. Remove Operation Board ---------------------------- 175
14.7. Remove Main Board ----------------------------------- 176
14.8. Remove Gear Chassis Section --------------------- 177
14.9. Remove Right Cover ---------------------------------- 178
14.10. Remove Right Cassette Guide---------------------- 178
14.11. Remove Bottom Plate --------------------------------- 179
14.12. Remove Laser Unit------------------------------------- 179
14.13. Remove Pick up Roller-------------------------------- 180
14.14. Remove Low Voltage Power Board---------------- 181
14.15. Remove Mirror ------------------------------------------ 181
14.16. Remove High Voltage Power Board --------------- 182
14.17. Note for disassembly ---------------------------------- 182
14.17.1. Position of Installing LABEL/CIS HOME ----- 182
14.18. Installation Position of The Lead-------------------- 183
14.18.1. Top Cover Section (1) ---------------------------- 183
14.18.2. Top Cover Section (2) ---------------------------- 184
14.18.3. Bottom Part Section (1) -------------------------- 185
14.18.4. Bottom Part Section (2) -------------------------- 186
14.18.5. Side Cabinet Section (1) ------------------------- 187
15 Maintenance----------------------------------------------------- 188
15.1. Maintenance Items and Component Locations - 188
15.1.1. Outline ------------------------------------------------ 188
15.1.2. Maintenance Check Items/Component
Locations--------------------------------------------- 188
15.2. Cleaning -------------------------------------------------- 190
15.3. Printing Operation Principle ------------------------- 190
15.3.1. Process Chart and Process BIAS------------- 190
15.3.2. CHARGING----------------------------------------- 190
15.3.3. Exposing--------------------------------------------- 191
15.3.4. Developing and Transcription ------------------ 192
15.3.5. Cleaning of Transfer Roller --------------------- 193
15.3.6. Fixing ------------------------------------------------- 194
15.4. Terminal Guide of The ICs Transistors and
Diodes ---------------------------------------------------- 195
15.4.1. Main Board------------------------------------------ 195
15.4.2. Operation Board ----------------------------------- 196
15.4.3. High Voltage Power Supply Board ------------ 196
15.4.4. Low Voltage Power Supply Board ------------ 196
15.5. How to Replace the Flat Package IC ------------- 197
15.5.1. Preparation------------------------------------------ 197
15.5.2. Flat Package IC Removal Procedure -------- 197
15.5.3. Flat Package IC Installation Procedure------ 198
15.5.4. Bridge Modification Procedure----------------- 198
15.6. Main Board Section------------------------------------ 199
15.6.1. NG Example ---------------------------------------- 200
15.7. Test Chart ------------------------------------------------ 201
15.7.1. ITU-T No.1 Test Chart---------------------------- 201
15.7.2. ITU-T No.2 Test Chart---------------------------- 202
16 Schematic Diagram ------------------------------------------ 203
16.1. For Schematic Diagram ------------------------------ 203
16.2. Main Board (KX-MB2085) --------------------------- 204
16.2.1. Main Board (1) ------------------------------------- 204
16.2.2. Main Board (2) ------------------------------------- 206
16.2.3. Main Board (3) ------------------------------------- 208
16.3. Main Board (KX-MB2090) --------------------------- 210
16.3.1. Main Board (1) ------------------------------------- 210
16.3.2. Main Board (2) ------------------------------------- 212
16.3.3. Main Board (3) ------------------------------------- 214
16.4. Operation Board---------------------------------------- 216
16.5. Sensor Board ------------------------------------------- 217
16.6. High Voltage Power Supply Board----------------- 218
16.7. Low Voltage Power Supply Board ----------------- 219
17 Printed Circuit Board ---------------------------------------- 220
17.1. Main Board ---------------------------------------------- 220
17.1.1. Main Board: Component View ----------------- 220
17.1.2. Main Board: Bottom View ----------------------- 221
17.2. Operation Board---------------------------------------- 222
17.2.1. Operation Board ----------------------------------- 222
17.3. Sensor Board ------------------------------------------- 223
17.3.1. Toner Sensor Board ------------------------------ 223
17.3.2. Fuser Board ---------------------------------------- 223
17.3.3. Pickup Sensor Board----------------------------- 223
17.3.4. Registration Sensor Board---------------------- 224
17.3.5. Varistor Sensor Board---------------------------- 224
17.3.6. Flatbed Relay Board------------------------------ 224
17.4. High Voltage Power Supply Board----------------- 225
17.4.1. HIGH VOLTAGE POWER SUPPLY
BOARD: COMPONENT VIEW----------------- 225
17.4.2. HIGH VOLTAGE POWER SUPPLY
BOARD: BOTTOM VIEW ----------------------- 225
17.5. Low Voltage Power Supply Board ----------------- 226
17.5.1. LOW VOLTAGE POWER SUPPLY
BOARD: COMPONENT VIEW----------------- 226
17.5.2. LOW VOLTAGE POWER SUPPLY
BOARD: BOTTOM VIEW ----------------------- 226
18 Exploded View and Replacement Parts List --------- 227

4
KX-MB2085CXW/KX-MB2090CXW
18.1. Cabinet, Mechanical and Electrical Parts
Location--------------------------------------------------- 227
18.1.1. Operation Panel Section------------------------- 227
18.1.2. ADF Section --------------------------------------- 228
18.1.3. ADF Gear Section -------------------------------- 229
18.1.4. Top Cover Section -------------------------------- 230
18.1.5. Main Cabinet Section----------------------------- 231
18.1.6. Fuser Section--------------------------------------- 232
18.1.7. Bottom Cabinet Section (1) --------------------- 233
18.1.8. Separation (DFP) Roller Section -------------- 234
18.1.9. Side Cabinet Section ----------------------------- 235
18.1.10. Motor Section--------------------------------------- 236
18.1.11. Bottom Cabinet Section (2) --------------------- 237
18.1.12. Output Tray Section------------------------------- 238
18.1.13. Actual Size of Screws and Washer ----------- 239
18.1.14. Accessories and Packing Materials ---------- 240
18.2. Electrical Parts ------------------------------------------ 241
18.2.1. Cabinet and Electrical Parts ------------------- 241
18.2.2. Main Board (KX-MB2085) ---------------------- 244
18.2.3. Main Board (KX-MB2090)----------------------- 249
18.2.4. Operation Board ---------------------------------- 254
18.2.5. Sensor Board Parts ------------------------------ 255
18.2.6. Back Light Board ---------------------------------- 256
18.2.7. High Voltage Power Board ---------------------- 256
18.2.8. Low Voltage Power Board----------------------- 256

5
KX-MB2085CXW/KX-MB2090CXW
1 Safety Precautions
1. Before servicing, unplug the AC power cord to prevent an electric shock.
2. When replacing parts, use only the manufacturer's recommended components.
3. Check the condition of the power cord. Replace if wear or damage is evident.
4. After servicing, be sure to restore the lead dress, insulation barriers, insulation papers, shields, etc.
5. Before returning the serviced equipment to the customer, be sure to perform the following insulation resistance test to prevent
the customer from being exposed to shock hazards.
1.1. For Service Technicians
•Repair service shall be provided in accordance with repair technology information such as service manual so as to pre-
vent fires, injury or electric shock, which can be caused by improper repair work.
1. When repair services are provided, neither the products nor their parts or members shall be remodeled.
2. If a lead wire assembly is supplied as a repair part, the lead wire assembly shall be replaced.
3. FASTON terminals shall be plugged straight in and unplugged straight out.
•ICs and LSIs are vulnerable to static electricity.
When repairing, the following precautions will help prevent recurring malfunctions.
1. Cover the plastic part's boxes with aluminum foil.
2. Ground the soldering irons.
3. Use a conductive mat on the worktable.
4. Do not touch the IC or LSI pins with bare fingers.
1.2. AC Caution
For safety, before closing the lower cabinet, please make sure of the following precautions.
1. The earth lead is fixed with the screw.
2. The AC connector is connected properly.

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KX-MB2085CXW/KX-MB2090CXW
1.3. Personal Safety Precautions
1.3.1. Moving Sections of the Unit
Be careful not to let your hair, clothes, fingers, accessories, etc., become caught in any moving sections of the unit.
The moving sections of the unit are the rollers and a gear. There is a separation roller and a document feed roller which are rotated
by the document feed motor. A gear rotates the two rollers. Be careful not to touch them with your hands, especially when the unit
is operating.
1.3.2. Live Electrical Sections
All the electrical sections of the unit supplied with AC power by the AC power cord are live.
Never disassemble the unit for service with the AC power supply plugged in.
CAUTION:
AC voltage is supplied to the primary side of the power supply unit. Therefore, always unplug the AC power cord before disas-
sembling for service.
Discharge the primary electrolytic capacitor before touching the power supply unit.
1.4. Service Precautions
1.4.1. Precautions to Prevent Damage from Static Electricity
Electrical charges accumulate on a person. For instance, clothes rubbing together can damage electric elements or change their
electrical characteristics. In order to prevent static electricity, touch a metallic part that is grounded to release the static electricity.
Never touch the electrical sections such as the power supply unit, etc.

7
KX-MB2085CXW/KX-MB2090CXW
2Warning
2.1. About Lead Free Solder (PbF: Pb free)
Note:
In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard solder or solder that con-
tains lead.
We will use PbF solder when discussing the lead free solder used in our manufacturing process which is made from Tin, (Sn),
Silver, (Ag), and Copper, (Cu).
This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB. For service and repair
work we suggest using the same type of solder although, with some precautions, standard Pb solder can also be used.
Caution
• PbF solder has a melting point that is 50°~ 70°F, ( 3 0°~ 40°C) higher than Pb solder. Please use a soldering iron with tempera-
ture control and adjust it to 700°± 20°F, (370°± 10°C). In case of using high temperature soldering iron, please be careful not to
heat too long.
• PbF solder will tend to splash if it is heated much higher than its melting point, approximately 1100°F, ( 60 0 °C).
• If you must use Pb solder on a PCB manufactured using PbF solder, remove as much of the original PbF solder as possible and
be sure that any remaining is melted prior to applying the Pb solder.
• When applying PbF solder to double layered boards, please check the component side for excess which may flow onto the
opposite side (See figure, below).
2.1.1. Suggested PbF Solder
There are several types of PbF solder available commercially. While this product is manufactured using Tin, Silver, and Copper,
(Sn+Ag+Cu), you can also use Tin and Copper, (Sn+Cu), or Tin, Zinc, and Bismuth, (Sn+Zn+Bi). Please check the manufac-
turer’s specific instructions for the melting points of their products and any precautions for using their product with other
materials.
The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3mm, 0.6mm and 1.0mm.

8
KX-MB2085CXW/KX-MB2090CXW
2.2. Discarding of P. C. Board
When discarding P. C. Board, delete all personal information such as telephone directory and caller list or scrap P. C. Board.
2.3. Insulation Resistance Test
1. Unplug the power cord and short the two prongs of the plug with a jumper wire.
2. Turn on the power switch.
3. Measure the resistance value with an ohmmeter between the jumpered AC plug and each exposed metal cabinet part
(screw heads, control shafts, bottom frame, etc.).
Note: Some exposed parts may be isolated from the chassis by design. These will read infinity.
4. If the measurement is outside the specified limits, there is a possibility of a shock hazard.
2.4. Battery Caution
CAUTION
Danger of explosion if the battery is incorrectly replaced. Replace only with the same or equivalent type recommended by the
manufacturer. Dispose of used batteries according to the manufacturer’s instructions.
The lithium battery is a critical component (type No.CR2354). Please observe for the proper polarity and exact location when
replacing it and the soldering the replacement litium battery in.
2.5. Laser Beam And Fuser Unit Section
• The printer of this unit utilizes a laser. Use of controls or adjustments or performance of procedures other than those specified
herein may result in hazardous radiation exposure.
• The fuser unit is inside of the unit and gets hot. Do not touch it when removing the jammed paper or cleaning the lower glass.

9
KX-MB2085CXW/KX-MB2090CXW
2.6. Note for Repairing
Caution
Please inform users of the danger of data being lost at the time of repair.
Data will be lost in the following situations.
1. When replacing the ROM ass'y.
2. When replacing the Main board ass'y.
3. When executing mode #550 or #710.
There is a possibility of data loss in the following situations.
1. When removing a board.
2. When writing new software to ROM.

10
KX-MB2085CXW/KX-MB2090CXW
3 Specifications
*1 Transmission speed depends on the contents of the pages, resolution, telephone line conditions and capability of the other
party’s machine.
*2 Transmission speed is based on the ITU-T No. 1 Test Chart with original mode. If the capability of the other party’s machine is
inferior to your unit, the transmission time may be longer.
*3 Only when connected via USB interface and LAN mode is OFF.
*4 Only when connected to a wired LAN.
*5 KX-MB2090 only
Applicable Lines: Public Switched Telephone Network
Document Size: Max. 216 mm in width, Max. 600 mm in length
Effective Scanning Width: 208 mm
Effective Printing Width: Letter/ Legal: 208 mm
A4: 202 mm
Transmission Time*1:Approx. 4 s/page (ECM-MMR Memory transmission)*2
Scanning Density: Scanning resolution:
Up to 600 ×1,200 dpi (Optical)
Up to 19,200 ×19,200 dpi (Interpolated)
Copy resolution:
Up to 600 ×600 dpi
FAX resolution*1:
Horizontal: 8 pels/mm
Vertical: 3.85 lines/mm -in standard resolution,
7.7 lines/mm -in fine/photo resolution,
15.4 lines/mm -in super fine resolution
Photo resolution: 64-level
Scanner Type: Colour Contact Image Sensor (CIS)
Printer Type: Laser printer
Data Compression System: Modified Huffman (MH), Modified READ (MR), Modified Modified READ (MMR)
Modem Speed:
33,600 / 31,200 / 28,800 / 26,400 / 24,000 / 21,600 / 19,200 / 16,800 / 14,400 /
12,000 / 9,600 / 7,200 / 4,800 / 2,400 bps; Automatic Fallback
Operating Environment:
10°C—32.5°C, 20%—70% RH (Relative Humidity)
Dimensions:
Approx. width 420 mm x depth 432 mm x height 305 mm
(Width is 505 mm when the handset unit is installed.)
Mass (Weight):
Approx. 12 kg
Power Consumption: Sleep: Less than 2.7 W *3 Less than 3.0 W *4
Standby: Approx. 65 W
Copy: Approx. 500 W
Maximum: Approx. 1,000 W (When the fuser lamp turns on)
Power Supply: 220-240 V AC, 50/60 Hz
Memory Capacity
(for operation and storing memory): 32 MB
Fax Memory Capacity: 3.5 MB in total
Approx. 110 pages of memory reception
Approx. 150 pages of memory transmission
(Based on the ITU-T No. 1 Test Chart in standard resolution)
Scan to email address memory capacity*5:5 MB in total (including the header and email message)
Scan to FTP server memory capacity*5:5 MB in total
Scan to SMB folder memory capacity*5:5 MB in total
Laser diode properties: Laser output: Max. 15 mW
Wave length: 760 nm—800 nm
Emission duration: Continuous
Print Speed: Approx. 26 ppm (pages per minute)
Printing Resolution: 600 x 600 dpi
LED light of CIS properties: LED radiation output: Max. 1 mW
Wavelength: Red 630 nm typical.
Green 520 nm typical.
Blue 465 nm typical.
Emission duration: Continuous

11
KX-MB2085CXW/KX-MB2090CXW
Note:
• Design and specifications are subject to change without notice.
• The accuracy of the clock is approximately ±60 seconds a month.

12
KX-MB2085CXW/KX-MB2090CXW
4 General/Introduction
4.1. Optional Accessories
Replacement accessory
- Toner cartridge
• Model No. (Part No.): KX-FAT411E
• Prints approximately 2,000 pages in accordance with ISO/IEC 19752 standard page.
- Drum cartridge
• Model No. (Part No.): KX-FAD412E
Note:
• ISO/IEC 19752 standard is as follows:
- Environment: 23 ± 2°C / 50 ± 10% RH
- Print mode: Continuous printing
4.2. Translation Lists
Refer to the Operating Instructions.
Note:
You can download and refer to the Operating Instructions (Instruction book).

13
KX-MB2085CXW/KX-MB2090CXW
5 Features
5.1. General Features
General
• LCD (Liquid Crystal Display) readout
Flat-Bed Multifunction Laser Printer
Output tray (approx. 100 sheets)
Letter/A4/Legal
Automatic document feeder (20 sheets)
Quick scan
Resolution: Standard/Fine/Super fine/Photo (64 level).
STANDARD: For printed or typewritten originals with normal-sized characters.
FINE: For originals with small printing.
SUPER FINE: For very small-sized characters.
PHOTO: For photographs, shaded drawings, etc.
Broadcast
• 250-sheet paper capacity (60 g/m2~ 75 g/m2)
Enhanced Copier Function
Multi-copy function (up to 99 copies)
Enlargement and reduction
64-Level halftone
5.2. Hardware Requirements for Multi-Function Software
To use Multi-Function Station on your computer, the following are required:
Operating System:
Windows 7 / Windows 8 / Windows XP / Windows Vista
Windows Server 2008 / 2012 *1
Mac OS X 10.5 - 10.8 *2
*1 Supported printer driver only
*2 Supported printer driver, scanner driver and PC fax (transmit) only
CPU:
Windows:
Windows 7 / Windows 8 / Windows Vista: Pentium 4 or higher processor
Windows XP: Pentium or higher processor
Mac OS:
Complies with Operating System recommendations
RAM:
Windows:
Windows 7 / Windows 8: 1GB (2GB or more recommended)
Windows XP: 128MB (256MB or more recommended)
Windows Vista: 512MB (1GB or more recommended)
Mac OS:
Complies with Operating System recommendations
Other Hardware:
CD-ROM drive
Windows:
Hard disk drive with at least 600MB of available space
Mac OS:
Hard disk drive with at least 200MB of available space
Web browser (recommendation):
Windows:
Windows Internet Explorer 6/7/8/9
Windows Internet Explorer 10 (with compatible mode
recommended)
Mac OS:
Safari 3/4/5/6
Important:
• To assure continued emission limit compliance;
- use only shielded USB cable (Example: Hi-Speed USB 2.0 certified cable).
- use only shielded LAN cable (category 5 straight cable(Cat-5) Ethernet cable) (KX-MB2090 only).
• To protect the unit, use only shielded USB cable in areas where thunderstorms occur.

14
KX-MB2085CXW/KX-MB2090CXW
6 Technical Descriptions
6.1. Connection Diagram
1 2 3 4 5 1 2 3 4 5
1 2 3 4 5 6 7 1 2 3 4 5 6 7
1
2
1
2
1
2
1
2
1
2
3
1
2
3
1
2
3
4
5
6
7
8
9
10
11
12
1
2
3
4
5
6
7
8
9
10
11
12
1 4
2 3
1 4
2 3
4
2
No
D
VBUS1
GNDD+3
NAMENAMENo
4
2
No
DVBUS1
GNDD+3
NAMENAMENo
CN500CN501CN502
CN506
CN509
CN503
CN505
CN504
CN510
1
2
3
4
1
2
3
4
CN600
CN511
1 2 3 4
CN701
1 2 3 4
CN701
1 2 3 4
CN700
1 2 3 4
CN700
CN300
CN101
CN100
8
7
6
5
4
3
2
1
8
7
6
5
4
3
2
1
CN200
CN750
1 2 3 4 5 6 7 8 9
10
1 2 3 4 5 6 7 8 9
10
1 2 3 4 5 6 7 8 9
10
CN508
MAIN BOARD
DC MOTOR UNIT
HVPS
SMPS
OPERATION PANEL BOARD
LCD
with backlight
LSU
MAIN
MOTOR
REG
REGISTER
SOLENOID
PICKUP
SOLENOID
TO
TELEPHONE
LINE
TO
EXTERNAL
TELEPHONE
TO
PC/USB
1 2 3 4 5 6 7 8 1 2 3 4 5 6 7 8
CN300
CN2
CN1
HTRCTL
7V
DG
DG
DG
24V
24V
CN101
1
2
1
2
CN1
CVR
HVERR
TRS
DEV
CHG
DG
CN1
LIVE
NEUTRAL
COVER OPEN SW
SW1
TRA
OPC
DEV
GRID
CHG
DG
FANDET1
FANON1
24V
DG
PICK
POLCLK
XREADY
POLON
DG
24V
3.3V DG
XHSYNC
XVIDEO XLDEN
XAPC
DG
24V
24V DG
DG
LD SS
1 2 3 4 5 6 7 8 1 2 3 4 5 6 7 8
1
2
3
4
5
6
7
8
1
2
3
4
5
6
7
8
CLK BRAKE
DC FAN1
(Left )
TRANSCRIPTION
ROLLER
OPC
DRUM
DRUM UNIT
SCOROTRON
1 2 3 4 5 6 7 8 1 2 3 4 5 6 7 8
THRM
KSTART
KTXD
KSCLK OPERST
DG 3.3V
BUZZER
THRM
KSTART
KTXD
KSCLK OPERST
DG 3.3V
BUZZER
RST
CD
SCL
SI
VSS VB0+
VB0
VB1 VB1+ VLCDIN
DEVELOPING
ROLLER
TONER SUPPLY
ROLLER
1 2 3 4 5 6 7 8 9
10
1 2 3 4 5 6 7 8 9
10
1 2 3 4 5 6 7 8 9
10
TONER
SENSOR
CN64
1
2
3
4
5
1
2
3
4
5
1
2
3
4
5
1
2
3
4
5
CN67
CN63
FANON2
FANDET2
DG
PICK
DG
PICKUP
SENSOR
SW50
1 2 3 1 2 3
FANDET2
DG FANON2
IC51
1 2 3 4 1 2 3 4
CN66
1 2 3 4 1 2 3 4
CN50
LED
REG
PTOP DG
REGISTER
SENSOR
PTOP
SENSOR
PS51 PS52
HEAT LAMP
THERMOSTAT THERMOSTAT
THERMISTOR
1 2 3 4 1 2 3 4
CN65
1 2 3 4
PS50
EXIT SENSOR
CN53
1
2
3
1
2
3
CN52
THRM1
DG
FUSER
UNIT
VARISTOR
BOARD
8RCT7
RD-6
5
TCT4RD+3
2
No
TD
TD+1
NAMENAM ENo
8RCT7
RD-65
TCT4RD+3
2
No
TDTD+1
NAMENAM ENo
b16S(W) / B25
b / B14a / A13
2
No
E(G) / A2a11
NAMENAMENo
b16S(W) / B25
b / B14a / A13
2
No
E(G) / A2a11
NAMENAMENo
CN100
a16E(W)5
a / A14b / B13
2
No
S(W)b11
NAMENAMENo
a16E(W)5
a / A14b / B13
2
No
S(W)b11
NAMENAMENo
CN101
8
7
6
5
4
3
2
1
8
7
6
5
4
3
2
1
HSSP+
HSSP
MIC+
MIC
HOOK
GND
SP
SP+
CN58
HOOK SW
1
2
1
2
CN57
Speaker
1 2 3 4 5 6 1 2 3 4 5 6
CN55
1 2 3 4 5 6 1 2 3 4 5 6
CN940
HSSP6HSSP+5
GND4HSMIC
3
2
No
HOOKHSMIC+1
NAMENAMENo
HSSP6HSSP+5
GND4HSMIC3
2
No
HOOKHSMIC+1
NAMENAMENo
CN55
1
2
3
4
CN941
HSMIC+4HSSP-3
2
No
HSMIC -HSSP+1
NAMENAM ENo
HSMIC+4HSSP-3
2
No
HSMIC -HSSP+1
NAMENAM ENo
CN941
HANDSET
HANDSET
SP+
SP
ADF
MOTOR
A
B
XA XB
READ
POSITION
SENSOR
DOCUMENT
SENSOR
PS53 PS54
1 2 3 4
CN56
3.3V
RPS
DOCU
DG
1
2
3
4
5
6
7
8
9
10
11
12
1
2
3
4
5
6
7
8
9
10
11
12
1
2
3
4
1
2
3
4
CN750
CN59
CN60
1 2 3 4
CN62
1 2 3 4
CN62
FB
MOTOR
A
B
XA XB
2 1
12 11
2 1
12 11
CN61
CISMODULE
LED_G10VLED9
CLK8DG7
SI6CNT5
VREF43.3V3
12
2
No
DGSIG1
LED_BLED_R11
NAMENAM ENo
LED_G10VLED9
CLK8DG7
SI6CNT5
VREF43.3V3
12
2
No
DGSIG1
LED_BLED_R11
NAMENAM ENo
CN61
FB TRANSIT
BOARD
DC FAN 2
(Right )
CN51
CR_A
CR_B
CR_XA
CR_XB
GND
3.3V
VREF
SI
GND
CLK
LED_G
LED_R
LED_B
SIG
GND
VLED
1
3
5
2
4
6
1
3
5
2
4
6
1
3
5
2
4
6
1
3
5
2
4
6
TO
PC/LAN
1
3
5
7
2
4
6
8
THRM1
LED
POUT GND
POUT
3.3V
THRM1 GND
FANON2 FANDET2
PICK
TNR
PTOP REG
24V
1
2
3
4
5
6
7
8
1
2
3
4
5
6
7
824V
1
2
3
4
5
6
7
8
1
2
3
4
5
6
7
8
12 11 10
9 8 7 6 5 4 3 2 1
CS0
VDD

15
KX-MB2085CXW/KX-MB2090CXW
6.2. General Block Diagram
MAIN UNIT
SOC (IC300)
This custom IC is used for general MFP operations.
ROM (IC402)
This 8MB FLASH ROM contains all of the program instructions on the unit operations.
And support the backup of user setting and FAX receive data.
SYNCHRONOUS DYNAMIC RAM (IC400)
This 256Mbit SDRAM is used for CPU work and receiving memory and page memory.
POWER SUPPLY
DC-DC converters generate 3.3V and 1.2V for system power.
Regurator generates 5V for peripheral devices.
TEL/FAX I/F
Composed of ITS circuit and NCU circuit.
Analog DAA (Direct Access Arrangement) and two AFE (Analog Front End) IC control Telephone line, Speaker, and Hand-
set.
READ SECTION
CIS Unit to read transmitted documents.
CIS Unit is connected to FLATBED transit Unit.
Scan data is converted by AFE(IC503).
MOTOR
This model has 1 DC motor and 2 stepping motors.
IC300 drives the DC motor for printing.
IC502 drives the stepping motor for Auto Document Feeder motor and CIS carriage.
LSU
Forms the images on the OPC DRUM by rotating polygon motor and reflecting the laser beam against polygon.
SENSORS
Composed of 2 switches and 5 sensors.
POWER SUPPLY BOARD
Supplies +24V and +7V to the Main unit and controls the Heat Lamp.
HIGH VOLTAGE POWER SUPPLY BOARD
Supplies bias need for the printing operation: bias of the DRUM, Developing and Transcription.
FIXING UNIT
Composed heat lamp, thermistor and thermostats.
1) CPU ARM9 operating at 250MHz.
2) SDRAM Controller Controls SDRAM Memory.
3) USB Controller with PHY Apply to USB2.0 HS
4) Scanner I/F Controls the CIS and AFE, and process the scan images.
5) LSU I/F Controls the polygon motor and outputs the VIDEO signal to LSU.
6) MOTOR I/F Controls the DC motor and Stepping Motor.
7) FAN I/F Controls FAN MOTOR and detect the rotation of FAN MOTOR.
8) OPERATION PANEL I/F Serial interface with Operation Panel.
9) SENSOR I/F Detects the sensor signal.
10) I/O PORT I/O Port Interface.
11) A/D, D/A converter Sends beep tones, etc.
Convert the analog signal to the digital signal.
12) RTC Real time clock.
13) MODEM Performs the modulation and the demodulation for FAX communication.
14) Analog Front End I/F Controls the DAA device for TEL/FAX function.
15) LAN Controller Ethernet Control. (KX-MB2090 ONLY)

16
KX-MB2085CXW/KX-MB2090CXW
Main Board
DAA block
SOC
DC motor
MB
MB2090
2090 series System Schematic
series System Schematic
SMPS
AC inlet
JST8
Thermostat
Thermostat
Heater
AMP9 (Blue)
AMP8
JST2
Resist Solenoid
LSU
AMP5
AMP7 USB
FLASH
(64Mbit)
SDRAM
(256Mbit
)
TEL
EXT
TEL
AMP2
Speaker
Ope
G/A
AFE
LCD
Motor
Driver
(FB)
AMP8
Flat Bed
Flat Bed
Thermistor (Room)
Motor
Driver
(ADF)
Carriage motor
Color CIS
FFC 12
JST4
RP Sensor
Document Sensor
ADF motor
JST4 AMP4(Blue)
FB Relay Board
AMP4
AMP12
Pick Up Solenoid
JST8
JST3
FAN (left)
JST2
HVPS
AMR
FAN (right)
Pick Up Sensor
JST3
Resist Sensor
AMP4
PTOP Sensor
EXIT Sensor
AMP4 2
Thermistor (Heater)
AMP5
AMP10
Toner Sensor
12V 5V REG
12V 3.3V/1.2V DC-DC
AMP4
MB2090 only
Center Relay Board
Pick Sensor Board
Exit Sensor Board
Resist Sensor Board
Handset Relay Board
ADF Sensor Board
Operation Panel Board
Varistor Board
Sensor
LAN Phy

17
KX-MB2085CXW/KX-MB2090CXW
6.3. Main Board Section
6.3.1. Data Flow
CIS unit
LSU
PC
USB
TEL
LINE
Wired LAN
CN510
CN500/501
SDRAM
MODEM Scanner
I/F Print I/F
AFE IC503
IC400
IC300
Main Board
BUS
I/F
CPU
LAN
I/F DSPJBIG
CN100
DAA
IC200
T100
PHY USB
I/F
1
CN300
IC750
CN750
[FAX Tx]
1. An analog image data is output from CIS unit to IC503.
IC503 decode the analog data to digital data, and output to IC300.
Scanner I/F in IC300 process image data and store it in IC400/401
through SDRAM I/F.
2. CPU compress the data in IC400/401.
3. CPU transfer the data to MODEM
and output it to TEL LINE through DAA circuit.
FLASH
IC402
CIS unit
LSU
PC
USB
TEL
LINE
Wired LAN
CN510
CN500/501
SDRAM
MODEM Scanner
I/F Print I/F
AFE IC503
IC400
IC300
Main Board
BUS
I/F
CPU
LAN
I/F DSPJBIG
CN100
DAA
PHY USB
I/F
1
CN300
IC750
CN750
[FAX Rx]
1. FAX data is input from TEL LINE to MODEM in IC300
through DAA circuit.
And then store it in IC402 .
2. CPU decompress the data from IC402 to IC400/401.
3. Print I/F retrieve the data from IC400/401 and output it to LSU.
FLASH
IC402
IC200
T100

18
KX-MB2085CXW/KX-MB2090CXW
CIS unit
LSU
PC
USB
TEL
LINE
Wired LAN
CN510
CN500/501
SDRAM
MODEM Scanner
I/F Print I/F
AFE IC503
IC400
IC300
Main Board
BUS
I/F
CPU
LAN
I/F DSPJBIG
CN100
DAA
PHY USB
I/F
1
CN300
IC750
CN750
[PC Scan]
1. An analog image data is output from CIS unit to IC503.
IC503 decode the analog data to digital data, and output to IC300.
Scanner I/F in IC300 process image data and store it in IC400/401 through SDRAM I/F.
2. If necessary, DSP process image data.
3. 1. When you use the wired-LAN,
the data is output to PC through the LAN I/F and PHY(IC750).
2. When you use the USB, the data is output to PC through the USB I/F1.
FLASH
IC402
IC200
T100
CIS unit
LSU
PC
USB
TEL
LINE
Wired LAN
CN510
CN500/501
SDRAM
MODEM Scanner
I/F Print I/F
AFE IC503
IC400
IC300
Main Board
BUS
I/F
CPU
LAN
I/F DSPJBIG
CN100
DAA
PHY USB
I/F
1
CN300
IC750
CN750
[PC print]
1.The print data is output from PC:
through Wired-LAN and pass the PHY(IC750) and LAN I/F in IC300.
through USB and pass the USB I/F1 in IC300.
then the data is stored in IC400/401 through SDRAM I/F.
2. If necessary, the data is decompressed via JBIG.
3. Print I/F retrieve the data from IC400/401 and output it to LSU.
FLASH
IC402
IC200
T100

19
KX-MB2085CXW/KX-MB2090CXW
CIS unit
LSU
PC
USB
TEL
LINE
Wired LAN
CN510
CN500/501
SDRAM
MODEM Scanner
I/F Print I/F
AFE IC503
IC400
IC300
Main Board
BUS
I/F
CPU
LAN
I/F DSPJBIG
CN100
DAA
PHY USB
I/F
1
CN300
IC750
CN750
[Copy]
1. An analog image data is output from CIS unit to IC503.
IC503 decode the analog data to digital data, and output to IC300.
Scanner I/F in IC300 process image data and store it in IC400/401
through SDRAM I/F.
2. If necessary, the data is compressed/decompressed via JBIG.
3. Print I/F retrieve the data from IC400/401 and output it to LSU.
CIS unit
IC200
T100
FLASH
IC402

20
KX-MB2085CXW/KX-MB2090CXW
Description of Pin Distribution (IC300) SOC (System On Chip)
Pin No. Pin Name I/O Description
A2 SDCLK O SDRAM Clock
G1 SDCKE O SDRAM Clock Enable
A9 NSDCS O SDRAM Chip Select
A8 NSDRAS O SDRAM Row Address Strobe
B8 NSDCAS O SDRAM Column Address Strobe
A7 NSDWE O SDRAM Write Enable
F1 SDLDM1 O SDRAM Data Mask For Higher Byte (DQ[15:8])
B7 SDLDM0 O SDRAM Data Mask For Lower Byte (DQ[7:0])
C5 SDBA1 O SDRAM Bank Address1
C4 SDBA0 O SDRAM Bank Address0
C9 ROMCE O Flash/Mask ROM Chip Enable
B9 ROMOE O Flash/Mask ROM Output Enable
J4 ROMWE O Flash ROM Write Enable
M2 ADR25 O NOT USED
M1 ADR24 O NOT USED
H3 ADR23 O NOT USED
H4 ADR22 O NOT USED
L1 ADR21 O Flash ROM Address
K2 ADR20 O Flash ROM Address
K1 ADR19 O Flash ROM Address
L2 ADR18 O Flash ROM Address
L3 ADR17 O Flash ROM Address
M3 ADR16 O Flash ROM Address
J1 ADR15 O Flash ROM Address
J2 ADR14 O Flash ROM Address
J3 ADR13 O Flash ROM Address
D3 ADR12 O Flash ROM/SDRAM Address
E3 ADR11 O Flash ROM/SDRAM Address
C6 ADR10 O Flash ROM/SDRAM Address
F3 ADR9 O Flash ROM/SDRAM Address
G2 ADR8 O Flash ROM/SDRAM Address
G3 ADR7 O Flash ROM/SDRAM Address
G4 ADR6 O Flash ROM/SDRAM Address
H1 ADR5 O Flash ROM/SDRAM Address
H2 ADR4 O Flash ROM/SDRAM Address
D8 ADR3 O Flash ROM/SDRAM Address
C8 ADR2 O Flash ROM/SDRAM Address
D7 ADR1 O Flash ROM/SDRAM Address
C7 ADR0 O Flash ROM/SDRAM Address
F2 DAT15 I/O Flash ROM/SDRAM Data
E1 DAT14 I/O Flash ROM/SDRAM Data
E2 DAT13 I/O Flash ROM/SDRAM Data
D1 DAT12 I/O Flash ROM/SDRAM Data
D2 DAT11 I/O Flash ROM/SDRAM Data
C1 DAT10 I/O Flash ROM/SDRAM Data
C2 DAT9 I/O Flash ROM/SDRAM Data
B1 DAT9 I/O Flash ROM/SDRAM Data
B3 DAT7 I/O Flash ROM/SDRAM Data
A3 DAT6 I/O Flash ROM/SDRAM Data
B4 DAT5 I/O Flash ROM/SDRAM Data
A4 DAT4 I/O Flash ROM/SDRAM Data
B5 DAT3 I/O Flash ROM/SDRAM Data
A5 DAT2 I/O Flash ROM/SDRAM Data
B6 DAT1 I/O Flash ROM/SDRAM Data
A6 DAT0 I/O Flash ROM/SDRAM Data
AF13 USBDP1 I/O USB Interface
AE13 USBDM1 I/O USB Interface
AE11 USBVBUS1 I USB Interface
AF11 USBRES1 I/O USB Interface
AE14 USBSEL1 I 3.3V
AC1 USBDP2 I/O NOT USED
AC2 USBDM2 I/O NOT USED
AB2 USBVBUS2 I NOT USED
AB1 USBRES2 I/O GND
AA2 USBSEL2 I GND