Panasonic TY-TP42P8-S User manual

©2005 Matsushita Electric Industrial Co., Ltd. All
rights reserved. Unauthorized copying and
distribution is a violation of law.
TY-TP42P8-S
TY-TP50P8-S
TY-TPEN6 (Option)
Optic Touch Panel
Specifications
Power Source
Voltage DC + 5V ± 10 %
Electric current DC + 5V Ma
x
400 m
A
Suppl
y
system from USB Bus Power (DC + 5V Ma
x
500 mA)
Touch Panel
Detection system Infrared obstruction detection system
Panel window (W × H) 945.2 mm × 531.2 mm (37.2” × 20.9”)
(TY-TP42P8-S)
1129.2 mm × 645.2 mm (44.4” × 25.4”)
(TY-TP50P8-S)
Detection range (W × H) 920 mm × 516 mm (36.2” × 20.3”)
(TY-TP42P8-S)
1104 mm × 620 mm (43.4” × 24.4”)
(TY-TP50P8-S)
Effective detection range Detection range + 1.0 mm (0.04”) at the top, bottom, left and right
Operating modes Detection operation at input point, during initial movement and at end point *1
Resolution (W × H) 1,841 × 1,033 *1 (TY-TP42P8-S) 2,209 × 1,241 *1 (TY-TP50P8-S)
Detection pitch 2.0 mm × 2.0 mm (0.08” × 0.08”)
Output system Coordinate output
Number of optic elements (W × H) 231 × 130 elements (TY-TP42P8-S) 277 × 156 elements (TY-TP50P8-S)
Optic element pitch (W × H) 4.0 mm × 4.0 mm (0.16” × 0.16”)
ORDER NO. ITD0510062CE
D18

1 Prevention of Electro Static Discharge (ESD) to
Electrostatically Sensitive (ES) Devices 4
2 About lead free solder (PbF) 5
3 External dimensions 6
4 Setup for Touch Panel 7
5 Touch Pen (Option) 21
6 Printed Circuit Board Structure 22
6.1. TY-TP42P8-S 22
6.2. TY-TP50P8-S 23
7 Trouble shooting 24
7.1. Checking procedures 24
7.2. Test Program 26
8 Conductor Views 35
8.1. X-Photo1, X-Photo2, Y-Photo1 Board (42inch) 35
8.2. X-Photo1, X-Photo2, X-Photo3, Y-Photo1, Y-Photo2 Board
(50inch) 36
8.3. X-Photo3 Board (42inch) 37
8.4. X-Photo4 Board (50inch) 38
8.5. Y-Photo2 Board (42inch) 39
8.6. X-LED1, X-LED2, Y-LED1 Board (42inch) 40
8.7. X-LED1, X-LED2, X-LED3, Y-LED1, Y-LED2 Board
(50inch) 41
8.8. X-LED3 Board (42inch) 42
8.9. X-LED4 Board (50inch) 43
8.10. Y-LED2 Board (42inch) 44
8.11. Controller Board (42inch) 45
8.12. Controller Board (50inch) 46
8.13. Pen-Receive Board (42inch) 47
8.14. Pen-Receive Board (50inch) 48
9 Block Diagram 49
9.1. Overall Block Diagram (TY-TP42P8-S) 49
9.2. Overall Block Diagram (TY-TP50P8-S) 50
9.3. Detail Block Diagram (1 of 3) 51
9.4. Detail Block Diagram (2 of 3) 52
9.5. Detail Block Diagram (3 of 3) 53
10 Schematic Diagram 55
10.1. Controller Board Schematic Diagram 55
10.2. X-Photo 1 Board Schematic Diagram 56
10.3. X-Photo 2 Board Schematic Diagram 57
10.4. X-Photo 3 Board Schematic Diagram 58
Minimum stylus size (W × H) 6.0 mm × 6.0 mm (0.24” × 0.24”)
Scan speed Initial touch: 30 ms/frame max.; during movement: 8 ms/frame max.
Touch pen Infrared system
USB Interface (USB 1.1) Terminal No. and Signal name
(TYPE B)
No.1 Vcc No.2 -DATA
No.3 +DATA No.4 GND
Temperature When operating 0°C (32°F) to 50°C (122°F) (temperature gradient 25°C (77°F)/h
r
max.) *2
When not operating: -20°C (-4°F) to 60° (140°F) temperature gradient 25°C (77°F)/hr max.
Humidit
y
When operating: 20% to 85% (must be no condensation) *2
When not operating: 10% to 95%
Resistance to extraneous ligh
t
Lateral light: 2,000 lux MIN +20% (angle of incidence: 20°)
Frontal light: 10,000 lux MIN +20% (angle of incidence: 90°)
Panel form Flat panel (Flat type)
External dimensions (
W
×H×T) 1,073 mm × 659 mm × 69 mm
(42.2” × 25.9” × 2.7”)
(Excluding mounting brackets)
(TY-TP42P8-S)
1,257 mm × 773 mm × 69 mm
(49.5” × 30.4” × 2.7”)
(Excluding mounting brackets)
(TY-TP50P8-S)
Weigh
t
5.0 kg (11 lbs) Excluding mounting brackets
(TY-TP42P8-S)
5.8 kg (12.7 lbs) Excluding mounting brackets
(TY-TP50P8-S)
Extruded material
A
luminum
Notes:
*1
*2
When it is used with exclusive driver software.
This applies to the touch panel alone. When the panel is attached to a device such as a PDP, follow the environmental conditions for the
device being used.
CONTENTS
Page Page
2
TY-TP42P8-S / TY-TP50P8-S

10.5. X-Photo 4 Board Schematic Diagram (TY-TP50P8-S) 59
10.6. X-LED 1 Board and Pen Receive Board Schematic
Diagram 60
10.7. X-LED 2 Board Board Schematic Diagram 61
10.8. X-LED 3 Board Board Schematic Diagram 62
10.9. X-LED 4 Board Board Schematic Diagram (TY-TP50P8-S)
63
10.10. Y-Photo 1 Board Schematic Diagram 64
10.11. Y-Photo 2 Board Schematic Diagram 65
10.12. Y-LED 1 Board Schematic Diagram 66
10.13. Y-LED 2 Board Schematic Diagram 67
11 Exploded View 69
11.1. TY-TP42P8-S 69
11.2. TY-TP50P8-S 71
12 Replacement Parts List 73
12.1. Replacement Parts List Notes 73
12.2. TY-TP42P8-S Mechanical Replacement parts List 74
12.3. TY-TP42P8-S Electrical Replacement parts List 75
12.4. TY-TP50P8-S Mechanical Replacement parts List 84
12.5. TY-TP50P8-S Electrical Replacement parts List 85
3
TY-TP42P8-S / TY-TP50P8-S

1 Prevention of Electro Static Discharge (ESD) to
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage
caused by electro static discharge (ESD).
1.Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your
body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,
which should be removed for potential shock reasons prior to applying power to the unit under test.
2.After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.
3.Use only a grounded-tip soldering iron to solder or unsolder ES devices.
4.Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static (ESD protected)" can
generate electrical charge sufficient to damage ES devices.
5.Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.
6.Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most
replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable
conductive material).
7.Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be installed.
Caution
Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.
8.Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the
brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD)
sufficient to damage an ES device).
4
TY-TP42P8-S / TY-TP50P8-S

2 About lead free solder (PbF)
Note:
Lead is listed as (Pb) in the periodic table of elements.
In the information below, Pb will refer to Lead solder, and PbF will refer to Lead Free Solder.
The Lead Free Solder used in our manufacturing process and discussed below is (Sn+Ag+Cu).
That is Tin (Sn), Silver (Ag) and Copper (Cu) although other types are available.
This model uses Pb Free solder in it´s manufacture due to environmental conservation issues. For service and repair work, we´d
suggest the use of Pb free solder as well, although Pb solder may be used.
Caution
· Pb free solder has a higher melting point than standard solder. Typically the melting point is 50 ~ 70 °F (30~40 °C) higher.
Please use a high temperature soldering iron and set it to 700 ± 20 °F (370 ± 10 °C).
· Pb free solder will tend to splash when heated too high (about 1100 °F or 600 °C).
If you must use Pb solder, please completely remove all of the Pb free solder on the pins or solder area before applying Pb
solder. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.
· After applying PbF solder to double layered boards, please check the component side for excess solder which may flow onto
the opposite side. (see figure below)
Suggested Pb free solder
There are several kinds of Pb free solder available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper) solder.
However, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also be used.
0.3mm x 100g 0.6mm x 100g 1.0mm x 100g
5
TY-TP42P8-S / TY-TP50P8-S

3 External dimensions
TY-TP42P8-S
TY-TP50P8-S
6
TY-TP42P8-S / TY-TP50P8-S

4 Setup for Touch Panel
TY-TP42P8-S / TY-TP50P8-S
7

TY-TP42P8-S / TY-TP50P8-S
8

TY-TP42P8-S / TY-TP50P8-S
9

TY-TP42P8-S / TY-TP50P8-S
10

TY-TP42P8-S / TY-TP50P8-S
11

TY-TP42P8-S / TY-TP50P8-S
12

TY-TP42P8-S / TY-TP50P8-S
13

TY-TP42P8-S / TY-TP50P8-S
14

TY-TP42P8-S / TY-TP50P8-S
15

TY-TP42P8-S / TY-TP50P8-S
16

TY-TP42P8-S / TY-TP50P8-S
17

TY-TP42P8-S / TY-TP50P8-S
18

TY-TP42P8-S / TY-TP50P8-S
19

TY-TP42P8-S / TY-TP50P8-S
20