Panasonic PAN1026A Guide

PAN1026A
Bluetooth®Basic Data Rate and Low Energy Module
Design Guide
Rev. 1.1
Wireless Modules

PAN1026A Bluetooth Module
Design Guide Rev. 1.1 Page 2
Overview
The PAN1026A is a Class 2 Bluetooth 4.2
Basic Data Rate and Low Energy (LE) module
for easy implementation of Bluetooth
functionality into various electronic devices.
Features
•Small SMD module: 15.6 mm x 8.7 mm x 1.8 mm
•Same form factor as PAN1760A and PAN1762
•Bluetooth 4.2 Basic Data Rate and LE compliant
•Bluetooth stack in ROM
•Embedded Basic Data Rate Serial Port
Profile (SPP) profile
•Embedded LE GATT profile
•Supported by Toshiba Bluetooth SDK
•UART, 10 General Purpose I/Os, wake up control
pins
Bluetooth
•Basic Data Rate SPP profile
•LE Peripheral and Broadcast support
•LE GATT server and GATT client support
•LE Central and Observer not supported
Basic Data Rate Features
•Faster SPP classic connection and disconnection
times
•Support for interlaced inquiry and page scan
•Support for extended inquiry response
Low Energy Features
•Increased LE MTU size of 160 bytes
•Increased number of supported GATT services
•Increased number of supported GATT
characteristics
•Support for TX power control
•Support for LE Secure Connections
•Improved peak error rate (PER)
Characteristics
•Typical sensitivity: -88 dBm
•Output power: max. 4 dBm
•Typical TX power consumption: 46 mA
•Voltage range: 2.7 V to 3.6 V (+/-10 %)
•Temperature range: -40 °C to +85 °C
Block Diagram

PAN1026A Bluetooth Module
Design Guide Rev. 1.1 Page 3
By purchase of any of the products described in this document the customer accepts the document's
validity and declares their agreement and understanding of its contents and recommendations. Panasonic
Industrial Devices Europe GmbH (Panasonic) reserves the right to make changes as required at any time
without notification. Please consult the most recently issued Design Guide before initiating or completing a
design.
© Panasonic Industrial Devices Europe GmbH 2019.
This specification sheet is copyrighted. Reproduction of this document is permissible only if reproduction is
without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Do
not disclose it to a third party.
All rights reserved.
This Design Guide does not lodge the claim to be complete and free of mistakes.
Engineering Samples (ES)
If Engineering Samples are delivered to the customer, these samples have the status “Engineering
Samples”. This means that the design of this product is not yet concluded. Engineering Samples may be
partially or fully functional, and they may differ from the published Product Specification.
Engineering Samples are not qualified and they are not to be used for reliability testing or series
production.
Disclaimer
The customer acknowledges that samples may deviate from the Design Guide and may bear defects due
to their status of development and the lack of qualification mentioned above.
Panasonic rejects any liability or product warranty for Engineering Samples. In particular, Panasonic
disclaims liability for damages caused by:
The use of the Engineering Sample other than for evaluation purposes, particularly the installation
or integration in another product to be sold by the customer,
Deviation or lapse in function of the Engineering Sample,
Improper use of the Engineering Sample.
Panasonic Industrial Devices Europe GmbH disclaims any liability for consequential and incidental
damages. In case of any queries regarding the Engineering Samples, please contact your local sales
partner or the related product manager.

PAN1026A Bluetooth Module
Design Guide Rev. 1.1 Page 4
Table of Contents
1About This Document.........................................................................................................................5
1.1 Purpose and Audience ..............................................................................................................5
1.2 Revision History.........................................................................................................................5
1.3 Use of Symbols .........................................................................................................................5
1.4 Related Documents...................................................................................................................6
2Overview..............................................................................................................................................7
2.1 Block Diagram...........................................................................................................................7
2.2 Pin Configuration.......................................................................................................................8
2.3 UART Interface........................................................................................................................10
2.4 Bluetooth Features ..................................................................................................................10
3Reference Design..............................................................................................................................11
3.1 USB Evaluation Kit Schematic.................................................................................................11
3.2 Placement Recommendations.................................................................................................11
4Software Related Documents Summary.........................................................................................13
4.1 Predefined High Level APIs.....................................................................................................13
4.2 Validation of Elliptic Curve Parameters....................................................................................14
4.3 Unique Mac/Bluetooth Address...............................................................................................14
5USB Evaluation Kit ...........................................................................................................................15
5.1 Overview for the USB Evaluation Board Options.....................................................................15
5.2 Recommended Tools...............................................................................................................16
5.3 Development of Applications...................................................................................................16
6Appendix ...........................................................................................................................................17
6.1 Ordering Information................................................................................................................17
6.2 Contact Details........................................................................................................................18

PAN1026A Bluetooth Module
1 About This Document
Design Guide Rev. 1.1 Page 5
1 About This Document
1.1 Purpose and Audience
This Design Guide applies to the Bluetooth development platform PAN1026A USB.
The intention is to enable our customers to easily and fast integrate our module PAN1026A in
their product.
This Design Guide describes the hardware and gives useful hints.
It is intended for hardware and software engineers. The product is referred to as
“the PAN1026A” or “the module” within this document.
1.2 Revision History
Revision
Date
Modifications/Remarks
1.0
2018-09-28
Updated layout and structure changes
1.1
2019-09-16
Updated Security Erratum and formal changes
1.3 Use of Symbols
Symbol
Description
Note
Indicates important information for the proper use of the product.
Non-observance can lead to errors.
Attention
Indicates important notes that, if not observed, can put the product’s functionality
at risk.
Tip
Indicates useful information designed to facilitate working with the module.
[chapter number]
[chapter title]
Cross reference
Indicates cross references within the document.
Example:
Description of the symbols used in this document 1.3 Use of Symbols.

Requirement
Indicates a requirement that must be met before the corresponding tasks can be
completed.

Result
Indicates the result of a task or the result of a series of tasks.
This font
GUI text
Indicates fixed terms and text of the graphical user interface.
Example:
Click Save.

PAN1026A Bluetooth Module
1 About This Document
Design Guide Rev. 1.1 Page 6
Symbol
Description
Menu > Menu item
Path
Indicates a path, e.g. to access a dialog.
Example:
In the menu, select File > Setup page.
This font
File names, messages, user input
Indicates file names or messages and information displayed on the screen or to
be selected or entered by the user.
Examples:
pan1760.c contains the actual module initialization.
The message Failed to save your data is displayed.
Enter the value Product 123.
Key
Key
Indicates a key on the keyboard, e.g. F10.
1.4 Related Documents
Please refer to the Panasonic website for related documents 6.2.2 Product Information.

PAN1026A Bluetooth Module
2 Overview
Design Guide Rev. 1.1 Page 7
2 Overview
The PAN1026A is a Bluetooth 4.2 Basic Data Rate and LE module based on the Toshiba
TC35661 single-chip controller.
It has both a Bluetooth Basic Data Rate Serial Port Profile (SPP) and a Bluetooth LE GATT
profile stack integrated. Enhanced Data Rate (EDR) and GATT Central Mode are not
supported.
Only one connection (either Bluetooth Basic Data Rate or LE) at a time is supported,
simultaneous operation of Bluetooth Basic Data Rate and LE is not possible.
The integrated EEPROM is pre-programmed with a Bluetooth Device Address and can be used
to store additional application information such as connection link keys.
Compared to the PAN1026, the PAN1026A is fully backwards compatible, but has additional
support for increased MTU size, increased number of services and characteristics and now also
supports LE Secure Connections.
Previously developed Bluetooth LE profiles and applications can be easily migrated with a
minimal effort.
Please refer to the Panasonic website for related documents 6.2.2 Product Information.
Further information on the variants and versions 6.1 Ordering Information.
2.1 Block Diagram

PAN1026A Bluetooth Module
2 Overview
Design Guide Rev. 1.1 Page 8
2.2 Pin Configuration
Pin Assignment
Top View
Pin Functions
No
Pin Name
Pin Type
Description
A1
GND
Ground Pin
Connect to ground
A2
NC
NC
Not connected, leave open
A3
Reset
Digital Input
Reset, active low
A4
VCC
Power
Analog/digital power supply connection
A5
VCC
Power
Analog/digital power supply connection
A6
VCC
Power
Analog/digital power supply connection
A7
GND
Ground Pin
Connect to ground
A8
NC
NC
Not connected
A9
GND
Ground Pin
Connect to ground
A11
GND
Ground Pin
Connect to ground
A12
GND
Ground Pin
Connect to ground
B1
NC
NC
Not connected, leave open
B2
GPIO 11
Digital I/O
B3
GPIO 10
Digital I/O
B4
NC
NC
Not connected, leave open
B5
NC
NC
Not connected, leave open

PAN1026A Bluetooth Module
2 Overview
Design Guide Rev. 1.1 Page 9
No
Pin Name
Pin Type
Description
B6
NC
NC
Not connected, leave open
B7
NC
NC
Not connected, leave open
B8
NC
NC
Not connected, leave open
B9
NC
NC
Not connected, leave open
C1
GPIO 17
Digital I/O
C2
GPIO 13
Digital I/O
C3
GPIO 12
Digital I/O
C4
NC
NC
Not connected, leave open
C5
NC
NC
Not connected, leave open
C6
GPIO 04
Digital I/O
Commonly used for sleep mode Host wake up signal from host
C7
GPIO 05
Digital I/O
C8
GND
Ground Pin
Connect to ground
C9
GND
Ground Pin
Connect to ground
D1
GPIO 18
Digital I/O
D2
GPIO 16
Digital I/O
D3
GPIO 01
Digital I/O
Commonly used for sleep mode Status signal to host
D4
GPIO 00
Digital I/O
Commonly used for sleep mode Request wake up signal to host
D5
NC
NC
Not connected, leave open
D6
GPIO 03
Digital I/O
D7
GND
Ground Pin
Connect to ground
D8
GND
Ground Pin
Connect to ground
D9
ANT
RF-Signal
Antenna pin (not connected for standard version)
E1
SDA
Digital I/O
Internal I2C interface, connect to test pin
E2
SCL
Digital I/O
Internal I2C interface, connect to test pin
E3
GND
Ground Pin
Connect to ground
E4
NC
NC
Not connected, leave open
E5
CLKREQ
Digital Output
Active high once crystal frequency is stable
E6
UART RXD
Digital Input
UART RXD
E7
GPIO 02
Digital I/O
E8
GND
Ground Pin
Connect to ground
E9
GND
Ground Pin
Connect to ground
F1
GND
Ground Pin
Connect to ground
F2
EEPROM_WP
Digital Input
Internal EEPROM Write Protect (active high)

PAN1026A Bluetooth Module
2 Overview
Design Guide Rev. 1.1 Page 10
No
Pin Name
Pin Type
Description
F3
GND
Ground Pin
Connect to ground
F4
GND
Ground Pin
Connect to ground
F5
UART CTS
Digital Input
UART CTS
F6
SLEEPCLK
Digital Input
Input clock for 32.768 KHz
F7
UARTTXD
Digital Output
UART TX
F8
UARTRTS
Digital Output
UART RTS
F9
GND
Ground Pin
Connect to ground
F11
GND
Ground Pin
Connect to ground
F12
GND
Ground Pin
Connect to ground
2.3 UART Interface
•Full-Duplex 4-wire data transfer: Rx, Tx, RTS, CTS
•Programmable baud rate: 2 400 bps to 4.33 Mbps
•Default baud rate: 115 200 bps
•Data format: 8N1, LSB first
•Error detection: Character timeout, Overrun error, Framing error
2.4 Bluetooth Features
•Bluetooth 4.2 with SPP and GATT
•GAP support for SPP
•GATT server and client mode supported for LE
•Class 2 Tc power with or without external PA (improved link robustness)
•Excellent link budget (up to 91 dB), enabling long-range applications
•GAP peripheral support for LE

PAN1026A Bluetooth Module
3 Reference Design
Design Guide Rev. 1.1 Page 11
3 Reference Design
3.1 USB Evaluation Kit Schematic
3.2 Placement Recommendations
Antenna “Keep out Area”
Do not place any ground plane under the marked restricted antenna area in
any layer! This would be affecting the performance of the chip antenna in a
critical manner.
The following requirements must be met:
Keep this product away from heat. Heat is the major cause of decreasing the life of these
products.
Keep this product away from other high frequency circuits.
+3V3
+3V3
n.c./0
n.c./0
0.5
+5V
0 Ohm/47p 0 Ohm/47p
1µ
4µ7
B3U-1000P
1k5
+3V3
USB_A
BLM15BB121SN1
4µ7
+5V
10nF
100nF
FT232RQ
BLM15BB121SN1
100nF
4µ7
+3V3
100nF
0
0
0
0
0
0
+5V
PAN1026
PAN1026
n.c./0
n.c./0
100nF
n.c.
+3V3
Green 270
100nF
SO2520-000032
+3V3
100nF
0
+3V3
0/n.c.
10k/n.c.
Green
270
+3V3
-Supply-Part
EN
3IN
1
NC 4
OUT 5
IC3
TPS76933
R3
R2
R15
C4 C5
C12
C11
S1
R10
DN 2
DP 3
GND@1GND@2
USB_GND 4
USB_VCC 1
X2
GND@3GND@4
L2
C13
C3
C1
IC2
VCC
19
3V3OUT
16
USBDP
14 USBDM
15
OSCO
28 OSCI
27
GND 4
TXD 30
RXD 2
RTS# 32
CTS# 8
DTR# 31
DSR# 6
DCD# 7
RI# 3
CBUS0 22
CBUS1 21
CBUS2 10
CBUS3 11
CBUS4 9
VCCIO
1
RESET#
18
GND
24
GND 17
TEST 26
GND 20
L1
C8
C2
C6
R5
R6
R7
R8
R11
R12
RF D9
GPIO5/FSYNC C7
GPIO4/PCMCLK C6
GPIO3/PCMIN D6
GPIO2/PCMOUT E7
GPIO16/DIN D2
GPIO17/CS0X C1
GPIO18/CS1X D1
GPIO10/BTA B3
GPIO11/BTS B2
GPIO12/WIA C3
GPIO13/BTI C2
EEPROMWP F2
GPIO14/SCL E2
GPIO15/SDA E1
GPIO6/UARTTX
F7 GPIO7/UARTRX
E6 GPIO8/RTS
F8
GPIO0/URDY
D4 URDY
E4 USBDP
F3 USBDM
F4
RESET
A3
PAN1026_PORTS
GPIO9/CTS
F5
GPIO1
D3
SLEEPCLK
F6 CLKRRQ
E5
VCC A6
VCC A5
VCC_DVDDB A4
GND F12
GND F11
GND F9
GND F1
GND E9
GND E8
GND D8
GND D7
GND C9
GND C8
GND A12
GND A11
GND A9
GND A7
GND A1
N.C.
C5 N.C.
C4 N.C.
B9 N.C.
B8 N.C.
B7 N.C.
B6
N.C.
D5
N.C.
B5 N.C.
B4 N.C.
B1 N.C.
A8 N.C.
A2
VDDUSB E3 R13
R1
C10
R4
LED
R14
C9
STANDBY
1GND
2
VDD
4OUTPUT 3
IC1
C7
R9
R16
12
34
56
78
910
X1
R17
LED1
R18
DP
DP
RESET
RESET
DN
DN
MOD_RX
MOD_RX
MOD_TX
MOD_TX
MOD_CTS
MOD_CTS
MOD_RTS
MOD_RTS
USBDPUSBDP USBDM
USBDM
GPIO0
GPIO0
SCL
SDA
SLEEPCLK
SLEEPCLK
GPIO1
GPIO1
GPIO13
GPIO13
GPIO12
GPIO12
GPIO11
GPIO11
GPIO10
GPIO10
GPIO18
GPIO18
GPIO17
GPIO17
GPIO16
GPIO16
GPIO5
GPIO5
Additional testpins
V1.2
Placement Difference for C4, C5, R1, R2, R3, R13 and R16:
dueto different functions: UART or Direct USB
UART / Direct USB// The different variants are seperatedby backslash. Left side is for UART, right side is USB direct.
This area will not be placed when USB is used
32.768kHz optional Oscillator
only needed when special sleep mode
USB is NOTsupported yet by the IC UARTAREA
PAN1026ETU Reference Design with UART and USBOption
DS-DG-1026ETU-205
IC1 is mounted on the board
Active mode
UFL
GND

PAN1026A Bluetooth Module
3 Reference Design
Design Guide Rev. 1.1 Page 12
Antenna “Keep out Area”
The antenna requires a cutout area of 5 mm x 3 mm under the PAN1026A module. This “Keep
out Area”shall be located in every layer under the module antenna.
Impact of Placement on the Antenna Radiation Pattern
The placement of the module, surrounding material, and customer
components have an impact on the radiation pattern of the antenna.
It is recommended to verify the perfect position of the module in the target application before
fixing the design.
Top View
8.7 mm
15.6 mm
Keep-Out Area
5.00 mm
3.00 mm
Min. 15 mm
Min. 15 mm
Dimensions are in mm.
Use a ground plane in the
area surrounding the module
module wherever possible.
Min. 40 mm
If possible place the module in the
center of mother PCB.
Place the module at the edge of
mother PCB.

PAN1026A Bluetooth Module
4 Software Related Documents Summary
Design Guide Rev. 1.1 Page 13
4 Software Related Documents Summary
4.1 Predefined High Level APIs
Make use of the easy-to-use High-Level SPP and Bluetooth LE API for PAN1026A setup,
connect and data transfer in an easy way. Driver layer provide access to the entire function set
of the module. SPP and Bluetooth LE application example is available on Toshiba ARM®
Cortex®-M3 MCU with FreeRTOS integration.
High Level SPP APIs are sufficient for communication with a remote SPP device.
With the LE+GATT Driver the use of PAN1026A Command Interface is simplified. It
encapsulates Chiron LE MNG, GAP and GATT Commands in one.
High Level SPP APIs
High Level Bluetooth LE APIs
Documentation
•SPP API Specification
•SPP Driver Specification
•SPP Application Note
•Bluetooth LE API Specification
•LE+GATT Driver Specification
•LE Heart-Rate Profile Application
Note
Software
•SPP Application example source
code
•SPP API as source code
•SPP drivers as source code
•Project files for Toshiba
•TMPM395 MCU
•LE Application example source code
•LE Heart-Rate Profile example source
code
•Bluetooth LE API source code
•LE+GATT driver source code
•Project files for Toshiba TMPM369
MCU

PAN1026A Bluetooth Module
4 Software Related Documents Summary
Design Guide Rev. 1.1 Page 14
4.2 Validation of Elliptic Curve Parameters
Researchers at the Israel Institute of Technology identified a security vulnerability in two related
Bluetooth features: Secure Simple Pairing and LE Secure Connections.
PAN1026A supports those features but does not perform public key validation during the pairing
procedure. In this case, connections between devices could be vulnerable to a
man-in-the-middle attack that would allow for the monitoring or manipulation of traffic.
To remedy the vulnerability, the Bluetooth SIG has now updated the Bluetooth specification to
require products to validate any public key received as part of public key-based security
procedures. In addition, the Bluetooth SIG has added testing for this vulnerability within the
Bluetooth Qualification Program.
The necessary procedures are included starting with the release of the Toshiba Bluetooth SDK
version 4.2.2. Further information is included in the documentation
Toshiba_Bluetooth_Platform_Errata.pdf contained in the SDK.
To ensure that the end product is operating according to the Bluetooth
specification the customer application has to follow the above mentioned
instructions.
4.3 Unique Mac/Bluetooth Address
The PAN1026A has a preprogrammed address in the EEPROM that needs to be copied into the
RAM during the initialization. Therefore three TCU commands need to be used. Below is an
example with the individual address 00 13 43 00 00 1A.
The bold marked Bluetooth address is original and needs to be byte switched
to write into the RAM of the module to be visible in an Bluetooth inquiry as
example.
1. Enter the address: 01 08 FC 0B 00 A0 00 00 00 14 5B FF 02 03 01.
The result is: 04 FF 0A 08 00 A0 00 00 00 14 5B 00 00.
2. Read the Bluetooth address from E2PROM:
01 08 FC 10 00 A1 00 00 00 14 88 FF 10 06 A0 01 01 06 02 00.
The result is:
04 FF 11 08 00 A1 00 00 00 14 88 00 10 06 00 13 43 00 00 1A.
3. Set the address into RAM: 01 13 10 06 1A 00 00 43 13 00.
The result is: 04 0E 04 04 13 10 00.

PAN1026A Bluetooth Module
5 USB Evaluation Kit
Design Guide Rev. 1.1 Page 15
5 USB Evaluation Kit
PAN1026A USB (easy to use) is a development platform for PAN1026A Bluetooth LE dual
module to implement Bluetooth functionality into various electronic devices.
The PAN1026A USB is intended for evaluation purpose and can be used together with
EasySPP and EasyBLE Software.
The API is a very useful abstracted tool, which is described on the Toshiba website.
For further details on additional options and services please refer to
6.2.1 Contact Us.
5.1 Overview for the USB Evaluation Board Options
Options
•UFL-External Antenna
•USB Direct
•Low Power Clock
•EPROM Write Protect
•UART Exposure
UFL-external antenna connector can be used if the cap next to the modules
shield is moved (de-soldered, soldered) to the other (free) pin.
Ingo Wagner 2012
PAN1026 –USB Kit
USB
Direct
USB Direct
32KHz LE
Clock
UFL-Ext.
Antenna
32KHz LE
Clock
UFL-Ext.
Antenna
32KHz LE
Clock
EEPROM
WP
UART
Exposure

PAN1026A Bluetooth Module
5 USB Evaluation Kit
Design Guide Rev. 1.1 Page 16
5.2 Recommended Tools
EasySPP
The following requirement must be met:
Microsoft .NET framework (version 4) which can be downloaded from the Microsoft website
Easy SPP is the first step to get familiar with the TCU commands. The issued commands can
be copied and then ported to any microcontroller. HyperTerminal is not recommended to use
because the commands are in binary format.
EasyBLE
This tool has the same intention as the EasySPP and shows some example Bluetooth LE
profiles e. g. heart rate sensor. It can be used together with various of the shelf apps running on
iPhone and Android phones supporting Bluetooth 4.0. One example is “Wahoo Utility” which is
available in the Apples iTunes App Store.
EasyBLE documentation includes an application example how to connect PAN1026A USB stick
and an iOS device.
5.3 Development of Applications
Please contact your local sales office for customized development of your individual application
6.2.1 Contact Us.
Please note that the individual Mac address is stored in the EEPROM and has
to be loaded into the RAM after each start-up.
The following tools are recommended: IAR, J-Link debugger.
The BMSKTOPASM369BT(kc) Starter Kit makes it possible to quickly and easily evaluate
Toshiba’s Bluetooth Dual Mode LSI TC35661-5xx in combination with Toshiba ARM®
Cortex®-M3 MCU as host MCU. It is made to execute the Toshiba Bluetooth Driver software and
debug user application code via an embedded J-Link debugger interface. The TMPM369FDFG
Microcontroller offers embedded Ethernet, CAN, USB host, USB device and RS-232
connectivity.
Starter Kit Content:
•Toshiba TOPAS369Bluetooth Board
•Segger J-Link JTAG/SWD Emulator with USB interface
•J-Link 19-pin Cortex-M Adapter
•USB Cable
•Rapid Start-Up Guide

PAN1026A Bluetooth Module
6 Appendix
Design Guide Rev. 1.1 Page 17
6 Appendix
6.1 Ordering Information
Variants and Versions
Order Number
Brand Name
Description
MOQ1
ENW89837AYKF2
PAN1026-ETU
PAN1026ETU Development Kit (includes 2 USB sticks)
1
ENW89837A5KF2
PAN1026A
Bluetooth Bluetooth 4.2 Basic Data Rate and LE module
1 500
1
Abbreviation for Minimum Order Quantity (MOQ). The default MOQ for mass production is 1 500 pieces,
fewer only on customer demand. Samples for evaluation can be delivered at any quantity via the distribution
channels.
2
Samples are available on customer demand.

PAN1026A Bluetooth Module
6 Appendix
Design Guide Rev. 1.1 Page 18
6.2 Contact Details
6.2.1 Contact Us
Please contact your local Panasonic Sales office for details on additional product options and
services:
For Panasonic Sales assistance in the EU, visit
https://eu.industrial.panasonic.com/about-us/contact-us
Email: [email protected]onic.com
For Panasonic Sales assistance in North America, visit the Panasonic website
“Sales & Support”to find assistance near you at
https://na.industrial.panasonic.com/distributors
Please visit the Panasonic Wireless Technical Forum to submit a question at
https://forum.na.industrial.panasonic.com
6.2.2 Product Information
Please refer to the Panasonic Wireless Connectivity website for further information on our
products and related documents:
For complete Panasonic product details in the EU, visit
http://pideu.panasonic.de/products/wireless-modules.html
For complete Panasonic product details in North America, visit
http://www.panasonic.com/rfmodules