Ublox TOBY-R2 Series Quick setup guide

TOBY-R2 series
Multi-mode LTE Cat 1 modules with 2G/3G fallback
System integration manual
Abstract
This document describes the features and the system integration of TOBY-R2 series multi-mode
cellular modules. These modules are a complete, cost efficient and performance optimized LTE
Cat 1 / 3G / 2G multi-mode solution covering up to four LTE bands, up to four 3G UMTS/HSPA bands
and up to four 2G GSM/EGPRS bands in the compact TOBY LGA form factor.
www.u-blox.com
UBX-16010572 - R10

TOBY-R2 series - System integration manual
UBX-16010572 - R10 Page 2 of 151
Document information
Title
TOBY-R2 series
Subtitle
Multi-mode LTE Cat 1 modules with 2G/3G fallback
Document type
System integration manual
Document number
UBX-16010572
Revision and date
R10
30-Aug-2019
Disclosure restriction
Product status
Corresponding content status
Functional sample
Draft
For functional testing. Revised and supplementary data will be published later.
In development /
Prototype
Objective specification
Target values. Revised and supplementary data will be published later.
Engineering sample
Advance information
Data based on early testing. Revised and supplementary data will be published later.
Initial production
Early production information
Data from product verification. Revised and supplementary data may be published later.
Mass production /
End of life
Production information
Document contains the final product specification.
This document applies to the following products:
Product name
Type number
Modem version
Application version
PCN reference
Product status
TOBY-R200
TOBY-R200-02B-00
30.31
A01.01
UBX-17006265
End of life
TOBY-R200-02B-01
30.31
A02.00
UBX-17048314
End of life
TOBY-R200-02B-02
30.31
A02.01
UBX-18018067
End of life
TOBY-R200-02B-03
30.31
A02.02
UBX-18057549
End of life
TOBY-R200-02B-04
30.33
A02.02
UBX-19011731
Mass production
TOBY-R200-42B-00
30.53
A01.00
UBX-19039698
Engineering sample
TOBY-R200-82B-00
30.53
A01.00
UBX-19039698
Engineering sample
TOBY-R202
TOBY-R202-02B-00
30.31
A01.01
UBX-17006265
End of life
TOBY-R202-02B-01
30.31
A02.00
UBX-17048314
End of life
TOBY-R202-02B-02
30.31
A02.01
UBX-18018067
End of life
TOBY-R202-02B-03
30.31
A02.02
UBX-18057549
End of life
TOBY-R202-02B-04
30.33
A02.02
UBX-19011731
Mass production
TOBY-R202-02B-34
30.33
A02.03
UBX-19039777
Mass production
u-blox or third parties may hold intellectual property rights in the products, names, logos and designs included in this
document. Copying, reproduction, modification or disclosure to third parties of this document or any part thereof is only
permitted with the express written permission of u-blox.
The information contained herein is provided “as is” and u-blox assumes no liability for its use. No warranty, either express or
implied, is given, including but not limited to, with respect to the accuracy, correctness, reliability and fitness for a particular
purpose of the information. This document may be revised by u-blox at any time without notice. For the most recent
documents, visit www.u-blox.com.
Copyright © u-blox AG.

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Contents
Document information................................................................................................................................2
Contents ..........................................................................................................................................................3
1System description............................................................................................................................... 7
1.1 Overview........................................................................................................................................................ 7
1.2 Architecture .................................................................................................................................................9
1.3 Pin-out......................................................................................................................................................... 10
1.4 Operating modes....................................................................................................................................... 14
1.5 Supply interfaces ...................................................................................................................................... 16
1.5.1 Module supply input (VCC) ............................................................................................................. 16
1.5.2 RTC supply input/output (V_BCKP) ..............................................................................................24
1.5.3 Generic digital interfaces supply output (V_INT).......................................................................25
1.6 System function interfaces ....................................................................................................................26
1.6.1 Module power-on ..............................................................................................................................26
1.6.2 Module power-off..............................................................................................................................28
1.6.3 Module reset...................................................................................................................................... 31
1.6.4 Module / host configuration selection.......................................................................................... 31
1.7 Antenna interface.....................................................................................................................................32
1.7.1 Antenna RF interfaces (ANT1 / ANT2)..........................................................................................32
1.7.2 Antenna detection interface (ANT_DET).....................................................................................34
1.8 SIM interface..............................................................................................................................................34
1.8.1 SIM interface .....................................................................................................................................34
1.8.2 SIM detection interface...................................................................................................................34
1.9 Data communication interfaces ............................................................................................................35
1.9.1 UART interface..................................................................................................................................35
1.9.2 USB interface.....................................................................................................................................46
1.9.3 DDC (I2C) interface............................................................................................................................49
1.9.4 SDIO interface ................................................................................................................................... 51
1.10 Audio............................................................................................................................................................52
1.10.1 Digital audio over I2S interface.......................................................................................................52
1.11 Clock output...............................................................................................................................................53
1.12 General Purpose Input/Output...............................................................................................................53
1.13 Reserved pins (RSVD) ..............................................................................................................................53
1.14 System features........................................................................................................................................54
1.14.1 Network indication ...........................................................................................................................54
1.14.2 Antenna supervisor..........................................................................................................................54
1.14.3 Jamming detection..........................................................................................................................54
1.14.4 Dual stack IPv4/IPv6.........................................................................................................................54
1.14.5 TCP/IP and UDP/IP............................................................................................................................55
1.14.6 FTP.......................................................................................................................................................55
1.14.7 HTTP....................................................................................................................................................55

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1.14.8 SSL / TLS............................................................................................................................................55
1.14.9 Bearer Independent Protocol..........................................................................................................57
1.14.10 AssistNow clients and GNSS integration....................................................................................57
1.14.11 Hybrid positioning and CellLocate®...............................................................................................58
1.14.12 Wi-Fi integration...............................................................................................................................60
1.14.13 Firmware update Over AT (FOAT).................................................................................................60
1.14.14 Firmware update Over The Air (FOTA).........................................................................................60
1.14.15 Smart temperature management ................................................................................................ 61
1.14.16 Power saving......................................................................................................................................63
2Design-in................................................................................................................................................ 64
2.1 Overview......................................................................................................................................................64
2.2 Supply interfaces ......................................................................................................................................65
2.2.1 Module supply (VCC)........................................................................................................................65
2.2.2 RTC supply output (V_BCKP) .........................................................................................................79
2.2.3 Generic digital interfaces supply output (V_INT)....................................................................... 81
2.3 System functions interfaces..................................................................................................................82
2.3.1 Module power-on (PWR_ON)..........................................................................................................82
2.3.2 Module reset (RESET_N).................................................................................................................83
2.3.3 Module / host configuration selection..........................................................................................84
2.4 Antenna interface.....................................................................................................................................85
2.4.1 Antenna RF interfaces (ANT1 / ANT2)..........................................................................................85
2.4.2 Antenna detection interface (ANT_DET).....................................................................................92
2.5 SIM interface..............................................................................................................................................94
2.5.1 Guidelines for SIM circuit design...................................................................................................94
2.5.2 Guidelines for SIM layout design ...................................................................................................99
2.6 Data communication interfaces ..........................................................................................................100
2.6.1 UART interface................................................................................................................................100
2.6.2 USB interface...................................................................................................................................105
2.6.3 DDC (I2C) interface.......................................................................................................................... 107
2.6.4 SDIO interface ...................................................................................................................................111
2.7 Audio interface .........................................................................................................................................112
2.7.1 Digital audio interface.....................................................................................................................112
2.8 General Purpose Input/Output..............................................................................................................116
2.9 Reserved pins (RSVD) ............................................................................................................................. 117
2.10 Module placement ................................................................................................................................... 117
2.11 Module footprint and paste mask........................................................................................................118
2.12 Thermal guidelines ..................................................................................................................................119
2.13 ESD guidelines......................................................................................................................................... 120
2.13.1 ESD immunity test overview ........................................................................................................120
2.13.2 ESD immunity test of TOBY-R2 series reference designs......................................................121
2.13.3 ESD application circuits .................................................................................................................121
2.14 Schematic for TOBY-R2 series module integration......................................................................... 123
2.14.1 Schematic for TOBY-R2 series module “x2” product version................................................ 123

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2.15 Design-in checklist.................................................................................................................................. 124
2.15.1 Schematic checklist....................................................................................................................... 124
2.15.2 Layout checklist.............................................................................................................................. 125
2.15.3 Antenna checklist........................................................................................................................... 125
3Handling and soldering ....................................................................................................................126
3.1 Packaging, shipping, storage and moisture preconditioning ........................................................ 126
3.2 Handling.................................................................................................................................................... 126
3.3 Soldering................................................................................................................................................... 127
3.3.1 Soldering paste ............................................................................................................................... 127
3.3.2 Reflow soldering.............................................................................................................................. 127
3.3.3 Optical inspection........................................................................................................................... 128
3.3.4 Cleaning ............................................................................................................................................ 128
3.3.5 Repeated reflow soldering ............................................................................................................ 129
3.3.6 Wave soldering................................................................................................................................ 129
3.3.7 Hand soldering ................................................................................................................................ 129
3.3.8 Rework .............................................................................................................................................. 129
3.3.9 Conformal coating.......................................................................................................................... 129
3.3.10 Casting.............................................................................................................................................. 129
3.3.11 Grounding metal covers ................................................................................................................130
3.3.12 Use of ultrasonic processes .........................................................................................................130
4Approvals.............................................................................................................................................. 131
4.1 Product certification approval overview..............................................................................................131
4.2 US Federal Communications Commission notice............................................................................ 132
4.2.1 Safety warnings review the structure........................................................................................ 132
4.2.2 Declaration of Conformity............................................................................................................. 132
4.2.3 Modifications................................................................................................................................... 133
4.3 Innovation, Science, Economic Development Canada notice ........................................................ 134
4.3.1 Declaration of Conformity............................................................................................................. 134
4.3.2 Modifications................................................................................................................................... 134
4.4 European Conformance CE mark ........................................................................................................ 136
5Product testing ..................................................................................................................................137
5.1 u-blox in-series production test........................................................................................................... 137
5.2 Test parameters for OEM manufacturer...........................................................................................138
5.2.1 “Go/No go” tests for integrated devices .................................................................................... 138
5.2.2 RF functional tests.........................................................................................................................138
Appendix ..................................................................................................................................................... 140
AMigration between TOBY-L2 and TOBY-R2 ............................................................................ 140
A.1 Overview....................................................................................................................................................140
A.2 Pin-out comparison between TOBY-L2 and TOBY-R2 .................................................................... 142
A.3 Schematic for TOBY-L2 and TOBY-R2 integration.......................................................................... 145
BGlossary ................................................................................................................................................146
Related documents ..................................................................................................................................149

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Revision history .........................................................................................................................................150
Contact......................................................................................................................................................... 151

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1System description
1.1 Overview
The TOBY-R2 series comprises LTE Cat 1 / 3G / 2G multi-mode modules supporting up to six LTE
bands, up to four 3G UMTS/HSPA bands and up to four 2G GSM/(E)GPRS bands for voice and/or data
transmission in the small TOBY LGA form-factor (35.6 x 24.8 mm, 152-pin), easy to integrate in
compact designs:
TOBY-R200 are designed for worldwide operation on LTE, 3G and 2G networks, and primarily in
North America
TOBY-R202 are designed primarily for operation in North America, on LTE and 3G networks
TOBY-R2 series modules are form-factor compatible with u-blox SARA, LISA and LARA cellular
module families and are pin-to-pin compatible with u-blox TOBY-L cellular module families: this
facilitates easy migration from the u-blox GSM/GPRS, CDMA, UMTS/HSPA, and LTE high data rate
modules, maximizes the investments of customers, simplifies logistics, and enables very short
time-to-market.
The modules are ideal for applications that are transitioning to LTE from 2G and 3G, due to the long
term availability and scalability of LTE networks.
With a range of interface options and an integrated IP stack, the modules are designed to support a
wide range of data-centric applications. The unique combination of performance and flexibility make
these modules ideally suited for medium speed M2M applications, such as smart energy gateways,
remote access video cameras, digital signage, telehealth and telematics.
TOBY-R2 series modules include product versions supporting Voice over LTE (VoLTE) and voice over
3G / 2G (CSFB) for applications that require voice, such as security and surveillance systems.
Table 1 summarizes the main features and interfaces of TOBY-R2 series modules.
Model
Region
Radio Access
Technology
Positioning
Interfaces
Audio
Features
Grade
LTE bands1
UMTS bands
GSM bands
GNSS via modem
AssistNow Software
CellLocate®
UART
USB 2.0
SDIO *
DDC (I2C)
GPIOs
Analog audio
Digital audio
Network indication
VoLTE
Antenna supervisor
Rx Diversity
Jamming detection
Embedded TCP/UDP stack
Embedded HTTP, FTP, SSL
FOTA
Dual stack IPv4 / IPv6
Standard
Professional
Automotive
TOBY-R200-02B
North
America
2,4
5,12
850,900
1900,2100
Quad
■
■
■
1
1
1
1
9
●
●
●
●
●
□
●
●
●
●
●
TOBY-R200-42B
Global
1,2,4
5,8,12
850,900
1900,2100
Quad
●
●
●
1
1
1
1
9
●
●
●
□
●
●
●
●
●
TOBY-R200-82B
Global
1,2,4
5,8,12
850,900
1900,2100
Quad
●
●
●
1
1
1
1
9
●
●
●
□
●
●
●
●
●
TOBY-R202-02B
North
America
2,4
5,12
850,1900
■
■
■
1
1
1
1
9
●
●
●
●
●
□
●
●
●
●
●
●= Supported by all FW version ■= Supported by "TOBY-R2xx-02B-01"FW version onwards □= Supported by future FW version *= HW ready
Table 1: TOBY-R2 series main features summary
1
LTE band 12 is a superset including band 17: LTE band 12 is supported along with Multi-Frequency Band Indicator feature

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Table 2 summarizes cellular radio access technology characteristics and features of the modules.
4G LTE
3G UMTS/HSDPA/HSUPA
2G GSM/GPRS/EDGE
3GPP Release 9
Long Term Evolution (LTE)
Evolved UTRA (E-UTRA)
Frequency Division Duplex (FDD)
DL Rx Diversity
3GPP Release 9
High Speed Packet Access (HSPA)
UMTS Terrestrial Radio Access (UTRA)
Frequency Division Duplex (FDD)
DL Rx diversity
3GPP Release 9
Enhanced Data rate GSM Evolution (EDGE)
GSM EGPRS Radio Access (GERA)
Time Division Multiple Access (TDMA)
DL Advanced Rx Performance Phase 1
Band support2:
TOBY-R200-02B:
oBand 12 (700 MHz)3
oBand 5 (850 MHz)
oBand 4 (1700 MHz)
oBand 2 (1900 MHz)
TOBY-R200-42B, TOBY-R200-82B:
oBand 12 (700 MHz)3
oBand 5 (850 MHz)
oBand 8 (900 MHz)
oBand 4 (1700 MHz)
oBand 2 (1900 MHz)
oBand 1 (2100 MHz)
TOBY-R202:
oBand 12 (700 MHz)3
oBand 5 (850 MHz)
oBand 4 (1700 MHz)
oBand 2 (1900 MHz)
Band support:
TOBY-R200-02B:
oBand 5 (850 MHz)
oBand 8 (900 MHz)
oBand 2 (1900 MHz)
oBand 1 (2100 MHz)
TOBY-R200-42B, TOBY-R200-82B:
oBand 5 (850 MHz)
oBand 8 (900 MHz)
oBand 2 (1900 MHz)
oBand 1 (2100 MHz)
TOBY-R202:
oBand 5 (850 MHz)
oBand 2 (1900 MHz)
Band support:
TOBY-R200-02B:
oGSM 850 MHz
oE-GSM 900 MHz
oDCS 1800 MHz
oPCS 1900 MHz
TOBY-R200-42B, TOBY-R200-82B:
oGSM 850 MHz
oE-GSM 900 MHz
oDCS 1800 MHz
oPCS 1900 MHz
LTE Power Class
Class 3 (23 dBm)
UMTS/HSDPA/HSUPA Power Class
Class 3 (24 dBm)
GSM/GPRS (GMSK) Power Class
Class 4 (33 dBm) for GSM/E-GSM band
Class 1 (30 dBm) for DCS/PCS band
EDGE (8-PSK) Power Class
Class E2 (27 dBm) for GSM/E-GSM band
Class E2 (26 dBm) for DCS/PCS band
Data rate
LTE category 1:
up to 10.3 Mb/s DL, 5.2 Mb/s UL
Data Rate
HSDPA category 8:
up to 7.2 Mb/s DL
HSUPA category 6:
up to 5.76 Mb/s UL
Data Rate4
GPRS multi-slot class 335, CS1-CS4,
up to 107 kb/s DL, up to 85.6 kb/s UL
EDGE multi-slot class 335, MCS1-MCS9,
up to 296 kb/s DL, up to 236.8 kb/s UL
Table 2: TOBY-R2 series LTE, 3G and 2G characteristics summary
TOBY-R2 series modules, except for the "42" / "82" product versions, provide Voice over LTE (VoLTE)
as well as Circuit-Switched-Fall-Back (CSFB) audio capability.
2
TOBY-R2 modules support all the E-UTRA channel bandwidths for each operating band according to 3GPP TS 36.521-1 [20]:
Band 12: 1.4 MHz, 3 MHz, 5 MHz, 10 MHz
Band 5: 1.4 MHz, 3 MHz, 5 MHz, 10 MHz
Band 4: 1.4 MHz, 3 MHz, 5 MHz, 10 MHz, 15 MHz, 20 MHz
Band 2: 1.4 MHz, 3 MHz, 5 MHz, 10 MHz, 15 MHz, 20 MHz
3
LTE band 12 is a superset that includes band 17
4
GPRS/EDGE multi-slot class determines the number of timeslots available for upload and download and thus the speed at
which data can be transmitted and received, with higher classes typically allowing faster data transfer rates.
5
GPRS/EDGE multi-slot class 33 implies a maximum of 5 slots in DL (Rx) and 4 slots in UL (Tx) with 6 slots in total.

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1.2 Architecture
Figure 1 summarizes the internal architecture of TOBY-R2 series modules.
Cellular
Base-band
Processor
Memory
Power Management Unit
26 MHz
32.768 kHz
ANT1
RF
Transceiver
ANT2
V_INT (I/O)
V_BCKP (RTC)
VCC (Supply)
SIM
USB
GPIO
Power On
External Reset
PAs
LNA
s
Filters
Filter
s
Duplexer
Filters
PAs
LNA
s
Filter
s
Filter
s
Duplexer
Filters
LNA
s
Filter
s
Filters
LNA
s
FiltersFilter
s
Switch
Switch
DDC(I2C)
SDIO
UART
Digital audio (I2S)
ANT_DET
Host Select
Figure 1: TOBY-R2 series modules simplified block diagram
TOBY-R2 series modules internally consists of the RF, Baseband and Power Management sections
here described with more details than the simplified block diagrams of Figure 1.
RF section
The RF section is composed of RF transceiver, PAs, LNAs, crystal oscillator, filters, duplexers and RF
switches.
Tx signal is pre-amplified by RF transceiver, then output to the primary antenna input/output port
(ANT1) of the module via power amplifier (PA), SAW band pass filters band, specific duplexer and
antenna switch.
Dual receiving paths are implemented according to LTE Receiver Diversity radio technology supported
by the modules as LTE category 1 User Equipment: incoming signal is received through the primary
(ANT1) and the secondary (ANT2) antenna input ports which are connected to the RF transceiver via
specific antenna switch, diplexer, duplexer, LNA, SAW band pass filters.
RF transceiver performs modulation, up-conversion of the baseband I/Q signals for Tx,
down-conversion and demodulation of the dual RF signals for Rx. The RF transceiver contains:
oSingle chain high linearity receivers with integrated LNAs for multi band multi-mode operation,
oHighly linear RF demodulator / modulator capable GMSK, 8-PSK, QPSK, 16-QAM,
oRF synthesizer,
oVCO.
Power Amplifiers (PA) amplify the Tx signal modulated by the RF transceiver
RF switches connect primary (ANT1) and secondary (ANT2) antenna ports to the suitable Tx / Rx
path
SAW duplexers and band pass filters separate the Tx and Rx signal paths and provide RF filtering
26 MHz voltage-controlled temperature-controlled crystal oscillator generates the clock reference
in active-mode or connected-mode.

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Baseband and power management section
The Baseband and Power Management section is composed of the following main elements:
A mixed signal ASIC, which integrates
oMicroprocessor for control functions
oDSP core for cellular Layer 1 and digital processing of Rx and Tx signal paths
oMemory interface controller
oDedicated peripheral blocks for control of the USB, SIM and generic digital interfaces
oInterfaces to RF transceiver ASIC
Memory system, which includes NAND flash and LPDDR2 RAM
Voltage regulators to derive all the subsystem supply voltages from the module supply input VCC
Voltage sources for external use: V_BCKP and V_INT
Hardware power on
Hardware reset
Low power idle-mode support
32.768 kHz crystal oscillator to provide the clock reference in the low power idle-mode, which can
be set by enable power saving configuration using the AT+UPSV command.
1.3 Pin-out
Table 3 lists the pin-out of the TOBY-R2 series modules, with pins grouped by function.
Function
Pin Name
Pin No
I/O
Description
Remarks
Power
VCC
70,71,72
I
Module supply input
VCC supply circuit affects the RF performance and
compliance of the device integrating the module with
applicable required certification schemes.
See section 1.5.1 for functional description / requirements.
See section 2.2.1 for external circuit design-in.
GND
2, 30, 32,
44, 46, 69,
73, 74, 76,
78, 79, 80,
82, 83, 85,
86, 88-90,
92-152
N/A
Ground
GND pins are internally connected each other.
External ground connection affects the RF and thermal
performance of the device.
See section 1.5.1 for functional description.
See section 2.2.1 for external circuit design-in.
V_BCKP
3
I/O
RTC supply
input/output
V_BCKP = 1.8 V (typical) generated by internal regulator
when valid VCC supply is present.
See section 1.5.2 for functional description.
See section 2.2.2 for external circuit design-in.
V_INT
5
O
Generic digital
interfaces supply
output
V_INT = 1.8 V (typical) generated by internal DC/DC
regulator when the module is switched on.
Test-Point for diagnostic access is recommended.
See section 1.5.3 for functional description.
See section 2.2.3 for external circuit design-in.
System
PWR_ON
20
I
Power-on input
Internal 10 kpull-up resistor to V_BCKP.
See section 1.6.1 for functional description.
See section 2.3.1 for external circuit design-in.
RESET_N
23
I
External reset input
Internal 10 kpull-up resistor to V_BCKP.
Test-Point for diagnostic access is recommended.
See section 1.6.3 for functional description.
See section 2.3.2 for external circuit design-in.
HOST_SELECT0
26
I/O
Selection of module/
host configuration
Not supported.
See section 1.6.4 for functional description.
See section 2.3.3 for external circuit design-in.

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Function
Pin Name
Pin No
I/O
Description
Remarks
HOST_SELECT1
62
I/O
Selection of module/
host configuration
Not supported.
See section 1.6.4 for functional description.
See section 2.3.3 for external circuit design-in.
Antennas
ANT1
81
I/O
Primary antenna
Main Tx / Rx antenna interface.
50 nominal characteristic impedance.
Antenna circuit affects RF performance and end-device
compliance with required certification schemes.
See section 1.7 for functional description / requirements.
See section 2.4 for external circuit design-in.
ANT2
87
I
Secondary antenna
Rx only for Rx diversity.
50 nominal characteristic impedance.
Antenna circuit affects RF performance and end-device
compliance with required certification schemes.
See section 1.7 for functional description / requirements
See section 2.4 for external circuit design-in.
ANT_DET
75
I
Antenna detection
ADC for antenna presence detection function
See section 1.7.2 for functional description.
See section 2.4.2 for external circuit design-in.
SIM
VSIM
59
O
SIM supply output
VSIM = 1.8 V / 3 V output as per connected SIM type.
See section 1.8 for functional description.
See section 2.5 for external circuit design-in.
SIM_IO
57
I/O
SIM data
Data input/output for 1.8 V / 3 V SIM
Internal 4.7 kpull-up to VSIM.
See section 1.8 for functional description.
See section 2.5 for external circuit design-in.
SIM_CLK
56
O
SIM clock
3.25 MHz clock output for 1.8 V / 3 V SIM
See section 1.8 for functional description.
See section 2.5 for external circuit design-in.
SIM_RST
58
O
SIM reset
Reset output for 1.8 V / 3 V SIM
See section 1.8 for functional description.
See section 2.5 for external circuit design-in.
UART
RXD
17
O
UART data output
1.8 V output, Circuit 104 (RXD) in ITU-T V.24,
for AT commands, data communication, FOAT, FW
update by u-blox EasyFlash tool and diagnostic.
Test-Point and series 0 for diagnostic recommended.
See section 1.9.1 for functional description.
See section 2.6.1 for external circuit design-in.
TXD
16
I
UART data input
1.8 V input, Circuit 103 (TXD) in ITU-T V.24,
for AT commands, data communication, FOAT, FW
update by u-blox EasyFlash tool and diagnostic.
Internal active pull-up to V_INT.
Test-Point and series 0 for diagnostic recommended.
See section 1.9.1 for functional description.
See section 2.6.1 for external circuit design-in.
CTS
15
O
UART clear to send
output
1.8 V output, Circuit 106 (CTS) in ITU-T V.24.
See section 1.9.1 for functional description.
See section 2.6.1 for external circuit design-in.
RTS
14
I
UART ready to send
input
1.8 V input, Circuit 105 (RTS) in ITU-T V.24.
Internal active pull-up to V_INT.
See section 1.9.1 for functional description.
See section 2.6.1 for external circuit design-in.
DSR
10
O
UART data set ready
output
1.8 V, Circuit 107 in ITU-T V.24.
See section 1.9.1 for functional description.
See section 2.6.1 for external circuit design-in.

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Function
Pin Name
Pin No
I/O
Description
Remarks
RI
11
O
UART ring indicator
output
1.8 V, Circuit 125 in ITU-T V.24.
See section 1.9.1 for functional description.
See section 2.6.1 for external circuit design-in.
DTR
13
I
UART data terminal
ready input
1.8 V, Circuit 108/2 in ITU-T V.24.
Internal active pull-up to V_INT.
Test-Point and series 0 for diagnostic recommended.
See section 1.9.1 for functional description.
See section 2.6.1 for external circuit design-in.
DCD
12
O
UART data carrier
detect output
1.8 V, Circuit 109 in ITU-T V.24.
Test-Point and series 0 for diagnostic recommended.
See section 1.9.1 for functional description.
See section 2.6.1 for external circuit design-in.
USB
VUSB_DET
4
I
USB detect input
VBUS (5 V typical) USB supply generated by the host must
be connected to this input pin to enable the USB interface.
If the USB interface is not used by the Host Processor,
Test-Point for diagnostic / FW update is recommended
See section 1.9.2 for functional description.
See section 2.6.2 for external circuit design-in.
USB_D-
27
I/O
USB Data Line D-
USB interface for AT commands, data communication,
FOAT, FW update by u-blox EasyFlash tool and diagnostic.
90 nominal differential impedance (Z0)
30 nominal common mode impedance (ZCM)
Pull-up or pull-down resistors and external series resistors
as required by the USB 2.0 specifications [6] are part of
the USB pin driver and need not be provided externally.
If the USB interface is not used by the Host Processor,
Test-Point for diagnostic / FW update is recommended.
See section 1.9.2 for functional description.
See section 2.6.2 for external circuit design-in.
USB_D+
28
I/O
USB Data Line D+
USB interface for AT commands, data communication,
FOAT, FW update by u-blox EasyFlash tool and diagnostic.
90 nominal differential impedance (Z0)
30 nominal common mode impedance (ZCM)
Pull-up or pull-down resistors and external series resistors
as required by the USB 2.0 specifications [6] are part of
the USB pin driver and need not be provided externally.
If the USB interface is not used by the Host Processor,
Test-Point for diagnostic / FW update is recommended.
See section 1.9.2 for functional description.
See section 2.6.2 for external circuit design-in.
DDC
SCL
54
O
I2C bus clock line
1.8 V open drain, for communication with I2C-slave devices
No internal pull-up.
See section 1.9.3 for functional description.
See section 2.6.3 for external circuit design-in.
SDA
55
I/O
I2C bus data line
1.8 V open drain, for communication with I2C-slave devices
No internal pull-up.
See section 1.9.3 for functional description.
See section 2.6.3 for external circuit design-in.
SDIO
SDIO_D0
66
I/O
SDIO serial data [0]
Not supported by “02” / "42" / "82" product versions.
See section 1.9.4 for functional description.
See section 2.6.4 for external circuit design-in.
SDIO_D1
68
I/O
SDIO serial data [1]
Not supported by “02” / "42" / "82" product versions.
See section 1.9.4 for functional description.
See section 2.6.4 for external circuit design-in.
SDIO_D2
63
I/O
SDIO serial data [2]
Not supported by “02” / "42" / "82" product versions.
See section 1.9.4 for functional description.
See section 2.6.4 for external circuit design-in.

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Function
Pin Name
Pin No
I/O
Description
Remarks
SDIO_D3
67
I/O
SDIO serial data [3]
Not supported by “02” / "42" / "82" product versions.
See section 1.9.4 for functional description.
See section 2.6.4 for external circuit design-in.
SDIO_CLK
64
O
SDIO serial clock
Not supported by “02” / "42" / "82" product versions.
See section 1.9.4 for functional description.
See section 2.6.4 for external circuit design-in.
SDIO_CMD
65
I/O
SDIO command
Not supported by “02” / "42" / "82" product versions.
See section 1.9.4 for functional description.
See section 2.6.4 for external circuit design-in.
Audio
I2S_TXD
51
O /
I/O
I2S transmit data /
GPIO
I2S transmit data output, alternatively settable as GPIO.
I2S interface not supported by "42" / "82" product versions.
See sections 1.10 and 1.12 for functional description.
See sections 2.7 and 2.8 for external circuit design-in.
I2S_RXD
53
I /
I/O
I2S receive data /
GPIO
I2S receive data input, alternatively configurable as GPIO.
I2S interface not supported by "42" / "82" product versions.
See sections 1.10 and 1.12 for functional description.
See sections 2.7 and 2.8 for external circuit design-in.
I2S_CLK
52
I/O /
I/O
I2S clock /
GPIO
I2S serial clock, alternatively configurable as GPIO.
I2S interface not supported by "42" / "82" product versions.
See sections 1.10 and 1.12 for functional description.
See sections 2.7 and 2.8 for external circuit design-in.
I2S_WA
50
I/O /
I/O
I2S word alignment /
GPIO
I2S word alignment, alternatively configurable as GPIO.
I2S interface not supported by "42" / "82" product versions.
See sections 1.10 and 1.12 for functional description.
See sections 2.7 and 2.8 for external circuit design-in.
Clock
output
GPIO6
61
O
Clock output
1.8 V configurable clock output.
See section 1.11 for functional description.
See section 2.7 for external circuit design-in.
GPIO
GPIO1
21
I/O
GPIO
1.8 V GPIO with alternatively configurable functions.
See section 1.12 for functional description.
See section 2.8 for external circuit design-in.
GPIO2
22
I/O
GPIO
1.8 V GPIO with alternatively configurable functions.
See section 1.12 for functional description.
See section 2.8 for external circuit design-in.
GPIO3
24
I/O
GPIO
1.8 V GPIO with alternatively configurable functions.
See section 1.12 for functional description.
See section 2.8 for external circuit design-in.
GPIO4
25
I/O
GPIO
1.8 V GPIO with alternatively configurable functions.
See section 1.12 for functional description.
See section 2.8 for external circuit design-in.
GPIO5
60
I/O
GPIO
1.8 V GPIO with alternatively configurable functions.
See section 1.12 for functional description.
See section 2.8 for external circuit design-in.
Reserved
RSVD
6
N/A
Reserved pin
This pin must be connected to ground.
See sections 1.13 and 2.9
RSVD
18, 19
N/A
Reserved pin
Test-Point for diagnostic access is recommended.
See sections 1.13 and 2.9
RSVD
1, 7-9, 29,
31, 33-43,
45, 47-49,
77, 84, 91
N/A
Reserved pin
Leave unconnected.
See sections 1.13 and 2.9
Table 3: TOBY-R2 series module pin definition, grouped by function

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1.4 Operating modes
TOBY-R2 series modules have several operating modes. The operating modes are defined in Table 4
and described in detail in Table 5, providing general guidelines for operation.
General Status
Operating Mode
Definition
Power-down
Not-powered Mode
VCC supply not present or below operating range: module is switched off.
Power-off Mode
VCC supply within operating range and module is switched off.
Normal operation
Idle mode
Module processor core runs with 32 kHz reference generated by the internal oscillator.
Active mode
Module processor core runs with 26 MHz reference generated by the internal oscillator.
Connected mode
RF Tx/Rx data connection enabled and processor core runs with 26 MHz reference.
Table 4: TOBY-R2 series modules operating modes definition
Mode
Description
Transition between operating modes
Not-Powered
Module is switched off.
Application interfaces are not
accessible.
When VCC supply is removed, the modules enter not-powered mode.
When in not-powered mode, the modules cannot be switched on by
PWR_ON, RESET_N or RTC alarm
When in not-powered mode, the modules can be switched on by
applying VCC supply (see 1.6.1) so that the modules switch from
not-powered to active-mode
Power-Off
Module is switched off: normal
shutdown by an appropriate power-off
event (see 1.6.2).
Application interfaces are not
accessible.
When the modules are switched off by an appropriate switch-off
event (see 1.6.2), the modules enter power-off mode from
active-mode.
When in power-off mode, the modules can be switched on by
PWR_ON, RESET_N or an RTC alarm.
When in power-off mode, the modules enter not-powered mode by
removing VCC supply.
Idle
Module is switched on with application
interfaces temporarily disabled or
suspended: the module is temporarily
not ready to communicate with an
external device by means of the
application interfaces as configured to
reduce the current consumption.
The module enters the low power idle-
mode whenever possible if power saving
is enabled by AT+UPSV (see u-blox AT
commands manual [2]) reducing current
consumption (see 1.5.1.5).
The CTS output line indicates when the
UART interface is disabled/enabled due
to the module idle/active-mode
according to power saving and HW flow
control settings (see 1.9.1.3, 1.9.1.4).
Power saving configuration is not
enabled by default: it can be enabled by
AT+UPSV (see the u-blox AT commands
manual [2]).
The modules automatically switch from the active-mode to low power
idle-mode whenever possible if power saving is enabled (see sections
1.5.1.5, 1.9.1.4, 1.9.2.4 and u-blox AT commands manual [2], AT+UPSV
command).
The modules wake up from low power idle-mode to active-mode in the
following events:
Automatic periodic monitoring of the paging channel for the
paging block reception according to network conditions (see
1.5.1.5, 1.9.1.4)
Automatic periodic enable of the UART interface to receive / send
data, with AT+UPSV=1 (see 1.9.1.4)
Data received over UART, according to HW flow control (AT&K)
and power saving (AT+UPSV) settings (see 1.9.1.4)
RTS input set ON by the host DTE, with HW flow control disabled
and AT+UPSV=2 (see 1.9.1.4)
DTR input set ON by the host DTE, with AT+UPSV=3 (see 1.9.1.4)
USB detection, applying 5 V (typ.) to VUSB_DET input (see 1.9.2)
The connected USB host forces a remote wakeup of the module as
USB device (see 1.9.2.4)
The connected u-blox GNSS device forces a wakeup of the module
using the GNSS Tx data ready function over GPIO3 (see 1.9.3)
The connected SDIO device forces a wakeup of the module as
SDIO host (see 1.9.4)
A preset RTC alarm occurs (see u-blox AT commands manual [2],
AT+CALA)

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Mode
Description
Transition between operating modes
Active
Module is switched on with application
interfaces enabled or not suspended:
the module is ready to communicate
with an external device by means of the
application interfaces unless power
saving configuration is enabled by
AT+UPSV (see 1.9.1.4, 1.9.2.4 and u-blox
AT commands manual [2]).
When the modules are switched on by an appropriate power-on event
(see 1.6.1), the module enter active-mode from not-powered or
power-off mode.
If power saving configuration is enabled by the AT+UPSV command,
the module automatically switches from active to idle-mode
whenever possible and the module wakes up from idle to active-mode
in the events listed above (see idle-mode to active-mode transition
description above).
When a RF Tx/Rx data or voice connection is initiated or when RF
Tx/Rx is required due to a connection previously initiated, the module
switches from active to connected-mode.
Connected
RF Tx/Rx data connection is in progress.
The module is prepared to accept data
signals from an external device unless
power saving configuration is enabled by
AT+UPSV (see sections 1.9.1.4, 1.9.2.4
and u-blox AT commands manual [2]).
When a data or voice connection is initiated, the module enters
connected-mode from active-mode.
Connected-mode is suspended if Tx/Rx data is not in progress, due to
connected discontinuous reception and fast dormancy capabilities of
the module and according to network environment settings and
scenario. In such case, the module automatically switches from
connected to active mode and then, if power saving configuration is
enabled by the AT+UPSV command, the module automatically
switches to idle-mode whenever possible. Vice-versa, the module
wakes up from idle to active mode and then connected mode if RF
Tx/Rx is necessary.
When a data connection is terminated, the module returns to the
active-mode.
Table 5: TOBY-R2 series modules operating modes description
Figure 2 describes the transition between the different operating modes.
Switch ON:
•Apply VCC
If power saving is enabled
and there is no activity for
a defined time interval
Any wake up event described
in the module operating
modes summary table above
Incoming/outgoing call
or other dedicated device
network communication
No RF Tx/Rx in progress, Call
terminated, Communication
dropped
Remove VCC
Switch ON:
•PWR_ON
•RTC alarm
•RESET_N
Not
powered
Power off
ActiveConnected Idle
Switch OFF:
•AT+CPWROFF
•PWR_ON
Figure 2: TOBY-R2 series modules operating modes transitions

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1.5 Supply interfaces
1.5.1 Module supply input (VCC)
The modules must be supplied via the three VCC pins that represent the module power supply input.
The VCC pins are internally connected to the RF power amplifier and to the integrated Power
Management Unit: all supply voltages needed by the module are generated from the VCC supply by
integrated voltage regulators, including V_BCKP Real Time Clock supply, V_INT digital interfaces
supply and VSIM SIM card supply.
During operation, the current drawn by the TOBY-R2 series modules through the VCC pins can vary
by several orders of magnitude. This ranges from the pulse of current consumption during GSM
transmitting bursts at maximum power level in connected-mode (as described in section 1.5.1.2) to
the low current consumption during low power idle-mode with power saving enabled (as described in
section 1.5.1.5).
TOBY-R200 modules provide separate supply inputs over the three VCC pins:
VCC pins #71 and #72 represent the supply input for the internal RF power amplifier, demanding
most of the total current drawn of the module when RF transmission is enabled during a
voice/data call
VCC pin #70 represents the supply input for the internal baseband Power Management Unit and
the internal transceiver, demanding minor part of the total current drawn of the module when RF
transmission is enabled during a voice/data call
Figure 3 provides a simplified block diagram of TOBY-R2 series modules internal VCC supply routing.
72
VCC
71
VCC
70
VCC
TOBY-R202
Power
Management
Unit
Memory
Baseband
Processor
Transceiver
RF PMU
LTE/3G PAs
72
VCC
71
VCC
70
VCC
TOBY-R200
Power
Management
Unit
Memory
Baseband
Processor
Transceiver
RF PMU
LTE/3G/2G PAs
Figure 3: TOBY-R2 series modules internal VCC supply routing simplified block diagram

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1.5.1.1 VCC supply requirements
Table 6 summarizes the requirements for the VCC modules supply. See section 2.2.1 for suggestions
to properly design a VCC supply circuit compliant with the requirements listed in Table 6.
⚠The VCC supply circuit affects the RF compliance of the device integrating TOBY-R2 series
modules with applicable required certification schemes as well as antenna circuit design.
Compliance is met by fulfilling the requirements for the VCC supply summarized in Table 6.
Item
Requirement
Remark
VCC nominal voltage
Within VCC normal operating range:
3.30 V min. / 4.40 V max
RF performance is guaranteed when VCC PA voltage is
inside the normal operating range limits.
RF performance may be affected when VCC PA voltage is
outside the normal operating range limits, though the
module is still fully functional until the VCC voltage is
inside the extended operating range limits.
VCC voltage during
normal operation
Within VCC extended operating range:
3.00 V min. / 4.50 V max
VCC voltage must be above the extended operating range
minimum limit to switch-on the module.
The module may switch-off when the VCC voltage drops
below the extended operating range minimum limit.
Operation above VCC extended operating range is not
recommended and may affect device reliability.
VCC average current
Support with adequate margin the highest
averaged VCC current consumption value
in connected-mode conditions specified in
TOBY-R2 data sheet [1].
The maximum average current consumption can be
greater than the specified value according to the actual
antenna mismatching, temperature and supply voltage.
Sections 1.5.1.2, 1.5.1.3 and 1.5.1.4 describe current
consumption profiles in 2G, 3G and LTE connected-mode.
VCC peak current
Support with margin the highest peak
VCC current consumption value in
connected-mode conditions specified in
TOBY-R2 data sheet [1]
The specified maximum peak of current consumption
occurs during GSM single transmit slot in 850/900 MHz
connected-mode, in case of mismatched antenna.
Section 1.5.1.2 describes 2G Tx peak/pulse current.
VCC voltage drop
during 2G Tx slots
Lower than 400 mV
Supply voltage drop values greater than recommended
during 2G TDMA transmission slots directly affect the RF
compliance with applicable certification schemes.
Figure 5 describes supply voltage drop during 2G Tx slots.
VCC voltage ripple
during 2G/3G/LTE Tx
Noise in the supply has to be minimized
High supply voltage ripple values during LTE/3G/2G RF
transmissions in connected-mode directly affect the RF
compliance with applicable certification schemes.
Figure 5 describes supply voltage ripple during RF Tx.
VCC under/over-shoot
at start/end of Tx slots
Absent or at least minimized
Supply voltage under-shoot or over-shoot at the start or
the end of 2G TDMA transmission slots directly affect the
RF compliance with applicable certification schemes.
Figure 5 describes supply voltage under/over-shoot
Table 6: Summary of VCC modules supply requirements

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1.5.1.2 VCC current consumption in 2G connected-mode
When a GSM call is established, the VCC module current consumption is determined by the current
consumption profile typical of the GSM transmitting and receiving bursts.
The peak of current consumption during a transmission slot is strictly dependent on the RF
transmitted power, which is regulated by the network (the current base station). The transmitted
power in the transmit slot is also the more relevant factor for determining the average current
consumption.
If the module is transmitting in 2G single-slot mode in the 850 or 900 MHz bands, at the maximum
RF power level (approximately 2 W or 33 dBm in the allocated transmit slot/burst) the current
consumption can reach an high peak (see the “Current consumption” section in the TOBY-R2 series
data sheet [1]) for 576.9 µs (width of the transmit slot/burst) with a periodicity of 4.615 ms (width of
1 frame = 8 slots/burst), so with a 1/8 duty cycle according to GSM TDMA (Time Division Multiple
Access).
If the module is transmitting in 2G single-slot mode in the 1800 or 1900 MHz bands, the current
consumption figures are quite less high than the one in the low bands, due to 3GPP transmitter output
power specifications.
During a GSM call, current consumption is not so significantly high in receiving or in monitor bursts
and is low in the inactive unused bursts.
Figure 4 shows an example of the module current consumption profile versus time in 2G single-slot
mode.
Time [ms]
RX
slot
unused
slot
unused
slot
TX
slot
unused
slot
unused
slot
MON
slot
unused
slot
RX
slot
unused
slot
unused
slot
TX
slot
unused
slot
unused
slot
MON
slot
unused
slot
GSM frame
4.615 ms
(1 frame = 8 slots)
Current [A]
200 mA
60-120 mA
1900 mA
Peak current depends
on TX power and
actual antenna load
GSM frame
4.615 ms
(1 frame = 8 slots)
60-120 mA 10-40 mA
0.0
1.5
1.0
0.5
2.0
Figure 4: VCC current consumption profile versus time during a 2G single-slot call (1 TX slot, 1 RX slot)
Figure 5 illustrates VCC voltage profile versus time during a 2G single-slot call, according to the
relative VCC current consumption profile described in Figure 4.
Time [ms]
undershoot
overshoot
ripple
drop
Voltage [mV]
3.8 V
(typ)
RX
slot
unused
slot
unused
slot
TX
slot
unused
slot
unused
slot
MON
slot
unused
slot
RX
slot
unused
slot
unused
slot
TX
slot
unused
slot
unused
slot
MON
slot
unused
slot
GSM frame
4.615 ms
(1 frame = 8 slots)
GSM frame
4.615 ms
(1 frame = 8 slots)
Figure 5: VCC voltage profile versus time during a 2G single-slot call (1 TX slot, 1 RX slot)

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When a GPRS connection is established, more than one slot can be used to transmit and/or more than
one slot can be used to receive. The transmitted power depends on network conditions, which set the
peak current consumption, but following the 3GPP specifications the maximum Tx RF power is
reduced if more than one slot is used to transmit, so the maximum peak of current is not as high as
can be in case of a 2G single-slot call.
The multi-slot transmission power can be further reduced by configuring the actual Multi-Slot Power
Reduction profile with the dedicated AT command, AT+UDCONF=40 (see the u-blox AT commands
manual [2]).
If the module transmits in GPRS class 12 in the 850 or 900 MHz bands, at the maximum RF power
control level, the current consumption can reach a quite high peak but lower than the one achievable
in 2G single-slot mode. This happens for 2.307 ms (width of the 4 transmit slots/bursts) with a
periodicity of 4.615 ms (width of 1 frame = 8 slots/bursts), so with a 1/2 duty cycle, according to 2G
TDMA.
If the module is in GPRS connected mode in the 1800 or 1900 MHz bands, the current consumption
figures are quite less high than the one in the low bands, due to 3GPP transmitter output power
specifications.
Figure 6 reports the current consumption profiles in GPRS class 12 connected mode, in the 850 or 900
MHz bands, with 4 slots used to transmit and 1 slot used to receive.
Time [ms]
RX
slot
unused
slot
TX
slot
TX
slot
TX
slot
TX
slot
MON
slot
unused
slot
RX
slot
unused
slot
TX
slot
TX
slot
TX
slot
TX
slot
MON
slot
unused
slot
GSM frame
4.615 ms
(1 frame = 8 slots)
Current [A]
200mA
60-130mA
Peak current depends
on TX power and
actual antenna load
GSM frame
4.615 ms
(1 frame = 8 slots)
1600 mA
0.0
1.5
1.0
0.5
2.0
Figure 6: VCC current consumption profile during a 2G GPRS/EDGE multi-slot connection (4 TX slots, 1 RX slot)
In case of EDGE connections the VCC current consumption profile is very similar to the GPRS current
profile, so the image shown in Figure 6, representing the current consumption profile in GPRS class
12 connected mode, is valid for the EDGE class 12 connected mode as well.

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1.5.1.3 VCC current consumption in 3G connected mode
During a 3G connection, the module can transmit and receive continuously due to the Frequency
Division Duplex (FDD) mode of operation with the Wideband Code Division Multiple Access (WCDMA).
The current consumption depends on output RF power, which is always regulated by the network (the
current base station) sending power control commands to the module. These power control
commands are logically divided into a slot of 666 µs, thus the rate of power change can reach a
maximum rate of 1.5 kHz.
There are no high current peaks as in the 2G connection, since transmission and reception are
continuously enabled due to FDD WCDMA implemented in the 3G that differs from the TDMA
implemented in the 2G case.
In the worst scenario, corresponding to a continuous transmission and reception at maximum output
power (approximately 250 mW or 24 dBm), the average current drawn by the module at the VCC pins
is considerable (see the “Current consumption” section in TOBY-R2 series data sheet [1]). At the
lowest output RF power (approximately 0.01 µW or –50 dBm), the current drawn by the internal power
amplifier is strongly reduced. The total current drawn by the module at the VCC pins is due to
baseband processing and transceiver activity.
Figure 7 shows an example of current consumption profile of the module in 3G WCDMA/ HSPA
continuous transmission mode.
Time
[ms]
3G frame
10 ms
(1 frame = 15 slots)
Current [mA]
Current consumption value
depends on TX power and
actual antenna load
170
mA
1 slot
666 µs
850
mA
0
300
200
100
500
400
600
700
Figure 7: VCC current consumption profile versus time during a 3G connection (TX and RX continuously enabled)