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1Therms and abbrevations ..................................................................................................... 3
2Hardware deskription............................................................................................................. 3
2.1 Operation Voltage capability: ......................................................................................... 3
2.2 TFT Display:................................................................................................................... 3
2.3 Front foil: ........................................................................................................................ 3
2.4 Buzzer: ........................................................................................................................... 3
2.5 RTC:............................................................................................................................... 3
3User Interface ......................................................................................................................... 4
3.1 Hardkey Button behaviour ............................................................................................. 4
3.2 Start Menu...................................................................................................................... 5
3.3 Settings .......................................................................................................................... 6
3.3.1 System Settings................................................................................................... 7
3.3.2 Back Arrow .......................................................................................................... 7
3.3.3 Update USB ......................................................................................................... 7
3.3.4 Touch calibration ................................................................................................. 8
3.3.5 Delete IOP Objectpool ......................................................................................... 9
3.3.6 IOP Objectpool Download ................................................................................... 9
4Electrical connectivity ......................................................................................................... 11
4.1 Main Connector............................................................................................................ 11
4.2 EMC ............................................................................................................................. 12
4.2.1 EN ISO 14982:2009........................................................................................... 12
4.3 ESD.............................................................................................................................. 12
4.3.1 EN ISO 10605.................................................................................................... 12
