Quectel EC25-AUX Supplement

Module : EC25-AUX
EC25 Hardware Design
LTE Standard Module Series
Rev. EC25_Hardware_Design_V2.2
Date: 2019-08-19
Status: Released
www.quectel.com

LTE Standard Module Series
EC25 Hardware Design
EC25_Hardware_Design 1 / 130
Our aim is to provide customers with timely and comprehensive service. For any
assistance, please contact our company headquarters:
Quectel Wireless Solutions Co., Ltd.
Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District,
Shanghai, China 200233
Tel: [phone]
Email: [email protected]
Or our local office. For more information, please visit:
http://www.quectel.com/support/sales.htm
For technical support, or to report documentation errors, please visit:
http://www.quectel.com/support/technical.htm
Or email to: [email protected]
GENERAL NOTES
QUECTEL OFFERS THE INFORMATION AS A SERVICE TO ITS CUSTOMERS. THE INFORMATION
PROVIDED IS BASED UPON CUSTOMERS’ REQUIREMENTS. QUECTEL MAKES EVERY EFFORT
TO ENSURE THE QUALITY OF THE INFORMATION IT MAKES AVAILABLE. QUECTEL DOES NOT
MAKE ANY WARRANTY AS TO THE INFORMATION CONTAINED HEREIN, AND DOES NOT ACCEPT
ANY LIABILITY FOR ANY INJURY, LOSS OR DAMAGE OF ANY KIND INCURRED BY USE OF OR
RELIANCE UPON THE INFORMATION. ALL INFORMATION SUPPLIED HEREIN IS SUBJECT TO
CHANGE WITHOUT PRIOR NOTICE.
COPYRIGHT
THE INFORMATION CONTAINED HERE IS PROPRIETARY TECHNICAL INFORMATION OF
QUECTEL WIRELESS SOLUTIONS CO., LTD. TRANSMITTING, REPRODUCTION, DISSEMINATION
AND EDITING OF THIS DOCUMENT AS WELL AS UTILIZATION OF THE CONTENT ARE
FORBIDDEN WITHOUT PERMISSION. OFFENDERS WILL BE HELD LIABLE FOR PAYMENT OF
DAMAGES. ALL RIGHTS ARE RESERVED IN THE EVENT OF A PATENT GRANT OR
REGISTRATION OF A UTILITY MODEL OR DESIGN.
Copyright © Quectel Wireless Solutions Co., Ltd. 2019. All rights reserved.

LTE Standard Module Series
EC25 Hardware Design
EC25_Hardware_Design 2 / 130
About the Document
History
Revision Date Author Description
1.0 2016-04-01 Woody WU Initial
1.1 2016-09-22
Lyndon LIU/
Frank WANG
1. Updated EC25 series frequency bands in Table 1.
2. Updated transmitting power, supported maximum
baud rate of main UART/internal protocols/USB
drivers of USB interface, firmware upgrade and
temperature range in Table 2.
3. Updated timing of turning on module in Figure 12.
4. Updated timing of turning off module in Figure 13.
5. Updated timing of resetting module in Figure 16.
6. Updated supported baud rates of main UART in
Chapter 3.11.
7. Added notes for ADC interface in Chapter 3.13.
8. Updated GNSS performance in Table 21.
9. Updated operating frequencies of module in Table 23.
10. Added current consumption in Chapter 6.4.
11. Updated RF output power in Chapter 6.5.
12. Added RF receiving sensitivity in Chapter 6.6.
1.2 2016-11-04
Lyndon LIU/
Michael ZHANG
1. Added SGMII and WLAN interfaces in Table 2.
2. Updated function diagram in Figure 1.
3. Updated pin assignment (Top View) in Figure 2.
4. Added description of SGMII and WLAN interfaces in
Table 4.
5. Added SGMII interface in Chapter 3.17.
6. Added WLAN interface in Chapter 3.18.
7. Added USB_BOOT interface in Chapter 3.19.
8. Added reference design of RF layout in Chapter 5.1.4.
9. Added note about SIMO in Chapter 6.6.
1.3 2017-01-24
Lyndon LIU/
Frank WANG
1. Updated function diagram in Figure 1.
2. Updated pin assignment (top view) in Figure 2.

LTE Standard Module Series
EC25 Hardware Design
EC25_Hardware_Design 3 / 130
3. Added BT interface in Chapter 3.18.2.
4. Updated GNSS performance in Table 24.
5. Updated reference circuit of wireless connectivity
interfaces with FC20 module in Figure 29.
6. Updated current consumption of EC25-E module in
Table 33.
7. Updated EC25-A conducted RF receiving sensitivity
in Table 38.
8. Added EC25-J conducted RF receiving sensitivity in
Table 40.
1.4 2018-03-05
AnniceZHANG/
Lyndon LIU/
Frank WANG
1. Updated functional diagram in Figure 1.
2. Updated LTE, UMTS and GSM features in Table 2.
3. Updated description of pin 40/136/137/138.
4. Updated PWRKEY pulled down time to 500ms in
Chapter 3.7.1 and reference circuit in Figure 10.
5. Updated reference circuit of (U)SIM interface in
Figure 17&18.
6. Updated reference circuit of USB interface in Figure
19.
7. Updated PCM mode in Chapter 3.12.
8. Added SD card interface in Chapter 3.13.
9. Updated USB_BOOT reference circuit in Chapter
3.20.
10. Updated module operating frequencies in Table 26.
11. Updated antenna requirements in Table 30.
12. Updated EC25 series module current consumption in
Chapter 6.4.
13. Updated EC25 series module conducted RF receiving
sensitivity in Chapter 6.6.
14. Added thermal consideration description in Chapter
6.8.
15. Added dimension tolerance information in Chapter 7.
16. Added storage temperature range in Table 2 and
Chapter 6.3.
17. Updated RF output power in Table 41.
18. Updated GPRS multi-slot classes in Table 53.
19. Updated storage information in Chapter 8.1.
1.5 2018-04-20 Kinsey ZHANG
1. Added information of EC25-AF in Table 1.
2. Updated module operating frequencies in Table 27.
3. Added current consumption of EC25-AF module in
Table 40.
4. Changed GNSS current consumption of EC25 series
module into Table 41.
5. Added EC25-AF conducted RF receiving sensitivity in

LTE Standard Module Series
EC25 Hardware Design
EC25_Hardware_Design 4 / 130
Table 50.
2.0 2019-04-30
Nathan LIU/
Frank WANG/
Ward WANG/
Ethan SHAN
1. Added new variants EC25-EU/-EC/-EUX/-MX and
related information.
2. Updated functional diagram in Figure 1.
3. Updated star structure of the power supply in Figure 8.
4. Updated power-on scenario of module in Figure 12.
5. Updated reference circuit with translator chip in Figure
20.
6. Added timing sequence for entering into emergency
download mode of USB_BOOT interface in Figure 32.
7. Updated general description in Table 1.
8. Updated module operating frequencies in Table 27.
9. Updated GNSS frequency in Table 29.
10. Updated antenna requirements in Table 30.
11. Updated EC25-V current consumption in Table 36.
12. Added EC25-EU current consumption in Table 41
13. Added EC25-EC current consumption in Table 42.
14. Added EC25-EUX current consumption in Table 43.
15. Added EC25-MX current consumption in Table 44.
16. Updated EC25-E conducted RF receiving sensitivity in
Table 47.
17. Updated EC25-A conducted RF receiving sensitivity in
Table 48.
18. Updated EC25-V conducted RF receiving sensitivity in
Table 49.
19. Updated EC25-AUT conducted RF receiving
sensitivity in Table 52.
20. Updated EC25-AUTL conducted RF receiving
sensitivity in Table 53.
21. Added EC25-EU conducted RF receiving sensitivity in
Table 55.
22. Added EC25-EC conducted RF receiving sensitivity in
Table 56.
23. Added EC25-EUX conducted RF receiving sensitivity
in Table 57.
24. Added EC25-MX conducted RF receiving sensitivity in
Table 58.
25. Updated recommended stencil thickness as
0.18mm~0.20mm and reflow soldering thermal profile
in Chapter 8.2.
2.1 2019-07-05
Fanny CHEN/
Ethan SHAN
1. Added new variants EC25-AFX/-AUX and related
information.
2. Added notes for interfaces not supported by ThreadX

LTE Standard Module Series
EC25 Hardware Design
EC25_Hardware_Design 5 / 130
modules.
3. Updated supported protocols and USB serial drivers in
Table 2.
4. Updated reference circuit of wireless connectivity
interfaces with FC20 module in Figure 26.
5. Added EC25-AFX current consumption in Table 41.
6. Added EC25-AFX conducted RF receiving sensitivity
in Table 56.
7. Updated mechanical dimensions of the module in
Figure 45.
8. Added tape and reel directions in Figure 51.
2.2 2019-08-19
Ward WANG/
Owen WEI/
Frank WANG
1. Updated EC25-J current consumption in Table 37.
2. Deleted the LTE-TDD bands information of EC25-AUT
current consumption in Table 39.
3. Updated EC25-EC current consumption in Table 43.
4. Updated EC25-EUX current consumption in Table 44.
5. Added EC25-AUX current consumption in Table 46.
6. Updated EC25-AU conducted RF receiving sensitivity
in Table 53.
7. Updated EC25-EU conducted RF receiving sensitivity
in Table 58.
8. Added EC25-AUX conducted RF receiving sensitivity
in Tbale 62.

LTE Standard Module Series
EC25 Hardware Design
EC25_Hardware_Design 6 / 130
Contents
About the Document................................................................................................................................ 2
Contents.................................................................................................................................................... 6
Table Index ............................................................................................................................................... 9
Figure Index............................................................................................................................................ 11
1Introduction..................................................................................................................................... 13
1.1.Safety Information................................................................................................................. 14
2Product Concept ............................................................................................................................. 16
2.1.General Description .............................................................................................................. 16
2.2.Key Features......................................................................................................................... 17
2.3.Functional Diagram ............................................................................................................... 20
2.4.Evaluation Board................................................................................................................... 21
3Application Interfaces..................................................................................................................... 22
3.1.General Description .............................................................................................................. 22
3.2.Pin Assignment ..................................................................................................................... 23
3.3.Pin Description...................................................................................................................... 24
3.4.Operating Modes .................................................................................................................. 36
3.5.Power Saving........................................................................................................................ 36
3.5.1.Sleep Mode.................................................................................................................. 36
3.5.1.1.UART Application .............................................................................................. 37
3.5.1.2.USB Application with USB Remote Wakeup Function....................................... 37
3.5.1.3.USB Application with USB Suspend/Resume and RI Function.......................... 38
3.5.1.4.USB Application without USB Suspend Function .............................................. 39
3.5.2.Airplane Mode.............................................................................................................. 39
3.6.Power Supply........................................................................................................................ 40
3.6.1.Power Supply Pins....................................................................................................... 40
3.6.2.Decrease Voltage Drop ............................................................................................... 41
3.6.3.Reference Design for Power Supply............................................................................ 42
3.6.4.Monitor the Power Supply............................................................................................ 42
3.7.Power-on/off Scenarios......................................................................................................... 43
3.7.1.Turn on Module Using the PWRKEY ........................................................................... 43
3.7.2.Turn off Module............................................................................................................ 45
3.7.2.1.Turn off Module Using the PWRKEY Pin........................................................... 45
3.7.2.2.Turn off Module Using AT Command ................................................................ 45
3.8.Reset Module........................................................................................................................ 46
3.9.(U)SIM Interface.................................................................................................................... 47
3.10.USB Interface........................................................................................................................ 50
3.11.UART Interfaces ................................................................................................................... 51
3.12.PCM and I2C Interfaces........................................................................................................ 54

LTE Standard Module Series
EC25 Hardware Design
EC25_Hardware_Design 7 / 130
3.13.SD Card Interface ................................................................................................................. 56
3.14.Wireless Connectivity Interfaces ........................................................................................... 58
3.14.1.WLAN Interface ........................................................................................................... 61
3.14.2.BT Interface*................................................................................................................ 61
3.15.ADC Interfaces...................................................................................................................... 61
3.16.SGMII Interface..................................................................................................................... 62
3.17.Network Status Indication ..................................................................................................... 64
3.18.STATUS................................................................................................................................ 66
3.19.Behaviors of RI ..................................................................................................................... 66
3.20.USB_BOOT Interface............................................................................................................ 67
4GNSS Receiver................................................................................................................................ 69
4.1.General Description .............................................................................................................. 69
4.2.GNSS Performance .............................................................................................................. 69
4.3.Layout Guidelines ................................................................................................................. 70
5Antenna Interfaces.......................................................................................................................... 71
5.1.Main/Rx-diversity Antenna Interfaces.................................................................................... 71
5.1.1.Pin Definition
................................................................................................................ 71
5.1.2.Operating Frequency ................................................................................................... 71
5.1.3.Reference Design of RF Antenna Interface ................................................................. 73
5.1.4.Reference Design of RF Layout................................................................................... 73
5.2.GNSS Antenna Interface....................................................................................................... 75
5.3.Antenna Installation .............................................................................................................. 77
5.3.1.Antenna Requirement.................................................................................................. 77
5.3.2.Recommended RF Connector for Antenna Installation................................................ 78
6Electrical, Reliability and Radio Characteristics.......................................................................... 80
6.1.Absolute Maximum Ratings .................................................................................................. 80
6.2.Power Supply Ratings........................................................................................................... 81
6.3.Operation and Storage Temperatures .................................................................................. 81
6.4.Current Consumption............................................................................................................ 82
6.5.RF Output Power ................................................................................................................ 104
6.6.RF Receiving Sensitivity ..................................................................................................... 105
6.7.Electrostatic Discharge ....................................................................................................... 113
6.8.Thermal Consideration........................................................................................................ 113
7Mechanical Dimensions................................................................................................................ 116
7.1.Mechanical Dimensions of the Module................................................................................ 116
7.2.Recommended Footprint..................................................................................................... 118
7.3.Design Effect Drawings of the Module ................................................................................ 119
8Storage, Manufacturing and Packaging...................................................................................... 120
8.1.Storage ............................................................................................................................... 120
8.2.Manufacturing and Soldering .............................................................................................. 121
8.3.Packaging ........................................................................................................................... 122

LTE Standard Module Series
EC25 Hardware Design
EC25_Hardware_Design 8 / 130
9Appendix A References................................................................................................................ 124
10Appendix B GPRS Coding Schemes........................................................................................... 128
11Appendix C GPRS Multi-slot Classes.......................................................................................... 129
12Appendix D EDGE Modulation and Coding Schemes................................................................ 131

LTE Standard Module Series
EC25 Hardware Design
EC25_Hardware_Design 9 / 130
Table Index
TABLE 1: FREQUENCY BANDS OF EC25 SERIES MODULE ....................................................................... 16
TABLE 2: KEY FEATURES OF EC25 MODULE .............................................................................................. 17
TABLE 3: I/O PARAMETERS DEFINITION ...................................................................................................... 24
TABLE 4: PIN DESCRIPTION........................................................................................................................... 24
TABLE 5: OVERVIEW OF OPERATING MODES ............................................................................................ 36
TABLE 6: VBAT AND GND PINS...................................................................................................................... 40
TABLE 7: PIN DEFINITION OF PWRKEY ........................................................................................................ 43
TABLE 8: PIN DEFINITION OF RESET_N ....................................................................................................... 46
TABLE 9: PIN DEFINITION OF (U)SIM INTERFACE....................................................................................... 48
TABLE 10: PIN DESCRIPTION OF USB INTERFACE..................................................................................... 50
TABLE 11: PIN DEFINITION OF MAIN UART INTERFACE ............................................................................ 51
TABLE 12: PIN DEFINITION OF DEBUG UART INTERFACE......................................................................... 52
TABLE 13: LOGIC LEVELS OF DIGITAL I/O ................................................................................................... 52
TABLE 14: PIN DEFINITION OF PCM AND I2C INTERFACES ...................................................................... 55
TABLE 15: PIN DEFINITION OF SD CARD INTERFACE................................................................................ 56
TABLE 16: PIN DEFINITION OF WIRELESS CONNECTIVITY INTERFACES ............................................... 58
TABLE 17: PIN DEFINITION OF ADC INTERFACES ...................................................................................... 62
TABLE 18: CHARACTERISTIC OF ADC.......................................................................................................... 62
TABLE 19: PIN DEFINITION OF SGMII INTERFACE ...................................................................................... 63
TABLE 20: PIN DEFINITION OF NETWORK CONNECTION STATUS/ACTIVITY INDICATOR .................... 65
TABLE 21: WORKING STATE OF NETWORK CONNECTION STATUS/ACTIVITY INDICATOR.................. 65
TABLE 22: PIN DEFINITION OF STATUS ....................................................................................................... 66
TABLE 23: BEHAVIORS OF RI......................................................................................................................... 67
TABLE 24: PIN DEFINITION OF USB_BOOT INTERFACE............................................................................. 67
TABLE 25: GNSS PERFORMANCE ................................................................................................................. 69
TABLE 26: PIN DEFINITION OF RF ANTENNAS ............................................................................................ 71
TABLE 27: MODULE OPERATING FREQUENCIES ....................................................................................... 71
TABLE 28: PIN DEFINITION OF GNSS ANTENNA INTERFACE.................................................................... 75
TABLE 29: GNSS FREQUENCY ...................................................................................................................... 76
TABLE 30: ANTENNA REQUIREMENTS......................................................................................................... 77
TABLE 31: ABSOLUTE MAXIMUM RATINGS ................................................................................................. 80
TABLE 32: POWER SUPPLY RATINGS .......................................................................................................... 81
TABLE 33: OPERATION AND STORAGE TEMPERATURES......................................................................... 81
TABLE 34: EC25-E CURRENT CONSUMPTION............................................................................................. 82
TABLE 35: EC25-A CURRENT CONSUMPTION............................................................................................. 84
TABLE 36: EC25-V CURRENT CONSUMPTION............................................................................................. 85
TABLE 37: EC25-J CURRENT CONSUMPTION ............................................................................................. 86
TABLE 38: EC25-AU CURRENT CONSUMPTION .......................................................................................... 87
TABLE 39: EC25-AUT CURRENT CONSUMPTION ........................................................................................ 90
TABLE 40: EC25-AF CURRENT CONSUMPTION........................................................................................... 91
TABLE 41: EC25-AFX CURRENT CONSUMPTION ........................................................................................ 92

LTE Standard Module Series
EC25 Hardware Design
EC25_Hardware_Design 10 / 130
TABLE 42: EC25-EU CURRENT CONSUMPTION .......................................................................................... 94
TABLE 43: EC25-EC CURRENT CONSUMPTION .......................................................................................... 96
TABLE 44: EC25-EUX CURRENT CONSUMPTION........................................................................................ 98
TABLE 45: EC25-MX CURRENT CONSUMPTION........................................................................................ 100
TABLE 46: EC25-AUX CURRENT CONSUMPTION...................................................................................... 101
TABLE 47: GNSS CURRENT CONSUMPTION OF EC25 SERIES MODULE .............................................. 104
TABLE 48: RF OUTPUT POWER ................................................................................................................... 104
TABLE 49: EC25-E CONDUCTED RF RECEIVING SENSITIVITY................................................................ 105
TABLE 50: EC25-A CONDUCTED RF RECEIVING SENSITIVITY................................................................ 106
TABLE 51: EC25-V CONDUCTED RF RECEIVING SENSITIVITY................................................................ 106
TABLE 52: EC25-J CONDUCTED RF RECEIVING SENSITIVITY ................................................................ 106
TABLE 53: EC25-AU CONDUCTED RF RECEIVING SENSITIVITY ............................................................. 107
TABLE 54: EC25-AUT CONDUCTED RF RECEIVING SENSITIVITY........................................................... 108
TABLE 55: EC25-AUTL CONDUCTED RF RECEIVING SENSITIVITY......................................................... 108
TABLE 56: EC25-AF CONDUCTED RF RECEIVING SENSITIVITY ............................................................. 108
TABLE 57: EC25-AFX CONDUCTED RF RECEIVING SENSITIVITY ........................................................... 109
TABLE 58: EC25-EU CONDUCTED RF RECEIVING SENSITIVITY ............................................................. 110
TABLE 59: EC25-EC CONDUCTED RF RECEIVING SENSITIVITY ............................................................. 110
TABLE 60: EC25-EUX CONDUCTED RF RECEIVING SENSITIVITY........................................................... 111
TABLE 61: EC25-MX CONDUCTED RF RECEIVING SENSITIVITY............................................................. 111
TABLE 62: EC25-AUX CONDUCTED RF RECEIVING SENSITIVITY........................................................... 112
TABLE 63: ELECTROSTATICS DISCHARGE CHARACTERISTICS (25ºC, 45% RELATIVE HUMIDITY)... 113
TABLE 64: RECOMMENDED THERMAL PROFILE PARAMETERS ............................................................ 121
TABLE 65: RELATED DOCUMENTS ............................................................................................................. 124
TABLE 66: TERMS AND ABBREVIATIONS................................................................................................... 124
TABLE 67: DESCRIPTION OF DIFFERENT CODING SCHEMES................................................................ 128
TABLE 68: GPRS MULTI-SLOT CLASSES.................................................................................................... 129
TABLE 69: EDGE MODULATION AND CODING SCHEMES........................................................................ 131

LTE Standard Module Series
EC25 Hardware Design
EC25_Hardware_Design 11 / 130
Figure Index
FIGURE 1: FUNCTIONAL DIAGRAM ............................................................................................................... 21
FIGURE 2: PIN ASSIGNMENT (TOP VIEW) .................................................................................................... 23
FIGURE 3: SLEEP MODE APPLICATION VIA UART ...................................................................................... 37
FIGURE 4: SLEEP MODE APPLICATION WITH USB REMOTE WAKEUP.................................................... 38
FIGURE 5: SLEEP MODE APPLICATION WITH RI......................................................................................... 38
FIGURE 6: SLEEP MODE APPLICATION WITHOUT SUSPEND FUNCTION................................................ 39
FIGURE 7: POWER SUPPLY LIMITS DURING BURST TRANSMISSION ..................................................... 41
FIGURE 8: STAR STRUCTURE OF THE POWER SUPPLY........................................................................... 41
FIGURE 9: REFERENCE CIRCUIT OF POWER SUPPLY .............................................................................. 42
FIGURE 10: TURN ON THE MODULE BY USING DRIVING CIRCUIT........................................................... 43
FIGURE 11: TURN ON THE MODULE BY USING KEYSTROKE ................................................................... 44
FIGURE 12: TIMING OF TURNING ON MODULE ........................................................................................... 44
FIGURE 13: TIMING OF TURNING OFF MODULE ......................................................................................... 45
FIGURE 14: REFERENCE CIRCUIT OF RESET_N BY USING DRIVING CIRCUIT ...................................... 46
FIGURE 15: REFERENCE CIRCUIT OF RESET_N BY USING BUTTON ...................................................... 47
FIGURE 16: TIMING OF RESETTING MODULE ............................................................................................. 47
FIGURE 17: REFERENCE CIRCUIT OF (U)SIM INTERFACE WITH AN 8-PIN (U)SIM CARD CONNECTOR
................................................................................................................................................................... 48
FIGURE 18: REFERENCE CIRCUIT OF (U)SIM INTERFACE WITH A 6-PIN (U)SIM CARD CONNECTOR 49
FIGURE 19: REFERENCE CIRCUIT OF USB APPLICATION......................................................................... 50
FIGURE 20: REFERENCE CIRCUIT WITH TRANSLATOR CHIP................................................................... 53
FIGURE 21: REFERENCE CIRCUIT WITH TRANSISTOR CIRCUIT.............................................................. 53
FIGURE 22: PRIMARY MODE TIMING ............................................................................................................ 54
FIGURE 23: AUXILIARY MODE TIMING.......................................................................................................... 55
FIGURE 24: REFERENCE CIRCUIT OF PCM APPLICATION WITH AUDIO CODEC ................................... 56
FIGURE 25: REFERENCE CIRCUIT OF SD CARD INTERFACE ................................................................... 57
FIGURE 26: REFERENCE CIRCUIT OF WIRELESS CONNECTIVITY INTERFACES WITH FC20 MODULE
................................................................................................................................................................... 60
FIGURE 27: SIMPLIFIED BLOCK DIAGRAM FOR ETHERNET APPLICATION............................................. 63
FIGURE 28: REFERENCE CIRCUIT OF SGMII INTERFACE WITH PHY AR8033 APPLICATION................ 64
FIGURE 29: REFERENCE CIRCUIT OF THE NETWORK INDICATOR ......................................................... 65
FIGURE 30: REFERENCE CIRCUITS OF STATUS ........................................................................................ 66
FIGURE 31: REFERENCE CIRCUIT OF USB_BOOT INTERFACE................................................................ 68
FIGURE 32: TIMING SEQUENCE FOR ENTERING EMERGENCY DOWNLOAD MODE ............................. 68
FIGURE 33: REFERENCE CIRCUIT OF RF ANTENNA INTERFACE ............................................................ 73
FIGURE 34: MICROSTRIP DESIGN ON A 2-LAYER PCB .............................................................................. 74
FIGURE 35: COPLANAR WAVEGUIDE DESIGN ON A 2-LAYER PCB.......................................................... 74
FIGURE 36: COPLANAR WAVEGUIDE DESIGN ON A 4-LAYER PCB (LAYER 3 AS REFERENCE GROUND)
................................................................................................................................................................... 74
FIGURE 37: COPLANAR WAVEGUIDE DESIGN ON A 4-LAYER PCB (LAYER 4 AS REFERENCE GROUND)
................................................................................................................................................................... 75

LTE Standard Module Series
EC25 Hardware Design
EC25_Hardware_Design 12 / 130
FIGURE 38: REFERENCE CIRCUIT OF GNSS ANTENNA............................................................................. 76
FIGURE 39: DIMENSIONS OF THE U.FL-R-SMT CONNECTOR (UNIT: MM) ............................................... 78
FIGURE 40: MECHANICALS OF U.FL-LP CONNECTORS............................................................................. 78
FIGURE 41: SPACE FACTOR OF MATED CONNECTOR (UNIT: MM) .......................................................... 79
FIGURE 42: REFERENCED HEATSINK DESIGN (HEATSINK AT THE TOP OF THE MODULE)............... 114
FIGURE 43: REFERENCED HEATSINK DESIGN (HEATSINK AT THE BACKSIDE OF CUSTOMERS’ PCB)
................................................................................................................................................................. 114
FIGURE 44: MODULE TOP AND SIDE DIMENSIONS .................................................................................. 116
FIGURE 45: MODULE BOTTOM DIMENSIONS (BOTTOM VIEW) ............................................................... 117
FIGURE 46: RECOMMENDED FOOTPRINT (TOP VIEW) ............................................................................ 118
FIGURE 47: TOP VIEW OF THE MODULE.................................................................................................... 119
FIGURE 48: BOTTOM VIEW OF THE MODULE............................................................................................ 119
FIGURE 49: REFLOW SOLDERING THERMAL PROFILE............................................................................ 121
FIGURE 50: TAPE AND REEL SPECIFICATIONS ........................................................................................ 123
FIGURE 51: TAPE AND REEL DIRECTIONS ................................................................................................ 123

LTE Standard Module Series
EC25 Hardware Design
EC25_Hardware_Design 13 / 130
1Introduction
This document defines EC25 module and describes its air interface and hardware interfaces which are
connected with customers’ applications.
This document can help customers quickly understand module interface specifications, electrical and
mechanical details, as well as other related information of EC25 module. To facilitate its application in
different fields, relevant reference design is also provided for customers’ reference. Associated with
application note and user guide, customers can use EC25 module to design and set up mobile
applications easily.
1. CAUTION : RISK OF EXPL OSION IF BATTERY IS REPL ACED BY AN INCORRECT
TYPE. DISPOSE OF USED BATTERIES ACCORDING To THE INSTRUCTIONS.
2. Operating temperature: -40 °C to 85° C
3. EC25-AUX, EC25-AUX MINIPCIEsupport frequency bands : GSM900/1800 , WCDMA
I/V/VIII, LTE Band 1/3/5/7/8/20/28/40 ;
4. EC25-AUX, EC25-AUX MINIPCIE max output power :
GSM900/1800 , WCDMA I/V/VIII, LTE Band 1/3/5/7/8/20/28/40 : 23dBm ;
The antenna(s) used for this transmitter must not be co-located or operating in
conjunction with any other antenna or transmitter and must be installed to
provide a separation distance of at least 20cm from all persons.
Declaration of Conformity
Hereby, Quectel Wireless Solutions Co., Ltd
declares that the radio equiqment type EC25-AUX, EC25-AUX
MINIPCIEis incompliance with
Directives: 2014/53/EU.The full text of the EU declaration ofconformity is available
at the following internet
address: http://www.quectel.com/support/downloadb/TechnicalDocuments.htm

LTE Standard Module Series
EC25 Hardware Design
EC25_Hardware_Design 14 / 130
1.1. Safety Information
The following safety precautions must be observed during all phases of operation, such as usage, service
or repair of any cellular terminal or mobile incorporating EC25 module. Manufacturers of the cellular
terminal should send the following safety information to users and operating personnel, and incorporate
these guidelines into all manuals supplied with the product. If not so, Quectel assumes no liability for
customers’ failure to comply with these precautions.
Full attention must be given to driving at all times in order to reduce the risk of an
accident. Using a mobile while driving (even with a handsfree kit) causes
distraction and can lead to an accident. Please comply with laws and regulations
restricting the use of wireless devices while driving.
Switch off the cellular terminal or mobile before boarding an aircraft. The operation
of wireless appliances in an aircraft is forbidden to prevent interference with
communication systems. If the device offers an Airplane Mode, then it should be
enabled prior to boarding an aircraft. Please consult the airline staff for more
restrictions on the use of wireless devices on boarding the aircraft. 
Wireless devices may cause interference on sensitive medical equipment, so
please be aware of the restrictions on the use of wireless devices when in
hospitals, clinics or other healthcare facilities.
Cellular terminals or mobiles operating over radio signals and cellular network
cannot be guaranteed to connect in all possible conditions (for example, with
unpaid bills or with an invalid (U)SIM card). When emergent help is needed in such
conditions, please remember using emergency call. In order to make or receive a
call, the cellular terminal or mobile must be switched on in a service area with
adequate cellular signal strength.
The cellular terminal or mobile contains a transmitter and receiver. When it is ON, it
receives and transmits radio frequency signals. RF interference can occur if it is
used close to TV set, radio, computer or other electric equipment.

LTE Standard Module Series
EC25 Hardware Design
EC25_Hardware_Design 15 / 130
In locations with potentially explosive atmospheres, obey all posted signs to turn
off wireless devices such as your phone or other cellular terminals. Areas with
potentially explosive atmospheres include fuelling areas, below decks on boats,
fuel or chemical transfer or storage facilities, areas where the air contains
chemicals or particles such as grain, dust or metal powders, etc.

LTE Standard Module Series
EC25 Hardware Design
EC25_Hardware_Design 16 / 130
2Product Concept
2.1. General Description
EC25 is a series of LTE-FDD/LTE-TDD/WCDMA/GSM wireless communication module with receive
diversity. It provides data connectivity on LTE-FDD, LTE-TDD, DC-HSDPA, HSPA+, HSDPA, HSUPA,
WCDMA, EDGE and GPRS networks. It also provides GNSS1) and voice functionality2) for customers’
specific applications. EC25 contains 14 variants: EC25-E, EC25-A, EC25-V, EC25-J, EC25-AU,
EC25-AUX, EC25-AUT, EC25-AF, EC25-AFX, EC25-EU, EC25-EUX, EC25-AUTL, EC25-EC and
EC25-MX. Customers can choose a dedicated type based on the region or operator. The following table
shows the frequency bands of EC25 series module.
Table 1: Frequency Bands of EC25 Series Module
Modules2) LTE Bands WCDMA
Bands GSM Bands Rx- diversity GNSS1)
EC25-E FDD: B1/B3/B5/B7/B8/B20
TDD: B38/B40/B41 B1/B5/B8 900/1800MHz Y
GPS,
GLONASS,
BeiDou/
Compass,
Galileo,
QZSS
EC25-A FDD: B2/B4/B12 B2/B4/B5 N Y
EC25-V FDD: B4/B13 N N Y
EC25-J
FDD: B1/B3/B8/B18/B19/
B26
TDD: B41
B1/B6/B8/B19 N Y
EC25-AU3)
FDD: B1/B2/B3/B4/B5/B7/
B8/B28
TDD: B40
B1/B2/B5/B8 850/900/
1800/1900MHz Y
EC25-AUX4)
FDD: B1/B23)/B3/B4/B5/B7/
B8/B28
TDD: B40
B1/B2/B4/B5/
B8
850/900/
1800/1900MHz Y
EC25-AUT FDD: B1/B3//B5/B7/B28 B1/B5 N Y
EC25-AF FDD: B2/B4//B5/B12/B13/
B14/B66/B71 B2/B4/B5 N Y

LTE Standard Module Series
EC25 Hardware Design
EC25_Hardware_Design 17 / 130
1. 1) GNSS function is optional.
2. 2) EC25 series module contains Telematics version and Data-only version. Telematics version
supports voice and data functions, while Data-only version only supports data function.
3. 3) B2 band on EC25-AU and EC25-AUX modules do not support Rx-diversity.
4. 4) EC25-AFX, EC25-EUX, EC25-AUX and EC25-MX are based on ThreadX OS.
5. Y = Supported. N = Not supported.
With a compact profile of 29.0mm × 32.0mm × 2.4mm, EC25 can meet almost all requirements for M2M
applications such as automotive, metering, tracking system, security, router, wireless POS, mobile
computing device, PDA phone, tablet PC, etc.
EC25 is an SMD type module which can be embedded into applications through its 144-pin pads,
including 80 LCC signal pads and 64 LGA pads.
2.2. Key Features
The following table describes the detailed features of EC25 module.
Table 2: Key Features of EC25 Module
EC25-AFX4) FDD: B2/B4//B5/B12/B13/
B14/B66/B71 B2/B4/B5 N Y
EC25-EU
FDD: B1/B3/B7/B8/B20/
B28A
TDD: B38/B40/B41
B1/B8 900/1800MHz Y
EC25-EUX4)
FDD: B1/B3/B7/B8/B20/
B28A
TDD: B38/B40/B41
B1/B8 900/1800MHz Y
EC25-AUTL FDD: B3/B7/B28 N N YN
EC25-EC FDD: B1/B3/B7/B8/B20/
B28A B1/B8 900/1800MHz Y N
EC25-MX4) FDD: B2/B4//B5/B7/B28/
B66 B2/B4/B5 N Y N
Features Details
Power Supply Supply voltage: 3.3V~4.3V
Typical supply voltage: 3.8V
NOTES

LTE Standard Module Series
EC25 Hardware Design
EC25_Hardware_Design 18 / 130
Transmitting Power
Class 4 (33dBm±2dB) for GSM850
Class 4 (33dBm±2dB) for EGSM900
Class 1 (30dBm±2dB) for DCS1800
Class 1 (30dBm±2dB) for PCS1900
Class E2 (27dBm±3dB) for GSM850 8-PSK
Class E2 (27dBm±3dB) for EGSM900 8-PSK
Class E2 (26dBm±3dB) for DCS1800 8-PSK
Class E2 (26dBm±3dB) for PCS1900 8-PSK
Class 3 (24dBm+1/-3dB) for WCDMA bands
Class 3 (23dBm±2dB) for LTE-FDD bands
Class 3 (23dBm±2dB) for LTE-TDD bands
LTE Features
Support up to non-CA Cat 4 FDD and TDD
Support 1.4/3/5/10/15/20MHz RF bandwidth
Support MIMO in DL direction
LTE-FDD: Max 150Mbps (DL)/Max 50Mbps (UL)
LTE-TDD: Max 130Mbps (DL)/Max 30Mbps (UL)
UMTS Features
Support 3GPP R8 DC-HSDPA, HSPA+, HSDPA, HSUPA and WCDMA
Support QPSK, 16-QAM and 64-QAM modulation
DC-HSDPA: Max 42Mbps (DL)
HSUPA: Max 5.76Mbps (UL)
WCDMA: Max 384Kbps (DL)/Max 384Kbps (UL)
GSM Features
GPRS:
Support GPRS multi-slot class 33 (33 by default)
Coding scheme: CS-1, CS-2, CS-3 and CS-4
Max 107Kbps (DL)/Max 85.6Kbps (UL)
EDGE:
Support EDGE multi-slot class 33 (33 by default)
Support GMSK and 8-PSK for different MCS (Modulation and Coding
Scheme)
Downlink coding schemes: CS 1-4 and MCS 1-9
Uplink coding schemes: CS 1-4 and MCS 1-9
Max 296Kbps (DL)/Max 236.8Kbps (UL)
Internet Protocol Features
Support TCP/UDP/PPP/FTP/FTPS/HTTP/HTTPS/NTP/PING/QMI/NITZ/
MMS/SMTP/SSL/MQTT/FILE/CMUX*/SMTPS* protocols
Support PAP (Password Authentication Protocol) and CHAP (Challenge
Handshake Authentication Protocol) protocols which are usually used for
PPP connections
SMS
Text and PDU mode
Point to point MO and MT
SMS cell broadcast
SMS storage: ME by default
(U)SIM Interface Support USIM/SIM card: 1.8V, 3.0V

LTE Standard Module Series
EC25 Hardware Design
EC25_Hardware_Design 19 / 130
Audio Features
Support one digital audio interface: PCM interface
GSM: HR/FR/EFR/AMR/AMR-WB
WCDMA: AMR/AMR-WB
LTE: AMR/AMR-WB
Support echo cancellation and noise suppression
PCM Interface
Used for audio function with external codec
Support 16-bit linear data format
Support long frame synchronization and short frame synchronization
Support master and slave modes, but must be the master in long frame
synchronization
USB Interface
Compliant with USB 2.0 specification (slave only); the data transfer rate can
reach up to 480Mbps
Used for AT command communication, data transmission, GNSS NMEA
output, software debugging, firmware upgrade and voice over USB
Support USB serial drivers for: Windows 7/8/8.1/10, Linux 2.6/3.x/4.1~4.15,
Android 4.x/5.x/6.x/7.x/8.x/9.x, etc.
UART Interfaces
Main UART:
Used for AT command communication and data transmission
Baud rates reach up to 921600bps, 115200bps by default
Support RTS and CTS hardware flow control
Debug UART:
Used for Linux console and log output
115200bps baud rate
SD Card Interface1) Support SD 3.0 protocol
SGMII Interface1) Support 10M/100M/1000M Ethernet work mode
Support maximum 150Mbps (DL)/50Mbps (UL) for 4G network
Wireless Connectivity
Interfaces1)
Support a low-power SDIO 3.0 interface for WLAN and UART/PCM
interfaces for Bluetooth
Rx-diversity Support LTE/WCDMA Rx-diversity
GNSS Features Gen8C Lite of Qualcomm
Protocol: NMEA 0183
AT Commands Compliant with 3GPP TS 27.007, 27.005 and Quectel enhanced AT
commands
Network Indication Two pins including NET_MODE and NET_STATUS to indicate network
connectivity status
Antenna Interfaces Including main antenna interface (ANT_MAIN), Rx-diversity antenna
interface (ANT_DIV) and GNSS antenna interface (ANT_GNSS)
Physical Characteristics Size: (29.0±0.15)mm × (32.0±0.15)mm × (2.4±0.2)mm
Weight: approx. 4.9g
Temperature Range
Operation temperature range: -35°C ~ +75°C2)
Extended temperature range: -40°C ~ +85°C3)
Storage temperature range: -40°C~ +90°C