Quectel BG772A-GL Supplement

BG772A-GL
Hardware Design
LPWA Module Series
Version: 1.0.0
Date: 2021-01-28
Status: Preliminary
www.quectel.com

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Our aim is to provide customers with timely and comprehensive service. For any assistance,
please contact our company headquarters:
Quectel Wireless Solutions Co., Ltd.
Building 5, Shanghai Business Park Phase III (Area B), No.1016 Tianlin Road, Minhang District, Shanghai
200233, China
Tel: [phone]
Email: [e-mail]
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For technical support, or to report documentation errors, please visit:
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General Notes
Quectel offers the information as a service to its customers. The information provided is based upon
customers’ requirements. Quectel makes every effort to ensure the quality of the information it makes
available. Quectel does not make any warranty as to the information contained herein, and does not
accept any liability for any injury, loss or damage of any kind incurred by use of or reliance upon the
information. All information supplied herein is subject to change without prior notice.
Disclaimer
While Quectel has made efforts to ensure that the functions and features under development are free
from errors, it is possible that these functions and features could contain errors, inaccuracies and
omissions. Unless otherwise provided by valid agreement, Quectel makes no warranties of any kind,
implied or express, with respect to the use of features and functions under development. To the maximum
extent permitted by law, Quectel excludes all liability for any loss or damage suffered in connection with
the use of the functions and features under development, regardless of whether such loss or damage
may have been foreseeable.
Duty of Confidentiality
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requirements, unauthorized use, or other illegal or malicious use of the documentation and information,
Quectel will reserve the right to take legal action.

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Copyright
The information contained here is proprietary technical information of Quectel. Transmitting, reproducing,
disseminating and editing this document as well as using the content without permission are forbidden.
Offenders will be held liable for payment of damages. All rights are reserved in the event of a patent grant
or registration of a utility model or design.
Copyright © Quectel Wireless Solutions Co., Ltd. 2021. All rights reserved.

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Safety Information
The following safety precautions must be observed during all phases of operation, such as usage, service
or repair of any cellular terminal or mobile incorporating the module. Manufacturers of the cellular terminal
should notify users and operating personnel of the following safety information by incorporating these
guidelines into all manuals of the product. Otherwise, Quectel assumes no liability for customers’ failure to
comply with these precautions.
Full attention must be paid to driving at all times in order to reduce the risk of an
accident. Using a mobile while driving (even with a handsfree kit) causes
distraction and can lead to an accident. Please comply with laws and regulations
restricting the use of wireless devices while driving.
Switch off the cellular terminal or mobile before boarding an aircraft. The operation
of wireless appliances in an aircraft is forbidden to prevent interference with
communication systems. If there is an Airplane Mode, it should be enabled prior to
boarding an aircraft. Please consult the airline staff for more restrictions on the use
of wireless devices on an aircraft.
Wireless devices may cause interference on sensitive medical equipment, so
please be aware of the restrictions on the use of wireless devices when in
hospitals, clinics or other healthcare facilities.
Cellular terminals or mobiles operating over radio signal and cellular network
cannot be guaranteed to connect in certain conditions, such as when the mobile bill
is unpaid or the (U)SIM card is invalid. When emergency help is needed in such
conditions, use emergency call if the device supports it. In order to make or receive
a call, the cellular terminal or mobile must be switched on in a service area with
adequate cellular signal strength. In an emergency, the device with emergency call
function cannot be used as the only contact method considering network
connection cannot be guaranteed under all circumstances.
The cellular terminal or mobile contains a transceiver. When it is ON, it receives
and transmits radio frequency signals. RF interference can occur if it is used close
to TV sets, radios, computers or other electric equipment.
In locations with explosive or potentially explosive atmospheres, obey all posted
signs and turn off wireless devices such as mobile phone or other cellular
terminals. Areas with explosive or potentially explosive atmospheres include
fuelling areas, below decks on boats, fuel or chemical transfer or storage facilities,
and areas where the air contains chemicals or particles such as grain, dust or
metal powders.

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About the Document
Revision History
Version
Date
Author
Description
-
2021-01-28
Besson RONG/
Ben JIANG
Creation of the document
1.0.0
2021-01-28
Besson RONG/
Ben JIANG
Preliminary

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Contents
Safety Information......................................................................................................................................................3
About the Document..................................................................................................................................................4
Contents........................................................................................................................................................................5
Table Index................................................................................................................................................................... 7
Figure Index................................................................................................................................................................. 9
1 Introduction....................................................................................................................................................... 10
1.1. Special Mark............................................................................................................................................13
2 Product Concept...............................................................................................................................................14
2.1. General Description............................................................................................................................... 14
2.2. Key Features...........................................................................................................................................15
2.3. Functional Diagram................................................................................................................................17
2.4. Evaluation Board.................................................................................................................................... 18
3 Application Interfaces.....................................................................................................................................19
3.1. Pin Assignment.......................................................................................................................................20
3.2. Pin Description........................................................................................................................................21
3.3. Operating Modes....................................................................................................................................27
3.4. Power Saving.......................................................................................................................................... 28
3.4.1. Airplane Mode.............................................................................................................................28
3.4.2. Power Saving Mode (PSM)*.....................................................................................................28
3.4.3. Extended Idle Mode DRX (e-I-DRX).......................................................................................29
3.4.4. Sleep Mode................................................................................................................................. 29
3.4.4.1. UART Application............................................................................................................29
3.5. Power Supply.......................................................................................................................................... 30
3.5.1. Power Supply Pins.....................................................................................................................30
3.5.2. Decrease Voltage Drop.............................................................................................................31
3.6. Turn on and off Scenarios.................................................................................................................... 32
3.6.1. Pin Definition of PWRKEY........................................................................................................32
3.6.2. Turn on Module Using PWRKEY............................................................................................ 32
3.6.3. Turn off Module...........................................................................................................................34
3.6.3.1. Turn off Module through PWRKEY..............................................................................34
3.6.3.2. Turn off Module through AT Command...................................................................... 34
3.7. Reset the Module................................................................................................................................... 35
3.8. PON_TRIG*.............................................................................................................................................36
3.9. (U)SIM Interface..................................................................................................................................... 37
3.10. USB Interface*........................................................................................................................................ 39
3.11. UART Interfaces..................................................................................................................................... 41
3.12. PCM and I2C Interfaces*...................................................................................................................... 44
3.13. Network Status Indication*....................................................................................................................45
3.14. STATUS................................................................................................................................................... 46
3.15. Behaviors of MAIN_RI*......................................................................................................................... 46

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3.16. ADC Interfaces*......................................................................................................................................47
3.17. GPIO Interfaces*.................................................................................................................................... 48
3.18. GRFC Interfaces*................................................................................................................................... 49
4 GNSS Receiver*................................................................................................................................................ 50
4.1. General Description............................................................................................................................... 50
4.2. GNSS Performance............................................................................................................................... 50
4.3. Layout Guidelines...................................................................................................................................51
5 Antenna Interfaces...........................................................................................................................................52
5.1. Main Antenna Interface......................................................................................................................... 52
5.1.1. Pin Definition............................................................................................................................... 52
5.1.2. Operating Frequency.................................................................................................................52
5.1.3. Reference Design of Main Antenna Interface....................................................................... 53
5.2. GNSS Antenna Interface...................................................................................................................... 54
5.2.1. Pin Definition............................................................................................................................... 54
5.2.2. GNSS Operating Frequency.................................................................................................... 54
5.2.3. Reference Design of GNSS Antenna Interface.................................................................... 54
5.3. Antenna Installation............................................................................................................................... 55
5.3.1. Reference Design of RF Layout.............................................................................................. 55
5.3.2. Antenna Requirements..............................................................................................................57
5.3.3. Recommended RF Connector for Antenna Installation.......................................................58
6 Electrical, Reliability and Radio Characteristics.....................................................................................60
6.1. Absolute Maximum Ratings..................................................................................................................60
6.2. Power Supply Ratings........................................................................................................................... 60
6.3. Operating and Storage Temperatures................................................................................................61
6.4. Current Consumption.............................................................................................................................62
6.5. Digital I/O Characteristic....................................................................................................................... 64
6.6. RF Output Power....................................................................................................................................65
6.7. RF Receiving Sensitivity....................................................................................................................... 65
6.8. Electrostatic Discharge..........................................................................................................................67
7 Mechanical Dimensions................................................................................................................................. 68
7.1. Top and Side Dimensions.....................................................................................................................68
7.2. Recommended Footprint...................................................................................................................... 70
7.3. Top and Bottom Views.......................................................................................................................... 71
8 Storage, Manufacturing and Packaging.................................................................................................... 72
8.1. Storage.....................................................................................................................................................72
8.2. Manufacturing and Soldering............................................................................................................... 73
8.3. Packaging................................................................................................................................................ 74
9 Appendix A References..................................................................................................................................76

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Table Index
Table 1: Special Mark............................................................................................................................................... 13
Table 2: Frequency Bands and GNSS Types of BG772A-GL Module........................................................... 14
Table 3: Key Features of BG772A-GL...................................................................................................................15
Table 4: Definition of I/O Parameters.....................................................................................................................21
Table 5: Pin Description........................................................................................................................................... 22
Table 6: Overview of Operating Modes................................................................................................................. 27
Table 7: VBAT and GND Pins................................................................................................................................. 30
Table 8: Pin Definition of PWRKEY........................................................................................................................32
Table 9: Pin Definition of RESET_N.......................................................................................................................35
Table 10: Pin Definition of PON_TRIG.................................................................................................................. 36
Table 11: Pin Definition of (U)SIM Interface......................................................................................................... 37
Table 12: Pin Definition of USB Interface..............................................................................................................39
Table 13: Pin Definition of Main UART Interface................................................................................................. 41
Table 14: Pin Definition of Debug UART Interface.............................................................................................. 42
Table 15: Pin Definition of Auxiliary UART Interface...........................................................................................42
Table 16: Pin Definition of PCM and I2C Interfaces............................................................................................44
Table 17: Pin Definition of NET_STATUS.............................................................................................................45
Table 18: Working State of NET_STATUS........................................................................................................... 45
Table 19: Pin Definition of STATUS.......................................................................................................................46
Table 20: Default Behaviors of MAIN_RI.............................................................................................................. 46
Table 21: Pin Definition of ADC Interfaces............................................................................................................47
Table 22: Characteristics of ADC Interfaces.........................................................................................................47
Table 23: Pin Definition of GPIO Interfaces..........................................................................................................48
Table 24: Pin Definition of GRFC Interfaces.........................................................................................................49
Table 25: Truth Table of GRFC Interfaces............................................................................................................49
Table 26: GNSS Performance.................................................................................................................................50
Table 27: Pin Definition of Main Antenna Interface............................................................................................. 52
Table 28: BG772A-GL Operating Frequency....................................................................................................... 52
Table 29: Pin Definition of GNSS Antenna Interface.......................................................................................... 54
Table 30: GNSS Operating Frequency..................................................................................................................54
Table 31: Antenna Requirements...........................................................................................................................57
Table 32: Absolute Maximum Ratings................................................................................................................... 60
Table 33: Power Supply Ratings.............................................................................................................................60
Table 34: Operating and Storage Temperatures................................................................................................. 61
Table 35: BG772A-GL Current Consumption (Power Supply: 3.3 V, Room Temperature)......................... 62
Table 36: GNSS Current Consumption (Power Supply: 3.3 V, Room Temperature)....................................64
Table 37: 1.8 V I/O Requirements.......................................................................................................................... 64
Table 38: (U)SIM 1.8 V I/O Requirements............................................................................................................ 64
Table 39: BG772A-GL RF Output Power..............................................................................................................65
Table 40: BG772A-GL Conducted RF Receiving Sensitivity............................................................................. 65
Table 41: Electrostatic Discharge Characteristics (Temperature: 25 ºC, Relative Humidity: 45 %)...........67

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Table 42: Recommended Thermal Profile Parameters...................................................................................... 74
Table 43: BG772A-GL Packaging Specifications................................................................................................ 75
Table 44: Related Documents.................................................................................................................................76
Table 45: Terms and Abbreviations....................................................................................................................... 76

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Figure Index
Figure 1: Functional Diagram.................................................................................................................................. 17
Figure 2: Pin Assignment (Top View).................................................................................................................... 20
Figure 3: Sleep Mode Application via UART........................................................................................................ 30
Figure 4: Star Structure of the Power Supply....................................................................................................... 31
Figure 5: Turn on the Module by Using Driving Circuit....................................................................................... 32
Figure 6: Turn on the Module by Using Keystroke.............................................................................................. 33
Figure 7: Power-up Timing.......................................................................................................................................33
Figure 8: Power-down Timing..................................................................................................................................34
Figure 9: Reset Timing............................................................................................................................................. 35
Figure 10: Reference Circuit of RESET_N by Using Driving Circuit................................................................ 35
Figure 11: Reference Circuit of RESET_N by Using Button..............................................................................36
Figure 12: Reference Circuit of PON_TRIG......................................................................................................... 37
Figure 13: Reference Circuit of (U)SIM Interface with an 8-Pin (U)SIM Card Connector.............................38
Figure 14: Reference Circuit of (U)SIM Interface with a 6-Pin (U)SIM Card Connector...............................38
Figure 15: Reference Design of USB PHY........................................................................................................... 40
Figure 16: Reference Design of USB Interface....................................................................................................40
Figure 17: Main UART Reference Design (Translator Chip)............................................................................. 43
Figure 18: Main UART Reference Design (Transistor Circuit).......................................................................... 43
Figure 19: Reference Circuit of PCM Application with Audio Codec................................................................44
Figure 20: Reference Design of NET_STATUS...................................................................................................45
Figure 21: Reference Design of STATUS............................................................................................................. 46
Figure 22: Reference Design of Main Antenna Interface................................................................................... 53
Figure 23: Reference Circuit of GNSS Antenna Interface..................................................................................54
Figure 24: Microstrip Design on a 2-layer PCB....................................................................................................55
Figure 25: Coplanar Waveguide Design on a 2-layer PCB................................................................................55
Figure 26: Coplanar Waveguide Design on a 4-layer PCB (Layer 3 as Reference Ground).......................56
Figure 27: Coplanar Waveguide Design on a 4-layer PCB (Layer 4 as Reference Ground).......................56
Figure 28: Dimensions of the U.FL-R-SMT Connector (Unit: mm)...................................................................58
Figure 29: Mechanicals of U.FL-LP Connectors.................................................................................................. 58
Figure 30: Space Factor of Mated Connector (Unit: mm).................................................................................. 59
Figure 31: Module Top and Side Dimensions...................................................................................................... 68
Figure 32: Bottom Dimensions (Bottom View)..................................................................................................... 69
Figure 33: Recommended Footprint (Top View)..................................................................................................70
Figure 34: Top and Bottom View of the Module...................................................................................................71
Figure 35: Recommended Reflow Soldering Thermal Profile........................................................................... 73
Figure 36: Tape Dimensions....................................................................................................................................75
Figure 37: Reel Dimensions.................................................................................................................................... 75

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1Introduction
This document defines BG772A-GL module and describes its air interface and hardware interfaces which
are connected with customers’ applications.
This document helps customers quickly understand the interface specifications, electrical and mechanical
details, as well as other related information of the module. To facilitate application designs, it also
includes some reference designs for customers’ reference. The document, coupled with application notes
and user guides, makes it easy to design and to set up mobile applications with BG772A-GL.
Hereby, [Quectel Wireless Solutions Co., Ltd.] declares that the radio equipment type [BG772A-GL] is in
compliance with Directive 2014/53/EU.
The full text of the EU declaration of conformity is available at the following internet address:
http://www.quectel.com
The device could be used with a separation distance of 20cm to the human body.
FCC Certification Requirements.
According to the definition of mobile and fixed device is described in Part 2.1091(b), this device is a
mobile device.
And the following conditions must be met:
1. This Modular Approval is limited to OEM installation for mobile and fixed applications only. The antenna
installation and operating configurations of this transmitter, including any applicable source-based
timeaveraging duty factor, antenna gain and cable loss must satisfy MPE categorical Exclusion
Requirements of 2.1091.
2. The EUT is a mobile device; maintain at least a 20 cm separation between the EUT and the user’s
body and must not transmit simultaneously with any other antenna or transmitter.
3. A label with the following statements must be attached to the host end product: This device contains
FCC ID: XMR2022BG772AGL
4. To comply with FCC regulations limiting both maximum RF output power and human exposure to RF
radiation, maximum antenna gain (including cable loss) must not exceed:
radiation, maximum antenna
gain (including cable loss)
FCC Max Antenna Gain
（dBi）
IC Max Antenna Gain（dBi）

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must not exceed: Operating
Band
LTE BAND 2
7.300
7.30
LTE BAND 4
4.300
4.30
LTE BAND 5
8.841
5.40
LTE BAND 12
8.098
4.91
LTE BAND 13
8.514
5.23
LTE BAND 25
7.300
7.30
LTE BAND 26(814-824)
8.841
5.36
LTE BAND 26(824-849)
8.841
5.36
LTE BAND 66
4.300
4.30
NB-IOT Band 2
7.300
7.30
NB-IOT Band 4
4.300
4.30
NB-IOT Band 5
8.841
5.40
NB-IOT Band 12
8.098
4.91
NB-IOT Band 13
8.514
5.23
NB-IOT Band 25
7.300
4.93
NB-IOT Band 26
8.841
7.30
NB-IOT Band 66
4.300
4.30
5. This module must not transmit simultaneously with any other antenna or transmitter
6. The host end product must include a user manual that clearly defines operating requirements and
conditions that must be observed to ensure compliance with current FCC RF exposure guidelines.
For portable devices, in addition to the conditions 3 through 6 described above, a separate approval is
required to satisfy the SAR requirements of FCC Part 2.1093
If the device is used for other equipment that separate approval is required for all other operating
configurations, including portable configurations with respect to 2.1093 and different antenna
configurations.
For this device, OEM integrators must be provided with labeling instructions of finished products.
Please refer to KDB784748 D01 v07, section 8. Page 6/7 last two paragraphs:
A certified modular has the option to use a permanently affixed label, or an electronic label. For a
permanently affixed label, the module must be labeled with an FCC ID - Section 2.926 (see 2.2
Certification (labeling requirements) above). The OEM manual must provide clear instructions explaining
to the OEM the labeling requirements, options and OEM user manual instructions that are required (see
next paragraph).
For a host using a certified modular with a standard fixed label, if (1) the module’s FCC ID is not visible
when installed in the host, or (2) if the host is marketed so that end users do not have straightforward
commonly used methods for access to remove the module so that the FCC ID of the module is visible;
then an additional permanent label referring to the enclosed module: “Contains Transmitter Module FCC
ID: XMR2022BG772AGL” or “Contains FCC ID: XMR2022BG772AGL” must be used. The host OEM user
manual must also contain clear instructions on how end users can find and/or access the module and the
FCC ID.
The final host / module combination may also need to be evaluated against the FCC Part 15B criteria for

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unintentional radiators in order to be properly authorized for operation as a Part 15 digital device.
The user’s manual or instruction manual for an intentional or unintentional radiator shall caution the user
that changes or modifications not expressly approved by the party responsible for compliance could void
the user's authority to operate the equipment. In cases where the manual is provided only in a form other
than paper, such as on a computer disk or over the Internet, the information required by this section may
be included in the manual in that alternative form, provided the user can reasonably be expected to have
the capability to access information in that form.
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions:
(1) This device may not cause harmful interference, and (2) this device must accept any interference
received, including interference that may cause undesired operation.
Changes or modifications not expressly approved by the manufacturer could void the user’s authority to
operate the equipment.
To ensure compliance with all non-transmitter functions the host manufacturer is responsible for ensuring
compliance with the module(s) installed and fully operational. For example, if a host was previously
authorized as an unintentional radiator under the Supplier’s Declaration of Conformity procedure without
a transmitter certified module and a module is added, the host manufacturer is responsible for ensuring
that the after the module is installed and operational the host continues to be compliant with the Part 15B
unintentional radiator requirements.
Manual Information To the End User
The OEM integrator has to be aware not to provide information to the end user regarding how to install or
remove this RF module in the user’s manual of the end product which integrates this module. The end
user manual shall include all required regulatory information/warning as show in this manual.
IC Statement
IRSS-GEN
"This device complies with Industry Canada’s licence-exempt RSSs. Operation is subject to the following
two conditions: (1) This device may not cause interference; and (2) This device must accept any
interference, including interference that may cause undesired operation of the device." or "Le présent
appareil est conforme aux CNR d’Industrie Canada applicables aux appareils radio exempts de licence.
L’exploitation est autorisée aux deux conditions suivantes :
1) l’appareil ne doit pas produire de brouillage; 2) l’utilisateur de l’appareil doit accepter tout brouillage
radioélectrique subi, même si le brouillage est susceptible d’en compromettre le fonctionnement."
Déclaration sur l'exposition aux rayonnements RF
L'autre utilisé pour l'émetteur doit être installé pour fournir une distance de séparation d'au moins 20 cm
de toutes les personnes et ne doit pas être colocalisé ou fonctionner conjointement avec une autre
antenne ou un autre émetteur.
The host product shall be properly labeled to identify the modules within the host product.
The Innovation, Science and Economic Development Canada certification label of a module shall be
clearly visible at all times when installed in the host product; otherwise, the host product must be labeled
to display the Innovation, Science and Economic Development Canada certification number for the
module, preceded by the word “Contains” or similar wording expressing the same meaning, as follows:
“Contains IC: 10224A-2022BG772A” or “where: 10224A-2022BG772A is the module’s certification
number”.
Le produit hôte doit être correctement étiqueté pour identifier les modules dans le produit hôte.
L'étiquette de certification d'Innovation, Sciences et Développement économique Canada d'un module

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doit être clairement visible en tout temps lorsqu'il est installédans le produit hôte; sinon, le produit hôte
doit porter une étiquette indiquant le numéro de certification d'Innovation, Sciences et Développement
économique Canada pour le module, précédé du mot «Contient» ou d'un libellé semblable exprimant la
même signification, comme suit:
"Contient IC: 10224A-2022BG772A " ou "où: 10224A-2022BG772A est le numéro de certification du
module".
1.1. Special Mark
Table 1: Special Mark
Mark
Definition
*
When an asterisk (*) is used after a function, feature, interface, pin name, AT command, or
argument, it indicates that the function, feature, interface, pin name, AT command, or
argument is under development and currently not supported, unless otherwise specified.

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2Product Concept
2.1. General Description
BG772A-GL is an embedded IoT (LTE Cat M1, LTE Cat NB1/Cat NB2*) wireless communication module.
It provides data connectivity on LTE-FDD network, and supports half-duplex operation in LTE network. It
also provides optional GNSS* and voice* 1) functionality to meet customers’ specific application demands.
The module is based on an architecture in which WWAN (LTE) and GNSS Rx chains share certain
hardware blocks. However, the module does not support concurrent operation of WWAN and GNSS. The
solution adopted in the module is a form of coarse time-division multiplexing (TDM) between WWAN and
GNSS Rx chains. Given the relaxed latency requirements of most LPWA applications, time-division
sharing of resources can be made largely transparent to applications. For more details, see
document [1].
Table 2: Frequency Bands and GNSS Types of BG772A-GL Module
1. 1) BG772A-GL supports VoLTE* (Voice over LTE) under LTE Cat M1.
2. 2) LTE Cat NB2* is backward compatible with LTE Cat NB1.
Module
Supported Bands
Power Class
GNSS*
BG772A-GL
Cat M1 1):
LTE-FDD:
B1/B2/B3/B4/B5/B8/B12/B13/B18/B19/
B20/B25/B26/B27/B28/B66
Cat NB2 2):
LTE-FDD:
B1/B2/B3/B4/B5/B8/B12/B13/B17/B18/
B19/B20/B25/B28/B66
Power Class 3
(23 dBm ± 2.7 dB)
GPS, GLONASS
NOTES

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With a compact profile of 14.9 mm × 12.9 mm × 1.9 mm, BG772A-GL can meet almost all requirements
for M2M applications such as smart metering, tracking system, security, wireless POS, etc. It is especially
suitable for size and weight sensitive applications such as smart watch and other wearable devices.
BG772A-GL is an SMD type module which can be embedded into applications through its 94 LGA pads. It
supports internet service protocols like TCP, UDP and PPP. Extended AT commands have been
developed for customers to use these internet service protocols easily.
2.2. Key Features
Table 3: Key Features of BG772A-GL
Features
Details
Power Supply 1)
VBAT_BB: 2.2–4.35 V, typical 3.3 V
VBAT_RF: 3.1–4.2 V, typical 3.3 V
Transmitting Power
Class 3 (23 dBm ± 2.7 dB) for LTE-FDD bands
LTE Features
Supports 3GPP Rel-14*
Supports LTE Cat M1 and LTE Cat NB2*
Supports 1.4 MHz RF bandwidth for LTE Cat M1
Supports 200 kHz RF bandwidth for LTE Cat NB2
Cat M1: Max. 600 kbps (DL)/1000 kbps (UL)
Cat NB2*: Max. 120 kbps (DL)/140 kbps (UL)
Internet Protocol
Features
Supports PPP/TCP/UDP/SSL/TLS/FTP(S)/HTTP(S)/NITZ*/PING/
MQTT/LwM2M*/CoAP* protocols
Support PAP and CHAP for PPP connections
SMS
Text and PDU modes
Point-to-point MO and MT
SMS cell broadcast
SMS storage: ME by default
(U)SIM Interface
Supports 1.8 V USIM/SIM card only
PCM Interface*
Supports one digital audio interface: PCM interface for VoLTE only
USB Interface*
Compliant with USB 2.0 specification
Supports operation at full-speed (12 Mbps) only
UART Interfaces
Main UART:
Used for data transmission and AT command communication
115200 bps baud rate by default
The default frame format is 8N1 (8 data bits, no parity, 1 stop bit)
Supports RTS and CTS hardware flow control

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1. 1) When the module starts up normally, to ensure full-function mode, the minimum power supply
voltage should be higher than 3.1 V.
2. 2) Within the operating temperature range, the module meets 3GPP specifications.
3. 3) Within the extended temperature range, the module remains the ability to establish and maintain
functions such as voice*, SMS and data transmission, without any unrecoverable malfunction. Radio
spectrum and radio network are not influenced, while one or more specifications, such as Pout, may
exceed the specified tolerances of 3GPP. When the temperature returns to the operating temperature
range, the module meets 3GPP specifications again.
Debug UART:
Used for firmware upgrade, software debugging and log output
115200 bps baud rate by default
The default frame format is 8N1 (8 data bits, no parity, 1 stop bit)
Support RTS and CTS hardware flow control
AUX UART:
Used for RF calibration debugging and log output
921600 bps baud rate by default
The default frame format is 8N1 (8 data bits, no parity, 1 stop bit)
Supports RTS and CTS hardware flow control
GNSS*
GPS, GLONASS
AT Commands
3GPP TS 27.007 and 3GPP TS 27.005 AT commands
Quectel enhanced AT commands
Network Indication
One NET_STATUS pin for network connectivity status indication
Antenna Interfaces
Main antenna (ANT_MAIN) and GNSS antenna (ANT_GNSS) interfaces
Physical Characteristics
Dimensions: (14.9 ±0.2) mm × (12.9 ±0.2) mm × (1.9 ±0.2) mm
Package: LGA
Weight: TBD
Temperature Range
Operating temperature range: -35 °C to +75 °C 2)
Extended temperature range: -40 °C to +85 °C 3)
Storage temperature range: -40 °C to +90 °C
Firmware Upgrade
Debug UART
DFOTA*
RoHS
All hardware components are fully compliant with EU RoHS directive.
NOTES

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2.3. Functional Diagram
The following figure shows a block diagram of BG772A-GL and illustrates the major functional parts.
Power management
Baseband
Radio frequency
Peripheral interfaces
Figure 1: Functional Diagram
PCM and I2C interfaces are for VoLTE* only.
NOTE

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2.4. Evaluation Board
To facilitate application development with BG772A-GL conveniently, Quectel supplies the evaluation
board (EVB), USB to RS-232 converter cables, USB data cables, earphone, antennas and other
peripherals to control or test the module. For more details, see document [2].

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3Application Interfaces
BG772A-GL is equipped with 94 LGA pads that can be connected to customers’ cellular application
platforms. The subsequent chapters will provide detailed description of interfaces listed below:
Power supply
PON_TRIG interface*
(U)SIM interface
USB interface*
UART interfaces
PCM and I2C interfaces*
Status indication interfaces
ADC interfaces*
GPIO interfaces*