RadiSys PROCELERANT CE915GMA User manual

www.radisys.com
PROCELERANT®
CE915GM COM EXPRESS MODULE
PRODUCT MANUAL
007-02532-0004 • August 2010
CE915GMA
CE915GME
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Revision History
Release Date Description
-0000 April 2007 First edition. New CE915GM COM Express modules and thermal solutions.
-0001 July 2007 Second edition. PCI resource allocation information added.
-0002 August 2007 Third edition. Thermal validation procedures added.
-0003 November 2007 Fourth edition. Thermal design power requirements of Intel processors updated.
-0004 August 2010 Fifth edition. See What’s new in this manual on page 8 for a list of changes in this
edition.
© 2007—2010 by RadiSys Corporation. All rights reserved.
Portions of this manual are copyrighted by the PCI Industrial Computer Manufacturers Group, and are reprinted with
permission.
RadiSys and Procelerant are registered trademarks of RadiSys Corporation. PICMG is a registered trademark and COM
Express is a trademark of the PCI Industrial Computer Manufacturers Group. Intel, Pentium and Celeron are registered
trademarks. Micron is a registered trademark of Micron Technology, Inc. Microsoft, Windows, and Windows XP are
registered trademarks of Microsoft Corporation. Red Hat and Red Hat Linux are registered trademarks of Red Hat, Inc.
Linux is a registered trademark of Linus Torvalds. Phoenix is a registered trademark and TrustedCore is a trademark of
Phoenix Technologies. Broadcom is a registered trademark of Broadcom Corporation. Seagate and Seagate
Technology are registered trademarks of Seagate Technology LLC. Maxtor and DiamondMax are registered trademarks
of Maxtor Corporation. Dell is a registered trademark of Dell Inc. Logitech is a registered trademark of Logitech, Inc.
Philips is a trademark or registered trademark of Royal Philips Electronics. Huntkey is a registered trademark of
Huntkey Enterprise Group. MontaVista is a registered trademark of MontaVista Software, Inc.
All other trademarks, registered trademarks, service marks, and trade names are the property of their respective
owners.
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Preface.................................................................................................................................................7
About this manual........................................................................................................................................7
What’s new in this manual...........................................................................................................................8
Safety notices..............................................................................................................................................8
Electrostatic discharge.........................................................................................................................................8
Where to get more product information.......................................................................................................8
Chapter 1: Product Overview ............................................................................................................9
Product codes............................................................................................................................................10
COM Express modules......................................................................................................................................10
System memory.................................................................................................................................................10
Thermal options.................................................................................................................................................10
Module layout............................................................................................................................................11
Chapter 2: Product Specifications..................................................................................................13
Mechanical ................................................................................................................................................13
Component height between module and carrier board......................................................................................16
Physical interfaces.............................................................................................................................................16
Electrical....................................................................................................................................................17
Module power consumption...............................................................................................................................17
General Purpose I/O (GPIO) power consumption .............................................................................................20
Thermal design power...............................................................................................................................21
Regulatory compliance..............................................................................................................................21
Environmental compliance.................................................................................................................................21
EMC compliance................................................................................................................................................22
Safety compliance .............................................................................................................................................22
Industry compliance...........................................................................................................................................22
MTBF reliability prediction.........................................................................................................................22
Chapter 3: Hardware Reference......................................................................................................23
General specifications...............................................................................................................................23
Block diagram............................................................................................................................................24
Power supply.............................................................................................................................................25
TABLE OF CONTENTS
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Voltage requirements.........................................................................................................................................25
Inrush current.....................................................................................................................................................25
CPU...........................................................................................................................................................27
Voltage requirements.........................................................................................................................................27
Thermal requirements........................................................................................................................................27
Clock generator .................................................................................................................................................28
System memory.........................................................................................................................................28
Chipset......................................................................................................................................................28
Graphics Memory Controller Hub (GMCH)........................................................................................................28
I/O Controller Hub (ICH)....................................................................................................................................29
Video.........................................................................................................................................................29
PCI Express graphics........................................................................................................................................29
VGA...................................................................................................................................................................30
LVDS interface...................................................................................................................................................30
TV-Out (product option).....................................................................................................................................30
SDVO ports........................................................................................................................................................30
Audio.........................................................................................................................................................31
I/O..............................................................................................................................................................31
PCI Express interface........................................................................................................................................31
SATA controller..................................................................................................................................................31
PCI interface......................................................................................................................................................31
IDE.....................................................................................................................................................................32
USB controller....................................................................................................................................................32
Real-time clock (RTC)...............................................................................................................................32
Firmware hub.............................................................................................................................................32
10/100/1000BASE-T Ethernet controller ...................................................................................................33
Thermal sensor..........................................................................................................................................33
Power management...................................................................................................................................33
Advanced Configuration and Power Interface (ACPI)........................................................................................33
ACPI wake up....................................................................................................................................................34
BIOS operation mode configuration...........................................................................................................34
Miscellaneous indicators............................................................................................................................35
Reset LED.........................................................................................................................................................35
POST LED.........................................................................................................................................................35
Chapter 4: Thermal Solutions..........................................................................................................37
Active heatsinks.........................................................................................................................................37
Product package components...........................................................................................................................37
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Passive heatsinks......................................................................................................................................39
Product package components...........................................................................................................................39
Mechanical specification....................................................................................................................................40
Heat spreader............................................................................................................................................42
Thermal interface materials.......................................................................................................................42
Chapter 5: BIOS Configuration........................................................................................................43
POST and boot process............................................................................................................................43
BIOS setup................................................................................................................................................43
Update and recovery.................................................................................................................................44
BIOS customization...................................................................................................................................44
Appendix A: COM Express Module Pinout Definitions.................................................................45
Type 2 pinout definitions............................................................................................................................45
Appendix B: System Resources .....................................................................................................49
PCI resource allocation .............................................................................................................................49
Interrupts and GPIOs to CR100 carrier board...........................................................................................49
BIOS organization and system memory map............................................................................................50
POST checkpoint codes............................................................................................................................50
POST 80 codes .................................................................................................................................................50
Error message codes.........................................................................................................................................56
Appendix C: Industry Standard References...................................................................................59
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7
PREFACE
About this manual
This manual is written primarily for system engineers who will integrate the Procelerant®
CE915GM COM Express™ embedded computing module into their own products.
See the following resources for information on the CE915GM modules not described in
this manual:
•Installation and initial setup instructions. the Procelerant CE915GM COM Express
Module Quick Start Guide provides the steps for assembling a COM Express system.
When referenced in this manual, the simplified name of Quick Start Guide will be
used.
•BIOS configuration information. The Procelerant CE915GMA BIOS Setup Utility
Specification describes the BIOS setup utility interfaces and configuration options.
When referenced in this manual, the simplified name of BIOS Setup Utility
Specification will be used.
•Carrier design guidelines and thermal validation procedures. The Procelerant
CE915GM COM Express Carrier Board Design Guidelines describes specific
considerations and guidelines for designing a carrier board to use with the COM
Express module.
When referenced in this manual, the simplified name of Carrier Board Design
Guidelines will be used.
•Qualified memory list. The CE915GMA Qualified Memory List provides the memory
modules RadiSys®has validated for use with COM Express modules.
When referenced in this manual, the simplified name of Qualified Memory List will be
used.
•Firmware and software update information. BIOS and driver updates may be
available for the COM Express module from time to time. Detailed procedures on
updating the firmware and software are included in the corresponding release
packages.
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Preface
8
What’s new in this manual
This manual has been updated with the following changes.
• New modules based on the Intel®915GME chipset have been added. See CE915GM
product codes on page 10 for details.
• A new section in this preface has been added to describe the resources available for
further information about the CE915GM modules.
For additional information about new features, resolved issues, and known limitations,
refer to the CE915GM COM Express Module Product Notes.
Safety notices
Electrostatic discharge
WARNING! This product contains static-sensitive components and should be handled with
care. Failure to employ adequate anti-static measures can cause irreparable damage to
components.
Electrostatic discharge (ESD) damage can result in partial or complete device failure,
performance degradation, or reduced operating life. To avoid ESD damage, the following
precautions are strongly recommended.
• Keep each module/PCB in its ESD shielding bag until you are ready to install it.
• Before touching a module, attach an ESD wrist strap to your wrist and connect its
other end to a known ground.
• Handle the module only in an area that has its working surfaces, floor coverings, and
chairs connected to a known ground.
• Hold modules only by their edges and mounting hardware. Avoid touching PCB
components and connector pins.
For further information on ESD, visit www.esda.org.
Where to get more product information
Visit the RadiSys web site at www.radisys.com for product information and other
resources. Downloads (manuals, release notes, software, etc.) are available at
www.radisys.com/downloads.
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9
1PRODUCT OVERVIEW
The Procelerant CE915GM COM Express embedded computing module is a standard form
factor (“basic module” with type 2 pinouts) Computer on Module (COM) mezzanine
board, compliant with PICMG®COM Express Module Base Specification Version 1.0.
COM Express modules enable high reuse and interchangeability of COM Express modules
and carrier boards, and hence reduce time-to-market by removing the embedded
computing module from the list of major components to design, which in turn lowers
costs. The modularity also lets you react to feature changes in the market, demand
fluctuations, and performance upgrades in addition to streamlining service and repair
inventories.
The CE915GMA series modules are designed around the Intel®Celeron®M and Pentium®
M processors, mobile 915GM/915GME Express chipset, and ICH6-M chipset, and supports
Microsoft®Windows®XP, Windows XP Embedded, and Red Hat®Desktop Linux®
operating systems.
Note: The CE915GME module uses the Intel 915GME chipset, which does not support TV-
Out or Microvision® Analog Copy Protection.
Figure 1. COM Express module and carrier board
COM Express Module CR100 Carrier Board
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1
Product Overview
10
Unless otherwise noted in this manual:
• CE915GM represents both CE915GMA and CE915GME modules.
• GMCH chipset represents both Intel 915GM and 915GME chipsets.
• ICH chipset represents the Intel ICH6-M chipset.
Product codes
Check the CE915GM product page on the RadiSys Web site or contact your sales
representative for the latest information about product offerings.
COM Express modules
All CE915GM modules are RoHS compliant. Each module contains one SO-DIMM memory
module socket.
System memory
CE915GM modules require one memory module to operate. For a list of system memory
options that have been validated for use with CE915GM modules, refer to the Procelerant
CE915GM Qualified Memory List.
See System memory on page 28 for general specifications.
Thermal options
The CE-AHSA active heatsink, CE-PHSA, and CE-PHS17A passive heatsinks, and CE-HSPA
heat speader are specifically designed for CE915GM modules.
SeeChapter 4, Thermal Solutions, on page 37 for detailed information.
Table 1. CE915GM product codes
Product series Product code Intel platform SDRAM Operating temperature
CE915GMA CE760A-0 • Intel 2.2GHz Pentium
M 760 processor
• Mobile Intel 915GM chipset None 0° C to 60° C
CE738A-0 •Intel
1.4GHz LV Pentium M 738 processor
• Mobile Intel 915GM chipset None 0° C to 60° C
CE738A-E-512 •Intel
1.4GHz LV Pentium M 738 processor
• Mobile Intel 915GM chipset 512MB -25°C to 70°C
CE370A-0 •Intel
1.5GHz Celeron M 370 processor
• Mobile Intel 915GM chipset None 0° C to 60° C
CE373A-0 •Intel
1.0GHzULVCeleronM373processor
• Mobile Intel 915GM chipset None 0° C to 60° C
CE915GME CE738B-0 •Intel
1.4GHz LV Pentium M 738 processor
• Mobile Intel 915GME chipset None 0° C to 60° C
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1
Module layout
11
Module layout
Figure 2. Module layout: top view
CPU
DDR2 SO-DIMM
memory socket
Phoenix FirstBIOS
Notebook (Pro) BIOS ROM
Intel 82573V
Ethernet controller
Intel ICH6M
Mobile Intel 915GM
Express chipset
Header for clearing CMOS
and recovering BIOS
Reset LED (D4)
POST LED (D5)
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1
Product Overview
12
Figure 3. Module layout: bottom view
Board-to-board
interconnectors
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13
2PRODUCT SPECIFICATIONS
Mechanical
The size of the CE915GM modules’ printed circuit board (PCB) is 95mm x 125mm, which
complies with the Basic Module Size outlined in the PICMG COM Express Specification
Revision 1.0. The thickness of the PCB is 0.079 inch [2mm].
Figure 4—Figure 7 show the form factor and envelope dimensions of CE915GM modules
in millimeters [inches]. The holes shown are intended for mounting the module and
thermal solution to the carrier board.
The dimension tolerance is ±0.25mm. The tolerance of the locating peg holes on the
board-to-board interconnector (dimensions [16.50, 6.00] and [16.50, 18.00]) is ±0.10mm.
Figure 4. Basic form factor
95.00 [3.740]
91.00 [3.583] 91.00 [3.583]
0 [.000]
[000.] 0
18.00 [.709]
6.00 [.236]
4.00 [.157]
Pin D1
Pin A1
125.00 [4.921] 121.00 [4.764] 80.00 [3.150] 16.50 [.650] 4.00 [].157
Board-to-board interconnector
is on opposite side of the board
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Product Specifications
14
Figure 5. CE915GM envelope dimensions: top view
0 [.00]
80 3.15]
121 [4.76] 125 [4.92]
4 [.157]
37.35 [1.470]
0 [.000]
4 [.157]
40.26 [1.585]
43.43 [1.710]
65 [2.559]
59.52 [2.343]
91 [3.58]
95 [3.740]
6x 2.69 [.106]
4 [.16] 16.8 [.66]
4x 2.21 [.087]
57.85 [2.277]
78.35 [3.085]
91 [3.58]
121 [4.76]
122.1 [4.81]
104.1 [4.10]
86.1 [3.39] 56.5 [2.23]
47.6 [1.88]
Max SO-DIMM height = 30 [1.181]
DDR2 200-pin 1.8V
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Mechanical
15
Figure 6. CE915GM envelope dimensions: bottom view
Figure 7. CE915GM component dimensions: top view
Backer plate option
supplied w/M2 screws
74.2 [2.921]
16.5 [.650]
0 [.000]
0 [.000]
6 [.236]
18 [.709]
2 x 0.89 [.035]
2 x 1.6[.063]
Locating posts for
440-pin receptacle
Pentium M or Celeron M processor
BGA height = 2.85 [.112] Max
2.60 [.102] Min
440-pin board-to-board interconnector
stack height from carrier: 5.0 [.197]
3.8 [.15] Max height
bottom-side components
GMCH
Graphics and Memory Controller Hub
BGA height - 2.60 [.102] Max
2.24 [.088] Min
ICH6-M
I/O Controller Hub
BGA height = 2.49 [.098] Max
2.07 [.081] Min
DDR2 SO-DIMM socket height
5.3 [.21] Max
5.0 [.20] Min
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2
Product Specifications
16
Component height between module and carrier board
Parts mounted on the bottom surface of CE915GM modules (between the module and
the carrier board) have a maximum height of 3.8mm. This affects the maximum allowable
height of carrier board components underneath the module.
• If the carrier board has module-to-carrier interconnectors 5mm in height, the
clearance between the carrier board and the bottom surface of the module’s PCB is
5mm. This limits the height of carrier board components underneath the module to
1mm.
• If the carrier board has module-to-carrier interconnectors 8mm in height, the
clearance between the carrier board and the bottom surface of the module’s PCB is
8mm. This allows the use of carrier board components underneath the module up to
4mm in height.
Physical interfaces
DDR2 SO-DIMM slot
The 200-pin DDR2 SDRAM SO-DIMM memory slot complies with the JEDEC standard. For
pinout definitions, refer to the JEDEC DDR2 Specification at www.jedec.org.
Board-to-board interconnectors
The CE915GM board-to-board interconnector complies with the PICMG COM Express
Base Specification Version 1.0. For pinout definitions of the board-to-board
interconnector and required/optional features of COM Express pinout type 2, see
Appendix A, COM Express Module Pinout Definitions, on page 45.
If you are designing a custom carrier board for CE915GM modules, refer to the Carrier
Board Design Guidelines for special notes.
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2
Electrical
17
Electrical
Module power consumption
The amount of power consumed by CE915GM modules is highly dependent on the
processor, memory, attached devices, software in use, and power state that the module is
in. Sample measurements were taken using the CR100 carrier board as follows:
• Power consumption of CE915GM modules in these samples includes the power
dissipation of the CPU and memory.
• Power consumption of the CR100 carrier board in this sample includes the power
dissipation of the CR100 carrier board itself, a hard disk, a PCI-based POST 80 card,
USB attachments, and a monitor.
• The total system power consumption includes CE915GM modules, CR100 carrier
board, and devices attached to the CR100 carrier board.
Test system configuration
All models of the CE915GM module were tested with this system configuration.
• Carrier board: Procelerant CR100 FlexATX
•Memory:Micron®, MT16HTF12864HY-53EB3, DDR2, 533MHz, CL4, 1GB
• Hard disk: Seagate®, ST3808110AS (80GB)
• Keyboard: Logitech®Y-SJ17, PS/2
•Mouse:Logitech®M-SBF83, USB
• Monitor: Dell®M992
• ATX PSU: Segotep®SG-400ATX-APF
• Operating system: Microsoft Windows XP Professional SP2
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2
Product Specifications
18
CE760A power dissipation
CE738A power dissipation
Main Rail Current Consumption +3.3V +5V +12V +5VSB System
consumption
Current (A) Current (A) Current (A) Current (A) Watts
Specification Min —————
Max ——7.5 1.0 —
Enter DOS (Stable) 0.43 0.37 1.04 0.063 16.08
Enter BIOS Setup (Stable) 0.43 0.32 2.04 0.062 27.82
Boot to Windows XP (Max) 0.47 0.29 2.31 0.246 31.92
At Windows Desktop Idle (Stable) 0.47 0.29 1.33 0.063 19.29
Running CPU Stress (Max) 0.47 0.29 2.40 0.065 32.10
Running Windows Stress (Max) 0.47 0.29 2.79 0.066 36.76
ShutdownfromWindows (Max) 0.47 0.29 2.16 0.066 29.24
Power Off S5 (Stable) 0.00 0.00 0.00 0.182 0.91
Standby mode S3 (Stable) 0.00 0.00 0.00 0.217 1.08
Hibernate mode S4 (Stable) 0.00 0.00 0.00 0.181 0.90
Main Rail Current Consumption +3.3V +5V +12V +5VSB System
consumption
Current (A) Current (A) Current (A) Current (A) Watts
Specification Min —————
Max ——7.5 1.0 —
Enter DOS (Stable) 0.43 0.39 1.15 0.034 17.34
Enter BIOS Setup (Stable) 0.43 0.39 0.86 0.034 13.90
Boot to Windows XP (Max) 0.43 0.39 1.20 0.034 17.94
At Windows Desktop Idle (Stable) 0.47 0.39 0.82 0.034 13.51
Running CPU Stress (Max) 0.47 0.46 1.48 0.034 21.72
Running Windows Stress (Max) 0.47 0.39 1.40 0.034 20.47
ShutdownfromWindows (Max) 0.47 0.39 1.16 0.034 17.59
Power Off S5 (Stable) 0.00 0.00 0.00 0.183 0.91
Standby mode S3 (Stable) 0.00 0.00 0.00 0.216 1.08
Hibernate mode S4 (Stable) 0.00 0.00 0.00 0.184 0.92
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2
Module power consumption
19
CE373A power dissipation
CE370A power dissipation
Main Rail Current Consumption +3.3V +5V +12V +5VSB System
consumption
Current (A) Current (A) Current (A) Current (A) Watts
Specification Min —————
Max ——7.5 1.0 —
Enter DOS (Stable) 0.25 0.69 0.95 0.040 15.92
Enter BIOS Setup (Stable) 0.25 0.71 0.94 0.040 15.79
Boot to Windows XP (Max) 0.29 0.71 1.43 0.040 21.92
At Windows Desktop Idle (Stable) 0.29 0.67 0.80 0.040 14.11
Running CPU Stress (Max) 0.29 0.75 1.13 0.040 18.48
Running Windows Stress (Max) 0.29 0.75 1.34 0.040 20.98
ShutdownfromWindows (Max) 0.29 0.72 1.12 0.040 18.20
Power Off S5 (Stable) 0.00 0.00 0.00 0.164 0.82
Standby mode S3 (Stable) 0.00 0.00 0.00 0.198 0.99
Hibernate mode S4 (Stable) 0.00 0.00 0.00 0.179 0.89
Main Rail Current Consumption +3.3V +5V +12V +5VSB System
consumption
Current (A) Current (A) Current (A) Current (A) Watts
Specification Min —————
Max ——7.5 1.0 —
Enter DOS (Stable) 0.25 0.65 1.42 0.054 21.39
Enter BIOS Setup (Stable) 0.25 0.67 1.40 0.055 21.25
Boot to Windows XP (Max) 0.29 0.74 1.60 0.057 24.14
At Windows Desktop Idle (Stable) 0.29 0.68 1.06 0.054 17.35
Running CPU Stress (Max) 0.29 0.68 1.93 0.054 27.79
Running Windows Stress (Max) 0.29 0.67 1.90 0.054 27.38
ShutdownfromWindows (Max) 0.29 0.67 1.56 0.054 23.30
Power Off S5 (Stable) 0.00 0.00 0.00 0.139 0.70
Standby mode S3 (Stable) 0.00 0.00 0.00 0.188 0.94
Hibernate mode S4 (Stable) 0.00 0.00 0.00 0.155 0.78
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2
Product Specifications
20
CE738B power dissipation
General Purpose I/O (GPIO) power consumption
GPIO input
GPIO output
Main Rail Current Consumption +3.3V +5V +12V +5VSB System
consumption
Current (A) Current (A) Current (A) Current (A) Watts
Specification Min —————
Max ——7.5 1.0 —
Enter DOS (Stable) 0.43 0.39 1.15 0.034 17.34
Enter BIOS Setup (Stable) 0.43 0.39 0.86 0.034 13.90
Boot to Windows XP (Max) 0.43 0.39 1.20 0.034 17.94
At Windows Desktop Idle (Stable) 0.47 0.39 0.82 0.034 13.51
Running CPU Stress (Max) 0.47 0.46 1.48 0.034 21.72
Running Windows Stress (Max) 0.47 0.39 1.40 0.034 20.47
ShutdownfromWindows (Max) 0.47 0.39 1.16 0.034 17.59
Power Off S5 (Stable) 0.00 0.00 0.00 0.183 0.91
Standby mode S3 (Stable) 0.00 0.00 0.00 0.216 1.08
Hibernate mode S4 (Stable) 0.00 0.00 0.00 0.184 0.92
GPIO Name Type VIH
1
1
VIH: Input High Voltage
VIL
2
2
VIL: Input Low Voltage
Min Max Min Max
GPI0 Input 2.0V 3.6V -0.5V 0.8V
GPI1 Input 2.0V 3.6V -0.5V 0.8V
GPI2 Input 2.0V 3.6V -0.5V 0.8V
GPI3 Input 2.0V 3.6V -0.5V 0.8V
GPIO Name Type VOH
1
(Min)
1
VOH: Output High Voltage
VOL
2
(Max)
2
VOL: Output Low Voltage
IOL
3
/IOH
4
3
IOL: Input Leakage Current
4
IOH: Output High Current
GPO0 Output 2.8V 0.4V 4mA/-2mA
GPO1 Output 2.8V 0.4V 4mA/-2mA
GPO2 Output 2.8V 0.4V 4mA/-2mA
GPO3 Output 2.9V 0.33V 1.5mA/-0.5mA
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