RadiSys EPC-3311 Application guide

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Find the RadiSys EPC-3311 at our website: Click HERE

007-01289-0005• November 2003
www.radisys.com
EPC® -3311 Hardware
Reference
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November2003
Copyright ©2003 by RadiSys Corporation.
All rights reserved.
EPC and RadiSys are registered trademarks of RadiSys Corporation. ASM, Brahma, DAI, DAQ, MultiPro, SAIB, Spirit, and ValuePro are
trademarks of RadiSys Corporation.
DAVID, MAUI, OS-9, OS-9000, and SoftStax are registered trademarks of RadiSys Microware Communications Software Division, Inc.
FasTrak, Hawk, and UpLink are trademarks of RadiSys Microware Communications Software Division, Inc.
† All other trademarks, registered trademarks, service marks, and trade names are the property of their respective owners.
Safety
To avoid the risk of fire or electric shock, carefully
follow the instructions provided in this manual.
Important
Always use caution when handling or operating
the equipment. Only qualified and trained
electronics service personnel should access the
equipment. Use extreme caution when installing
or removing components. For additional
information, please contact RadiSys Technical
Support at 866–385–6167 Monday through
Friday between 6:00 a.m. and 5:00 p.m., PST,
continental USA.
Wichtig
Arbeiten am System bzw. Betrieb des Systems,
sollten immer mit der nötigen Vorsicht
vorgenommen werden. Nur qualifiziertes und
ausgebildetes Fachpersonal sollte am Inneren
des Gerätes arbeiten. Beim Installieren und
Entfernen von Komponenten ist besondere
Vorsicht geboten.
Für weitere Informationen wenden Sie sich bitte
an den Technical Support von RadiSys:
• USA : 866–385–6167 Montags bis Freitags
von 0600 Uhr bis 1700 Uhr,
Pacific USA.
• International : [phone] Montags bis
Freitags von 0830 Uhr bis 1700 Uhr. (CET
GMT +1.00)
Changes or modifications not expressly
approved by RadiSys Corporation could void the
product warranty and the user’s authority to
operate the equipment.
Notice
This equipment has been tested and found to
comply with the limits for a Class B digital device,
pursuant to Part 15 of the FCC Rules. These limits
are designed to provide reasonable protection
against harmful interference when the equipment
is operated in a residential environment.
This equipment generates, uses, and can emit
radio frequency energy and, if not installed and
used in accordance with this instruction manual,
may cause harmful interference to radio
communications. However, there is no guarantee
that interference will not occur in a particular
installation. If this equipment does cause harmful
interference to radio or television reception,
which can be determined by turning the
equipment off and on, the user is encouraged to
try to correct the interference by one or more of
the following measures:
• Reorient the receiving antenna
• Relocate this equipment in relation to the
receiver
• Place the AC power connection for this
equipment on another circuit
Any change or modification not expressly
approved by the manufacturer is prohibited and
could void the user’s authority to operate the
equipment.
Shielded interface cables, if any, must be used in
order to comply with the emission limits. Use of
non-shielded cables may result in interference to
TV and radio reception. The following booklet
prepared by the FCC may be helpful.
“How to Identify and Resolve Radio-TV
Interference Problems”
This booklet is available from the U.S.
Government Printing Office, Washington, D.C.
20402, Stock No. 004-000-003454.
This product also meets requirements for
compliance with EN55022 and EN55024,
Class B ITE.
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iii
Before you begin
This guide describes the EPC®-3311, a high performance single-slot CompactPCI†
board that operates as either a host or task processor. It is fully compliant with
PICMG†2.16 for use with packet-switched backplanes and the dual Gigabit
Ethernet channels offer maximum bandwidth to the backplane.
This book is for hardware and software designers, programmers, engineers, and
those with a knowledge of electronics and/or programming who need to understand
the operation of the EPC-3311.
About this guide
Contents
Chapter/appendix Description
1Introduction Introduces the EPC-3311 and briefly describes its
features and functions.
2Installation and operation Explains how to install the EPC-3311 in a
CompactPCI mainframe.
3BIOS configuration Explains how to configure the BIOS using the
built-in BIOS setup menus.
5Theory of operation Describes how EPC-3311 components provide a
CompactPCI bus compatible embedded computer
with standard PC peripherals plus PCI and ISA
interfaces.
6RTMs Describes how to install, configure, and use the
Rear Transition Module (RTM).
7Hardware management Provides hardware management information.
AChipset and I/O map Maps the addresses used for I/O and by the
chipset registers.
BInterrupts Shows the EPC-3311’s interrupt assignments.
CFlash memory addresses Lists the EPC-3311 flash chip’s major sections.
DConnectors Details the location, function, and pin-outs of the
EPC-3311’s connectors and LEDs.
EMessages Explains common error messages and start-up codes.
FPMC modules Describes how to install an optional PMC module.
GCompactFlash cards Describes how to install, configure, and use the
optional CompactFlash card.
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EPC® -3311 Hardware Reference
iv
Notational conventions
This manual uses the following conventions:
•Screen text and syntax strings appear in this font.
• All numbers are decimal unless otherwise stated.
• Bit 0 is the low-order bit. If a bit is set to 1, the associated description is true
unless otherwise stated.
Where to get more information
About the EPC-3311
You can find out more about EPC-3311 from these sources:
•World Wide Web: RadiSys maintains an active site on the World Wide Web. The
site contains current information about the company and locations of sales
offices, new and existing products, contacts for sales, service, and technical
support information. You can also send e-mail to RadiSys using the web site.
HFPGA features register set
Maps the address space used by the FPGA registers.
IRe-programming the
flash chip
Explains how to update or recover your system
BIOS by re-programming all or part of the
EPC-3311’s flash chip
Chapter/appendix Description
Notes indicate important information
about the product.
Tips indicate alternate techniques or
procedures that you can use to save
time or better understand the product.
The globe indicates a World Wide
Web address.
The book indicates a book or file.
ESD cautions indicate situations that
may cause damage to hardware via
electro-static discharge (ESD).
Cautions indicate potentially
hazardous situations which, if not
avoided,
may result in minor or
moderate injury, or damage to
data or hardware. It may also
alert you about unsafe practices.
Warnings indicate potentially
hazardous situations which, if not
avoided,
can result in death or
serious injury.
Danger indica tes imminently
hazardous situations which, if not
avoided,
will result in death or
serious injury.
RadiSys web site
When sending e-mail for technical support, please include information
about both the hardware and software, plus a detailed description of the
problem, including how to reproduce it.
To access the RadiSys web site, enter this URL in your web browser:
http://www.radisys.com
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Before you begin
v
Requests for sales, service, and technical support information receive
prompt response.
•Other: If you purchased your RadiSys product from a third-party vendor, you
can contact that vendor for service and support.
About related RadiSys products
82600 High Performance System Controller
A member of the RadiSys family of long-life embedded PC compatible core logic.
the 82600 is a highly integrated single chip implementation of all requirements of a
high performance Compact PCI Central Resource and Peripheral Bridge including
the North Bridge, South Bridge, PCI to PCI Bridge, and a selected set of Super I/O
functions targeted at embedded, PC-compatible systems. It supports Intel Celeron†,
Pentium II, and Pentium III processors with 66MHz, 100MHz and 133MHz system
bus frequencies.
CP50 chassis
A 9-U tall rack-mountable CompactPCI chassis that incorporates packet-switching
technology, the CP50 is NEBS-compliant and provides a highly available, fault-
tolerant platform through redundancy, system management reporting, and effective
thermal design.
The chassis is an industry-standard, 19" wide housing that accomodates the system
modules and provides power and communications busing for these components via
a 21-slot wide backplane.
MM50 IDE Media Module
The MM50 IDE Media Module is a 4HP module used in CompactPCI systems
which incorporates these features:
• Support for these IDE device types:
• Notebook-style 2.5" IDE hard drives.
• Notebook-style ATAPI CD-RW or ATAPI CD-RW/DVD.
• Support for these options:
• MM50-01: Two 2.5" IDE drives (on a single bus).
• MM50-02: One 2.5" IDE drive and one CD-RW or CD-RW/DVD drive (on
a single bus).
• System Management support, using a microcontroller.
• A companion RTM which supports a dual-IDE MM50.
• Support for dual IPMBs (Intelligent Platform Management Buses).
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EPC® -3311 Hardware Reference
vi
ESM/EFM-31xx blades
Single-slot CompactPCI PICMG 2.16 compliant Layer 2 and Layer 3 switches that
feature 24 Fast Ethernet link ports, 4Gb up-links, and integrated platform
management.
Other
PICMG
CompactPCI specification, PICMG. For information about PICMG and the
CompactPCI standard, consult the PICMG website at this URL:
PCI architecture
PCI System Architecture, Fourth Edition, published by Addison-Wesley and
authored by Mindshare, Inc.
PCI specifications, available at the PCI SIG web site:
http://www.picmg.org
www.pcisig.com
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vii
Contents
Before you begin
About this guide ............................................................................................................................... iii.
Notational conventions .............................................................................................................. iv.
Where to get more information......................................................................................................... iv.
About the EPC-3311 .................................................................................................................. iv.
About related RadiSys products ................................................................................................. v.
82600 High Performance System Controller........................................................................ v.
CP50 chassis ........................................................................................................................ v.
MM50 IDE Media Module.................................................................................................. v.
ESM/EFM-31xx blades ....................................................................................................... vi.
PICMG ................................................................................................................................ vi.
PCI architecture ................................................................................................................... vi.
Chapter 1: Introduction
Features ............................................................................................................................................ 3.
External interfaces...................................................................................................................... 4.
Specifications .................................................................................................................................... 5.
System specifications .................................................................................................................. 5.
Environmental............................................................................................................................ 6.
Additional specifications ............................................................................................................ 7.
Chapter 2: Installation and operation
Before you begin............................................................................................................................... 10.
Setting jumpers and headers ............................................................................................................. 11.
Manufacturing header (J4) ...................................................................................................... 11.
ROM_TOP (J7) ...................................................................................................................... 12.
H8 Programming header (J8) ................................................................................................... 12.
POST header (P1) ..................................................................................................................... 13.
Inserting the EPC-3311..................................................................................................................... 13.
Operation ......................................................................................................................................... 14.
Powering on the system .............................................................................................................. 14.
Hot insertion/Hot swapping....................................................................................................... 15.
Post-installation troubleshooting ...................................................................................................... 15.
Maintaining and upgrading the EPC-3311........................................................................................ 15.
Extracting the EPC-3311............................................................................................................ 15.
Dis-assembling the EPC-3311 .................................................................................................... 16.
Replacing the battery ............................................................................................................... 16.
Installing other options .............................................................................................................. 17.
Re-assembling the EPC-3311 ..................................................................................................... 17.
Peripheral devices ............................................................................................................................. 18.
Chapter 3: BIOS configuration
BIOS setup screens............................................................................................................................ 19.
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EPC® -3311 Hardware Reference
viii
Navigation ................................................................................................................................. 20.
Main Setup menu ............................................................................................................................. 21.
IDE Configuration sub-menu ..................................................................................................... 22.
Primary Master/Slave sub-menus ......................................................................................... 24.
Console Redirection sub-menu .................................................................................................. 28.
Boot Options sub-menu ........................................................................................................... 29.
Keyboard Features sub-menu ..................................................................................................... 31.
Advanced menu ................................................................................................................................ 32.
Advanced Chipset Control sub-menu ......................................................................................... 34.
PCI Configuration sub-menu......................................................................................................36.
PCI/PNP ISA IRQ Resource Exclusion sub-menu ................................................................ 38.
Boot menu ........................................................................................................................................ 39.
Exit menu ......................................................................................................................................... 41.
Chapter 4: MBA configuration
Requirements.................................................................................................................................... 43.
MBA features: ............................................................................................................................ 44.
MBA setup screens............................................................................................................................ 44.
Boot failure ................................................................................................................................ 44.
Navigation ................................................................................................................................. 45.
MBA configuration options ....................................................................................................... 46.
Chapter 5: Theory of operation
Organization..................................................................................................................................... 50.
Block diagram ............................................................................................................................ 50.
Features ............................................................................................................................................ 51.
CPU ........................................................................................................................................... 51.
RadiSys 82600 ........................................................................................................................... 51.
Power-up configuration ....................................................................................................... 51.
Host bridge.......................................................................................................................... 52.
Memory subsystem .............................................................................................................. 52.
PCI interrupts ...................................................................................................................... 53.
Dual PCI bus architecture .................................................................................................... 53.
IDE ...................................................................................................................................... 56.
RTC (Real Time Clock) ....................................................................................................... 56.
System battery ..................................................................................................................... 56.
USB...................................................................................................................................... 56.
Keyboard and mouse controller ........................................................................................... 56.
System Management bus...................................................................................................... 56.
Hot Swap and system management ............................................................................................ 57.
Hot Swap............................................................................................................................. 57.
High availability .................................................................................................................. 58.
IPMI management system ..........................................................................................................59.
Local I2C ............................................................................................................................. 59.
Power......................................................................................................................................... 59.
System management power.................................................................................................. 60.
HMC hardware watchdog ................................................................................................... 61.
Optional features.............................................................................................................................. 62.
Optional peripheral accessories .................................................................................................. 62.
RTM peripheral connections ............................................................................................... 62.
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Contents
ix
Optional board-mounted accessories.......................................................................................... 63.
Hard disk drives......................................................................................................................... 63.
Hard disk drive options ....................................................................................................... 63.
IDE disks ............................................................................................................................. 64.
Ultra DMA .......................................................................................................................... 64.
Chapter 6: RTMs
Features ............................................................................................................................................ 66.
Installation and configuration........................................................................................................... 67.
Before you begin ........................................................................................................................ 67.
Inserting the RTM...................................................................................................................... 68.
Removing the RTM ................................................................................................................... 68.
Block diagram................................................................................................................................... 69.
RTM connectors............................................................................................................................... 70.
Connector locations ................................................................................................................... 70.
CompactPCI connectors (J3 and J5)........................................................................................... 71.
J5 connector ........................................................................................................................ 71.
J3 connector ........................................................................................................................ 72.
Ethernet connectors.................................................................................................................... 73.
Link/activity LEDs ............................................................................................................... 73.
IDE header (internal).................................................................................................................. 74.
Keyboard and mouse connectors................................................................................................ 74.
PIM connector ........................................................................................................................... 75.
RS-232 DE-9 connector ............................................................................................................ 76.
USB connector............................................................................................................................ 76.
Chapter 7: Hardware management
Overview .......................................................................................................................................... 77.
Local management services ............................................................................................................... 78.
Sensor monitoring ...................................................................................................................... 78.
Controls ..................................................................................................................................... 79.
Managed Hot Swap ................................................................................................................... 79.
Fault annunciation ..................................................................................................................... 79.
Status LEDs................................................................................................................................ 80.
Watchdog................................................................................................................................... 80.
FRU inventory area .................................................................................................................... 80.
SEL (System Event Log) ............................................................................................................. 81.
Host interface............................................................................................................................. 81.
Appendix A: Chipset and I/O map
I/O map ............................................................................................................................................ 83.
Memory map .................................................................................................................................... 84.
PCI I/O space ............................................................................................................................. 85.
Appendix B: Interrupts
Appendix C: Flash memory addresses
Appendix D: Connectors
Connector locations.......................................................................................................................... 92.
CompactPCI connectors ................................................................................................................... 93.
J1 connector............................................................................................................................... 94.
J2 connector............................................................................................................................... 95.
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EPC® -3311 Hardware Reference
x
J3 connector............................................................................................................................... 96.
J5 connector............................................................................................................................... 97.
PMC connectors ............................................................................................................................... 98.
Jn1 connector ............................................................................................................................ 98.
Jn2 connector ............................................................................................................................ 99.
Serial port......................................................................................................................................... 100.
LEDs ........................................................................................................................................ 100.
IDE header (internal) ........................................................................................................................ 101.
CompactFlash socket ................................................................................................................. 102.
Reset button............................................................................................................................... 102.
Appendix E: Messages
Appendix F: PMC modules
Installing a PMC module on the main board .................................................................................... 105.
Disconnecting the PMC module........................................................................................................ 106.
Appendix G: CompactFlash cards
Appendix H: FPGA features register set
BIOS Control/Status register (0x100) ........................................................................................ 112.
FPGA RSI (Register Set Index) register (0x185) ........................................................................ 113.
FPGA Register Set Data Port register (0x187) ........................................................................... 113.
Index 04—Reset Event register (0x04) ...................................................................................... 114.
Index 05—Local Interrupt Control/Status register (0x05) ......................................................... 115.
Index 06—Reset Control register (0x06) ................................................................................... 116.
EPC-3311 General Purpose Control register (0x07) .................................................................. 117.
Index 08—Boot ROM Access Control register (0x08) .............................................................. 118.
Index 09—Reserved register (0x09) .......................................................................................... 119.
Index 0A—ROM Program Control register (0x0A) .................................................................. 120.
Appendix I: Re-programming the flash chip
Aboutthe flash chip ......................................................................................................................... 123
Selectingare-programming method.................................................................................................. 125
Before you begin............................................................................................................................... 126
Obtain filesfrom RadiSys................................................................................................................. 127
Updatethe BIOS program................................................................................................................. 129
UpdateCrisis Reflash program......................................................................................................... 129
Perform CrisisReflashfrom serial port............................................................................................. 130
Perform CrisisReflashfrom LS-120 drive......................................................................................... 132
DOS restrictions ............................................................................................................................... 134
Glossary ...................................................................................................................... 135
Index............................................................................................................................. 143
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Contents
xi
Figures
Figure 1-1. The EPC-3311....................................................................................................................... 1.
Figure 2-1. EPC-3311: jumper locations.................................................................................................. 11.
Figure 2-2. Manufacturing header settings .............................................................................................. 11.
Figure 2-3. ROM_TOP jumper settings................................................................................................... 12.
Figure 2-4. H8 Programming header settings .......................................................................................... 12.
Figure 2-5. P1 POST header settings ....................................................................................................... 13.
Figure 3-1. BIOS Main Setup menu......................................................................................................... 21.
Figure 3-2. IDE Configuration sub-menu ................................................................................................ 22.
Figure 3-3. Primary Master/Slave sub-menus........................................................................................... 24.
Figure 3-4. Console Redirection sub-menu.............................................................................................. 28.
Figure 3-5. Boot Options sub-menu ........................................................................................................ 29.
Figure 3-6. Keyboard Features sub-menu ................................................................................................ 31.
Figure 3-7. Advanced menu..................................................................................................................... 32.
Figure 3-8. Advanced Chipset Control sub-menu .................................................................................... 34.
Figure 3-9. PCI Configuration sub-menu................................................................................................. 36.
Figure 3-10. PCI/PNP ISA IRQ Resource Exclusion sub-menu ................................................................ 38.
Figure 3-11. Boot menu........................................................................................................................... 39.
Figure 3-12. Exit menu............................................................................................................................ 41.
Figure 4-1. MBA menu............................................................................................................................ 46.
Figure 5-1. EPC-3311: block diagram ..................................................................................................... 50.
Figure 6-1. RTMs: block diagram ........................................................................................................... 69.
Figure 6-2. RTM: connectors .................................................................................................................. 70.
Figure C-1. Flash chip memory addresses................................................................................................ 89.
Figure D-1. EPC-3311 connector locations ............................................................................................. 92.
Figure F-1. Installing a PMC module....................................................................................................... 106.
Figure F-2. Removing a PMC module ..................................................................................................... 107.
Figure G-1. Inserting a CompactFlash card ............................................................................................. 110.
Figure I-1. Flash chip memory addresses ................................................................................................. 121.
Figure I-2. Flash chip re-programming coverage...................................................................................... 122.
Figure I-3. Flash chip re-programming process flow................................................................................ 123.
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EPC® -3311 Hardware Reference
xii
Tables
Table 1-1. System specifications .............................................................................................................. 5.
Table 1-2. Environmental specifications.................................................................................................. 6.
Table 1-3. Additional EPC-3311 specifications ....................................................................................... 7.
Table 2-1. Attaching peripheral devices................................................................................................... 18.
Table 5-1. PCI devices............................................................................................................................. 53.
Table 5-2. 82600 SMbus I2C address assignments..................................................................................57.
Table 6-1. CompactPCI J5 connector (RTM).......................................................................................... 71.
Table 6-2. CompactPCI J3 connector (RTM).......................................................................................... 72.
Table 6-3. Ethernet RJ-45 10BASE-T and 100BASE-T operation............................................................ 73.
Table 6-4. Ethernet RJ-45 1000BASE-T operation..................................................................................73.
Table 6-5. Port LEDs .............................................................................................................................. 73.
Table 6-6. IDE header pin assignments ................................................................................................... 74.
Table 6-7. P/S 2-style keyboard and mouse pin assignments.................................................................... 74.
Table 6-8. PIM connector pin assignments.............................................................................................. 75.
Table 6-9. RS-232 RTM connector ......................................................................................................... 76.
Table 6-10. USB connector...................................................................................................................... 76.
Table 7-1. Local sensors.......................................................................................................................... 78.
Table 7-2. Local controls ........................................................................................................................ 79.
Table 7-3. Blade LED.............................................................................................................................. 79.
Table 7-4. User LED ............................................................................................................................... 80.
Table 7-5. Hot Swap LED....................................................................................................................... 80.
Table 7-6. IPMI FRU inventory area ....................................................................................................... 81.
Table A-1. EPC-3311 I/O map ................................................................................................................ 83.
Table A-2. EPC-3311 memory map ........................................................................................................ 84.
Table A-3. Fixed I/O-mapped ports and registers .................................................................................... 85.
Table B-1. Interrupts ............................................................................................................................... 87.
Table D-1. CompactPCI J1 connector ..................................................................................................... 94.
Table D-2. CompactPCI J2 connector ..................................................................................................... 95.
Table D-3. CompactPCI J3 connector ..................................................................................................... 96.
Table D-4. CompactPCI J5 connector ..................................................................................................... 97.
Table D-5. Jn1 connector (PMC 32-bit PCI interface) .............................................................................98.
Table D-6. Jn2 connector (PMC 32-bit PCI interface) .............................................................................99.
Table D-7. Serial port connector ............................................................................................................. 100.
Table D-8. Primary IDE connector ......................................................................................................... 101.
Table D-9. CompactFlash socket pinout ................................................................................................. 102.
Table E-1. POST message codes .............................................................................................................. 103.
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1
1
Introduction Chapter 1
The EPC-3311 is a high performance, single slot CompactPCI board that operates
as either a host or task processor. It is fully compliant with PICMG 2.16 for use
with packet-switched backplanes and the dual Gigabit Ethernet channels offer
maximum bandwidth to the backplane. The EPC-3311 uses the RadiSys 82600
chipset and a Mobile Intel†Pentium†III Processor-M. It also provides two PMC
sites, allowing the use of a variety of PMC modules such as SCSI, LAN or WAN
adapters. The EPC-3311 can operate in these environments:
• PICMG 2.16-compliant node slot.
• PICMG 2.0-compliant PCI system slot.
• PICMG 2.0-compliant PCI peripheral slot.
The EPC-3311 includes these subsystems:
•CPU board: A single-slot system controller which plugs into a 6U System Slot of
a CompactPCI system.
•Optional rear transition module: A rear I/O transition module which plugs
into a rear I/O slot of a CompactPCI system. The EPC-3311 can operate with
either the RTML or the RTM216.
Figure 1-1. The EPC-3311
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EPC® -3311 Hardware Reference
2
The EPC-3311 requires a backplane that supports the CompactPCI Specification
Revision 2.1.
The EPC-3311 can be ordered in these configurations:
1
If you install this option, you can install only one PMC. Also, if you plan to install a
CompactFlash, you must do so
before installing the drive as the drive is mounted
over the CompactFlash connector.
You can also add to the EPC-3311:
• One or two PMCs (either RadiSys or third-party). For information about
installing a PMC, see Appendix F, PMC modules.
• A CompactFlash device. For information about CompactFlash cards, see
Appendix G, CompactFlash cards.
• IDE devices. The EPC-3311 supports a maximum of two IDE devices connected
to the processor board or the RTM. For information about the IDE connectors,
see Appendix D, Connectors and Chapter 6, RTMs.
Configuration Description
EPC-3311-512 Includes 512 MB memory.
EPC-3311-1G Includes 1 GB memory.
EPC-3311-RTM216 An RTM that works with the EPC-3311 in a 2.16-compliant
system. This RTM has an additional optional PIM in place of the
Ethernet connectors.
EPC-3311-RTML An RTM that works with the EPC-3311 in a legacy (non-2.16)
chassis. This RTM expands EPC-3311 connectivity and
functionality for use as part of a CompactPCI computer system.
EPC-3311-HDD
1
An onboard 2.5" IDE hard disk drive which occupies the space for
the PMC “A” site.
You cannot install a Processor PMC (such as the EPC-6315) the PMC A/B
site when a CompactFlash is installed.
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Chapter 1: Introduction
3
Features
• Mobile Intel Pentium III Processor-M (Tualatin):
• 1200 MHz.
• Micro FC-BGA (Flip Chip Ball Grid Array) package.
• A front side bus frequency of 133 MHz.
• A RadiSys 82600 High Integration Dual PCI System Controller, which includes:
• Host bridge.
• One Ultra DMA/33 EIDE channel.
• One USB channel (with appropriate OS drivers).
• One RS-232 serial (COM1) port (300 to 115,200 baud).
• Hardware watchdog timer, two-stage configurable.
• RTC (Real-Time Clock).
• A CR2032 Lithium (Li/MnO2) coin battery that powers the RTC to retain date,
time, and CMOS parameters.
• A discrete memory module in capacities of 512 MB or 1 GB.
• An Intel Strataflash†BIOS/Flash ROM device of 4 MB.
• EPC-3311 CompactPCI bus configuration:
• When installed in a system slot, the EPC-3311 functions as a system controller.
• When installed in a peripheral slot, the EPC-3311 functions as a
peripheral processor.
• Two Intel 82544EI 10/100/1000BASE-T Ethernet controllers incorporating
internal MAC and PHY interface support for 10BASE-T, 100BASE-TX, or
1000BASE-T connectivity.
• Two 32-bit PCI +5V I/O compatible PMC sites.
• These sites support Jn1 and Jn2, for local PCI signal and power.
• Jn4 signals route out the CompactPCI J3/J5 connectors.
• IPMI hardware management controller, implementing dual IPMB. The
controller uses an I2C-style system management bus.
• Disk drives:
• Optional bootable CF (CompactFlash
†
) via industry standard CF Type I socket.
• Optional factory-installed onboard IDE hard disk drive.
• IDE bus available for other IDE devices through an RTM connector.
You can use either the on-board or the RTM IDE bus; you cannot use both
at the same time.
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EPC® -3311 Hardware Reference
4
• Front panel:
• LEDs, including Hot Swap, user-status, blade, and Ethernet link/speed.
• Reset button.
• Injector/ejector levers (with a hot swap micro switch).
External interfaces
The EPC-3311 has external interfaces available from the front panel, the
CompactPCI standard connectors J1-J5, and onboard interfaces. The RTM offers
more connectors for the functions on the main board.
The front panel external indicators and interfaces are:
• Hot Swap micro switch contained within board ejector
• CompactPCI Blue Hot Swap LED
• Red/Green User LED for software status (IPMI-controlled)
• Red/Green Blade Status LED (IPMI-controlled)
• Ethernet Link/Activity (Speed) LEDs
• Reset switch
• COM 1 serial port on DE9 connector
• The CompactPCI backplane connections are:
• J1/J2, 32-bit CompactPCI interface, +3.3V, +5V, and ±12V power
• Ethernet 1 & 2, PMC J24 rear I/O signals, and Fused +3.3V and +5V to
RTM
• EIDE, keyboard, mouse, Serial port, USB, PMC J14 rear I/O signals
Onboard interfaces include:
• Two PMC sites (Jn1, Jn2, Jn4 connectors)
• Manufacturing test header
• IPMI HMC 10-pin programming header
• Processor ITP (installed only on prototypes)
• Battery holder (for a 20mm, 3V Lithium coin cell)
• Type I CompactFlash socket
• IDE 44-pin connector to support an onboard IDE drive
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Chapter 1: Introduction
5
Specifications
System specifications
Table 1-1. System specifications
Characteristic Value
CPU Mobile Intel Pentium III Processor-M with a 133 MHz
front side bus.
• 1200 MHz.
•MicroFC–BGApackage.
Chipset RadiSys 82600 chipset (North bridge and P2P bridge).
Cache 512 KB Level 2 write-back cache operating at full
clock speed.
Memory • 512MB or 1GB.
•ECC.
• Single-bit error correction, double-bit detection
(ECC mode only).
Addressing Real and protected mode supported.
• Real address mode : 20-bit
• Protected address mode : 32-bit on PCI local bus
Data path 32-bit onboard processor bus at 133 MHz.
Flash memory 4 Mb (4096 KB x 8).
Clock/calendar • Embedded Real-Time Clock.
• Accurate to ±12 minutes/year, at 25°C.
• Includes 256 bytes of CMOS SRAM in two 128 byte
banks.
Power requirements
with 512 MB SDRAM
Input power 30 W maximum
+3.3V 3 A maximum/2.5 A typical
+5V 3.5 A maximum/2.0 A typical
+12V 0.1 A
–12V 0.1 A
Note : These values represent all components fully
populated.
Battery CR2032 Lithium (Li/MnO
2
).
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EPC® -3311 Hardware Reference
6
Environmental
The EPC-3311 meets the following environmental specifications with no hard disk
drive installed:
¹ Ambient temperature is measured at the leading edge of the EPC-3311 heatsink with
a 1200 MHz processor installed and all components fully populated. RadiSys
validates the operating specifications of its products by testing with the “hottest”
available hardware and software configuration to maximize the power supply draw
and generate a worst-case scenario. Despite these efforts, the specifications outlined
above are only benchmarks and should be regarded as such.
² Measured only under ambient temperature of 20°C to 30°C and ambient humidity of
30% to 60%.
• The EPC-3311 is for use only with compatible UL Listed computers that have
installation instructions detailing user installation of card cage accessories.
• The operating environment must provide sufficient airflow (300 LFM) across
the board to keep it within its temperature specification. Failure to provide
sufficient airflow may result in board failure.
Table 1-2. Environmental specifications
Parameter Conditions Detailed specification
Te m p e r a t u r e
(ambient)¹
Operating +5ºC to 55ºC (41ºF to 131ºF) derated 2ºC per
1000 feet (300 m) over 6600ft (2000m) with
300 LFM airflow.
Storage –20ºC to +60ºC (–4ºF to +140ºF).
Relative humidity Operating 20% to 80% non-condensing; 10% per hour
maximum excursion gradient.
Storage 5% to 85% non-condensing; 10% per hour
maximum excursion gradient.
Vibration² Operating 0.005G²/Hz from 5 to1000 Hz random, 10 min per
sweep cycle.
Storage 0.02G²/Hz from 5 to1000 Hz random, 10 min per
sweep cycle.
Shock²
(un-packaged)
Operating 5G, 11ms duration, half-sine shock pulse.
Storage 15G, 11ms duration, half-sine shock pulse.
Altitude Operating 0 to 15,000ft. (4,500 m).
Storage 0 to 40,000 ft. (12,000 m).
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Chapter 1: Introduction
7
Additional specifications
¹ The EPC-3311’s mechanical outline complies with IEEE 1101.1, 1101.11, and
P1101.11 mechanical requirements.
Table 1-3. Additional EPC-3311 specifications
Characteristic Value
Mechanical¹ EPC-3311 Standard 6U form factor;
100 mm x 160 mm x 20.32 mm.
EPC-3311-RTM216 100 mm x 80 mm x 20.32 mm.
EPC-3311-RTML 100 mm x 80 mm x 20.32 mm.
Heat sink Provides sufficient cooling for the processor and other components
as required when used in an environment providing 300 LFM airflow
at a maximum ambient temperature of 55 °C.
2
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