Samsung GT-C6712 User manual

GSM TELEPHONE
GT-C6712
1. Safety Precautions
2. Specification
3. Product Function
4. Exploded View and Parts list
5. MAIN Electrical Parts List
6. Level 1Repair
7. Level 2Repair
8. Level 3Repair
9. Reference data
Notice :
All functionality, features, specifications and other
product information provided in this document inclu
ding, but not limited to, the benefits, design, pricing,
components, performance, availability, and capabiliti
-es of the product are subject to change without
notice or obligation. Samsung reserves the right to
make changes to this document and the product
described herein, at anytime, without obligation on
Samsung to provide notification of such change.
GSM TELEPHONE CONTENTS

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1. Safety Precautions
1-1
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1-1. Repair Precaution
―Repair in Shield Box, during detailed tuning. Take specially care of tuning or test, because
specipicty of cellular phone is sensitive for surrounding interference(RF noise).
―Be careful to use akind of magnetic object or tool, because performance of parts is damaged by
the influence of magnetic force.
―Surely use astandard screwdriver when you disassemble this product, otherwise screw will be
worn away.
―Use athicken twisted wire when you measure level.
Athicken twisted wire has low resistance, therefore error of measurement is few.
―Repair after separate Test Pack and Set because for short danger (for example an overcurrent
and furious flames of parts etc) when you repair board in condition of connecting Test Pack and
tuning on.
―Take specially care of soldering, because Land of PCB is small and weak in heat.
―Surely tune on/off while using AC power plug, because arepair of battery charger is dangerous
when tuning ON/OFF PBA and Connector after disassembling charger.
―Don't use as you pleases after change other material than replacement registered on SEC System.
Otherwise engineer in charge isn't charged with problem that you don't keep this rules.

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Safety Precautions
1-2
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1-2. ESD(Electrostatically Sensitive Devices) Precaution
Several semiconductor may be damaged easily by static electricity. Such parts are called by ESD
(Electrostatically Sensitive Devices), for example IC,BGA chip etc. Read Precaution below.
You can prevent from ESD damage by static electricity.
―Remove static electricity remained your body before you touch semiconductor or parts with
semiconductor. There are ways that you touch an earthed place or wear static electricity prevention
string on wrist.
―Use earthed soldering steel when you connect or disconnect ESD.
―Use soldering removing tool to break static electricity. ,otherwise ESD will be damaged by static
electricity.
―Don't unpack until you set up ESD on product. Because most of ESD are packed by box and
aluminum plate to have conductive power,they are prevented from static electricity.
―You must maintain electric contact between ESD and place due to be set up until ESD is
connected completely to the proper place or acircuit board.

2. Specification
2-1
2-1. GSM General Specification
EGSM900 DCS1800
Freq. Band[MHz]
Uplink/Downlink
880~915
925~960
1710~1785
1805~1880
ARFCN range 0~124 &
975~1023 512~885
Tx/Rx spacing 45MHz 95MHz
Mod. Bit rate
/BitPeriod
270.833kbps
3.692us
270.833kbps
3.692us
Time Slot Period
/ Frame Period
576.9us
4.615ms
576.9us
4.615ms
Modulation 0.3GMSK 0.3GMSK
MS Power 33dBm~5dBm 30dBm~0dBm
Power Class 5~19(class4) 0~15(class1)
Sensitivity -102dBm -100dBm
TDMA Mux 8 8
Cell Radius 35Km 2Km

Speclflcation
2-2
TX Power
control level DCS1800
030±3
dBm
128±3
dBm
226±3
dBm
324±3
dBm
422±3
dBm
520±3
dBm
618±3
dBm
716±3
dBm
814±3
dBm
912±4
dBm
10 10±4 dBm
11 8±4dBm
12 6±4 dBm
13 4±4 dBm
14 2±5 dBm
15 0±5 dBm
TX Power
control level GSM900
533±2
dBm
631±2
dBm
729±2
dBm
827±2
dBm
925±2
dBm
10 23±2 dBm
11 21±2 dBm
12 19±2 dBm
13 17±2 dBm
14 15±2 dBm
15 13±2 dBm
16 11±3 dBm
17 9±3 dBm
18 7±3 dBm
19 5±3 dBm
2-2. GSM TX power class

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3. Operation Instruction and Installation
3-1
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Main Function
•EDGE RX (850/900/1800/1900)
•3.2”
WQVGA LCD
•3.2
MP Camera
•Dual SIM, Dual Standby
•BTv3.0 ,Micro USB 2.0
•FM Radio Support
•Micro SD Card support
•3.5
pi Earjack Support
•Wi-Fi 802.11(b/g/n)
•SMS, MMS

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4. Exploded View and Parts List
4-1
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4-1. Cellular phone Exploded View
QME03
QFR01
QLC01
QLB01
QMI03
QAR01
QCA01
QCK02 QRE01
QSP01
QBA01
QCR101
QBC00
QMP01
QKP01
QVK02
QCK01
QMO01
QME01
QRF06
QSD01
QVO01

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Exploded View and Parts List
4-2
This Document can not be used without Samsung's authorization
Design LOC Description SEC CODE
QCR101 SCREW-MACHINE 6001-002005
QBA01 INNER BATTERY PACK-1200MAH,BLK,ENG,MAIN GH43-03447A
QSP01 MODULE-SPK +INT GH59-10668A
QCA01 CAMERA MODULE-3M LSI 1/5" 5CC SOCKET TYP GH59-10764A
QVK02 KEY FPCB-PWR KEY FPCB GH59-10787A
QME03 TOUCH/PANEL-GT-C6712 GH59-10814A
QMI03 RMO RUBBER-MIC TOP GH73-14863A
QMP01 A/S ASSY-PBA MAIN (COMM) GH82-05721A
QLC01 ASSY LCD-3.2"WQVGA GT-C6712 ASSY GH96-05076A
QAR01 ASSY MODULE-RCV(+EARJACK)+BRACKET FPCB GH96-05141A
QFR01 ASSY CASE-FRONT GH98-19406A
QKP01 ASSY KEYPAD-(EU) GH98-19408A
QBC00 ASSY COVER-BATT(IML) GH98-19784A
QLB01 ASSY BRACKET-LCD GH98-19407A
QME01 KEY FPCB-KEY FPCB ASSY GH59-10786A
QRE01 ASSY CASE-REAR GH98-19409A
QMO01 MOTOR DC GH31-00534A
QRF06 PMO COVER-USB GH72-62923A
QSD01 PMO COVER-SD GH72-62924A
QCK02 PMO KEY-SIM GH72-62926A
QVO01 PMO KEY-VOL GH72-62927A
QCK01 PMO KEY-HOLD GH72-62928A
4-2. Cellular phone Parts list

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5. MAIN Electrical Parts List
5-1
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SEC CODE Design LOC Description
0403-001870 ZD300 DIODE-ZENER
0404-001172 D401,D402 DIODE-SCHOTTKY
0404-001504 D100,D101 DIODE-SCHOTTKY
0406-001286 ZD301,ZD403 DIODE-TVS
0406-001293 ZD401,ZD402 DIODE-TVS
0406-001413 ZD408,ZD411 DIODE-TVS
0406-001446 U411,ZD404,ZD405 DIODE-TVS
0406-001446 ZD409,ZD410 DIODE-TVS
0801-003130 U200 IC
1001-001410 U403 IC
1001-001607 U104 IC
1001-001655 U401 IC
1001-001687 U100 IC
1108-000395 UME200 MEMORY
1201-003166 PAM100 IC
1203-006589 U402 IC
1203-006660 PM300 IC
1205-003868 U102 IC
1205-004046 UCP200 IC
1205-004113 U105 IC
1209-001945 U301 IC
1404-001221 VR300 THERMISTOR
1405-001298 V400,V401,V405,V407 VARISTOR
1405-001298 V408 VARISTOR
2007-000138 R422,R423,R424,R425 R-CHIP
2007-000138 R430 R-CHIP
2007-000139 R137 R-CHIP
2007-000140 R111,R420 R-CHIP
2007-000141 R206,R207,R208,R209 R-CHIP
2007-000141 R219,R220,R406 R-CHIP
2007-000143 R202,R433 R-CHIP
2007-000144 R211,R212,R213,R214 R-CHIP
2007-000148 R312 R-CHIP
2007-000156 R305,R404 R-CHIP
2007-000159 R204 R-CHIP
2007-000162 R134,R135,R136,R216 R-CHIP

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Main Electrical Parts List
5-2
This Document can not be used without Samsung's authorization
SEC CODE Design LOC Description
2007-000162 R217,R218,R222 R-CHIP
2007-000165 R300 R-CHIP
2007-000169 R438 R-CHIP
2007-000170 R402,R408 R-CHIP
2007-001244 R205 R-CHIP
2007-001292 R301,R302 R-CHIP
2007-001294 R100,R405 R-CHIP
2007-001333 R409 R-CHIP
2007-002796 R418 R-CHIP
2007-003014 R316 R-CHIP
2007-003018 R108,R110 R-CHIP
2007-007008 R304 R-CHIP
2007-007014 R411 R-CHIP
2007-007015 R439 R-CHIP
2007-007132 R114,R128,R410 R-CHIP
2007-007156 R460,R462 R-CHIP
2007-007193 R200 R-CHIP
2007-007312 R215 R-CHIP
2007-007315 R221 R-CHIP
2007-007981 R313,R315 R-CHIP
2007-008401 R314 R-CHIP
2203-000233 C234,C450,C451,C452 C-CERAMIC
2203-000233 C453,C456 C-CERAMIC
2203-000254 C137,C222,C231 C-CERAMIC
2203-000278 C125,C126,C136,C143 C-CERAMIC
2203-000278 C169,C170,C171 C-CERAMIC
2203-000330 C118 C-CERAMIC
2203-000386 C236,C402,C413,C415 C-CERAMIC
2203-000386 C460 C-CERAMIC
2203-000425 C219 C-CERAMIC
2203-000438 C150,C229 C-CERAMIC
2203-000627 C116,C312,C313 C-CERAMIC
2203-000679 C130 C-CERAMIC
2203-000696 C144 C-CERAMIC
2203-000714 C182 C-CERAMIC
2203-000725 C464,C465 C-CERAMIC