Samsung GT-S5260 User manual

GSM TELEPHONE
GT-S5260
1. Safety Precautions
2. Specification
3. Product Function
4. Exploded View and Parts list
5. MAIN Electrical Parts List
6. Level 1Repair
7. Level 2Repair
8. Level 3Repair
9. Reference data
Notice :
All functionality, features, specifications and other
product information provided in this document inclu
ding, but not limited to, the benefits, design, pricing,
components, performance, availability, and capabiliti
-es of the product are subject to change without
notice or obligation. Samsung reserves the right to
make changes to this document and the product
described herein, at anytime, without obligation on
Samsung to provide notification of such change.
GSM TELEPHONE CONTENTS

This Service Manual is aproperty of Samsung Electronics Co.,Ltd.
Any unauthorized use of Manual can be punished under applicable
International and/or domestic law.
Samsung Electronics Co.,Ltd.
2011. 01. Rev.1.0
ⓒ

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2. Specification
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2-1
2-1. GSM General Specification
EGSM 900 DCS1800
Freq. Band[MHz]
Uplink/Downlink
880~915
925~960
1710~1785
1805~1880
ARFCN range 0~124 &
975~1023 512~885
Tx/Rx spacing 45MHz 95MHz
Mod. Bit rate/
Bit Period
270.833kbps
3.692us
270.833kbps
3.692us
Time Slot
Period/Frame
Period
576.9us
4.615ms
576.9us
4.615ms
Modulation 0.3GMSK 0.3GMSK
MS Power 33dBm~5dBm 30dBm~0dBm
Power Class 4
(max +33dBm)
1
(max +30dBm)
Sensitivity -102dBm -100dBm
TDMA Mux 8 8
Cell Radius 35Km 2Km

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Specification
2-2
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2-2. GSM Tx Power Class
TX Power
control level GSM900
5 32.5±2 dBm
631±2
dBm
729±2
dBm
827±2
dBm
925±2
dBm
10 23±2 dBm
11 21±2 dBm
12 19±2 dBm
13 17±2 dBm
14 15±2 dBm
15 13±2 dBm
16 11±3 dBm
17 9±3 dBm
18 7±3 dBm
19 5±3 dBm
TX Power
control level DCS1800
0 29.5±3 dBm
128±3
dBm
226±3
dBm
324±3
dBm
422±3
dBm
520±3
dBm
618±3
dBm
716±3
dBm
814±3
dBm
912±4
dBm
10 10±4 dBm
11 8±4 dBm
12 6±4 dBm
13 4±4 dBm
14 2±5 dBm
15 0±5 dBm

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3. Operation Instruction and Installation
3-1
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Main Function
•Android OS: Eclair
•HSDPA 7.2Mbps /HSUPA 5.76Mbps
•5
MP AF w/o LED Flash
•4.0"
WVGA Super AMOLED Full Touch (C-Type)
•A-GPS /BT v3.0 /USB v2.0 /WiFi (802.11 b/g/n)
•HD Recording (720p) /Full HD Playback (1080p), DLNA
•Sensors: Accelerometer, Compass, Proximity, Light
•TouchWiz 3.0 for Android, Multistage, Augmented Reality, Integrated phonebook with
SNS, IM, E-mail, Face Recognition, etc.

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6. Level 1Repair
6-1
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6-1. S/W Download
6-1-1. Pre-requsite for S/W Downloading
•Downloader Program(MultiLoader_V5.65.exe)
•GT-S5260 Mobile Phone
•Data Cable
•JIG BOX (GH99-36900A)
•RF Test Cable (GH39-00985A)
•JIG Cable (GH39-01290A)
•Adapter (GH99-38251A)
•Binary files
（Settings
Connect to ANYWAY JIG BOX
&JIG CABLE (Phone to JIG)

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Level 1Repair
6-2
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6-1-2. S/W Downloader Program
｝Load the binary download program by executing the
"MultiLoader_V5.65.exe "enter this file.
1.Check the "Full Download BOX" and open binary folder.

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Level 1Repair
6-3
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2.Select the each items in the Downloader V5.65 and Choose the files.
Downloader V5.65 file name
Boot BOOTFILES (folder)
Apps apps_compressed.bin
Rsrc1 Rsrc_S5260_Open_Europe_Common.rc1
Rsrc2 Rsrc2_S5260(Low).rc2
Factory FS FactoryFs_S5260_Open_Europe_Common.ffs
CSC CSC_S5260_Open_Europe_Common_OXA.csc
SHP APP ShpApp.app

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Level 1Repair
6-4
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3.Connect the handset, select Download.
(For enter "Download mode", press hold key+Vol. up key+send key.)
(downloading screen)

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Level 1Repair
6-5
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4.When downloading is complete, confirm the this message.
"All files complete"
5.Confirm the downloaded version name and etc. :
*#1234#
Full Reset :
*2767*3855#

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9. Reference Abbreviate
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9-1
Reference Abbreviate
―AAC:Advanced Audio Coding.
―AVC :Advanced Video Coding.
―BER :Bit Error Rate
―BPSK:Binary Phase Shift Keying
―CA :Conditional Access
―CDM :Code Division Multiplexing
―C/I :Carrier to Interference
―DMB :Digital Multimedia Broadcasting
―EN :European Standard
―ES :Elementary Stream
―ETSI:European Telecommunications Standards Institute
―MPEG:Moving Picture Experts Group
―PN :Pseudo-random Noise
―PS :Pilot Symbol
―QPSK:Quadrature Phase Shift Keying
―RS :Reed-Solomon
―SI :Service Information
―TDM :Time Division Multiplexing
―TS :Transport Stream

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1. Safety Precautions
1-1
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1-1. Repair Precaution
―Repair in Shield Box, during detailed tuning. Take specially care of tuning or test, because
specipicty of cellular phone is sensitive for surrounding interference(RF noise).
―Be careful to use akind of magnetic object or tool, because performance of parts is damaged by
the influence of magnetic force.
―Surely use astandard screwdriver when you disassemble this product, otherwise screw will be
worn away.
―Use athicken twisted wire when you measure level.
Athicken twisted wire has low resistance, therefore error of measurement is few.
―Repair after separate Test Pack and Set because for short danger (for example an overcurrent
and furious flames of parts etc) when you repair board in condition of connecting Test Pack and
tuning on.
―Take specially care of soldering, because Land of PCB is small and weak in heat.
―Surely tune on/off while using AC power plug, because arepair of battery charger is dangerous
when tuning ON/OFF PBA and Connector after disassembling charger.
―Don't use as you pleases after change other material than replacement registered on SEC System.
Otherwise engineer in charge isn't charged with problem that you don't keep this rules.

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Safety Precautions
1-2
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1-2. ESD(Electrostatically Sensitive Devices) Precaution
Several semiconductor may be damaged easily by static electricity. Such parts are called by ESD
(Electrostatically Sensitive Devices), for example IC,BGA chip etc. Read Precaution below.
You can prevent from ESD damage by static electricity.
―Remove static electricity remained your body before you touch semiconductor or parts with
semiconductor. There are ways that you touch an earthed place or wear static electricity prevention
string on wrist.
―Use earthed soldering steel when you connect or disconnect ESD.
―Use soldering removing tool to break static electricity. ,otherwise ESD will be damaged by static
electricity.
―Don't unpack until you set up ESD on product. Because most of ESD are packed by box and
aluminum plate to have conductive power,they are prevented from static electricity.
―You must maintain electric contact between ESD and place due to be set up until ESD is
connected completely to the proper place or acircuit board.

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4. Exploded View and Parts List
4-1
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4-1. Cellular phone Exploded View
QRE01
QME03
QFR01
QLC01
QLB01
QJK01
QAR01
QMO01
QCR67
QBC00
QCA01
QCK02
QKP02
QME01
QSP01
QMP01
QRF06
QVO01
QSD01

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Exploded View and Parts List
4-2
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Design LOC Description SEC CODE
QAR01 AUDIO-RECEIVER 3009-001521
QCR67 SCREW-MACHINE 6001-002083
QMO01 MOTOR DC-SPHV8400 GH31-00187A
QJK01 MODULE-EARJACK/FPCB ASSY GH59-10334A
QME03 TOUCH/PANEL-EU COMMON (WHITE) GH59-10336A
QSP01 MODULE-SPK/INTENNA (GT-S5260) GH59-10488A
QCA01 CAMERA MODULE-3M CAMERA MODULE GH59-10594A
QMP01 A/S ASSY-PBA MAIN (COMM) GH82-05493A
QLC01 ASSY LCD-MODULE ASSY(GT-S5260) GH96-04956A
QME01 ASSY MODULE-KEY PBA/MIC/BRACKET GH96-05038A
QKP02 ASSY KEYPAD-SUB GH98-18495A
QFR01 ASSY CASE-FRONT GH98-18510A
QBC00 ASSY COVER-BATT GH98-18512A
QLB01 ASSY BRACKET-LCD GH98-18513A
QRE01 ASSY CASE-REAR GH98-18511A
QVO01 PMO KEY-VOLUME GH72-61830A
QCK02 PMO KEY-HOLD GH72-61831A
QRF06 PMO COVER-USB GH72-61832A
QSD01 PMO COVER-SD GH72-61833A
4-2. Cellular phone Parts list

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5. MAIN Electrical Parts List
5-1
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SEC CODE Design LOC Description
0403-001870 ZD300 DIODE-ZENER
0404-001172 D402 DIODE-SCHOTTKY
0404-001504 D100,D101 DIODE-SCHOTTKY
0406-001286 ZD400 DIODE-TVS
0406-001329 ZD401 DIODE-TVS
0406-001446 ZD402,ZD40 DIODE-TVS
0406-001446 ZD405 DIODE-TVS
0407-001002 D300 DIODE-ARRAY
0505-002388 Q401 FET-SILICON
0801-003130 U200 IC
1001-001607 U104 IC
1001-001655 U401 IC
1001-001687 U102 IC
1108-000395 UME200 IC
1201-003166 PAM100 IC
1202-001068 U409 IC
1203-006589 U402 IC
1203-006660 U300 IC
1205-003868 U100 IC
1205-004046 UCP200 IC
1205-004113 U103 IC
1209-001945 U302 IC
1404-001221 VR300 VARISTOR
1405-001231 VR200,VR20 VARISTOR
1405-001231 VR411,VR41 VARISTOR
1405-001298 VR400,VR40 VARISTOR
1405-001298 VR405,VR40 VARISTOR
1405-001298 VR412 VARISTOR
2007-000137 R407 R-CHIP
2007-000138 R101 R-CHIP
2007-000140 R103,R424 R-CHIP
2007-000141 R204,R205, R-CHIP
2007-000141 R415,R416 R-CHIP
2007-000143 R201,R219, R-CHIP
2007-000144 C231,R211, R-CHIP
2007-000148 R304,R411 R-CHIP

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Main Electrical Parts List
5-2
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SEC CODE Design LOC Description
2007-000156 R305 R-CHIP
2007-000157 R423 R-CHIP
2007-000159 R208 R-CHIP
2007-000162 R107,R110, R-CHIP
2007-000162 R217,R221, R-CHIP
2007-000165 R300,R421, R-CHIP
2007-000169 R429 R-CHIP
2007-000170 R402,R408, R-CHIP
2007-000172 R401,R406 R-CHIP
2007-000758 R422 R-CHIP
2007-001244 R209 R-CHIP
2007-001291 R301,R302 R-CHIP
2007-001295 R404,R413 R-CHIP
2007-001298 R102,R403 R-CHIP
2007-001333 R409 R-CHIP
2007-002965 R108 R-CHIP
2007-003014 R312 R-CHIP
2007-003015 R418,R419 R-CHIP
2007-007008 R306 R-CHIP
2007-007014 R410 R-CHIP
2007-007015 R430 R-CHIP
2007-007132 R106,R112 R-CHIP
2007-007193 R200 R-CHIP
2007-007312 R214 R-CHIP
2007-007315 R218 R-CHIP
2007-007981 R309,R311 R-CHIP
2007-008401 R308 R-CHIP
2203-000233 C129,C130, C-CERAMIC
2203-000233 C234 C-CERAMIC
2203-000254 C137,C223, C-CERAMIC
2203-000278 C120,C121, C-CERAMIC
2203-000278 C127,C128, C-CERAMIC
2203-000278 C166,C167, C-CERAMIC
2203-000386 C165,C312, C-CERAMIC
2203-000386 C416 C-CERAMIC
2203-000425 C220 C-CERAMIC

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Main Electrical Parts List
5-3
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SEC CODE Design LOC Description
2203-000438 C144,R425 C-CERAMIC
2203-000466 C131 C-CERAMIC
2203-000696 C140 C-CERAMIC
2203-000714 C119 C-CERAMIC
2203-000812 C114,C342, C-CERAMIC
2203-000812 C414 C-CERAMIC
2203-000854 C118,C151, C-CERAMIC
2203-000995 C206,C217, C-CERAMIC
2203-001101 C224 C-CERAMIC
2203-001153 C400,C405, C-CERAMIC
2203-002487 C428,C429, C-CERAMIC
2203-005057 C117 C-CERAMIC
2203-005450 C145 C-CERAMIC
2203-005481 C423 C-CERAMIC
2203-006048 C102,C104, C-CERAMIC
2203-006048 C109,C125, C-CERAMIC
2203-006048 C157,C171, C-CERAMIC
2203-006048 C211,C212, C-CERAMIC
2203-006048 C215,C216, C-CERAMIC
2203-006048 C316,C341, C-CERAMIC
2203-006048 C402,C403, C-CERAMIC
2203-006048 C419,C420 C-CERAMIC
2203-006141 C306 C-CERAMIC
2203-006190 C112,C155 C-CERAMIC
2203-006257 C345 C-CERAMIC
2203-006260 C122 C-CERAMIC
2203-006348 C301,C437, C-CERAMIC
2203-006399 C126,C133, C-CERAMIC
2203-006399 C147,C200, C-CERAMIC
2203-006399 C208,C210, C-CERAMIC
2203-006399 C307,C309, C-CERAMIC
2203-006399 C319,C322, C-CERAMIC
2203-006399 C328,C329, C-CERAMIC
2203-006399 C352,C412, C-CERAMIC
2203-006399 C427,C431, C-CERAMIC
2203-006399 C434,C435 C-CERAMIC

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Main Electrical Parts List
5-4
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SEC CODE Design LOC Description
2203-006562 C401 C-CERAMIC
2203-006681 C226,C421 C-CERAMIC
2203-006824 C100,C422 C-CERAMIC
2203-006841 C305 C-CERAMIC
2203-006872 C105,C135, C-CERAMIC
2203-006872 C205,C207, C-CERAMIC
2203-006872 C225,C349 C-CERAMIC
2203-006890 C300,C320, C-CERAMIC
2203-006890 C337 C-CERAMIC
2203-007271 C326,C327, C-CERAMIC
2203-007271 C334,C335 C-CERAMIC
2203-007279 C113,C303, C-CERAMIC
2203-007317 C101,C143 C-CERAMIC
2203-007775 C115,C116 C-CERAMIC
2404-001377 TA400 C-TA,CHIP
2404-001496 TA300 C-TA,CHIP
2404-001506 TA301 C-TA,CHIP
2404-001516 C302 C-TA,CHIP
2703-001733 C103 INDUCTOR-SMD
2703-001748 L106,L107 INDUCTOR-SMD
2703-001751 L119,L121 INDUCTOR-SMD
2703-001938 L403 INDUCTOR-SMD
2703-002170 L110 INDUCTOR-SMD
2703-002176 L118 INDUCTOR-SMD
2703-002198 L115,L116 INDUCTOR-SMD
2703-002200 L120,L122 INDUCTOR-SMD
2703-002204 L112,L123 INDUCTOR-SMD
2703-002267 L114,L117 INDUCTOR-SMD
2703-002281 L109,L113 INDUCTOR-SMD
2703-002309 L410 INDUCTOR-SMD
2703-002367 C153,C154 INDUCTOR-SMD
2703-002369 L127 INDUCTOR-SMD
2703-003485 L401 INDUCTOR-SMD
2703-003686 L300,L301 INDUCTOR-SMD
2703-003698 L105 INDUCTOR-SMD
2801-004466 OSC300 CRYSTAL-UNIT

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Main Electrical Parts List
5-5
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SEC CODE Design LOC Description
2801-004787 OSC200 CRYSTAL-UNIT
2801-005054 OSC100 CRYSTAL-UNIT
2901-001639 F400,F401, FILTER-EMI SMD
2904-001935 F100 FILTER-SAW
2904-001937 F101 FILTER-SAW
2909-001337 F102 FILTER-DUPLEXER
3003-001136 MIC401 MIC-CONDENSOR
3301-001438 L128 CORE-FERRITE BEAD
3301-001534 L100,L101 CORE-FERRITE BEAD
3301-001659 L124,L125, CORE-FERRITE BEAD
3301-001812 L400,L402 CORE-FERRITE BEAD
3301-002062 L404 CORE-FERRITE BEAD
3301-002065 L406,L407, CORE-FERRITE BEAD
3301-002065 R400 CORE-FERRITE BEAD
3404-001303 TAC_DN,TAC SWITCH-TACT
3404-001303 TAC_UP SWITCH-TACT
3705-001731 RFS100 CONNECTOR-COAXIAL
3708-002222 SLC401 CONNECTOR-FPC/FFC/PIC
3709-001575 SD300 CONNECTOR-CARD EDGE
3709-001668 SIM300 CONNECTOR-CARD EDGE
3711-006615 HDC401,SLC CONNECTOR-HEADER
3711-006676 HDC400 CONNECTOR-HEADER
3711-007650 BTC300 CONNECTOR-HEADER
3712-001348 ANT400,ANT CONNECTOR-TERMINAL
3722-002867 IFC400 JACK-PHONE
GH62-00018A GA100 PAD GAP-PCB GASKET
Please consult the GSPN website (Samsung Portal) for the most recent version of the product's
part list.