Samsung SGH-E760 User manual

GSM TELEPHONE
SGH-E760
GSM TELEPHONE CONTENTS
1. Specification
2. Circuit Description
3. Exploded Views and Parts List
4. Electrical Parts List
5. Block Diagrams
6. PCB Diagrams
7. Flow Chart of Troubleshooting

Samsung Electronics Co.,Ltd. September. 2005
Printed in Korea.
Code No.: GH68-08106A
BASIC.
This Service Manual is a property of Samsung Electronics Co.,Ltd.
Any unauthorized use of Manual can be punished under applicable
International and/or domestic law.
ⓒ

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1. Specification
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1-1
GSM900
Phase 1 EGSM 900 Phase 2 DCS1800 Phase 1 PCS1900
Freq. Band[MHz]
Uplink/Downlink 890~915 935~960 880~915 925~960 1710~1785 1805~1880 1850~1910 1930~1990
ARFCN range 1~124 0~124 &
975~1023 512~885 512~810
Tx/Rx spacing 45MHz 45MHz 95MHz 80MHz
Mod. Bit rate
/BitPeriod 270.833kbps 3.692us 270.833kbps 3.692us 270.833kbps 3.692us 270.833kbps 3.692us
Time Slot Period
/FramePeriod 576.9us 4.615ms 576.9us 4.615ms 576.9us 4.615ms 576.9us 4.615ms
Modulation 0.3GMSK 0.3GMSK 0.3GMSK 0.3GMSK
MS Power 33dBm~13dBm 33dBm~5dBm 30dBm~0dBm 30dBm~0dBm
Power Class 5pcl ~ 15pcl 5pcl ~ 19pcl 0pcl ~ 15pcl 0pcl ~ 15pcl
Sensitivity -102dBm -102dBm -100dBm -100dBm
TDMA Mux 8 8 8 8
Cell Radius 35Km 35Km 2Km -
1-1. GSM General Specification

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Specification
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1-2
TX Power
control level GSM900
5 33±3 dBm
6 31±3 dBm
7 29±3 dBm
8 27±3 dBm
9 25±3 dBm
10 23±3 dBm
11 21±3 dBm
12 19±3 dBm
13 17±3 dBm
14 15±3 dBm
15 13±3 dBm
16 11±5 dBm
17 9±5 dBm
18 7±5 dBm
19 5±5 dBm
TX Power
control level DCS1800
0 30±3 dBm
1 28±3 dBm
2 26±3 dBm
3 24±3 dBm
4 22±3 dBm
5 20±3 dBm
6 18±3 dBm
7 16±3 dBm
8 14±3 dBm
9 12±4 dBm
10 10±4 dBm
11 8±4dBm
12 6±4 dBm
13 4±4 dBm
14 2±5 dBm
15 0±5 dBm
TX Power
control level PCS1900
0 30±3 dBm
1 28±3 dBm
2 26±3 dBm
3 24±3 dBm
4 22±3 dBm
5 20±3 dBm
6 18±3 dBm
7 16±3 dBm
8 14±3 dBm
9 12±4 dBm
10 10±4 dBm
11 8±4dBm
12 6±4 dBm
13 4±4 dBm
14 2±5 dBm
15 0±5 dBm
1-2. GSM TX power class

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2. Circuit Description
2-1
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2-1. SGH-E760 RF Circuit Description
2-1-1. RX PART
- FEM(MODULE100) →Switching Tx, Rx path for GSM900, DCS1800 and PCS1900 by logic controlling.
- FEM Control Logic (MODULE100) →Truth Table
VC1 VC2 VC3
Tx Mode (GSM900) H L L
Tx Mode (DCS1800/1900) L H L(H)
Rx Mode (GSM900) L L L
Rx Mode (DCS1800) L L L
Rx Mode (PCS1900) L L H
- VC-TCXO-2146C6(26MHz) (OSC100)
This module generates the 26MHz reference clock to drive the logic and RF.
It is turned on when the supply voltage is applied.
After buffering a reference clock of 26MHz is supplied to the other parts of the system through the transceiver pin
VCXOOUT1.
- Transceiver (U100)
This chip is a RF transceiver IC for GSM850/900, DCS1800, and PCS1900 Quad band cellular system, and incorporates
GPRS transceiver capability, and integrates most of the low power silicon functions of a transceiver.
It incorporates triple RF LNAs, direct conversion mixers which are IQ demodulator, an auto offset calibrated
programmable gain amplifier with baseband filter for IQ chains, RF synthesizer, a I/Q modulator, offset PLL, IF
synthesizer, and the circuits which are needed polar loop architecture for the transmitter.
2-1-2. TX PART
Transmitter of the transceiver is capable of GMSK and 8-PSK modulation, providing support for conventional GSM and
GPRS. The modulated signal out of the transceiver is fed into Power Amplifer Module(U101). PAM output signal is
radiated to the air through FEM(MODULE1) and antenna.

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Circuit Description
2-2
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2-2. Baseband Circuit description of SGH-E760
2-2-1.. PCF5603 (U405)
―Power Management
Eight low-dropout regulators designed specifically for GSM applications power the terminal and help ensure optimal
system performance and long battery life. A programmable boost converter provides support for 1.8V, 3.0V SIMs,
while a self-resetting, electronically fused switch supplies power to external accessories.
Ancillary support functions, such as RTC module and High Voltage Charge pump, Clock generator, aid in reducing
both board area and system complexity.
I2C BUS serial interface provides access to control and configuration registers. This interface gives a microprocessor
full control of the PCF50603 and enables system designers to maximize both standby and talk times.
Supervisory functions. including a reset generator, an input voltage monitor, and a temperature sensor, support reliable
system design. These functions work together to ensure proper system behavior during start-up or in the event of a
fault condition(low microprocessor voltage, insufficient battery energy, or excessive die temperature).
―Backlight Brightness Modulator
The Backlight Brightness Modulator (BBM) contains a programmable Pulse-width modulator (PWM) and FET to
modulate the intensity of a series of LED’s or to control a DC/DC converter that drives LCD backlight.
―Clock Generator
The Clock Generator (CG) generates all clocks for internal and external usage. The 32.768 kHz crystal oscillator
provides an accurate low clock frequency for the PCF50603 and other circuitry.
2-2-2. LCD Connector
LCD is consisted of main MAIN LCD, SUB LCD
Chip select signals in the U305, LCD_CS, can enable LCD. BACKLIGHT signal enables white LED of main LCD. These
signal is from U400.
16-bit data lines(LD(0)~LD(15)) transfers data and commands to LCD. Data and commands use "RS" signal. If this signal
is high, Inputs to LCD are commands. If it is low, Inputs to LCD are data. The signal which informs the input or output
state to LCD, is required. But this system is not necessary this signal. So "L_WR" signal is used to write data or
commands to LCD. Power signals for LCD are "VDD_IO_HIGH".
2-2-3. Key
This is consisted of key interface pins KEY_ROW(0:4) and KEY_COL(0:4) in PCF5213EL1. These signals compose the
matrix. Result of matrix informs the key status to key interface in the PCF5213EL1. Power on/off key is seperated from
the matrix. So power on/off signal is connected with PCF50603 to enable PCF50603. Key LED is consisted of six white
LEDs for sub key and eight white LEDs for main key.
Main and Sub key LED use the 3.3V LDO for a supply voltage. KEY_LED_ON signal enables eight white LED.

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Circuit Description
2-3
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2-2-4. EMI ESD Filter
This system uses the EMI ESD filter, U500 to protect noise from IF CONNECTOR part.
2-2-5. IF connetor
It is 18-pin connector. They are designed to use VBAT, V_EXT_CHARGE, USB_D+, +VBUS, USB_D-, TXD1, RXD1,
AUX_ON, EXT1, EXT2 and GND. They connected to power supply IC, microprocessor and signal processor IC.
2-2-6. Battery Charge Management
A complete constant-current/constant-voltage linear charger for single cell lithium-ion batteries.
If TA connected to phone, "V_EXT_CHARGE" enable charger IC and supply current to battery.
When fault condition caused, "CHG_ON" signal level change low to high and charger IC stop charging process.
2-2-7. Audio
HFR_P and HFR_N from PCF5213EL1 are connected to the main speaker via analog switches. MIC_P and MIC_N
are connected to the main MIC as well. YMU765 is a synthesizer LSI for mobile phones. This LSI has a built-in speaker
amplifier for outputting sounds that are used by mobile phones in addition to game sounds and ringing melodies that are
replayed by a synthesizer.
There is Stereophonic analog output for Headphone.
2-2-8. Memory
This system uses Samsung's memory, KBJ10KB00A.TheKBJ10KB00A. is a Multi Chip Package
Memory whichcombines 256Mbit Synchronous Burst Multi Bank NOR Flash Memory and 1Gbit NAND
Flash and 128Mbit Synchronous Burst U tRAM.
It has 16 bit data line, HD[1~16] which is connected to PCF5213 and MV3315DOQ, also has 24 bit address lines,
HA[1~24]. There are 3 chip select signals, CS0n_FLASH, CS4n_NAND, and CS1n_RAM.
In the Wrting process, WEn is fallen to low and it enables writing process to operate. During reading process,
OEn is fallen to low and it enables reading process to operate. Each chip select signals in the PCF5213EL1 choose
different memories.
2-2-9. PCF5213EL1
The PCF5213EL1 is mainly composed of embeded DSP and ARM core. The DSP subsystem includes the Saturn
DSP core with embedded RAM and ROM, and a set of peripherals. It has 24kx16 bits PRAM, 104k*16 bits,
32k*16 XYRAM and 63k*16 XYROM in the DSP.
The ARM946E-S consists of an ARM9E-S processor core, 8 kbyte instruction cache and 8 kbyte data cache,
tghtly-coupled ITCM(Instruction Tightly Coupled Memory) and DTCM(Data Tightly Coupled Memory) memories, a
memory protection unit, and an AMBA(Advanced Microcontroller Bus Architecture) AHB(Advanced
High-performance Bus) bus interface with a write buffer.
HD(0:15), data lines and HA(0:23), address lines are connected to KBJ10KB00M (memory), MV319DNQ (image dsp)
and YMU765 (melody IC). It has 64 kbyte SC RAM (0.5 Mbit) and 32 kbyte SC program ROM for bootstrap
loader in the ARM core.

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Circuit Description
2-4
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HD(0:15), data lines and HA(0:23), address lines are connected to memory and YMU765 to communicate.
MV319DNQ(Camera DSP Chip) controls the communication between ARM core and DSP core.
OEn, WEn control the access of memory. KROW, and KCOL recognize the key string input status.
It has J-TAG control pins (TDI/TDO/TCK) for ARM and DSP core. J-SEL signal controls different access to ARM
and DSP core.
ADC(Analog to Digital Convertor) receives the condition of temperature, battery type and battery voltage.
2-2-10. TOH2600DGI4KRA(26MHz)
This system uses the 26MHz TCXO, VC-TCXO-214C6.AFC control signal form PCF5213EL1 controls requency from
26MHz x-tal. It generates the clock frequency. This clock is connected to PCF5213EL1, YMU765 and
MV3315DOQ.
2-2-11. Camera DSP(MV3315DOQ)
MV3315DOQ provides rich video functions up to 30-frame display with minimized tasks in the handset main processor
as well as hardware based real-time JPEG compression and decompression. MV3315DOQ directly transmits and
previews the RGB data to the LCD graphic memory by processing the sensor output data according to the
handset's command. It can save the raw RGB data up to VGA resoultion into its image buffer and allows the
host processor to download with scalable sized compressed data.
It utilizes 16 bit data bus for communication with the main processor, including bus interface types.
2-2-12. KXP74
KXP74 is Tri-axis Orthogonal accelerometers and inclinometers.
The KXP74 utilizes an onboard Serial Peripheral Interface (SPI) for digital communication.
PCF5213EL1 apply KXP74 for G- button and game

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3. Exploded View and Parts List
3-1
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3-1. Exploded View
QCA01
QLC01
QMO01 QAR01
QFL01
QHI01
QSC05
QMW02
QFU01
QLC02
QFR01
QKP01
QVK01
QCA02
QMP01
QAN02
QCK02
QRE01
QCR06
QBA01
QRF01
QCR06
QSC07
QME01
QRF03
QVO02
QIF01

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Exploded view and Part List
3-2
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3-2. Parts List
Location No Description Sec Code
QAN02 ㅤINTENNA-SGHE760;390-OY359,SGH-E760,8 GH42-00638A
QAR01 ㅤAUDIO-RECEIVER;32ohm,110dB±2dB,10X3 3009-001124
QBA01 ㅤBATTERY-800MAH,BLA,ENG,M;BST5208BE,S GH43-02028A
QCA01 ㅤUNIT-CAMERA;SGH-E760,AU-61C,-,RUSS,2 GH59-02218A
QCA02 ㅤUNIT-CAMERA;SGH-E760,-,-,SER,12V,10m GH59-02229A
QCK02 ㅤPMO-SIDE KEY CAMERA;SGH-E760,ABS+URE GH72-22978A
QCR06 ㅤSCREW-MACHINE;PH(PI2.5),+,M1.4,L3.5, 6001-001155
QFR01 ㅤMEC-FRONT COVER;SGH-E760,EU,-,-,-,-, GH75-07395A
QFU01 ㅤMEC-FOLDER UPPER;SGH-E760,EU,-,-,-,- GH75-07396A
QIF01 ㅤPMO-IF COVER V1;SGH-E760,PC+URETHANE GH72-22976A
QKP01 ㅤMEC-KEY PAD;SGH-E760,EU,-,-,-,-,SIL, GH75-07398A
QLC01 ㅤLCD-SGH-E760-MAIN;LTS180QC-F02,SGH-E GH07-00737A
QLC02 ㅤLCD-SGH-SUB-MODULE;PM09EC015A,SGH-E7 GH07-00741A
QME01 ㅤUNIT-METAL DOME;SGH-E760,-,-,EU,12V, GH59-02227A
QMO01 ㅤMOTOR DC-SCHX460;DMJBRK32M,SCH-X460, GH31-00036A
QMP01 ㅤPBA MAIN-SGHE760;SGH-E760,XET,EU,PBA GH92-02239A
QMW02 ㅤPCT-MAIN WINDOW;SGH-E760,ACRYL,TRP,- GH72-22981A
QRE01 ㅤMEC-REAR COVER;SGH-E760,EU,-,-,-,-,B GH75-07399A
QRF01 ㅤMPR-TAPE RF CAP;SGH-E760,PC SHEET,5. GH74-15696A
QRF03 ㅤPMO-EAR COVER V2;SGH-E760,PC,BLK,-,- GH72-23993A
QSC05 ㅤRMO-SCREW CAP L;SGH-E760,URETHANE,3. GH73-04940A
QSC07 ㅤRMO-SCREW CAP R;SGH-E760,URETHANE,3. GH73-04941A
QVK01 ㅤUNIT-VOLUME KEY;SGH-E760,-,-,SER,12V GH59-02228A
QVO02 ㅤPMO-SIDE KEY VOLUME;SGH-E760,ABS+URE GH72-22977A
QFL01 ㅤMEC-FOLDER LOWER;SGH-E760,EU,-,-,-,- GH75-07397A
ㅤQHI01 MEC-HINGE ASSY;SGH-E760,EU,-,-,-,-,S GH75-07551A