Samsung SGH-E760 User manual

GSM TELEPHONE
SGH-E760
GSM TELEPHONE CONTENTS
1. Specification
2. Circuit Description
3. Exploded Views and Parts List
4. Electrical Parts List
5. Block Diagrams
6. PCB Diagrams
7. Flow Chart of Troubleshooting

Samsung Electronics Co.,Ltd. September. 2005
Printed in Korea.
Code No.: GH68-08106A
BASIC.
This Service Manual is a property of Samsung Electronics Co.,Ltd.
Any unauthorized use of Manual can be punished under applicable
International and/or domestic law.
ⓒ

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1. Specification
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1-1
GSM900
Phase 1 EGSM 900 Phase 2 DCS1800 Phase 1 PCS1900
Freq. Band[MHz]
Uplink/Downlink 890~915 935~960 880~915 925~960 1710~1785 1805~1880 1850~1910 1930~1990
ARFCN range 1~124 0~124 &
975~1023 512~885 512~810
Tx/Rx spacing 45MHz 45MHz 95MHz 80MHz
Mod. Bit rate
/BitPeriod 270.833kbps 3.692us 270.833kbps 3.692us 270.833kbps 3.692us 270.833kbps 3.692us
Time Slot Period
/FramePeriod 576.9us 4.615ms 576.9us 4.615ms 576.9us 4.615ms 576.9us 4.615ms
Modulation 0.3GMSK 0.3GMSK 0.3GMSK 0.3GMSK
MS Power 33dBm~13dBm 33dBm~5dBm 30dBm~0dBm 30dBm~0dBm
Power Class 5pcl ~ 15pcl 5pcl ~ 19pcl 0pcl ~ 15pcl 0pcl ~ 15pcl
Sensitivity -102dBm -102dBm -100dBm -100dBm
TDMA Mux 8 8 8 8
Cell Radius 35Km 35Km 2Km -
1-1. GSM General Specification

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Specification
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1-2
TX Power
control level GSM900
5 33±3 dBm
6 31±3 dBm
7 29±3 dBm
8 27±3 dBm
9 25±3 dBm
10 23±3 dBm
11 21±3 dBm
12 19±3 dBm
13 17±3 dBm
14 15±3 dBm
15 13±3 dBm
16 11±5 dBm
17 9±5 dBm
18 7±5 dBm
19 5±5 dBm
TX Power
control level DCS1800
0 30±3 dBm
1 28±3 dBm
2 26±3 dBm
3 24±3 dBm
4 22±3 dBm
5 20±3 dBm
6 18±3 dBm
7 16±3 dBm
8 14±3 dBm
9 12±4 dBm
10 10±4 dBm
11 8±4dBm
12 6±4 dBm
13 4±4 dBm
14 2±5 dBm
15 0±5 dBm
TX Power
control level PCS1900
0 30±3 dBm
1 28±3 dBm
2 26±3 dBm
3 24±3 dBm
4 22±3 dBm
5 20±3 dBm
6 18±3 dBm
7 16±3 dBm
8 14±3 dBm
9 12±4 dBm
10 10±4 dBm
11 8±4dBm
12 6±4 dBm
13 4±4 dBm
14 2±5 dBm
15 0±5 dBm
1-2. GSM TX power class

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2. Circuit Description
2-1
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2-1. SGH-E760 RF Circuit Description
2-1-1. RX PART
- FEM(MODULE100) →Switching Tx, Rx path for GSM900, DCS1800 and PCS1900 by logic controlling.
- FEM Control Logic (MODULE100) →Truth Table
VC1 VC2 VC3
Tx Mode (GSM900) H L L
Tx Mode (DCS1800/1900) L H L(H)
Rx Mode (GSM900) L L L
Rx Mode (DCS1800) L L L
Rx Mode (PCS1900) L L H
- VC-TCXO-2146C6(26MHz) (OSC100)
This module generates the 26MHz reference clock to drive the logic and RF.
It is turned on when the supply voltage is applied.
After buffering a reference clock of 26MHz is supplied to the other parts of the system through the transceiver pin
VCXOOUT1.
- Transceiver (U100)
This chip is a RF transceiver IC for GSM850/900, DCS1800, and PCS1900 Quad band cellular system, and incorporates
GPRS transceiver capability, and integrates most of the low power silicon functions of a transceiver.
It incorporates triple RF LNAs, direct conversion mixers which are IQ demodulator, an auto offset calibrated
programmable gain amplifier with baseband filter for IQ chains, RF synthesizer, a I/Q modulator, offset PLL, IF
synthesizer, and the circuits which are needed polar loop architecture for the transmitter.
2-1-2. TX PART
Transmitter of the transceiver is capable of GMSK and 8-PSK modulation, providing support for conventional GSM and
GPRS. The modulated signal out of the transceiver is fed into Power Amplifer Module(U101). PAM output signal is
radiated to the air through FEM(MODULE1) and antenna.

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Circuit Description
2-2
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2-2. Baseband Circuit description of SGH-E760
2-2-1.. PCF5603 (U405)
―Power Management
Eight low-dropout regulators designed specifically for GSM applications power the terminal and help ensure optimal
system performance and long battery life. A programmable boost converter provides support for 1.8V, 3.0V SIMs,
while a self-resetting, electronically fused switch supplies power to external accessories.
Ancillary support functions, such as RTC module and High Voltage Charge pump, Clock generator, aid in reducing
both board area and system complexity.
I2C BUS serial interface provides access to control and configuration registers. This interface gives a microprocessor
full control of the PCF50603 and enables system designers to maximize both standby and talk times.
Supervisory functions. including a reset generator, an input voltage monitor, and a temperature sensor, support reliable
system design. These functions work together to ensure proper system behavior during start-up or in the event of a
fault condition(low microprocessor voltage, insufficient battery energy, or excessive die temperature).
―Backlight Brightness Modulator
The Backlight Brightness Modulator (BBM) contains a programmable Pulse-width modulator (PWM) and FET to
modulate the intensity of a series of LED’s or to control a DC/DC converter that drives LCD backlight.
―Clock Generator
The Clock Generator (CG) generates all clocks for internal and external usage. The 32.768 kHz crystal oscillator
provides an accurate low clock frequency for the PCF50603 and other circuitry.
2-2-2. LCD Connector
LCD is consisted of main MAIN LCD, SUB LCD
Chip select signals in the U305, LCD_CS, can enable LCD. BACKLIGHT signal enables white LED of main LCD. These
signal is from U400.
16-bit data lines(LD(0)~LD(15)) transfers data and commands to LCD. Data and commands use "RS" signal. If this signal
is high, Inputs to LCD are commands. If it is low, Inputs to LCD are data. The signal which informs the input or output
state to LCD, is required. But this system is not necessary this signal. So "L_WR" signal is used to write data or
commands to LCD. Power signals for LCD are "VDD_IO_HIGH".
2-2-3. Key
This is consisted of key interface pins KEY_ROW(0:4) and KEY_COL(0:4) in PCF5213EL1. These signals compose the
matrix. Result of matrix informs the key status to key interface in the PCF5213EL1. Power on/off key is seperated from
the matrix. So power on/off signal is connected with PCF50603 to enable PCF50603. Key LED is consisted of six white
LEDs for sub key and eight white LEDs for main key.
Main and Sub key LED use the 3.3V LDO for a supply voltage. KEY_LED_ON signal enables eight white LED.

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Circuit Description
2-3
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2-2-4. EMI ESD Filter
This system uses the EMI ESD filter, U500 to protect noise from IF CONNECTOR part.
2-2-5. IF connetor
It is 18-pin connector. They are designed to use VBAT, V_EXT_CHARGE, USB_D+, +VBUS, USB_D-, TXD1, RXD1,
AUX_ON, EXT1, EXT2 and GND. They connected to power supply IC, microprocessor and signal processor IC.
2-2-6. Battery Charge Management
A complete constant-current/constant-voltage linear charger for single cell lithium-ion batteries.
If TA connected to phone, "V_EXT_CHARGE" enable charger IC and supply current to battery.
When fault condition caused, "CHG_ON" signal level change low to high and charger IC stop charging process.
2-2-7. Audio
HFR_P and HFR_N from PCF5213EL1 are connected to the main speaker via analog switches. MIC_P and MIC_N
are connected to the main MIC as well. YMU765 is a synthesizer LSI for mobile phones. This LSI has a built-in speaker
amplifier for outputting sounds that are used by mobile phones in addition to game sounds and ringing melodies that are
replayed by a synthesizer.
There is Stereophonic analog output for Headphone.
2-2-8. Memory
This system uses Samsung's memory, KBJ10KB00A.TheKBJ10KB00A. is a Multi Chip Package
Memory whichcombines 256Mbit Synchronous Burst Multi Bank NOR Flash Memory and 1Gbit NAND
Flash and 128Mbit Synchronous Burst U tRAM.
It has 16 bit data line, HD[1~16] which is connected to PCF5213 and MV3315DOQ, also has 24 bit address lines,
HA[1~24]. There are 3 chip select signals, CS0n_FLASH, CS4n_NAND, and CS1n_RAM.
In the Wrting process, WEn is fallen to low and it enables writing process to operate. During reading process,
OEn is fallen to low and it enables reading process to operate. Each chip select signals in the PCF5213EL1 choose
different memories.
2-2-9. PCF5213EL1
The PCF5213EL1 is mainly composed of embeded DSP and ARM core. The DSP subsystem includes the Saturn
DSP core with embedded RAM and ROM, and a set of peripherals. It has 24kx16 bits PRAM, 104k*16 bits,
32k*16 XYRAM and 63k*16 XYROM in the DSP.
The ARM946E-S consists of an ARM9E-S processor core, 8 kbyte instruction cache and 8 kbyte data cache,
tghtly-coupled ITCM(Instruction Tightly Coupled Memory) and DTCM(Data Tightly Coupled Memory) memories, a
memory protection unit, and an AMBA(Advanced Microcontroller Bus Architecture) AHB(Advanced
High-performance Bus) bus interface with a write buffer.
HD(0:15), data lines and HA(0:23), address lines are connected to KBJ10KB00M (memory), MV319DNQ (image dsp)
and YMU765 (melody IC). It has 64 kbyte SC RAM (0.5 Mbit) and 32 kbyte SC program ROM for bootstrap
loader in the ARM core.

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Circuit Description
2-4
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HD(0:15), data lines and HA(0:23), address lines are connected to memory and YMU765 to communicate.
MV319DNQ(Camera DSP Chip) controls the communication between ARM core and DSP core.
OEn, WEn control the access of memory. KROW, and KCOL recognize the key string input status.
It has J-TAG control pins (TDI/TDO/TCK) for ARM and DSP core. J-SEL signal controls different access to ARM
and DSP core.
ADC(Analog to Digital Convertor) receives the condition of temperature, battery type and battery voltage.
2-2-10. TOH2600DGI4KRA(26MHz)
This system uses the 26MHz TCXO, VC-TCXO-214C6.AFC control signal form PCF5213EL1 controls requency from
26MHz x-tal. It generates the clock frequency. This clock is connected to PCF5213EL1, YMU765 and
MV3315DOQ.
2-2-11. Camera DSP(MV3315DOQ)
MV3315DOQ provides rich video functions up to 30-frame display with minimized tasks in the handset main processor
as well as hardware based real-time JPEG compression and decompression. MV3315DOQ directly transmits and
previews the RGB data to the LCD graphic memory by processing the sensor output data according to the
handset's command. It can save the raw RGB data up to VGA resoultion into its image buffer and allows the
host processor to download with scalable sized compressed data.
It utilizes 16 bit data bus for communication with the main processor, including bus interface types.
2-2-12. KXP74
KXP74 is Tri-axis Orthogonal accelerometers and inclinometers.
The KXP74 utilizes an onboard Serial Peripheral Interface (SPI) for digital communication.
PCF5213EL1 apply KXP74 for G- button and game

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3. Exploded View and Parts List
3-1
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3-1. Exploded View
QCA01
QLC01
QMO01 QAR01
QFL01
QHI01
QSC05
QMW02
QFU01
QLC02
QFR01
QKP01
QVK01
QCA02
QMP01
QAN02
QCK02
QRE01
QCR06
QBA01
QRF01
QCR06
QSC07
QME01
QRF03
QVO02
QIF01

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Exploded view and Part List
3-2
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3-2. Parts List
Location No Description Sec Code
QAN02 ㅤINTENNA-SGHE760;390-OY359,SGH-E760,8 GH42-00638A
QAR01 ㅤAUDIO-RECEIVER;32ohm,110dB±2dB,10X3 3009-001124
QBA01 ㅤBATTERY-800MAH,BLA,ENG,M;BST5208BE,S GH43-02028A
QCA01 ㅤUNIT-CAMERA;SGH-E760,AU-61C,-,RUSS,2 GH59-02218A
QCA02 ㅤUNIT-CAMERA;SGH-E760,-,-,SER,12V,10m GH59-02229A
QCK02 ㅤPMO-SIDE KEY CAMERA;SGH-E760,ABS+URE GH72-22978A
QCR06 ㅤSCREW-MACHINE;PH(PI2.5),+,M1.4,L3.5, 6001-001155
QFR01 ㅤMEC-FRONT COVER;SGH-E760,EU,-,-,-,-, GH75-07395A
QFU01 ㅤMEC-FOLDER UPPER;SGH-E760,EU,-,-,-,- GH75-07396A
QIF01 ㅤPMO-IF COVER V1;SGH-E760,PC+URETHANE GH72-22976A
QKP01 ㅤMEC-KEY PAD;SGH-E760,EU,-,-,-,-,SIL, GH75-07398A
QLC01 ㅤLCD-SGH-E760-MAIN;LTS180QC-F02,SGH-E GH07-00737A
QLC02 ㅤLCD-SGH-SUB-MODULE;PM09EC015A,SGH-E7 GH07-00741A
QME01 ㅤUNIT-METAL DOME;SGH-E760,-,-,EU,12V, GH59-02227A
QMO01 ㅤMOTOR DC-SCHX460;DMJBRK32M,SCH-X460, GH31-00036A
QMP01 ㅤPBA MAIN-SGHE760;SGH-E760,XET,EU,PBA GH92-02239A
QMW02 ㅤPCT-MAIN WINDOW;SGH-E760,ACRYL,TRP,- GH72-22981A
QRE01 ㅤMEC-REAR COVER;SGH-E760,EU,-,-,-,-,B GH75-07399A
QRF01 ㅤMPR-TAPE RF CAP;SGH-E760,PC SHEET,5. GH74-15696A
QRF03 ㅤPMO-EAR COVER V2;SGH-E760,PC,BLK,-,- GH72-23993A
QSC05 ㅤRMO-SCREW CAP L;SGH-E760,URETHANE,3. GH73-04940A
QSC07 ㅤRMO-SCREW CAP R;SGH-E760,URETHANE,3. GH73-04941A
QVK01 ㅤUNIT-VOLUME KEY;SGH-E760,-,-,SER,12V GH59-02228A
QVO02 ㅤPMO-SIDE KEY VOLUME;SGH-E760,ABS+URE GH72-22977A
QFL01 ㅤMEC-FOLDER LOWER;SGH-E760,EU,-,-,-,- GH75-07397A
ㅤQHI01 MEC-HINGE ASSY;SGH-E760,EU,-,-,-,-,S GH75-07551A

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Exploded view and Part List
3-3
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Description Sec Code
BAG PE;LDPE,T0.05,W80,L180,TRP,-,- 6902-000634
CBF INTERFACE-DATA LINK CABLE;SGH-D5 GH39-00371A
ADAPTOR-SGHD500 BLK;TAD137EBE,SGH-D5 GH44-00954A
S/W CD-PC LINK CD;SGH-D500,SGH-D500, GH46-00127A
UNIT-EARPHONE;SGH-C230,EM-SS550E-STB GH59-02166A
SPRING ETC-LOCKER;SGH-T108,KSD3509,0 GH61-00028A
LABEL(P)-WATER SOAK;COMM,NORGE,100G, GH68-02026A
MANUAL-WEEE CARD;COMM,SEC,ENGLISH,UN GH68-07013A
MANUAL-USER;SGH-E760,XEG,GERMAN,GERM GH68-07680A
LABEL(R)-MAIN(EU);SGH-E760,EU,POLYES GH68-07758A
CUSHION-CASE MAIN;SGH-E750,PULP,T0.5 GH69-03134A
BOX(P)-UNIT(EU);SGH-E760,SC350+SC350 GH69-03138A
PMO-BATT LOCKER;SGH-E760,PC(K2261),B GH72-22975A
RMO-PBA-MCP-RUBBER;SGH-E760,CR RUBBE GH73-05327A
MPR-BOHO VINYL IF;SGH-E720,#950,85X1 GH74-13606A
MPR-TAPE FPCB HOLE;SGH-E760,PC SHEET GH74-16158A
MPR-TAPE INS KEY TOP;SGH-E760,3M 851 GH74-17312A
MPR-TAPE EMI MAIN KEY;SGH-E760,DTF10 GH74-17453A
MPR-TAPE J/TAG BOHO;SGH-E760,DTF100, GH74-17540A
MPR-TAPE CAMERA KEY;SGH-E760,3M-851, GH74-17546A
MPR-TAPE VOLUME KEY;SGH-E760,3M-851, GH74-17547A
MPR-BOHO VINYL SUB WIN;SGH-E760,PVC, GH74-17759A

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Exploded view and Part List
3-4
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3-3. Test Jig (GH80-03306A)
3-3-1. RF Test Cable
(GH39-00283A) 3-3-2. Test Cable (GH39-00337A) 3-3-3. Serial Cable
3-3-4. Power Supply Cable 3-3-5. DATA CABLE
(GH39-00219A) 3-3-6. TA
(GH44-00954A)

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4. Electrical Parts List
4-1
This Document can not be used without Samsung's authorization
SEC CODE Description Design LOC
ANT102 ANT-CHIP 4202-001064
BAT400 BATTERY 4302-001177
BTC500 CONNECTOR-HEADER 3711-005829
C100,C102,C103,C111 C-CERAMIC,CHIP 2203-000812
C104 INDUCTOR-SMD2703-002170
C106,C107,C115 C-CERAMIC,CHIP 2203-002668
C108,C112 C-CERAMIC,CHIP 2203-001259
C116 C-TA,CHIP 2404-001348
C117 C-CERAMIC,CHIP 2203-006190
C118,C119,C131,C133 C-CERAMIC,CHIP 2203-005482
C120,C204,C210 C-CERAMIC,CHIP 2203-000812
C121,U703 C-CERAMIC,CHIP 2203-000654
C122,C126 C-TA,CHIP 2404-001374
C123,C127,C132,C147 C-CERAMIC,CHIP 2203-000628
C124,C128,C135,C201 C-CERAMIC,CHIP 2203-000254
C125,C420 C-CERAMIC,CHIP 2203-000585
C134,C136,C303 C-CERAMIC,CHIP 2203-000438
C137,C140,C407 C-CERAMIC,CHIP 2203-000233
C142,C618 C-CERAMIC,CHIP 2203-000679
C143,C202,C203,C205 C-CERAMIC,CHIP 2203-005482
C144 C-CERAMIC,CHIP 2203-000870
C146 C-CERAMIC,CHIP 2203-006399
C148,C402,C406,C408 C-CERAMIC,CHIP 2203-000628
C200,C306,C400,C401 C-CERAMIC,CHIP 2203-006208
C206,C207,C208,C211 C-CERAMIC,CHIP 2203-005482
C212,C213,C214,C216 C-CERAMIC,CHIP 2203-005482
C300,C626 C-CERAMIC,CHIP 2203-000254
C301,C302,C305,C307 C-CERAMIC,CHIP 2203-005482
C304 C-CERAMIC,CHIP 2203-000725
C308,C311,C312,C315 C-CERAMIC,CHIP 2203-005482
C309 C-CERAMIC,CHIP 2203-000550
C317,C320,C329,C404 C-CERAMIC,CHIP 2203-005482
C321,C412,C501,C507 C-CERAMIC,CHIP 2203-006093
C326,C327,C328 C-CERAMIC,CHIP 2203-005481
C403 C-CERAMIC,CHIP 2203-006090
C405,C414,C415,C423 C-CERAMIC,CHIP 2203-006257
C409,C504,C508 C-TA,CHIP 2404-001268
C411,C413,C416,C421 C-CERAMIC,CHIP 2203-006208
C417,C503,C509,C603 C-CERAMIC,CHIP 2203-005482
C422,C700 C-CERAMIC,CHIP 2203-006208
C424 C-CERAMIC,CHIP 2203-006257
C502 C-CERAMIC,CHIP 2203-000854
C505,C506 C-CERAMIC,CHIP 2203-006562
C600,C615 C-TA,CHIP 2404-001375
C601,C602,C606,C610 C-CERAMIC,CHIP 2203-000278
C604 C-TA,CHIP 2404-001352
C605,C608,C617,C621 C-CERAMIC,CHIP 2203-005482
C607,C619,C627,C628 C-CERAMIC,CHIP 2203-000995
C609,C611,C613,C614 C-CERAMIC,CHIP 2203-006585
C612,C616,C620,C624 C-CERAMIC,CHIP 2203-000278

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Electrical Parts List
4-2
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SEC CODE Description Design LOC
C622,C623 C-CERAMIC,CHIP 2203-005057
C625 C-CERAMIC,CHIP 2203-006137
C629,C630 C-CERAMIC,CHIP 2203-000995
C701 C-CERAMIC,CHIP 2203-002443
C702,U713 C-CERAMIC,CHIP 2203-005482
C704 C-CERAMIC,CHIP 2203-006053
C705,C706 C-CERAMIC,CHIP 2203-006093
CN501 CONNECTOR-SOCKET 3710-001994
CN601 JACK-PHONE[phone]
CON1 CONNECTOR-COAXIAL3705-001358
F101 FILTER-EMI SMD2901-001254
F104,F105 FILTER-EMI SMD2901-001347
HEA702 CONNECTOR-HEADER 3711-005873
L103 INDUCTOR-SMD2703-002314
L104,L105,L109,L110 INDUCTOR-SMD2703-002365
L107 INDUCTOR-SMD2703-002596
L119 INDUCTOR-SMD2703-001752
L123,L124 INDUCTOR-SMD2703-002208
L400 CORE-FERRITEBEAD3301-001120
L401 INDUCTOR-SMD2703-002840
L600,L601,L602,L603 INDUCTOR-SMD2703-001259
L700 CORE-FERRITEBEAD3301-001534
LED600,LED601,LED602 LED 0601-002055
LED603,LED604,LED605 LED 0601-002055
LED606,LED607,LED608 LED 0601-002055
LED609,LED610,LED611 LED 0601-002055
LED612,LED613,LED614 LED 0601-002055
LED615,LED616,LED617 LED 0601-002055
MIC600 MIC-CONDENSOR 3003-001107
MODULE1FILTER 2911-000007
OSC100 OSCILLATOR-VCTCXO2809-001281
OSC400 CRYSTAL-UNIT 2801-004373
Q100,Q101,Q102,Q103 TR-DIGITAL0504-001151
R100,R101,R102,R104 R-CHIP 2007-000162
R105 R-CHIP 2007-000173
R108,R200,R307,R504 R-CHIP 2007-000148
R110,R118,R120,R127 R-CHIP 2007-000171
R121,R125 R-CHIP 2007-007014
R122,R124,R128,R131 R-CHIP 2007-000170
R123 R-CHIP 2007-001303
R130,R132,R134,R201 R-CHIP 2007-000171
R133,R608,R615,U709 R-CHIP 2007-000138
R203,R204,R600,R603 R-CHIP 2007-000242
R205 R-NETWORK 2011-001394
R206 R-CHIP 2007-000143
R208,R209,R213,R308 R-CHIP 2007-000171
R302 R-CHIP 2007-001325
R303,R306,R404,R501 R-CHIP 2007-000162
R312,R316,R317,R618 R-CHIP 2007-000171
R400 R-CHIP 2007-007592

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Electrical Parts List
4-3
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SEC CODE Description Design LOC
R401,R512 R-CHIP 2007-007334
R402 R-CHIP 2007-007100
R409,R607,R612 R-CHIP 2007-002796
R500,R502 R-CHIP 2007-000758
R503,R509,R613,R700 R-CHIP 2007-000162
R505,R506 R-CHIP 2007-000170
R507 R-CHIP 2007-000152
R510,R616 R-CHIP 2007-007573
R511 R-CHIP 2007-000137
R513 R-CHIP 2007-008275
R514 R-CHIP 2007-007875
R515,R516 R-CHIP 2007-008531
R517,R518 R-CHIP 2007-008542
R601,R610 R-CHIP 2007-000148
R602,R604,R605,R606 R-CHIP 2007-000151
R609,R611 R-CHIP 2007-000242
R614 R-CHIP 2007-001339
R617 R-CHIP 2007-007480
R701,R702,R703,R704 R-CHIP 2007-002970
R705,R706,R707,R708 R-CHIP 2007-002970
R709,R710,R711,R712 R-CHIP 2007-002970
R720 R-CHIP 2007-000162
R721,R722,R723,R724 R-CHIP 2007-002970
R725,R726 R-CHIP 2007-002970
SIM400 CONNECTOR-CARDEDGE3709-001384
U100 IC1205-002709
U101 IC-RF 1201-002223
U103,U303 IC0801-002237
U200 IC1205-002647
U300 IC-IMAGEGH13-00030A
U301 IC1204-002138
U302 MEMORY 1108-000022
U306 IC1209-001618
U307 IC0801-002882
U400 IC1203-003568
U401 IC1203-002837
U500 DIODE-TVS0406-001188
U501 FILTER-EMI SMD2901-001315
U502 TR-DIGITAL0504-001151
U503 IC1203-003742
U504 IC1203-003737
U602,U605,U606 IC1001-001231
U603 IC1202-001068
U700 IC1203-003754
U701 IC1009-001010
U702 FET-SILICON 0505-001469
U711 RF-MODULE 4709-001374
U712 IC1201-002241
V300,V301,V302,V400 VARISTOR 1405-001082
V401,V703 VARISTOR 1405-001133

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Electrical Parts List
4-4
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SEC CODE Description Design LOC
V500 THERMISTOR 1404-001221
V601,V602,V702,V705 VARISTOR 1405-001082
ZD500 DIODE-ZENER 0403-001547
ZD501 DIODE-ZENER 0403-001427
ZD502,ZD600,ZD602 DIODE-TVS0406-001203
ZD601,ZD700,ZD701 DIODE-TVS0406-001208

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This Document can not be used without Samsung's authorization
5. Block Diagrams
5-1
5-1. RF Solution Block Diagram

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Block Diagrams
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5-2
5-2. Base Band Solution Block Diagram

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6. PCB Diagrams
6-1
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6-1. PCB Top Diagram

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PCB Diagrams
6-2
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6-2. PCB Bottom Diagram