Samsung SGH-P270 User manual

GSM TELEPHONE
SGH-P270
1. Safety Precautions
2. Specification
3. Product Function
4. Array course control
5. Exploded View and Parts list
6. MAIN Electrical Parts List
7. Disassembly and Assembly
Instructions
8. Block Diagrams
9. PCB Diagrams
10. Chart of Troubleshooting
11. Reference data
GSM TELEPHONE CONTENTS

This Service Manual is aproperty of Samsung Electronics Co.,Ltd.
Any unauthorized use of Manual can be punished under applicable
International and/or domestic law.
Samsung Electronics Co.,Ltd.
2008. 11. Rev.1.0
ⓒ
Country Web Site
North America service.samsungportal.com
Latin America latin.samsungportal.com
CIS cis.samsungportal.com
Europe europe.samsungportal.com
China china.samsungportal.com
Asia asia.samsungportal.com
Mideast &Africa mea.samsungportal.com
GSPN (Global Service Partner Network)

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2. Specification
This Document can not be used without Samsung's authorization
2-1
GSM900
Phase 1
EGSM 900
Phase 2
DCS1800
Phase 1 PCS1900
Freq. Band[MHz]
Uplink/Downlink
890~915
935~960
880~915
925~960
1710~1785
1805~1880
1850~1910
1930~1990
ARFCN range 1~124 0~124 &
975~1023 512~885 512~810
Tx/Rx spacing 45MHz 45MHz 95MHz 80MHz
Mod. Bit rate
/BitPeriod
270.833kbps
3.692us
270.833kbps
3.692us
270.833kbps
3.692us
270.833kbps
3.692us
Time Slot Period
/FramePeriod
576.9us
4.615ms
576.9us
4.615ms
576.9us
4.615ms
576.9us
4.615ms
Modulation 0.3GMSK 0.3GMSK 0.3GMSK 0.3GMSK
MS Power 33dBm~5dBm 33dBm~5dBm 30dBm~0dBm 30dBm~0dBm
Power Class 5pcl ~ 19pcl 5pcl ~19
pcl 0pcl ~15 pcl 0pcl ~15 pcl
Sensitivity -102dBm -102dBm -100dBm -100dBm
TDMA Mux 8 8 8 8
Cell Radius 35Km 35Km 2Km -
2-1. GSM General Specification

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Specification
2-2
TX Power
control level PCS1900
030±2
dBm
128±3
dBm
226±3
dBm
324±3
dBm
422±3
dBm
520±3
dBm
618±3
dBm
716±3
dBm
814±3
dBm
912±4
dBm
10 10±4 dBm
11 8±4dBm
12 6±4 dBm
13 4±4 dBm
14 2±5 dBm
15 0±5 dBm
TX Power
control level DCS1800
030±2
dBm
128±3
dBm
226±3
dBm
324±3
dBm
422±3
dBm
520±3
dBm
618±3
dBm
716±3
dBm
814±3
dBm
912±4
dBm
10 10±4 dBm
11 8±4dBm
12 6±4 dBm
13 4±4 dBm
14 2±5 dBm
15 0±5 dBm
TX Power
control level GSM900
533±2
dBm
631±3
dBm
729±3
dBm
827±3
dBm
925±3
dBm
10 23±3 dBm
11 21±3 dBm
12 19±3 dBm
13 17±3 dBm
14 15±3 dBm
15 13±3 dBm
16 11±5 dBm
17 9±5 dBm
18 7±5 dBm
19 5±5 dBm
2-2. GSM TX power class

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Specification
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2-3
TX Power
control level GSM900
827±3
dBm
925±3
dBm
10 23±3 dBm
11 21±3 dBm
12 19±3 dBm
13 17±3 dBm
14 15±3 dBm
15 13±3 dBm
16 11±5 dBm
17 9±5 dBm
18 7±5 dBm
19 5±5 dBm
TX Power
control level DCS1800
226-4/+3
dBm
324±3
dBm
422±3
dBm
520±3
dBm
618±3
dBm
716±3
dBm
812±3
dBm
910±3
dBm
10 14±3 dBm
11 12±4 dBm
12 10±4 dBm
13 8±4dBm
14 6±4 dBm
15 4±4 dBm
2-3. GSM EDGE TX power class
TX Power
control level PCS1900
226-4/+3
dBm
324±3
dBm
422±3
dBm
520±3
dBm
618±3
dBm
716±3
dBm
812±3
dBm
910±3
dBm
10 14±3 dBm
11 12±4 dBm
12 10±4 dBm
13 8±4dBm
14 6±4 dBm
15 4±4 dBm

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3. Product Function
3-1
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Main Function
－2MEGA PIXEL CMOS
－MP3 /64Poly Melody
－BT 2.0
－USB 2.0
－WAP 2.0
－FM Radio with RDS
－MIDP 2.0 / CLDC 1.1
－GPRS/EDGE :c
lass 12
－SMS /M
MS
－BT/FM :Stereo FM Radio +BT (CSR)
－Battery: 960mA
－Weight: 93.3 g
－Memory:1G LB +512Mb
－Camera: 2M + CIF CMOS
－LCD :2.2”,176
x220, 262K TFT
－Size: 99x49x14.9mm (TBD)
－Band: 900/1800/1900/2100
－BB :PNX 5217 (NXP)
－RF :UAA3582(3G) +SI4221(2G)

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10. Reference data
10-1
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Reference Abbreviate
―AAC:Advanced Audio Coding.
―AVC :Advanced Video Coding.
―BER :Bit Error Rate
―BPSK:Binary Phase Shift Keying
―CA :Conditional Access
―CDM :Code Division Multiplexing
―C/I :Carrier to Interference
―DMB :Digital Multimedia Broadcasting
―EN :European Standard
―ES :Elementary Stream
―ETSI:European Telecommunications Standards Institute
―MPEG:Moving Picture Experts Group
―PN :Pseudo-random Noise
―PS :Pilot Symbol
―QPSK:Quadrature Phase Shift Keying
―RS :Reed-Solomon
―SI :Service Information
―TDM :Time Division Multiplexing
―TS :Transport Stream

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1. Safety Precautions
1-1
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1-1. Repair Precaution
―Repair in Shield Box, during detailed tuning.
Take specially care of tuning or test,
because specipicty of cellular phone is sensitive for surrounding interference(RF noise).
―Be careful to use akind of magnetic object or tool,
because performance of parts is damaged by the influence of magnetic force.
―Surely use astandard screwdriver when you disassemble this product, otherwise screw
will be worn away.
―Use athicken twisted wire when you measure level.
Athicken twisted wire has low resistance, therefore error of measurement is few.
―Repair after separate Test Pack and Set because for short danger (for example an
overcurrent and furious flames of parts etc) when you repair board in condition of
connecting Test Pack and tuning on.
―Take specially care of soldering, because Land of PCB is small and weak in heat.
―Surely tune on/off while using AC power plug, because arepair of battery charger is
dangerous when tuning ON/OFF PBA and Connector after disassembling charger.
―Don't use as you pleases after change other material than replacement registered on SEC
System.
Otherwise engineer in charge isn't charged with problem that you don't keep this rules.

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Safety Precautions
1-2
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1-2. ESD(Electrostatically Sensitive Devices) Precaution
Several semiconductor may be damaged easily by static electricity. Such parts are called by
ESD(Electrostatically Sensitive Devices), for example IC,BGA chip etc. Read Precaution below.
You can prevent from ESD damage by static electricity.
―Remove static electricity remained your body before you touch semiconductor or parts
with semiconductor. There are ways that you touch an earthed place or wear static
electricity prevention string on wrist.
―Use earthed soldering steel when you connect or disconnect ESD.
―Use soldering removing tool to break static electricity. ,otherwise ESD will be damaged
by static electricity.
―Don't unpack until you set up ESD on product. Because most of ESD are packed by box
and aluminum plate to have conductive power,they are prevented from static electricity.
―You must maintain electric contact between ESD and place due to be set up until ESD is
connected completely to the proper place or acircuit board.

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5. Exploded View and Parts List
5-1
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5-1. Cellular phone Exploded View
QMW01
QFU01
QMO01
QFL01
QCR17
QAR01
QCA02
QLC01
QME02
QKP02
QPC01
QFR01
QKP01
QME01
QCR12
QMP01
QMI01
QSH01
QAN03
QRE01
QCR03
QBA01
QBA00
QMI03
QCO01
QCH05
QIF01
QCK01
QSP01
QCA01
QAN02
QCR57

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Main Electrical Parts List
5-2
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Design LOC Discription SEC CODE
QAN02 INTENNA-BT&WLAN INTENNA-SGH_P2 GH42-01736A
QAN03 INTENNA-MAIN INTENNA-SGH_P270 GH42-01747A
QAR01 AUDIO-RECEIVER 3009-001323
QBA00 PMO COVER-BATT GH98-11455C
QBA01 INNER BATTERY PACK-960MAH,BLK, GH43-02720A
QCA01 ELA UNIT-CAMERA ASSY GH96-03250A
QCA02 ELA UNIT-CAMERA ASS'Y(CIF) GH96-03244A
QCR03 SCREW-MACHINE 6001-001811
QCR12 SCREW-MACHINE 6001-001530
QCR17 SCREW-MACHINE 6001-001460
QCR57 SCREW-MACHINE 6001-002001
QFL01 ASSY CASE-LOWER GH98-07827C
QFU01 ASSY CASE-UPPER GH98-07826C
QKP01 ASSY KEYPAD-MAIN(ORG/GRY) GH98-10927A
QKP02 ASSY KEYPAD-SUB(EU/MODERN BLAC GH98-07823C
QLC01 ELA ETC-LCD MODULE GH96-03497A
QME01 DOME SHEET-SGH P270 GH59-05992A
QME02 KEY FPCB-S/DOME SHEET 9KEY GH59-05618A
QMI01 MICROPHONE-ASSY-SGHJ800 SMD TY GH30-00517A
QMO01 MOTOR DC-SPH_W6300 GH31-00154H
QMP01 A/S ASSY-PBA MAIN (SGH_P270 SV GH82-03261A
QMW01 ASSY COVER-MAIN WINDOW GH98-09067A
QPC01 FPC-CON TO CON(L750) GH41-02121A
QSH01 ASSY COVER-SHIELD CAN GH98-09066A
QSP01 SPEAKER 3001-002410
QFR01 ASSY CASE-FRONT GH98-09064A
QMI03 ASSY RUBBER-MIC GH98-09878A
QRE01 ASSY CASE-REAR GH98-09063C
QCH05 PMO COVER-T FLASH GH72-48581C
QCK01 PMO KEY-CAMERA GH72-48582A
QIF01 PMO COVER-IF GH72-48580C
QVO01 ASSY KEY-VOLUME GH98-10799A
5-2. Cellular phone Parts list

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11. Disassembly and Assembly Instructions
11-1
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※ Caution
       
※ Caution
       
       
※ Caution ※ Caution
       
1) Unscrew the 4 points.
2) Separate the REAR from the FRONT ass'y
using disassembly stick.
11) Seprete PBA from the slide ass'y. 2
31) Seprete the KEYPAD from the slide ass'y. 41) Unscrew the 4 points.
2) Separate the FRONT case from the slide
ass'y.
11-1. Disassembly

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Disassembly and Assembly Instructions
11-2
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※ Caution
       
       
※ Caution
       
        
       
※ Caution
) Be care of damage to camera F-PCB.
※ Caution
 Be care of scratch to main WINDOW.
5 6
7 8
1) Unscrew the 6 points.
2) Separate the LOWER case from the UPPER
case.
1) Disassemble the slide F-PCB from the sub
PCB.
1) Detach the RECEIVER & MOTOR from the
UPPER case.
2) Disassemble the VGA F-PCB from the sub
PCB.
1) Sperate the LCD module from the UPPER
case.

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Disassembly and Assembly Instructions
11-3
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1) LCD CONNECTOR가 손상가지 않도록 주의한다. 1) 양면테잎으로 LCD 모듈이 고정되어 있으므로 분리 시
주의한다.
※ Caution
1) Be care of damage to F-PCB.
※ Caution
1) Be care of damage to F-PCB.
2) Be care of damage to the zip connector.
※ Caution
1) Be care of scratch and molding damage. ※ Caution
10
1) Detatch the SPEAKER F-PCB from the PBA
by soldering designated point.
2) Unscrew the 2 points.
1) Separate the camera module from the PBA.
9
1) Unscrew the 1 point to separate the
INTENNA from the PBA.
11 12 1) Unscrew the 2 points to separate the
shield can from the PBA.

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Disassembly and Assembly Instructions
11-4
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※ Caution
       
   
※ Caution
※ Caution
1) Be care of damage the INTENNA.
※ Caution
1) Be care of damage the FPCB and connector.
1 2
3 4
1) Attach the DOMESHEET to the PCB like
below.
1) Screw down the two points to assembly
the shield can and the PBA.
1) Screw down the 1 point 1) Connect the CAMERA and the CONNECTOR.
11-2. Assembly

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Disassembly and Assembly Instructions
11-5
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※ Caution
1) Be care of damage to the PBA.
※ Caution
1) Be care of damage to the VGA F-PCB.
※ Caution
1) Be care of damage to the LCD module.
2) Keep clean the main WINDOW before assembling
the LCD module.
※ Caution
1) Be care of damage to the VGA F-PCB.
2) Wires shold be arranged like the picture.
5 6
7 8
1) Screw down the 2 points.
2) Solder the speaker F-CPB like below.
1) Solder the MOTOR wire & RECEIVER on the
VGA CAMEARA F-CPB.
1) Assemble the LCD module on the UPPER case. 1) Connect the VGA F-PCB & connector.
2) Place the MOTOR & RECEIVER stably.

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Disassembly and Assembly Instructions
11-6
This Document can not be used without Samsung's authorization
※ Caution
1) Be care of scratch and damage to the slide
F-PCB.
※ Caution
1) Be care of scratch and damage to the slide
F-PCB.
※ Caution
        ※ Caution
9 10
11
1) Assemble the slide F-CPB with the
conenctor.
1) Assemble the LOWER case with the UPPER
case.
2) Screw donw the 6 points.
1) Screw down the 4 points. 1) Place the KEYPAD on the FRONT case.
12

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Disassembly and Assembly Instructions
11-7
This Document can not be used without Samsung's authorization
※ Caution
1) Be care of scratch and damage to the slide
F-PCB.
※ Caution
       
13 1) Connect the slide F-PCB & PBA ass'y.
2) Place the PBA ass'y on the FRONT case
stably.
14 1) Assemble the REAR case and FRONT cas.
2) Screw down 4 points.

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9-1
This Document can not be used without Samsung's authorization
9. Flow Chart of Troubleshooting
9-1.Baseband
9-1-1Power ON
Check the Battery Voltage
is more than 3.4V
'Power On 'does not work
Change the Battery
END
No
Yes
C425(VINT) = 2.55V? Check the PMU related to VINT
No
Yes
Check the Clock at
OSC400=32KHZ
Resolder OSC400
No
Yes
C418(VDD_IO_LOW_1.8V) &
C412(VDD_IO_HIGH_2.9V) =
"H"?
Check the related circuit
No
Yes
L402(VDD_GSM_CORE_1.2V)
=1.2
V?
Check the VDD_GSM_CORE_1.2V
circuit
No
Yes
Check for the clock at
TCX100 =26 MHz
Check the clock generation circuit
(relatedtoTCX100 )
No
Yes
Check the initial operation
Yes
Yes

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Flow Chart of Troubleshooting
9-2
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C101
C135
VDD_IO_LOW
VCC_SYN
C100
VCC_RX_TX
C131
C134
VCC_RX_TX
C106 R100
C136
R103
1
4
VCC
VCC_RX_TX
TCX100
2
GND
OUT
3
VC
R104
C126
C109
XOUT
35
XTAL1
34
XTAL2
_PDN
19
_RES 9
1
_SEN
SDIO 2
33
VDD1
32
VDD2
11
VDD3
12
VDD4
VDD5
16
VIO
10
XDIV
30 36
XEN
XMODE
29
8
27
RFIAP
26
RFIDN
23
22 RFIDP
25 RFIEN
24 RFIEP
RFIPN
21
20 RFIPP
RFOH
17 15
RFOL
SCLK 3
BIN
BIP 7
BQN 4
5
BQP
GND
28 37
GND1
18
NC
39
NC1
NC2
38
13
RAMPIN
14
RAMPOUT
RFIAN
U100
AFC
31
6
C120
C110
RAMP_PAM
DCS_TX
IRX_TX_N
RAMP
BT_CLK_REQ
BB2G_REF_CLK
IRX_TX_P
QRX_TX_N
QRX_TX_P
DCS_RXM
DCS_RXP
GSM_RXM_900
GSM_RXP_900
PCS_RXM
PCS_RXP
GSM_TX
D_REF_CLK
RF_CLK
RF_EN
AFC
BT_CLK_26M
RF_DATA
PON_4220
C426
C410
VDD_GSM_CORE
VINT
C411
R415
VCC_SYN
C401
470nF
6.3V
1005
VHIGH
R414
C415C414
C425
C418
R421
VDD_VIB_3V3
C429
VINT
VCC_RX_TX
VBUS_5V
ADV3V
VHIGH
VDD_IO_HIGH
C409
C416
VDD_MEM_3G_CORE
VCC_TX
VBAT
VBUS_5V
C406
C428
TP401
C423
AVDD_HFA
ADV3V
VCC_SIM
C417
C432
L403
C427
VDD_PLL
C412
VBAT
VBAT
VDD_IO_LOW
VDD_USB
C442
VDD_MEM_CARD_2V9
VCHG_5V
VBAT
C413
AVDD
C407
VDD_IO_LOW
OSC400
L402
VCC_KEYLED_3V3
C430
R417
C405
C420
C404
D8
GPO1
C444
B9
PWREN1
D1
SCUSB
D2
NC
D3
NC
D4
GPO1VIN
D5
REC1_N
D6
GPIO56GND
D7
NC
B41
OSCO
B42
NC
B43
VINT
B44
CCSET
B5
INT_N
B6
PWREN5
B7
PWREN3
B8
PWREN2
B34
GPO2VIN
B35 NC
B36
NC
B37
MICBIASVDD
B38
REFC
B39
VINT
B4
RSTMEM_N
B40
NC
B27
D3D4VIN
B28
USBVIN
B29
D1D2VIN
B3
DCD2FB
B30
VCC
B31
USIMVIN
B32
RF3RF4VIN
B33
RF1RF2VIN
B2
LCVIN
B20NC
B21
D6VDD
B22
SCL
B23
NC
B24
NC
B25
NC
B26
IOVIN
B12
GPIO6
B13
CLK32K
B14
USIMACT
B15
USIMPRES
B16
SHUTDOWN
B17
NC
B18
NC
B19
HCVDD
A56
REC2_N
A6
DCD2LX
A7
DCD1VIN
A8
PWREN4
A9
DCD1LX
B1
VBATSENSE
B10
GPIO1
B11
GPIO3
A49
VHIGH
A5
DCD2VIN
A50
NC
A51
NC
A52
OSCI
A53
VBUS
A54
VCHG
A55
VCHG
A41
RF2VDD
A42
RF1VDD
A43
GPO2
A44
NC
A45
NC
A46
NC
A47
VSAVE
A48
REFGND
A34
D4VDD
A35
D3VDD
A36
USBVDD
A37
D2VDD
A38
D1VDD
A39
RF4VDD
A4
NC
A40
RF3VDD
A27
D5VDD
A28
SDA
A29
NC
A3
LCVDD
A30
VINT
A31
NC
A32
NC
IOVDD
A33
A2
VBAT
A20
ONKEY_N
A21
NC
A22
GND
A23
HCVIN
A24
NC
A25
NC
A26
D5D6VIN
A12
GPIO4
A13
NC
A14
GPIO5
A15
NC
A16
RSTHC_N
A17
NC
A18
NC
A19GND
U400
1
GND
2
NC
3
NC
A1
VBAT
A10
DCD1FB
A11
GPIO2
C424
BAT400
C443
TP400
USB_SUSPEND
BT_CLK_REQ
ONKEYn
CTRL_VREF_3G_B1
BB3G_REF_ON
IT_PMU
VREF_3G_B1
SCL1
SIM_OFF
RSTON
SDA1
32KHZ_DIGIT
AUX_ON