Samsung SGH-X700 User manual

GSM TELEPHONE
SGH-X700
GSM TELEPHONE CONTENTS
1. Specification
2. Circuit Description
3. Exploded Views and Parts List
4. Electrical Parts List
5. Block Diagrams
6. PCB Diagrams
7. Flow Chart of Troubleshooting

Samsung Electronics Co.,Ltd. December. 2005
Printed in Korea.
Code No.: GH68-08969A
BASIC.
This Service Manual is a property of Samsung Electronics Co.,Ltd.
Any unauthorized use of Manual can be punished under applicable
International and/or domestic law.
ⓒ

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1. Specification
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1-1
PCS1900
1850~1910
1930~1990
512~810
80MHz
270.833kbps
3.692us
576.9us
4.615ms
0.3GMSK
30dBm~0dBm
0pcl ~ 15pcl
-100dBm
8
-
GSM900
Phase 1
EGSM 900
Phase 2
DCS1800
Phase 1
Freq. Band[MHz]
Uplink/Downlink
890~915
935~960
880~915
925~960
1710~1785
1805~1880
ARFCN range 1~124 0~124 &
975~1023 512~885
Tx/Rx spacing 45MHz 45MHz 95MHz
Mod. Bit rate
/BitPeriod
270.833kbps
3.692us
270.833kbps
3.692us
270.833kbps
3.692us
Time Slot Period
/ Frame Period
576.9us
4.615ms
576.9us
4.615ms
576.9us
4.615ms
Modulation 0.3GMSK 0.3GMSK 0.3GMSK
MS Power 33dBm~5dBm 33dBm~5dBm 30dBm~0dBm
Power Class 5pcl ~ 19pcl 5pcl ~ 19pcl 0pcl ~ 15pcl
Sensitivity -102dBm -102dBm -100dBm
TDMA Mux 8 8 8
Cell Radius 35Km 35Km 2Km
1-1. GSM General Specification

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Specification
1-2
TX Power
control level
PCS1900
0 30±3 dBm
1 28±3 dBm
2 26±3 dBm
3 24±3 dBm
4 22±3 dBm
5 20±3 dBm
6 18±3 dBm
7 16±3 dBm
8 14±3 dBm
9 12±4 dBm
10 10±4 dBm
11 8±4dBm
12 6±4 dBm
13 4±4 dBm
14 2±5 dBm
15 0±5 dBm
TX Power
control level
DCS1800
0 30±3 dBm
1 28±3 dBm
2 26±3 dBm
3 24±3 dBm
4 22±3 dBm
5 20±3 dBm
6 18±3 dBm
7 16±3 dBm
8 14±3 dBm
9 12±4 dBm
10 10±4 dBm
11 8±4dBm
12 6±4 dBm
13 4±4 dBm
14 2±5 dBm
15 0±5 dBm
TX Power
control level
GSM900
5 33±3 dBm
6 31±3 dBm
7 29±3 dBm
8 27±3 dBm
9 25±3 dBm
10 23±3 dBm
11 21±3 dBm
12 19±3 dBm
13 17±3 dBm
14 15±3 dBm
15 13±3 dBm
16 11±5 dBm
17 9±5 dBm
18 7±5 dBm
19 5±5 dBm
1-2. GSM TX power class

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2. Circuit Description
2-1
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2-1. SGH-X700 RF Circuit Description
2-1-1. RX PART
- FRONT END MODULE(ANTENNA SWITCH MODULE + RX SAW FILTER) (U100)
It performs to switch Tx & Rx paths for GSM900, DCS1800 and PCS1900 with logic controls below.
- FEM Control Logic Table
FESW1 FESW2
Tx Mode (GSM900) H L
Tx Mode (DCS1800/1900) L H
Rx Mode (GSM900) L L
Rx Mode (DCS1800) L L
Rx Mode (PCS1900) L L
- VC-TCXO (TCX100)
This module generates the 26MHz reference clock to drive the logic and RF systems.
It is turned on when the supply voltage (+VCC_SYN_2V8) is applied.
After buffering, the 26MHz reference clock is supplied to the other parts of the system through the transceiver pin
CLKOUT.
- Transceiver (U102)
This chip is fully integrated GSM & GPRS tri-band transceiver with RF VCO, loop filters and most of the
passive components required in it.
It also fully integrated fractional N RF synthesizer with AFC control possibility, RF VCO with integrated supply
regulator. Semi integrated reference oscillator with integrated supply regulator.
RF Receiver front-end amplifies the E-GSM900, DCS1800 and PCS1900 aerial signal, convert the chosen channel
down to a low IF of 100kHz.
In IF section, further amplifies the wanted channel, performs gain control to tune the output level to the desired value and
rejects DC.
2-1-2. TX PART
The transmitter is fully differential using a direct up conversion architecture. It consists of a signal side band
power up mixer. Gain is controlled by 6 dB via 3-wire serial bus programing. The fully integrated VCO and power
mixer achieve LO suppression, quadrature phase error, quadrature amplitude balance and low noise floor specification.
Output matching/balun components drive a standard 50 ohms single ended load.

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Circuit Description
2-2
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2-2. Baseband Circuit description of SGH-X700
2-2-1. PCF50603 (U400)
- Power Management
Eight low-dropout regulators designed specifically for GSM applications power the terminal and help ensure optimal
system performance and long battery life. A programmable boost converter provides support for 1.8V, 3.0V SIMs,
while a self-resetting, electronically fused switch supplies power to external accessories. Ancillary support functions,
such as RTC module and High Voltage Charge pump, Clock generator, aid in reducing both board area and system
complexity.
I2C BUS serial interface provides access to control and configuration registers. This interface gives a microprocessor
full control of the PCF50603 and enables system designers to maximize both standby and talk times.
Supervisory functions. including a reset generator, an input voltage monitor, and a temperature sensor, support reliable
system design. These functions work together to ensure proper system behavior during start-up or in the event of a
fault condition(low microprocessor voltage, insufficient battery energy, or excessive die temperature).
- Pulse-Width Modulator
The Backlight Brightness Modulator (BBM) contains a programmable Pulse-width modulator (PWM) to modulate the
intensity of a series of LED's or to control a DC/DC converter that drives LCD backlight.
This phone is using PWM control to modulate the LCD backlight brightness.
- Clock Generator
The Clock Generator (CG) generates all clocks for internal and external usage. The 32.768 kHz crystal oscillator
provides an accurate low clock frequency for the PCF50603 and other circuitry.
2-2-2. LCD
X700 has just one 1.9" TFT LCD. 16-bit data lines(LD(0)~LD(15)) transfers data and commands to LCD. There are
couple of control signals such as RS, CS, RD, WR, etc. RS stands for "Register Select pin." When RS = 0, data can be
written to the index register or status can be read, and when RS = 1, an instruction can be issued or data can be written
to or read from RAM. Read or write operation is selected according to RD/WR signals. The data is received when the
R/W bit is 0, and is transmitted when the R/W bit is 1. At the falling edge of CS input, serial data transfer is
initiated. On the other hand, at the rising edge of CS input, the data transfer is ceased.
2-2-3. Key
Key recognition part is consisted of 8 ports from PCF5213EL1. KEY_ROW(0:4) & KEY_COL(0:4)
These signals performs with the matrix. Any input from the matrix informs the key status to key interface in the
PCF5213EL1. Power on/off key is independent of the matrix. Therefore, 'power on/off' signal is directly connected with
PCF50603 to turn PCF50603 on.
3.3V LDO(U700) enables Key LED on. Key LED consists of 12 LEDs. It is controlled by "Key_led_on" signal.

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Circuit Description
2-3
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2-2-4. EMI ESD Filter (U500)
This system uses the EMI ESD filter (U500) to protect the device from noises from IF CONNECTOR part.
2-2-5. IF connetor (IFC500)
It has 18-pin. They are designed to allocate VBAT, V_EXT_CHARGE, USB_D+, +VBUS, USB_D-, TXD1, RXD1,
AUX_ON, EXT1, EXT2 and GND. They connected to power supply IC, microprocessor and signal processor IC.
2-2-6. Battery Charge Management
X700 has a complete constant-current/constant-voltage linear charger for single cell lithium-ion batteries inside.
If Travel Adapter is connected, "V_EXT_CHARGE" begins to provide the charger IC (to battery) with power (current).
When the charging operation is done, "End_of_charge" informs it to PCF5213EL1 to stop the operation. "CHG_ON"
signal enables the charger IC to operate in adequate circumstances.
2-2-7. Audio - Part
X700 has several audio-outputs such as stere speaker, receiver, earphone, etc. RCV_P/N signals from CPU are connected
to the receiver via analog switche (U602). MIC_P/N are connected to the main MIC as well.
YMU762 is a synthesizer LSI for mobile phones. This LSI has a built-in speaker amplifier for outputting sounds that are
used by mobile phones in addition to game sounds and ringing melodies that are replayed by a synthesizer.
YMU762 has built a speaker amplifier of which maximum out is 580 mW at SPVDD=3.6V in this device. There is
Stereophonic analog output for Headphone.
2-2-8. Memory (UME300)
X700 has KAP17SG00A-D4U4 as a memory module.
The KAP17SG00A-D4U4 is a Multi Chip Package Memory which combines 256Mbit Synchronous Burst Multi Bank NOR
Flash Memory and 512Mbit OneNAND Flash and 128Mbit Synchronous Burst U tRAM.
It has 16 bit data line, HD[1~16] which is connected to PCF5213 and MV3315DOQ, also has 24 bit address lines,
HA[1~24]. There are 3 chip select signals, CS0n_FLASH, CS1n_RAM, and CS4n_NAND.
Inthewrtingprocess,WEnisfallentolowanditenableswriting process to operate. During reading process,
OEn is fallen to low and it enables reading process to operate. Each chip select signals in the PCF5213EL1 choose
different types of memory.
2-2-9. PCF5213EL1 (UCP200)
The PCF5213EL1 is mainly composed of embeded DSP and ARM core. The DSP subsystem includes the Saturn
DSP core with embedded RAM and ROM, and a set of peripherals. It has 24k×16 bits PRAM, 104k×16 bits,
32k×16 XYRAM and 63k×16 XYROM in the DSP.
The ARM946E-S consists of an ARM9E-S processor core, 8 kbyte instruction cache and 8 kbyte data cache,
tightly-coupled ITCM (Instruction Tightly Coupled Memory) and DTCM (Data Tightly Coupled Memory) memories, a
memory protection unit, and an AMBA (Advanced Microcontroller Bus Architecture) AHB (Advanced
High-performance Bus) bus interface with a write buffer.
HD(0:15), data lines and HA(0:23), address lines are connected to KAP17SG00A (memory), MV3018B (image dsp)
and YMU762 (melody IC). It has 64 kbyte SC RAM (0.5 Mbit) and 32 kbyte SC program ROM for bootstrap
loader in the ARM core.

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Circuit Description
2-4
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HD(0:15), data lines and HA(0:23), address lines are connected to memory and YMU762 to communicate.
MV3018B(Camera DSP Chip) controls the communication between ARM core and DSP core.
OEn, WEn control the access of memory. KROW, and KCOL recognize the key string input status.
It has J-TAG control pins (TDI/TDO/TCK) for ARM and DSP core. J-SEL signal controls different access to ARM
and DSP core.
ADC(Analog to Digital Convertor) receives the condition of temperature, battery type and battery voltage.
HD(0:15), data lines and HA(0:23), address lines are connected to memory and YMU762 to communicate.
MV3315DOQ(Camera DSP Chip) controls the communication between ARM core and DSP core.
OEn, WEn control the access of memory. KROW, and KCOL recognize the key string input status.
It has J-TAG control pins (TDI/TDO/TCK) for ARM and DSP core. J-SEL signal controls different access to ARM
and DSP core.
ADC(Analog to Digital Convertor) receives the condition of temperature, battery type and battery voltage.
2-2-10. VC-TCXO-214C6 (TCX100, 26MHz)
This system has the 26MHz TCXO, TCO-5871U from Toyocom. AFC controlling signal form PCF5213EL1 controls
frequency from 26MHz X-tal. It generates the clock frequency. This clock is connected to PCF5213EL1, YMU762 and
UAA3587.
2-2-11. Camera DSP (U303, MV3315DOQ)
MV3315DOQ provides rich video functions up to 30-frame display with minimized tasks in the handset main processor
as well as hardware based real-time JPEG compression and decompression. MV3315DOQ directly transmits and
previews the RGB data to the LCD graphic memory by processing the sensor output data according to the
handset's command. It can save the raw RGB data up to VGA resoultion into its image buffer and allows the
host processor to download with scalable sized compressed data.
It utilizes 16 bit data bus for communication with the main processor, including bus interface types.

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4. Electrical Parts List
4-1
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Design LOC Description SEC CODE STATUS
AN300 ANTENNA-CHIP 4202-001060 SA
BAT400 BATTERY-LI(2ND) 4302-001119 SA
BTC500 HEADER-BATTERY 3711-006026 SA
C100 C-CER,CHIP 2203-001385 SA
C103 C-CER,CHIP 2203-000812 SA
C104 C-CER,CHIP 2203-000233 SA
C105 C-CER,CHIP 2203-000995 SA
C106 C-CER,CHIP 2203-000995 SA
C109 C-CER,CHIP 2203-001201 SA
C110 C-CER,CHIP 2203-005057 SA
C112 C-CER,CHIP 2203-000812 SA
C113 C-CER,CHIP 2203-000233 SA
C114 C-CER,CHIP 2203-000233 SA
C115 INDUCTOR-SMD 2703-001748 SA
C116 C-CER,CHIP 2203-005393 SA
C118 C-CER,CHIP 2203-000812 SA
C121 C-CER,CHIP 2203-000425 SA
C122 C-CER,CHIP 2203-000425 SA
C123 C-CER,CHIP 2203-006190 SA
C124 C-CER,CHIP 2203-000233 SA
C126 C-CER,CHIP 2203-005234 SA
C127 C-CER,CHIP 2203-000585 SA
C128 C-CER,CHIP 2203-000330 SA
C133 C-CER,CHIP 2203-000254 SA
C134 C-CER,CHIP 2203-005393 SA
C135 C-CER,CHIP 2203-000254 SA
C136 C-CER,CHIP 2203-000812 SA
C137 C-TA,CHIP 2404-001406 SA
C139 C-CER,CHIP 2203-005234 SA
C140 C-CER,CHIP 2203-000654 SA
C141 C-CER,CHIP 2203-001383 SA
C147 C-CER,CHIP 2203-002677 SA
C148 C-CER,CHIP 2203-005053 SA
C149 C-CER,CHIP 2203-002668 SA
C150 C-CER,CHIP 2203-000696 SA
C201 C-CER,CHIP 2203-000254 SA
C202 C-CER,CHIP 2203-005482 SA
C203 C-CER,CHIP 2203-005482 SA
C204 C-CER,CHIP 2203-000812 SA
C205 C-CER,CHIP 2203-005482 SA
C206 C-CER,CHIP 2203-005482 SA
C207 C-CER,CHIP 2203-005482 SA
C208 C-CER,CHIP 2203-005482 SA
C209 C-CER,CHIP 2203-005482 SA
C210 C-CER,CHIP 2203-000812 SA
C211 C-CER,CHIP 2203-005482 SA
C212 C-CER,CHIP 2203-005482 SA
C213 C-CER,CHIP 2203-005482 SA
C216 C-CER,CHIP 2203-005482 SA
C217 C-CER,CHIP 2203-005482 SA

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Electrical Parts List
4-2
This Document can not be used without Samsung's authorization
Design LOC Description SEC CODE STATUS
C218 C-CER,CHIP 2203-005482 SA
C219 C-CER,CHIP 2203-005482 SA
C300 C-CER,CHIP 2203-005480 SA
C301 C-CER,CHIP 2203-000254 SA
C302 C-CER,CHIP 2203-000233 SA
C303 C-CER,CHIP 2203-000254 SA
C304 C-CER,CHIP 2203-005482 SA
C306 C-CER,CHIP 2203-005480 SA
C307 C-CER,CHIP 2203-005480 SA
C308 C-CER,CHIP 2203-000995 SA
C309 C-CER,CHIP 2203-000679 SA
C310 C-TA,CHIP 2404-001394 SA
C311 C-CER,CHIP 2203-005482 SA
C312 C-CER,CHIP 2203-006562 SA
C313 C-CER,CHIP 2203-006137 SA
C314 C-CER,CHIP 2203-005482 SA
C315 C-CER,CHIP 2203-006137 SA
C316 C-CER,CHIP 2203-006137 SA
C317 C-CER,CHIP 2203-006137 SA
C318 C-CER,CHIP 2203-005480 SA
C319 C-CER,CHIP 2203-005482 SA
C320 C-CER,CHIP 2203-000233 SA
C321 C-CER,CHIP 2203-005482 SA
C322 C-CER,CHIP 2203-005482 SA
C323 C-CER,CHIP 2203-005482 SA
C324 C-CER,CHIP 2203-005482 SA
C325 C-CER,CHIP 2203-005482 SA
C326 C-CER,CHIP 2203-000679 SA
C327 C-CER,CHIP 2203-005482 SA
C328 C-CER,CHIP 2203-005482 SA
C329 C-CER,CHIP 2203-006208 SA
C330 C-CER,CHIP 2203-000725 SA
C331 C-CER,CHIP 2203-000438 SA
C332 C-CER,CHIP 2203-005482 SA
C336 C-CER,CHIP 2203-005482 SA
C337 C-CER,CHIP 2203-006399 SA
C338 C-CER,CHIP 2203-006399 SA
C339 C-CER,CHIP 2203-005482 SA
C340 C-TA,CHIP 2404-001394 SA
C350 C-CER,CHIP 2203-000233 SA
C400 C-CER,CHIP 2203-006053 SA
C401 C-CER,CHIP 2203-006053 SA
C402 C-TA,CHIP 2404-001394 SA
C403 C-TA,CHIP 2404-001375 SA
C404 C-CER,CHIP 2203-006364 SA
C405 C-CER,CHIP 2203-006708 SA
C406 C-CER,CHIP 2203-006708 SA
C407 C-CER,CHIP 2203-005482 SA
C408 C-CER,CHIP 2203-006257 SA
C409 C-CER,CHIP 2203-000330 SA