Samsung SP-C501R User manual

Samsung Cordless 900MHz Phone
SERVICE
Wide Phone SP-C501R
�Samsung Electronics Co., Ltd. 11. 2003
�Printed in Korea
Samsung Cordless 900MHz Phone Table of Contents
1. Service Guidelines
2. Product Specifications
3. How to Check for Trouble
4. Test Mode Procedure
5. Electrical Components List
6. Layout of Components
7.
Perspective View and Components List
8. Block Diagram
9. Circuit Diagram
2
3
4
9
16
21
24
30
33
MANUAL

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Samsung Electronics Co., Ltd Service Manual
Management Guideline for Service Manual
SP-C501R
This service manual contains important technical data on Samsung's products, so it may not be
reproduced or distributed without our prior written consent. Please be careful to keep it safe from
getting lost and stolen.
[Explanations on the Abbreviated Words Used in this Manual]
Abbreviations
AF
BPF
CO
MPU
ID-CODE
IF
LD
LN
LNA
MCF
PABX
PCB
PLL
RF
SAW
TCXO
Audio Frequency
Band Pass Filter
Central Office
Micro Processor Unit
Identification-Code
Intermediate Frequency
Lock Detector
Line Engage/Disengage
Low Noise Amplifier
Monolithic Crystal Filter
Private Automatic Branch Exchange
Printed Circuit Board
Phase-Locked Loop
Radio Frequency
Surface Acoustic Wave
Temperature Compensated X-tal Oscillater
Definition

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Chapter 2.Product Specifications SP-C501R
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Chapter 1.Service Guideline SP-C501R
Please, finely adjust the remote set only in the SHIELD ROOM. Do not turn the CORE of RF
MODULE if you have to adjust the remote set in any other place. The RF PART of remote
set is very sensitive, so please modify and adjust the CORE at the place where it is isolated
from the surrounding RF NOISE in order to prevent troubles.
If you use the magnetic adjusting tool such as watch driver when adjusting the core, it may
jeopardize the performance of the product, so only use the ceramic adjusting tool.
The RF MODULE is seldom open or short circuited, so lastly check if the MODULE is
altered.
Be careful not to get the PCB damaged upon removal of MODULE as the modules are
mounted on the double-faced board.
If small screws used for this product are loosened by the wrong or unauthorized driver, they
may be worn away, so only use the driver meeting the requirements for the standard.
Please use thick and flexible wire when measuring the RF Level, as it may reduce the
measuring error by its low resistance against RF.
ID numbers may not be changed as it is memorized in the EEPROM of base and remote
sets. If ID numbers stored in base and remote sets differ from each other, then please enroll
the remote set in the base set again. You must enroll with the same ID Number at this time.
When placing the remote set on the charger, if there is any foreign substance clinging to the
charger, or the charging lamp is not ON, or the remote set is not charging, then please first
clean it and then recharge it afterward.
Do not adjust the adjusting parts of each end, unless a part of itself is not modified.
If you use the unauthorized adjusting tool when adjusting the RF Module used for this mobile
phone, the CORE of MODULE may be damaged, so only use the authorized adjusting tool.
Items
Frequency Range
Channel
Channel Space
Output power
Modulation Method
Using Times
Operating Temperature
Operating Humidity
Items
Weight (g)
Size (mm)
Power Supply
Remote Set
138g
44×27×178
DC3.6V, 450mAh
(Ni-MH Battery)
Base Set
270g
120×129×106
DC 11V/9V, 500mA/150mA
(ADAPTOR)
Specifications
814.0125MHz ~ 814.9875MHz
904.0125MHz ~ 904.9875MHz
40CH
25KHz
Less than 10mW
FM
Standby Times: More than 20 hours
Talk Times: More than 3 hours
0℃~ +40℃
5% ~ 90%

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Chapter 3.How to Check for Trouble
SP-C501R
This mobile phone basically consists of a base set and a remote set. If and when any trouble occurs
with the phone, you must first check and see which set is troubled in order to repair the trouble in a
timely manner. The easiest way to find out the troubled area is to check via the communication test
using another phone under normal operations. The way to check for trouble will be explained here
and is based on the repairs after finding out where the troubled area is.
3.1 BASE SET
3.1.1 How to Check for Trouble Regarding the Call
Connect the Power Source and
the Telephone Line
Yes
No
Yes
No
Yes
A
Is power LED ON?
When the
Ring Signal is supplied,
is there a ringing
sound in the remote set?
1. Check the adaptor
2. Check the power circuit (U900), LED2.
1. Check the Ring Detector circuit(surrounding circuit of
PC 201)and if the pulse is supplied when the ring is
entered in the pin (U1 No. 30).
Diagnosis completion
Yes
No
Yes
No
Yes
Yes
A
Is the ID setting done correctly?
When the wireless channel is
captured, does the dial tone
sound and is the call available?
1. Check the connection to the antenna.
2. Check the action of the RF-MODULE.
3. It is trouble related to the data signal path and
EEPROM (U2)
(ID transmitted/received from U1 to U400 is
connected through the wireless RF-MODULE).
1. When dial tone does not sound, check the operating
conditions of loop circuit and surrounding circuit of
SPEECH IC (U500) and check to see if there is any
signal along the receiving path.
2. If wireless transmitting is not available, then check
and see if there is any signal along the transmitting
path.
No
Is dialing available?
1. Check if speech IC (U500) pin No. 12 is high when
dialing.

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3.1.2 How to Check the Trouble Regarding the LED BOARD
Connect the power source and the phone line
Diagnosis completion
Yes
No
Is the power LED ON?
1. Check the adaptor.
2. Check if pin No. 9 of CON1/CON2 is 1.7V.
3. Check if pin No. 7 of CON1/CON2 is set to GND.
Yes
No
Is charging LED ON?
When placing the remote
set on the base set.
1. Remove the foreign substance in the charging
terminal.
2. Check the output of the base set (U600) is 9V.
3. Check if both ends of the charging terminals are 6V
when placing the remote set on the base set.
Yes
No
When the channel is captured,
is the in-use LED ON?
1. Check if pin No. 10 of CON1/CON2 changes
from high to low.
2. Check to see if the in-use LED is normal.
Yes
Yes
No
When pressing the page
button, does the ring tone
sound?
1. Check and see if pin No. 11 of CON1/CON2 goes
from high to low.
3.2 REMOTE SET
Connect battery (Above 3.6V)
Diagnosis completion
Yes
No
Is the LCD DISPLAY
appearing correctly?
1. Then check the power unit.
2. Check the RESET circuit and the MPU
oscillation section (X1).
Yes
No
Is the phone book
correctly registered?
1. For the MPU trouble, check the circuit of
the EEPROM IC (U4).
Yes
No
Is the ID appropriately enrolled?
1. It is the trouble related to the DATA signal path.
2. ID transmitted/received from the MPU to the
MODEM is connected through the wireless RF-
MODULE.
Yes
No
Is the remote available for transmitting?
1. The voice signal path is wrong.
2. Then check the MIC, MODEM(U2) and their
surrounding circuits.
Yes
No
Yes
Is the remote available
for receiving?
1. Then check the receiving unit, MODEM(U2) and the
AMP circuit(U3).

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Chapter 4.Test Mode Procedure SP-C501R
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3.3 CAUSES FOR THE TROUBLE AND TROUBLESHOOTING
Troubles
Not operable at all
Channel is not captured
Communication distance is
too short
Call path is not formed
Dialing is not available
Ring tone does not sound
Transmitting is not
normal (Remote set)
Receiving is not
normal (Remote set)
Is not chargeable
Causes
1. Defective power source (base)
2. Battery is discharged (Remote)
1. ID discord
2.
Defective transmitting/receiving data
1. Antenna is open
2. Defective transmitting power adjustment
Defective SPEECH IC(U500)
Defective SPEECH IC(U500)
Defective ring detector Circuit
(PC201)
1. Defective MIC
2. Defective transmitting path
1. Defective receiving unit
2. Defective receiving path
1. Defective battery
2. Defective contact terminal
Troubleshooting
Check the voltage of each end.
Charge and/or replace the battery.
Check the ID setting.
Check the transmitting/receiving data path
Remove the cause of the trouble.
Readjust the PWR adjustable resistance
Check the speech IC (U500) and
surrounding circuits
Check the DTMF path
Check the ring detecting circuit and
surrounding circuits
Replace the MIC
Check the transmitting path
Replace the receiving unit
Check the receiving path
Replace the battery
Check the contact terminal
4.1 BASE SET TEST MODE
1) How to Enter the Test Mode
You may enter the test mode by shorting the test point of "Test Mode" with the adaptor connected to
the base and power supplied. Looping will be done according to the shorting times as follow:
Test stand by status "Test Mode" TP: Short a time
20 channels, TX Enable
"Test Mode" TP: Short twice
20 channels, TX Data "1" transmitting
"Test Mode" TP: Short three times
42 channels, RX Enable
"Test Mode" TP: Short four times
Returns to the first step
Power OFF: Exit from the Test Mode

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2) Base Set Test SPEC
(Loop Current - 50mA, RF Channel = 20CH)
Test Mode 1. Supply the power to Base set. 2. You may enter the test mode by shorting the test mode with power supplied.
3. In principle, the cable for RF measurements is free of loss.
**TX Test Mode
1. Adjust the TX Power with HP8920A set to the TX Test mode
(Adjusting the 'PWR' of RF). 9dBm
TX Power
1. Adjust the TX Frequency in the TX Test mode of HP8920A
(Adjusting the 'FREQ' of RF). Fo 0.8KHz
TX Frequency
1. Supply the audio of 1KHz, -8dBm to the FEEDING using
the AF GEN of HP8920A.
2. Adjust the modulation factor by turning the RV 401 of PCB after
selecting the 400Hz HPF, 15KHz LPF for the Filter of HP8920A.
3 0.1KHz
Normal Deviation
Select the Distortion Factor and read the value displayed on the
unit (Adjusting point is none). Less than 5%
TX Distortion
**RX Test Mode
1. Convert the HP8920A to the RX Test Mode.
2. Set the Ext LOAD R, RF GEN and amplitude to 600ohm, corresponding
channel frequency (815.0375 MHz) and -55dBm respectively.
3. Set the AF GEN to the modulation factor of 3KHz_dev for 1KHz AUDIO.
4. Adjust the AC LEVEL by turning the RV402 of PBA after selecting the
'400Hz HPF, 15KHz LPF' for the FILTER of HP8920A.
00.5dBm
(Tel-line both
ends)
RX Audio Level
1. Same as RX Audio Level in measuring condition.
2. Select the DISTORTION FACTOR and read the value
(Adjusting point is none).
Less than 5%
RX Audio
Distortion
1. Change the RF Level to -15dBm under the condition of measuring
the RX Audio Level.
2. Read the value of Distortion (Adjusting point is none).
Less than 10%
High Power
Rejection
1. Same as RX Audio Level in measuring condition.
2. Select the SNR Factor and read the value (Adjusting point is none).
Above 50dB
RX S/N Ratio
1. Set the RF Level to -110dBm and Filter to '400Hz HPF, CCITT ON
respectively under the condition of measuring the RX Audio Level.
2. Set the SINAD Factor and read the value (Adjusting point is none).
Above 25dB
RX Audio SINAD
1. Same as RX Audio SINAD in measuring condition.
2. Check if complete H/L is done within the range of
RF Level 01-114 4dBm.
"L H"=118dBm
"H L"=108dBm
20dB Carrier
Sensitivity
Items to Test Testing Conditions and Test Commands Adjusting Spec
4.2 REMOTE TEST MODE
1) How to Enter the Test Mode
Power ON with the buttons "*" and "#" Simultaneously pressed.
"Beep" sounds and �YS TEST” is displayed on LCD and then press the buttons "*" and
"#"sequentially, then"Beep" sounds again and you may enter the Test Mode.
Then select the RF channel using numeric buttons.
(EX. For 20CH, press " " and " ")

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3) Remote Set Test SPEC
(Battery = DC 3.6V, RF Channel = 20CH)
Test Mode 1. Power ON with the buttons "* and #" Simultaneously pressed. 2. Then press the buttons "* and #", sequentially, you may enter the Test Mode.
3. In principle, the cable for RF measurements is free of loss.
TX Power
** RF CH Setting (Ex. For 20CH, press "2 and "0")
** TX Test Mode
1. Meet the requirements for specification by adjusting the
TX Power of the RF Module.
9.0 dBm
TX Frequency 1. Same as TX Power measuring condition.
2. Meet the requirement for specification by adjusting the TX
Frequency of RF Module. Fe 0.8KHz
Normal Deviation
1. Same as TX Power in measuring condition.
2. Set Audio 1KHz, -36dBm, '400Hz HPF, 15KHz LPF.
3. Adjust the modulation factor to meet the requirements for the
specification by adjusting the "VR1".
2.9 ~ 3.1KHz
TX Distortion 1. Same as Normal Deviation in measuring condition.
2. Set the Distortion Factor and read the value
(Adjusting point is none). Less than 5%
RX Audio Level
**RX Test Mode
1. Convert the HP8920A to the RX Test Mode.
2. Set the Exl LOAD R, RF GEN and amplitude to 600ohm,
corresponding channel frequency and -55dBm respectively.
3. Set the AF GEN to the modulation factor of 3KHz-dev for 1KHz AUDIO.
4. Read the value of AC Level after selecting the Filter of HP8920A
to the '400Hz HPF, 15KHz LPF' (Adjusting point is none).
-12 3dBm
RX Audio
Distortion
1. Same as RX Audio Level measuring condition.
2. Set the DISTORTION FACTOR and read it's value
(Adjusting point is none). Less than 5%
RX Audio SINAD
1. Set the RF Level and Filter to -110dBm and '400Hz HPF, CCITT
ON respectively under the condition of measuring the RX Audio
Level.
2. Set the SINAD Factor and read the value of SINAD
(Adjusting point is none).
Above 25dB
20dB (C/S)
1. Set the RF Level to -114dBm under the condition of measuring
the RX Audio SINAD.
2. Check if complete H/L is done within the range of RF Level -
114 4dBm.
"L H"=118dBm
"H L"=110dBm
Items to Test Testing Conditions and Test Commands Adjusting Spec
Measuring Test Conditions
Base Set
Remote Set

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RF-Module Adjusting Position
It is the same for the base set and remote set
4.3 TRANSMITTING/RECEIVING FREQUENCY BY UNIT
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
904.0125
904.0375
904.0625
904.0875
904.1125
904.1375
904.1625
904.1875
904.2125
904.2375
904.2625
904.2875
904.3125
904.3375
904.3625
904.3875
904.4125
904.4375
904.4625
904.4875
904.5125
904.5375
904.5625
904.5875
904.6125
904.6375
904.6625
904.6875
904.7125
904.7375
904.7625
904.7875
904.8125
904.8375
904.8625
904.8875
904.9125
904.9375
904.9625
904.9875
BASE TX / REMOTE RX
TABLE
BASE TX / REMOTE RX
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
814.0125
814.0375
814.0625
814.0875
814.1125
814.1375
814.1625
814.1875
814.2125
814.2375
814.2625
814.2875
814.3125
814.3375
814.3625
814.3875
814.4125
814.4375
814.4625
814.4875
814.5125
814.5375
814.5625
814.5875
814.6125
814.6375
814.6625
814.6875
814.7125
814.7375
814.7625
814.7875
814.8125
814.8375
814.8625
814.8875
814.9125
814.9375
814.9625
814.9875
FREQUENCY ADJ
TX POWER OUTPUT ADJ

Loc Name
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Chapter 5.Components List SP-C501R
No Level Part Number
Loc Name
Spec
1 1 GG97-02152D ASSY-REMOTE SP-C501RSL,-,-,-
2 2 6003-000149 SCREW-TAPTITE PH,+,B,M2.5,L8,ZPC(YEL),SM20C
3 2 6003-000314 SCREW-TAPTITE PH,+,S,M2,L5,ZPC(YEL),SWRCH18A
4 2 GG02-00030A TAPE ETC-REMOTE CID DECO SP-C750,#4970,-,0.24T,-,-,WHITE,-
5 2 GG02-00031A TAPE ETC-HADSET HEARING DECO SP-C750,#4970,-,T0.24,-,-,WHITE,-
6 2 GG02-00032A TAPE ETC-REMOTE WINDOW SP-C753,#51970,TESA,T0.2,-,-,CLEAR,-
7 2 GG07-00025B LCD1 LCD SEQ0880,SP-C700R,-,37.2*22.0,Y/G,1/8 DUTY,-,0℃ ~ 50℃,3.2V,STN TYPE,-
8 2 GG34-00001A SWITCH-METAL DOME -,-,PET,-,-,-,-,-,-,-,-,-,-,WHITE,-,0.1T,5PI,-,-
9 2 GG42-00027A ANTENNA-HELICAL HP03859M,SP-C700R,814-904[MHZ],-,50OHM,-,78X7X7[MM],-,VERTICAL,LESS THEN 1.8,-,R
10 2 GG59-00068F REMOTE-UPPER SP-C501RSL,ABS,HG-0760,94HB,W91434,19G,L153.4,W46.0,H18.2,-,-
11 2 GG59-00070B REMOTE-CID DECO SP-C501R,ABS,MP-211,94HB,1.2G,-,-,-,-,-,-
12 2 GG59-00071A REMOTE-CONTACT SP-C750,SUS304,T0.3,GOLD CHROMATE,-,-,-,-,-,-,-
13 2 GG59-00072A REMOTE-ILLUMINATING PLATE SP-C750,-,PC,CALIBRE 201-15,CLEAR,-,-,-,-,-,-
14 3 GG02-00035A TAPE ETC-REMOTE LCD SP-C750,-,POLYESTER,T0.26,W3.0,L30.0,BLACK,-
15 2 GG59-00078B REMOTE-HEARING DECO SP-C501R,ABS,MP-211,W13.20,L1920,H3.0,94HB,3G,-,-,-
16 2 GG59-00079D REMOTE-LOWER SP-C501RSL,ABS,HG-0760,W91434,W46.0,L153.3,H14.3,94HB,15G,-,-
17 2 GG61-00142A HOLDER-MIC SP-RA985,RUBBER,6.9X7.3X5.9,BL
18 2 GG61-00239A HOLDER-REMOTE BUZZER SP-B960,SILICON,-,-,-,BLK,1G
19 2 GG61-00243A HANDSET-SIDE BELT SP-C750,URETAN,T3.2,W8.4,L99.1,GRAY,-
20 2 GG63-00072F COVER-REMOTE BATTERY SP-C501RSL,ABS,1.8,45.0,74.0,-,-,G61133,8G
21 2 GG63-00079A SHEET-RMT LCD BOHO CLP ALL MODEL,RE4187,T0.5,W40,L30,CLEAR,-
22 2 GG64-00250B KEY-REMOTE FUNCTION SP-C700R,ABS,MP-211,94HB,5G,-,-
23 2 GG64-00283B WINDOW-REMOTE SP-C501R,TRANSPARENCY ABS,1.8,40.0,65.0,-,BLACK,-
24 2 GG72-00125A SPONGE-SPEAKER SP-RA985,SPONGE,7X8XT4,BLK,-
25 2 GG72-00156A SPONGE-HEARING UNIT SP-C750,EVA40,-,T3.0,D19.5*D14.5,-,-,-
26 2 GG72-00159A SPONGE-REMOTE LCD SP-C753,PET FILM,-,T1.0,W3.0,L30.0,BLK,-
27 2 GG92-01445A ASSY PCB-REMOTE -,SP-C501R,-,-,-
28 3 0401-000133 D2 DIODE-SWITCHING RLS4148,75V,150MA,LL-34,TP
29 3 0401-000133 D5 DIODE-SWITCHING RLS4148,75V,150MA,LL-34,TP
30 3 0401-001125 D1 DIODE-SWITCHING MMBD2838LT1,75V,100MA,SOT-23,TP
31 3 0401-001125 D3 DIODE-SWITCHING MMBD2838LT1,75V,100MA,SOT-23,TP
32 3 0401-001125 D4 DIODE-SWITCHING MMBD2838LT1,75V,100MA,SOT-23,TP
33 3 0501-000338 Q1 TR-SMALL SIGNAL 2SC2812,NPN,200mW,SOT-23,TP,20
34 3 0501-000338 Q2 TR-SMALL SIGNAL 2SC2812,NPN,200mW,SOT-23,TP,20
35 3 0501-000338 Q6 TR-SMALL SIGNAL 2SC2812,NPN,200mW,SOT-23,TP,20
36 3 0501-000338 Q7 TR-SMALL SIGNAL 2SC2812,NPN,200mW,SOT-23,TP,20
37 3 0501-000338 Q8 TR-SMALL SIGNAL 2SC2812,NPN,200mW,SOT-23,TP,20
38 3 0501-000457 Q11 TR-SMALL SIGNAL MMBT2222A,NPN,350MW,SOT-23,TP,35-300
39 3 0501-000457 Q3 TR-SMALL SIGNAL MMBT2222A,NPN,350MW,SOT-23,TP,35-300
40 3 0501-000457 Q5 TR-SMALL SIGNAL MMBT2222A,NPN,350MW,SOT-23,TP,35-300
41 3 0501-000457 Q9 TR-SMALL SIGNAL MMBT2222A,NPN,350MW,SOT-23,TP,35-300
42 3 0501-000462 Q12 TR-SMALL SIGNAL MMBT2907A,PNP,350MW,SOT-23,TP,50-300
43 3 0501-000462 Q4 TR-SMALL SIGNAL MMBT2907A,PNP,350MW,SOT-23,TP,50-300
44 3 0601-000273 LED3 LED CHIP,Y/GRN,0.8x1.2mm,570nm
45 3 0601-000273 LED4 LED CHIP,Y/GRN,0.8x1.2mm,570nm
No Level Part Number
Spec
46 3 0601-000273 LED5 LED CHIP,Y/GRN,0.8x1.2mm,570nm
47 3 0601-000273 LED6 LED CHIP,Y/GRN,0.8x1.2mm,570nm
48 3 0601-000273 LED7 LED CHIP,Y/GRN,0.8x1.2mm,570nm
49 3 0601-000273 LED8 LED CHIP,Y/GRN,0.8x1.2mm,570nm
50 3 0903-001314 U1 IC-MICROCONTROLLER -,8BIT,QFP-1420C,80P,14X20MM,8MHZ,-,-,PLASTIC,5V,-,-25TO+85 C,2KBYTE,-,16BIT,-,
51 3 1103-001284 U4 IC-EEPROM AT24C04N,4KX1BIT,SOP,8P,-,-,-,-,PLASTIC,-,-,CMOS,-
52 3 1201-000103 U3 IC-AUDIO AMP 8602,SOP,8P,300MIL,DUAL,-,PLAS
53 3 1203-000388 U5 IC-POSI.FIXED REG. 11432,SOP,6P,150MIL,PLASTIC,3.
54 3 2007-000070 R53 R-CHIP 0ohm,5%,1/10W,TP,1608
55 3 2007-000070 RC1 R-CHIP 0ohm,5%,1/10W,TP,1608
56 3 2007-000078 R4 R-CHIP 1Kohm,5%,1/10W,TP,1608
57 3 2007-000078 R5 R-CHIP 1Kohm,5%,1/10W,TP,1608
58 3 2007-000084 R64 R-CHIP 4.7Kohm,5%,1/10W,TP,1608
59 3 2007-000084 R65 R-CHIP 4.7Kohm,5%,1/10W,TP,1608
60 3 2007-000084 R66 R-CHIP 4.7Kohm,5%,1/10W,TP,1608
61 3 2007-000084 R67 R-CHIP 4.7Kohm,5%,1/10W,TP,1608
62 3 2007-000090 R2 R-CHIP 10Kohm,5%,1/10W,TP,1608
63 3 2007-000090 R44 R-CHIP 10Kohm,5%,1/10W,TP,1608
64 3 2007-000091 R17 R-CHIP 12Kohm,5%,1/10W,TP,1608
65 3 2007-000091 R37 R-CHIP 12Kohm,5%,1/10W,TP,1608
66 3 2007-000094 R18 R-CHIP 22Kohm,5%,1/10W,TP,1608
67 3 2007-000094 R41 R-CHIP 22Kohm,5%,1/10W,TP,1608
68 3 2007-000097 R13 R-CHIP 47Kohm,5%,1/10W,TP,1608
69 3 2007-000097 R40 R-CHIP 47Kohm,5%,1/10W,TP,1608
70 3 2007-000100 R15 R-CHIP 68Kohm,5%,1/10W,TP,1608
71 3 2007-000100 R20 R-CHIP 68Kohm,5%,1/10W,TP,1608
72 3 2007-000100 R43 R-CHIP 68Kohm,5%,1/10W,TP,1608
73 3 2007-000102 R14 R-CHIP 100Kohm,5%,1/10W,TP,1608
74 3 2007-000102 R16 R-CHIP 100Kohm,5%,1/10W,TP,1608
75 3 2007-000102 R19 R-CHIP 100Kohm,5%,1/10W,TP,1608
76 3 2007-000102 R34 R-CHIP 100Kohm,5%,1/10W,TP,1608
77 3 2007-000102 R36 R-CHIP 100Kohm,5%,1/10W,TP,1608
78 3 2007-000102 R46 R-CHIP 100Kohm,5%,1/10W,TP,1608
79 3 2007-000102 R79 R-CHIP 100Kohm,5%,1/10W,TP,1608
80 3 2007-000109 R35 R-CHIP 1Mohm,5%,1/10W,TP,1608
81 3 2007-000121 R31 R-CHIP 820ohm,5%,1/10W,TP,1608
82 3 2007-000122 R10 R-CHIP 1.2Kohm,5%,1/10W,TP,1608
83 3 2007-000122 R11 R-CHIP 1.2Kohm,5%,1/10W,TP,1608
84 3 2007-000122 R60 R-CHIP 1.2Kohm,5%,1/10W,TP,1608
85 3 2007-000122 R61 R-CHIP 1.2Kohm,5%,1/10W,TP,1608
86 3 2007-000122 R7 R-CHIP 1.2Kohm,5%,1/10W,TP,1608
87 3 2007-000122 R8 R-CHIP 1.2Kohm,5%,1/10W,TP,1608
88 3 2007-000125 R26 R-CHIP 3.9Kohm,5%,1/10W,TP,1608
89 3 2007-000127 R9 R-CHIP 9.1Kohm,5%,1/10W,TP,1608
90 3 2007-000134 R23 R-CHIP 33Kohm,5%,1/10W,TP,1608

Loc Name Loc Name
－19－
Samsung Electronics Co., Ltd Service Manual
SP-C501R
－18－
Samsung Electronics Co., Ltd Service Manual
SP-C501R
No Level Part Number
Spec
91 3 2007-000134 R3 R-CHIP 33Kohm,5%,1/10W,TP,1608
92 3 2007-000134 R45 R-CHIP 33Kohm,5%,1/10W,TP,1608
93 3 2007-000402 R63 R-CHIP 150ohm,5%,1/10W,TP,1608
94 3 2007-000402 R75 R-CHIP 150ohm,5%,1/10W,TP,1608
95 3 2007-000402 R76 R-CHIP 150ohm,5%,1/10W,TP,1608
96 3 2007-000643 R30 R-CHIP 270ohm,5%,1/10W,TP,1608
97 3 2007-000659 R62 R-CHIP 27ohm,5%,1/10W,TP,1608
98 3 2007-000729 R48 R-CHIP 300ohm,5%,1/10W,TP,1608
99 3 2007-000729 R49 R-CHIP 300ohm,5%,1/10W,TP,1608
100 3 2007-000729 R50 R-CHIP 300ohm,5%,1/10W,TP,1608
101 3 2007-000805 R22 R-CHIP 36Kohm,5%,1/10W,TP,1608
102 3 2007-000805 R32 R-CHIP 36Kohm,5%,1/10W,TP,1608
103 3 2007-000848 R24 R-CHIP 3Mohm,5%,1/10W,TP,1608
104 3 2007-000848 R25 R-CHIP 3Mohm,5%,1/10W,TP,1608
105 3 2007-001010 R21 R-CHIP 51Kohm,5%,1/10W,TP,1608
106 3 2007-001114 R1 R-CHIP 680Kohm,5%,1/10W,TP,1608
107 3 2007-001114 R38 R-CHIP 680Kohm,5%,1/10W,TP,1608
108 3 2007-001134 R27 R-CHIP 68ohm,5%,1/10W,TP,1608
109 3 2007-001134 R28 R-CHIP 68ohm,5%,1/10W,TP,1608
110 3 2007-001134 R29 R-CHIP 68ohm,5%,1/10W,TP,1608
111 3 2007-001196 R42 R-CHIP 820Kohm,5%,1/10W,TP,1608
112 3 2007-008148 R39 R-CHIP 121Kohm,1%,1/10W,TP,1608
113 3 2007-008148 R51 R-CHIP 121Kohm,1%,1/10W,TP,1608
114 3 2007-008148 R52 R-CHIP 121Kohm,1%,1/10W,TP,1608
115 3 2007-008148 R77 R-CHIP 121Kohm,1%,1/10W,TP,1608
116 3 2104-000152 VR1 VR-SMD 50Kohm,25%,1/10W,TOP
117 3 2203-000140 C12 C-CER,CHIP 1.5nF,10%,50V,X7R,TP,1608,-
118 3 2203-000140 C17 C-CER,CHIP 1.5nF,10%,50V,X7R,TP,1608,-
119 3 2203-000189 C10 C-CER,CHIP 100nF,+80-20%,25V,Y5V,TP,1608,
120 3 2203-000189 C13 C-CER,CHIP 100nF,+80-20%,25V,Y5V,TP,1608,
121 3 2203-000189 C15 C-CER,CHIP 100nF,+80-20%,25V,Y5V,TP,1608,
122 3 2203-000189 C18 C-CER,CHIP 100nF,+80-20%,25V,Y5V,TP,1608,
123 3 2203-000189 C19 C-CER,CHIP 100nF,+80-20%,25V,Y5V,TP,1608,
124 3 2203-000189 C24 C-CER,CHIP 100nF,+80-20%,25V,Y5V,TP,1608,
125 3 2203-000189 C25 C-CER,CHIP 100nF,+80-20%,25V,Y5V,TP,1608,
126 3 2203-000189 C30 C-CER,CHIP 100nF,+80-20%,25V,Y5V,TP,1608,
127 3 2203-000189 C37 C-CER,CHIP 100nF,+80-20%,25V,Y5V,TP,1608,
128 3 2203-000189 C7 C-CER,CHIP 100nF,+80-20%,25V,Y5V,TP,1608,
129 3 2203-000236 C42 C-CER,CHIP 0.1NF,5%,50V,C0G,TP,1608
130 3 2203-000236 C43 C-CER,CHIP 0.1NF,5%,50V,C0G,TP,1608
131 3 2203-000257 C26 C-CER,CHIP 10nF,10%,50V,X7R,TP,1608
132 3 2203-000257 C29 C-CER,CHIP 10nF,10%,50V,X7R,TP,1608
133 3 2203-000257 C36 C-CER,CHIP 10nF,10%,50V,X7R,TP,1608
134 3 2203-000257 C38 C-CER,CHIP 10nF,10%,50V,X7R,TP,1608
135 3 2203-000315 C16 C-CER,CHIP 0.12NF,5%,50V,C0G,TP,1608
No Level Part Number
Spec
136 3 2203-000440 C5 C-CER,CHIP 1nF,10%,50V,X7R,TP,1608,-
137 3 2203-000624 C1 C-CER,CHIP 0.022NF,2%,50V,C0G,TP,1608
138 3 2203-000783 C8 C-CER,CHIP 0.33NF,5%,50V,C0G,TP,1608
139 3 2203-000798 C28 C-CER,CHIP 33nF,10%,16V,X7R,TP,1608,-
140 3 2203-000888 C23 C-CER,CHIP 4.7nF,10%,50V,X7R,TP,1608
141 3 2203-000972 C31 C-CER,CHIP 47nF,10%,16V,X7R,TP,1608
142 3 2203-001052 C6 C-CER,CHIP 0.56nF,10%,50V,X7R,TP,1608
143 3 2203-001103 C3 C-CER,CHIP 6.8nF,10%,50V,X7R,TP,1608,-
144 3 2203-002123 C4 C-CER,CHIP 68NF,20%,50V,Z5U,TP,1608
145 3 2203-005065 C20 C-CER,CHIP 1000nF,+80-20%,10V,Y5V,TP,1608
146 3 2203-005065 C21 C-CER,CHIP 1000nF,+80-20%,10V,Y5V,TP,1608
147 3 2203-005065 C22 C-CER,CHIP 1000nF,+80-20%,10V,Y5V,TP,1608
148 3 2203-005862 C34 C-CER,CHIP 0.027NF,2%,50V,NP0,TP,1608
149 3 2203-005862 C35 C-CER,CHIP 0.027NF,2%,50V,NP0,TP,1608
150 3 2404-000175 C2 C-TA,CHIP 2.2uF,20%,6.3V,-,TP,3216,1.1mm
151 3 2404-000232 C11 C-TA,CHIP 4.7uF,20%,10V,-,TP,3216,-
152 3 2404-000232 C39 C-TA,CHIP 4.7uF,20%,10V,-,TP,3216,-
153 3 2404-001020 C14 C-TA,CHIP 10uF,20%,10V,GP,TP,3216,3.2
154 3 2404-001020 C27 C-TA,CHIP 10uF,20%,10V,GP,TP,3216,3.2
155 3 3002-001140 BZ1 BUZZER-MAGNETIC 88DB,3.0V,90MA,2,730HZ,TP
156 3 3003-001011 MIC 1 MIC-CONDENSOR 2V,0.5MA,-45DB,2.2KOHM
157 3 3711-000817 BT2 CONNECTOR-HEADER BOX,2P,1R,2.5mm,STRAIGHT,SN
158 3 GG41-00246A PCB PCB-REMOTE SP-C750 REMOTE,FR-4,DOUBLE LAYER,-,T1.6,39.4 * 137.0 MM,-,4,-,-
159 3 GG47-00012A RF1 MODULE-RF RU0814H07KAD,SP-C700R,-,-,-,-,-,REMOTE,S-TYPE,27.4*36.7*12.0 [MM],PIN,-
160 3 GG81-01528A U2 IC-MODEM AK2361E-E2,VSOP,24P,307MIL,PLASTI
161 3 GG81-01537A LED1 LED CL-221YG-C-TS,SP-R9811VS,CHIP/SMD,2012,Y/GREEN
162 3 GG81-01537A LED2 LED CL-221YG-C-TS,SP-R9811VS,CHIP/SMD,2012,Y/GREEN
163 3 GG81-01557A D6 TR-DIGITAL KRC231S,NPN,5V,600mA,200mA
164 3 GG81-01569A R78 R-CHIP 24Kohm,1%,1/16W,DA,TP,1608
165 3 GG81-01570A R59 R-CHIP 220Kohm,1%,1/16W,DA,TP,1608
166 3 GG81-01603A X1 CRYSTAL-UNIT 3.579545MHz,3OPPM,HC-49/SM
167 2 GG97-01974A ASSY-REMOTE SPEAKER REMOTE SPK ASSY
168 3 3009-001037 A AUDIO-RECEIVER 150ohm,20x3mm
169 2 GG97-02151D ASSY-REMOTE DIAL SUB SP-C501R,-,-,-
170 3 GG64-00282A KEY-REMOTE SEARCH SP-C753,ABS,-,-,-,-,-
171 3 GG64-00284C KEY-REMOTE DIAL SP-C501R,ACRYL,HI-850S,CLEAR,L82.3,W39.4,H8.5
172 3 GG69-00208A PAD-REMOTE KEY SP-C750,SILICONE,-,-,-,SINECHI,CLEAR,-,55
173 1 GG97-02161C ASSY-BASE SP-C501RSL,-,-,-
174 2 6003-000168 SCREW-TAPTITE PH,+,B,M3,L8,ZPC(YEL),SWRCH18A
175 2 GG68-00442B LABEL-BASE SP-C501R,SAMSUNG,POLYERTER,T0.05,W42,L56,BLACK,SILVER,-,-
176 2 GG97-02162C ASSY-BASE HOUSING SP-C501RSL,-,-,-
177 3 6003-000193 SCREW-TAPTITE PWH,+,B,M2.6,L6,ZPC(YEL),SWRCH18A
178 3 GG39-00119A CBF HARNESS SP-C550,WIRE,UL1007,2PIN,50/70MM,RED/BLK,#26,-,-,-,DC500V,2MM,45/65MM,-,-,-
179 3 GG61-00242A BODY-BASE CONTACT SP-B960,PBT(WB-5300G),T10.7,-,L7.8,W6.8,BLK,1G
180 3 GG61-00261B BASE-HOUSING PIECE SP-C551SL,ABS(HG-0760),T32.0,W66.9,L102.4,G3262,94HB,27G

Loc Name Loc Name
－21－
Samsung Electronics Co., Ltd Service Manual
－20－
Samsung Electronics Co., Ltd Service Manual
SP-C501R
No Level Part Number
Spec
181 4 0103-000427 RESIN-ABS HG-0760,SUB GRY,G3262,HB
182 3 GG61-00262C BASE-HOUSING SP-C501RSL,ABS(HG-0760),2.5,125.0,134.1,G61133,-
183 3 GG63-00074C COVER-BASE SIDE SP-C501R,ABS(HG-0760) ,G31329,-,-,-,-,-,-,-
184 4 0103-001135 RESIN-ABS HG-0760S,LIGHT GRY,G6411,-
185 3 GG64-00286A KEY-BASE CALL SP-C550,ABS(MP-211),-,-,-,-,-
186 3 GG67-00037A CAP-BASE LED LAMP SP-C550,ACRYL(HI-850S),-,-,-,-,-
187 2 GG97-02163C ASSY-BASE PLATE SP-C501RSL,-,-,-
188 3 6003-000149 SCREW-TAPTITE PH,+,B,M2.5,L8,ZPC(YEL),SM20C
189 3 6003-000165 SCREW-TAPTITE PH,+,B,M3,L6,ZPC(YEL),SWRCH18A
190 3 GG39-00120A CBF HARNESS SP-C550,STRANDED,UL1007 ,1PIN,32MM,BLK,#24,-,-,-,DC500V,-,-,-,-,-
191 3 GG81-01618A ANTENNA SP-R9711,914-959MHz,10dB,50ohm
192 3 GG92-01441A ASSY PCB-BASE SP-C501R,-,-,-,-
193 4 0502-000235 Q500 TR-POWER KSA1156-O,PNP,1W,TO-126,-,60-1
194 4 1203-000276 U900 IC-POSI.FIXED REG. 7805,TO-220,3P,-,PLASTIC,4.8/5
195 4 1203-000299 U600 IC-POSI.FIXED REG. 7809,TO-220,3P,-,PLASTIC,8.65/
196 4 2305-001054 C200 C-FILM,LEAD-PEF 820nF,10%,250V,TP,18x7.5x13.5,
197 4 2702-001070 L500 INDUCTOR-RADIAL 4000uH,10%,9.5x15mm
198 4 2702-001070 L501 INDUCTOR-RADIAL 4000uH,10%,9.5x15mm
199 4 2801-000238 X3 CRYSTAL-UNIT 3.579545MHz,50ppm,28-AAA,20pF,
200 4 2801-001365 X2 CRYSTAL-UNIT 32.768KHz,30ppm,28-AAB,30pF,40
201 4 3404-000191 SW1 SWITCH-TACT 12V,50mA,120gf,6X6X3.5mm,SPST
202 4 3711-000826 CHGR CONNECTOR-HEADER BOX,2P,1R,2mm,ANGLE,SN
203 4 3711-002812 CONNECTOR-HEADER BOX,11P,1R,2mm,STRAIGHT,SN
204 4 3722-000252 MJ500 JACK-MODULAR 6P/6C,-,AU30U,IVORY,-
205 4 GG39-00118A CON2 CBF HARNESS
SP-C550,WIRE,UL1061,11P,200MM,RED/BLK,#26,BMH250-11R,YMH025-11R,-,DC250V,2.0MM,1
206 4 GG47-00011A RF1 MODULE-RF RU0904B07KAD,SP-C700R,-,-,-,-,-,BASE,S-TYPE,27.4*36.7*12.0 [MM],PIN,-
207 4 GG62-00005A HEAT SINK SP-B960,AL,T8,W14,L20,SILVER,-,2G
208 4 GG81-01600A PWR1 JACK-MODULAR 6P/4C,AU3U,IVORY
209 4 GG92-01442A ASSY PCB AUTO-BASE AX -,-,SP-C501R,-
210 5 0402-000345 D501 DIODE-RECTIFIER 1N4004,400V,1A,DO-41,TP
211 5 0402-000345 D502 DIODE-RECTIFIER 1N4004,400V,1A,DO-41,TP
212 5 0402-000345 D503 DIODE-RECTIFIER 1N4004,400V,1A,DO-41,TP
213 5 0402-000345 D504 DIODE-RECTIFIER 1N4004,400V,1A,DO-41,TP
214 5 0402-000345 D905 DIODE-RECTIFIER 1N4004,400V,1A,DO-41,TP
215 5 0403-000537 DZ506 DIODE-ZENER 1N4749A,24V,5%,1W,DO-41,TP
216 5 2001-000065 R200 R-CARBON 10KOHM,5%,1/4W,AA,TP,2.4X6.4MM
217 5 2001-000501 R711 R-CARBON 20OHM,5%,1/2W,AA,TP,3.3X9MM
218 5 2003-002314 R604 R-METAL OXIDE 43OHM,5%,1W,-,TP,3.3X9MM
219 5 2701-000115 L2 INDUCTOR-AXIAL 10uH,10%,3070
220 5 4715-000127 VA500 SURGE ABSORBER 300V,15%,500A,-,-
221 5 GG81-01550A DZ507 DIODE-ZENER ZY13,13V,12.4V~14.1V,2W
222 4 GG92-01443A ASSY PCB AUTO-BASE RD -,-,SP-C501R,-
223 5 2201-000560 C500 C-CERAMIC,DISC 0.47NF,20%,400V,Y5P,TP,6.3X3MM,5
224 5 2201-000560 C501 C-CERAMIC,DISC 0.47NF,20%,400V,Y5P,TP,6.3X3MM,5
225 5 2401-000041 C902 C-AL 220uF,20%,16V,GP,TP,10x12.5,5
No Level Part Number
Spec
226 5 2401-000042 C405 C-AL 100uF,20%,16V,GP,TP,6.3x7,5
227 5 2401-000042 C424 C-AL 100uF,20%,16V,GP,TP,6.3x7,5
228 5 2401-000042 C603 C-AL 100uF,20%,16V,GP,TP,6.3x7,5
229 5 2401-000042 C703 C-AL 100uF,20%,16V,GP,TP,6.3x7,5
230 5 2401-000414 C604 C-AL 10uF,20%,16V,GP,TP,4x7,5
231 5 2401-000414 C8 C-AL 10uF,20%,16V,GP,TP,4x7,5
232 5 2401-001227 C700 C-AL 4.7uF,20%,16V,GP,TP,4x7,5
233 5 2401-001415 C900 C-AL 470uF,20%,35V,GP,TP,10x20,5
234 5 GG41-00261A PCB-BASE SP-C550,FR-1,DOUBLE SILVER THRU,-,1.6T,162X238MM,-,2,-,-
235 4 GG92-01444A ASSY PCB AUTO-BASE SMD -,-,SP-C501R,-
236 5 0501-000338 Q200 TR-SMALL SIGNAL 2SC2812,NPN,200mW,SOT-23,TP,20
237 5 0501-000338 Q400 TR-SMALL SIGNAL 2SC2812,NPN,200mW,SOT-23,TP,20
238 5 0501-000462 Q601 TR-SMALL SIGNAL MMBT2907A,PNP,350MW,SOT-23,TP,50-300
239 5 0501-002153 Q502 TR-SMALL SIGNAL MMBTA42,NPN,350mW,SOT-23,TP,25-
240 5 0504-000127 Q1 TR-DIGITAL KSR1102,NPN,200MW,10K/10K,SOT-23,TP
241 5 0504-000127 Q503 TR-DIGITAL KSR1102,NPN,200MW,10K/10K,SOT-23,TP
242 5 0601-000273 LED1 LED CHIP,Y/GRN,0.8x1.2mm,570nm
243 5 0601-000273 LED3 LED CHIP,Y/GRN,0.8x1.2mm,570nm
244 5 0601-001226 LED2 LED CHIP,RED,1.2x0.8mm,660nm
245 5 0604-000138 PC201 PHOTO-COUPLER TR,300-600%,170mW,SOP-4,ST
246 5 1203-000388 U401 IC-POSI.FIXED REG. 11432,SOP,6P,150MIL,PLASTIC,3.
247 5 1205-000377 U500 IC-TRANSMITTER TEA1062AT,SOP,16P,-,PLASTIC,2.
248 5 2007-000070 L100 R-CHIP 0ohm,5%,1/10W,TP,1608
249 5 2007-000070 R12 R-CHIP 0ohm,5%,1/10W,TP,1608
250 5 2007-000070 R13 R-CHIP 0ohm,5%,1/10W,TP,1608
251 5 2007-000070 RC419 R-CHIP 0ohm,5%,1/10W,TP,1608
252 5 2007-000077 R205 R-CHIP 470ohm,5%,1/10W,TP,1608
253 5 2007-000078 R1 R-CHIP 1Kohm,5%,1/10W,TP,1608
254 5 2007-000078 R403 R-CHIP 1Kohm,5%,1/10W,TP,1608
255 5 2007-000078 R404 R-CHIP 1Kohm,5%,1/10W,TP,1608
256 5 2007-000078 R405 R-CHIP 1Kohm,5%,1/10W,TP,1608
257 5 2007-000078 R406 R-CHIP 1Kohm,5%,1/10W,TP,1608
258 5 2007-000078 R408 R-CHIP 1Kohm,5%,1/10W,TP,1608
259 5 2007-000078 R421 R-CHIP 1Kohm,5%,1/10W,TP,1608
260 5 2007-000078 R422 R-CHIP 1Kohm,5%,1/10W,TP,1608
261 5 2007-000078 R423 R-CHIP 1Kohm,5%,1/10W,TP,1608
262 5 2007-000078 R606 R-CHIP 1Kohm,5%,1/10W,TP,1608
263 5 2007-000078 R707 R-CHIP 1Kohm,5%,1/10W,TP,1608
264 5 2007-000078 R720 R-CHIP 1Kohm,5%,1/10W,TP,1608
265 5 2007-000082 R417 R-CHIP 3.3Kohm,5%,1/10W,TP,1608
266 5 2007-000082 R418 R-CHIP 3.3Kohm,5%,1/10W,TP,1608
267 5 2007-000084 R2 R-CHIP 4.7Kohm,5%,1/10W,TP,1608
268 5 2007-000084 R407 R-CHIP 4.7Kohm,5%,1/10W,TP,1608
269 5 2007-000084 R725 R-CHIP 4.7Kohm,5%,1/10W,TP,1608
270 5 2007-000090 R419 R-CHIP 10Kohm,5%,1/10W,TP,1608
SP-C501R

Loc Name Loc Name
－23－
Samsung Electronics Co., Ltd Service Manual
－22－
Samsung Electronics Co., Ltd Service Manual
No Level Part Number
Spec
271 5 2007-000090 R504 R-CHIP 10Kohm,5%,1/10W,TP,1608
272 5 2007-000091 R414 R-CHIP 12Kohm,5%,1/10W,TP,1608
273 5 2007-000091 R603 R-CHIP 12Kohm,5%,1/10W,TP,1608
274 5 2007-000098 R409 R-CHIP 56Kohm,5%,1/10W,TP,1608
275 5 2007-000098 R410 R-CHIP 56Kohm,5%,1/10W,TP,1608
276 5 2007-000098 R415 R-CHIP 56Kohm,5%,1/10W,TP,1608
277 5 2007-000098 R427 R-CHIP 56Kohm,5%,1/10W,TP,1608
278 5 2007-000100 R712 R-CHIP 68Kohm,5%,1/10W,TP,1608
279 5 2007-000101 R402 R-CHIP 82Kohm,5%,1/10W,TP,1608
280 5 2007-000102 R202 R-CHIP 100Kohm,5%,1/10W,TP,1608
281 5 2007-000102 R203 R-CHIP 100Kohm,5%,1/10W,TP,1608
282 5 2007-000102 R206 R-CHIP 100Kohm,5%,1/10W,TP,1608
283 5 2007-000102 R4 R-CHIP 100Kohm,5%,1/10W,TP,1608
284 5 2007-000102 R400 R-CHIP 100Kohm,5%,1/10W,TP,1608
285 5 2007-000102 R411 R-CHIP 100Kohm,5%,1/10W,TP,1608
286 5 2007-000102 R420 R-CHIP 100Kohm,5%,1/10W,TP,1608
287 5 2007-000102 R708 R-CHIP 100Kohm,5%,1/10W,TP,1608
288 5 2007-000102 R710 R-CHIP 100Kohm,5%,1/10W,TP,1608
289 5 2007-000102 R713 R-CHIP 100Kohm,5%,1/10W,TP,1608
290 5 2007-000104 R501 R-CHIP 150Kohm,5%,1/10W,TP,1608
291 5 2007-000106 R14 R-CHIP 220Kohm,5%,1/10W,TP,1608
292 5 2007-000106 R3 R-CHIP 220Kohm,5%,1/10W,TP,1608
293 5 2007-000109 R201 R-CHIP 1Mohm,5%,1/10W,TP,1608
294 5 2007-000109 R416 R-CHIP 1Mohm,5%,1/10W,TP,1608
295 5 2007-000118 R602 R-CHIP 390ohm,5%,1/10W,TP,1608
296 5 2007-000120 R701 R-CHIP 680ohm,5%,1/10W,TP,1608
297 5 2007-000122 R704 R-CHIP 1.2Kohm,5%,1/10W,TP,1608
298 5 2007-000123 R502 R-CHIP 1.5Kohm,5%,1/10W,TP,1608
299 5 2007-000125 R703 R-CHIP 3.9Kohm,5%,1/10W,TP,1608
300 5 2007-000125 R721 R-CHIP 3.9Kohm,5%,1/10W,TP,1608
301 5 2007-000129 R5 R-CHIP 27Kohm,5%,1/10W,TP,1608
302 5 2007-000130 R705 R-CHIP 39Kohm,5%,1/10W,TP,1608
303 5 2007-000134 R503 R-CHIP 33Kohm,5%,1/10W,TP,1608
304 5 2007-000368 R702 R-CHIP 130Kohm,5%,1/10W,TP,1608
305 5 2007-000402 R605 R-CHIP 150ohm,5%,1/10W,TP,1608
306 5 2007-000512 R601 R-CHIP 2.4Kohm,5%,1/10W,TP,1608
307 5 2007-000729 R706 R-CHIP 300ohm,5%,1/10W,TP,1608
308 5 2007-001010 R401 R-CHIP 51Kohm,5%,1/10W,TP,1608
309 5 2007-001010 R413 R-CHIP 51Kohm,5%,1/10W,TP,1608
310 5 2007-001161 R412 R-CHIP 75Kohm,5%,1/10W,TP,1608
311 5 2104-000152 RV401 VR-SMD 50Kohm,25%,1/10W,TOP
312 5 2104-000152 RV402 VR-SMD 50Kohm,25%,1/10W,TOP
313 5 2203-000125 C408 C-CER,CHIP 1.2nF,10%,50V,X7R,TP,1608,-
314 5 2203-000189 C205 C-CER,CHIP 100nF,+80-20%,25V,Y5V,TP,1608,
315 5 2203-000189 C404 C-CER,CHIP 100nF,+80-20%,25V,Y5V,TP,1608,
SP-C501R
No Level Part Number
Spec
316 5 2203-000189 C407 C-CER,CHIP 100nF,+80-20%,25V,Y5V,TP,1608,
317 5 2203-000189 C415 C-CER,CHIP 100nF,+80-20%,25V,Y5V,TP,1608,
318 5 2203-000189 C701 C-CER,CHIP 100nF,+80-20%,25V,Y5V,TP,1608,
319 5 2203-000189 C704 C-CER,CHIP 100nF,+80-20%,25V,Y5V,TP,1608,
320 5 2203-000189 C718 C-CER,CHIP 100nF,+80-20%,25V,Y5V,TP,1608,
321 5 2203-000189 C901 C-CER,CHIP 100nF,+80-20%,25V,Y5V,TP,1608,
322 5 2203-000189 C903 C-CER,CHIP 100nF,+80-20%,25V,Y5V,TP,1608,
323 5 2203-000236 C416 C-CER,CHIP 0.1NF,5%,50V,C0G,TP,1608
324 5 2203-000236 C707 C-CER,CHIP 0.1NF,5%,50V,C0G,TP,1608
325 5 2203-000257 C2 C-CER,CHIP 10nF,10%,50V,X7R,TP,1608
326 5 2203-000257 C403 C-CER,CHIP 10nF,10%,50V,X7R,TP,1608
327 5 2203-000257 C503 C-CER,CHIP 10nF,10%,50V,X7R,TP,1608
328 5 2203-000257 C705 C-CER,CHIP 10nF,10%,50V,X7R,TP,1608
329 5 2203-000315 C401 C-CER,CHIP 0.12NF,5%,50V,C0G,TP,1608
330 5 2203-000315 C402 C-CER,CHIP 0.12NF,5%,50V,C0G,TP,1608
331 5 2203-000315 C406 C-CER,CHIP 0.12NF,5%,50V,C0G,TP,1608
332 5 2203-000440 C708 C-CER,CHIP 1nF,10%,50V,X7R,TP,1608,-
333 5 2203-000440 C710 C-CER,CHIP 1nF,10%,50V,X7R,TP,1608,-
334 5 2203-000440 C721 C-CER,CHIP 1nF,10%,50V,X7R,TP,1608,-
335 5 2203-000462 C100 C-CER,CHIP 0.001nF,0.1pF,50V,TH,TP,1608
336 5 2203-000552 C4 C-CER,CHIP 0.02NF,5%,50V,C0G,TP,1608
337 5 2203-000552 C5 C-CER,CHIP 0.02NF,5%,50V,C0G,TP,1608
338 5 2203-000552 C6 C-CER,CHIP 0.02NF,5%,50V,C0G,TP,1608
339 5 2203-000552 C7 C-CER,CHIP 0.02NF,5%,50V,C0G,TP,1608
340 5 2203-000604 C505 C-CER,CHIP 22nF,10%,25V,X7R,TP,1608
341 5 2203-000783 C709 C-CER,CHIP 0.33NF,5%,50V,C0G,TP,1608
342 5 2203-000888 C414 C-CER,CHIP 4.7nF,10%,50V,X7R,TP,1608
343 5 2203-000888 C9 C-CER,CHIP 4.7nF,10%,50V,X7R,TP,1608
344 5 2203-000972 C3 C-CER,CHIP 47nF,10%,16V,X7R,TP,1608
345 5 2203-000972 C717 C-CER,CHIP 47nF,10%,16V,X7R,TP,1608
346 5 2203-000972 C726 C-CER,CHIP 47nF,10%,16V,X7R,TP,1608
347 5 2203-001683 C400 C-CER,CHIP 0.068nF,5%,50V,NP0,TP,1608
348 5 2203-005065 C409 C-CER,CHIP 1000nF,+80-20%,10V,Y5V,TP,1608
349 5 2203-005065 C411 C-CER,CHIP 1000nF,+80-20%,10V,Y5V,TP,1608
350 5 2203-005065 C412 C-CER,CHIP 1000nF,+80-20%,10V,Y5V,TP,1608
351 5 2203-005065 C413 C-CER,CHIP 1000nF,+80-20%,10V,Y5V,TP,1608
352 5 GG09-00044A U1 IC MICOM-BASE
TCC121BC15-QXRB,SP-C750,100,5,3.58MHZ,-,-,-,-,QFP,-,17.9X23.9MM,-,-25TO+85
353 5 GG81-01528A U400 IC-MODEM AK2361E-E2,VSOP,24P,307MIL,PLASTI
354 5 GG81-01543A U2 IC-EEPROM AT24C02N-10SI-2.7,2K*1BIT,SOP,8PIN,-,-,-
355 3 GG97-02165C ASSY-BASE PLATE SUB SP-C501RSL,-,-,-
356 4 GG61-00260C BASE-PLATE SP-C501RSL,ABS(HG-0760),1.5,125,110,G61133,-
357 4 GG73-00035A RUBBER-FOOT SP-R919,NR,PI10,BLK
358 1 GG97-02164C ASSY-PACKING SP-C501R,-,-,-
359 2 GG39-00072A CBF LINE CORD AR62-6P2C,1000mm,MODULAR-TO-MODULARAR
360 2 GG43-00013B BATTERY-NI MH LH045-4A52LC3BML,SP-C700R,NI-MH,450MAH,AAAA,-,45MA,3.6V,0 TO+45[C],450MAH,25.5*5
SP-C501R

Loc Name
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Samsung Electronics Co., Ltd Service Manual
Chapter 6.Layout of Components SP-C501R
6.1 BASE LOGIC TOP
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Samsung Electronics Co., Ltd Service Manual
No Level Part Number
Spec
361 2 GG44-00075A ADAPTOR
STA-1109V,SP-C900R,230V,50HZ,11V/9V,500MA/150MA,-,14VA,AC-DC,-20~+50,-,-
362 2 GG64-00157A HANDLE SP-R9700,PE
363 2 GG68-00334A LABEL-SEAL SP-R912,CRP,65.0x95.0,-,ORG
364 2 GG68-00441B MANUAL SP-C501R,SAMSUNG,RUS/ENG,RUS,MOJO PAPER,106MM,174MM,1.0,-
365 2 GG69-00068A BAG PE-BASE VINYL PE,T0.06,250X350,SP-R915
366 2 GG69-00069A BAG PE PE,T0.06,120X210,SP-R915
367 2 GG69-00070A BAG PE-H/S R/M VINYL PELD,T0.06,100X260,SP-RM928
368 2 GG69-00231C BOX CARTON SP-C501R,SW2,A KOL,L588.0,W240.0,H175.0,-,-
369 2 GG69-00232C BOX INNER SP-C501R,ST300 A180 S125,ST300G+E,L223,W164.0,H116.0,-,-
370 2 GG69-00233B CUSHION PAD SP-C501R,SW2(A KOL),SK180 K180 SK180,T5.0,L340.0,W182.0,-,YELLOW,-
SP-C501R

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SP-C501R
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Samsung Electronics Co., Ltd Service Manual
SP-C501R
6.2 REMOTE LOGIC TOP 6.3 REMOTE LOGIC BOTTOM

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SP-C501R
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Samsung Electronics Co., Ltd Service Manual
Chapter 7. Perspective View and Components List
SP-C501R
7.1 BASE MAIN 7.2 BASE MAIN PART LIST
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
BASE-HOUSING
COVER-BASE SIDE
SCREW-TAPTITE(PWH 2.5�6)
CBF-HARNESS(2P)
CHF-HARNESS(11P)
SCREW-TAPTITE(PH3�6)
BASE MAIN PBA
BASE PLATE
ANTENNA WHIP
RUBBER-FOOT
CAP-BASE LED LANP
KEY-BASE CALL
SCREW-TAPTITE(PWH 2.6�6)
SCREW-TAPTITE(PH 2.5�8)
SCREW-TAPTITE(PH 3�8)
BASE HOUSING PLECE
GG61-00262C
GG63-00074C
6003-000193
GG39-00119A
GG39-00118A
6003-000165
GG92-01400A
GG61-00260C
GG81-01618A
GG73-00035A
GG67-00037A
GG64-00286A
6003-000193
6003-000149
6003-000168
GG61-00261C
Sec Code
SP-C501R SL
Description
No Remark

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Samsung Electronics Co., Ltd Service Manual
SP-C501R
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Samsung Electronics Co., Ltd Service Manual
SP-C501R
7.3 REMOTE MAIN 7.4 REMOTE MAIN PART LIST
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
REMOTE LOWER
REMOTE WINDOW
HANDSET SIDE BELT
ASSY REMOTE DIAL SUB
REMOTE ILLUMINATING PLATE
LCD
HOLDER-REMOTE BUZZER
REMOTE CONTACT
REMOTE UPPER
SCREW-TAPTITE
HANDSET HEARING DECO
COVER REMOTE BATTERY
SCREW-TAPTITE
ATENNA-HERICAL
SPONGE HEARING UNIT
BATTERY-NI MH
REMOTE CID DECO
GG59-00079D
GG64-00283B
GG61-00243A
GG97-02151D
GG59-00072A
GG07-00021A
GG61-00239A
GG59-00071A
GG59-00068F
6003-000149
GG59-00078B
GG63-00072F
6003-000314
GG41-00027A
GG72-00156A
GG43-00013B
GG59-00070B
Sec Code
Description
No Remark
SP-C501R SL

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SP-C501R
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Samsung Electronics Co., Ltd Service Manual
Chapter 8.Block Diagram SP-C501R
8.1 RF BLOCK DIAGRAM 8.2 BASE SET BLOCK DIAGRAM
MODEM
TIP/RING
MICOM
EEPROM
[SP-C501R BASE BLOCK DIAGRAM]
RING
DTMP SPEECH
NETWORK
POWER
Signal path
Data path
RING
DETECTOR
RF MODULE

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Samsung Electronics Co., Ltd Service Manual
Chapter 9.Explanation on the Circuit SP-C501R
9.1 BASE SET
9.1.1 Wireless Section
Receiving status means a string of processes to check if there is any signal received from an antenna
and to analyze the signals by switching the channels, from No.1 to No. 40, in the cycle of about
160ms. after judging if the signal is from his or her own base set.
In the receiving status, the talk switch is controlled and transmission is stopped and speakers or
microphones are not being operated in order not to cause any trouble to the others.
MICOM plays a string of these controls, and the changes of channel, which are essential to the
automatic selection of 40 channels, will be explained first.
If MICOM provides the specific channel data to IC351 (frequency synthesizer IC) via a channel data
terminal, the internal decoder enters the RX Divide corresponding to the entered channel data, into
the RX Divide or TX Divide.
RX Divider supply the output of the 1st local oscillator of IC351 divided by the value of RX Divider to
an input terminal of the Phase Detector (hereinafter referred to as the "PD").
Reference Counter of the frequency synthesizing section of which the dividing value is fixed to 2048
keeps dividing the oscillating frequency of output 21.25MHz of TCXO, so it supply the divided
waveform of 10.6KHz to another input terminal, and this value is constant, unless the oscillating
frequency of 21.25MHz oscillator is changed.
Therefore, the error corresponding to the phase difference between 10.6KHz frequency, output of
Reference Counter, and output frequency of RX Divider at the PD is outputted, and this phase
difference is then changed into DC Voltage in the process of passing the Loop Filter, and 1st local
frequency, output of VCO, is decreased or increased through the driving of the VCO by this DC
Voltage, and this 1st local frequency will be locked to the constant frequency after a certain time
elapses, through the continual feedback in the process of repeated dividing and comparison. In the
other words, when the input phase of PD completely accords, PD Output becomes "0" and output
resistance becomes the infinity, so the 1st local frequency is stabilized, as there is no change in the
DC Voltage of VCO.
This is the detailed synthesizing process of 1st received local frequency, and transmission frequency
is synthesized on the same principle.
The time taken to reach the 1st local frequency is about 30ms. and the time taken for the synthesis of
transmitting frequency is about 60ms.
Once MICOM transmits the data of a certain channel to the Decoder of frequency synthesizing
section, then the 1st Lock frequency is locked after the receiving lock time elapses, so receiving
additive demodulation is performed. If the White Noise Level of the demodulated signal in the
receiving section is higher than a certain level, 'LOW' is outputted, and if it is less than a certain level,
'HIGH' is outputted.
If the output of 30dB Detector is 'LOW', the current channel is in use and if it is 'HIGH', the channel is
construed as the one not in use. Therefore, you may check if the current channel is in use by reading
20dB value after the output of the channel data and a certain time elapses. Also, you may perceive
the condition of a channel by checking 'LOW/HIGH' depending on the channel status, 'BUSY/FREE',
in the 20dB Detector circuit. The reason why you have to check 'BUSY/FREE' in the 20dB/30dB is
that you may speed up the checking process as you know if the channel is used, and you may skip
checking when the channel is 'HIGH' which means there is no data in the channel. You may speed
up the scanning process of whole channels and the formation of the communication path between the
base and the remote sets accordingly.
For example, if the current channel is not being used, or the user does not attempt to call, in other
words, if 20/30dB is 'HIGH', the same process keeps repeating by transmitting the data of the next
channel to a frequency synthesizing section.
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Samsung Electronics Co., Ltd Service Manual
SP-C501R
8.3 REMOTE SET BLOCK DIAGRAM
RF MODULE MODEM RECEIVER
MIC
BUZZER
POWER CHARGE
DISPLAY
34 KEY
MATRIX
EEPROM
MICOM
RESET
BATT,
VOLTAGE DET
[SP-C501R REMOTEBLOCK DIAGRAM]

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SP-C501R
9.1.2.2 TEL-LINE Circuit
It consists of Speech IC (TEA1062T) and its surrounding circuits.
The RMT transmitting signal is supplied to the Speech IC (U500) 7Pin and transmitted to the TEL-
LINE through the internal AMP and Pin No. 10 after being amplified in the AMP. Upon receiving, the
signal is supplied to Speech IC (U500) Pin No. 1 from the TEL-LINE and transmitted to the RMT
through the internal AMP and Pin No. 10. In addition, the TEL-LINE Communication path is
controlled by the LOOP OUT and DP Port of MICOM.
9.1.2.3 BELL Detecting Circuit
BELL Signal is detected by the PC201 and transmitted to the PIN No. 30 of the MPU and sends the
BELL Signal to RMT through the RF in MICOM.
9.1.2.4 DTMF Output Circuit
The DTMF of this device is produced at the MPU, and is transmitted to the TEL-LINE. The MPU
outputs the DTMF Frequency through the PIN No. 61 by dividing the oscillation frequency of
oscillation device X3 and sends the DTMF Frequency to the TEL-LINE through the SPEECH
NETWORK IC. When the DTMF is sent to the TEL-LINE, it must be separated from the AUDIO
SIGNAL, so the MPU output the HIGH Signal to the SPEECH NETWORK IC PIN No. 12 using the
PIN No. 31 and gets only the DTMF Signal sent to the TEL-LINE.
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Samsung Electronics Co., Ltd Service Manual
SP-C501R
If 20/30dB is 'LOW', you may decide if you attempt to use your base set by analyzing the data input
pin (53PIN) in the receiving section for a certain time. When you decide to use your base set,
perform the command of the base set by analyzing the RX Data, and if another person is using the
channel, you may change to another channel. You may check if your base set is usable through the
repeated change of channels (hereinafter referred to as a "Channel Scan").
When you press the Talk button, attempting to call, you may enter a channel that is not being used
and transmit the data required for the TX Data Pin of MICOM.
9.1.1.1 Receiving
The signal inputted through an antenna is provided to the RX AMP (Q101, Q102) via a SAW Filter
(FL101). The RF AMP compensates the level of signal, received from an antenna, reduced in the
process of passing the Filter. The received signal passed through the RX AMP is entered to the
Q100 of 1st local oscillating circuit and mixed and then it is entered to the IC151 (FM Detector IC)
after being resonated at 21.4MHz and amplified to Q104 through the X-TAL Filter (XF101, XF102).
It is demodulated through the super heterodyne process by being combined with the QUAD Coil (L-
103) and outputting the 455KHz after passing the external filter (CF151) and being mixed at IC151
internal 2nd Mixer.
The demodulated signal is supplied to the Speech IC by compensating the signal controlled by the
Compressor in the transmitting section through the AK2361 Internal OP-AMP and DE-EMPHASIS
and EXPANDOR for SNR compensation.
Even when any call is made, MICOM keeps checking the 30dB Pin, and if the value is less than
regulated level (out of service area), communication path is closed after certain time elapses (after 30
seconds' alarm). Also, MICOM detects and analyzes the data such as end of call and change of
channel by monitoring the RX Data in the service area.
9.1.1.2 Transmitting
Once a call is connected, an audio signal is transmitted to a Compressor through the OP-AMP in
AK2361. An audio signal and noise level pass through the PRE-EMPHASIS and LIMITER for the
prevention of over demodulation after being appropriately compensated. The signal outputted at
AK2361 through the SCF (Switched Capacitor Filter) for the elimination of high frequency element of
limited wave form demodulates the synthesized carrier by means of frequency synthesizer and VCO
through the damper, and the output is emitted at the antenna after being classified into
receiving/transmitting through the Duplexer and being amplified in power through the multiplier
(Q201) and two TR AMP (Q202, 203).
The data demodulated by the MSK Demodulator in AK2361 is outputted after being filtered, and
thereafter the path is same as the Audio Output Path.
9.1.2 LOGIC Section
9.1.2.1 MSK modulation and demodulation circuits
For the data communication between remote and base sets, 2400bps MSK Method is adopted and
used. The modulation and demodulation of this MSK are performed in the Modem IC AK2361.
For the MPU, if TDE Pin is 'LOW', AK2361 sends CLK of 2.4KHz to TCLK Pin, and the MPU on the
increasing Edge sends the data to the TDATA Pin. It is modulated to 0: 2.4KHz at AK2361 and 1:
1.2KHz at the MSK Modulator respectively and it's speed is 2400bps.
The MSK signal is sent to both the filter and buffer in AK2361 and it is outputted and then modulated
to FM, after being reduced by the damper and being inputted to the VCO of Module.
For the demodulation, when the signal received through the RF Module is inputted to the AK2361, it
is outputted to the MPU through the MSK Demodulator, and the MPU performs the corresponding
command by analyzing the inputted "I and O" signals.