Samsung GT-C3010 User manual

GSM TELEPHONE
GT-C3010
1. Safety Precautions
2. Specification
3. Product Function
4. Array course control
5. Exploded View and Parts list
6. MAIN Electrical Parts List
7. Block Diagrams
8. PCB Diagrams
9. Chart of Troubleshooting
10. Reference data
11. Disassembly and Assembly
Instructions
GSM TELEPHONE CONTENTS

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1. Safety Precautions
1-1
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1-1. Repair Precaution
●Repair in Shield Box, during detailed tuning.
Take specially care of tuning or test,
because specipicty of cellular phone is sensitive for surrounding interference(RF noise).
●Be careful to use akind of magnetic object or tool,
because performance of parts is damaged by the influence of manetic force.
●Surely use astandard screwdriver when you disassemble this product,
otherwise screw will be worn away.
●Use athicken twisted wire when you measure level.
Athicken twisted wire has low resistance, therefore error of measurement is few.
●Repair after separate Test Pack and Set because for short danger (for example an
overcurrent and furious flames of parts etc) when you repair board in condition of
connecting Test Pack and tuning on.
●Take specially care of soldering, because Land of PCB is small and weak in heat.
●Surely tune on/off while using AC power plug, because arepair of battery charger is
dangerous when tuning ON/OFF PBA and Connector after disassembing charger.
●Don't use as you pleases after change other material than replacement registered on SEC
System.
Otherwise engineer in charge isn't charged with problem that you don't keep this rules.

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Safety Precautions
1-2
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1-2. ESD(Electrostatically Sensitive Devices) Precaution
Several semiconductor may be damaged easilly by static electricity. Such parts are called by
ESD(Electrostatically Sensitive Devices), for example IC,BGA chip etc. Read Precaution below.
You can prevent from ESD damage by static electricity.
●Remove static electricity remained your body before you touch semiconductor or parts with
semiconductor. There are ways that you touch an earthed place or wear static electricity
prevention string on wrist.
●Use earthed soldering steel when you connect or disconnect ESD.
●Use soldering removing tool to break static electricity. ,otherwise ESD will be damaged by
static electricity.
●Don't unpack until you set up ESD on product. Because most of ESD are packed by box
and aluminum plate to have conductive power,they are prevented from static electricity.
●You must maintain electric contact between ESD and place due to be set up until ESD is
connected completely to the proper place or acircuit board.

2. Specification
2-1
2-1. GSM General Specification
GSM900
Phase 1
DCS1800
Phase 1
Freq.
Band[MHz]
Uplink/Downlink
880~915
925~960
1710~1785
1805~1880
ARFCN range 0~124 & 975~1023 512~885
Tx/Rx spacing 45MHz 95MHz
Mod. Bit rate/
Bit Period
270.833kbps
3.692us
270.833kbps
3.692us
Time Slot
Period/Frame
Period
576.9us
4.615ms
576.9us
4.615ms
Modulation 0.3GMSK 0.3GMSK
MS Power 33dBm~5dBm 30dBm~0dBm
Power Class 5pcl ~ 19pcl 0pcl ~15
pcl
Sensitivity -102dBm -102dBm
TDMA Mux 8 8
Cell Radius 35Km 2Km

Speclflcation
2-2
TX Power
control level GSM900
533±3
dBm
631±3
dBm
729±3
dBm
827±3
dBm
925±3
dBm
10 23±3 dBm
11 21±3 dBm
12 19±3 dBm
13 17±3 dBm
14 15±3 dBm
15 13±3 dBm
16 11±5 dBm
17 9±5 dBm
18 7±5 dBm
19 5±5 dBm
TX Power
control level DCS1800
030±3
dBm
128±3
dBm
226±3
dBm
324±3
dBm
422±3
dBm
520±3
dBm
618±3
dBm
716±3
dBm
814±3
dBm
912±4
dBm
10 10±4 dBm
11 8±4dBm
12 6±4 dBm
13 4±4 dBm
14 2±5 dBm
15 0±5 dBm
2-2. GSM Tx Power Class

Speclflcation
2-3
TX Power
control level GSM900
8 27±3 dBm
9 25±3 dBm
10 23±3 dBm
11 21±3 dBm
12 19±3 dBm
13 17±3 dBm
14 15±3 dBm
15 13±3 dBm
16 11±5 dBm
17 9±5 dBm
18 7±5 dBm
19 5±5 dBm
TX Power
control level DCS1800
226±3
dBm
324±3
dBm
422±3
dBm
520±3
dBm
618±3
dBm
716±3
dBm
812±3
dBm
910±3
dBm
10 14±3 dBm
11 12±4 dBm
12 10±4 dBm
13 8±4dBm
14 6±4 dBm
15 4±4 dBm
2-3. GSM EDGE TX power class Only in Master

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3. Operation Instruction and Installation
3-1
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Main Function
-VGA (CMOS) Camera
-QQVGA 2.0 inch 256k TFT
-SMS /MMS(OMA v1.2) /EMS (Read only)
-WAP 2.0 Browser
-MP3 /WMA /WAV /IMY /MMF /MIDI /MID /AAC /M4A /AMR
-Dual Band (EGSM900 /DCS /EDGE Rx only)
-MicroSD Card Support
-External Memory
-USB v2.0, Bluetooth v2.0+EDR
-FM Radio Support,Radio Data System

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4. Array course control
4-1
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4-1. Software Adjustments
Test Jig (GH99-36900A)
RF Test Cable (GH39-00985A) Adapter (GH99-38251A)
Test Cable (GH39-011600A)

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Array course control
4-2
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4-2. Software Downloading
4-2-1. Pre-requsite for Downloading
•Downloader Program(Optiflash Version 4.17_HK1 )
•GT-C3010 Mobile Phone
•Data Cable
•S3 file, TFS file,CSC file
4-2-2. S/W Downloader Program
■To make USB connection between your PC and the Mobile phone.
Press and hold '*' key then connect the Data cable to Mobile phone.
(Both of PC and Mobile phone must be in Power off state)
■Load the binary download program by executing the
"Optiflash Version 4.17_HK1 "and select Settings in Options

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Array course control
4-3
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1.Select Customer T: Stratus (Intel Sibley 512/128, USB)
Check Debug Mode and Erase All Unused Regions.
2.Select the COM port that the mobile phone is connected to..

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Array course control
4-4
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3.Click Browse and Select S3 file.
4.Click Browse and Select CSC file.Check S-Record with Contents

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Array course control
4-5
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5.Click Flash and Type 'YES'in capital letters on the pop-up WARNING !!!
6.Click OK and the downloading process will be started.

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Array course control
4-6
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7.Wait until the message 'All is well.'displayed
8.Confirm the downloaded version name and etc. :
*#1234#
Full Reset :
*2767*3855#

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5. Exploded View and Parts List
5-1
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5-1. Cellular phone Exploded View
QRE01
QSP01
QVK01
QMO01
QCA01
QMW01
QLC01
QVO01
QFR01
QKP01
QME00
QAN02
QCR92
QCR60
QBA01
QBA00
QMP01
QCW01
QIF01

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Exploded View and Parts List
5-2
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Design LOC Description SEC CODE
QAN02 INTENNA-GT_C3010 GH42-01983A
QBA00 PMO COVER-BATTERY GH72-52898A
QBA01 INNER BATTERY PACK-800MAH,BLK,UNI,MAIN GH43-03241A
QCA01 ASSY CAMERA-GT_C3010 VGA GH96-03766A
QCR60 SCREW-MACHINE 6001-002005
QCR92 SCREW-MACHINE 6001-002261
QKP01 ASSY KEYPAD-(SER/MKA) GH98-12888A
QLC01 ASSY LCD-2.0" QQVGA C3010 LCD ASSY GH96-03664A
QME00 ASSY MODULE-GT_C3010 KEY PBA+SHIELDCAN GH96-03913A
QMO01 MOTOR DC-SGH_P250 GH31-00454A
QMP01 ASSY PBA MAIN-GT_C3010 GH92-05386A
QMW01 ASSY COVER-WINDOW MAIN GH98-12213A
QSP01 MODULE-GT_C3010 SPK GH59-07598A
QVK01 KEY FPCB-GT_C3010 SIDE GH59-07282A
QVO01 PMO KEY-VOLUME GH72-52900A
QFR01 ASSY CASE-FRONT GH98-12215A
QIF01 PMO COVER-IF GH72-52899A
QRE01 ASSY CASE-REAR GH98-12216A
QCW01 PMO WINDOW-CAMERA GH72-52894A
5-2. Cellular phone Parts list

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6. MAIN Electrical Parts List
6-1
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SEC CODE Design LOC Description
0401-001141 D500 DIODE-SWITCHING
0403-001547 ZD502 DIODE-ZENER
0406-001241 ZD503,ZD505 DIODE-TVS
0406-001288 ZD506 DIODE-TVS
0406-001329 ZD500 DIODE-TVS
0801-003024 U201 IC
0801-003139 U301 IC
1201-002731 PAM100 IC
1201-002764 U400 IC
1203-003643 U601 IC
1203-005658 U300 IC
1203-005687 U600 IC
1204-002746 U401 IC
1205-003409 U200 IC
1205-003517 U100 IC
1205-003563 RFT100 IC
1205-003650 UCD300 IC
1108-000263 UCP200(UP) IC
1205-003749 UCP200 IC
1404-001165 TH300 THERMISTOR
2007-000138 R207,R208,R209,R210 R-CHIP
2007-000138 R211,R212,R220,R315 R-CHIP
2007-000138 R605 R-CHIP
2007-000139 R100,R219 R-CHIP
2007-000140 R501,R502,R503,R504 R-CHIP
2007-000140 R505 R-CHIP
2007-000141 R407,R419,R601,R602 R-CHIP
2007-000143 R214 R-CHIP
2007-000147 R205,R206 R-CHIP
2007-000148 R101 R-CHIP
2007-000153 R414 R-CHIP
2007-000157 R104,R201,R213,R313 R-CHIP
2007-000157 R500,R600 R-CHIP
2007-000162 R312,R410,R411 R-CHIP

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Main Electrical Parts List
6-2
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SEC CODE Design LOC Description
2007-000168 R604 R-CHIP
2007-000172 R218 R-CHIP
2007-000242 R202 R-CHIP
2007-001119 R408 R-CHIP
2007-001292 R203,R204 R-CHIP
2007-001316 R423 R-CHIP
2007-002965 R400,R401 R-CHIP
2007-003010 R421,R422 R-CHIP
2007-003015 R102,R200 R-CHIP
2007-007148 R308 R-CHIP
2007-007308 R301 R-CHIP
2007-007314 R305 R-CHIP
2007-008780 R417,R420 R-CHIP
2203-000233 C126,C423 C-CERAMIC,CHIP
2203-000254 C129,C134,C205,C215 C-CERAMIC,CHIP
2203-000254 C305,C319,C320,C321 C-CERAMIC,CHIP
2203-000254 C331,C405,C407,C414 C-CERAMIC,CHIP
2203-000278 C105 C-CERAMIC,CHIP
2203-000330 C324,C325 C-CERAMIC,CHIP
2203-000386 C128,C403,C404,C503 C-CERAMIC,CHIP
2203-000386 C504 C-CERAMIC,CHIP
2203-000627 C115 C-CERAMIC,CHIP
2203-000812 C110,C122,C123,C124 C-CERAMIC,CHIP
2203-000812 C347,C620,C621,C622 C-CERAMIC,CHIP
2203-001124 C310 C-CERAMIC,CHIP
2203-001153 C101,C102 C-CERAMIC,CHIP
2203-002487 C103 C-CERAMIC,CHIP
2203-005057 C114 C-CERAMIC,CHIP
2203-005281 C135,C137 C-CERAMIC,CHIP
2203-005382 C136 C-CERAMIC,CHIP
2203-005393 C118 C-CERAMIC,CHIP
2203-005483 C420,C422 C-CERAMIC,CHIP
2203-006048 C100,C112,C127,C200 C-CERAMIC,CHIP
2203-006048 C201,C202,C204,C206 C-CERAMIC,CHIP

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Main Electrical Parts List
6-3
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SEC CODE Design LOC Description
2203-006048 C207,C208,C210,C211 C-CERAMIC,CHIP
2203-006048 C212,C213,C214,C217 C-CERAMIC,CHIP
2203-006048 C218,C300,C301,C302 C-CERAMIC,CHIP
2203-006048 C303,C304,C308,C314 C-CERAMIC,CHIP
2203-006048 C322,C332,C345,C346 C-CERAMIC,CHIP
2203-006048 C424,C502,C619 C-CERAMIC,CHIP
2203-006137 C505 C-CERAMIC,CHIP
2203-006190 C601,C602 C-CERAMIC,CHIP
2203-006208 C327 C-CERAMIC,CHIP
2203-006260 C111,C341,C342,C406 C-CERAMIC,CHIP
2203-006260 C410 C-CERAMIC,CHIP
2203-006348 C307 C-CERAMIC,CHIP
2203-006399 C108,C116,C216,C311 C-CERAMIC,CHIP
2203-006399 C317,C323,C326,C344 C-CERAMIC,CHIP
2203-006399 C400,C401,C402,C417 C-CERAMIC,CHIP
2203-006399 C418,C421,C425,C501 C-CERAMIC,CHIP
2203-006399 C606,C613,C614 C-CERAMIC,CHIP
2203-006474 C316,C500 C-CERAMIC,CHIP
2203-006562 C409,C600 C-CERAMIC,CHIP
2203-006872 C109,C130,C131,C203 C-CERAMIC,CHIP
2203-006872 C309,C313,C315,C328 C-CERAMIC,CHIP
2203-006872 C334,C335,C336,C338 C-CERAMIC,CHIP
2203-006872 C339,C340,C603,C604 C-CERAMIC,CHIP
2203-006872 C605,C607,C608 C-CERAMIC,CHIP
2203-006890 C113,C330,C419 C-CERAMIC,CHIP
2404-001496 TA500 C-TA,CHIP
2703-001701 L109,L110 INDUCTOR-SMD
2703-002198 L115 INDUCTOR-SMD
2703-002200 L114 INDUCTOR-SMD
2703-002203 L102,L111,L112 INDUCTOR-SMD
2703-002204 L106 INDUCTOR-SMD
2703-002206 L402,L403 INDUCTOR-SMD
2703-002268 L105 INDUCTOR-SMD
2703-002367 L113 INDUCTOR-SMD

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Main Electrical Parts List
6-4
This Document can not be used without Samsung's authorization
SEC CODE Design LOC Description
2703-002589 L500 INDUCTOR-SMD
2703-002872 L301 INDUCTOR-SMD
2801-004466 OSC300 CRYSTAL-UNIT
2801-004683 OSC100 CRYSTAL-UNIT
2904-001792 F100 FILTER-SAW
2909-001283 F101 FILTER-DUPLEXER
3301-001342 L600 CORE-FERRITE BEAD
3301-001659 L405,L406,L501,L502 CORE-FERRITE BEAD
3301-001879 L300 CORE-FERRITE BEAD
3301-001912 L404 CORE-FERRITE BEAD
3303-001138 MIC400 MIC
3705-001503 RFS100 CONNECTOR-COAXIAL
3708-002222 HDC601 CONNECTOR-FPC/FFC/PIC
3709-001465 SIM600 CONNECTOR-CARD EDGE
3710-002568 IFC500 CONNECTOR-SOCKET
3711-006882 HDC600 CONNECTOR-HEADER
3711-006910 BTC500 CONNECTOR-HEADER
3711-006923 HDC500 CONNECTOR-HEADER
4202-001453 ANT101 ANT
Please consult the GSPN website (Samsung Portal) for the most recent version of the product's
part list.

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7. Block Diagrams
7-1
7-1. Block Diagram